JP2010010195A - Cooling device for electronic component for automobile - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device for an electronic component for an automobile, which is compact and exhibits high cooling performance. <P>SOLUTION: A cooling unit 10 constituting the cooling device is constituted so that two first and second units 16a and 16b, each formed by inserting a plurality of thin-diameter inner pipes 14 into an outer pipe 12 in a flat shape and closely arranging those inner pipes 14 in an array such that outer peripheral surfaces 12 of the inner pipes 14 come into contact with an inner peripheral surface of the outer pipe 14, are connected in series one over the other respectively so that a flat surface 24 of the outer pipe 12 on the side where the electronic component 26 is attached is on the outer side, and a heat insulating material 20 is inserted between opposite flat surfaces 18 of the first unit 16a and second unit 16b. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a cooling device for an electronic component for automobiles, and particularly relates to a cooling device for an electronic component for automobiles that can be suitably used as a cooler for electronic components such as inverters used in hybrid vehicles and the like.

  In recent years, electric vehicles, fuel cell vehicles, hybrid vehicles, etc. have received attention as traffic / transportation systems that use electricity as a driving force instead of internal combustion engines due to soaring fuel in addition to environmental protection. Is configured to drive a motor using electric energy stored in a battery via an inverter to obtain power. Thus, in such a power output mechanism, a large current flows through the inverter device. Therefore, the heat generation of semiconductor elements such as IGBTs constituting the inverter device increases, so that it is cooled. In addition, a cooler having a large cooling capacity is required.

  For this reason, conventionally, various liquid-cooled coolers have been proposed in order to cool such a high heat density heating element. For example, in Japanese Patent Laid-Open No. 7-38025 (Patent Document 1), a cooling structure having a flat tube shape by combining a pair of comb-shaped cooling blocks is proposed. A metal having excellent conductivity, for example, a material formed by cutting copper is used. Moreover, in JP 2002-9216 A (Patent Document 2), a flat tube integrally formed by extrusion, which is a type generally used for condensers and evaporators of air conditioners, was used. A cooling fluid cooling type circuit device has been proposed. Furthermore, in Japanese Patent Application Laid-Open No. 2005-203732 (Patent Document 3), two metal plates made of aluminum or the like are processed by press molding, and the edges are joined to form a tube, A cooler having a structure in which corrugated fins made of aluminum or the like are arranged in the tube has been proposed. In each of these proposed cooling devices, a structure is adopted in which the heat generated from the semiconductor element attached to the outer surface of the tube is cooled by the coolant flowing through the inside of the tube. It is.

  By the way, in this kind of cooling device, it is desired to make it as compact as possible because space is limited at the time of installation, and the heat generated from the semiconductor element is increasingly increased in heat density. From now on, there is a need for further higher cooling performance, but the cooling devices that have been proposed so far respond to such requests for compactness and higher cooling performance. Various problems are inherent.

  For example, in a cooling device of the type disclosed in Patent Document 1 or Patent Document 3, a tube is formed by combining two parts. In other words, the reliability of the sealing performance of the joint becomes a problem. Specifically, in Patent Document 1, a structure in which an O-ring is attached to the outermost joint portion of the tube and screwed is employed, and in Patent Document 3, an edge portion of two plates is used. The target tube is completed by brazing, but the presence of a brazing joint in such a tube is a seal compared to that composed of an integral tube. In addition to being unfavorable, measures such as mounting an O-ring as a countermeasure against this increase the number of parts and increase costs in addition to fixing work using screws. The more compact the cooler, the greater the difficulty.

  Under such circumstances, a cooler of the type proposed in Patent Document 2 in which an integrally molded product is used is preferable. However, there is a problem that the cooling performance is limited when the cooler is made compact. Is inherent. In particular, in cooling applications for electronic circuit components such as inverters for automobiles, in addition to increasing the density of heating elements, it is necessary to make the cooler as compact as possible. While it is necessary to secure a large coolant flow path and also to sufficiently ensure the heat transfer surface of the coolant and the tube, it is not possible to sufficiently meet such a demand. That is, in the cooler of the type proposed in Patent Document 2, the cooling performance can be improved by making the inner wall of the tube as thin (thin) as possible and increasing the number thereof. Thus, it is not easy to form many thin inner walls in the small cross-sectional shape of the hollow tube.

