JP2011047650A - Probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card capable of increasing a density of probe pins, even if perpendicular cantilevers are ready to be easily curved and deformed. <P>SOLUTION: The probe card 1 includes a plurality of probe pins 3A. The probe pins 3A are formed with four perpendicular cantilevers 4, which abut on ball electrodes 10, and which are arranged equidistantly spaced on the circumference of a virtual circle VC. Here, movable regions 3AR of the plurality of probe pins 3 overlap mutually, and the probe pins 3A are disposed so that rotational angles may differ alternately in the X-Y direction by setting the rotational angles to 0 or 45 degrees. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a probe card, and more particularly to a probe card that can be suitably used for a continuity test of a BGA type IC (ball grid array type integrated circuit).

  In the conventional probe card 101, as an example, as shown in FIG. 23, a plurality of probe pins 103 in which a plurality of vertical cantilevers 104 formed using a high-rigidity metal such as tungsten are arranged in a cylindrical shape are arrayed. Are arranged (on lattice points of a square lattice). As shown in FIG. 24, when a ball electrode 10 of a BGA IC (ball grid array integrated circuit) (not shown) is pressed near the center of the probe pin 103, the vertical cantilever 104 is curved and deformed outward. As a result, the probe pin 103 spreads outward and deforms so as to enclose the ball-type electrode 10, so that an IC continuity test can be performed without damaging the ball-type electrode 10.

JP-A-8-17500

  However, when the rigidity of the vertical cantilever 104 is lowered in order to minimize the occurrence of scratches on the ball-type electrode 10, or when using a highly conductive metal that has excellent conductivity but poor rigidity, When the cantilever 104 is formed and the vertical cantilever 104 is in a state of being easily deformed to bend, as shown in FIG. 25, if the distance D between the adjacent probe pins 103 is too small, Sometimes the vertical cantilever 104 comes into contact with the adjacent vertical cantilever 104. In order to avoid this, in the conventional probe card 101, as shown in FIG. 26 and FIG. 27, the distance D between the arrangement of the probe pins 103 had to be increased. There was a problem that it could not be realized.

  Accordingly, the present invention has been made in view of these points, and it is an object of the present invention to provide a probe card capable of realizing high-density probe pins even when the vertical cantilever is in a state of being easily bent and deformed. It is an object of the invention.

  In order to achieve the above-described object, the probe card of the present invention has, as its first aspect, a plurality of vertical cantilevers that are in contact with the ball-type electrode and are arranged at equal intervals on the virtual circumference. A probe pin is provided, and the vertical cantilever is formed so as to be deformed outward from the center of the probe pin upon contact with the ball-shaped electrode, and the probe pin is deformed when the vertical cantilever is contact-deformed. It is characterized in that it is disposed so as to overlap with another adjacent probe pin and so that the contact-deformed vertical cantilever does not contact the contact-deformed vertical cantilever.

  According to the probe card of the first aspect of the present invention, the distance between adjacent probe pins can be reduced by the amount of overlap of the probe pins.

  The probe card according to the second aspect of the present invention is the probe card according to the first aspect, wherein the probe pin has n (even number equal to or greater than 2) vertical cantilevers, and the plurality of probe pins are Rotation of a probe pin which is arranged on a lattice point of a square lattice and arranged so that the deformation direction of one of the n vertical cantilevers is adapted to one of two-dimensional directions It is characterized in that the angle of rotation is set to 0 degrees and the rotation angle of the probe pin is set to 0 degrees or 360 / 2n degrees so that the rotation angles are alternately different in both directions of the two-dimensional direction.

  According to the probe card of the second aspect of the present invention, the overlap rate of the probe pins can be improved.

  The probe card according to a third aspect of the present invention is the probe card according to the first aspect, wherein the probe pin has m (m = odd greater than or equal to 3) vertical cantilevers, and the plurality of probe pins are Rotation of the probe pin which is arranged on the lattice point of the square lattice and which is arranged by adapting the deformation direction of one of the m vertical cantilevers to one of the two-dimensional directions. By setting the angle of the probe pin to 0 degree and the rotation angle of the probe pin to 0 degree or 360/2 m degrees, the rotation angle is arranged to be alternately different only in one direction of the two-dimensional direction.

  According to the probe card of the third aspect of the present invention, the overlap ratio of probe pins can be improved.

