JP2009162682A - Probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card capable of preventing buckling of a probe pin formed by arranging vertical-type cantilevers in a circular form at equal intervals, when it is brought into contact with a ball type electrode. <P>SOLUTION: In this probe card 1A, a plurality of probe pins 3A are arranged in an array form on the surface 2a of a wiring board 2. The probe pin 3A is formed by arranging at equal intervals on a virtual circle VC, three or more vertical type cantilevers 4A to be in contact with the ball type electrode. The vertical type cantilever 4A has an inner peripheral surface 7, comprising a lower reference surface 6 on the wiring board 2 side and an upper inclined surface 5 on the ball type electrode side. In addition, the upper inclined surface 5 is tilted to the outside so that an intersection line L between the lower reference surface 6, and the upper inclined surface 5 is tilted with respect to a compression direction of the ball type electrode. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a probe card, and more particularly, to a probe card that can be suitably used when a continuity test of a BGA type IC is performed by bringing a probe pin into contact with a ball type electrode of the BGA type IC.

  In the conventional probe card 101, as an example, as shown in FIG. 10, a plurality of probe pins 103 are arranged on the surface 102a of the wiring board 102 in an array (on a lattice point of a square lattice). The probe pin 103 is formed by circularly arranging a plurality of vertical cantilevers 104 at equal intervals. Further, since the vertical cantilever 104 is curved and deformed outward from the center when the ball-shaped electrode 10 contacts the probe pin 103, the upper end surface 105 having a thin quadrangular or arc-shaped column shape is formed at 30 ° to 60 °. It is formed in a shape that is inclined outward by about °.

  When a ball-type electrode 10 of a BGA-type IC (ball grid array integrated circuit) (not shown) is pressed near the center of the probe pin 103, the vertical cantilever 104 is curved and deformed outward from the center of the probe pin 103. As a result, the probe pin 103 comes into contact so as to enclose the ball-type electrode 10, so that an IC continuity test can be performed without damaging the ball-type electrode 10.

JP-A-8-17500

  However, as shown in FIG. 11, when the thickness of the vertical cantilever 104 is reduced, a large compressive stress from the ball-type electrode 10 is concentrated on the boundary line (intersection line) L between the inclined upper end surface 105 and other surfaces. Therefore, there is a problem that the vertical cantilever 104 is buckled from the boundary line L.

  Therefore, the present invention has been made in view of these points, and it is possible to prevent a probe pin formed by arranging circular vertical cantilevers at regular intervals in a circle from buckling when contacting with a ball-type electrode. It is an object of the present invention to provide a probe card that can be used.

  In order to achieve the object described above, a probe card according to the present invention has, as a first aspect thereof, a plurality of probe pins formed by arranging three or more vertical cantilevers in contact with a ball-shaped electrode at equal intervals on a virtual circle. The vertical cantilever has an inner peripheral surface composed of a lower reference surface formed on the wiring board side and an upper inclined surface that first contacts the ball-type electrode. The upper inclined surface is formed in a shape that is inclined outward so that the line of intersection between the lower reference surface and the upper inclined surface is inclined with respect to the compression direction of the ball-type electrode.

  According to the probe card of the first aspect of the present invention, when the ball-type electrode contacts the upper inclined surface, the upper inclined surface of the vertical cantilever can be deformed in a direction orthogonal to the compression direction of the ball-type electrode. .

  The probe card according to the second aspect of the present invention is the probe card according to the first aspect, wherein the vertical cantilever is in the tangential direction of the virtual circle within the range in which the upper inclined surface is in contact with the ball-type electrode. It is characterized by being offset in the direction in which the distance from the electrode to the intersection line increases.

  According to the probe card of the second aspect of the present invention, the distance from the ball-type electrode to the intersection line can be increased.

  The probe card of the third aspect of the present invention is characterized in that in the probe card of the first or second aspect, all vertical cantilevers in any probe pin are formed in the same shape.

  According to the probe card of the third aspect of the present invention, the compressive stress of the ball-type electrode can be evenly distributed to all the vertical cantilevers.

  The probe card according to a fourth aspect of the present invention is the probe card according to any one of the first to third aspects, wherein the upper inclined surface of the vertical cantilever has a tangential direction of a virtual circle as a width direction of the vertical cantilever. Further, it is characterized in that it is formed so that its width narrows from the wiring board side toward the ball-type electrode side.

  According to the probe card of the fourth aspect of the present invention, the drag of the vertical cantilever against the ball-type electrode increases according to the deformation amount of the vertical cantilever. Can be in contact with the ball-type electrode.

