JP2006051717A - Method of manufacturing laminate, method of manufacturing electronic information recording card, and apparatus for manufacturing laminate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent sheet materials from being partially contracted in the width direction when the sheet materials are continuously stuck together, and prevent the stuck sheet materials from being insufficient in adhesion, warped, distorted, or the like. <P>SOLUTION: The method of manufacturing a sheet laminate in which a first sheet and a second sheet are carried to be continuously stuck together while being coated with an adhesive, is characterised in that the carrying tension is kept at a specified value when the sheet materials are carried, or the intervals between nip rollers including laminate rollers are made to be smaller than the width of the sheet materials or smaller than the length of respective sheet materials in the carrying direction, or either the sheet materials or the thermoplastic adhesive is kept warm until they become 70°C or higher when the first sheet and the second sheet are stuck together by the laminate rollers, and the mutually stuck sheet materials are cooled down to 25°C or lower during the time when they pass the nip rollers. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

    The present invention relates to a laminate manufacturing method and laminate manufacturing apparatus for manufacturing a laminate formed by laminating a plurality of sheet materials via an adhesive layer, and an IC module having an IC chip and an antenna via an adhesive layer. The present invention relates to a method for manufacturing an electronic information recording card and an apparatus for manufacturing an electronic information recording card that are bonded together in a state where sheet materials are laminated in an enclosed configuration.

Conventionally, as a laminated body manufacturing method, it is disclosed by Unexamined-Japanese-Patent No. 6-115038, Unexamined-Japanese-Patent No. 8-76631, Unexamined-Japanese-Patent No. 11-157262, etc., for example, of the 1st sheet material and the 2nd sheet material There is one that manufactures a laminated body in which an adhesive is applied onto at least one sheet material to bond a first sheet material and a second sheet material. Further, methods for producing a non-contact IC card using an IC module are disclosed in JP-A-10-147087, JP-A-2001-325579, JP-A-2002-109499, and the like.
Japanese Patent Laid-Open No. 6-115038 (first to seventh pages, FIGS. 1 to 5) JP-A-8-76631 (first to fifth pages, FIGS. 1 to 6) JP-A-11-157262 (first to tenth pages, FIGS. 1 to 9) JP-A-10-147087 (first to fifth pages, FIGS. 1 to 4) JP 2001-325579 A (pages 1 to 22 and FIGS. 1 to 30) JP 2002-109499 A (pages 1 to 14 and FIGS. 1 to 8)

  In the non-contact IC card in which the IC module is bonded through the adhesive layer in this way, in the laminating section where the bonding is performed, the bonding is performed in an appropriate heat-retaining state in order to ensure the fluidity of the hot melt adhesive. There is. By the way, when pasting together, the wrinkle-like slip of a conveyance direction may generate | occur | produce immediately after the 1st sheet material and the 2nd sheet material are pasted together by the laminating roller. When such slippage occurs, adhesion failure of the bonded sheet material, warpage, distortion, and the like are generated, which causes poor appearance of the laminated body and the electronic information recording card.

  The present invention has been made in view of such points, and prevents the sheet material from slipping in the width direction during continuous bonding of the sheet material, and prevents adhesion failure, warpage, distortion, and the like of the bonded sheet material. It is an object of the present invention to provide a laminate manufacturing method, an electronic information recording card manufacturing method, and a laminate manufacturing apparatus.

  In order to solve the above-described problems and achieve the object, the present invention is configured as follows.

According to the first aspect of the present invention, the first sheet material and the second sheet are conveyed while the first sheet material and the second sheet material are conveyed and an adhesive is applied onto at least one of the sheet materials. In the sheet laminate manufacturing method for continuously bonding materials together,
It is a laminated body manufacturing method characterized by making conveyance tension at the time of conveying the sheet material 0.08 kgf / cm or less.

According to a second aspect of the present invention, the first sheet material and the second sheet are conveyed while the first sheet material and the second sheet material are conveyed and an adhesive is applied onto at least one of the sheet materials. In the sheet laminate manufacturing method for continuously bonding materials together,
At least one nip roller is provided after the laminating roller for laminating the first sheet material and the second sheet material, and a gap between the nip rollers including the laminating roller is set to be equal to or less than the sheet material width. It is a laminated body manufacturing method.

According to a third aspect of the present invention, the first sheet material and the second sheet are conveyed while conveying the first sheet material and the second sheet material and applying an adhesive on at least one of the sheet materials. In the sheet laminate manufacturing method for continuously bonding materials together,
At least one nip roller is provided after the laminating roller that bonds the first sheet material and the second sheet material, and the interval between the nip rollers including the laminating roller is set. The laminate manufacturing method is characterized in that the length of the sheet material of the sheet is equal to or less than the length in the sheet conveying direction.

