JP2010079429A - Production device for non-contact ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a production device for a non-contact IC card allowing smooth carriage between each pair of heating rollers, and equalizing a thickness. <P>SOLUTION: This production device for the non-contact IC card has at least two pairs of heating rollers 27 pinching an IC card laminate body, melting a first hot-melt layer and a second hot-melt layer to bond an inlet sheet, and a front face side base material and a rear face side base material, and disposed at a prescribed interval. A plurality of strip-like reception guides 34 disposed below the carried IC card laminate body are provided in a width direction, between each pair of the heating rollers 27. Strip-like press guides 35 guiding the IC card laminate body between the strip-like press guides 35 and the reception guides 34, disposed above the carried IC card laminate body are provided between each pair of the heating rollers 27. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a non-contact IC card manufacturing apparatus capable of uniformly manufacturing a non-contact IC card having an inlet sheet configured by connecting an IC chip to a conductor functioning as an antenna.

  In recent years, contactless IC cards that communicate with external devices such as readers / writers in a contactless manner are becoming popular. The demand for non-contact IC cards is expected to expand rapidly in the future, and accordingly, it is strongly desired to manufacture high-quality non-contact IC cards at low cost. .

  The non-contact IC card includes a first base material, a surface-side base material including a first adhesive layer provided on one surface of the first base material, a second base material, and one of the second base materials. The back side base material containing the 2nd adhesive bond layer provided in the surface is provided. Also, an inlet sheet including an inlet base material, an IC chip provided on the inlet base material, and an antenna provided corresponding to the IC chip is provided between the front surface side base material and the back surface side base material. (For example, refer to Patent Document 1).

When manufacturing a non-contact IC card having such a configuration, first, an adhesive is applied to one surface of the surface-side substrate to form a first adhesive layer, and one of the back-side substrate is formed. An adhesive is applied to the surface to form a second adhesive layer. Next, the front side substrate, the inlet sheet, and the back side substrate are laminated to produce an IC card laminate, and the first adhesive layer and the second adhesive layer are melted by at least two pairs of heating rollers. The front surface side substrate and the inlet sheet and the inlet sheet and the back surface side substrate are bonded. Then, the 1st adhesive bond layer of the surface side base material and the 2nd adhesive bond layer of the back surface side base material are hardened by carrying out cooling pressurization.
JP 2003-162697 A

  However, when the inlet sheet is bonded to the front surface side base material and the back surface side base material by each pair of heating rolls in this way, when the rotation speed of each heating roll is different, or between the upper heating roll and the IC card laminate The friction between the two and the friction between the lower heating roll and the IC card laminate may be different, or the layer configuration of the laminate may not be symmetric with respect to the central antenna. In this case, since the first adhesive layer and the second adhesive layer are melted by the heating roll and have fluidity, the front side substrate or the back side substrate is displaced from the inlet sheet, and the IC There is a problem that the card stack is warped.

  For example, as shown in FIG. 7A, the rotation speed of the upper heating roll 40 is equal to the rotation speed of the lower heating roll 40, and between the surface of the IC card laminate 41 and the upper heating roll 40. And the friction between the back surface of the IC card laminated body 41 and the lower heating roll 40 are equal, and the layer structure of the laminated body is symmetrical with respect to the central antenna, the IC fed from the pair of heating rolls 40 The card laminated body 41 is not warped and the thickness thereof is kept uniform. However, as shown in FIG. 7A, the rotational speeds of the upper and lower heating rolls 40 are equalized, and the friction between the IC card laminate 41 and the upper and lower heating rolls 40 is equalized. Have difficulty. For this reason, the IC card laminated body 41 may be warped as described below.

  That is, as shown in FIG. 7B, when the rotation speed of the upper heating roll 40 is larger than the rotation speed of the lower heating roll 40, or between the surface of the IC card laminate 41 and the upper heating roll 40. When the friction between them is larger than the friction between the back surface of the IC card laminated body 41 and the lower heating roll 40, the IC card laminated body 41 delivered from the pair of heating rolls 40 warps downward. Moreover, as shown in FIG.7 (c), when the rotational speed of the lower heating roll 40 is larger than the rotational speed of the upper heating roll 40, or the back surface of the IC card laminated body 41 and the lower heating roll 40 When the friction between them is larger than the friction between the surface of the IC card laminated body 41 and the upper heating roll 40, the IC card laminated body 41 delivered from the pair of heating rolls 40 warps upward. This problem is particularly caused when the first base material of the front surface side base material and the second base material of the back surface side base material are thin, or when the adhesive forming the first adhesive layer and the second adhesive layer is used. It tends to be prominent when it is made of a material whose viscosity is remarkably lowered at high temperatures.