  The probe card according to the fifth aspect of the present invention is the probe card according to any one of the first to fourth aspects, wherein the inner peripheral surface of the vertical cantilever is formed only by the lower reference surface and the upper inclined surface. The lower reference surface and the upper inclined surface are formed in a planar shape.

  According to the probe card of the fifth aspect of the present invention, since the probe pin can be easily formed, the manufacturing cost of the probe card can be suppressed.

  The probe card according to the sixth aspect of the present invention is the probe card according to any one of the first to fourth aspects, wherein the inner peripheral surface of the vertical cantilever is formed only by the lower reference surface and the upper inclined surface. The lower reference surface and the upper inclined surface are characterized by being formed in a continuous and curved surface.

  According to the probe card of the sixth aspect of the present invention, since the deformed portion of the vertical cantilever continuously moves, the buckling resistance of the vertical cantilever can be increased.

  According to the probe card of the present invention, since the upward inclined surface of the vertical cantilever is deformed in the direction orthogonal to the compression direction of the ball-type electrode, it is possible to prevent the probe pin from being buckled and deformed.

  Hereinafter, the probe card of the present invention will be described with reference to its three embodiments.

  First, the probe card 1A of the first embodiment will be described.

  In the probe card 1A of the first embodiment, as shown in FIG. 1, a plurality of probe pins 3A connected to wirings, vias, or other wiring members (each not shown) on the surface 2a of the wiring board 2 are provided. They are arranged in an array (on the lattice points of a square lattice). As shown in FIG. 2, each probe pin 3A is formed by arranging four (three or more) vertical cantilevers 4A formed in the same shape at equal intervals on a virtual circle VC. The diameter of the virtual circle VC is smaller than the diameter of the ball-type electrode 10.

  The shape of the vertical type cantilever 4A can be explained in a word as shown in FIG. More specifically, the vertical cantilever 4A has an inner peripheral surface 7 facing the inner side of the probe pin 3A. The inner peripheral surface 7 is composed only of the lower reference surface 6 and the upper inclined surface 5 formed in a flat shape, and the developed view thereof is rectangular.

  The lower reference surface 6 is formed on the wiring board 2 side. The upper inclined surface 5 is located above the lower reference surface 6 and is inclined with respect to the lower reference surface 6. The intersection line L between the lower reference surface 6 and the upper inclined surface 5 is the height direction of the vertical cantilever 4A, that is, the direction in which the ball electrode 10 compresses the probe pin 3A (hereinafter referred to as “compression of the ball electrode 10”). It is set to be inclined with respect to the CD. Specifically, the normal vector of the lower reference plane 6 is set parallel to the radial direction of the virtual circle VC, and the normal vector of the upper inclined plane 5 is the normal vector of the lower reference plane 6 and the virtual circle VC. The tangential direction and the direction opposite to the compression direction CD of the ball-type electrode 10 are respectively inclined to be greater than 0 degree and less than 90 degrees, preferably about 30 to 60 degrees. Thereby, the intersection line L of these surfaces is set to be inclined with respect to the compression direction CD of the ball-type electrode 10.

  As shown in FIGS. 3 and 4, the vertical cantilever 4 </ b> A has a tangential direction of the virtual circle VC and a direction SD in which the distance from the ball-shaped electrode 10 to the intersection line L increases in the compression direction CD of the ball-shaped electrode 10. It is preferable to be offset. 3 and 4, the intersection line L is set to have a leftward inclination when viewed from the center of the probe pin 3A, and the upper inclined surface 5 is inclined so that the upper right corner of the inner peripheral surface 7 opens outward. Therefore, the vertical cantilever 4A is offset in the left direction SD when viewed from the center of the probe pin 3A. However, the offset amount of the vertical cantilever 4A needs to be set within a range where the upper inclined surface 5 is in contact with the ball electrode 10.

  Next, the operation of the probe card 1A of the first embodiment will be described.

  In the probe card 1A of the first embodiment, as shown in FIGS. 5 and 6, the intersection line L between the lower reference surface 6 and the upper inclined surface 5 on the inner peripheral surface 7 of the vertical cantilever 4A is a ball type. The upper inclined surface 5 of the vertical cantilever 4A is inclined so as to be inclined with respect to the compression direction CD of the electrode 10. From this, when the ball-type electrode 10 contacts the upper inclined surface 5, the upper inclined surface 5 of the vertical cantilever 4A is inclined toward the outside of the virtual circle VC with respect to both the compression direction CD and the orthogonal direction PD. While deforming. Here, the vertical cantilever 4A does not buckle even when pressure is applied in the width direction of the vertical cantilever 4A (the direction PD perpendicular to the compression direction CD of the ball-type electrode 10). Therefore, at least the ball-type electrode 10 abuts on the intersection line L between the lower reference surface 6 and the upper inclined surface 5, and the lower reference surface 6 is deformed toward the outside in the radial direction of the probe pin 3A as in the prior art. Until the bending occurs, the buckling of the probe pin 3A can be suppressed.