  The probe card according to a fourth aspect of the present invention is the probe card according to the first aspect, wherein the probe pin has n (n = 2 or more) vertical type cantilevers, and the plurality of probe pins are Rotation of a probe pin which is arranged on a lattice point of a square lattice and arranged so that the deformation direction of one of the n vertical cantilevers is adapted to one of two-dimensional directions The angle is set to 0 degree, and the rotation angle of all probe pins is set to 360 / 4n degree.

  According to the probe card of the fourth aspect of the present invention, the overlap ratio of probe pins can be improved.

  The probe card according to a fifth aspect of the present invention is the probe card according to any one of the second to fourth aspects, wherein the plurality of vertical cantilevers are formed to have the same width and are equal to or greater than the width of the vertical cantilever. It is characterized by being arranged at equal intervals on the virtual circumference with a distance of.

  According to the probe card of the fifth aspect of the present invention, the overlap ratio of probe pins can be improved.

  According to the probe card of the present invention, since the probe pins overlap without causing the vertical cantilever to contact when the ball-type electrode contacts, the height of the probe pin can be increased even in a state where the vertical cantilever tends to bend and deform. There is an effect that densification can be realized.

  Hereinafter, the probe card of the present invention will be described with reference to its three embodiments.

  First, the probe card 1A of the first embodiment will be described. 1 and 2 show a probe pin 3A formed on the probe card 1A of the first embodiment. 3 and 4 show a state in which the ball type electrode 10 of the BGA type IC (not shown) is in contact with the probe pin 3A of the first embodiment.

  As shown in FIG. 1 or FIG. 3, the probe card 1A of the first embodiment has a plurality of probes on the surface 2a of the wiring board 2 facing the ball type electrode 10 of a BGA type IC represented by a solder ball or the like. A pin 3A is provided. The plurality of probe pins 3A are electrically connected to wirings and vias (not shown) formed on the wiring board 2.

  As shown in FIGS. 1 and 2, the probe pin 3 </ b> A has a plurality of vertical cantilevers 4. The vertical cantilever 4 is a cantilever that stands in a vertical direction from the reference surface 2a, with one end serving as a fixed end 4r fixed to the reference surface (surface 2a of the wiring board 2) and the other end serving as a free end 4f.

  The plurality of vertical cantilevers 4 are arranged at equal intervals on the circumference of a virtual circle VC having a diameter smaller than the diameter of the ball-type electrode 10. The reason why the diameter of the virtual circle VC is smaller than the diameter of the ball-type electrode 10 is that the ball-type electrode 10 contacts the probe pin 3A in the vicinity of the center 3c of the probe pin 3A. The diameter of the probe pin 3A of the first embodiment (the diameter of the virtual circle VC described above) is 20 μm to 100 μm.

  As shown in FIGS. 2 to 4, the vertical cantilever 4 is formed so as to be deformed outward from the center 3 c of the probe pin 3 </ b> A when contacting the ball-type electrode 10. Regarding the shape of the vertical cantilever 4, various shapes can be considered in consideration of the prior art. The vertical cantilever 4 of the first embodiment has an arc-shaped column shape (see FIG. 1), a quadrangular column shape (see FIG. 5), or other column shape or cone shape, as shown in FIG. The periphery of the free end 4f is formed in a shape that is refracted about 30 to 60 degrees outward from the center 3c of the probe pin 3A.

  The number of vertical cantilevers 4 that one probe pin 3A has (hereinafter simply referred to as “the number of vertical cantilevers 4”) differs depending on each embodiment. The number of the vertical cantilevers 4 in the first embodiment is n (n = 2 or even number), specifically, four.

  The thickness of the vertical cantilever 4 (the length of the probe pin 3A in the direction from the center 3c to the outside) is determined by how much the resistance to the ball-type electrode 10 is set. Since the vertical cantilever 4 of the first embodiment is formed mainly using a metal such as Ni—P, Cu, W (tungsten), the thickness is set to about 10 μm to 20 μm.

