JP2011065795A - Heat radiation adapter, lamp device, and lighting fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiation adapter capable of improving heat radiation of a bulb-shaped lamp which has LED elements as a light source. <P>SOLUTION: The heat radiation adapter 18 includes lamp mounting portions 41, 42, arranged by thermally contacting a heat radiator 21 of the bulb-shaped lamp 16, and a plurality of heat conductor portions 43 connected between the lamp mounting portions 41, 42. The heat conductor portions 43 include fixture contacting portions 44 which thermally contact the lighting fixture 11 in which the bulb-shaped lamp 16 is mounted, and the heat generated at a time of lighting of the bulb-shaped lamp 16 is radiated by heat conduction to the fixture side. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a heat dissipation adapter for a lamp device having a semiconductor light emitting element as a light source, a lamp device using the heat dissipation adapter, and a lighting fixture using the lamp device.

  2. Description of the Related Art Conventionally, a lamp device having an LED element, which is a semiconductor light emitting element as a light source, has a base attached to one end of an outer member and a substrate mounted with a plurality of LED elements attached to the other end of the outer member. There is a light bulb shaped lamp in which a glove is attached so as to cover a substrate, and a lighting device is accommodated inside an outer shell member.

  In this bulb-type lamp, the outer member is made of metal, and heat generated when the LED element is turned on is efficiently conducted to dissipate heat from the outer surface of the outer member into the air, thereby reducing the heat load on the LED element. ing.

  In addition, a bulb-type lamp can be used in place of an incandescent bulb for lighting fixtures such as downlights. A bulb-type lamp cap is attached to the socket of the fixture body, and the bulb-type lamp is placed in the fixture body. is doing. In a state where the light bulb shaped lamp is mounted on the lighting fixture, an air layer is interposed between the reflector disposed inside the fixture main body and the outer member of the light bulb shaped lamp, and these do not come into contact with each other (for example, patents) Reference 1).

JP 2009-37995 A (No. 5, pages 11-12, FIGS. 1-2, 10)

  When a light bulb shaped lamp mounted on a lighting fixture is turned on, the heat generated when the LED element is turned on is efficiently conducted to the metal outer member. From this outer member, the heat conductivity in the fixture body is increased. There is a problem that heat must be radiated in a low air layer, heat dissipation efficiency from the outer member into the air layer is low, a sufficient temperature drop of the LED element cannot be obtained, and a heat load on the LED element is low. is there.

  This invention is made | formed in view of such a point, and it aims at providing the thermal radiation adapter which can improve the heat dissipation of a lamp device, a lamp device, and a lighting fixture.

  The heat dissipating adapter according to claim 1 includes: a lamp mounting portion that is mounted in thermal contact with a lamp device having a semiconductor light emitting element as a light source; and a fixture contact portion that is in thermal contact with a lighting fixture on which the lamp device is mounted. And a heat conduction part that conducts heat generated when the lamp device is turned on from the lamp mounting part side to the appliance contact part side.

  The heat dissipating adapter may be configured by using any material such as metal, resin, rubber, and the like, or may be configured by combining a plurality of members. Further, the heat dissipating adapter may be detachable or integrally provided with the lamp device. .

  The lamp mounting portion is preferably mounted on a member having high thermal conductivity at a position where there is no optical influence on the lamp device. In addition, when the lamp mounting portion is mounted near the semiconductor light emitting element or when the lamp device is mounted on a lighting fixture, It is preferable that the heat conducting portion is attached at a position where it does not hinder the lighting fixture. When the lamp mounting part is mounted in thermal contact with the lamp device, for example, it is in surface contact without interposing an air layer or the like, and a state where high thermal conductivity is ensured between the lamp mounting unit and the lamp device. Means.

  For example, the heat conducting part may be in the form of a belt, and may be arranged so as to protrude radially around the lamp device so as to be in thermal contact with the luminaire, but with the lamp device mounted on the luminaire. Any shape can be used as long as it is in thermal contact with the luminaire.

  For example, the instrument contact portion may be composed of the outer surface of the heat conducting portion or may be composed of another part or member. The appliance contact portion being in thermal contact with the lighting fixture means a state in which, for example, surface contact is made without interposing an air layer, and high thermal conductivity is ensured between the appliance contact portion and the lighting fixture.

  Examples of the lamp device targeted by the heat dissipation adapter include a light bulb lamp having an E-shaped base and a flat lamp device having a GX53-shaped base. However, other lamp devices may be used. The semiconductor light emitting element of the lamp device may be any of an LED element and an EL element, for example.