  Moreover, when the tube material is aluminum or aluminum alloy with good extrudability, the hollow material can be extruded by porthole extrusion, but the small cross section and the complicated cross section as described above. Extrusion of the shape becomes extremely difficult, and when using copper or copper alloy with good thermal conductivity as the tube material, the hollow tube as described above is formed by extrusion It was almost impossible to do.

JP-A-7-38025 JP 2002-9216 A JP 2005-203732 A

  The present invention has been made in the background of such circumstances, and the problem to be solved is to provide an automotive electronic component cooling device that is compact and exhibits high cooling performance. is there.

  In the present invention, in order to solve such a problem, a plurality of inner pipes are inserted into the outer pipe having a flat shape and closely arranged in a row. The outer peripheral surface of the inner tube is in intimate contact with the inner peripheral surface of the tube, and one of the flat surfaces given by the flat shape of the outer tube is attached with a predetermined automobile electronic component, while the inner tube And the entire gap between the inner tube and the outer tube has first and second units configured to allow a coolant to flow, and the first unit and the second unit Are composed of a plurality of cooling units having a structure in which one end portion corresponding to each outer pipe is connected in series in a return flow path, and these cooling units are arranged in the first and second units. At the corresponding other end of the tube, the coolant flow In the cooling device for automotive electronic components having a structure connected in series or in parallel at the header serving as the outlet, the first unit and the second unit in the cooling unit are attached to the electronic component. The outer pipes are overlapped so that the flat surfaces of the outer pipes on the outer sides are outside, and a heat insulating layer is provided between the flat faces of the outer pipes facing the first unit and the second unit. The gist of the present invention is a cooling apparatus for an automotive electronic component, which is interposed.

  In addition, according to one of desirable modes of the automotive electronic component cooling device according to the present invention, the heat insulating layer is an air layer constituted by a space of a predetermined gap, and is another desirable mode. According to the above, the heat insulating layer is a heat insulating material layer having a predetermined thickness.

  Moreover, in one of the preferable embodiments of the automotive electronic component cooling device according to the present invention, the outer tube and the inner tube are each made of copper or a copper alloy, and are further preferable. In one aspect, the outer tube and the inner tube are each made of aluminum or an aluminum alloy.

  In such a cooling apparatus for electronic parts for automobiles according to the present invention, in the first and second two units in each cooling unit, on one of the flat surfaces provided on the flat outer peripheral surface of each outer tube. The electronic parts for automobiles are individually attached, while the cooling liquid is circulated in the inner pipe and the entire gap between the outer pipe and the inner pipe to cool the electronic parts. The heat of the parts spreads by heat conduction to the entire tube wall of the outer tube, and in the outer tube to which the electronic components are attached, the inner tube is placed so as to be in close contact with the outer tube wall. As a result, not only the inner surface of the outer tube but also the inner and outer surfaces of the inner tube become heat transfer surfaces to the coolant. Yes, the heat transfer area to the coolant is even more effective And obtained was allowed to increase, it is becoming possible to exhibit a high cooling capacity.

  Moreover, in such a cooling apparatus for an electronic component for automobiles according to the present invention, in each cooling unit, a plurality of small inner pipes are arranged in the large outer pipes constituting the first and second units. Because it has an integrated structure that is inserted and closely arranged, and it is not necessary to have a brazed joint or an O-ring mounting part, its compactness can be advantageously realized. Also, in terms of structure, since it is configured by inserting a plurality of thin inner pipes into a large outer pipe, a small cross section without adopting a special operation such as extrusion processing. It is possible to easily form a large number of inner walls serving as heat transfer surfaces in the shape.

