JP2011112421A - Probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card for suppressing increase in manufacturing cost, preventing a substrate from becoming enlarged, and reducing a pitch in a probe layout. <P>SOLUTION: The probe card has a main substrate 30 formed, on which a connector 33 is disposed around an opening 32 and includes a plurality of connection terminals; a guide plate 10, formed with a penetration hole 10a and having a first surface facing the main substrate 30; a plurality of probes 11 fixed to a second surface of the guide plate 10 and inserted in the penetration hole 10a at an end; and the flexible substrate 50, connected to the connector 33 at one end via the opening 32, and bonded to the end of the probes 11 at the other end. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a probe card, and more particularly, to an improvement in a probe card including a flexible board that conducts a probe and a connection terminal on a main board.

  The manufacturing process of a semiconductor device includes an inspection process for inspecting electrical characteristics of an electronic circuit formed on an inspection substrate such as a semiconductor wafer. This electrical property inspection is performed using a tester device that inputs a test signal to an electronic circuit to be inspected and detects the response. Usually, a test signal output from a tester device is transmitted to an electronic circuit on an inspection board via a probe card. The probe card includes a large number of probes that contact a minute terminal electrode of an electronic circuit and transmit a test signal, and a wiring board that electrically connects these probes to the tester device.

  In general, in a probe card, a large number of probes and a large number of external terminals are formed on a common wiring board, and the corresponding probes and external terminals are made conductive through a wiring pattern on the wiring board. The probes are probes for making contact with the terminal electrodes of the electronic circuit, and are arranged at the same pitch as the terminal electrodes. On the other hand, the external terminals are input / output terminals for connecting the tester device, and are arranged at a wider pitch than the probes.

  In recent years, the degree of integration of electronic circuits has been improved by the advancement of microfabrication technology, and the arrangement of terminal electrodes tends to be narrowed. For this reason, for example, while the probe is disposed on the guide plate, the external terminal has been disposed on the main substrate larger than the guide plate. In such a probe card, for example, an ST (space transformer) substrate is used in order to increase the wiring pitch between the guide plate and the main substrate.

  A probe card using an ST substrate is prepared by fixing a probe unit in which a plurality of probes are arranged on a guide plate to the ST substrate and wire bonding the terminal electrode on the guide plate and the terminal electrode on the ST substrate. Is done. On the other hand, a probe card that does not use an ST substrate is produced by connecting the end portions of the probes to terminal electrodes on the main substrate through through holes formed in the guide plate, for example. In addition, the technique which connects a probe and the terminal part on a flexible substrate is disclosed by patent documents 1-3, for example.

JP-A-1-295185 JP 2003-75503 A JP-A-9-321100

  In the case of a probe card using an ST substrate, an expensive ST substrate is required, resulting in an increase in manufacturing cost. Further, in a conventional probe card that does not use an ST substrate, it is necessary to arrange terminal electrodes for connecting the end portions of the probes within the substrate surface. I had to enlarge it. For this reason, it has been difficult to reduce the pitch of the probes without increasing the size of the main board. Furthermore, since the end of the probe has to be extended to the terminal electrode on the main board through the through hole of the guide plate, compared to the case where the probe and the terminal are connected by the wiring pattern formed on the board. The electrical characteristics were degraded.

  The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a probe card capable of suppressing the increase in manufacturing cost and narrowing the arrangement of probes without increasing the size of a substrate. It is said. In particular, it is an object of the present invention to provide a probe card capable of narrowing the arrangement of probes without increasing the size of a main board that conducts the end portions of the probes. It is another object of the present invention to provide a probe card that can suppress deterioration of electrical characteristics when connecting a probe and a terminal portion on a main board.

  According to a first aspect of the present invention, there is provided a probe card comprising: a main board having connection terminals arranged around an opening; a guide plate having a through-hole and having a first surface facing the main board; A probe fixed to two surfaces and having an end inserted through the through-hole, a flexible substrate having one end connected to the connection terminal and the other end joined to the end of the probe via the opening; It is configured with.

  In this probe card, the end of the probe fixed to the guide plate is electrically connected to the connection terminal on the main board via the flexible board. This flexible substrate passes through an opening provided in the main substrate, and one end of the flexible substrate is connected to the connection terminal on the main substrate and the other end is joined to the end of the probe. Space can be used effectively. Therefore, when more probes are arranged, it is possible to prevent the main substrate from becoming larger in the direction along the substrate surface. Moreover, since the probe fixed to the guide plate and the connection terminal on the main substrate are conducted through the flexible substrate, an increase in manufacturing cost can be suppressed as compared with the case where the ST substrate is used. Furthermore, since the probe and the main board are connected via a flexible board, the probe and the terminal part on the main board are connected compared to the case where the end of the probe is directly connected to the terminal part on the main board. It is possible to suppress the deterioration of the electrical characteristics when performing.

