JP2010251785A - Side-emission type light emitting diode package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easily-manufacturable side-emission type LED package, and an assembly. <P>SOLUTION: This LED package includes: an LED chip; a lower structure including a lower mirror extended upward to the outside around the LED chip to reflect light generated from the LED chip upward while supporting the LED chip, and a transparent sealing body formed around the LED chip inside the lower mirror; and an upper structure combined with the upper part of the lower structure to reflect the light reflected upward by the lower structure in a radial lateral direction. As described above, the lower structure for reflecting the light of the LED chip upward and the upper structure for further laterally reflecting the reflected light are separately formed and combined with each other, whereby moldability of the sealing body is improved, and workability thereof can be improved. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a side emission type light emitting diode package and an assembly. More specifically, the lower structure for reflecting the light of the LED chip upward and the upper structure for reflecting the light further to the side are configured separately. The present invention relates to a side emission type LED package and an assembly which can improve the workability by improving the moldability of a sealed body by bonding.

  As the electronic equipment industry develops, a liquid crystal display (LCD) attracts attention as a next-generation display device. Since the LCD does not emit light spontaneously, it usually includes a backlight module that emits light on the back surface of the LCD panel.

  FIG. 1 shows an LED lens disclosed in US Pat. No. 6,679,621 as an example of a prior art side-emitting light emitting diode (LED) lens used in an LCD backlight module. It is sectional drawing.

  Referring to FIG. 1, the LED lens 10 disclosed in the above document is divided into a reflective surface 1, an upper portion having a refractive surface H, and a lower portion having a refractive surface 156. When viewed three-dimensionally, it has a symmetrical shape with the optical axis 43 as the center.

  In this LED lens, the light emitted from the focal point F is reflected to the reflecting surface 1 and emitted to the outside through the refracting surface H or directly to the outside through the refracting surface 156.

  However, the conventional LED lens 10 has the following problems.

  First, the LED lens 10 is difficult to mold. That is, it is difficult to precisely form the connecting point L connecting the refracting surface H and the lower refracting surface 156 and the internal cusp P where the reflecting surfaces 1 are gathered through molding. 10 Lines can occur on the surface.

  Further, when filling the resin into the cavity C that accommodates the LED chip indicated by the focus F, an additional work for preventing bubbles is required. That is, the LED chip is mounted on a substrate (not shown), the substrate is coupled with the LED lens 10 so that the LED chip is positioned in the space C of the LED lens 10, and then a transparent resin is injected into the cavity C. However, if this is done, the cavity C may not be completely filled with resin, and bubbles may be generated. Therefore, not only an additional work such as removing air bubbles through the air discharge port is necessary, but there is always a possibility that air bubbles remain and the optical characteristics of the LED package are deteriorated despite such additional work.

  The present invention has been devised to solve the above-mentioned problems of the prior art. The object of the present invention is to provide a lower structure that reflects the light of the LED chip upward and an upper structure that reflects this light further to the side. It is intended to provide a side emission type LED package and an assembly which can be manufactured easily by improving the moldability of the sealed body by constituting them separately and interconnecting them.

  In order to achieve the above-mentioned object of the present invention, the present invention is extended outwardly around the LED chip so as to reflect the LED chip and the light generated from the LED chip upward while supporting the LED chip. A lower structure including a lower mirror and a transparent sealing body formed around the LED chip inside the lower mirror, and an upper portion of the lower structure so as to reflect light reflected upward by the lower structure to a radial side. An LED package including a bonded superstructure is provided.

  In the LED package, the upper structure has a reflection part having a reflection surface inclined with respect to an axis so as to reflect the light reflected by the lower structure to the side, and an upper part of the lower structure to support the reflection part. A combined support portion is provided.

  In the LED package, the upper structure is a transparent member having a reflecting surface inclined with respect to an axis so as to reflect light arriving from below to the side, and an emitting surface for emitting light reflected by the reflecting surface to the outside. It is characterized by being.

  In addition, the present invention provides an LED chip, a lower mirror extending upwardly around the LED chip so as to reflect light generated from the LED chip while supporting the LED chip, and the above-mentioned in the lower mirror. A lower structure having a transparent sealing body filled around the LED chip, a reflecting portion having a reflecting surface inclined with respect to an axis so as to reflect light reflected by the lower structure radially, and the reflecting portion are supported. An LED package including an upper structure having a plurality of pins coupled to an upper portion of the transparent sealing body is provided.

  The present invention also provides an LED chip, a lower mirror extending upwardly around the LED chip so as to reflect light generated from the LED chip while supporting the LED chip, and the above in the lower mirror. A lower structure having a transparent sealing body filled around the LED chip and a holder formed on the outer periphery of the lower mirror, and a reflective surface inclined with respect to the axis so as to reflect light reflected by the lower structure radially outward And a superstructure having a plurality of pins coupled to the holder to support the reflector and the reflector.

  Further, the present invention provides an LED chip, a lower mirror extending upwardly around the LED chip so as to reflect light generated from the LED chip while supporting the LED chip, and the inner side of the lower mirror. The lower structure having a transparent sealing body filled around the LED chip, and the upper structure is reflected by the reflection surface inclined with respect to the axis and the reflection surface so that the light reflected by the lower structure is reflected radially. And a transparent upper structure in which a bottom surface is coupled to the top surface of the resin.

