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JP2005026503A - Semiconductor light emitting device and its manufacturing method - Google Patents

Semiconductor light emitting device and its manufacturing method Download PDF

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Publication number
JP2005026503A
JP2005026503A JP2003190961A JP2003190961A JP2005026503A JP 2005026503 A JP2005026503 A JP 2005026503A JP 2003190961 A JP2003190961 A JP 2003190961A JP 2003190961 A JP2003190961 A JP 2003190961A JP 2005026503 A JP2005026503 A JP 2005026503A
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JP
Japan
Prior art keywords
light emitting
emitting device
semiconductor light
resin
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2003190961A
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Japanese (ja)
Inventor
Masafumi Shinahama
政文 尻無浜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
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Priority to JP2003190961A priority Critical patent/JP2005026503A/en
Publication of JP2005026503A publication Critical patent/JP2005026503A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device preventing variations when the manufacturing semiconductor light emitting devices, and provide light emitting devices having optical characteristics of excellent high brightness, and its manufacturing method. <P>SOLUTION: The semiconductor light-emitting device 1 is equipped with a base 4, a reflector 5 connected to the base 4 and having a recessed section 6, and a light-emitting element mounted on the base of the recessed section 6. A lens 7 is formed and connected to a connecting section 11 so as to cover the reflector 5 on the connecting section 11 formed on a base-section surface along the outer periphery of the reflecting section 5, by filling a lens mold with a resin and dipping and heating the lens mold and curing the resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、プリント配線基板の表面にマウントされる表面実装型の半導体発光装置およびその製造方法に関する。
【0002】
【従来の技術】
表面実装型の半導体発光装置として、チップLEDが従来から利用されている。チップLEDは、プリント配線基板に直に導通搭載できるようにしたいわゆる表面実装タイプのものであり、例えば、携帯電話等のように小型化が進んでいる電子機器に多用されており、これからもますます電子機器の小型化の要望とともに用途が広がっていくと思われる。
【0003】
また、車載用照明用として使用される場合では、光学特性として視野角が広い範囲となるよりも、狭視野で高輝度となる半導体発光装置が求められる場合が多くなってきている。
【0004】
図5に基づいて、従来の表面実装型の半導体発光装置の説明をする。
【0005】
図5(a)は、樹脂封止する前の従来の面実装型の半導体発光装置を示す斜視図、(b)は樹脂封止した後の従来の面実装型の半導体発光装置を示す斜視図である。
【0006】
図5(a)において、半導体発光装置は、リードフレームである第1電極30と第2電極31と、発光素子32を搭載するリードフレーム部分を露出させる凹部33を有する樹脂モールド部34と、発光素子32とで構成される。
【0007】
樹脂モールド部34は、樹脂を射出成型法にて一体成型し、発光素子32の光を反射させるポリフタルアミド(PPA)で略直方体状に形成される。
【0008】