  When warping occurs in the IC card laminate in this way, it is difficult to transport this IC card laminate between the next heating rolls arranged on the downstream side. It will be conveyed between the heating rolls of a downstream side in the state by which the part of the direction side was folded. For this reason, it becomes difficult to smoothly convey the IC card laminate between each pair of heating rolls.

  On the other hand, in order to deal with such a problem, as shown in FIG. 8, three pairs of heating rolls 40 and a pair of heating rollers 40 provided between each pair of heating rollers 40 are disposed below the IC card laminated body 41 to be conveyed. A non-contact IC card manufacturing apparatus having a guide 42 having a width corresponding to the width of the IC card laminated body 41 is known. In such a non-contact IC card manufacturing apparatus, when the IC card laminated body 41 is transported between each pair of heating rollers 40, the IC card laminated body 40 is guided by a guide 42. However, in this case, the IC card laminated body 41 contacts the guide 42 over substantially the entire width of the IC card laminated body 41. As a result, the heat of the IC card laminated body 41 heated by the heating roller 40 is taken away by the guide 42, and the temperature in the IC card laminated body 41 may become uneven.

  Here, as described above, the first adhesive layer and the second adhesive layer are heated and melted by the heating roller. Accordingly, when the temperature of the IC card laminated body becomes non-uniform in this molten state, a part of the viscosity of the adhesive forming the first adhesive layer and the second adhesive layer increases. In this case, the thickness of the IC card laminated body becomes non-uniform, and it becomes difficult to make the thickness of the non-contact IC card uniform.

  The present invention has been made in consideration of the above points, and can make the conveyance between each pair of heating rollers smooth and make the thickness uniform. The purpose is to provide.

  The present invention includes a first base material, a surface-side base material including a first hot melt layer formed by applying a fluid hot melt to one surface of the first base material, a second base material, A back side substrate including a second hot melt layer formed by applying a fluid hot melt to one surface of the second substrate, and interposed between the front side substrate and the back side substrate. In a non-contact IC card manufacturing apparatus for manufacturing a non-contact IC card by sandwiching and heating an IC card laminate having an inlet sheet, the first hot melt layer and The second hot melt layer is melted to adhere the inlet sheet to the front surface side base material and the back surface side base material, and at least two pairs of heating rollers disposed at a predetermined interval, and between each pair of heating rollers, A plurality are provided in the width direction and conveyed. A plurality of strip-shaped receiving guides arranged below the C card laminated body and a pair of heating rollers are provided in the width direction, arranged above the IC card laminated body to be conveyed, and between the receiving guides An apparatus for manufacturing a non-contact IC card, comprising: a band-shaped restraining guide for guiding an IC card laminated body.

  In the present invention, the inlet sheet has an inlet base, a plurality of IC chips provided on the inlet base, and an antenna provided corresponding to each IC chip. The area other than the area corresponding to the non-contact IC card in the IC card laminated body in which the inlet sheet, the front surface side base material, and the back surface side base material are bonded to each other. An apparatus for manufacturing a non-contact IC card.

  The present invention is the contactless IC card manufacturing apparatus, wherein each receiving guide is arranged in an area other than the area corresponding to the contactless IC card in the IC card stack.

  The present invention is the contactless IC card manufacturing apparatus, wherein each receiving guide has a large number of protrusions formed on the surface on the IC card laminate side.

  The present invention is a non-contact IC card manufacturing apparatus, characterized in that the surface of each restraining guide on the side of the IC card laminate is coated with a low friction material.

  The present invention is the non-contact IC card manufacturing apparatus, wherein each holding guide is made of polyetheretherketone.

  The present invention is a non-contact IC card manufacturing apparatus characterized in that a plurality of rollers that are in rolling contact with the back side base material are provided between each pair of heating rollers and below the IC card laminate. .

  According to the present invention, between each pair of heating rollers, a plurality of strip-shaped receiving guides arranged below the IC card laminate to be conveyed are provided in the width direction, and arranged above the IC card laminate. A plurality of strip-shaped holding guides are provided in the width direction, and the IC card stack is guided between each receiving guide and each holding guide. For this reason, it can prevent that an IC card laminated body warps, and can convey an IC card laminated body smoothly.