  The probe card according to the second aspect of the present invention is configured such that, in addition to the above configuration, a groove is provided on the first surface of the guide plate, and the other end of the flexible substrate is engaged with the groove. . According to such a configuration, the other end of the flexible substrate is engaged with the groove of the guide plate, so that the displacement of the flexible substrate can be suppressed.

  The probe card according to the third aspect of the present invention is configured such that, in addition to the above configuration, the flexible substrate is suspended on the main substrate side with respect to the guide plate.

  According to the probe card according to the present invention, the flexible substrate passes through the opening provided in the main substrate, and one end thereof is connected to the connection terminal on the main substrate, and the other end is joined to the end of the probe. When many probes are arranged, it is possible to prevent the main board from becoming large. Moreover, since the probe fixed to the guide plate and the connection terminal on the main substrate are conducted through the flexible substrate, an increase in manufacturing cost can be suppressed as compared with the case where the ST substrate is used. Therefore, an increase in manufacturing cost can be suppressed, and the arrangement of the probes can be narrowed without increasing the size of the main substrate. In addition, since the probe and the main board are connected via the flexible board, it is possible to suppress deterioration in electrical characteristics when connecting the probe and the terminal portion on the main board.

It is the top view which showed an example of schematic structure of the probe card 100 by embodiment of this invention, and the mode that the probe card 100 was seen from lower side is shown. It is the top view which showed an example of schematic structure of the probe card 100 of FIG. 1, and the mode that the probe card 100 was seen from the upper side is shown. It is sectional drawing which showed the structural example of the probe card 100 of FIG. 1, and the cut surface by the AA line is shown. It is the perspective view which showed the structural example in the principal part of the probe card 100 of FIG. 1, and the some probe 11 arranged on the probe holding | maintenance board 12a is shown. It is the figure which showed the structural example in the principal part of the probe card 100 of FIG. 1, and the mode around the probe holder part 12 is shown. It is the top view which showed the structural example in the principal part of the probe card 100 of FIG. 1, and FPC51 for power supply is shown. It is the top view which showed the structural example in the principal part of the probe card 100 of FIG. 1, and FPC52 for signal transmission is shown. FIG. 2 is a perspective view illustrating a configuration example of a main part of the probe card 100 of FIG. 1, in which a structure for attaching a power supply FPC 51 to a guide plate 10 is illustrated.

<Probe card>
1 and 2 are plan views showing an example of a schematic configuration of a probe card 100 according to an embodiment of the present invention. FIG. 1 shows the probe card 100 as viewed from below, and FIG. 2 shows the probe card 100 as viewed from above.

  The probe card 100 is an inspection device used when inspecting the electrical characteristics of the electronic circuit on the inspection substrate, and is composed of the guide plate 10, the unit holder plate 20, the main substrate 30, the reinforcing plate 40, and the flexible substrate 50. The The main board 30 is a circular PCB (printed circuit board) that is detachably attached to a probe device (not shown), and is used for inputting / outputting signals to / from a tester device (not shown). The external terminal 31 is provided at the periphery.

  The guide plate 10 is a flat holding member for holding the tips of the plurality of probes 11 in a state of being separated from the substrate surface, and is made of a semiconductor such as silicon or an insulator such as ceramic. The guide plate 10 is disposed below the main substrate 30 and is fixed to the central portion of the unit holder plate 20 with the upper surface facing the unit holder plate 20. Each probe 11 is a probe that is brought into contact with a minute electrode of an electronic circuit, and is arranged in alignment with the arrangement of the electrode of the electronic circuit.

  In this example, four probe rows are formed at the center of the rectangular guide plate 10. The probe row is composed of a plurality of probes 11 arranged in a direction parallel to the side of the guide plate 10, and two probe rows having a horizontal arrangement and two probe rows having a vertical arrangement are formed. ing. A plurality of probes 11 constituting one probe row are held by a probe holder portion 12 fixed to the lower surface of the guide plate 10.

