JP2010525544A - ビアホール用導電性組成物 - Google Patents

ビアホール用導電性組成物 Download PDF

Info

Publication number: JP2010525544A
Authority: JP; Japan
Prior art keywords: conductive; composition; conductive composition; composition according; metal
Prior art date: 2007-04-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Ceased

Application number

JP2010506150A

Other languages

English (en)

Japanese (ja)

Inventor

明稲葉

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

EIDP Inc

Original Assignee

EI Du Pont de Nemours and Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-04-26

Filing date

2007-04-26

Publication date

2010-07-22

2007-04-26 Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co

2010-07-22 Publication of JP2010525544A publication Critical patent/JP2010525544A/ja

Status Ceased legal-status Critical Current

Links

239000000203 mixture Substances 0.000 title claims abstract description 120
229910052751 metal Inorganic materials 0.000 claims abstract description 65
239000002184 metal Substances 0.000 claims abstract description 65
239000012530 fluid Substances 0.000 claims abstract description 17
229920003023 plastic Polymers 0.000 claims abstract description 14
239000000758 substrate Substances 0.000 claims description 34
238000010304 firing Methods 0.000 claims description 30
238000000034 method Methods 0.000 claims description 24
239000000843 powder Substances 0.000 claims description 22
239000011521 glass Substances 0.000 claims description 16
238000004519 manufacturing process Methods 0.000 claims description 14
229910052809 inorganic oxide Inorganic materials 0.000 claims description 13
239000002245 particle Substances 0.000 claims description 11
229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 9
239000011347 resin Substances 0.000 claims description 9
229920005989 resin Polymers 0.000 claims description 9
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 7
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
239000002131 composite material Substances 0.000 claims description 7
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 7
229910052709 silver Inorganic materials 0.000 claims description 7
239000004332 silver Substances 0.000 claims description 7
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
229910004298 SiO 2 Inorganic materials 0.000 claims description 6
239000010949 copper Substances 0.000 claims description 4
239000010931 gold Substances 0.000 claims description 4
229910052763 palladium Inorganic materials 0.000 claims description 4
229910052697 platinum Inorganic materials 0.000 claims description 4
VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 3
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
239000000956 alloy Substances 0.000 claims description 3
229910045601 alloy Inorganic materials 0.000 claims description 3
229910052782 aluminium Inorganic materials 0.000 claims description 3
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
239000011230 binding agent Substances 0.000 claims description 3
229910052802 copper Inorganic materials 0.000 claims description 3
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
229910052737 gold Inorganic materials 0.000 claims description 3
229910052759 nickel Inorganic materials 0.000 claims description 3
239000003960 organic solvent Substances 0.000 claims description 3
229920000178 Acrylic resin Polymers 0.000 claims description 2
239000004925 Acrylic resin Substances 0.000 claims description 2
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
239000001856 Ethyl cellulose Substances 0.000 claims description 2
ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 2
229910010413 TiO 2 Inorganic materials 0.000 claims description 2
GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 claims description 2
WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 2
SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 2
150000002148 esters Chemical class 0.000 claims description 2
229920001249 ethyl cellulose Polymers 0.000 claims description 2
235000019325 ethyl cellulose Nutrition 0.000 claims description 2
CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
VASIZKWUTCETSD-UHFFFAOYSA-N manganese(II) oxide Inorganic materials [Mn]=O VASIZKWUTCETSD-UHFFFAOYSA-N 0.000 claims description 2
229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 2
229940116411 terpineol Drugs 0.000 claims description 2
239000010410 layer Substances 0.000 description 23
239000000919 ceramic Substances 0.000 description 21
238000007639 printing Methods 0.000 description 18
239000000463 material Substances 0.000 description 8
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
238000001035 drying Methods 0.000 description 5
239000011800 void material Substances 0.000 description 5
230000015572 biosynthetic process Effects 0.000 description 4
239000004020 conductor Substances 0.000 description 4
230000000694 effects Effects 0.000 description 4
230000000052 comparative effect Effects 0.000 description 3
238000011156 evaluation Methods 0.000 description 3
238000003475 lamination Methods 0.000 description 3
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
230000001590 oxidative effect Effects 0.000 description 2
238000003825 pressing Methods 0.000 description 2
238000005488 sandblasting Methods 0.000 description 2
238000005245 sintering Methods 0.000 description 2
239000007787 solid Substances 0.000 description 2
230000007847 structural defect Effects 0.000 description 2
CONKBQPVFMXDOV-QHCPKHFHSA-N 6-[(5S)-5-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-2-oxo-1,3-oxazolidin-3-yl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C[C@H]1CN(C(O1)=O)C1=CC2=C(NC(O2)=O)C=C1 CONKBQPVFMXDOV-QHCPKHFHSA-N 0.000 description 1
RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
229910052581 Si3N4 Inorganic materials 0.000 description 1
230000002411 adverse Effects 0.000 description 1
238000005422 blasting Methods 0.000 description 1
229910052791 calcium Inorganic materials 0.000 description 1
230000001413 cellular effect Effects 0.000 description 1
239000001913 cellulose Substances 0.000 description 1
229920002678 cellulose Polymers 0.000 description 1
229910010293 ceramic material Inorganic materials 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
229910052878 cordierite Inorganic materials 0.000 description 1
230000007547 defect Effects 0.000 description 1
230000032798 delamination Effects 0.000 description 1
230000001627 detrimental effect Effects 0.000 description 1
238000009792 diffusion process Methods 0.000 description 1
JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
229910001873 dinitrogen Inorganic materials 0.000 description 1
238000007606 doctor blade method Methods 0.000 description 1
238000005553 drilling Methods 0.000 description 1
238000010894 electron beam technology Methods 0.000 description 1
238000000635 electron micrograph Methods 0.000 description 1
230000001747 exhibiting effect Effects 0.000 description 1
239000000945 filler Substances 0.000 description 1
230000009969 flowable effect Effects 0.000 description 1
238000007731 hot pressing Methods 0.000 description 1
239000011229 interlayer Substances 0.000 description 1
238000004898 kneading Methods 0.000 description 1
238000010030 laminating Methods 0.000 description 1
229910052748 manganese Inorganic materials 0.000 description 1
239000011572 manganese Substances 0.000 description 1
238000001000 micrograph Methods 0.000 description 1
238000002156 mixing Methods 0.000 description 1
229910000510 noble metal Inorganic materials 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
238000012856 packing Methods 0.000 description 1
229910052703 rhodium Inorganic materials 0.000 description 1
239000010948 rhodium Substances 0.000 description 1
238000007650 screen-printing Methods 0.000 description 1
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
229910010271 silicon carbide Inorganic materials 0.000 description 1
239000000377 silicon dioxide Substances 0.000 description 1
HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
239000002356 single layer Substances 0.000 description 1
239000002002 slurry Substances 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
229910052719 titanium Inorganic materials 0.000 description 1
239000010936 titanium Substances 0.000 description 1
KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
239000011345 viscous material Substances 0.000 description 1
229910052726 zirconium Inorganic materials 0.000 description 1
229910001928 zirconium oxide Inorganic materials 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemical & Material Sciences (AREA)
Dispersion Chemistry (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
Inorganic Chemistry (AREA)
Conductive Materials (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Parts Printed On Printed Circuit Boards (AREA)