  In addition, according to the present invention, as described above, each receiving guide and each holding guide are formed in a band shape, thereby reducing the contact area between each receiving guide and each holding guide and the IC card laminate. Can do. For this reason, it can suppress that the heat | fever of the IC card laminated body heated by each heating roller is transmitted to each receiving guide and each holding guide. For this reason, it can suppress that the temperature of an IC card laminated body becomes non-uniform | heterogenous. As a result, the thickness of the IC card laminate can be made uniform, and a non-contact IC card having a uniform thickness can be manufactured.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG. 6 are diagrams showing an embodiment of a non-contact IC card manufacturing apparatus according to the present invention. Among these, FIG. 1 is a diagram showing a cross-sectional configuration of a non-contact IC card manufactured by the non-contact IC card manufacturing apparatus according to the embodiment of the present invention, and FIG. FIG. 3 is a perspective view showing an example of an inlet sheet of a non-contact IC card manufactured by a contact IC card manufacturing apparatus, and FIG. 3 is a schematic diagram showing a non-contact IC card manufacturing apparatus in an embodiment of the present invention. . 4A is a front view showing details of the bonding means in the non-contact IC card manufacturing apparatus according to the embodiment of the present invention, and FIG. 4B is a top view of FIG. FIG. FIG. 5 is a perspective view showing an IC card laminated body produced by the non-contact IC card manufacturing apparatus in the embodiment of the present invention, and FIG. 6 (a) is a non-view in the embodiment of the present invention. FIG. 6B is a diagram showing a state in which the conveyance direction side portion of the IC card laminate is conveyed between a pair of upstream heating rollers in the bonding means of the contact IC card manufacturing apparatus, and FIG. It is a figure which shows the state in which the body is conveyed between each pair of heating rollers.

  First, a non-contact IC card manufactured by the manufacturing apparatus according to the present invention will be described with reference to FIGS. Here, the contactless IC card can communicate with an external device such as a reader / writer in a contactless manner.

  As shown in FIG. 1, the non-contact IC card 1 is formed by applying a first base material 3 and a flowable hot melt 14 (see FIG. 3) to one surface of the first base material 3. A surface-side substrate 2 including a hot-melt layer 4, a second substrate 6, and a second hot-melt layer 7 formed by applying a flowable hot-melt 14 to one surface of the second substrate 6; The back side base material 5 containing is provided. In addition, as shown in FIGS. 1, 2, and 5, an inlet base 9 and a plurality of ICs provided on the inlet base 9 are provided between the front side base 2 and the back side base 5. An inlet sheet 8 including a chip 11 and an antenna 10 provided corresponding to each IC chip 11 is provided.

  As shown in FIG. 2, the IC chip 11 is formed in a rectangular parallelepiped shape, and the thickness of the IC chip 11 is, for example, 150 μm to 300 μm. The IC chip 11 includes a memory for recording information, and an external device (reader / writer or the like) reads information recorded on the IC chip 11 via the antenna 10 or IC via the antenna 10. New information can be written on the chip 11. And the circuit wiring for expressing such a function of the non-contact IC card 1 is written in the IC chip 11.

  As shown in FIG. 2, the antenna 10 is formed in a substantially coil shape on the inlet base material 9 and is electrically connected to the IC chip 11. In the present embodiment, an example in which the antenna 10 is formed in a substantially coil shape is shown, but the present invention is not limited to this.

  The antenna 10 can be transferred by, for example, applying conductive ink onto the inlet base material 9 using a screen printing machine, or punching and transferring a conductive foil made of copper, aluminum, or the like onto the inlet base material 9. Or by etching the conductive foil made of copper, aluminum or the like laminated on the inlet base material 9 and patterning it into a desired shape, etc. it can.

  Moreover, the 1st base material 3 of the surface side base material 2, the 2nd base material 6 of the back surface side base material 5, and the base material 9 for inlets of the inlet sheet 8 consist of PET film, paper, etc.

  The first hot melt layer 4 and the second hot melt layer 7 are both formed thicker than the thickness of the IC chip 11 of the inlet sheet 8. The fluid hot melt 14 that forms the first hot melt layer 4 and the second hot melt layer 7 is made of a moisture-curing urethane resin.