  The unit holder plate 20 is a flat plate for holding the guide plate 10, and is fixed to the main substrate 30 with the upper surface facing the main substrate 30. The unit holder plate 20 has a rectangular shape smaller than the main board 30 and is disposed at the center of the main board 30.

  The probe card 100 is held horizontally by the probe device with the surface on which the probe 11 is disposed facing downward, and the tester device is connected. In this state, if the inspection board is approached from below and the probe 11 is brought into contact with the terminal electrode of the electronic circuit on the inspection board, a test signal can be input / output between the tester device and the electronic circuit via the probe 11. it can.

  The reinforcing plate 40 is a flat plate for preventing the main substrate 30 from being bent or warped at the time of attachment to the probe device or at a high temperature inspection, and is made of a metal having higher rigidity than the main substrate 30. The reinforcing plate 40 has a circular shape, is fixed to the upper surface of the main substrate 30, and has a rectangular opening 41 through which the flexible substrate 50 is inserted at the center. Further, the reinforcing plate 40 is formed with a notch portion 42 for accommodating the connector portion 33 at the peripheral portion thereof.

  The connector portion 33 is a terminal portion for connecting the terminal portions of the flexible substrate 50 and includes a plurality of connection terminals fixed to the main substrate 30. The connector portion 33 is disposed around an opening 32 provided in the main board 30, and each connection terminal in the connector portion 33 is electrically connected to the external terminal 31 through a wiring pattern (not shown).

  The flexible substrate 50 is an FPC (Flexible Printed Circuit) for connecting the probe 11 and the connector portion 33 on the main substrate 30 and is provided for each probe row. The wiring portion of the probe 11 is connected to one end portion of the flexible substrate 50, and the other end portion is coupled to the connector portion 33.

  In this example, four flexible substrates 50 are arranged so as to extend radially through rectangular openings 32 formed in the central portion of the main substrate 30. The connector part 33 and the notch part 42 are provided for each flexible substrate 50.

<Cross-section structure>
FIG. 3 is a cross-sectional view showing an example of the configuration of the probe card 100 of FIG. The guide plate 10 is arranged on the lower side of the main substrate 30 via the unit holder plate 20 and holds the plurality of probes 11 by the probe holder portion 12 formed on the lower surface. The guide plate 10 is disposed so as to face the main substrate 30 while being separated from the main substrate 30. The guide plate 10 has a through hole 10 a through which the wiring portion 13 formed at the end of the probe 11 is inserted.

  The flexible substrate 50 is disposed so that one end thereof intersects the guide plate 10, and the wiring portion 13 of the probe 11 is connected to the vicinity of the one end. In the flexible substrate 50, one end hangs down toward the upper surface of the guide plate 10 and is arranged so as to be parallel to the arrangement direction of the probes 11.

  On the other hand, the other end of the flexible substrate 50 is coupled to the connector portion 33. That is, the wiring part 13 of the probe 11 is electrically connected to the connector part 33 of the main board 30 through such a flexible board 50.

  In this example, the flexible substrate 50 includes a power supply FPC 51 and a signal transmission FPC 52, and is arranged in a state of being overlapped from above the guide plate 10 to the vicinity of the connector portion 33 of the main substrate 30.

  The power supply FPC 51 is a film-like flexible board on which a power line and a GND line are formed. The FPC 51 is connected to the connector portion 33 through the opening 32 of the main board 30 and the other end is a wiring of the probe 11. It is joined to the part 13. That is, at one end of the power supply FPC 51, there is provided a terminal portion 51a that is electrically connected to the terminal portion 52a of the signal transmission FPC 52 via the wire member 53. It is connected to the connector part 33. Further, the other end of the power supply FPC 51 is disposed so as to intersect the upper surface of the guide plate 10. In the power supply FPC 51, one end is engaged with an engagement groove provided in the guide plate 10, thereby preventing misalignment.

  The signal transmission FPC 52 is a film-like flexible board on which a signal line is formed. The signal transmission FPC 52 passes through the opening 32 of the main board 30, one end thereof is connected to the connector part 33, and the other end to the wiring part 13 of the probe 11. It is joined. That is, a terminal portion 52 a for coupling to the connector portion 33 on the main substrate 30 is provided at one end portion of the signal transmission FPC 52, and the other end portion is inserted into the opening 32 of the main substrate 30. Suspended in state.

  Specifically, the signal transmission FPC 52 is suspended above the guide plate 10 by joining the wiring portion 13 of the probe 11 to the other end portion. That is, the signal transmission FPC 52 is held in a state in which the other end is movable in the vertical direction and the horizontal direction without contacting the guide plate 10.