  The present invention also provides an LED chip, a lower mirror extending upwardly around the LED chip so as to reflect the light generated from the LED chip upward while supporting the LED chip, and the lower mirror in the lower mirror. A lower structure having an upper hemispherical transparent sealing body formed around the LED chip, a reflection surface inclined with respect to an axis so as to reflect light reflected by the lower structure radially, and reflected by the reflection surface And a transparent upper structure coupled to the upper edge of the lower structure.

  In the LED package, the upper structure is made of a metal or a high reflectivity polymer.

  In the LED package, the lower mirror is made of a metal or a high reflectance polymer.

  In order to achieve the object of the present invention, the present invention provides an LED chip, a lower structure configured to emit light generated from the LED chip upward while sealing the LED chip, and the lower structure is inexpensive. An LED assembly comprising: a substrate mounted; and an upper structure supported by the substrate to reflect light emitted upward by the lower structure from an upper portion of the lower structure to a radial side. To do.

  In the LED assembly, the upper structure is coupled to the substrate so as to support the reflecting portion having a reflecting surface inclined with respect to an axis so as to reflect the light reflected by the lower structure to the side. And a support portion.

  In this case, the support part is a plurality of pins coupled to the substrate. The pins may be fixed to the substrate by at least one of pinching, bonding, and soldering. Meanwhile, the LED assembly may further include as many holders as the pins combined with the substrate to receive the pins.

  In the LED assembly, the upper structure is disposed at a predetermined interval from the lower structure.

  In the LED assembly, the superstructure is made of a metal or a high reflectance projectile.

  In the LED assembly, the lower structure supports the LED chip and reflects the light from the LED chip upward so as to reflect the LED chip upward, and the lower mirror inside the lower mirror extends upward. A transparent sealing body formed around the LED chip is provided.

  In the LED assembly, the lower structure includes a mounting part that supports the LED chip and a transparent sealing part that seals the LED chip on the mounting part.

  In the LED assembly, the substrate is a reflector of a backlight device on which the LED assembly is mounted.

  In order to achieve the object of the present invention, the present invention provides an LED chip, a lower structure configured to emit light generated from the LED chip upward while sealing the LED chip, and the lower structure is inexpensive. A substrate mounted thereon, a transparent plate disposed on the substrate at a predetermined distance from the lower structure, and the transparent plate configured to reflect light emitted upward by the lower structure to a radial side. An LED assembly including an upper structure provided on a bottom surface is provided.

  In the LED assembly, the upper structure has a reflective surface inclined with respect to an axis so as to reflect the light reflected by the lower structure to the side, and a flat upper surface disposed on the bottom surface of the transparent plate. And

  In this case, the upper structure may be bonded to the bottom surface of the transparent plate. Alternatively, the upper structure may be injection molded on the bottom surface of the transparent plate. On the other hand, the upper structure is formed of a high reflectivity projectile or metal.

  In the LED assembly, the upper structure is spaced from the lower structure.

  In the LED assembly, the lower structure supports the LED chip and reflects the light from the LED chip upward so as to reflect the LED chip upward, and the lower mirror inside the lower mirror extends upward. A transparent sealing body formed around the LED chip is provided.

  In the LED assembly, the lower structure includes a mounting part that supports the LED chip and a transparent sealing part that seals the LED chip on the mounting part.

  In the LED assembly, the substrate and the transparent plate are a reflector and a transparent plate of a backlight device on which the LED assembly is mounted.

  According to the present invention, the side-emitting LED package and the LED assembly include a lower structure that reflects the light of the LED chip upward and an upper structure that reflects the light further to the side separately and combined to form a sealed body. It is possible to improve the workability by improving the moldability.

It is sectional drawing of the LED lens of a prior art. 1 is an exploded perspective view of an LED package according to a first embodiment of the present invention. FIG. 3 is a perspective view illustrating a combined state of the LED package illustrated in FIG. 2. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. It is sectional drawing corresponding to FIG. 4 which employ | adopted the submount. FIG. 3 is a schematic cross-sectional view illustrating an operation of the LED package illustrated in FIG. 2. FIG. 6 is an exploded perspective view of an LED package according to a second embodiment of the present invention. FIG. 5 is a cross-sectional view of an LED package according to a third embodiment of the present invention. FIG. 8 is a cross-sectional view illustrating a combined state of the LED package illustrated in FIG. 7. FIG. 8 is a schematic cross-sectional view illustrating an operation of the LED package illustrated in FIG. 7. FIG. 6 is a cross-sectional view of an LED package according to a fourth embodiment of the present invention. FIG. 11 is a schematic cross-sectional view illustrating an operation of the LED package illustrated in FIG. 10. FIG. 7 is a perspective view of an LED assembly according to a fifth embodiment of the present invention. FIG. 13 is a front view of the LED assembly illustrated in FIG. 12. FIG. 13 is a cross-sectional view of one of the LED assemblies illustrated in FIG. 12. FIG. 13 is a schematic cross-sectional view illustrating the operation of the LED assembly illustrated in FIG. 12. FIG. 3 is a cross-sectional view illustrating various coupling configurations between pins and a substrate of an LED assembly. FIG. 3 is a cross-sectional view illustrating various coupling configurations between pins and a substrate of an LED assembly. FIG. 3 is a cross-sectional view illustrating various coupling configurations between pins and a substrate of an LED assembly. FIG. 3 is a cross-sectional view illustrating various coupling configurations between pins and a substrate of an LED assembly. It is a perspective view of the modification of the LED assembly by 5th Example. FIG. 10 is a front view of an LED assembly according to a sixth embodiment of the present invention. FIG. 22 is a schematic cross-sectional view illustrating an operation of the LED assembly illustrated in FIG. 21. It is a front view of the modification of the LED assembly by 6th Example of this invention. FIG. 24 is a schematic cross-sectional view illustrating the operation of the LED assembly illustrated in FIG. 23. FIG. 10 is a perspective view of an LED assembly according to a seventh embodiment of the present invention. FIG. 24 is a front view of the LED assembly illustrated in FIG. 23. FIG. 26 is a schematic cross-sectional view illustrating an operation of the LED assembly illustrated in FIG. 25.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  First, an LED package according to a first embodiment of the present invention will be described with reference to FIGS. In these drawings, FIG. 2 is an exploded perspective view of the LED package according to the first embodiment of the present invention, FIG. 3 is a perspective view of the LED package according to the first embodiment of the present invention, and FIG. FIG. 5 is a schematic cross-sectional view for explaining the operation of the LED package according to the first embodiment of the present invention.