  Next, the manufacturing apparatus 20 of the non-contact IC card 1 will be described with reference to FIG. The non-contact IC card 1 manufacturing apparatus 20 includes a first adhesive applying means 21 for applying the fluid hot melt 14 to one surface of the first base 3 of the front side base 2, and the back side base 5. A second adhesive applying means 22 for applying the fluid hot melt 14 is provided on one surface of the second substrate 6. The non-contact IC card 1 manufacturing apparatus 20 is disposed downstream of the first adhesive application unit 21 and the second adhesive application unit 22, and is an inlet sheet between the front surface side substrate 2 and the back surface side substrate 5. IC card stacking by partially joining the first hot-melt layer 4 and the second hot-melt layer 7 disposed on the downstream side of the stacking means 23 and the stacking means 23 for producing the IC card laminate 12 with 8 interposed Temporary joining means 24 for temporarily joining the body 12 is provided. Among these, the temporary joining means 24 is composed of the ultrasonic welder 25, but is not limited to the ultrasonic welder 25, and a thermocompression bonding machine 29, an adhesive material applying machine 30, or an adhesive material applying machine 31 may be used. The non-contact IC card 1 manufacturing apparatus 20 is disposed on the downstream side of the temporary joining means 24, melts the IC card laminated body 12, adheres the front side substrate 2 and the inlet sheet 8, and back surface Adhesive means 26 for adhering the side substrate 5 and the inlet sheet 8 is provided. Further, a cooling and pressurizing unit 32 for cooling and pressurizing the bonded IC card laminated body 12 is provided on the downstream side of the bonding unit 26. The cooling and pressurizing means 32 includes a pair of cooling blocks 33 that sandwich the IC card laminate 12. Further, a cutting unit 28 is provided on the downstream side of the cooling and pressing unit 32 to cut the bonded IC card laminate 12 for each IC chip 11 and antenna 10.

  Of these, the bonding means 26 will be described in detail. As shown in FIGS. 3 and 4 (a) and 4 (b), the adhesive means 26 sandwiches the IC card laminate 12 and melts the first hot melt layer 4 and the second hot melt layer 7 to thereby introduce the inlet. The sheet 8 is bonded to the front surface side base material 2 and the back surface side base material 5 and has two pairs of heating rollers 27 arranged at a predetermined interval. Each pair of heating rollers 27 is disposed above and below the IC card laminate 12. Further, two strip-shaped receiving guides 34 are provided between the pair of heating rollers 27 in the width direction of the IC card laminated body 12 and are arranged below the IC card laminated body 12 to be conveyed. Furthermore, between the pair of heating rollers 27, two strip-shaped restraining guides 35 are provided in the width direction, which are arranged above the IC card laminated body 12 to be conveyed. Each receiving guide 34 and each holding guide 35 are formed in a band shape with the conveying direction as a longitudinal direction between each pair of heating rollers 27, and can prevent heat from being transmitted from the IC card laminate 12. It has a width.

  Each receiving guide 34 and each holding guide 35 are inclined at upstream end portions 34a and 35a and downstream end portions 34b and 35b, as shown in FIG. Thereby, the IC card laminated body 12 conveyed from between the heating rollers 27 on the upstream side can be smoothly guided. The receiving guides 34 and the holding guides 35 do not have to be inclined in the vicinity of the downstream end portions 34b and 35b.

  Further, as shown in FIG. 4 (b), each holding guide 35 is cut by the cutting means 28 in the IC card laminate 12 in which the inlet sheet 8, the front surface side base material 2, and the back surface side base material 5 are bonded. It is a region other than the region corresponding to the non-contact IC card 1 obtained in this way, and is disposed on both ends in the width direction of the IC card laminate 12 (see FIG. 6B). Further, each holding guide 35 is configured to be movable in the width direction corresponding to various widths of the IC card laminated body 12. This makes it possible to easily cope with the widths of different IC card laminates 12.

  Each receiving guide 34 has a large number of protrusions on the surface of the IC card laminate 12 side. In particular, as a material used for each receiving guide 34, it is preferable to use a striped steel plate having a large number of protrusions formed on the surface. As a result, the contact area between the IC card laminate 12 and each receiving guide 34 can be reduced, and heat from the IC card laminate 12 to each receiving guide 34 can be suppressed.

  Each holding guide 35 is coated with a low friction material on the surface on the IC card laminate 12 side. It is preferable to use Teflon (registered trademark) as the low friction material. Thereby, the friction between the IC card laminated body 12 and each holding guide 35 can be reduced, and the IC card laminated body 12 can be smoothly conveyed between each pair of heating rolls 27.

  Moreover, as a material used for each restraining guide 35, it is preferable to use polyether ether ketone (PEEK). Here, the IC card laminated body 12 is heated to about 120 ° C. at the maximum by each pair of heating rollers 27. For this reason, by using polyether ether ketone for each restraining guide 35, each restraining guide 35 can endure the heat which IC card laminated body 12 has.