  Further, in the automotive electronic component cooling apparatus according to the present invention as described above, the location where the electronic component is attached to each cooling unit is divided into the first and second units, and the cooling is performed. Since the liquid flow path has an independent structure divided into two parts, a unit in which two electronic components are attached to the upper and lower surfaces of one outer tube is designed to avoid mutual heat interference. Compared to increasing the flat thickness, the coolant cross-sectional area can be advantageously reduced, and the coolant flow rate can be increased, thereby effectively improving the cooling capacity. It can be made.

  Furthermore, in the cooling device for an electronic component for automobiles according to the present invention, in each cooling unit, there is a predetermined interval between the two units divided into the first and second parts, that is, between the divided coolant flow paths. Since the heat insulating layer is interposed, the influence of the temperature rise (thermal interference) of one coolant channel is not exerted on the other coolant channel. It has the feature that it is possible to suppress the temperature rise and improve the cooling capacity more advantageously. In other words, the heat of the electronic component attached to one cooling unit does not affect the cooling effect of the electronic component attached to the other unit, and the cooling efficiency of the entire cooling device is advantageously improved. It can be harassed.

  Then, by connecting the first and second units in series so that the coolant flow path has a return flow path structure, compared to a straight flow path structure. Thus, the length of the cooling device in the flow direction can be reduced to ½, and this point can contribute to the downsizing of the cooling device.

  Hereinafter, in order to clarify the present invention more specifically, embodiments of the present invention will be described in detail with reference to the drawings.

  First, FIG. 1 shows one embodiment of a cooling unit that constitutes a cooling apparatus for an automotive electronic component according to the present invention, where (a) shows a perspective view and (b) shows a perspective view. The planar forms are shown respectively. Further, FIGS. 2 and 3 show the forms of the AA cross section and the BB cross section in FIG. 1B, respectively.

  In these drawings, the cooling unit 10 has a thick, thick, flat or oval outer tube 12 and a thin, thin, substantially circular shape housed in the outer tube 12. The seven inner pipes 14 and the first unit 16a and the second unit 16b, respectively, are configured so that one flat surface 18, 18 of each unit is opposed to each other with a predetermined interval. It is constructed by being overlapped with each other. And the heat insulating material 20 of predetermined thickness is inserted | pinched by the clearance gap part formed between the flat surfaces 18 and 18 which these 1st unit 16a and 2nd unit 16b oppose. Further, the first unit 16a and the second unit 16b constituting such a cooling unit 10 have one end corresponding to the axial direction as shown in FIG. 1 (a) and FIG. 1 (b). In the section, the outer pipes 12 and 12 are narrowed to have a small diameter, and a return flow path portion 22 that is curved in a U shape so as to connect them is integrally formed. The first unit 16a and the second unit 16b are connected in series. At the other end, headers 23 and 23 serving as cooling liquid inflow / outflow ports that are circulated through the first unit 16a and the second unit 16b are respectively attached.

  More specifically, the outer tube 12 is a flat tube made of copper or a copper alloy and having a larger diameter and thickness than the inner tube 14 and having two flat surfaces with a predetermined width on the outer peripheral surface thereof. On the other hand, the inner tube 14 is formed of copper or a copper alloy like the outer tube 12 and is a tube body that is thinner and thinner than the outer tube 12 and has a substantially circular cross section. ing. A plurality of such inner tubes 14, here seven inner tubes 14, are inserted into the outer tube 12, and the outer peripheral surface of each inner tube 14 is the outer tube 12 as shown in FIG. 2. As shown in FIG. 3, the outer tube 12 and the inner tube 14 are integrated by being arranged in a row so as to be in close contact with the inner surface and in close contact with the outer surface of the adjacent inner tube 14. Thus, the first unit 16a and the second unit 16b, which are thermally bonded, are respectively configured.

  The first unit 16a and the second unit 16b are arranged such that the flat surfaces 24 and 24 on the side to which the electronic components (heating elements) of the respective units are attached are outside, that is, the first unit 16a and the second unit 16b. The flat surface 18 of the unit 16a and the flat surface 18 of the second unit 16b are overlapped so as to face each other at a predetermined interval. In addition, a heat insulating material 20 having a predetermined thickness is inserted into such a gap so that thermal interference does not occur between the first unit 16a and the second unit 16b. Moreover, as the heat insulating material 20, for example, rock wool which is one of general heat insulating materials is used.