  The inner peripheral surface 7 of the vertical cantilever 4A may have a surface other than the lower reference surface 6 and the upper inclined surface 5, but in the first embodiment, they are formed only by them, and the lower reference surface It is preferable that the surface 6 and the upward inclined surface 5 are formed in a planar shape. Since the probe pin 3A can be easily formed by limiting the surface existing on the inner peripheral surface 7 of the probe pin 3A, the manufacturing cost of the probe card 1A can be suppressed. Further, when a surface other than the lower reference surface 6 and the upper inclined surface 5 is formed on the inner peripheral surface 7 of the vertical cantilever 4A, it is possible to prevent buckling from occurring from the boundary line between the surface and the other surface. it can.

  Further, as shown in FIG. 7, the vertical cantilever 4A is offset in the above-described direction SD (the direction in which the dotted vertical cantilever 4 moves to the solid vertical cantilever 4) SD. When the vertical cantilever 4A is offset, the distance from the ball-shaped electrode 10 to the intersection line L increases. As described above, when the ball-type electrode 10 contacts the intersection line L between the lower reference surface 6 and the upper inclined surface 5, the probe pin 3A may be buckled. That is, by increasing the distance from the ball-type electrode 10 to the intersection line L, the amount of push-in of the ball-type electrode 10 required until the buckling deformation of the probe pin 3A occurs can be increased. Even when the amount becomes large, the buckling of the probe pin 3A can be prevented.

  Even when the distance from the ball-shaped electrode 10 to the intersection line L is increased, the inclination angle of the upper inclined surface 5 is reduced to reduce the ball-shaped electrode 10 and the upper inclined surface 5 in the compression direction CD. The distance, that is, the stroke amount of the probe pin 3 can be set in the same manner as before the offset.

  Four such vertical cantilevers 4A are arranged on the probe pin 3A. If these shapes and positions are freely set, one of the four vertical cantilevers 4A is a ball type. Since a large compressive stress is applied from the electrode 10, the probe pin 3A is buckled. Therefore, as shown in FIG. 2 or FIG. 3, these four vertical cantilevers 4A are formed in the same shape and are arranged at equal intervals on the circumference of the virtual circle VC. Thereby, the compressive stress of the ball-type electrode 10 can be evenly distributed to all the vertical cantilevers 4A.

  Next, a probe card 1B of the second embodiment will be described.

  In the probe card 1B of the second embodiment, a plurality of probe pins 3B connected to wirings, vias, or other wiring members (each not shown) on the surface 2a of the wiring board 2 as in the first embodiment. Are arranged in an array (on the lattice points of a square lattice). As shown in FIG. 8, each probe pin 3B is formed by arranging four (three or more) vertical cantilevers 4B formed in the same shape at equal intervals on a virtual circle VC. As shown in FIG. 8, the difference between the first embodiment and the second embodiment is the shape of the vertical cantilever 4B.

  The inner peripheral surface 7 of the vertical cantilever 4B is formed by only the lower reference surface 6 and the upper inclined surface 5 as in the first embodiment. However, unlike the first embodiment, the lower reference surface 6 and the upper inclined surface 5 are formed in a flat shape and are not separately distinguished (see FIG. 2 or FIG. 3), but are shown in FIG. As shown, the inner peripheral surface 7 is formed in a continuous and curved surface shape from the lower left corner to the upper right corner.

  Specifically, the normal vector of the lower reference plane 6 is set parallel to the radial direction of the virtual circle VC. The normal vector of the upper inclined surface 5 is greater than 0 degree and 90 degrees with respect to the normal vector of the lower reference surface 6, the tangential direction of the virtual circle VC and the direction opposite to the compression direction CD of the ball-type electrode 10. Tilt to less than a degree. Since the lower reference surface 6 and the upper inclined surface 5 are formed in a continuous and curved surface shape, the inclination angle continuously changes from an arbitrary angle to 0 degree from the upper side to the lower side of the vertical cantilever 4B. ing. Therefore, the intersection line L of these surfaces is set to be inclined with respect to the compression direction CD of the ball-type electrode 10.

  The vertical cantilever 4B is offset in the same manner as described above, and the vertical cantilever 4B is formed in the same shape as in the first embodiment.