  Also, as shown in FIGS. 4A and 4B, a plurality of rollers 36 that are in rolling contact with the back-side substrate 5 are provided between each pair of heating rollers 27 and below the IC card laminate 12. It has been. More specifically, each roller 36 is rotatably connected to a fixed member 38 via a corresponding roller shaft 37, and three rollers are arranged in a row in the transport direction. Three rows are formed in the width direction. Moreover, as a material used for this roller 36, it is suitable to use polyetheretherketone (PEEK). Accordingly, each roller 36 can withstand the heat of the IC card laminate 12.

  Next, the operation of the present embodiment having such a configuration, that is, a method for manufacturing the non-contact IC card 1 using the non-contact IC card manufacturing apparatus 20 according to the present embodiment will be described.

  First, as shown in FIGS. 1 and 3, a first base 3 and a first hot melt layer 4 formed by applying a fluid hot melt 14 to one surface of the first base 3 are included. The surface side base material 2 is prepared. In this case, first, as shown in FIG. 5, a first base 3 having a size capable of producing a multi-row, multi-stage non-contact IC card 1 is prepared. In FIG. 5, the 1st base material 3 has a magnitude | size which can produce the non-contact IC card 1 of 2 rows x 3 steps = 6 sheets. In the present embodiment, the so-called single-wafer first base material 3 is not a method in which the winding core around which the base material is wound rotates to continuously supply a single sheet-like base material extending in a strip shape. Prepare. As a result, a small-lot non-contact IC card 1 can be easily manufactured. Note that the number of non-contact IC cards 1 that can be produced for one surface-side substrate 2 is not limited to six.

  Next, the flowable hot melt 14 made of a moisture curable urethane resin is applied to the back surface of the first base material 3 by the first adhesive application means 21. In this case, the thickness of the first hot melt layer 4 formed by applying the fluid hot melt 14 is made larger than the thickness of the IC chip 11. Thereby, the surface of the non-contact IC card 1 can be flattened without being affected by the uneven shape of the inlet sheet 8.

  Next, as shown in FIG. 1 and FIG. 3, a second base 6 and a second hot melt layer 7 formed by applying a flowable hot melt 14 to one surface of the second base 6. The back side substrate 5 including is prepared. In this case, first, in the same manner as the surface side base material 2, as shown in FIG. 5, it is substantially the same as the first base material 3 having a size capable of producing a multi-row non-contact IC card 1 as shown in FIG. The 2nd base material 6 of the magnitude | size is prepared. Next, the flowable hot melt 14 made of a moisture curable urethane resin is applied to the surface of the second base 6 by the second adhesive applying means 22. In this case, similarly to the first hot melt layer 4, the thickness of the second hot melt layer formed by applying the fluid hot melt 14 is made larger than the thickness of the IC chip 11. Thereby, the back surface of the non-contact IC card 1 can be flattened without being affected by the uneven shape of the inlet sheet 8.

  Next, as shown in FIGS. 2 and 3, the inlet base material 9, a plurality of IC chips 11 provided on the inlet base material 9, and the antenna 10 provided corresponding to each IC chip 11. An inlet sheet 8 including the above is prepared. In this case, first, an inlet base 9 having a size corresponding to the first base 3 and the second base 6 is prepared. Next, as shown in FIG. 2, the antenna 10 is formed on the inlet base material 9. At this time, six antennas 10 are formed on the inlet base 9 so that six non-contact IC cards 1 can be manufactured. As a means for forming the antenna 10 on the inlet base material 9, a screen printing machine for applying conductive ink on the inlet base material 9, or a conductive foil made of copper, aluminum or the like on the inlet base material 9. Or a transfer apparatus that transfers the pattern to a desired shape by etching a conductive foil made of copper, aluminum, or the like laminated on the inlet base material 9 can be used. If these means for forming an antenna are used, not only the inlet sheet 8 having a coiled antenna but also antennas having various shapes can be formed on the inlet sheet 8. Thereafter, IC chips 11 are attached corresponding to the respective antennas 10 formed on the inlet base material 9, whereby the antennas 10 are formed at six locations on the inlet base material 9, and six IC chips are provided. 11 is provided.

  Next, as shown in FIG. 3, the first hot melt layer 4 of the front surface side substrate 2 and the second hot melt layer 7 of the back surface side substrate 5 are cooled and solidified. By the way, when the fluid hot melt 14 made of a moisture-curable urethane resin is exposed to an air environment at room temperature or rapidly cooled, the tackiness is lost and solidifies in several seconds to several tens of seconds. As a result, the first hot melt layer 4 and the second hot melt layer 7 are exposed to the air environment for several seconds to several tens of seconds or cooled, and the first hot melt layer 4 and the second hot melt layer 7 are tacky. Solidify until lost.