  In addition, the first and second units 16a and 16b that are overlapped are reduced in diameter at the corresponding ends of the respective outer tubes 12 and 12, and are bent into a U shape. By being set to 22, they are connected in series (see FIG. 1). As shown in FIG. 3, the seven inner pipes 14 inserted and arranged in the outer pipe 12 are open at both ends in the outer pipe 12, and the outer pipe 12 is reduced in diameter. By being arranged inside the end portion to be formed, a gap portion formed between the inner peripheral surface of the outer tube 12 and the outer peripheral surface of the inner tube 14 serving as a coolant flow path or the inner tube 14 is formed. Are connected to each other in the reduced diameter portion (return flow path portion 22). In addition, headers 23 and 23 are attached to the other corresponding ends of the outer pipes 12 and 12 in the first and second units 16a and 16b, respectively, The other one is structured to be connected to the downstream flow path of the coolant.

  Further, in the cooling unit 10 having such a structure, the superposed flat surfaces 24 and 24 positioned outside the first unit 16a and the second unit 16b have electrons such as an inverter as a heating element. The components 26 and 26 are attached, and a predetermined portion is formed in the outer tube 12, that is, in a gap formed between the inner peripheral surface of the outer tube 12 and the outer peripheral surface of the inner tube 14 or in the inner tube 14. By allowing the coolant to circulate, heat from the electronic component 26 is transmitted to the outer tube 12 and the inner tube 14 that are in close contact therewith, and the heat transmitted to the outer tube 12 and the inner tube 14 as such is also transmitted through the tube. By being transmitted to the circulating coolant, heat exchange is performed between the electronic component 26 and the coolant, so that the electronic component 26 is cooled.

  By the way, although the cooling unit 10 made into the structure according to this invention will be formed in accordance with various well-known methods, for example, the method as shown below will be employ | adopted advantageously. That is, first, one circular outer tube 12 having a predetermined size and a plurality of inner tubes 14 (in this case, seven units) constituting the first and second units 16a and 16b are prepared. After inserting a predetermined number of inner tubes 14 into the tube 12 and arranging them at a predetermined interval in the tube axis direction, an external force is applied to the outer wall surface of the outer tube 12 so that the outer tube 12 has a desired flat shape. The outer peripheral surface of each inner tube 14 is brought into close contact with the outer peripheral surface of the adjacent inner tube 14 and the inner peripheral surface of the outer tube 12 by being compressed and deformed. By performing this operation on the first and second units 16a and 16b forming portions in one outer tube 12, as shown in FIG. 4 (a) and FIG. 4 (b), 1 In the outer pipe 12, the flat portions 28a and 28b integrated with the seven inner pipes 14 are formed.

  Thereafter, as shown in FIG. 4C, the flat surfaces 18 and 18 of the flat-shaped portions 28a and 28b face each other while the small-diameter portion 28c connecting the two flat-shaped portions 28a and 28b is stretched. As shown in FIG. 4D, the flat surface 18 of the first unit 16a is obtained by bending the first unit 16a including the flat portion 28a and the second unit 16b including the flat portion 28b. Therefore, the cooling unit 10 having a shape in which the flat surface 18 of the second unit 16b and the flat surface 18 of the second unit 16b are opposed to each other with a predetermined interval is realized.

  By adopting such a method, work such as integration of the outer tube 12 and the inner tube 14 and brazing for connecting the first unit 16a and the second unit 16b in series is not necessary. The target cooling structure 10 can be formed only by a simple process such as compression deformation. In addition, when forming the 1st unit 16a and the 2nd unit 16b, it does not specifically limit as a means to apply external force to the outer tube | pipe 12, and to carry out compression deformation, For example, the drawing process by a diameter reducing die | dye It is possible to appropriately adopt various known means such as press working. Further, when the outer tube 12 is compressed and deformed, the inner tube 14 is also subjected to a deforming action, whereby the adjacent inner tubes 14 and the closeness between the inner tube 14 and the outer tube 12 are also advantageous. Can be increased.