  Further, the lamp device to which the heat dissipation adapter is attached in advance may be attached to the lighting fixture, or the heat dissipation adapter may be attached to the lamp device attached to the lighting fixture. In addition, when a lamp device with a heat dissipation adapter attached in advance is mounted on a lighting fixture, the heat dissipation adapter may be slid while in contact with the fixture side at the time of mounting, or the heat dissipation adapter should not be slid. You may keep away from the instrument side.

  According to a second aspect of the present invention, in the heat dissipation adapter according to the first aspect, the heat conducting portion has elasticity that urges the heat conducting portion in a direction of deployment from the lamp device toward the lighting fixture.

  The elasticity that urges the heat conducting portion in the direction of deployment from the lamp device toward the lighting fixture may be provided by the heat conducting portion itself, or another elastic body may be used.

  The heat dissipating adapter according to claim 3 is the heat dissipating adapter according to claim 1 or 2, wherein when the lamp device is mounted on the lighting fixture, the heat contact portion of the heat conducting portion is restricted from coming into contact with the lighting fixture and is mounted. It is provided with a restricting means that makes it possible to cancel the restriction.

  The regulating means may use a ring or band that elastically deforms and holds the heat conducting part so as to approach the lamp device, or uses a shape memory alloy for the heat conducting part and approaches the lamp device side at room temperature. It may be displaced so that the temperature rises due to heat when the lamp device is turned on so that the lamp device expands toward the lighting fixture.

  The lamp device according to claim 4 is a lamp device body having a radiator, a semiconductor light emitting element provided on one end side of the radiator, and a cap portion provided on the other end side of the radiator; and heat dissipation of the lamp device body. A heat dissipating adapter according to any one of claims 1 to 3 attached to a body.

  Examples of the lamp device include a bulb-type lamp having the E-shaped base described above and a flat lamp device having a GX53-shaped base. However, other lamp devices may be used.

  The lighting fixture according to claim 5 is a fixture main body having a socket; a base portion is mounted on the socket and disposed in the fixture main body, and a fixture contact portion of the heat conducting portion is brought into contact with the fixture side. And a lamp device.

  The luminaire includes, for example, a downlight, and may include a reflector that includes the lamp device. In this case, the heat dissipation adapter can dissipate heat by contacting the reflector.

  According to the heat dissipation adapter of the first aspect, the lamp mounting portion is attached in thermal contact with the lamp device, and the fixture contact portion of the heat conducting portion is in thermal contact with the lighting fixture on which the lamp device is mounted. Therefore, the heat generated when the lamp device is turned on can be efficiently conducted to the lighting fixture, and the heat dissipation of the lamp device can be improved.

  According to the heat dissipating adapter of claim 2, in addition to the effect of the heat dissipating adapter of claim 1, the heat conduction part has elasticity to urge in the direction of deployment from the lamp device toward the lighting fixture, It is possible to obtain a high matching rate to the lighting fixtures.

  According to the heat dissipating adapter according to claim 3, in addition to the effect of the heat dissipating adapter according to claim 1 or 2, when the lamp device is mounted on the lighting fixture, the appliance contact portion of the heat conducting portion is made into the lighting fixture by the regulating means. It is possible to prevent the lighting fixture from being damaged because it is possible to restrict contact with the lighting fixture.

  According to the lamp device of the fourth aspect, since the heat radiation adapter is attached to the heat radiator of the lamp device main body, the heat radiation performance can be improved without optical influence.

  According to the lighting fixture of claim 5, since the appliance contact portion of the heat conducting portion of the heat radiating adapter comes into contact with the appliance side by arranging the lamp device in the appliance main body, the heat generated when the lamp device is lit is generated. Heat can be efficiently conducted to the lighting fixture, and the heat dissipation of the lamp device can be improved.

It is sectional drawing of the lighting fixture in the use condition of the lamp device which attached the heat dissipation adapter which shows the 1st Embodiment of this invention. It is sectional drawing of the lighting fixture at the time of mounting | wearing of the lamp device which attached the heat dissipation adapter same as the above. It is a side view of the decomposition | disassembly state of a heat dissipation adapter and a lamp device same as the above. It is sectional drawing of the lighting fixture in the normal temperature state of the lamp device which attached the heat dissipation adapter which shows the 2nd Embodiment of this invention. It is sectional drawing of the lighting fixture using the lamp device which attached the heat dissipation adapter which shows the 3rd Embodiment of this invention. It is a perspective view of the lamp device which shows the 4th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 3 show a first embodiment.