  Next, as shown in FIG. 3, the IC card laminate 12 in which the inlet sheet 8 is interposed between the front surface side base material 2 and the back surface side base material 5 is produced by the laminating means 23. In this case, the front surface side base material 2, the back surface side base material 5, and the inlet sheet 8 are aligned. During this time, the first hot-melt layer 4 of the surface-side base material 2 has lost tackiness, so that even if the surface-side base material 2 and the inlet sheet 8 come into contact with each other, they are not joined. This makes it possible to easily and accurately produce the IC card laminate 12 while aligning the surface side base material 2 and the inlet sheet 8. Similarly, since the tackiness of the second hot melt layer 7 of the back surface side base material 5 is also lost, even if the back surface side base material 5 and the inlet sheet 8 come into contact with each other, they are not joined. This makes it possible to easily and accurately produce the IC card laminate 12 while aligning the back side base material 5 and the inlet sheet 8. By the way, as shown in FIG. 1, the IC chip 11 and the antenna 10 arranged on the inlet base material 9 are directed to the front surface side base material 2 side, but may be directed to the back surface side base material 5 side. .

  Next, as shown in FIG. 3, provisional joining means 24 is applied to the IC card laminate 12 to partially join the first hot melt layer 4 and the second hot melt layer 7. 12 is temporarily joined. In the present embodiment, the temporary joining means 24 includes an ultrasonic welder 25. In this case, the ultrasonic welder 25 is a region other than the non-contact IC card 1 obtained by cutting the front surface side base material 2 and the back surface side base material 5, and is applied in front of the IC card laminate 12. . As a result, a temporary joint (not shown) is formed in the IC card laminate 12. For this reason, the IC card laminated body 12 can be temporarily joined without leaving the unevenness | corrugation produced by temporary joining in the surface and back surface used as the area | region of the non-contact IC card 1 obtained by cutting.

  Next, as shown in FIG. 3, the temporarily bonded IC card laminate 12 is transported between the two pairs of heating rollers 27 constituting the bonding means 26, and the first hot melt layer 4 and the second hot melt layer are transported. The layer 7 is melted so that the front surface side substrate 2 and the inlet sheet 8 are bonded, and the back surface side substrate 5 and the inlet sheet 8 are bonded. In this case, first, as shown in FIG. 6A, the temporarily bonded IC card laminated body 12 is transported between the upstream heating rollers 27 of the two pairs of heating rollers 27.

  Here, in the present embodiment, as described above, the first hot melt layer 4 and the second hot melt layer 7 are in a state in which tackiness is lost. For this reason, until it heats with the two pairs of heating rollers 27, the surface side base material 2, the back surface side base material 5, and the inlet sheet 8 are not adhered. As a result, the first hot melt layer 4 and the second hot melt layer 7 are sequentially melted from the temporary joint portion provided in front of the IC card laminate 12 to the rear, and the front surface side substrate 2 and the back surface side. The base material 5 and the inlet sheet 8 are sequentially bonded. During this time, the air interposed between the front surface side base material 2 and the back surface side base material 5 and the inlet sheet 8 escapes backward. For this reason, it can prevent reliably that an air layer is formed between the surface side base material 2 and the back surface side base material 5, and the inlet sheet 8. FIG.

  Next, the IC card laminated body 12 heated by the upstream heating roller 27 is conveyed to the downstream heating roller 27. During this time, the IC card laminate 12 is guided by the receiving guides 34, the holding guides 35, and the rollers 36 provided between the pairs of heating rollers 27. Next, the IC card laminate 12 is heated by the downstream heating roller 27. In this way, the inlet sheet 8 is bonded to the front surface side base material 2 and the back surface side base material 3.

  Next, as shown in FIG. 3, the IC card laminate 12 is cooled and pressurized by the cooling and pressing means 32, and the first hot melt layer 4 and the second hot melt layer 7 are cured.

  Thereafter, the IC card laminate 12 subjected to cooling and pressurization is taken out from the cooling and pressurizing means 32 and left in an air environment for about two days. In this case, the flowable hot melt 14 made of a moisture-curable urethane resin is cured by crosslinking reaction by absorbing moisture in the air after being melted. As a result, the IC card laminate 12 can be left in an air environment for about two days, and the first hot melt layer 4 and the second hot melt layer 7 can be reliably cured. For this reason, during use of the non-contact IC card 1, the non-contact IC card 1 is not softened even when the non-contact IC card 1 is in a high temperature state.