  Therefore, in the cooling unit 10 having such a structure, the flow path through which the coolant flows is divided into two by the two units of the first unit 16a and the second unit 16b. Therefore, in the cooling structure of the two heating elements 26, the flow path cross-sectional area is advantageously reduced, and the flow rate of the cooling liquid can be increased. As a result, the cooling capacity can be improved.

  And since the heat insulation layer (20) is provided between the two units of the 1st unit 16a and the 2nd unit 16b which were divided into 2 in that way, the heat_generation | fever absorbed by one unit The temperature rise of the coolant due to the heat from the body 26 does not occur with respect to the coolant of the other unit, that is, the thermal interference that the temperature rise of one unit affects the other unit is suppressed. Therefore, the cooling capacity of the cooling unit 10 can be improved more advantageously.

  In addition, since the first unit 16a and the second unit 16b are connected in series so that the flow path of the coolant has a return flow path structure, the cooling unit is combined into one unit. Compared with the case of the linear flow path structure configured as described above, the length of the cooling unit in the direction in which the coolant flows can be reduced to ½ of the overall size of the cooling unit. This makes it possible to obtain a cooling device.

  Furthermore, in the cooling unit 10 having such a configuration, a plurality of (seven in this case) inner tubes 14 are provided so as to be in close contact with the inner peripheral surface of the outer tube 12 to which the electronic component 26 is attached. The heat of the electronic component 26 attached to the flat surface 24 of the outer tube 12 spreads over the entire tube wall of the outer tube 12 due to heat conduction, and the outer tube 12 Heat was transferred from the tube wall to the tube wall of the inner tube 14, and in this way, the heat transferred to the inner tube 14 as well as the outer tube 12 was introduced from the end of the outer tube 12. Heat exchange with the coolant will occur. In this way, not only the inner surface of the outer tube 12 but also the inner and outer surfaces of the inner tube 14 become heat transfer surfaces to the coolant, so that the heat transfer area to the coolant is effective. Therefore, it is possible to increase the cooling capacity and to exhibit a high cooling capacity.

  As the outer tube 12 used to form the first unit 16a and the second unit 16b constituting the cooling unit 10, a tube body in which at least one flat outer peripheral surface is formed in advance, It is possible to use a tubular body formed into a shape, but by using a tubular body having a simple circular cross-sectional shape and applying an external force to the outer wall surface as described above, simultaneously with the close contact with the inner tube 14 It would be advantageous to employ a flat surface (18, 24) on the outer surface.

  In addition, as the pipe material of the outer pipe 12 and the inner pipe 14 constituting such a cooling unit 10, here, copper or a copper alloy having a good heat transfer property is adopted. It has been further improved. In addition to such copper and copper alloy, the cooling unit 10 may be configured by using aluminum or aluminum alloy having good workability. In addition, the advantage that the cooling unit 10 can be manufactured at low cost is also exhibited.

  The automotive electronic component cooling apparatus according to the present invention connects a plurality of such cooling units 10 as shown in FIG. 1 in parallel as shown in FIGS. 5 (a) and 5 (b). Or, as shown in FIG. 5 (c), it is configured by connecting in series, but further, cooling in a form in which these serial connection and parallel connection are combined. Of course, it is also possible to use an apparatus. In this way, by connecting a plurality of cooling units 10 in the series direction or the parallel direction, it is possible to further improve the cooling performance and to cool a larger area. Is appropriately selected according to the performance and size of the target cooling device.

  As described above, one of the representative embodiments of the present invention has been described in detail. However, this is merely an example, and the present invention is not limited by the specific description according to such an embodiment. It should be understood that this is not to be construed as limiting.

  For example, the number of the inner pipes 14 that are inserted into the outer pipe 12 and are closely arranged is not limited to the seven illustrated, but depends on the thickness of the outer pipe 12 and the inner pipe 14 that are used. An appropriate number can be selected.