  FIG. 6 shows the deformation direction 4CD of the vertical cantilever 4 and the movable region 3AR of the probe pin 3A based on FIGS. The deformation direction 4CD of the vertical cantilever 4 is indicated by using the arrow shown in FIG. 6, and the movable area 3AR of the probe pin 3A is indicated by using the circle shown in FIG. Moreover, the overlapping part of each movable area | region 3AR has shown overlap OL of the probe pin 3A. The movable region 3AR of the probe pin 3A is a circle centered on the center 3c of the probe pin 3A, and the circumference of a circle in which the tip of an arrow indicating the deformation direction 4CD of the vertical cantilever 4 is arranged on the circumference. The upper and inner regions depend on the amount of deformation of the vertical cantilever 4 but do not depend on the number thereof.

  As shown in FIG. 3 and FIG. 6, the plurality of probe pins 3A are on lattice points (array form) of a square lattice similar to the arrangement of the ball-shaped electrodes 10 so as to satisfy a predetermined position and condition. Has been placed. The predetermined position means that when four vertical cantilevers 4 in one arbitrarily selected probe pin 3A are in contact with the ball-shaped electrode 10 and deformed, the probe pin 3A is adjacent to the other probe pin 3A. This is a position overlapping the pin 3A. Also, the predetermined condition is that when the four vertical cantilevers 4 in one arbitrarily selected probe pin 3A are in contact with the ball electrode 10 and deformed, the four vertical cantilevers 4 deformed in contact with each other. Is in such a condition that it does not come into contact with the vertical cantilever 4 that has been deformed in contact with another adjacent probe pin 3A.

  Various methods are conceivable for satisfying the predetermined condition. In the first embodiment, as a first method, as shown in FIG. 6, the rotation angle of the probe pin 3A is set to 0 degree or θ (θ = 360 / 2n) degree, thereby arranging the lattice arrangement. A plurality of probe pins 3A are arranged so that their rotation angles are alternately changed in both directions of the probe pin 3A in the XY direction (two-dimensional direction). For example, as shown in FIG. 6, the deformation direction 4CD of one vertical cantilever 4 out of four vertical cantilevers 4 is changed to the X direction (either one) in the XY direction (two-dimensional direction). If the rotation angle of the probe pin 3A arranged so as to be adjusted to 0 is 0 degree (see the arrow parallel to the X direction inside the circle in the center 3c in FIG. 6), the rotation angle of the probe pin 3A in the center in FIG. The rotation angles of the other four probe pins 3A adjacent to it in the XY direction are θ. Since the number n of the vertical cantilevers 4 in the first embodiment is four, the rotation angle of the probe pin 3A is 0 degree or 45 (= 360 / 2n) degrees.

  Further, as a second method satisfying the above-mentioned predetermined condition, as shown in FIG. 5, in addition to the first method described above, the width w of the vertical cantilever 4 is set to the same length, and those There is a method of setting the length smaller than the distance d between the arrangements. For example, when the vertical cantilever 4 has an arc column shape as shown in FIG. 1, the vertical cantilever 4 is set to be smaller than an arc of 1/8 circle, and the distance d between adjacent vertical cantilevers 4 is set. Is preferably set to be larger than an arc of 1/8 circle.

  If the width w of the vertical cantilever 4 is made too small, the contact area with the ball-type electrode 10 becomes small, and the deformation direction 4CD of the vertical cantilever 4 may be blurred. In view of the above, the width w of the vertical cantilever 4 is preferably about 10 μm to 55 μm (the width w of the vertical cantilever 4 <the length of one side of the 2n square).

  Next, the manufacturing method of the vertical cantilever 4 of the first embodiment will be briefly described with reference to FIGS. The vertical cantilever 4 of the first embodiment is manufactured mainly through four processes.

  In the first step, as shown in FIG. 7, a resist film 10 having a thickness equivalent to the height of the vertical cantilever 4 is formed on the surface 2a of the wiring board 2, and a cup similar to a megaphone is formed on the resist film 10. A first resist pattern 10p having a shape is formed by patterning. The first resist pattern 10 p is a mold that forms the outer peripheral surface of the vertical cantilever 4. Then, a seed film 11 such as a Cu film is formed by sputtering on the surface of the first resist pattern 10p.

  In the second step, as shown in FIG. 8, a resist film is formed on the surface of the seed film 11 and patterned to form a second resist pattern 12 on the surface of the seed film 11. The second resist pattern 12 has the same shape as the space formed between the adjacent vertical cantilevers 4 and forms a side surface of the vertical cantilever 4.