樹脂モールド部34を成型した後に、第1電極30に発光素子32をダイスボンドし、第2電極31と発光素子32をワイヤボンディングにより導通接続した後に、エポキシ樹脂等の光透過性樹脂35をポッティングにより発光素子32を封止する。このエポキシ樹脂は、光の透過率を向上させるため、フィラーの添加をおさえた、またはフィラーを添加しない高純度のものを使用している。
【0009】
ポッティングによる光透過性樹脂35の量は、半導体発光装置の発光面が水平となる程度の量を充填する。光透過性樹脂35が硬化しレンズ部36となった半導体発光装置を図5(b)に示す。
【0010】
封止が完了すると、第1電極30および第2電極31を樹脂モールド部34の下部側に曲げて完成する。このような半導体発光装置が特許文献1に記載がある。
【0011】
また、同様の構成において、リードフレームを樹脂にて一体成型する際に、リードフレーム間に樹脂で隔壁を形成し、半導体発光装置をリフロー処理する際にも樹脂の熱膨張に強い半導体発光装置が特許文献2に記載されている。
【0012】
【特許文献1】
特開2002−280616号公報(段落番号0007−0009)
【特許文献2】
特開2001−177160号公報(段落番号0030−0036)
【0013】
【発明が解決しようとする課題】
しかしながら、従来の半導体発光装置においては、光透過性樹脂をポッティングによりレンズ部36を形成する際に、光透過性樹脂の温度や粘度により、一定量を樹脂モールド部34に形成された凹部33に充填するのは困難であり、バラツキが大きいという問題がある。
【0014】
光透過性樹脂の充填する量が均一とならない場合、封止した光透過性樹脂が一定の形状とならないため、光軸が所定の方向から外れ、配光特性が悪くなったり、白色発光装置の場合では、色ムラが発生したりするという問題が発生する。
【0015】
また、光透過性樹脂をポッティングで、狭視野でかつ高輝度を実現する半球状のレンズ部を形成する場合では、レンズの厚みを光軸方向に厚くしようとすると、光透過性樹脂の表面張力に限界があるので、光透過性樹脂が周りに流れてしまい、指向特性の良いレンズ部を形成することは不可能であった。
【0016】
この課題を解決するために本発明は、半導体発光装置の製造のバラツキを防止し、狭視野で高輝度な優れた光学特性を有する半導体発光装置およびその製造方法を提供することを目的とする。
【0017】
【課題を解決するための手段】
この課題を解決するために本発明は、基台部と、基台部に接続され、凹部を有する反射部と、凹部の底面に搭載した発光素子とを備え、反射部の外周に沿って基台部面上に形成された接続部を有する半導体発光装置であって、反射部を覆うように、反射部の外周に沿って前記基台部面上に形成された接続部に接続してレンズ部を形成することを特徴とする半導体発光装置であり、そのレンズ部の形成方法は、樹脂を充填させた略半球形状をした金型へ、接続部が樹脂に当接するまで浸漬し、樹脂を加熱し硬化させ、略半球形状をしたレンズ部を形成することを特徴とする半導体装置の製造方法である。
【0018】
これにより、レンズ部を所定の形状に精度良く形成できるので、光軸のズレや、色ムラの発生を防止でき、狭視野で高輝度な光学特性の良い半導体装置とすることができる。
【0019】
【発明の実施の形態】
本願の請求項1に記載の発明は、基台部と、前記基台部に接続され、凹部を有する反射部と、前記凹部の底面に搭載した発光素子とを有する半導体発光装置において、前記反射部を覆うように、前記反射部の外周に沿って前記基台部面上に形成された接続部に接続されたレンズ部を備えたことを特徴とする半導体発光装置としたものであり、基台部にレンズ部と接続する接続部を形成したことで、レンズ部が接続する反射部および基台部の面積が増えるという作用がある。
【0020】
請求項2に記載の発明は、前記反射部の外形は、前記基台部の外形と同形状に形成され、前記反射部を覆うように、前記反射部の外周側面に接続して形成された前記レンズ部を備えたことを特徴とする請求項1記載の半導体発光装置としたものであり、半導体発光装置の形成に際して、基台部および反射部の形成に、従来の金型が使用できる。
【0021】
請求項3に記載の発明は、基台部と、前記基台部に接続され、凹部を有する反射部と、前記凹部の底面に搭載した発光素子とを備え、前記反射部の外周に沿って前記基台部面上に形成された接続部を有する半導体発光装置の製造方法であって、前記基台部および前記反射部を、樹脂を充填させた略半球形状をした金型へ、前記接続部が前記樹脂に当接するまで浸漬し、前記樹脂を加熱し硬化させ、略半球形状をしたレンズ部を形成することを特徴とする半導体発光装置の製造方法としたものであり、レンズ部を形成する金型を使用することで、所定の形状が容易に精度良く形成できる半導体発光装置の製造方法である。
【0022】
請求項4に記載の発明は、前記反射部の外形を、前記基台部の外形と同形状に形成し、樹脂を充填させた略半球形状をした前記金型へ、前記反射部の外周面が浸かるまで浸漬し、前記樹脂を加熱し硬化させ、レンズ部を形成することを特徴とする請求項3記載の半導体発光装置の製造方法としたものであり、半導体発光装置の形成に際して、基台部および反射部の形成に、従来の金型が使用できる。
【0023】
本発明の実施の形態に係る半導体発光装置の製造方法および半導体装置について、図1から図3を用いて説明する。なお、説明にあたっては、反射部の発光素子搭載面を上側、反対側を下側とする。
【0024】
(実施の形態1)
図1は、本発明の実施の形態1に係る半導体発光装置の製造方法によって得られる半導体発光装置であり(a)は同半導体発光装置の斜視図、(b)は同半導体発光装置の平面図である。
【0025】
まず、図1に基づいて、本実施の形態に係る半導体発光装置の製造方法によって得られる半導体発光装置の構成から説明をする。
【0026】
実施の形態1の半導体発光装置1は、電極であるリードフレーム2と、電圧を印加することで発光する発光素子3と、リードフレーム2を封止する基台部4と、基台部4に接続されて凹部6を有する反射部5と、発光素子3を封止するレンズ部7から構成され、表面実装型である。