  Further, in this embodiment, rock wool is adopted as the heat insulating material 20 inserted and arranged in the gap between the first unit 16a and the second unit 16b. Various heat insulating materials to be used are appropriately selected and used. In addition to adopting such a heat insulating material, an air layer may be provided by setting the width of the gap as a space having an appropriate size. That is, it is possible to suppress thermal interference between the first unit 16a and the second unit 16b by exerting a heat insulating effect by an air layer having a predetermined volume, and when a heat insulating material is inserted into the gap The same effect can be demonstrated.

  Furthermore, in the exemplary cooling unit 10, the return flow path portion 22 that connects the first unit 16 a and the second unit 16 b in series includes the outer tube 12 that constitutes the first and second units. Is reduced in diameter and bent into a U shape, and is integrally formed. However, the return flow path portion does not have to be integrally formed. For example, it is formed separately. There is no problem even if the first unit 16a and the second unit 16b are connected in series using the return flow path member (22).

  Furthermore, the header provided in the edge part on the opposite side to the side in which the return flow path part 22 which connects the 1st unit 16a and the 2nd unit 16b which comprise such a cooling unit 10 is formed. 23, the header 23 formed separately is provided at the end of each unit, and the outer pipes 12 constituting the units are deformed so that the first units 16a are provided. Alternatively, it may be formed integrally with the second unit 16b.

  In addition, although not listed one by one, the present invention is implemented in a mode to which various changes, modifications, improvements and the like are added based on the knowledge of those skilled in the art. It goes without saying that any one of them falls within the scope of the present invention without departing from the spirit of the invention.

  In the following, one of the representative embodiments of the present invention will be shown to clarify the features of the present invention. However, the present invention is not restricted by the description of such embodiments. It goes without saying that it is not a thing.

First, in order to form a cooling unit constituting a cooling device having a structure according to the present invention, a large-diameter outer tube (12) having a thickness of 1 mm, each made of phosphorous deoxidized copper, and a thickness of An inner tube (14) having a small diameter of 0.4 mm was prepared. Next, after inserting the seven inner pipes (14) into the outer pipe (12), the outer pipe 12 and the inner pipe 14 are brought into close contact with each other, as shown in FIG. 1 and FIG. Flat first and second units (16a, 16b) were formed. After that, the two units are connected in series with the flat surfaces on the side where the electronic component (26) is attached being overlapped so that they are outside, and the two units are insulated between the opposing flat surfaces. Rock wool was sandwiched as the material (20) to form a cooling unit (10) having a structure according to the present invention, which was used as an example. In addition, the width (W) in the left-right direction in FIG. 2 of the outer tube 12 formed into a flat shape is 47 mm, the thickness (T ₀ ) in the vertical direction per unit is 8 mm, and the two units are overlapped. The thickness (T) in the vertical direction of the cooling unit (10) was 17.25 mm. In addition, rock wool as a heat insulating material sandwiched between these two units had a thermal conductivity of 0.04 W / (m · k) and a thickness of 1.25 mm.

Since the coolant flow path cross-sectional area in the cross section of the cooling unit 10 obtained in this way is 210 mm ² per unit, the total of the two units is 420 mm ² , and the area of the heat transfer surface is the cooling unit 10. The length was 71709 mm ² per 100 mm.

  On the other hand, as a cooling unit having a conventional structure, similarly to the first embodiment, an outer tube 32 having a thickness of 1 mm made of phosphorous deoxidized copper and an inner tube 34 having a thickness of 0.4 mm are used. After the 14 inner tubes 34 are prepared and inserted into the outer tube 32, pressing is performed to form two flat surfaces 36, 36 to which electronic components are attached, and the outer tube 32, the inner tube 34, Were made close to each other, and a cooling unit 30 having a cross section as shown in FIG. 6 was manufactured, which was used as a comparative example. The width (W) in the left-right direction in FIG. 6 of the outer tube 32 formed into a flat shape was 47 mm, and the thickness (T) in the vertical direction was 14 mm.