  The main board 30 is disposed so as to face the upper surface of the guide plate 10, and a connector portion 33 for coupling the terminal portion 52 a is provided on the upper surface opposite to the guide plate 10. In this example, the ends of the power supply FPC 51 and the signal transmission FPC 52 are arranged so as to be perpendicular to the guide plate 10.

  Further, the power supply FPC 51 has a wiring portion 13 bonded to the first surface thereof, and an electronic component 54 such as a decoupling capacitor and a terminal portion 51a provided on the second surface. The signal transmission FPC 52 is disposed with its second surface facing the first surface of the power supply FPC 51, an electronic component 54 such as a decoupling capacitor is provided on the first surface, and the wiring portion 13 is disposed on the second surface. Are joined.

  The connector part 33 is a terminal part that removably couples the terminal part 52a of the signal transmission FPC 52, and the terminal part 52a is attached to the direction intersecting the main board 30, for example, a direction perpendicular to the board surface. Remove it. The terminal electrode of the connector part 33 and the terminal electrode of the terminal part 52a are being fixed via solder.

  By disposing the guide plate 10 so as to face the main substrate 30, the radiant heat from the inspection substrate is blocked during the high-temperature test of the inspection substrate, so that the flexible substrate 50 can be suppressed from being heated.

<Probe holding structure>
4 (a) and 4 (b) are perspective views showing a configuration example of the main part of the probe card 100 of FIG. 1, and a plurality of probes 11 arranged on the probe holding plate 12a are shown. 4A shows a state where the probe 11 is viewed from the contact part 11a side, and FIG. 4B shows a state where the probe 11 is viewed from the wiring part 13 side.

  The probe 11 is made of a wire member that penetrates the guide plate 10, and includes a contact portion 11 a that is brought into contact with an inspection object, an elastic deformation portion 11 b that elastically supports the contact portion 11 a, and a probe holder portion 12 of the guide plate 10. And a wiring part 13 connected to the flexible substrate 50.

  The contact portion 11a is formed of a columnar body having a smaller outer diameter at the tip portion, and the elastic deformation portion 11b is formed of a rod-shaped body having a substantially equal diameter. The probe holding plate 12 a is a flat plate that holds the support portion 11 c of the probe 11 while intersecting the plate surface, and fixes the lower end surface to the guide plate 10. On the upper end surface of the probe holding plate 12a, a plurality of cutout portions 12b for accommodating the support portions 11c are formed.

  The plurality of probes 11 constituting the probe array are accommodated in the respective notches 12b of the probe holding plate 12a, and the contact portions 11a are separated from the substrate surface of the guide plate 10 by accommodating the support portions 11c. They are held parallel to each other. Each probe 11 is aligned so that the contact portion 11 a is parallel to the guide plate 10.

  By adjusting the interval between the notches 12b and the position of the support portion 11c when the probes 11 are accommodated in the notches 12b, the positions of the contact portions 11a in the substrate surface of each probe 11 in the probe row are adjusted. Can be as desired.

  In this example, a plurality of probes 11 constituting a probe row are arranged in multiple stages using a plurality of probe holding plates 12a having different heights from the substrate surface of the guide plate 10. That is, by arranging the probe holding plates 12a having different heights in the extending direction of the elastically deforming portion 11b so as to face each other, the number of the probe holding plates 12a is the number of steps, and the probe 11 is stepped. Arranged.

  Specifically, two probes holding plate 12a are used to arrange eight probes 11 constituting one probe row in two stages. Each probe holding plate 12a holds four probes 11. The contact portion 11a of the probe 11 held on one probe holding plate 12a and the contact of the probe 11 held on the other probe holding plate 12a. The portions 11a are arranged alternately on a straight line.

  FIG. 5 is a diagram showing a configuration example of a main part of the probe card 100 of FIG. 1, and shows the surroundings of the probe holder part 12. The probe holder part 12 is formed by hardening with resin so as to cover a plurality of probe holding plates 12a each accommodating the support part 11c of the probe 11 in the notch part 12b. That is, each probe 11 constituting the probe row is fixed to the guide plate 10 by the probe holder portion 12.

  By arranging the probes 11 constituting the probe row in multiple stages in this way, the wiring parts 13 can be arranged at an arrangement pitch that is enlarged by the number of stages as compared with the arrangement pitch of the contact parts 11a.