The invention according to claim 4 is the first sheet material and the second sheet while conveying the first sheet material and the second sheet material and applying an adhesive on at least one of the sheet materials. In the sheet laminate manufacturing method for continuously bonding materials together,
The adhesive is a thermoplastic adhesive, and when the first sheet material and the second sheet material are bonded to each other with a laminating roller, the sheet material or the adhesive is kept at 70 ° C. or higher. Keep at least one of them warm,
It is conveyed by a nip roller provided at least one stage after the laminating roller, and the laminated sheet material is cooled to 25 ° C. or lower while passing through the nip roller. is there.

  In a fifth aspect of the present invention, a guide roller having a shape in which the diameter gradually increases from the end portion to the central portion is disposed upstream of the laminating roller that bonds the first sheet material and the second sheet material. The laminate manufacturing method according to any one of claims 1 to 4, wherein the sheet material is conveyed by the guide roller.

In the invention according to claim 6, a guide roller having a flange corresponding to the width of the sheet material to be conveyed is disposed upstream of a laminating row and the like for bonding the first sheet material and the second sheet material. And
The laminate manufacturing method according to any one of claims 1 to 4, wherein the sheet material is conveyed by the guide roller.

  According to the seventh aspect of the invention, an IC chip and an antenna are placed in the adhesive layer while conveying the first sheet material and the second sheet material and applying an adhesive on at least one of the sheet materials. 7. The method of manufacturing an electronic information recording card according to claim 1, wherein the IC module is encapsulated and bonded together in a stacked state.

According to an eighth aspect of the present invention, the first sheet material and the second sheet material are conveyed, and the first sheet material and the first sheet material are applied while applying a thermoplastic adhesive on at least one of the sheet materials. 2 is an apparatus for manufacturing a laminate that continuously bonds the sheet material of 2;
When the first sheet material and the second sheet material are bonded with a laminating roller, a heat retaining means for retaining at least one of the sheet material or the adhesive until the temperature becomes 70 ° C. or higher;
A cooling means for cooling the laminated sheet material to 25 ° C. or less while being conveyed by a nip roller provided at least one stage after the laminating roller and passing through the nip roller;
The said cooling means is a laminated body manufacturing apparatus using the cooling roller which circulated the cooling medium in the said nip roller, and having an air ejection apparatus which blows gas with respect to the said cooling roller.

  With the above configuration, the present invention has the following effects.

  According to the invention described in claim 1, by setting the conveyance tension when conveying the sheet material to 0.08 kgf / cm or less, an excessive conveyance tension is not applied to the laminated sheet material immediately after lamination. By preventing the occurrence of slippage in the sheet material and suppressing adhesion failure, warpage, and distortion, it is possible to prevent appearance defects and printing defects from occurring.

  According to the invention described in claim 2, at least one nip roller is provided after the laminating roller, and the interval between the nip rollers including the laminating roller is set to be equal to or smaller than the width of the sheet material. It is possible to prevent occurrence of defective appearance and defective printing by preventing the occurrence of slippage in the sheet material by making the nips uniform, and suppressing adhesion failure, warpage, and distortion.

  According to the invention described in claim 3, at least one nip roller is provided after the laminating roller, and the interval between the nip rollers including the laminating roller is set to be equal to or less than the length of the sheet material in the sheet conveyance direction. , Prevent creases that occur in the sheet material by making the nip of the laminated sheet material just after laminating uniform, and suppress poor adhesion, warpage, and distortion so as not to cause poor appearance and poor printing can do.

  According to the invention described in claim 4, the temperature is set to a high temperature at the time of laminating, and the conditions are set so that the bonding can be easily performed, and the adhesive is solidified in a state where no slippage occurs by rapidly cooling immediately after laminating. By suppressing warping and distortion, it is possible to prevent appearance defects and printing defects from occurring.

  According to the invention described in claim 5, the sheet material itself is easy to meander by reducing the sheet material conveyance tension and installing a large number of nip rollers. A guide roller having a shape gradually increasing from the end portion to the center portion is arranged, and the sheet material is conveyed by the guide roller to prevent the sheet material from being meandered.

  According to the sixth aspect of the present invention, the sheet material itself becomes easy to meander by reducing the conveying tension of the sheet material and installing a large number of nip rollers. However, the sheet material is conveyed upstream of the laminating roller. A guide roller having a flange corresponding to the width of the sheet material is disposed, and the sheet material is conveyed by the guide roller to prevent the sheet material from being meandered.