  As shown in FIGS. 1 and 2, reference numeral 11 denotes a lighting fixture. The lighting fixture 11 is a downlight that is embedded in a ceiling surface, and has a fixture main body 12 having an open bottom surface. Inside, a socket 13 is attached on the top side, and a reflector 14 that opens from the position of the socket 13 toward the lower surface opening of the instrument body 12 is disposed.

  A light bulb shaped lamp 16 as a lamp device is mounted on the socket 13, and the light bulb shaped lamp 16 is disposed in the reflector 14. The light bulb shaped lamp 16 includes a lamp device main body 17 and a heat dissipation adapter 18 for transferring heat from the lamp device main body 17 to the appliance side for heat dissipation.

  As shown in FIGS. 1 to 3, the lamp device main body 17 of the light bulb shaped lamp 16 is attached to a metal radiator 21 and one end side of this heat radiator 21 (one end side of the lamp shaft of the light bulb shaped lamp 16). The light emitting module 22, the insulating cover 23 attached to the other end of the radiator 21, the base 24 attached to the other end of the cover 23, one end of the radiator 21 covering the light emitting module 22 And a lighting circuit 26 housed inside the cover 23 between the radiator 21 and the base part 24.

  The radiator 21 is integrally formed of a metal material such as aluminum having excellent thermal conductivity, and a body portion 29 is formed in the central area, and a plurality of heat radiating fins are provided around the body portion 29 along the lamp axis direction. 30 is formed to project radially. The heat radiating fins 30 are formed to be inclined so that the amount of protrusion in the radial direction gradually increases from the other end side of the heat radiating body 21 to the one end side. Further, the light emitting module 22 is attached to the surface on one end side of the radiator 21 in surface contact, and a wiring hole (not shown) for connecting the light emitting module 22 and the lighting circuit 26 by wiring is formed in the body portion 29. Yes.

  The light emitting module 22 includes, for example, a substrate 32 formed of a metal material such as aluminum, or an insulating material such as ceramics or epoxy resin, and a plurality of wiring patterns formed on one end side surface of the substrate 32. An LED element 33 as a semiconductor light emitting element is mounted, and the surface on the other end side of the substrate 32 is attached in a state where it is in surface contact with the heat radiator 21 and is in thermal contact therewith. As the LED element 33, an SMD (Surface Mount Device) package for mounting an element with a connection terminal on which an LED chip is mounted, a COB (Chip On Board) module having a large number of LED chips mounted on a substrate, or the like is used. It is done.

  The cover 23 is formed of an insulating material such as PBT resin, for example, and is interposed between the radiator 21 and the base portion 24 to insulate each other.

  The base part 24 can be connected to a socket for general lighting bulbs such as E26 type, for example, a shell 35 that is caulked and fixed to the cover 23, an insulating part 36 provided on the other end side of the shell 35, and this An eyelet 37 provided on the top of the insulating portion 36 is provided.

  The globe 25 is formed in a spherical shape so as to cover the light emitting module 22 with light diffusing glass or synthetic resin. The other end side of the globe 25 is opened, and the edge of the opening is fitted and fixed to the radiator 21.

  The lighting circuit 26 is a circuit that supplies a constant current to the LED elements 33 of the light emitting module 22, for example, and is housed in the cover 23. The input side of the lighting circuit 26 is electrically connected to the shell 35 and the eyelet 37 of the base portion 24 by lead wires, and the output side of the lighting circuit 26 is connected to the light emitting module 22 by lead wires that pass through the wiring holes of the radiator 21. The substrate 32 is electrically connected.

  The heat dissipation adapter 18 is made of a metal such as a leaf spring having high thermal conductivity and elasticity due to spring force, and is provided at two locations on one end side and the other end side of the outer peripheral surface of the heat radiating body 21 of the light bulb shaped lamp 16. Lamp mounting portions 41 and 42 that are mounted in thermal contact with each other and a plurality of heat conducting portions 43 connected between the lamp mounting portions 41 and 42 are provided. On the outer surface of the heat conducting portion 43, an appliance contact portion 44 that is in surface contact with the reflector 14 of the luminaire 11 to which the light bulb shaped lamp 16 is attached is in thermal contact.