  In the third step, as shown in FIG. 9, the vertical cantilever 4 is formed by metal plating on the seed film 11 exposed after the second step. As the material of the vertical cantilever 4, a material conventionally used for the probe pin 3 </ b> A such as Ni—P or Cu can be selected.

  In the fourth step, as shown in FIG. 10, the second resist pattern 12, the seed film 11 and the resist film 10 are removed. The second resist pattern 12 and the resist film 10 are removed by a resist remover, and the seed film 11 is removed by ion milling. Through the above four steps, the vertical cantilever 4 of the probe pin 3A is formed.

  Next, the operation of the probe card 1A of the first embodiment will be described.

  As shown in FIG. 1 or 5, the probe card 1 </ b> A according to the first embodiment is provided with probe pins 3 </ b> A that satisfy the predetermined positions and conditions described above. The predetermined position is a position where the movable region 3AR of the probe pin 3A overlaps when briefly described, and the predetermined condition is a condition satisfying the arrangement of the probe pins 3A so that the vertical cantilevers 4 do not contact each other. It is. When the probe pins 3A satisfy these predetermined positions and conditions, as shown in FIGS. 3 and 4, the distance between the adjacent probe pins 3A can be reduced by the amount of overlap of the probe pins 3A.

  With respect to the predetermined condition described above, the overlap rate of the probe pin 3A can be improved by employing various methods. Examples of the various methods include the two methods described above.

  In the first method, as shown in FIG. 6, the rotation angle of the probe pin 3A is set to 0 degree or θ degree, and the rotation angle of the probe pin 3A is made different in both directions in the XY directions. . The rotation angle θ degree is 360 / 2n degrees, and the value of θ is half the sandwich angle 360 / n degrees formed by the deformation direction 4CD of the two adjacent vertical cantilevers 4. Since n = 4 in the first embodiment, the included angle is 90 degrees and the rotation angle θ is 45 degrees. That is, as shown in FIG. 6, the vertical cantilever 4 of another probe pin 3A adjacent to the probe pin 3A so as to divide into the middle of the two adjacent vertical cantilevers 4 of a certain probe pin 3A. Is deformed. To discuss from another angle, when one vertical type cantilever 4 in one probe pin 3A is curved outwardly, the two vertical type cantilevers 4 of the other probe pins 3A adjacent to it are arranged so as to avoid contact with each other. To bend and deform. By arranging the probe pins 3A in such a direction, the overlap rate of the probe pins 3A can be improved.

  Further, in the second method satisfying the above-mentioned predetermined condition, as shown in FIG. 5, the width w of the vertical cantilever 4 is formed to be the same, and the distance d between the vertical cantilevers 4 is set to the vertical type. The vertical cantilevers 4 are equally spaced apart by a distance equal to or greater than the width w of the cantilever 4. If the width w of the vertical cantilever 4 is larger than the distance d between the vertical cantilevers 4, the vertical cantilever 4 may come into contact with the adjacent vertical cantilever 4 before completing the outward bending deformation. (See FIG. 3). However, as shown in FIG. 5, if the width w of the vertical cantilever 4 is smaller than the distance d between the vertical cantilevers 4, the adjacent vertical cantilevers 4 come into contact with each other without deformation. There is no. That is, by adopting the second method, the distance D between the adjacent probe pins 3A can be reduced, so that the overlap ratio of the probe pins 3A can be improved.

  That is, according to the probe card 1A of the first embodiment, since the probe pin 3A overlaps without causing the vertical cantilever 4 to contact when the ball-shaped electrode 10 contacts, the vertical cantilever 4 is curved and deformed. Even in an easy state, there is an effect that the high density of the probe pins 3A can be realized.

  Note that the number of vertical cantilevers 4 in the first embodiment is four, that is, n = 4, but n is an even number of 2 or more. Therefore, the number n of the vertical cantilevers 4 may be set to 2 as shown in FIGS. In this case, since the sandwiching angle of the adjacent vertical cantilever 4 is 180 degrees, the rotation angle of the probe pin 3A is preferably set to 0 degree or 90 (= 360 / 2n) degrees. The width w of the vertical cantilever 4 is preferably set similarly to the above.