<FPC for power supply>
FIGS. 6A and 6B are plan views showing a configuration example of the main part of the probe card 100 of FIG. 1, and details of the power supply FPC 51 are shown. 6A shows the entire power supply FPC 51, and FIG. 6B shows an enlarged end of the probe 11 on the side where the wiring part 13 is joined.

  The power supply FPC 51 is an elongate flexible substrate, which is provided with a terminal portion 51a at the upper end and an insertion portion 55 and electrode pads 51b and 51c at the lower end. The insertion portion 55 is an engagement portion for fixing the power supply FPC 51 by being inserted into an engagement groove formed in the guide plate 10, and is formed along the lower end surface of the substrate.

  The electrode pad 51b is a probe electrode for joining the wiring part 13 of the probe 11, and the wiring part 13 is fixed using a low melting point metal having a lower melting point than the wiring part 13 or the electrode pad 51b, for example, solder. It consists of solder land. The electrode pad 51c is an electrode for attaching an electronic component 54 such as a decoupling capacitor for noise suppression, and is composed of, for example, a solder land for component mounting.

  In this example, nine electrode pads 51 b are arranged in the left-right direction on a common horizontally long wiring pattern 57, and six vertically long wiring patterns 56 are formed above the wiring pattern 57. The wiring pattern 56 is a wiring pattern common to the plurality of electrode pads 51b arranged in the longitudinal direction, and electrically connects the electrode pads 51b and the terminal portion 51a. The power supply FPC 51 is disposed such that its lower end portion hangs down toward the upper surface of the guide plate 10, and the electrode pads 51b and 51c are aligned in the suspending direction.

  A part of the electrode pad 51 c is formed across the wiring pattern 57 and the wiring pattern 56. For example, in the rightmost wiring pattern 56, eight electrode pads 51b and two electrode pads 51c are formed. Further, two electrode pads 51b and two electrode pads 51c are formed in the second wiring pattern 56 from the right.

  In the power supply FPC 51, a maximum of five electrode pads 51b are provided in the longitudinal direction (vertical direction in the figure), and a maximum of three electrode pads 51c are formed. The lower end portion of the power supply FPC 51 is narrower than the upper end portion on which the terminal portion 51a is formed, and without increasing the size of the main board 30 to which the terminal portion 51a is connected, The arrangement pitch can be reduced.

<FPC for signal transmission>
FIGS. 7A and 7B are plan views showing a configuration example of the main part of the probe card 100 of FIG. 1, and details of the signal transmission FPC 52 are shown. FIG. 7A shows the entire signal transmission FPC 52, and FIG. 7B shows an enlarged end of the probe 11 on the side where the wiring part 13 is joined.

  The signal transmission FPC 52 is an elongated flexible substrate, similar to the power supply FPC 51, and is provided with a terminal portion 52a at the upper end and electrode pads 52b and 52c at the lower end.

  The electrode pad 52b is a probe electrode for joining the wiring part 13 of the probe 11, and the wiring part 13 is fixed using a low melting point metal having a lower melting point than the wiring part 13 or the electrode pad 52b, for example, solder. It consists of solder land. The electrode pad 52c is an electrode for attaching an electronic component 54 such as a decoupling capacitor for noise suppression, and is made of, for example, a solder land for component mounting.

  In this example, nine electrode pads 52b are arranged in the left-right direction, and electrode pads 52b, 52c and a wiring pattern 58 are formed on the upper side of the pad row so as to be divided into four regions. Each region is provided with two electrode pads 52c, eight electrode pads 52b arranged in the longitudinal direction, and a wiring pattern 58 for electrically connecting the electrode pad 52b and the terminal portion 52a. The signal transmission FPC 52 is arranged such that the lower end portion hangs down toward the upper surface of the guide plate 10, and the electrode pads 52 b and 52 c are aligned in the hanging direction.

  The wiring pattern 58 is formed for each electrode pad 52b. One electrode pad 52c is formed so that a part thereof overlaps with the electrode pad 52b arranged at the lowest level in the region.

  The lower end portion of the signal transmission FPC 52 is narrower than the upper end portion on which the terminal portion 52a is formed, and without increasing the size of the main board 30 to which the terminal portion 52a is coupled, The arrangement pitch can be reduced.

<FPC mounting structure>
FIG. 8 is a perspective view showing a configuration example of a main part of the probe card 100 of FIG. The power supply FPC 51 is held in a state where the end portion is perpendicular to the substrate surface by inserting the insertion portion 55 into the engagement groove 10 b formed in the guide plate 10.