  According to the invention described in claim 7, while applying an adhesive on at least one sheet material, an IC module having an IC chip and an antenna is enclosed in an adhesive layer, and these are stacked. If the electronic information recording card that uses the IC module is stuck, the IC module in the adhesive layer is distorted, and communication failure due to disconnection of the antenna with the IC chip can be prevented. it can.

  According to the invention described in claim 8, when the first sheet material and the second sheet material are bonded together with a laminating roller, at least one of the sheet material or the adhesive is kept warm until the temperature becomes 70 ° C. or higher. The sheet material is conveyed by a nip roller provided at least one stage after the laminating roller, and the bonded sheet material is cooled to 25 ° C. or lower while passing through the nip roller. Condensation on the roller surface can be prevented when a cooling roller in which a cooling medium is circulated in the nip roller is used and gas is blown against the cooling roller to rapidly cool the nip roller.

  Embodiments of a laminate manufacturing method, an electronic information recording card manufacturing method, and a laminate manufacturing apparatus of the present invention will be described below. The embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.

  As an example of application to the laminate of the present invention, there is a use such as a card. Specifically, cards including business cards, nameplates, passports, examination cards, telephone cards, identification cards, driver's licenses, commuter passes, cash cards, IC cards, etc. Yes, and in many cases, they are carried around. Here, as an electronic information recording card, for example, an IC card is applied. For example, an example of an employee card of a company will be described, but the application example is not limited to this form.

  An IC card contains an IC module in a recess provided in a part of a base made of a synthetic resin such as a vinyl chloride resin. As described above, the IC card is contacted depending on the manner of electrical contact between the IC and an external circuit. There are types and non-contact types. However, if the contact terminal is exposed on the card surface as in the contact type, the contact surface may be deteriorated, the contact may be defective, and power supply to the IC card and data signal input / output may not be performed. .

  In view of this, an IC card having a configuration in which an electromagnetic wave is generated and / or received by an antenna coil for exchanging electrical signals in a non-contact manner has appeared.

  FIG. 1 is a plan view showing an example of such a contactless IC card having no metal terminal on the surface. In the figure, the IC card 1 is provided with an IC chip 2a and an IC module 2 having an antenna coil 2b as a signal transmission / reception unit for R / W (read / write). Since the IC chip 2a has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip. The key information section 3 is attribute identification information for identifying the IC card 1 and other cards, and is, for example, a code number assigned to the surface of the IC card 1. The character information section 4 is a name, a workplace, an issue date, and the like given to the surface of the IC card 1, and the image information section 5 is image information such as a face.

  FIG. 2 is a cross-sectional view schematically showing the layer configuration of the IC card. This is a configuration of an IC card 1 in which an IC module 2 having an IC chip 2a and an antenna coil 2b is enclosed in adhesive layers 6 and 7 interposed between a first sheet material 10 and a second sheet material 20.

  As the sheet material of the IC card 1 composed of the first sheet material 10 and the second sheet material 20, a sheet material such as resin or paper can be used. This sheet material is, for example, polyethylene terephthalate resin, polyethylene resin, polypropylene resin, acrylonitrile butadiene styrene copolymer resin, polyvinyl chloride resin, polyphenylene sulfide resin, polyimide resin, fine paper, matte paper, coated paper, synthetic paper, etc. It is. Further, the surface sheet portion may be subjected to easy adhesion treatment (primer application, corona discharge treatment, plasma treatment, etc.) in order to enhance the adhesion with the adhesive.

  The IC module is an intermediate inlet in which an antenna coil and an IC chip mounting portion are provided on a module base material, and may include a capacitor in some cases. As the inlet sheet, for example, an insulating plastic sheet having a thickness of about 10 to 100 μm and made of a resin such as epoxy, glass epoxy, polyimide, polycarbonate, PVC, PET, or ABS is generally used. Also, as a connection body between the IC chip and the antenna coil, a gold bump or nickel bump is used for the input / output terminal of the IC chip, and the antenna coil formed by winding a copper wire, for example, is directly connected. It is also possible to use a structure in which the two nonwoven fabric sheets having the properties are integrated with each other.