  Next, a probe card 1B according to the second embodiment will be described with reference to FIGS. 13 and 14 show a contact state of the probe pin 3B formed on the probe card 1B of the second embodiment. The difference between the first embodiment and the second embodiment is that the number of the vertical cantilevers 4 is set to an odd number instead of an even number.

  As shown in FIGS. 13 and 14, the probe card 1 </ b> B of the second embodiment has a plurality of probe pins 3 </ b> B of the second embodiment on the surface 2 a of the wiring board 2. The probe pin 3B of the second embodiment has m (m = odd greater than or equal to 3) vertical cantilevers 4, and specifically, is set to three. Further, the plurality of probe pins 3B satisfy predetermined positions and conditions and are arranged on lattice points of a square lattice. The predetermined position and condition are, in a simplified manner, a position where the probe pin 3B overlaps and a condition where the vertical cantilever 4 does not contact. The condition of not contacting is, for example, the condition of the orientation of the probe pin 3B or the condition of the width w of the vertical cantilever 4.

  Here, as a point greatly different from the first embodiment, the rotation angle of the probe pin 3B is set to 0 degree or 360/2 m degrees, and the X direction (one direction) in the XY direction (two-dimensional direction). Only in that the rotation angles are alternately different. The rotation angle of the probe pin 3B is not different in the Y direction (other direction). As in the first embodiment, the rotation angle of the probe pin 3B arranged with the deformation direction 4CD of the arbitrary vertical cantilever 4 adapted to the Y direction (one of the two-dimensional directions) is set to 0 degree. .

  As in the first embodiment, the vertical cantilevers 4 of the second embodiment have the same width w and are spaced apart by a distance d greater than the width w. It is preferable to arrange them at intervals.

  Next, the operation of the probe card 1B of the second embodiment will be described. Since operations and effects similar to those of the first embodiment are exhibited except for differences from the first embodiment, operations relating to differences from the first embodiment will be described mainly.

  In the probe card 1B of the second embodiment, as shown in FIGS. 13 and 14, the rotation angle of the probe pin 3B is set to 0 degrees or θ (= 360/2 m) degrees, and the X direction (2 The probe pins 3B are arranged so that the rotation angles thereof are alternately different only in one direction of the dimension).

  As is apparent from the probe pins 3B arranged in the Y direction, in the probe pins 3B arranged in the Y direction, when the vertical cantilever 4 directed in the Y direction is curved and deformed outward, it is opposite to and adjacent to the 2 The two vertical cantilevers 4 are curved and deformed so as to avoid contact with the vertical cantilevers 4. That is, for the probe pins 3B arranged in the Y direction, the distance D between the arrangement of the probe pins 3B can be reduced without changing the rotation angle of the probe pins 3B, so that the rotation angle is not changed. The overlap ratio of the probe pin 3B can be increased. On the other hand, if the rotation angle of the probe pins 3B arranged in the X direction is not changed, the adjacent vertical cantilevers 4 come into contact with each other.

  Therefore, when m = 3 as in the second embodiment, the sandwiching angle of the adjacent vertical cantilever 4 is 120 degrees, so the rotation angle of the probe pins 3B arranged in the X direction is set to 0 degrees or 60 degrees. The probe pins 3B are arranged so that the rotation angles are alternately different by setting (= 360 / 2m) degrees. Accordingly, the vertical cantilevers 4 adjacent to each other in the X direction are arranged in parallel, so that contact of the vertical cantilevers 4 can be prevented.

  From the above, also in the probe card 1B of the second embodiment, the overlap rate of the probe pins 3B can be improved in both directions in the XY directions. From this, the distance D between arrangement | positioning of the probe pin 3B can be narrowed.

  That is, according to the probe card 1B of the second embodiment, since the probe pin 3B overlaps without causing the vertical cantilever 4 to contact when the ball-type electrode 10 contacts, the vertical cantilever 4 is bent and deformed. Even in an easy state, there is an effect that the high density of the probe pins 3B can be realized.

  In the second embodiment, m = 3 is set. However, as shown in FIGS. 15 and 16, even if m = 5, m is an odd number equal to or greater than 3, so that it is the same as in the second embodiment. The effect of is established.