【0027】
リードフレーム2は、第1電極8および第2電極9から構成され、基台部4の底面の下部側に折り曲げてあり、垂直断面が略コ字状に形成されている。
【0028】
第1電極8および第2電極9は、対向して配設され、一側である第1電極8には、発光素子3がダイスボンディングにより導通接続されており、他側である第2電極9とは、発光素子3とワイヤ20にてワイヤボンディングにて導通接続されている。
【0029】
基台部4は、略直方体状に形成されており、アノード、カソードを識別する切欠き部19を有しており、第1電極8がカソードであることを示している。
【0030】
反射部5は、基台部4の上面に接続され、開口部10を有する凹部6が形成されており、開口部10から見て略円形をした筒状をしており、底面は、リードフレーム2が露出するよう形成されている。また、凹部6の側面は、底面から開口部10へ向かって広がる傾斜面に形成されている。
【0031】
基台部4と反射部5は、光を反射させる樹脂であるポリフタルアミド(PPA)を射出成型法にて一体的に形成されている。
【0032】
反射部5の凹部6の底面に搭載された発光素子3からの射光は、凹部6の側面に反射され、開口部10から照射される。
【0033】
レンズ部7は、略半球状をしており、反射部5の凹部6および反射部5の外周面を覆うように形成され、基台部4の反射部5の外形に沿って形成された接続部11と接続している。レンズ部7は、光透過性樹脂であり、例えばエポキシ樹脂で形成され、光の透過率を向上させるため、フィラーの添加をおさえた、またはフィラーを添加しない高純度のものを使用している。レンズ部7は、発光素子3の射光に、狭視野となる指向性を持たせ、輝度を向上させる役目をする。
【0034】
ワイヤ20は、Auで形成され、ボンディング装置にて接続される。
【0035】
以上で構成される半導体発光装置において、その製造方法について、図2および図3に基づいて説明する。
【0036】
図2は、実施の形態1の半導体発光装置の製造方法を説明する図であり、図3は、レンズ部を形成する方法を説明する図である。
【0037】
まず、加工前のリードフレーム2の第1電極8および第2電極9を、金型(図示せず)にて型締めし、樹脂を金型に圧入し、射出成型法にて基台部4および反射部5を一体的に形成する。そして、反射部5の底面に露出した第1電極8に発光素子3をダイスボンディングにより導通搭載する(同図(a))。
【0038】
発光素子3と第2電極9をワイヤ20にてワイヤボンディングにより導通接続し、半導体発光装置部材12とする(同図(b))。
【0039】
次に、レンズ部7を形成するが、図3にてその形成方法を説明する。
【0040】
発光素子3をリードフレーム2に搭載し、ワイヤボンディングした半導体発光装置部材12を、上下を逆さにし、光透過性樹脂13を充填させたレンズ部7の形状に内側を略半球状に形成したレンズ金型14に、基台部4の接続部11が光透過性樹脂13に当接するまで浸漬する(同図(a))。
【0041】
レンズ金型14を加熱し、光透過性樹脂13を硬化させ、レンズ金型14から半導体発光装置部材12を取り外し、レンズ部7を半導体発光装置部材12に形成することができる(同図((b))。
【0042】
図2に戻って、レンズ部7を形成した半導体発光装置部材12のリードフレーム2を、基台部4の底面の下部側に折り曲げて、半導体発光装置1が完成する(同図(c))。
【0043】
以上により、本実施の形態の半導体発光装置は、狭視野で高輝度な光学特性を持つレンズ部を容易に形成することが可能であり、基台部にレンズ部と接続する接続部を形成したことで、レンズ部が、接続する基台部および反射部の面積が増え、衝撃にも強い半導体発光装置とすることができる。
【0044】
(実施の形態2)
本発明の実施の形態2に係る半導体発光装置を図4に基づいて説明する。
【0045】
図4は、本発明の実施の形態2に係る半導体発光装置の製造方法によって得られる半導体発光装置の側断面図である。
【0046】
実施の形態2の半導体発光装置15は、実施の形態1のレンズ部の底面に接続する、基台部に形成した接続部を省略したものである。
【0047】
反射部16は、その外周部が基台部17と同じ形状に形成されている。
【0048】
こうすることにより、反射部16および基台部17とを一体的に形成し、外形を同形状した従来の金型で、半導体発光部材を製造することが可能である。
【0049】
この場合においても、反射部16の上面に形成されたレンズ部18により、狭視野で高輝度な半導体発光装置15とすることができる。
【0050】
【発明の効果】
以上に述べたように、本発明によれば以下の効果を奏することができる。
【0051】
(1)レンズ部を樹脂が充填された略半球形状の金型で形成することで、ポッティングによる樹脂封止を行う必要がないため、製造時のバラツキが防止でき、容易に所定の形状に精度よく形成することができる。よって、配光特性が良く、色ムラの発生しないレンズ部とすることができる。
【0052】
(2)レンズ部を基台部面上に形成した接続部に接続させることで、接続する面積が増え、衝撃にも強いレンズ部とすることができる。
【0053】
(3)レンズ部を略半球状とすることで、狭視野で高輝度な光学特性を持つレンズ部を有する半導体発光装置および製造方法とすることができる。
【0054】
(4)レンズ部を樹脂が充填された略半球形状の金型で形成することで、表面実装型でなく、基板の貫通孔へリードフレームを挿入して実装するタイプの半導体発光装置の製造に使用していた金型がそのまま流用できるため、新たな設備を備える必要がない。
【0055】
(5)反射部の外形は、前記基台部の外形と同形状に形成することで、基台部および反射部を一体的に形成する金型が流用でき、新たな金型を備える必要がない。
【図面の簡単な説明】
【図1】本発明の実施の形態1に係る半導体発光装置の製造方法によって得られる半導体発光装置であり、
(a)は同半導体発光装置の斜視図
(b)は同半導体発光装置の平面図