  For example, examples of the non-woven sheet member include a mesh woven fabric such as a non-woven fabric, and a plain woven fabric, a twill woven fabric, and a satin woven fabric. In addition, a fabric having pile called moquette, plush velor, seal, velvet, or suede can be used. Materials include polyamides such as nylon 6, nylon 66 and nylon 8, polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyvinyl alcohols, polyvinylidene chloride, polyvinyl chloride, polyacrylonitrile, acrylamide, methacryl Synthetic resins such as amide and other acrylics, polycyanide vinylidene, polyfluoroethylene, polyurethane, etc., natural fibers such as silk, cotton, wool, cellulose, cellulose ester, recycled fibers (rayon, acetate), aramid fibers The fiber which combined the 1 type (s) or 2 or more types chosen from among these is raised. Of these fiber materials, rayon that is preferably polyamide-based such as nylon 6 and nylon 66, acrylic-based such as polyacrylonitrile, acrylamide, and methacrylid, polyester-based such as polyethylene terephthalate, cellulose-based as recycled fiber, and cellulose ester-based And acetate and aramid fibers.

  Self-compression bonding means that when a compressive force is applied to a flexible substrate at room temperature or under heating, each fiber constituting the flexible substrate is bonded, and a plurality of flexible substrate materials are stacked to apply a compressive force. In some cases, the superimposed flexible substrate materials are bonded to each other. For example, when the fibers constituting the nonwoven fabric are coated with PET-G, the nonwoven fabric is pressed by heating at a temperature equal to or higher than the melting point of PET-G. The sheet material is self-bonded.

  Moreover, since the nonwoven fabric sheet material has compressibility in the thickness direction, when the nonwoven fabric sheet material is compressed in the thickness direction with the IC chip and antenna coil connection body interposed therebetween, the two nonwoven fabric sheets are compressed. Recesses for embedding connecting bodies are formed on the inner surface of the material, and the surface of the nonwoven fabric sheet material can be formed flat, producing information carriers such as non-contact IC cards with a flat surface and excellent aesthetics can do.

  The antenna coil is used to exchange data without contact with an external reader / writer. Its shape, number of turns, etc. are the size of the antenna coil on the receiving side, and how far away the radio waves are transmitted (communication distance) ), How much frequency radio waves are received (communication frequency) and the like.

  In addition, since the IC chip has a weak point pressure applied locally, it is preferable to have a metal reinforcing plate as a reinforcing structure in the vicinity of the IC chip or a ring-shaped reinforcing member around the IC chip.

  The thickness of the IC module is preferably 10 to 300 μm, more preferably 30 to 300 μm, still more preferably 30 to 250 μm.

  As the adhesive used in the present invention, for example, an epoxy two-component mixed type, a UV curable adhesive, a hot melt adhesive, preferably a moisture curable reactive hot melt adhesive is used. As the hot melt resin, ethylene vinyl copolymer resin, polyolefin, polyester, acrylamide, polyurethane and the like can be used. When the card substrate which is a laminate is easily warped, or when a layer susceptible to high-temperature processing such as an image receiving layer for image formation by thermal transfer is provided on the card surface, the image receiving layer is formed when the bonding temperature is too high. The temperature of the sheet material and the adhesive when pasting through an adhesive due to problems such as damage, thermal contraction of the sheet material, and deterioration of dimensions and positional accuracy during pasting. Are preferably bonded at 80 ° C. or lower, more preferably 10 to 80 ° C., and still more preferably 20 to 80 ° C. Among adhesives that adhere at low temperatures, specifically, a reactive hot melt adhesive is preferable. Particularly preferred in the present invention is a photocurable hot melt adhesive, which is activated by irradiating it with an energy beam such as an electron beam or an ultraviolet ray as disclosed in JP-A-2001-56849. It consists of a photoreactive component that causes a polymerization or cross-linking reaction with a photocationic polymerization initiator and a hot melt adhesive component. As a lamp serving as a light source for initiating the reaction, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a microwave mercury lamp, a metal halide lamp, or the like including an emission wavelength of 300 to 500 nm can be used.

  Next, a laminated body manufacturing apparatus will be described. As this laminated body manufacturing apparatus, there is an IC card manufacturing apparatus. An embodiment of the IC card manufacturing apparatus is shown in FIG.

  The IC card manufacturing apparatus is provided with a feed shaft 50 for feeding the roll-shaped second sheet material 20, and the second sheet material 20 is guided and conveyed by guide rollers 51 and 52. An adhesive application device 41 for applying an adhesive to the second sheet material 20 fed from the feed shaft 50 is disposed. An adhesive is supplied and applied onto the second sheet material 20 from the adhesive application device 41, and then the IC module 2 is supplied.