  2 to 4, an LED package 100 according to the present invention includes an LED chip 102, a lower structure 110 that supports the LED chip 102 and reflects light generated from the LED chip 102 upward, and the lower structure 110. It includes an upper structure 130 coupled to the upper portion of the lower structure 110 to reflect the light reflected upwardly radially.

  The lower structure 110 includes a main body 112 and a mounting portion 116 that is a bottom surface that supports the LED chip 102 inside the main body 112. The lower structure main body 112 is formed with a hollow C recessed inside and a lower mirror 114 is formed on the surface thereof. A mounting portion 116 is disposed at the bottom of the cavity C to support the LED chip 102, and a sealing body 120 is filled around the LED chip 102 to seal the LED chip 102 from the outside.

  The lower mirror 114 extends upward outward around the LED chip 102, and is configured to reflect the light L generated from the LED chip 102 upward as shown in FIG. The lower mirror 114 is formed by connecting a plurality of surfaces as illustrated. Unlike this, the light L generated from the LED chip 102 may be formed on one or more curved surfaces formed so as to reflect the light L upward to the upper structure 130 side.

  The lower structure main body 112 can be processed by casting, cutting, molding or the like, and can be manufactured integrally with the lower mirror 114 from a metal or a polymer. In this case, the lower structure main body 112 and the lower mirror 114 are formed of a high reflectivity metal or a high reflectivity polymer.

  Examples of high reflectivity polymers include Otsuka Chemical Co. , Ltd., Ltd. Product names NM114WA and NM04WA. Since these materials exhibit high reflectivity even at a high temperature of about 180 ° C., they are suitable as materials for the lower structure body 112 and / or the lower mirror 114 of the present invention. Specifically, the NM114WA maintains a reflectance of 88.0% for the initial wavelength of 470 nm and 78.0% after 2 hours. NM04WA maintains the reflectance of 89.0% for the initial wavelength of 470 nm and 89.0% after 2 hours.

  Alternatively, the lower structure body 112 may be formed of a low reflectivity polymer or metal, and the lower mirror 114 may be formed of a film form of a high reflectivity material. The film can be implemented with a high reflectivity metal or the high reflectivity polymer.

  The mounting portion 116 is flat and the LED chip 102 is mounted thereon. Of course, as shown in FIG. 4 a, the submount 106 may be mounted on the mounting portion 116 with the LED chip 102 attached to the submount 106.

  The sealing body 120 is preferably made of a transparent resin, and is selected to have a thermal expansion coefficient and a refractive index similar to those of the LED chip 102. In particular, silicon has very little change due to short-wavelength light such as yellowing, and has a high refractive index, so that it has not only excellent optical properties but also a zel or elastic body after curing. In order to maintain the state, it is possible to stably protect the LED chip 102 from impact and vibration.

  The superstructure 130 includes a funnel-shaped superstructure body 132 and three pins 136 (only two of them are shown) coupled to the top of the seal 120 to support the superstructure 130, and has an overall tripod configuration. . An upper mirror 134 is formed on the lower surface of the upper structure body 132. The upper mirror 134 may have various configurations such as a conical shape and a slightly bulging conical shape in addition to the funnel shape as illustrated.

  The upper mirror 134 is configured to further reflect the light L generated from the LED chip 102 and reflected upward by the lower mirror 114 to the side. Further, the light L1 that reaches the upper part directly from the LED chip 102 is reflected to the side.

  On the other hand, the upper mirror 134 is arranged such that its axis A including the apex P is aligned with the focal point F of the LED chip 102. Here, the focal point F refers to a point located at the center of the LED chip 106 which is a light emitting source.

  At this time, the upper structure main body 132 can be formed by casting, cutting, molding, or the like, and can be manufactured integrally with the upper mirror 134 from a metal or a polymer. In this case, the upper structure body 132 and the upper mirror 134 are formed of a high reflectivity metal or a high reflectivity polymer.

  Alternatively, the lower structure body 112 may be formed of a low reflectivity polymer or metal, and the lower mirror 114 may be formed of a film form of a high reflectivity material. The film can be implemented with a high reflectivity metal or a high reflectivity polymer as described above. Moreover, there exists a thing containing TiO2 as an injection material with an excellent reflectance.

  The pin 136 is bonded or inserted into the sealing body 120 to couple the upper structure 130 to the lower structure 110 and has a diameter that does not affect the light L reflected to the side by the upper mirror 134, preferably 0.4 mm or less. Consists of diameter.