【図2】本発明の実施の形態1に係る半導体発光装置の製造方法を説明する図
【図3】レンズ部を形成する方法を説明する図
【図4】本発明の実施の形態2に係る半導体発光装置の製造方法によって得られる半導体発光装置の断面図
【図5】従来の表面実装型の半導体発光装置の説明する図であり、
(a)は樹脂封止する前の従来の面実装型の半導体発光装置を示す斜視図
(b)は樹脂封止した後の従来の面実装型発光装置を示す斜視図
【符号の説明】
1 半導体発光装置
2 リードフレーム
3 発光素子
4 基台部
5 反射部
6 凹部
7 レンズ部
8 第1電極
9 第2電極
10 開口部
11 接続部
12 半導体発光装置部材
13 光透過性樹脂
14 レンズ金型
15 半導体発光装置
16 反射部
17 基台部
18 レンズ部
19 切欠き部
20 ワイヤ
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface mount type semiconductor light emitting device mounted on the surface of a printed wiring board and a method for manufacturing the same.
[0002]
[Prior art]
Conventionally, chip LEDs have been used as surface mount semiconductor light emitting devices. Chip LEDs are of the so-called surface mount type that can be directly conductively mounted on a printed wiring board. For example, they are widely used in electronic devices that are becoming smaller, such as mobile phones. Applications are expected to expand with the demand for smaller electronic devices.
[0003]
In addition, when used for in-vehicle lighting, a semiconductor light-emitting device that has a narrow field of view and high brightness is often required rather than a wide viewing angle range as optical characteristics.
[0004]
A conventional surface-mount semiconductor light-emitting device will be described with reference to FIG.
[0005]
FIG. 5A is a perspective view showing a conventional surface mount semiconductor light emitting device before resin sealing, and FIG. 5B is a perspective view showing a conventional surface mount semiconductor light emitting device after resin sealing. It is.
[0006]
5A, the semiconductor light emitting device includes a first electrode 30 and a second electrode 31 that are lead frames, a resin mold portion 34 having a recess 33 that exposes a lead frame portion on which the light emitting element 32 is mounted, and light emission. It is comprised with the element 32. FIG.
[0007]
The resin mold portion 34 is formed in a substantially rectangular parallelepiped shape by polyphthalamide (PPA) that integrally molds resin by an injection molding method and reflects the light of the light emitting element 32.
[0008]
After molding the resin mold portion 34, the light emitting element 32 is die-bonded to the first electrode 30, and after the second electrode 31 and the light emitting element 32 are conductively connected by wire bonding, a light transmissive resin 35 such as epoxy resin is potted. Thus, the light emitting element 32 is sealed. In order to improve the light transmittance, this epoxy resin uses a high-purity resin that does not contain a filler or does not contain a filler.