  Next, as shown in FIG. 3, after the first hot melt layer 4 and the second hot melt layer 7 are completely cured, the IC card laminate 12 is cut by the cutting means 28 for each IC chip 11 and antenna 10. . As described above, individual contactless IC cards 1 can be obtained.

  As described above, according to the present embodiment, a plurality of strip-shaped receiving guides 34 disposed below the IC card laminated body 12 to be conveyed are provided between the pair of heating rollers 27 in the width direction. A plurality of strip-shaped holding guides 35 disposed above the card laminated body 12 are provided in the width direction, and the IC card laminated body 12 is guided between each receiving guide 34 and each holding guide 35. For this reason, it is possible to prevent the IC card laminated body 12 from warping and prevent the IC card laminated body 12 from being folded and conveyed to the heating roller 27 on the downstream side. As a result, the IC card laminated body 12 can be smoothly conveyed.

  Further, according to the present embodiment, as described above, each receiving guide 34 and each holding guide 35 are formed in a strip shape, and each receiving guide 34 is made of a striped steel plate having a large number of protrusions formed on the surface. Yes. Thereby, the contact area between each receiving guide 34 and each holding guide 35 and the IC card laminated body 12 can be reduced, and the heat of the IC card laminated body 12 heated by each heating roller 27 is applied to each receiving guide. 34 and each restraining guide 35 can be suppressed.

  Here, the first hot melt layer 4 and the second hot melt layer 7 heated by the heating roller 27 are in a molten state. For this reason, when the temperature of the IC card laminated body 12 becomes non-uniform, a part of the viscosity of the hot melt forming the first hot melt layer 4 and the second hot melt layer 7 is increased, and the thickness of the IC card laminated body 12 is increased. It becomes uneven. On the other hand, according to the present embodiment, as described above, the heat of the IC card laminated body 12 heated by each heating roller 27 is suppressed from being transmitted to each receiving guide 34 and each holding guide 35. . This can prevent the temperature of the IC card laminated body 12 from becoming uneven. For this reason, the thickness of the IC card laminated body 12 can be made uniform, and the non-contact IC card 1 with uniform thickness can be manufactured.

  Further, according to the present embodiment, each restraining guide 35 is an area other than the area corresponding to the non-contact IC card 1 obtained by cutting, and is arranged on both ends in the width direction of the IC card laminate 12. Has been. Thereby, each restraining guide 35 can be brought into contact with an area other than the area corresponding to the non-contact IC card 1 in the IC card laminated body 12. For this reason, it can suppress that the temperature of the area | region of the non-contact IC card 1 among the IC card laminated bodies 12 falls, and can make the thickness of the non-contact IC card 1 uniform.

  Further, according to the present embodiment, a plurality of rollers 36 that are in rolling contact with the back-side base material 5 are provided between each pair of heating rollers 27 and below the IC card laminate 12. Thereby, the IC card laminated body 12 can be smoothly conveyed from the heating roller 27 on the upstream side to the heating roller 27 on the downstream side.

  In the present embodiment, an example in which two pairs of heating rollers 27 are provided has been described. However, the number of heating rollers 27 is not limited to two, and three or more pairs of heating rollers 27 may be provided. In the present embodiment, two receiving guides 34 are provided below the IC card laminated body 12. However, the present invention is not limited to this, and for example, the receiving guide 34 is attached to the IC card laminated body 12. You may provide four below. In this case, it is preferable that two of the four receiving guides 34 are arranged so as to correspond to the holding guide 35. Thereby, the IC card laminated body 12 can be reliably guided.

Next, a modification of the non-contact IC card manufacturing apparatus according to the present invention will be described. In this modification, each receiving guide is arranged in an area other than the area corresponding to the non-contact IC card in the IC card laminate, and the other configuration is the first embodiment shown in FIGS. 1 to 6. The form is substantially the same.

  According to this modification, each receiving guide 34 is disposed in an area other than the area corresponding to the non-contact IC card 1 obtained by cutting the IC card laminated body 12. Thereby, each receiving guide 34 can be brought into contact with an area other than the non-contact IC card 1 in the IC card laminated body 12. For this reason, it can suppress that the temperature of the area | region of the non-contact IC card 1 among the IC card laminated bodies 12 falls, and can make the thickness of the non-contact IC card 1 uniform.