  Further, the IC card manufacturing apparatus is provided with a delivery shaft 21 for feeding the roll-shaped first sheet material 10, and the first sheet material 10 is guided and conveyed by guide rollers 53, 54 and 55. . An adhesive application device 43 for applying an adhesive to the first sheet material 10 delivered from the delivery shaft 21 is disposed. An adhesive is supplied and applied onto the first sheet material 10 from the adhesive application device 43.

  In this way, the IC module 2 is placed on the adhesive of the second sheet material 20, and the first sheet material 10 and the second sheet are applied by the laminating roller 27 while applying the adhesive on the first sheet material 10. The sheet material 20 is bonded together.

  In this IC card manufacturing apparatus, a pressurizing unit 72, a coating unit 90, a coating liquid drying unit 95, a cutting unit 74, and a punching unit 73 are arranged along the transport direction.

  A plurality of pairs of nip rollers 72 a are arranged in the pressure unit 72. The first sheet material 10 and the second sheet material 20 bonded between the plurality of pairs of nip rollers 72a are conveyed. A predetermined pressure is applied to the first sheet material 10 and the second sheet material 20 bonded together by the pair of nip rollers 72a to bring them into close contact with each other.

  The image receiving layer coating solution container 30 is provided below the coating unit 90, and a supply roller 31 a is provided in the image receiving layer coating solution container 30. The image receiving layer coating solution 33 is provided from the supply roller 31 a through the intermediate roller 31 b. Is supplied to the application roller 32, and by the reverse rotation of the application roller 32, the image receiving layer coating liquid 33 is applied to one surface side of the first sheet material 10, and the image receiving layer is formed on the surface by the reverse coater method.

  The application unit 90 is provided with a writing layer coating solution container 60 below, and a writing roller 61a is provided in the writing layer coating solution container 60, and the writing layer coating is applied from the supply roller 61a through the intermediate roller 61b. The liquid 63 is supplied to the application roller 62, and the writing layer application liquid 63 is applied to one surface side of the second sheet material 20 by the reverse rotation of the application roller 62, and a writing layer is formed on the surface by the reverse coater method.

  The coating liquid drying unit 95 vaporizes the solvent of the image receiving layer of the first sheet material 10 and the writing layer of the second sheet material 20 to form a coating layer on both sides.

  The cutting portion 74 includes a cutter upper die 74a and a cutter lower die 74b that are vertically opposed to each other. The cutter upper die 74a is provided so as to be movable up and down, and the first sheet material 10 and the second sheet material 20 are heated. The sheet 84 is cut in a welded state, and the sheet 84 is fed to the punching unit 73.

  The punching unit 73 includes a card punching upper die 73a and a card punching lower die 73b that are arranged facing each other in the vertical direction. The card punch upper die 73a is movable in the vertical direction, and is integrated after the first sheet material 10 and the second sheet material 20 are completely heat-welded, and thereafter punched to the size of the IC card CA. It has become. In the lower part of the card punching lower die 73b, there is provided a storage portion 85 for sequentially stacking and storing, for example, 4 to 100 IC cards CA cut from the sheet 84.

  Next, the invention described in claim 1 is shown in FIG. In the IC card manufacturing apparatus, conveying means 100 to 102 are arranged. The conveyance unit 100 includes conveyance rollers, a conveyance belt, and the like that are arranged in the conveyance path of the first sheet material 10, and the conveyance unit 101 is a conveyance roller and a conveyance unit that are arranged in the conveyance path of the second sheet material 20. The conveyance means 102 is configured by a conveyance roller, a conveyance belt, or the like disposed in the conveyance path of the bonded sheet material.

  The conveying means 100 to 102 are driven by driving means 103a to 103c. The driving means 103a to 103c are constituted by, for example, motors, and the control means 104 controls the conveyance speed of the driving means 103a to 103c. The control unit 104 includes a CPU, a ROM, a RAM, and the like, and controls the driving units 103a to 103c so that the conveyance speed is constant when conveying the sheet material, so that the conveyance tension is 0.08 kgf / cm or less. To do.

  As described above, when the first sheet material 10 and the second sheet material 20 are continuously bonded, the transfer tension at the time of transferring the sheet material is set to 0.08 kgf / cm or less so that the bonding immediately after the lamination is performed. By preventing excessive conveyance tension on the combined sheet material and preventing occurrence of slippage in the sheet material and suppressing poor adhesion, warpage, and distortion, it is possible to prevent appearance defects and printing defects from occurring. .

  Next, the invention described in claim 2 is shown in FIG. This IC card manufacturing apparatus is provided with a laminating roller 27 for bonding the first sheet material 10 and the second sheet material 20, and nip rollers 72 a 1 to 72 a 4 are provided downstream of the laminating roller 27. . In this embodiment, four nip rollers 72a1 to 72a4 are provided, but at least one nip roller 72a1 to 72a4 may be provided.