  The manufacturing process of the LED package 100 of the present invention will be briefly described. First, after manufacturing the lower structure 110 and mounting the LED chip 102 on the mounting portion 116, a transparent resin is injected to form the sealing body 120. Thereafter, the upper structure 130 is coupled to the sealing body 120 to complete the LED package 100.

  At this time, although not shown, it is preferable that the pin 136 is inserted into the sealing body 120 at a predetermined depth before the sealing body 120 is completely cured. In this way, the hardened seal 120 is firmly bonded to the pins 136 so that the upper structure 130 is naturally coupled to the lower structure 110.

  In this way, since the sealing body 120 can be formed by injecting transparent resin from above into the cavity C of the lower structure 110 to which the LED chip 102 is mounted, the forming operation of the sealing body 120 is facilitated. Furthermore, even if bubbles are generated in the resin of the sealing body 120, the disadvantage of the prior art in which bubbles are generated because they are left during the cooling process is improved.

  FIG. 6 is an exploded perspective view showing a modification of the LED package according to the second embodiment of the present invention. As shown in FIG. 6, the LED package 200 is the same as that of the first embodiment except that the holder 218 is formed on the outer periphery of the lower structure body 212 and the pins 236 of the upper structure 230 are formed corresponding to these holders 218. The LED package 100 is substantially the same. Accordingly, the corresponding components in the 200s are assigned the same reference numerals, and descriptions thereof are omitted.

  As described above, when the holder 218 for receiving the pin 236 is formed in the lower structure 210 and the upper structure 230 is coupled to the lower structure 210, the pin 236 is inserted into the holder 218, so that the coupling operation becomes easier and the manufacturing process becomes easier. Become.

  7 is an exploded cross-sectional view of an LED package according to a third embodiment of the present invention, FIG. 8 is a cross-sectional view of the LED package of FIG. 7, and FIG. 9 is an LED package according to a second embodiment of the present invention. FIG.

  7 to 8, the LED package 300 of the present invention reflects the LED chip 302, the lower structure 310 that reflects the light generated from the LED chip 302 while supporting the LED chip 302, and the upper structure 310 to reflect the light upward. The upper structure 330 is coupled to the upper portion of the lower structure 310 to reflect the emitted light radially outward.

  The lower structure 310 includes a main body 312 and a flat mounting portion 316 that supports the LED chip 302 from the inside of the main body 312. The lower structure main body 312 is formed with a hollow C recessed inside and a lower mirror 314 is formed on the surface thereof. A sealing body 320 is filled around the LED chip 302 in the cavity C to seal the LED chip 302 from the outside.

  The lower mirror 314 is extended outwardly around the LED chip 302, and is configured to reflect light L2 generated from the LED chip 302 upward as shown in FIG. The lower mirror 314 is formed by connecting a plurality of surfaces as illustrated. Unlike this, the light L generated from the LED chip 302 may be formed of one or a plurality of curved surfaces formed so as to be able to reflect the light L upward to the upper structure 330 side.

  The lower structure main body 312 can be processed by casting, cutting, or the like, and can be manufactured integrally with the lower mirror 314 from a metal or a polymer. In contrast, the lower structure main body 312 may be formed of a polymer, and the lower mirror 314 may be formed of a metal layer.

  The lower structure main body 312 can be processed by casting, cutting, or the like, and can be manufactured integrally with the lower mirror 314 from a metal or a polymer. When the lower structure main body 312 is formed integrally with the lower mirror 314, these are preferably formed of a high reflectivity metal or a high reflectivity polymer.

  Examples of high reflectivity polymers include Otsuka Chemical Co. Ltd. product names NM114WA and NM04WA. Since these materials exhibit high reflectivity even at a high temperature of about 180 ° C., they are suitable as materials for the lower structure body 312 and / or the lower mirror 314 of the present invention. Specifically, the NM114WA maintains a reflectance of 88.0% for the initial wavelength of 470 nm and 78.0% after 2 hours. NM04WA maintains the reflectance of 89.0% for the initial wavelength of 470 nm and 89.0% after 2 hours.

  In contrast, the lower structure body 312 may be formed of a polymer or metal having a low reflectance, and the lower mirror 314 may be formed of a film form of a high reflectance material. The film can be implemented with a high reflectivity metal or a high reflectivity polymer as described above.

  The sealing body 320 is preferably made of a transparent resin and has a thermal expansion coefficient and a refractive index similar to those of the LED chip 302. In particular, silicon not only has excellent optical properties because it has very little change due to short-wavelength light, such as yellowing, and also has a high refractive index, but it also has an impact to maintain the state of the gel and elastic body after curing. In addition, the LED chip 302 can be stably protected from vibration. The cured sealing body 320 has a flat upper surface 322 and a chip housing portion 324 around the lower LED chip 302.

  The upper structure 330 is a structure in which a main body 332 is filled as an integral member obtained by molding a transparent resin. The upper portion of the main body 332 has a reflection surface 334 that reflects light L1 and L2 emitted from below to the side, and the side surface of the main body 332 emits the light L1 and L2 reflected by the reflection surface 334 to the outside. A surface 336 is formed.

  The reflective surface 334 preferably has a line-symmetric shape with respect to the axis A passing through the internal cusp P and the focal point F of the LED chip 302. Therefore, the lights L1 and L2 that strike the reflecting surface 334 are reflected radially.