JP2010506150A 2007-04-26 2007-04-26 ビアホール用導電性組成物 Ceased JP2010525544A (ja)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/US2007/010030 WO2008133612A1 (en)	2007-04-26	2007-04-26	Electrically conductive composition for via-holes

Publications (1)

Publication Number	Publication Date
JP2010525544A true JP2010525544A (ja)	2010-07-22

Family

ID=38858889

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2010506150A Ceased JP2010525544A (ja)	2007-04-26	2007-04-26	ビアホール用導電性組成物

Country Status (5)

Country	Link
EP (1)	EP2140743A1 (zh)
JP (1)	JP2010525544A (zh)
KR (1)	KR20100005143A (zh)
CN (1)	CN101663924B (zh)
WO (1)	WO2008133612A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2012033876A (ja) *	2010-07-30	2012-02-16	Samsung Electro-Mechanics Co Ltd	印刷回路基板の製造方法
US8715849B2 (en)	2007-10-05	2014-05-06	Toray Battery Separator Film Co., Ltd.	Microporous polymer membrane
WO2019235132A1 (ja) *	2018-06-06	2019-12-12	日東電工株式会社	配線回路基板およびその製造方法
JP2020025045A (ja) *	2018-08-08	2020-02-13	日本特殊陶業株式会社	導電ペースト、配線基板、導電ペーストの製造方法、および、配線基板の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20120071921A (ko) *	2010-12-23	2012-07-03	한국전자통신연구원	실리콘 관통 홀(ｔｓｖ) 충진용 조성물, ｔｓｖ 충진방법 및 상기 조성물을 이용하여 형성된 ｔｓｖ 충진물을 포함하는 기판
CN107180665A (zh) *	2016-03-11	2017-09-19	上海卡翱投资管理合伙企业（有限合伙）	应用于低温共烧陶瓷的灌孔过渡金铂银孔浆及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH03148195A (ja) *	1989-10-25	1991-06-24	Du Pont Japan Ltd	多層回路板の製造方法
JP2005109009A (ja) *	2003-09-29	2005-04-21	Matsushita Electric Ind Co Ltd	ペースト充填方法、ペースト充填装置
JP2006344938A (ja) *	2005-04-25	2006-12-21	E I Du Pont De Nemours & Co	厚膜導体組成物ならびにｌｔｃｃ回路およびデバイスにおけるその使用