  The lamp mounting portions 41 and 42 are each formed in a ring shape, and the large-diameter lamp mounting portion 41 on one end side is press-fitted to the outer peripheral surface of the one end side of the radiator 21 of the light bulb shaped lamp 16 and is in surface contact with the heat. The small-diameter lamp mounting portion 42 on the other end side is press-fitted to the outer peripheral surface on the other end side of the light bulb shaped lamp 16, and is attached in a state of being in thermal contact with the surface contact. .

  The heat conducting portion 43 is in the form of a band, one end side is connected to one end side of the lamp mounting portion 41, the other end side is connected to one end side of the lamp mounting portion 42, and is equidistant along the circumferential direction of the lamp mounting portions 41, 42. Is arranged. In a state where the lamp mounting portions 41 and 42 are mounted on the light bulb shaped lamp 16, the length of the heat conducting portion 43 is longer than the distance between the lamp mounting portions 41 and 42, and the heat conducting portion 43 is curved to form a bulb shape. Projecting radially around the lamp 16, gaps 45 are formed between the plurality of heat conducting portions 43. In this state, the heat conducting portion 43 has elasticity that urges the heat conducting portion 43 to expand toward the outer diameter direction of the bulb lamp 16. Note that the lamp mounting portions 41 and 42 and the heat conducting portions 43 may be formed integrally or may be configured in combination as separate bodies.

  In addition, as shown in FIG. 2, when the bulb lamp 16 is mounted on the luminaire 11, the appliance contact portion 44 of the heat conducting portion 43 is restricted from contacting and damaging the reflector 14 of the luminaire 11. In addition, a ring 46 is used as a restricting means for holding the heat conducting portion 43 in a reduced diameter state that is elastically deformed so as to approach the outer peripheral surface of the bulb lamp 16.

  Next, the operation of the first embodiment will be described.

  As shown in FIG. 3, in order to attach the heat dissipation adapter 18 to the light bulb shaped lamp 16, the large diameter lamp mounting portion 41 of the heat radiation adapter 18 is attached to the outer peripheral portion of the light bulb shaped lamp 16 from the small diameter cap portion 24 side. And the lamp mounting portion 42 in this order, the large-diameter lamp mounting portion 41 of the heat dissipation adapter 18 is press-fitted into the outer peripheral surface of the large-diameter one end of the radiator 21, and the small-diameter lamp mounting portion 42 is Are fitted into the outer peripheral surface of the other end of the small diameter, and are in surface contact with the outer peripheral surface of the radiator 21 and are in thermal contact with each other.

  In a state where the heat dissipation adapter 18 is attached to the light bulb shaped lamp 16, each heat conducting portion 43 is curved and protrudes radially around the light bulb shaped lamp 16.

  As shown in FIG. 2, while elastically deforming the heat conducting portion 43 of the heat radiation adapter 18 so as to approach the outer peripheral surface of the light bulb shaped lamp 16, a ring 46 is attached around these heat conducting portions 43 to conduct heat conduction. The portion 43 is held in a reduced diameter state.

  Then, as shown in FIG. 2, in order to attach the light bulb shaped lamp 16 with the heat dissipation adapter 18 attached to the lighting fixture 11, the light bulb shaped lamp 16 with the base portion 24 facing upward is placed on the lower surfaces of the fixture body 12 and the reflector 14. The base portion 24 is inserted into the socket 13 and screwed into the socket 13 for connection.

  At this time, the heat conduction portion 43 of the heat dissipation adapter 18 is held in a reduced diameter state elastically deformed so as to approach the outer peripheral surface of the light bulb shaped lamp 16 by the ring 46, so that the heat conduction portion 43 of the reflector 14 The base portion 24 can be screwed into the socket 13 and connected without contacting the inner reflective surface.

  After the base portion 24 is screwed and connected to the socket 13, the ring 46 is removed downward while elastically deforming the heat conducting portion 43 of the heat dissipation adapter 18. As a result, as shown in FIG. 1, due to the elasticity of the heat conducting portion 43 of the heat dissipation adapter 18, the heat conducting portion 43 expands toward the outer diameter direction of the light bulb shaped lamp 16, and the outer surface of the heat conducting portion 43. That is, the instrument contact portion 44 comes into surface contact with the reflecting surface of the reflector 14 and comes into thermal contact therewith.

  Then, by energizing the light bulb shaped lamp 16 through the socket 13, the LED element 33 of the light bulb shaped lamp 16 is turned on, and the light of the LED element 33 is radiated downward through the lower surface opening of the reflector 14. At this time, the heat dissipation adapter 18 is attached to the heat dissipating body 21 which is a non-light emitting portion of the light bulb shaped lamp 16, and is disposed around the heat dissipating body 21, so that the light emitted from the light bulb shaped lamp 16 is blocked. There is no optical influence.