  The distance D1 between the laminating roller 27 and the nip roller 72a1, or the distance D2 between the nip roller 72a1 and the nip roller 72a2, the distance D3 between the nip roller 72a2 and the nip roller 72a3, and the distance D2 to D4 between the nip rollers 72a3 and 72a4. Below the width. In this way, the nip of the laminated sheet material immediately after laminating is made uniform so as to prevent the occurrence of slippage in the sheet material and suppress poor adhesion, warpage, and distortion, thereby preventing appearance defects and printing defects. Can be.

  Next, the invention described in claim 3 will be described. This IC card manufacturing apparatus is configured in the same manner as the IC card manufacturing apparatus of FIG. 5, but includes a gap between the nip rollers including the laminating roller, that is, a distance D1 between the laminating roller 27 and the nip roller 72a1, or a nip roller 72a1 and the nip roller. The distance D2 between the nip rollers 72a2 and the nip rollers 72a3, the distance D3 between the nip rollers 72a3 and the nip rollers 72a4, and the distances D2 to D4 between the nip rollers are equal to or less than the length of the sheet material in the sheet conveyance direction.

  In this way, at least one nip roller is provided after the laminating roller 27, and the interval between the nip rollers including the laminating roller 27 is set to be equal to or less than the length of the sheet material in the sheet conveying direction. It is possible to prevent occurrence of poor appearance and poor printing by preventing the occurrence of slippage in the sheet material by making the nips of the combined sheet material uniform and suppressing adhesion failure, warpage, and distortion.

  Next, the invention according to claim 4, claim 7 and claim 8 is shown in FIG. This IC card manufacturing apparatus is provided with a laminating roller 27 for bonding the first sheet material 10 and the second sheet material 20, and nip rollers 72 a 1 to 72 a 4 are provided downstream of the laminating roller 27. . In this embodiment, four nip rollers 72a1 to 72a4 are provided, but at least one nip roller 72a1 to 72a4 may be provided.

  This embodiment is provided with a heat retaining means 200 that retains at least one of the sheet material and the adhesive until the temperature becomes 70 ° C. or higher when the laminate roller 27 is used for bonding. The heat retaining means 200 is constituted by, for example, a heating blower. A temperature detection sensor S1 that directly or indirectly detects the temperature of the sheet material or the adhesive is disposed in the vicinity of the laminating roller 27, and the temperature detection information of the temperature detection sensor S1 is sent to the control means 201. In the control means 201, the heat retaining means 200 is controlled based on the temperature detection information of the sheet material or adhesive, and at the time of bonding by the laminating roller 27, at least one of the sheet material or adhesive is kept at 70 ° C. or higher, By this heat retention, the first sheet material 10 and the second sheet material 20 can be reliably adhered.

  Further, this embodiment includes a cooling unit 210 that cools the bonded sheet material to 25 ° C. or lower while the bonded sheet passes through the nip rollers 72a1 to 72a4.

  The cooling unit 210 uses a cooling roller in which a cooling medium is circulated in the nip rollers 72a1 to 72a4, and has an air ejection device 210a that blows gas to the cooling roller. This air ejection device 210a has air outlets 210a1 and 210a2, and the air outlets 210a1 and 210a2 are arranged on both upper and lower sides of the nip rollers 72a1 to 72a4.

  A temperature detection sensor S <b> 2 that directly detects or indirectly detects the temperature of the sheet material is disposed in the vicinity, and temperature detection information of the temperature detection sensor S <b> 2 is sent to the control unit 201. The control unit 201 controls the valves 210a3 and 210a4 of the air ejection device 210a based on the temperature detection information of the sheet material, and the bonded sheet material is kept at 25 ° C. or lower while the bonded sheet passes through the nip rollers 72a1 to 72a4. Cool until

  In this way, the conditions are set so that bonding can be easily performed at a high temperature during lamination, and the adhesive is solidified in a state where there is no slippage by rapidly cooling immediately after lamination, thereby suppressing poor adhesion, warpage, and distortion. As a result, it is possible to prevent appearance defects and printing defects from occurring.