  Next, a probe card 1C according to the third embodiment will be described with reference to FIGS. 17 and 18 show a contact state of the probe pin 3C formed on the probe card 1C of the third embodiment. The difference between the first embodiment and the third embodiment is that the rotation angle of the probe pin 3C is not alternately changed in both directions in the XY directions, but the rotation angle of the probe pin 3C is in any direction. Is also set to be constant.

  As shown in FIGS. 17 and 18, the probe card 1 </ b> C of the third embodiment has a plurality of probe pins 3 </ b> C of the third embodiment on the surface 2 a of the wiring board 2. The probe pin 3C of the third embodiment has n (n = 2 or even number) vertical cantilevers 4, and specifically, is set to four. Further, the plurality of probe pins 3C satisfy predetermined positions and conditions and are arranged on lattice points of a square lattice. The predetermined position and condition are the position where the probe pin 3C overlaps, the condition of the orientation of the probe pin 3C that increases the overlap ratio, and the condition of the width w of the vertical cantilever 4.

  Here, the point that differs greatly from the first embodiment is that the probe pins 3C are arranged with their rotation angles θ set to 360 / 4n degrees. As in the first embodiment, the rotation angle of the probe pin 3C arranged with the deformation direction 4CD of the arbitrary vertical cantilever 4 adapted to the X direction (one of the two-dimensional directions) is set to 0 degree. .

  As in the first embodiment, the vertical cantilevers 4 of the third embodiment have the same width w, and the distance d between them is separated by a distance greater than the width w. It is preferable to arrange them at intervals.

  Next, the operation of the probe card 1C of the third embodiment will be described. Since operations and effects similar to those of the first embodiment are exhibited except for differences from the first embodiment, operations relating to differences from the first embodiment will be described mainly.

  In the probe card 1C of the second embodiment, as shown in FIGS. 17 and 18, all the rotation angles of the probe pins 3C are set to θ (= 360 / 4n) degrees and the probe pins 3C are arranged. .

  When n = 4 as in the third embodiment, the sandwiching angle of the adjacent vertical cantilever 4 is 90 degrees, so the rotation angle of the probe pin 3C is set to 22.5 (= 360 / 4n) degrees. Has been. For this reason, the vertical cantilevers 4 adjacent to each other in both the X-Y directions are arranged in parallel, so that the vertical cantilevers 4 can be prevented from contacting each other.

  From the above, also in the probe card 1C of the third embodiment, it is possible to improve the overlap rate of the probe pins 3C in both the X and Y directions. From this, the distance D between the arrangement of the probe pins 3C can be reduced.

  That is, according to the probe card 1C of the third embodiment, since the probe pin 3C overlaps without causing the vertical cantilever 4 to contact when the ball-type electrode 10 contacts, the vertical cantilever 4 is curved and deformed. Even in an easy state, there is an effect that the high density of the probe pins 3C can be realized.

  Although n = 4 is set in the third embodiment, as shown in FIG. 19 and FIG. 20, even if n = 6, n is an even number of 2 or more. Similar effects are achieved.

  Further, the present invention is not limited to the above-described embodiments and the like, and various modifications can be made as necessary.

  For example, in the above-described embodiment, the predetermined conditions related to the probe pins 3A, 3B, and 3C are determined by the orientation of the probe pins 3A, 3B, and 3C and the width w of the vertical cantilever 4, but the conditions are determined by other methods. Conditions may be determined. Specifically, as shown in FIGS. 21 and 22, the orientation of the probe pin 3D and the width w of the vertical cantilever 4 arranged in the probe card 1D of the other embodiments are the same as those in the prior art. The height h of the vertical cantilever 4 is alternately provided in both two-dimensional directions for each probe pin 3D so that the probe pins 3D overlap each other and the distance D between them is made closer. Meanwhile, the contact of the vertical cantilever 4 can be prevented.