Moreover, the coolant flow path cross-sectional area in the cross section of the cooling unit 30 obtained in this way was 427 mm ² , and the area of the heat transfer surface was 62970 mm ² per 100 mm of the length of the cooling unit 30.

  In the cooling units (10, 30) of Examples and Comparative Examples prepared as described above, six electronic components are attached to the flat surfaces of the outer surfaces, respectively, while water as a cooling liquid is supplied at 8 L / A cooling performance measurement test was performed in which the electronic component was cooled by flowing at a flow rate of min and the change in the surface temperature of the electronic component was measured.

  As a result, in the cooling unit of the example, it was confirmed that the surface temperature of the electronic component can be reduced by 10K, although the thickness of the cooling unit is slightly larger by 1.23 times than the cooling unit of the comparative example. .

It is explanatory drawing which shows an example of the cooling unit which comprises the cooling device of the electronic component for motor vehicles according to this invention, Comprising: (a) is the perspective explanatory drawing, (b) is the front explanatory drawing. It is AA cross section explanatory drawing in FIG.1 (b). It is BB sectional explanatory drawing in FIG.1 (b). It is explanatory drawing which shows an example of the process which manufactures the cooling unit which comprises the cooling device of the electronic component for motor vehicles according to this invention, Comprising: (a) is the state which deform | transformed the outer tube into the flat shape and integrated with the inner tube (B) is a front explanatory view showing a small-diameter portion connecting two flat-shaped portions in the state of (a), and (c) is a diagram illustrating the small-diameter portion. It is front explanatory drawing which shows a mode that a bending process is performed while extending | stretching, (d) is front explanatory drawing which shows a mode that it processed to the state where the flat shape part was piled up. It is explanatory drawing which shows the example of the preferable aspect of the cooling device of the electronic component for motor vehicles according to this invention, Comprising: (a) is front explanatory drawing which shows an example of a mode that the some cooling unit was connected in parallel, ( (b) is a plane explanatory view of the parallel connection form of the cooling units shown in (a), and (c) is a front explanatory view showing an example of a state in which a plurality of cooling units are connected in series. It is sectional explanatory drawing which shows an example of the cooling unit of the electronic component for motor vehicles according to the conventional structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Cooling unit 12 Outer tube 14 Inner tube 16a 1st unit 16b 2nd unit 18 Flat surface 20 Heat insulating material 22 Return flow path part 23 Header 24 Flat surface 26 Electronic component

Claims (5)

With respect to the outer tube having a flat shape, a plurality of inner tubes are inserted and closely arranged in a row, and the outer peripheral surface of the inner tube is in close contact with the inner peripheral surface of the outer tube, On one of the flat surfaces given by the flat shape of the outer tube, a predetermined automobile electronic component is attached, while a cooling liquid is formed in the inner tube and the entire gap between the inner tube and the outer tube. The first unit and the second unit are configured so as to be circulated, and the first unit and the second unit are connected in series at a return channel at a corresponding one end of each outer pipe. It is composed of a plurality of cooling units structured to be connected to each other, and these cooling units are provided at headers serving as coolant inflow / outflow ports at the corresponding other end portions of the outer pipes in the first and second units, respectively. Not connected in series or in parallel In the automotive cooling system for electronic components structure,
The first unit and the second unit in the cooling unit are overlapped with each other such that the flat surface of the outer tube on the side to which the electronic component is attached is outside, and the first unit and An automotive electronic component cooling device, wherein a heat insulating layer is interposed between the flat surfaces of the outer tube facing the second unit.   The automotive electronic component cooling device according to claim 1, wherein the heat insulating layer is an air layer constituted by a space having a predetermined gap.   The cooling device for an automotive electronic component according to claim 1, wherein the heat insulating layer is a heat insulating material layer having a predetermined thickness.   4. The automotive electronic component cooling device according to claim 1, wherein each of the outer tube and the inner tube is made of copper or a copper alloy. 4. The automotive electronic component cooling device according to claim 1, wherein the outer tube and the inner tube are each made of aluminum or an aluminum alloy.

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