  In addition, when a cooling roller in which a cooling medium is circulated in the nip rollers 72a1 to 72a4 is used and gas is blown to the cooling roller through the air outlets 210a1 and 210a2 of the air ejection device 210a, the nip roller is rapidly cooled. It is possible to prevent condensation on the roller surface. Usually, the room temperature is about 25 ° C, but the nip rollers 72a1 to 72a4 are cooled to about 5 to 15 ° C in order to rapidly cool the first sheet material 10 and the second sheet material 20 heated to 70 ° C or more. Then, the adhesive can be solidified in a state where no slippage occurs, and adhesion failure, warpage, and distortion can be suppressed. Under such conditions, when a cooling roller in which a cooling medium is circulated in the nip rollers 72a1 to 72a4 is used, condensation easily occurs when the air in the room atmosphere comes into contact with the roller surface, and the moisture is transferred to the sheet surface and pasted. Although it may be attached or contaminated on the sheet surface, it is possible to prevent condensation on the roller surface when gas is blown by the air blowing device 210a and the nip roller is rapidly cooled.

  Also, a configuration in which an IC module 2 having an IC chip 2a and an antenna 2b is enclosed in an adhesive layer while applying an adhesive on at least one of the first sheet material 10 and the second sheet material 20. Then, when these are laminated together and the electronic information recording card using the IC module 2 is distorted, the IC module 2 in the adhesive layer is distorted, and the IC chip 2a is connected to the IC chip 2a. Communication failure due to disconnection of the antenna 2b or the like can be prevented.

  Next, the invention described in claim 5 is shown in FIG. 7 and FIG. This IC card manufacturing apparatus is provided with a laminating roller 27 for bonding the first sheet material 10 and the second sheet material 20, and the subsequent stage of the laminating roller 27 is as shown in FIGS. Composed. In this embodiment, guide rollers 52 and 55 are arranged in front of the laminating roller 27. As shown in FIG. 8, the guide rollers 52 and 55 have a shape in which the diameter of the guide rollers 52 and 55 gradually increases from the end portions 52a and 55a to the central portions 52b and 55b.

  Thus, the guide rollers 52 and 55 are formed in a drum shape, and the diameter D11 of the central portions 52b and 55b is larger than the diameter D10 of the end portions 52a and 55a. The diameter of the guide rollers 52, 55 gradually increases from the end portions 52a, 55a to the central portions 52b, 55b, so that the central portions 52b, 55b are pushed when the first sheet material 10 and the second sheet material 20 are conveyed. The pressure is increased, and the sheet material can be prevented from shaking in the width direction due to the pressing force of the central portions 52b and 55b.

  In this embodiment, the configuration as shown in FIG. 1 to FIG. 6 makes it easy to meander the sheet material itself by reducing the conveyance tension of the sheet material and installing many nip rollers. Further, guide rollers 52 and 55 having a shape in which the diameter gradually increases from the end portion to the center portion are disposed upstream of the laminating roller 27, and the sheet material is conveyed by the guide rollers 52 and 55 to meander the sheet material. This can be prevented.

  Next, the invention of Claim 6 is shown in FIG.9 and FIG.10. This IC card manufacturing apparatus is provided with a laminating roller 27 for bonding the first sheet material 10 and the second sheet material 20, and the subsequent stage of the laminating roller 27 is as shown in FIGS. Composed. In this embodiment, guide rollers 52 and 55 are arranged in front of the laminating roller 27. As shown in FIG. 10, the guide rollers 52 and 55 are provided with flange portions 52d and 55d at both ends of the roller portions 52c and 55c.

  In this embodiment, the configuration as shown in FIG. 1 to FIG. 6 makes it easy to meander the sheet material itself by reducing the conveyance tension of the sheet material and installing many nip rollers. Further, guide rollers 52 and 55 having flange portions 52d and 55d corresponding to the width of the sheet material to be conveyed are arranged upstream of the laminating roller 27, and the sheet material is conveyed by the guide rollers 52 and 55, thereby the sheet material. It is possible to prevent the conveyance from meandering.

  The first sheet material and the second sheet material are conveyed, and the first sheet material and the second sheet material are continuously bonded onto at least one of the sheet materials while applying the adhesive. The transport tension when transporting is set to 0.08 kgf / cm or less. In addition, at least one nip roller is provided after the laminating roller for bonding the first sheet material and the second sheet material, and the nip roller interval including the laminating roller is set to be equal to or smaller than the sheet material width. Further, at least one nip roller is provided after the laminating roller for laminating the first sheet material and the second sheet material, and one sheet material is in a single wafer state, and the nip roller interval including the laminating roller is set. The length of the sheet material of the single wafer is set to be equal to or shorter than the length in the sheet conveying direction. Further, when the adhesive is a thermoplastic adhesive and the first sheet material and the second sheet material are bonded to each other with a laminating roller, at least one of the sheet material and the adhesive until the temperature becomes 70 ° C. or higher. The sheet material is conveyed by a nip roller provided at least one after the laminating roller, and the bonded sheet material is cooled to 25 ° C. or lower while passing through the nip roller.