  Further, the heat generated by the LED element 33 that is lit is mainly conducted to the radiator 21 through the substrate 32.

  Part of the heat conducted to the radiator 21 is thermally conducted from the lamp mounting portions 41 and 42 of the radiator adapter 18 to the heat conducting portion 43, and from the appliance contact portion 44 of the heat conducting portion 43 to the reflector 14. Conducted and dissipated. At this time, since the lamp mounting portion 41 on one end side of the heat dissipation adapter 18 is attached to one end side of the heat dissipating member 21 close to the LED element 33, the heat transmitted from the LED element 33 to the heat dissipating member 21 is efficiently heated. Conducted to dissipate heat to the instrument side.

  Further, part of the heat conducted to the radiator 21 is radiated from the radiation fins 30 of the radiator 21 into the air. At this time, the heat radiation adapter 18 arranged around the heat radiator 21 has a gap 45 formed between the plurality of heat conducting portions 43, so that air permeability between the inside and the outside of the heat radiation adapter 18 is ensured. Replacement by convection between the air around the radiating fin 30 and the temperature below the lighting fixture 11 is possible, and the radiating efficiency of the radiating fin 30 can be ensured.

  In this way, by using the heat dissipation adapter 18, the heat generated when the light bulb shaped lamp 16 is turned on can be efficiently conducted to the lighting fixture 11, and the heat radiation performance of the light bulb shaped lamp 16 can be improved. Therefore, the temperature rise of the LED element 33 can be suppressed, the life can be extended, and the input can be increased to increase the luminous flux.

  In addition, since the heat conducting unit 43 has elasticity that urges the lamp-shaped lamp 16 in the direction of deployment toward the lighting fixture 11, even if the interval between the bulb-shaped lamp 16 and the lighting fixture 11 varies. It is possible to cope with it, and it is possible to obtain a high conformity rate to the existing lighting fixture 11.

  In addition, when the light bulb shaped lamp 16 is attached to the luminaire 11, it is possible to restrict the heat conduction part 43 from coming into contact with the luminaire 11 by the ring 46, so that the luminaire 11 can be prevented from being damaged.

  Further, since the heat dissipation adapter 18 is attached to the heat dissipating body 21 which is a non-light emitting portion of the light bulb shaped lamp 16, the heat dissipation can be improved without optical influence.

  In addition, by making the heat dissipation adapter 18 detachable from the light bulb shaped lamp 16, for example, the heat radiation adapter 18 can be replaced as a new light bulb shaped lamp 16 by removing the heat radiation adapter 18 from the light bulb shaped lamp 16 whose life has been broken or broken. A heat-dissipating adapter 18 prepared by removing a light bulb shaped lamp that is not attached can be attached and used, and the heat-dissipating adapter 18 can be reused many times.

  Next, FIG. 4 shows a second embodiment, and FIG. 4 is a sectional view of the lighting fixture 11 in a normal temperature state of a light bulb shaped lamp 16 to which a heat dissipation adapter 18 is attached.

  A shape memory alloy is used as a restricting means for at least the heat conducting portion 43 of the heat dissipation adapter 18. The shape memory alloy heat conduction portion 43 is set so as to reduce the diameter close to the bulb-shaped lamp 16 side in a predetermined normal temperature region, and at the side of the bulb-shaped lamp 16 by raising the temperature from the normal temperature region. It is set to expand towards.

  When the light bulb shaped lamp 16 with the heat radiating adapter 18 attached is attached to the lighting fixture 11, the heat conducting portion 43 of the heat radiating adapter 18 is in the normal temperature region, so that the heat conducting portion 43 approaches the light bulb shaped lamp 16 side and is reduced in diameter. The base part 24 can be screwed into the socket 13 and connected without the heat conducting part 43 contacting the reflective surface of the inner surface of the reflector 14.

  In addition, when the light bulb shaped lamp 16 is turned on, the heat generated by the LED element 33 is conducted to the heat conducting portion 43 of the heat dissipation adapter 18 and rises in temperature from the normal temperature region. The outer surface of the heat conducting portion 43, that is, the instrument contact portion 44 is brought into surface contact with the reflecting surface of the reflector 14 and is in thermal contact with it (see the state shown in FIG. 1). Become).