  At this time, the bottom surface 338 of the upper structure 330 is formed flat and comes into surface contact with the upper surface 322 of the sealing body 320 when the upper structure 330 is coupled to the lower structure 310.

  Therefore, when the upper structure 330 is formed of a material having the same refractive index as that of the sealing body 320, the light L1 and L2 generated from the focal point F of the LED chip 302 is not refracted or reflected as shown in FIG. It is possible to enter 330.

  A manufacturing process of the LED package 300 of the present embodiment will be briefly described. First, after manufacturing the lower structure 310 and mounting the LED chip 302 on the mounting portion 316 at the bottom, a transparent resin is injected to form the sealing body 320. Thereafter, the upper structure 330 is coupled to the sealing body 320 to complete the LED package 300.

  At this time, as an example, after the upper structure 330 is previously formed separately, the bottom surface 338 of the upper structure 330 is pressed against the upper surface 322 of the sealing body 320 before the sealing body 320 is cured, and these are bonded to each other. It is possible.

  In this way, the sealing body 320 can be easily formed because the sealing body 320 can be formed by pouring transparent resin from above into the cavity C of the lower structure 310 to which the LED chip 302 is mounted. In addition, even if bubbles are generated in the resin of the sealing body 320, the defects of the prior art in which bubbles are generated because they leave during the cooling process are improved.

  FIG. 10 is an exploded cross-sectional view of an LED package according to a fourth embodiment of the present invention, and FIG. 11 is a schematic cross-sectional view illustrating an operation of the LED package shown in FIG.

  First, as illustrated in FIG. 10, the LED package 400 of the fourth embodiment has a hemispherical shape in which the sealing body 420 formed around the LED chip 402 in the hollow cavity C has a predetermined radius r. The LED package 300 is the same as the LED package 300 of the third embodiment except that a part of the upper structure 430 is maintained in a vacant state and the bottom surface of the upper structure 430 is coupled to the upper edge of the lower structure 310. Accordingly, the same reference numerals are given to the same parts, and repeated description is omitted.

  The sealing body 420 is formed in various shapes such as a hemisphere, a dome, an ellipse, a structure having a flat upper surface, for example, a structure in which only the upper surface is flat in a dome shape or a cavity C of the lower structure 410 is filled only around the LED chip 402. Where the hemispherical shape or hemispherical form includes these various shapes.

  The sealing body 420 is selected as a transparent resin having thixotropy and capable of maintaining a certain shape when discharged. Examples of preferred materials include the Dow Corning product name JCR6101up.

  Further, as an example of a discharge device for accurately discharging the resin into the cavity C, there is a product name ML-808FX of Musashi. This device is capable of precise dotting control up to about 0.03 cc.

  Next, the operation of the LED package 400 of this embodiment will be described with reference to FIG. In FIG. 11, the optical path I1 indicates the light traveling from the LED chip focal point F to the connection point P1 with the edge of the lower mirror 414, and the optical path I2 is from the LED chip focal point F to the connection point P2 between the reflection surface 434 and the emission surface 436. Show the light going. In the case of the LED package 300 of the third embodiment, all the light between the optical path I1 and the optical path I2 does not pass through the reflection surface 434 but is emitted through the direct emission surface 436.

  However, since the sealing body 420 of the present embodiment has a hemispherical shape and a space is formed in the cavity C between the sealing body 420 and the bottom surface 438 of the upper structure 430, the light L1 generated from the focal point F, Lx travels straight when released from the sealing body 420, but is refracted toward the reflecting surface 334 due to the refractive index difference between air and resin when entering the bottom surface 438 of the upper structure from the cavity C. The refracted light is reflected by the reflecting surface 334 and emitted sideways through the emitting surface 336. As a result, the directivity angle of light emitted from the side surface of the LED package 400 can be reduced. The overall light path associated therewith is denoted by L, and α is the angle between the light paths I1 and I2.

  12 is a perspective view of an LED assembly according to a fifth embodiment of the present invention, FIG. 13 is a front view of FIG. 12, FIG. 14 is a cross-sectional view of one LED assembly shown in FIG. 12, and FIG. FIG. 15 is a schematic cross-sectional view illustrating the operation of the LED assembly of FIG. 14.

  Referring to FIGS. 12 to 15, a plurality of LED assemblies 500 of the present embodiment are preferably arranged on a substrate 540 such as a reflector in a backlight device (not shown) at a predetermined interval. The Each LED assembly 500 is emitted upward by an LED chip 502, a lower structure 510 and a lower structure 510 that are configured to emit light emitted from the LED chip 502 while sealing the LED chip 502 and seated on a substrate 540. And an upper structure 530 supported by the substrate 540 to reflect light from the upper portion 510 of the lower structure to the radial side.

  The lower structure 510 has a main body 512 that accommodates the LED chip 502, and a cavity C is formed under the central portion of the main body 512. The bottom of the cavity C is flat and becomes a mounting portion for supporting the LED chip 502, and the wall surface of the cavity C around the LED chip 502 forms a lower mirror 514 that reflects light generated from the LED chip 502 upward. Meanwhile, the cavity C is filled with a transparent sealing body 520 to seal the LED chip 502 from the outside.

  The lower mirror 514 extends outwardly around the LED chip 502 and is configured to reflect the light L generated from the LED chip 502 upward as shown in FIG. The lower mirror 514 is formed by connecting a plurality of surfaces as illustrated. Unlike this, the light L generated from the LED chip 502 may be formed on one or a plurality of curved surfaces formed so as to be able to reflect the light L upward to the upper structure 530 side.