[0009]
The amount of the light transmissive resin 35 by potting is filled so that the light emitting surface of the semiconductor light emitting device is horizontal. FIG. 5B shows a semiconductor light emitting device in which the light transmissive resin 35 is cured to form the lens portion 36.
[0010]
When the sealing is completed, the first electrode 30 and the second electrode 31 are bent to the lower side of the resin mold portion 34 to complete. Such a semiconductor light emitting device is described in Patent Document 1.
[0011]
Also, in the same configuration, when the lead frame is integrally molded with resin, a partition wall is formed with resin between the lead frames, and a semiconductor light emitting device that is resistant to thermal expansion of the resin even when the semiconductor light emitting device is reflow-treated. It is described in Patent Document 2.
[0012]
[Patent Document 1]
JP 2002-280616 A (paragraph numbers 0007-0009)
[Patent Document 2]
JP 2001-177160 A (paragraph numbers 0030-0036)
[0013]
[Problems to be solved by the invention]
However, in the conventional semiconductor light emitting device, when the lens portion 36 is formed by potting the light transmissive resin, a certain amount is applied to the concave portion 33 formed in the resin mold portion 34 due to the temperature and viscosity of the light transmissive resin. It is difficult to fill, and there is a problem that variation is large.
[0014]
If the amount of the light-transmitting resin to be filled is not uniform, the sealed light-transmitting resin does not have a certain shape, so that the optical axis is deviated from the predetermined direction, the light distribution characteristics are deteriorated, or the white light emitting device In some cases, color unevenness may occur.
[0015]
In addition, in the case of forming a hemispherical lens portion that realizes high brightness with a narrow field of view by potting the light-transmitting resin, the surface tension of the light-transmitting resin is increased if the lens thickness is increased in the optical axis direction. Therefore, it is impossible to form a lens portion with good directivity because the light-transmitting resin flows around.
[0016]
In order to solve this problem, an object of the present invention is to provide a semiconductor light-emitting device that has excellent optical characteristics with a narrow field of view and high brightness, and a method for manufacturing the same.
[0017]
[Means for Solving the Problems]
In order to solve this problem, the present invention includes a base part, a reflective part connected to the base part and having a concave part, and a light emitting element mounted on the bottom surface of the concave part, and is based on the outer periphery of the reflective part. A semiconductor light emitting device having a connection portion formed on a base portion surface, wherein the lens is connected to the connection portion formed on the base portion surface along the outer periphery of the reflection portion so as to cover the reflection portion The lens is formed by immersing the resin in a substantially hemispherical mold filled with resin until the connecting portion comes into contact with the resin. A method of manufacturing a semiconductor device, comprising: heating and curing to form a substantially hemispherical lens portion.
[0018]
Accordingly, since the lens portion can be accurately formed in a predetermined shape, the optical axis can be prevented from being shifted and color unevenness can be prevented, and a semiconductor device with a narrow field of view and high luminance can be obtained.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
The invention according to claim 1 of the present application is the semiconductor light emitting device including a base portion, a reflection portion connected to the base portion and having a recess, and a light emitting element mounted on a bottom surface of the recess. A semiconductor light emitting device comprising a lens portion connected to a connecting portion formed on the base portion surface along the outer periphery of the reflecting portion so as to cover the portion, By forming the connection part connected to the lens part on the base part, there is an effect that the area of the reflection part and the base part to which the lens part is connected increases.
[0020]
According to a second aspect of the present invention, the outer shape of the reflecting portion is formed in the same shape as the outer shape of the base portion, and is formed by connecting to the outer peripheral side surface of the reflecting portion so as to cover the reflecting portion. 2. The semiconductor light emitting device according to claim 1, further comprising a conventional mold for forming the base portion and the reflection portion when forming the semiconductor light emitting device.
[0021]
The invention according to claim 3 includes a base portion, a reflection portion connected to the base portion and having a concave portion, and a light emitting element mounted on the bottom surface of the concave portion, and along the outer periphery of the reflective portion. A method of manufacturing a semiconductor light emitting device having a connection portion formed on the base portion surface, wherein the connection of the base portion and the reflection portion to a substantially hemispherical mold filled with resin. The method of manufacturing a semiconductor light emitting device is characterized by forming a lens portion having a substantially hemispherical shape by dipping until the portion comes into contact with the resin, and heating and curing the resin. This is a method for manufacturing a semiconductor light-emitting device in which a predetermined shape can be easily and accurately formed by using a mold that performs the above-described process.