  Moreover, since the heat conducting part 43 of the heat dissipation adapter 18 is lowered to the normal temperature region by turning off the light bulb shaped lamp 16, the heat conducting part 43 is displaced so as to reduce the diameter by approaching the light bulb shaped lamp 16 side, and the reflector. 14 is away from the reflective surface of the inner surface of 14. Therefore, when the light bulb shaped lamp 16 is removed from the luminaire 11 for replacement or cleaning of the light bulb shaped lamp 16, the heat conducting part 43 does not come into contact with the reflecting surface on the inner surface of the reflector 14, and the light bulb shaped lamp 16 The base part 24 can be removed from the socket 13 by rotating.

  Next, FIG. 5 shows a third embodiment, and FIG. 5 is a cross-sectional view of a lighting fixture using a lamp device to which a heat dissipation adapter is attached. In addition, since it has the function similar to the said embodiment about a thermal radiation adapter, it demonstrates using the same code | symbol.

  The lighting fixture 51 is, for example, a downlight, and includes a fixture main body 52, a socket 53 attached to the fixture main body 52, and a lamp device 54 that can be attached to and detached from the socket 53.

  The instrument main body 52 is made of metal and is integrally formed with a reflector whose peripheral portion expands downward.

  The socket 53 has a cylindrical socket body 57 made of an insulating synthetic resin, and an insertion hole 58 is formed through the center of the socket body 57 in the vertical direction. On the lower surface of the socket body 57, a pair of connection holes 59 are formed in a symmetrical position with respect to the center of the socket body 57, and a power receiver (not shown) for supplying power is disposed inside the connection holes 59. ing. The connection hole 59 is an arc-shaped long hole that is concentric with the center of the socket main body 57, and an enlarged diameter portion is formed at one end of the long hole.

  The lamp device 54 includes a lamp device main body 61 and a heat dissipation adapter 18 for transferring heat from the lamp device main body 61 to the fixture side for heat dissipation.

  The lamp device main body 61 includes a radiator 64, a cap 65 formed on the upper surface which is one end of the radiator 64, a light emitting module 66 disposed on the lower surface which is the other end of the radiator 64, and the light emission. A globe 67 that covers the module 66 and a lighting circuit 68 disposed in the radiator 64 are provided and are formed in a thin shape with a small dimension in the height direction.

  The radiator 64 is made of a metal having excellent thermal conductivity, such as aluminum, and is formed in a disk shape, and a base portion 65 is integrally formed on the upper surface side.

  The base portion 65 is of the GX53 type, and includes a cylindrical protrusion 70 protruding upward from the center of the upper surface, and a pair of lamp pins 72 protruding upward from a ring-shaped insulating cover 71 disposed around the protrusion 70. I have.

  The pair of lamp pins 72 are arranged at symmetrical positions with respect to the center of the lamp device 54, and a large-diameter portion 73 is formed at the tip. The large diameter portion 73 of each lamp pin 72 is inserted from the enlarged diameter portion of each connection hole 59 of the socket 53, and the lamp pin 72 is moved to the long hole portion of the connection hole 59 by the rotation of the lamp device 54. 72 is electrically connected to a receiver disposed inside the connection hole 59, and the large diameter portion 73 is caught by the edge of the connection hole 59, so that the lamp device 54 is held in the socket 53.

  The light emitting module 66 includes, for example, a substrate 75 formed of a metal material such as aluminum, or an insulating material such as ceramics or epoxy resin, and a plurality of semiconductor light emitting elements on a wiring pattern formed on the lower surface of the substrate 75 The LED element 76 is mounted, and the upper surface of the substrate 75 is in thermal contact with the radiator 64 in surface contact. As the LED element 76, as in the above-described embodiment, an SMD package for mounting an element with a connection terminal on which an LED chip is mounted is used.

  The globe 67 is made of transparent or light diffusing glass or synthetic resin having translucency.

  The lighting circuit 68 is a circuit that supplies a constant current to the LED element 76 of the light emitting module 66, and the input side of the lighting circuit 68 is electrically connected to the pair of lamp pins 72 of the base 65 by lead wires, The output side of the lighting circuit 68 is electrically connected to the substrate 75 of the light emitting module 66 by a lead wire.