  The lower structure main body 512 can be processed by casting, cutting, molding, or the like, and can be manufactured integrally with the lower mirror 514 from a metal or a polymer. In this case, the lower structure main body 512 and the lower mirror 514 are formed of a high reflectivity metal or a high reflectivity polymer. Examples of such a high reflectivity polymer are as described in the first embodiment of the present invention.

  On the other hand, the lower structure main body 512 may be formed of a polymer or metal having a low reflectance, and the lower mirror 514 may be formed of a film form of a high reflectance material. The film can be implemented with a high reflectivity metal or a high reflectivity polymer as described above.

  The transparent sealing body 520 is preferably made of resin and has a thermal expansion coefficient and a refractive index similar to those of the LED chip 502. In particular, since silicon has very little change due to short-wavelength light such as yellowing and has a high refractive index, it not only has excellent optical characteristics, but also has impact and It is possible to stably protect the LED chip 502 from vibration.

  The upper structure 530 includes a funnel-shaped upper structure body 532 and three pins 536 coupled to the substrate 540 to support the upper structure 530 in a generally tripod form that is symmetrical about the axis A. Further, an upper mirror 534 is formed on the lower surface of the upper structure body 532. The upper mirror 514 may have various configurations such as a conical shape and a slightly swollen conical shape in addition to the funnel shape as illustrated.

  The upper mirror 534 is configured to further reflect the light L generated from the LED chip 502 and reflected by the lower mirror 514 to the upper side. Further, the light L1 that reaches the upper part directly from the LED chip 502 is reflected to the side.

  On the other hand, the upper mirror 534 is arranged such that its axis A including the apex P is aligned with the focal point F of the LED chip 502. Here, the focal point F refers to a point located at the center of the LED chip 502 which is a light emitting source.

  At this time, the upper structure main body 532 can be formed by casting, cutting, molding, or the like, and can be manufactured integrally with the upper mirror 534 from a metal or a polymer. In this case, the upper mirror 534 of the upper structure body 532 is formed of a high reflectivity metal or a high reflectivity polymer.

On the other hand, the lower structure main body 512 may be formed of a polymer or metal having a low reflectance, and the lower mirror 514 may be formed of a film form of a high reflectance material. The film may be implemented with a high reflectivity metal or the high reflectivity polymer described above. Also, there is one containing the TiO ₂ is as excellent injection product reflectivity.

  Pins 536 are coupled to the substrate 540 and support the upper structure 530 in a fixed manner. The pin 536 has a diameter that does not affect the light L reflected to the side by the upper mirror 534, and preferably has a diameter of 0.4 mm or less.

  Hereinafter, an example of the pin 536 of the upper structure 530 fixed to the substrate 540 will be described with reference to FIGS.

  First, as illustrated in FIG. 16, a recess (or hole) having a diameter corresponding to the pin 536 can be formed in the substrate 540, and the pin 536 can be inserted and fixed in the recess. Of course, forcible pinching in which the diameter of the concave portion is smaller than that of the pin 536 is also possible.

  FIG. 17 shows an example using an adhesive 542. That is, it is possible to fix the pin 536 more reliably by inserting the pin 536 after injecting the adhesive 542 into the concave portion of the substrate 540. Of course, in this case, the diameter of the recess can be finer than that of the pin 536.

  FIG. 18 shows an example in which the holder 544 is employed and the pins 536 are fixed to the substrate 540. It is also possible to place the holder 544 by inserting a hole in the substrate 540 and inserting the holder 544 into the recess of the substrate 540.

  FIG. 19 shows an example in which the pin 536 is fixed to the substrate 540 through the weld 546.

  As described above, the pins 536 can be fixed to the substrate 540 through various methods.

  FIG. 20 is a perspective view of a modification of the LED assembly shown in FIG.

  The LED assembly 500A illustrated in FIG. 20 has a single upper structure 530A disposed on the plurality of lower structures 510. This can be usefully applied when the lower structure 510 is arranged adjacent to each other. Since the other structure except for the upper structure 530A is the same as that of FIG. 12, the description thereof is omitted.

  FIG. 21 is a front view of an LED assembly according to a sixth embodiment of the present invention, and FIG. 22 is a schematic cross-sectional view illustrating the operation of the LED assembly shown in FIG. Referring to FIGS. 21 to 22, a plurality of the LED assemblies 600 of the present embodiment are preferably disposed on a substrate 640 such as a reflector in a backlight device (not shown) at a predetermined interval. The Each LED assembly 600 includes an LED chip 602, a lower structure 610 that emits light emitted from the LED chip 602 while supporting the LED chip 602, and light emitted upward by the lower structure 510. And an upper structure 530 supported on the substrate 540 to reflect radially outward.

  The lower structure 610 includes a sealing portion 612 that seals the LED chip 602 and a mounting portion 618 that is a bottom surface that supports the LED chip 602. The sealing portion 612 is made of a transparent resin such as epoxy or silicon, and has a discharge surface 614 that rises from the mounting portion 618 into an upper hemispherical shape. The mounting unit 618 includes a terminal that supplies power to the LED chip 602, a heat transfer unit (hit slug) that discharges generated heat, and the like. The mounting unit 618 may be formed of a highly reflective metal, polymer, or the like so as to form a reflective surface that reflects light generated from the LED chip 602 upward. Alternatively, the upper material may be provided on the surface of the mounting portion 618 by coating, application, or the like.