The fragmentary top view which shows the probe card of 1st Embodiment 2-2 sectional view of FIG. The fragmentary top view which shows the state which the ball-type electrode contacted the probe pin in the probe card of 1st Embodiment 4-4 cross-sectional view of FIG. The fragmentary top view which shows the state in which the width | variety of a vertical type cantilever is narrower than the distance between those arrangement | positioning in the probe card of 1st Embodiment Schematic diagram showing deformation direction of vertical cantilever and movable region of probe pin based on FIGS. 1 is a longitudinal sectional view showing a first step in a manufacturing process of a vertical cantilever according to a first embodiment; FIG. 5 is a longitudinal sectional view showing a second step in the manufacturing process of the vertical cantilever of the first embodiment. A longitudinal section showing the 3rd process in the manufacturing process of the vertical type cantilever of a 1st embodiment. A longitudinal section showing the 4th process in the manufacturing process of the vertical type cantilever of a 1st embodiment. The fragmentary top view which shows the case where the number of vertical type cantilevers is two in the probe card of 1st Embodiment Schematic diagram showing the deformation direction of the vertical cantilever and the movable region of the probe pin in the first embodiment based on FIG. The fragmentary top view which shows the probe card of 2nd Embodiment Schematic diagram showing the deformation direction of the vertical cantilever and the movable region of the probe pin in the second embodiment based on FIG. The fragmentary top view which shows the case where the number of the vertical type cantilevers is five in the probe card of 2nd Embodiment Schematic diagram showing the deformation direction of the vertical cantilever and the movable region of the probe pin in the second embodiment based on FIG. The fragmentary top view which shows the probe card of 3rd Embodiment Schematic diagram showing the deformation direction of the vertical cantilever and the movable region of the probe pin in the third embodiment based on FIG. The fragmentary top view which shows the case where the number of the vertical type cantilevers is six in the probe card of 3rd Embodiment Schematic diagram showing the deformation direction of the vertical cantilever and the movable region of the probe pin in the third embodiment based on FIG. The fragmentary top view which shows the probe card of other embodiment Sectional view taken along the arrow 22-22 in FIG. The front view which shows the state before a ball-type electrode contacts a probe pin in an example of the conventional probe card The partial top view which shows the state after a ball-type electrode contacts the probe pin in an example of the conventional probe card Front view showing a state in which probe pins are arranged at high density in an example of a conventional probe card Front view showing a state in which probe pins are arranged at a high density so as not to contact each other in an example of a conventional probe card 27-27 arrow sectional view of FIG.

Explanation of symbols

1A, 1B, 1C Probe card 2 Wiring board 3A, 3B, 3C Probe pin 3AR Movable region of probe pin 4 Vertical cantilever 4CD Deformation direction of vertical cantilever 10 Ball type electrode

Claims (5)

It has a plurality of probe pins formed by arranging a plurality of vertical type cantilevers that come into contact with the ball-type electrode at equal intervals on the virtual circumference,
The vertical cantilever is formed so as to be deformed outward from the center of the probe pin upon contact with the ball-type electrode,
When the vertical cantilever is contact-deformed, the probe pin is in contact with another adjacent probe pin, and the contact-deformed vertical cantilever is in contact with the vertical cantilever deformed in contact with the other probe pin. The probe card is arranged so that it does not. The probe pin has n (n = 2 or even number) vertical cantilevers,
The plurality of probe pins are disposed on lattice points of a square lattice, and the deformation direction of one of the n vertical cantilevers is adapted to one of two-dimensional directions. The probe pins are arranged so that the rotation angles thereof are alternately different in both directions in the two-dimensional direction by setting the rotation angle of the probe pins to 0 degrees and setting the rotation angle of the probe pins to 0 degrees or 360 / 2n degrees. The probe card according to claim 1. The probe pin has m (m = odd greater than or equal to 3) vertical cantilevers,
The plurality of probe pins are arranged on lattice points of a square lattice, and the deformation direction of one of the m vertical cantilevers is adapted to one of two-dimensional directions. The rotation angle of the probe pin arranged in this way is set to 0 degree, and the rotation angle of the probe pin is set to 0 degree or 360/2 m degrees so that the rotation angles are alternately changed in only one direction in the two-dimensional direction. The probe card according to claim 1, wherein: The probe pin has n (n = 2 or even number) vertical cantilevers,
The plurality of probe pins are disposed on lattice points of a square lattice, and the deformation direction of one of the n vertical cantilevers is adapted to one of two-dimensional directions. 2. The probe card according to claim 1, wherein the probe pins are arranged such that a rotation angle of all the probe pins is 360 / 4n degrees with a rotation angle of the probe pins arranged as 0 degrees. The plurality of vertical cantilevers are formed to have the same width, and are arranged at equal intervals on the virtual circumference with a distance equal to or greater than the width of the vertical cantilevers. The probe card according to claim 1.

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