  Similarly to the embodiment, the heat dissipation adapter 18 is made of metal such as a leaf spring having high thermal conductivity and elasticity by spring force, and the lower end side of the outer peripheral surface of the radiator 64 of the lamp device 54 and There are lamp mounting portions 41 and 42 that are mounted in thermal contact with each other at two locations on the upper end side, and a plurality of heat conducting portions 43 connected between the lamp mounting portions 41 and 42. On the outer surface of the heat conducting portion 43, an appliance contact portion 44 that is in surface contact with the fixture main body (reflector) 52 of the luminaire 51 to which the lamp device 54 is attached is in thermal contact.

  The lamp mounting portions 41 and 42 are each formed in a ring shape, and are press-fitted onto the outer peripheral surface of the heat radiating body 64 of the lamp device 54 and are mounted in a state where they are in surface contact and in thermal contact.

  The heat conducting portion 43 is belt-shaped, one end side is connected to the lamp mounting portion 41, the other end side is connected to the lamp mounting portion 42, and is arranged at equal intervals along the circumferential direction of the lamp mounting portions 41 and 42. In a state where the lamp mounting portions 41 and 42 are mounted on the lamp device 54, the length of the heat conducting portion 43 is longer than the distance between the lamp mounting portions 41 and 42, and the heat conducting portion 43 is curved and the lamp device 54 is bent. And a gap (similar to the gap 45 in the above-described embodiment) is formed between the plurality of heat conducting portions 43. In this state, the heat conducting portion 43 has elasticity that biases it so as to expand toward the outer diameter direction of the lamp device 54.

  In order to mount the lamp device 54 on the lighting fixture 51, the lamp pin 72 of the lamp device 54 is inserted into the enlarged diameter portion of the connection hole 59 of the socket 53, and the lamp device 54 is rotated in the mounting direction. Is moved to the connection hole 59 so that the lamp pin 72 is brought into electrical contact with the receptacle of the socket 53, and the large diameter portion 73 of the lamp pin 72 is caught on the edge of the connection hole 59. Can be attached to.

  At this time, as in the above-described embodiment, the heat conduction part 43 of the heat dissipation adapter 18 is held in a reduced diameter state elastically deformed so as to approach the outer peripheral surface of the lamp device 54 by the ring 46. The base part 65 can be rotated and connected to the socket 53 without the conductive part 43 contacting the reflective surface of the inner surface of the instrument body 52.

  After connecting the base part 65 to the socket 53, the ring 46 is removed downward from the heat conducting part 43 of the heat radiating adapter 18, so that the heat conducting part 43 becomes elastic due to the elasticity of the heat conducting part 43 of the heat radiating adapter 18. The lamp device 54 expands toward the outer diameter direction, and the outer surface of the heat conducting part 43, that is, the instrument contact part 44 comes into surface contact with the reflective surface of the instrument body 52 and comes into thermal contact therewith.

  When the lamp device 54 is energized through the socket 13, the LED element 76 of the lamp device 54 is turned on, and the light of the LED element 76 is radiated downward through the lower surface opening of the instrument body 52. At this time, the heat radiation adapter 18 is attached to the heat radiator 64 which is a non-light emitting portion of the lamp device 54 and is disposed around the heat radiator 64, so that the light emitted from the lamp device 54 may be blocked. There is little optical influence.

  Further, heat generated by the LED element 76 that is lit is mainly conducted to the heat radiating body 64 through the substrate 75.

  A part of the heat conducted to the radiator 64 is conducted from the lamp mounting portions 41 and 42 of the radiator adapter 18 to the heat conducting portion 43, and from the appliance contact portion 44 of the heat conducting portion 43 to the appliance main body 52. Conducted and dissipated. At this time, the lamp mounting part 41 on one end side of the heat dissipation adapter 18 is attached to the heatsink 64 at a position close to the LED element 76, so that the heat transferred from the LED element 76 to the heatsink 64 is efficiently conducted. Can be dissipated to the appliance side.

  As described above, by using the heat dissipation adapter 18, heat generated when the lamp device 54 is turned on can be efficiently conducted to the lighting fixture 51, and heat dissipation of the lamp device 54 can be improved. Therefore, the temperature rise of the LED element 76 can be suppressed, the life can be extended, and the input can be increased to increase the luminous flux.

  Next, FIG. 6 shows a fourth embodiment, and FIG. 6 is a perspective view of the lamp device.

  The lamp device 81 has a ball shape and is suitable for indirect illumination such as a wall surface. The lamp device 81 covers a hemispherical radiator 82, a light emitting module 83 attached to one end of the radiator 82, and the light emitting module 83. The hemispherical translucent cover 84 attached to one end of the radiator 82, the base 85 disposed on the one end of the translucent cover 84, and the radiator 82 and the base 85 are connected and supported. And a lighting column 87 housed in the radiator 82.