[0022]
According to a fourth aspect of the present invention, an outer peripheral surface of the reflecting portion is formed into an approximately hemispherical mold in which the outer shape of the reflecting portion is formed in the same shape as the outer shape of the base portion and filled with resin. 4. The method of manufacturing a semiconductor light emitting device according to claim 3, wherein the lens portion is formed by dipping until the substrate is immersed, and heating and curing the resin to form a lens portion. A conventional mold can be used for forming the part and the reflection part.
[0023]
A method of manufacturing a semiconductor light emitting device and a semiconductor device according to an embodiment of the present invention will be described with reference to FIGS. In the description, the light emitting element mounting surface of the reflecting portion is the upper side, and the opposite side is the lower side.
[0024]
(Embodiment 1)
1A and 1B are semiconductor light-emitting devices obtained by the method for manufacturing a semiconductor light-emitting device according to Embodiment 1 of the present invention. FIG. 1A is a perspective view of the semiconductor light-emitting device, and FIG. 1B is a plan view of the semiconductor light-emitting device. It is.
[0025]
First, a configuration of a semiconductor light emitting device obtained by the method for manufacturing a semiconductor light emitting device according to the present embodiment will be described with reference to FIG.
[0026]
The semiconductor light emitting device 1 of the first embodiment includes a lead frame 2 that is an electrode, a light emitting element 3 that emits light by applying a voltage, a base portion 4 that seals the lead frame 2, and a base portion 4. It is composed of a reflective part 5 connected to have a recess 6 and a lens part 7 that seals the light emitting element 3, and is a surface mount type.
[0027]
The lead frame 2 is composed of a first electrode 8 and a second electrode 9, is bent to the lower side of the bottom surface of the base portion 4, and has a substantially U-shaped vertical cross section.
[0028]
The first electrode 8 and the second electrode 9 are disposed to face each other, and the light emitting element 3 is conductively connected to the first electrode 8 on one side by die bonding, and the second electrode 9 on the other side. Is electrically connected to the light emitting element 3 by wire bonding.
[0029]
The base part 4 is formed in a substantially rectangular parallelepiped shape, and has a notch part 19 for identifying the anode and the cathode, indicating that the first electrode 8 is a cathode.
[0030]
The reflecting portion 5 is connected to the upper surface of the base portion 4, has a recess 6 having an opening 10, has a substantially circular cylindrical shape when viewed from the opening 10, and the bottom surface is a lead frame. 2 is exposed. Further, the side surface of the recess 6 is formed as an inclined surface that widens from the bottom surface toward the opening 10.
[0031]
The base part 4 and the reflection part 5 are integrally formed by injection molding of polyphthalamide (PPA), which is a resin that reflects light.
[0032]
The incident light from the light emitting element 3 mounted on the bottom surface of the concave portion 6 of the reflecting portion 5 is reflected on the side surface of the concave portion 6 and is irradiated from the opening portion 10.
[0033]
The lens portion 7 has a substantially hemispherical shape, is formed so as to cover the concave portion 6 of the reflecting portion 5 and the outer peripheral surface of the reflecting portion 5, and is formed along the outer shape of the reflecting portion 5 of the base portion 4. Connected to the unit 11. The lens portion 7 is a light-transmitting resin, and is formed of, for example, an epoxy resin, and uses a high-purity resin that suppresses the addition of the filler or does not add the filler in order to improve the light transmittance. The lens unit 7 serves to improve luminance by giving the light emitted from the light emitting element 3 directivity with a narrow field of view.
[0034]
The wire 20 is made of Au and connected by a bonding apparatus.
[0035]
A manufacturing method of the semiconductor light emitting device configured as described above will be described with reference to FIGS.
[0036]
FIG. 2 is a diagram illustrating a method for manufacturing the semiconductor light emitting device of the first embodiment, and FIG. 3 is a diagram illustrating a method for forming a lens portion.
[0037]
First, the first electrode 8 and the second electrode 9 of the lead frame 2 before processing are clamped with a mold (not shown), a resin is press-fitted into the mold, and the base 4 is injected by an injection molding method. And the reflection part 5 is formed integrally. Then, the light emitting element 3 is conductively mounted by die bonding on the first electrode 8 exposed on the bottom surface of the reflecting portion 5 (FIG. 1A).
[0038]
The light emitting element 3 and the second electrode 9 are electrically connected by wire bonding with a wire 20 to form a semiconductor light emitting device member 12 (FIG. 2B).
[0039]
Next, the lens portion 7 is formed. The forming method will be described with reference to FIG.