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE68912932T2 (de) *	1989-05-12	1994-08-11	Ibm Deutschland	Glas-Keramik-Gegenstand und Verfahren zu dessen Herstellung.

2007
- 2007-04-26 KR KR1020097024531A patent/KR20100005143A/ko not_active Application Discontinuation
- 2007-04-26 WO PCT/US2007/010030 patent/WO2008133612A1/en active Application Filing
- 2007-04-26 JP JP2010506150A patent/JP2010525544A/ja not_active Ceased
- 2007-04-26 EP EP07776181A patent/EP2140743A1/en not_active Withdrawn
- 2007-04-26 CN CN2007800525775A patent/CN101663924B/zh not_active Expired - Fee Related

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH03148195A (ja) *	1989-10-25	1991-06-24	Du Pont Japan Ltd	多層回路板の製造方法
JP2005109009A (ja) *	2003-09-29	2005-04-21	Matsushita Electric Ind Co Ltd	ペースト充填方法、ペースト充填装置
JP2006344938A (ja) *	2005-04-25	2006-12-21	E I Du Pont De Nemours & Co	厚膜導体組成物ならびにｌｔｃｃ回路およびデバイスにおけるその使用

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8715849B2 (en)	2007-10-05	2014-05-06	Toray Battery Separator Film Co., Ltd.	Microporous polymer membrane
JP2012033876A (ja) *	2010-07-30	2012-02-16	Samsung Electro-Mechanics Co Ltd	印刷回路基板の製造方法
WO2019235132A1 (ja) *	2018-06-06	2019-12-12	日東電工株式会社	配線回路基板およびその製造方法
JP2019212791A (ja) *	2018-06-06	2019-12-12	日東電工株式会社	配線回路基板およびその製造方法
CN112237052A (zh) *	2018-06-06	2021-01-15	日东电工株式会社	布线电路基板及其制造方法
JP7262183B2 (ja)	2018-06-06	2023-04-21	日東電工株式会社	配線回路基板およびその製造方法
JP2020025045A (ja) *	2018-08-08	2020-02-13	日本特殊陶業株式会社	導電ペースト、配線基板、導電ペーストの製造方法、および、配線基板の製造方法
JP7221609B2 (ja)	2018-08-08	2023-02-14	日本特殊陶業株式会社	導電ペーストの製造方法

Also Published As

Publication number	Publication date
WO2008133612A1 (en)	2008-11-06
CN101663924B (zh)	2012-03-28
EP2140743A1 (en)	2010-01-06
CN101663924A (zh)	2010-03-03
KR20100005143A (ko)	2010-01-13

Publication	Publication Date	Title
US7736544B2 (en)	2010-06-15	Electrically conductive composition for via-holes
JP4507012B2 (ja)	2010-07-21	多層セラミック基板
JP5693940B2 (ja)	2015-04-01	セラミックスビア基板、メタライズドセラミックスビア基板、これらの製造方法
JP4557417B2 (ja)	2010-10-06	低温焼成セラミック配線基板の製造方法
JP2010525544A (ja)	2010-07-22	ビアホール用導電性組成物
KR100617436B1 (ko)	2006-08-31	Ｌｔｃｃ 테이프를 위한 후막 도체 페이스트 조성물
CN111096090B (zh)	2023-04-21	陶瓷基板的制造方法、陶瓷基板以及模块
JP5922739B2 (ja)	2016-05-24	セラミックスビア基板、メタライズドセラミックスビア基板、これらの製造方法
JP5409117B2 (ja)	2014-02-05	セラミックグリーンシートおよびセラミック多層基板の製造方法
JP3652196B2 (ja)	2005-05-25	セラミック配線基板の製造方法
JP2008204980A (ja)	2008-09-04	多層セラミック基板とその製造方法
JPH06100377A (ja)	1994-04-12	多層セラミック基板の製造方法
JP2002193691A (ja)	2002-07-10	低誘電率セラミック焼結体及びその製造方法、並びにそれを用いた配線基板
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