  The radiator 82 is made of a metal material such as aluminum having excellent thermal conductivity, and a plurality of radiating fins 89 are formed on the outer peripheral surface.

  The light emitting module 83 includes, for example, a disk-shaped substrate 91 formed of a metal material such as aluminum, or an insulating material such as ceramics or epoxy resin, and a wiring pattern formed on one surface of the substrate 91 A plurality of LED elements 92 as semiconductor light emitting elements are mounted thereon, and the other end side surface of the substrate 91 is attached in a state of being in thermal contact with the radiator 82. For this LED element 92, an SMD package or the like on which an element with a connection terminal on which an LED chip is mounted is mounted, and the light emission direction is a direction perpendicular to the substrate 91, and the LED element 92 is parallel to the substrate 91. Both of the outer diameter direction and the outer diameter direction are used. Further, the upper surface of the substrate 91 and the upper surface of the heat dissipating body 82 are configured as reflective surfaces having high reflectivity.

  The translucent cover 84 is made of light diffusing glass or synthetic resin.

  The base portion 85 can be connected to a socket for general lighting bulbs such as an E26 type, and has a shell 94 and an eyelet 96 on an end surface of the shell 94 via an insulating portion 95.

  The column 86 is cylindrical and supports the radiator 82 and the base 85 connected to each other. Inside, a lead wire for connecting the base 85 and the lighting circuit 87 in the radiator 82 is inserted and arranged. ing.

  The heat dissipating adapter of the above embodiment can be attached to the heat dissipating body 82 of the lamp device 81.

  When the lighting fixture is a wall-mounted indirect lighting fixture, the translucent cover 84 of the lamp device 81 is attached to the wall surface by connecting the base portion 85 of the lamp device 81 to the socket of the fixture body attached to the wall surface. The heat radiating body 82 faces the direction opposite to the wall surface and faces the inner surface of the front cover of the lighting fixture.

  When the LED element 92 is turned on, the light from the LED element 92 is diffused and transmitted through the translucent cover 84 and irradiated onto the wall surface, and indirectly illuminated.

  In addition, the heat dissipation adapter attached to the heat radiator 82 of the lamp device 81 faces the inner surface of the front cover of the lighting fixture. The heat dissipation adapter is in thermal contact with the front cover, and heat generated when the LED element 92 is lit. The heat is transferred from the radiator 82 to the appliance side to dissipate heat.

11 Lighting equipment
12 Instrument body
13 socket
16 Light bulb shaped lamp as a lamp device
17 Lamp unit
18 Heat dissipation adapter
21 radiator
24 Base part
33 LED elements as semiconductor light-emitting elements
41, 42 Lamp mount
43 Heat conduction part
44 Instrument contact area
46 Rings as regulatory means
51 Lighting equipment
52 Instrument body
53 Socket
54 Lamp device
61 Lamp unit
64 radiator
65 Base
76 LED elements as semiconductor light-emitting elements
81 Lamp device
82 radiator
85 base
92 LED elements as semiconductor light-emitting elements

Claims (5)

A lamp mounting portion mounted in thermal contact with a lamp device having a semiconductor light emitting element as a light source;
A heat-conducting portion that has an appliance contact portion that is in thermal contact with a lighting fixture equipped with the lamp device, and that conducts heat generated when the lamp device is turned on from the lamp mounting portion side to the appliance contact portion side;
A heat dissipating adapter comprising: The heat-radiating adapter according to claim 1, wherein the heat conducting portion has elasticity to urge the heat conducting portion in a direction of deployment from the lamp device toward the lighting fixture. The apparatus further comprises a restricting means for restricting the appliance contact portion of the heat conducting portion from contacting the lighting fixture when the lamp device is attached to the lighting fixture, and allowing the restriction to be released in the mounted state. Item 3. The heat dissipation adapter according to item 1 or 2. A lamp body having a radiator, a semiconductor light emitting element provided on one end of the radiator, and a base provided on the other end of the radiator;
The heat dissipation adapter according to any one of claims 1 to 3, wherein the heat dissipation adapter is attached to a heat dissipation body of the lamp device body;
A lamp device comprising: An instrument body having a socket;
The lamp device according to claim 4, wherein the base portion is mounted on the socket and disposed in the device main body, and the device contact portion of the heat conducting unit is brought into contact with the device side;
The lighting fixture characterized by comprising.

Images