  The wiring portion 13 of the probe 11 is drawn to the upper surface side of the guide plate 10 through the through hole 10a and joined to the power supply FPC 51. The through hole 10a and the engagement groove 10b are formed for each probe row. By engaging the other end of the power supply FPC 51 with the engagement groove 10b of the guide plate 10, the other end of the power supply FPC 51 can be fixed so as not to move in the horizontal direction.

  According to the present embodiment, the flexible substrate 50 is inserted into the opening 32 provided in the main substrate 30, one end thereof is connected to the connector portion 33 on the main substrate 30, and the wiring portion 13 of the probe 11 is connected to the other end. Since the bonding is performed, when more probes 11 are disposed, the size of the main substrate 30 can be suppressed from increasing in the direction along the substrate surface. Further, since the probe 11 fixed to the guide plate 10 and the connector portion 33 on the main board 30 are electrically connected via the flexible board 50, an increase in manufacturing cost is suppressed as compared with the case where the ST board is used. Can do.

  Furthermore, since the probe 11 and the connector portion 33 of the main substrate 30 are connected via the flexible substrate 50, the probe 11 is compared with the case where the wiring portion 13 of the probe 11 is directly connected to the terminal portion on the main substrate 30. 11 and the connector 33 on the main board 30 can be prevented from being deteriorated in electrical characteristics. Specifically, since the wiring portion 13 is shortened and directly joined to the electrode pads 51b and 52b of the flexible substrate 50, impedance matching can be easily achieved.

  Further, since the flexible substrate 50 is coupled to the connector portion 33 on the opposite side of the guide plate 10 of the main substrate 30 through the opening 32, the probe 11 can be obtained by utilizing the space in the thickness direction of the main substrate 30. The electrode pads 51b and 52b can be arranged at an interval larger than the arrangement pitch. Therefore, when more probes 11 are provided, the main substrate 30 can be prevented from becoming larger, and the arrangement of the probes 11 can be narrowed without increasing the size of the main substrate 30. it can.

  In the present embodiment, an example in which the flexible substrate 50 for connecting the probe 11 and the connector portion 33 on the main substrate 30 includes the power supply FPC 51 and the signal transmission FPC 52 has been described. The invention is not limited to this. For example, as the flexible substrate 50, a power supply line, a GND line, and a signal line can be formed on one FPC by using a multilayer substrate in which a wiring layer is formed in addition to the first surface and the second surface. . If such a flexible substrate 50 is used, the electrical characteristics can be further improved.

  In the present embodiment, an example in which the probe 11 is made of a wire member and the wiring portion 13 at the probe end is directly joined to the electrode pads 51b and 52b of the flexible substrate 50 has been described. It is not limited to this. For example, the end of the probe 11 and the probe electrode on the flexible substrate 50 may be wire bonded.

  In the present embodiment, the example in which the flexible substrate 50 is inserted through the opening 32 of the main substrate 30 and one end thereof is connected to the upper surface of the main substrate 30 has been described, but the present invention is not limited thereto. is not. For example, one end of the flexible substrate 50 may be connected to the lower surface of the main substrate 30.

DESCRIPTION OF SYMBOLS 10 Guide board 10a Through-hole 10b Engaging groove 11 Probe 11a Contact part 11b Elastic deformation part 11c Support part 12 Probe holder part 12a Probe holding board 12b Notch part 13 Wiring part 20 Unit holder board 30 Main board 31 External terminal 32 Opening 33 Connector 40 Reinforcing plate 41 Opening 42 Notch 50 Flexible substrate 51 Power supply FPC
51a, 52a Terminal portions 51b, 51c, 52b, 52c Electrode pad 52 FPC for signal transmission
53 Wire member 54 Electronic component 55 Insertion part 56-58 Wiring pattern 100 Probe card

Claims (3)

A main board on which connection terminals are arranged around the opening;
A guide plate in which a through hole is formed and the first surface faces the main substrate;
A probe fixed to the second surface of the guide plate and having an end inserted through the through hole;
A probe card comprising: a flexible substrate having one end connected to the connection terminal and the other end joined to the end of the probe via the opening.   The probe card according to claim 1, wherein a groove is provided on the first surface of the guide plate, and the other end of the flexible substrate is engaged with the groove.   The probe card according to claim 1, wherein the flexible board is suspended on the main board side with respect to the guide plate.

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