It is a top view which shows an example of the non-contact-type IC card without a metal terminal on the surface. It is sectional drawing which shows the layer structure of an IC card typically. It is a figure which shows embodiment of the manufacturing apparatus of an IC card. It is a figure which shows the invention of Claim 1. It is a figure which shows invention of Claim 2 and Claim 3. It is a figure which shows invention of Claim 4, Claim 7, and Claim 8. It is a figure which shows invention of Claim 5. It is a side view of a guide roller. It is a figure which shows the invention of Claim 6. It is a side view of a guide roller.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC card 2 IC module 2a IC chip 2b Antenna coil 3 Key information part 4 Character information part 5 Image information part 6,7 Adhesive layer 10 1st sheet material 20 2nd sheet material 27 Laminating roller 41, 43 Adhesive Coating device 52, 55 Guide roller 72a1-72a4 Nip roller 100-102 Conveying means 103a-103c Driving means 104 Control means 200 Heat retaining means 201 Control means 210 Cooling means

Claims (8)

A sheet that conveys the first sheet material and the second sheet material and continuously bonds the first sheet material and the second sheet material onto at least one of the sheet materials while applying an adhesive. In the laminate manufacturing method,
A method for producing a laminate, wherein a conveying tension when conveying the sheet material is 0.08 kgf / cm or less. A sheet that conveys the first sheet material and the second sheet material and continuously bonds the first sheet material and the second sheet material onto at least one of the sheet materials while applying an adhesive. In the laminate manufacturing method,
At least one nip roller is provided after the laminating roller for laminating the first sheet material and the second sheet material, and a gap between the nip rollers including the laminating roller is set to be equal to or less than the sheet material width. Laminate manufacturing method. A sheet that conveys the first sheet material and the second sheet material and continuously bonds the first sheet material and the second sheet material onto at least one of the sheet materials while applying an adhesive. In the laminate manufacturing method,
At least one nip roller is provided after the laminating roller that bonds the first sheet material and the second sheet material, and the interval between the nip rollers including the laminating roller is set. The laminate manufacturing method, wherein the length of the sheet material in the sheet conveyance direction is equal to or less than the length of the sheet material. A sheet that conveys the first sheet material and the second sheet material and continuously bonds the first sheet material and the second sheet material onto at least one of the sheet materials while applying an adhesive. In the laminate manufacturing method,
The adhesive is a thermoplastic adhesive, and when the first sheet material and the second sheet material are bonded to each other with a laminating roller, the sheet material or the adhesive is kept at 70 ° C. or higher. Keep at least one of them warm,
A laminate manufacturing method, wherein the sheet material is conveyed by a nip roller provided at least one downstream of the laminating roller, and the bonded sheet material is cooled to 25 ° C. or lower while passing through the nip roller. A guide roller having a shape in which the diameter gradually increases from an end portion to a center portion is disposed upstream of a laminating roller that bonds the first sheet material and the second sheet material, and the sheet material is moved by the guide roller. It conveys, The laminated body manufacturing method of any one of Claim 1 thru | or 4 characterized by the above-mentioned. A guide roller having a flange corresponding to the width of the sheet material to be conveyed is disposed upstream of the laminating row and the like that bonds the first sheet material and the second sheet material,
The laminate manufacturing method according to any one of claims 1 to 4, wherein the sheet material is conveyed by the guide roller. In a configuration in which an IC module having an IC chip and an antenna is enclosed in the adhesive layer while conveying the first sheet material and the second sheet material and applying an adhesive on at least one of the sheet materials, The method for manufacturing an electronic information recording card according to any one of claims 1 to 6, wherein these are laminated together in a laminated state. Conveying the first sheet material and the second sheet material and applying the thermoplastic adhesive onto at least one sheet material, the first sheet material and the second sheet material are continuously performed. It is an apparatus for manufacturing a laminate to be bonded
When the first sheet material and the second sheet material are bonded with a laminating roller, a heat retaining means for retaining at least one of the sheet material or the adhesive until the temperature becomes 70 ° C. or higher;
A cooling means for cooling the laminated sheet material to 25 ° C. or less while being conveyed by a nip roller provided at least one stage after the laminating roller and passing through the nip roller;
The said manufacturing means uses the cooling roller which circulated the cooling medium in the said nip roller, and has an air ejection apparatus which blows gas with respect to the said cooling roller, The laminated body manufacturing apparatus characterized by the above-mentioned.

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