[0040]
A lens in which a light-emitting element 3 is mounted on a lead frame 2 and a wire-bonded semiconductor light-emitting device member 12 is turned upside down, and a lens portion 7 filled with a light-transmitting resin 13 is formed in a substantially hemispherical shape. It is immersed in the metal mold 14 until the connection part 11 of the base part 4 comes into contact with the light-transmitting resin 13 ((a) in the figure).
[0041]
The lens mold 14 is heated, the light-transmitting resin 13 is cured, the semiconductor light emitting device member 12 is removed from the lens mold 14, and the lens portion 7 can be formed on the semiconductor light emitting device member 12 ((( b)).
[0042]
Returning to FIG. 2, the lead frame 2 of the semiconductor light emitting device member 12 in which the lens portion 7 is formed is bent to the lower side of the bottom surface of the base portion 4 to complete the semiconductor light emitting device 1 ((c) in FIG. 2). .
[0043]
As described above, the semiconductor light emitting device of the present embodiment can easily form a lens portion having a narrow field of view and high-brightness optical characteristics, and a connection portion connected to the lens portion is formed on the base portion. Accordingly, the area of the base portion and the reflection portion to which the lens portion is connected is increased, and a semiconductor light emitting device that is resistant to impact can be obtained.
[0044]
(Embodiment 2)
A semiconductor light-emitting device according to Embodiment 2 of the present invention will be described with reference to FIG.
[0045]
FIG. 4 is a side sectional view of a semiconductor light emitting device obtained by the method for manufacturing a semiconductor light emitting device according to the second embodiment of the present invention.
[0046]
In the semiconductor light emitting device 15 according to the second embodiment, the connecting portion formed on the base portion that connects to the bottom surface of the lens portion according to the first embodiment is omitted.
[0047]
The reflection portion 16 has an outer peripheral portion formed in the same shape as the base portion 17.
[0048]
By doing so, it is possible to manufacture a semiconductor light emitting member with a conventional mold in which the reflecting portion 16 and the base portion 17 are integrally formed and the outer shape is the same.
[0049]
Also in this case, the lens unit 18 formed on the upper surface of the reflection unit 16 can provide the semiconductor light emitting device 15 with a narrow field of view and high brightness.
[0050]
【The invention's effect】
As described above, according to the present invention, the following effects can be obtained.
[0051]
(1) Since the lens part is formed of a substantially hemispherical mold filled with resin, it is not necessary to perform resin sealing by potting, so that variations during manufacturing can be prevented and accuracy to a predetermined shape can be easily achieved. Can be well formed. Therefore, it is possible to obtain a lens portion that has good light distribution characteristics and does not cause color unevenness.
[0052]
(2) By connecting the lens part to the connection part formed on the base part surface, the area to be connected is increased, and the lens part can be made resistant to impact.
[0053]
(3) By making the lens part substantially hemispherical, it is possible to provide a semiconductor light emitting device and manufacturing method having a lens part having a narrow field of view and high luminance optical characteristics.
[0054]
(4) By forming the lens part with a substantially hemispherical mold filled with resin, it is not a surface mount type but a semiconductor light emitting device of a type that is mounted by inserting a lead frame into a through hole of a substrate. Since the used mold can be used as it is, there is no need to provide new equipment.
[0055]
(5) By forming the outer shape of the reflecting portion into the same shape as the outer shape of the base portion, a mold that integrally forms the base portion and the reflecting portion can be diverted, and it is necessary to provide a new die. Absent.
[Brief description of the drawings]
1 is a semiconductor light emitting device obtained by a method for manufacturing a semiconductor light emitting device according to a first embodiment of the present invention;
FIG. 2A is a perspective view of the semiconductor light emitting device. FIG. 2B is a plan view of the semiconductor light emitting device. FIG. 2 illustrates a method for manufacturing the semiconductor light emitting device according to the first embodiment of the invention. FIG. 4 is a cross-sectional view of a semiconductor light-emitting device obtained by the method for manufacturing a semiconductor light-emitting device according to Embodiment 2 of the present invention. FIG. 5 is a diagram illustrating a conventional surface-mount type semiconductor light-emitting device. It is a figure explaining
(A) is a perspective view showing a conventional surface mount type semiconductor light emitting device before resin sealing, and (b) is a perspective view showing a conventional surface mount type light emitting device after resin sealing.