  On the other hand, since the upper structure 630 and the substrate 640 are substantially the same as the upper structure 530 and the substrate 640 of the fifth embodiment, description thereof is omitted.

  Referring to FIG. 22, the light L1 generated at the focal point F of the LED chip 602 is refracted laterally due to the refractive index difference between the sealing portion 612 and air and the curvature of the emission surface 614 while being emitted to the outside through the emission surface 614. Is done. On the other hand, the light L2 emitted upward from the emission surface 614 is reflected laterally by the reflection surface of the upper structure 630. In this way, the lights L1 and L2 generated from the LED chip 602 are all emitted in a direction substantially perpendicular to the central axis A, that is, in a direction parallel to the plane on which the LED chip 602 is mounted.

  On the other hand, the light L2 emitted upward from the emission surface 614 is illustrated as not refracted, but can be refracted to the axis A side or to the side depending on the curvature of the emission surface 614 and the like. That is, the sealing portion 612 can have various forms other than the illustrated hemisphere, such as a dome, a flat hemisphere or dome having an upper surface, and a hemisphere or dome having a recessed upper surface.

  One such modification will be described with reference to FIGS. In these drawings, FIG. 23 is a front view of a modification of the LED assembly according to the sixth embodiment of the present invention, and FIG. 24 is a schematic sectional view for explaining the operation of the LED assembly shown in FIG. .

  23 and 24, the LED assembly 600-1 of the modified example is formed by indenting a first discharge surface 614 having a sealing portion 612 rising from the mounting portion 618 into an upper hemispherical shape and an upper portion of the first discharge surface 614. The LED assembly 600 is the same as the LED assembly 600 except that the second emission surface 616 is provided. Accordingly, the corresponding constituent elements are denoted by the same reference numerals, and the description thereof is omitted.

  Referring to FIG. 24, the lights L1 and L2 generated at the focal point F of the LED chip 602 are emitted to the outside through the first and second emission surfaces 614 and 616. The light L <b> 1 is refracted laterally by the difference in refractive index between the sealing portion 612 and air and the curvature of the first emission surface 614. On the other hand, the light L2 is refracted to the axis A side by the refractive index difference between the sealing portion 612 and the air and the curvature of the second emission surface 616, and then reflected to the side by the reflection surface 634 of the upper structure 630. In this way, the lights L1 and L2 generated from the LED chip 602 are all emitted in a direction substantially perpendicular to the central axis A, that is, in a direction parallel to the plane on which the LED chip 602 is mounted.

  On the other hand, if the sealing portion 612 is configured in the form of a hemisphere or dome having a flat top surface, the light path will be an intermediate shape between FIGS. 22 and 24. It is possible to change depending on the like.

  25 is a perspective view of an LED assembly according to a seventh embodiment of the present invention, FIG. 26 is a front view of the LED assembly shown in FIG. 25, and FIG. 27 is an operation of the LED assembly shown in FIG. It is a schematic sectional drawing explaining these.

  Referring to FIGS. 25 to 27, the LED assembly 700 of the present embodiment is preferably disposed inside a backlight device (not shown). The LED assembly 700 includes an LED chip 702, a lower structure 710 configured to emit light generated from the LED chip 702 while sealing the LED chip 702, a substrate 740 on which the lower structure 710 is seated, A transparent plate 750 disposed on the upper side of the substrate 740 at a predetermined distance from the lower structure 710, and a bottom surface of the transparent plate 750 so as to reflect light emitted upward by the lower structure 710 radially outward. The superstructure 730 provided in FIG.

  Since the structure and function of the lower structure 710 are substantially the same as those of the lower structure 510 of the fifth embodiment, the corresponding structural elements are given the reference numerals in the 700s and their description is omitted.

  The upper structure 730 is disposed at a predetermined distance from the lower structure 710, and its upper surface is coupled to the bottom surface of the transparent plate 750 as a funnel shape symmetrical to the central axis A. The surface of the upper structure 730 forms an upper mirror 734. Meanwhile, the upper structure 730 may have various configurations such as a conical shape and a slightly bulging conical shape in addition to the funnel shape as illustrated.

  The superstructure 730 may be made of metal or a high reflectivity projectile, and may preferably be bonded to the bottom surface of the transparent plate 750. On the other hand, after forming the transparent plate 750, the upper structure 730 can be formed on the bottom surface of the transparent plate 750 by injection molding.

  The upper mirror 734 is configured to further reflect the light generated from the LED chip 702 and reflected by the lower mirror 714 to the side. In addition, the light directly reaching the upper part from the LED chip 702 is reflected sideways. The configuration and operation of the lower and upper mirrors 714 and 734 are substantially the same as those of the fifth embodiment described with reference to FIG.

  On the other hand, in this embodiment, the substrate 740 is preferably a reflector of the backlight device, and the transparent plate 750 is preferably a transparent plate of the backlight device. Accordingly, the LED assembly 700 of the present embodiment is implemented as an internal single unit of the backlight device.

  Also, the lower structure 710 of the present embodiment can be provided in the same form as the lower structures 610 and 610-1 of the sixth embodiment and its modifications.

  On the other hand, the upper structure 730 and the lower structure 710 are illustrated in the same number. However, as in the modified example of the fifth embodiment of FIG. 20, one upper structure 730 reflects light reflected from the plurality of lower structures 710 upward. It is also possible to install to reflect to the side.