  Next, the operation of the probe card 1B of the second embodiment will be described.

  In the probe card 1B of the second embodiment, as shown in FIG. 8, the inner peripheral surface 7 of the vertical cantilever 4B is formed only by the lower reference surface 6 and the upper inclined surface 5. Similar to the first embodiment, the normal vector of the lower reference surface 6 is formed in parallel with the radial direction of the virtual circle VC (that is, the radial direction of the probe pin 3B), and the normal vector of the upper inclined surface 5 and The intersecting line L of these surfaces is set to be inclined with respect to the compression direction CD of the ball-type electrode 10. Therefore, as in the first embodiment, at least the ball-shaped electrode 10 abuts on the intersection line L between the lower reference surface 6 and the upper inclined surface 5, and the lower reference surface 6 is in the radial direction of the probe pin 3B as in the prior art. The buckling of the probe pin 3B can be suppressed until it is deformed toward the outside to cause the buckling.

  On the other hand, unlike the first embodiment, the lower reference surface 6 and the upper inclined surface 5 are formed continuously and curved. Therefore, since the upper inclined surface 5 of the vertical cantilever 4B is curved and deformed, the deformed portion can be continuously moved to the lower reference surface 6 side. Since the compressive stress received from the ball-type electrode 10 tends to be concentrated and applied to the deformed portion, the ball shape is formed over the entire upper inclined surface 5 of the vertical cantilever 4B by continuously moving the deformed portion. The compressive stress received from the electrode 10 is supported, and the buckling resistance of the vertical cantilever 4B can be increased.

  Moreover, about the point similar to 1st Embodiment, the effect | action similar to 1st Embodiment can be acquired.

  Next, a probe card 1C according to the third embodiment will be described.

  In the probe card 1C of the third embodiment, a plurality of probe pins 3C connected to wiring, vias, or other wiring members (each not shown) on the surface 2a of the wiring board 2 as in the second embodiment. Are arranged in an array (on the lattice points of a square lattice). As shown in FIG. 9, each probe pin 3C is formed by arranging four (three or more) vertical cantilevers 4C formed in the same shape at equal intervals on a virtual circle VC. As shown in FIG. 9, the difference between the second embodiment and the third embodiment is the change in the width of the vertical cantilever 4C.

  As in the second embodiment, the inner peripheral surface 7 of the vertical cantilever 4C is formed by only the lower reference surface 6 and the upper inclined surface 5, and these are continuous and curved surfaces as shown in FIG. It is formed in a shape. The setting of the inclination angle of the upper inclined surface 5 is the same as in the second embodiment.

  On the other hand, unlike the second embodiment, the inner peripheral surface of the vertical cantilever 4C is not rectangular but triangular. When the tangential direction of the virtual circle VC is the width direction of the vertical cantilever 4C, the width of the vertical cantilever 4C is narrowed from the wiring board 2 side toward the ball electrode 10 side. However, since it is not necessary to deform the lower reference surface 6 of the vertical cantilever 4C, at least only the width of the upper inclined surface 5 of the vertical cantilever 4C is narrowed from the wiring board 2 side toward the ball electrode 10 side. It only has to be done.

  The vertical cantilever 4C is offset in the same manner as described above, and the vertical cantilever 4C is formed in the same shape as in the first or second embodiment.

  Next, the operation of the probe card 1C of the third embodiment will be described.

  In the probe card 1C of the third embodiment, as in the first or second embodiment, as shown in FIG. 9, the inner peripheral surface 7 of the vertical cantilever 4C is only the lower reference surface 6 and the upper inclined surface 5. Is formed by. The normal vector of the lower reference surface 6 is formed in parallel with the radial direction of the virtual circle VC (that is, the radial direction of the probe pin 3C), and the normal vector of the upper inclined surface 5 and the intersection line L of these surfaces are It is set to be inclined with respect to the compression direction CD of the ball-type electrode 10. Therefore, as in the first or second embodiment, at least the ball-type electrode 10 contacts the intersection line L between the lower reference surface 6 and the upper inclined surface 5, and the lower reference surface 6 is in the probe pin 3C as in the conventional case. The buckling of the probe pin 3C can be suppressed until it is deformed toward the outer side in the radial direction to cause buckling.

  Further, similarly to the second embodiment, the lower reference surface 6 and the upper inclined surface 5 are formed continuously and in a curved surface shape. Therefore, since the upper inclined surface 5 of the vertical cantilever 4C is curved and deformed, the deformed portion continuously moves to the lower reference surface 6 side, and the buckling resistance of the vertical cantilever 4C can be increased.