DESCRIPTION OF SYMBOLS 1 Semiconductor light-emitting device 2 Lead frame 3 Light-emitting element 4 Base part 5 Reflection part 6 Concave part 7 Lens part 8 First electrode 9 Second electrode 10 Opening part 11 Connection part 12 Semiconductor light-emitting device member 13 Light transmitting resin 14 Lens mold DESCRIPTION OF SYMBOLS 15 Semiconductor light-emitting device 16 Reflection part 17 Base part 18 Lens part 19 Notch part 20 Wire

Claims (4)

基台部と、前記基台部に接続され、凹部を有する反射部と、前記凹部の底面に搭載した発光素子とを有する半導体発光装置において、前記反射部を覆うように、前記反射部の外周に沿って前記基台部面上に形成された接続部に接続されたレンズ部を備えたことを特徴とする半導体発光装置。In a semiconductor light emitting device having a base part, a reflective part connected to the base part and having a concave part, and a light emitting element mounted on the bottom surface of the concave part, an outer periphery of the reflective part so as to cover the reflective part A semiconductor light emitting device comprising: a lens portion connected to a connection portion formed on the base portion surface along the surface. 前記反射部の外形は、前記基台部の外形と同形状に形成され、前記反射部を覆うように、前記反射部の外周側面に接続して形成された前記レンズ部を備えたことを特徴とする請求項1記載の半導体発光装置。The outer shape of the reflecting portion is formed in the same shape as the outer shape of the base portion, and includes the lens portion that is connected to the outer peripheral side surface of the reflecting portion so as to cover the reflecting portion. The semiconductor light-emitting device according to claim 1. 基台部と、前記基台部に接続され、凹部を有する反射部と、前記凹部の底面に搭載した発光素子とを備え、前記反射部の外周に沿って前記基台部面上に形成された接続部を有する半導体発光装置の製造方法であって、前記基台部および前記反射部を、樹脂を充填させた略半球形状をした金型へ、前記接続部が前記樹脂に当接するまで浸漬し、前記樹脂を加熱し硬化させ、略半球形状をしたレンズ部を形成することを特徴とする半導体発光装置の製造方法。A base part, a reflective part connected to the base part and having a concave part, and a light emitting element mounted on the bottom surface of the concave part, and formed on the base part surface along the outer periphery of the reflective part A method of manufacturing a semiconductor light emitting device having a connecting portion, wherein the base portion and the reflecting portion are immersed in a substantially hemispherical mold filled with a resin until the connecting portion contacts the resin. And heating and curing the resin to form a lens portion having a substantially hemispherical shape. 前記反射部の外形を、前記基台部の外形と同形状に形成し、樹脂を充填させた略半球形状をした前記金型へ、前記反射部の外周面が浸かるまで浸漬し、前記樹脂を加熱し硬化させ、レンズ部を形成することを特徴とする請求項3記載の半導体発光装置の製造方法。The outer shape of the reflecting portion is formed in the same shape as the outer shape of the base portion, and is immersed in the substantially hemispherical mold filled with resin until the outer peripheral surface of the reflecting portion is immersed, and the resin is 4. The method of manufacturing a semiconductor light emitting device according to claim 3, wherein the lens portion is formed by heating and curing.
JP2003190961A 2003-07-03 2003-07-03 Semiconductor light emitting device and its manufacturing method Pending JP2005026503A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100616684B1 (en) * 2005-06-03 2006-08-28 삼성전기주식회사 High power led package and fabrication method thereof
EP1786045A2 (en) * 2005-11-15 2007-05-16 Samsung Electro-Mechanics Co., Ltd. LED package
JP2010251785A (en) * 2005-02-03 2010-11-04 Samsung Electro-Mechanics Co Ltd Side-emission type light emitting diode package
JP2012235147A (en) * 2006-06-09 2012-11-29 Lg Electronics Inc Light emitter package module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251785A (en) * 2005-02-03 2010-11-04 Samsung Electro-Mechanics Co Ltd Side-emission type light emitting diode package
KR100616684B1 (en) * 2005-06-03 2006-08-28 삼성전기주식회사 High power led package and fabrication method thereof
EP1786045A2 (en) * 2005-11-15 2007-05-16 Samsung Electro-Mechanics Co., Ltd. LED package
JP2007142413A (en) * 2005-11-15 2007-06-07 Samsung Electro-Mechanics Co Ltd Led package
EP1786045A3 (en) * 2005-11-15 2012-08-29 Samsung LED Co., Ltd. LED package
JP2012235147A (en) * 2006-06-09 2012-11-29 Lg Electronics Inc Light emitter package module

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