FIG. 1 is a diagram showing a cross-sectional configuration of a non-contact IC card manufactured by a non-contact IC card manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing an example of an inlet sheet of a non-contact IC card manufactured by the non-contact IC card manufacturing apparatus according to the embodiment of the present invention. FIG. 3 is a schematic diagram showing a non-contact IC card manufacturing apparatus according to an embodiment of the present invention. Fig.4 (a) is a front view which shows the detail of an adhesion | attachment means among the manufacturing apparatuses of the non-contact IC card in embodiment of this invention. FIG. 4B is a top view of FIG. FIG. 5 is a perspective view showing an IC card laminated body manufactured by the non-contact IC card manufacturing apparatus according to the embodiment of the present invention. FIG. 6A shows a state in which the conveyance direction side portion of the IC card laminate is conveyed between a pair of upstream heating rollers in the bonding means of the non-contact IC card manufacturing apparatus according to the embodiment of the present invention. FIG. FIG. 6B is a diagram showing a state in which the IC card laminate is being conveyed between each pair of heating rollers. FIG. 7A is a diagram showing a case where no warp is formed in the IC card laminate between the heating rollers of the conventional non-contact IC card manufacturing apparatus, and FIG. FIG. 7C is a diagram illustrating a case where the IC card stack is warped upward. The figure which shows the heating roll part of the manufacturing apparatus of the conventional non-contact IC card.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC card 2 Surface side base material 3 1st base material 4 1st hot melt layer 5 Back surface side base material 6 2nd base material 7 2nd hot melt layer 8 Inlet sheet 9 Inlet base material 10 Antenna 11 IC chip 12 IC Card Laminate 20 Manufacturing Device 21 First Adhesive Application Unit 22 Second Adhesive Application Unit 23 Lamination Unit 24 Temporary Bonding Unit 25 Ultrasonic Welder 26 Adhesion Unit 27 Heating Roller 28 Cutting Unit 29 Thermocompression Press 30 Adhesive Application Machine 31 Adhesive material coating machine 32 Cooling and pressurizing means 33 Cooling block 34 Receiving guide 34a Upstream end 34b Downstream end 35 Holding guide 35a Upstream end 35b Downstream end 36 Roller 37 Roller shaft 38 Fixed member 40 Heating roll 41 IC card laminate 42 Guide

Claims (7)

A surface-side substrate including a first substrate, and a first hot-melt layer formed by applying a fluid hot melt to one surface of the first substrate; a second substrate; and a second substrate A back side substrate including a second hot melt layer formed by applying a flowable hot melt to one side of the sheet, and an inlet sheet interposed between the front side substrate and the back side substrate, In a non-contact IC card manufacturing apparatus for manufacturing a non-contact IC card by sandwiching and heating an IC card laminated body having
While sandwiching the IC card laminate, the first hot melt layer and the second hot melt layer are melted to adhere the inlet sheet to the front surface side base material and the back surface side base material, and at least disposed at a predetermined interval. Two pairs of heating rollers;
Between each pair of heating rollers, a plurality of strips in the width direction, and a belt-shaped receiving guide disposed below the IC card laminate to be conveyed;
A plurality of strips in the width direction between each pair of heating rollers, disposed above the conveyed IC card laminate, and a belt-like holding guide for guiding the IC card laminate between the receiving guides An apparatus for manufacturing a non-contact IC card. The inlet sheet has an inlet base, a plurality of IC chips provided on the inlet base, and an antenna provided corresponding to each IC chip.
Each restraining guide is an area other than the area corresponding to the non-contact IC card in the IC card laminated body in which the inlet sheet, the front surface side base material, and the back surface side base material are bonded, and both ends in the width direction of the IC card laminated body The non-contact IC card manufacturing apparatus according to claim 1, wherein the non-contact IC card manufacturing apparatus is arranged on each side.   The non-contact IC card manufacturing apparatus according to claim 2, wherein each receiving guide is arranged in an area other than an area corresponding to the non-contact IC card in the IC card laminated body.   4. The non-contact IC card manufacturing apparatus according to claim 1, wherein each of the receiving guides has a plurality of protrusions formed on a surface of the IC card laminate.   The non-contact IC card manufacturing apparatus according to any one of claims 1 to 4, wherein a surface of each holding guide on the IC card laminated body side is coated with a low friction material.   6. The non-contact IC card manufacturing apparatus according to claim 1, wherein each holding guide is made of polyetheretherketone.   The non-contact according to any one of claims 1 to 6, wherein a plurality of rollers that are in rolling contact with the back-side base material are provided between each pair of heating rollers and below the IC card laminate. IC card manufacturing equipment.

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