  On the other hand, unlike the first and second embodiments, the width of the vertical cantilever 4C is narrowed from the wiring board 2 side to the ball electrode 10 side as shown in FIG. The shape of 4C is a tapered shape toward the upper end. Therefore, the vertical cantilever 4C exhibits a fishing rod effect, and the drag of the vertical cantilever 4C against the ball-type electrode 10 increases according to the deformation amount of the vertical cantilever 4C.

  The necessity of the fishing rod effect is caused by the fact that a plurality of ball-type electrodes 10 arranged in the BGA type IC are undesirably caused to have a height difference. In other words, for the ball-shaped electrode 10 that is protruded (high ball-shaped electrode 10 as the height difference), it is possible to push the probe pin 3C deeply by weakening the initial drag, but without protruding. The ball-shaped electrode 10 (the ball-shaped electrode 10 having a low height difference) can be pushed with a small stress near the upper end of the probe pin 3C. Therefore, it is possible to contact all the ball-type electrodes 10 even if a difference in height occurs in the plurality of ball-type electrodes 10 while preventing the probe pins 3C from buckling.

  Note that the same effects as in the first embodiment can be obtained with respect to the same points as in the first or second embodiment.

  That is, according to the probe cards 1A to 1C of any one of the first to third embodiments, the compressive stress applied to the probe pins 3A to 3C is reduced, so that the probe pins 3A to 3C are buckled. There is an effect that can be prevented.

  In addition, this invention is not limited to embodiment mentioned above etc., A various change is possible as needed.

  For example, in the vertical cantilevers 4A to 4B of the probe pins 3A to 3B of the first and second embodiments, the developed inner peripheral surface 7 is formed in a rectangular shape, but in other embodiments, The developed inner peripheral surface 7 may be a triangle or another shape.

The fragmentary perspective view which shows the probe card of 1st Embodiment The perspective view which shows the probe pin of 1st Embodiment The perspective view which shows the state which carried out offset arrangement | positioning of the vertical type cantilever in the probe pin of 1st Embodiment. The top view which shows the state which carried out offset arrangement | positioning of the vertical type cantilever in the probe pin of 1st Embodiment The front view which shows the state before a ball-type electrode contacts in the probe pin of 1st Embodiment The front view which shows the state which the ball-type electrode contacted in the probe pin of 1st Embodiment Sectional view taken along arrow 7-7 in FIG. The perspective view which shows the probe pin of 2nd Embodiment The perspective view which shows the probe pin of 3rd Embodiment A longitudinal sectional view showing a state in which a ball-type electrode is in contact with a probe pin in a conventional probe card Longitudinal sectional view showing the probe pin buckled in the conventional probe card

Explanation of symbols

1A, 1B, 1C Probe card 2 Wiring board 3A, 3B, 3C Probe pin 4A, 4B, 4C Vertical cantilever 5 Upper inclined surface 6 Lower reference surface 7 Inner circumferential surface L Intersection line VC Virtual circle

Claims (6)

Provided on the surface of the wiring board with a plurality of probe pins formed by arranging three or more vertical cantilevers in contact with the ball-shaped electrode at equal intervals on a virtual circle,
The vertical cantilever has an inner peripheral surface composed of a lower reference surface formed on the wiring board side and an upper inclined surface that first contacts the ball-type electrode, and the lower reference surface and the A probe card characterized in that the upper inclined surface is inclined outward so that the line of intersection with the upper inclined surface is inclined with respect to the compression direction of the ball-type electrode. The vertical cantilever is offset in the tangential direction of the virtual circle and the distance from the ball-shaped electrode to the intersection line is increased within a range in which the upper inclined surface is in contact with the ball-shaped electrode. The probe card according to claim 1, wherein: 3. The probe card according to claim 1, wherein all the vertical cantilevers in any of the probe pins are formed in the same shape. The upper inclined surface of the vertical cantilever is formed such that the tangential direction of the virtual circle is the width direction of the vertical cantilever, and the width thereof decreases from the wiring board side toward the ball electrode side. The probe card according to any one of claims 1 to 3, wherein: The inner peripheral surface of the vertical cantilever is formed only by the lower reference surface and the upper inclined surface,
The probe card according to any one of claims 1 to 4, wherein the lower reference surface and the upper inclined surface are formed in a flat shape. The inner peripheral surface of the vertical cantilever is formed only by the lower reference surface and the upper inclined surface,
The probe card according to any one of claims 1 to 4, wherein the lower reference surface and the upper inclined surface are formed in a continuous and curved surface shape.

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