  The above description has been made with reference to the preferred embodiments of the present invention. However, those who have ordinary knowledge in the pertinent technical field should not depart from the spirit and scope of the present invention described in the following claims. It will be understood that various modifications and changes can be made to the present invention.

102, 202, 302, 402, 502, 602, 702 LED chips 114, 214, 314, 414, 514, 714 Lower mirror 120, 220, 320, 420, 520, 720 Transparent sealing body 612 Sealing portion 618 Mounting portion 134, 234, 334, 434, 534, 634, 734 Reflecting surface 218 Holder 336, 436 Emission surface

Claims (29)

LED chip,
A transparent mirror formed around the LED chip inside the lower mirror and a lower mirror extended upwards around the LED chip so as to reflect the light generated from the LED chip upward while supporting the LED chip An LED package comprising: a lower structure having a sealing body; and an upper structure disposed on an upper portion of the lower structure to reflect light reflected upward by the lower structure to a radial side. The superstructure is
A reflecting portion having a reflecting surface inclined with respect to an axis so as to reflect the light reflected by the lower structure to the side; and a supporting portion coupled to the upper portion of the lower structure to support the reflecting portion. The LED package according to claim 1.   The LED package according to claim 2, wherein the support part is a plurality of pins coupled to the upper part of the transparent sealing body.   The LED package according to claim 2, wherein the support part includes a plurality of pins, and the lower structure includes a holder formed on an outer periphery to receive the pins.   3. The LED package according to claim 2, wherein the upper structure is made of a metal or a high reflectance emissive material.   The upper structure is a transparent member having a reflecting surface inclined with respect to an axis so as to reflect light arriving from below to the side and an emitting surface for emitting light reflected by the reflecting surface to the outside. The LED package according to claim 1.   7. The transparent sealing body according to claim 6, wherein the transparent sealing body has a flat upper surface and is formed to fill the inside of the lower mirror, and the upper structure has a bottom surface coupled to an upper surface of the transparent sealing body. LED package.   7. The LED package according to claim 6, wherein the transparent sealing body has an upper hemispherical shape so as to leave an empty space between the lower mirror around the transparent sealing body and the bottom surface of the upper structure.   9. The LED package according to claim 8, wherein the hemispherical transparent sealing body has a thixotropy.   2. The LED package according to claim 1, wherein the lower mirror is made of a metal or a high reflectivity polymer. LED chip,
A lower structure configured to emit light generated from the LED chip upward while sealing the LED chip;
A substrate on which the lower structure is seated; and an upper structure supported by the substrate to reflect light emitted upward by the lower structure from the upper part of the lower structure to a radial side. LED assembly. The superstructure is
A reflecting portion having a reflecting surface inclined with respect to a central axis so as to reflect the light reflected by the lower structure laterally; and a supporting portion coupled to the substrate to support the reflecting portion. The LED assembly according to claim 11.   The LED assembly according to claim 12, wherein the support is a plurality of pins coupled to the substrate.   14. The LED assembly according to claim 13, wherein the pin is fixed to the substrate by at least one of sandwiching, bonding and soldering.   The LED assembly of claim 13, further comprising as many holders as the pins coupled to the substrate to receive the pins.   12. The LED assembly according to claim 11, wherein the upper structure is disposed at a predetermined distance from the lower structure.   12. The LED assembly according to claim 11, wherein the superstructure is made of metal or a high reflectivity projectile.   The lower structure is formed around the LED chip on the inner side of the lower mirror and the lower mirror that is extended outwardly around the LED chip so as to reflect the light of the LED chip upward while supporting the LED chip. The LED assembly according to claim 11, further comprising a transparent sealing body.   12. The LED assembly according to claim 11, wherein the lower structure includes a mounting portion that supports the LED chip and a transparent sealing portion that seals the LED chip on the mounting portion.   12. The LED assembly according to claim 11, wherein the substrate is a reflector of a backlight device on which the LED assembly is mounted. LED chip,
A lower structure configured to emit light generated from the LED chip upward while sealing the LED chip;
A substrate on which the lower structure is attached;
A transparent plate disposed on the substrate at a predetermined distance from the lower structure, and provided on a bottom surface of the transparent plate to reflect light emitted upward by the lower structure to a radial side; An LED assembly comprising a superstructure.   The upper structure includes a reflective surface inclined with respect to a central axis so as to reflect light reflected by the lower structure to a side, and a flat upper surface disposed on a bottom surface of the transparent plate. 22. The LED assembly according to item 21.   The LED assembly according to claim 22, wherein the upper structure is bonded to a bottom surface of the transparent plate.   The LED assembly according to claim 22, wherein the upper structure is injection-molded on the bottom surface of the transparent plate.   The LED assembly according to claim 22, wherein the superstructure is made of a high-reflectance projectile or metal.   The LED assembly of claim 21, wherein the upper structure is spaced apart from the lower structure.   The lower structure is formed around the LED chip on the inner side of the lower mirror and the lower mirror that is extended outwardly around the LED chip so as to reflect the light of the LED chip upward while supporting the LED chip. The LED assembly according to claim 21, further comprising a transparent sealing body.   The LED assembly according to claim 21, wherein the lower structure includes a mounting part for supporting the LED chip and a transparent sealing part for sealing the LED chip on the mounting part.   The LED assembly according to claim 21, wherein the substrate and the transparent plate are a reflector and a transparent plate of a backlight device on which the LED assembly is mounted.

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