JP2009239298A - Adhesive sheet for processing rolled wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing a rolled wafer excellent in storage stability, radiation curability, and low staining properties to wafers. <P>SOLUTION: The adhesive sheet for processing the rolled wafer has a multiply-wound laminate film with a base-material film 2, a radiation-curable adhesive-agent layer 3, and a release film 4 laminated in this order. In the adhesive sheet, an arithmetic-mean roughness (Ra) is below 1 μm at the surface of the side opposite to the side in contact with the radiation-curable adhesive-agent layer of the base-material film and/or the release film, and the weight of a radical polymerization-inhibiting agent is below 1,000 ppm as contained in the radiation-curable adhesive-agent layer. Further, a radiation-curable adhesive agent as a material constituting the radiation-curable adhesive-agent layer contains a base polymer having a carbon-carbon double bond, as obtained through an additional reaction of a polymer having a hydroxyl group and a 2-methacryloyloxyethyl isocyanate under the existence of a catalyst. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an adhesive sheet for processing a rolled wafer, an adhesive sheet for processing a wafer, and an adhesive sheet with a semiconductor wafer. The present invention also relates to a method for manufacturing a semiconductor element using an adhesive sheet for wafer processing or an adhesive sheet with a semiconductor wafer, and a semiconductor element obtained by the manufacturing method. The pressure-sensitive adhesive sheet for processing a rolled wafer according to the present invention includes a pressure-sensitive adhesive sheet used for protecting the surface of a wafer in a grinding process of grinding the back surface of a semiconductor wafer among various semiconductor manufacturing processes, and a semiconductor wafer cut into element pieces. It is useful as an adhesive sheet for fixed support that is divided and affixed to the back surface of a wafer in a dicing process in which the element pieces are automatically collected by a pickup method.

  In the wafer manufacturing process, a pattern-formed wafer is generally subjected to a back grinding process in which the wafer is cut to a predetermined thickness. At that time, for the purpose of protecting the wafer or the like, it is a common method to bond and grind the adhesive sheet as a wafer adhesive sheet on the wafer surface. Further, when a wafer or the like is cut into individual chips, a method of dicing by bonding an adhesive sheet as a wafer holding sheet on the wafer surface is common.

  In addition, the recent trend toward larger wafers such as 8 inches and 12 inches, and thinner wafers for IC card applications and the like is progressing. The pressure-sensitive adhesive sheet used when processing these is provided with a radiation curable pressure-sensitive adhesive layer that can reduce the adhesive strength of the pressure-sensitive adhesive layer by ultraviolet irradiation or the like because the semiconductor wafer can be easily peeled off after processing. Often, an adhesive sheet is used. In this radiation-curable pressure-sensitive adhesive sheet, the pressure-sensitive adhesive layer is cured and contracted by irradiating with radiation such as ultraviolet rays, and the adhesive strength with a semiconductor wafer as an adherend is reduced.

  The radiation-curable pressure-sensitive adhesive comprises a base polymer, a radiation-polymerizable compound (monomer, oligomer) having a weight-average molecular weight of 20000 or less and a carbon-carbon double bond in the molecule, and a radiation polymerization initiator as essential materials, and a crosslinking agent. It is prepared by appropriately adding various additives such as. Since such an adhesive extremely reduces the adhesive strength after irradiation, a polyfunctional compound having two or more carbon-carbon double bonds in the molecule is used as a radiation polymerizable compound (Patent Document 1). 2).

  In addition, a technique that does not use a radiation-polymerizable compound having two or more carbon-carbon double bonds by introducing a carbon-carbon double bond into the main chain or side chain of the base polymer to form a radiation-reactive polymer. Is also disclosed (Patent Document 3).

  However, these pressure-sensitive adhesives for processing wafers have reactivity, so that the reaction gradually proceeds during storage from manufacture to use, and there is a problem that they completely cure when the pressure-sensitive adhesive sheet is used. Such a phenomenon is because the radical polymerization chain reaction proceeds gradually due to the photopolymerization initiator contained in the pressure-sensitive adhesive composition or the base thermal polymer used when the base polymer is synthesized. .

  In order to suppress such a polymerization reaction during storage, a method of adding an additive that deactivates a radical chain reaction such as a polymerization inhibitor or an antioxidant to the pressure-sensitive adhesive composition is used.

  However, polymerization inhibitors and antioxidants are not effective unless they are contained in the pressure-sensitive adhesive composition to a certain extent. On the other hand, when the content is too high, the pressure-sensitive adhesive is not used when the pressure-sensitive adhesive sheet is used. Residual curing does not occur, or adhesive residue is generated on the wafer due to insufficient reaction. Furthermore, the semiconductor wafer itself may be contaminated by bleeding out of these additives.

Japanese Patent No. 219328 Japanese Patent No. 2126520 JP 2000-355678 A

  An object of the present invention is to provide a roll-shaped wafer processing pressure-sensitive adhesive sheet having excellent storage stability, radiation curability, and low contamination to a wafer. Another object of the present invention is to provide a wafer processing pressure-sensitive adhesive sheet obtained by cutting the roll-shaped wafer processing pressure-sensitive adhesive sheet and a pressure-sensitive adhesive sheet with a semiconductor wafer. Furthermore, an object of this invention is to provide the manufacturing method of the semiconductor element using the adhesive sheet for wafer processing, or an adhesive sheet with a semiconductor wafer, and the semiconductor element obtained by this manufacturing method.

  As a result of intensive studies to solve the above problems, the present inventors have found that the above object can be achieved by the following wafer processing pressure-sensitive adhesive sheet, and have completed the present invention.

  That is, the present invention relates to a roll-shaped wafer processing pressure-sensitive adhesive sheet in which a base film, a radiation curable pressure-sensitive adhesive layer, and a release film are laminated in this order. Or the arithmetic average roughness (Ra) of the other surface side surface of the release film that is in contact with the radiation curable pressure-sensitive adhesive layer is 1 μm or more, and the radical polymerization inhibitor contained in the radiation curable pressure-sensitive adhesive layer The radiation-curable pressure-sensitive adhesive having a weight of less than 1000 ppm and being a material for forming the radiation-curable pressure-sensitive adhesive layer is obtained by subjecting a polymer having a hydroxyl group to 2-methacryloyloxyethyl isocyanate in the presence of a catalyst. The present invention relates to a roll-shaped wafer processing pressure-sensitive adhesive sheet comprising a base polymer having a carbon-carbon double bond.

  The inventors of the present invention have an arithmetic average roughness (Ra) of 1 μm or more on the other side surface of the surface in contact with the base film of the laminated film and / or the radiation curable pressure-sensitive adhesive layer of the release film, By storing the laminated film in a roll shape, the radical polymerization chain reaction can be effectively suppressed even when the radical polymerization inhibitor contained in the radiation curable pressure-sensitive adhesive layer is extremely small, It has been found that a pressure sensitive adhesive sheet for processing a rolled wafer having excellent storage stability can be obtained. In addition, since the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet of the present invention has a very low content of radical polymerization inhibitor, the pressure-sensitive adhesive does not react and cure when using the pressure-sensitive adhesive sheet, or adhesive residue is generated on the wafer due to insufficient reaction. There is nothing to do. The reason why such a remarkable effect is manifested is not clear, but when a laminated film in which a base film, a radiation curable pressure-sensitive adhesive layer, and a release film are laminated in this order is wound in multiple rolls In general, the base film and the release film are in close contact with each other. By roughening the other surface side surface of the base film and / or the release film that comes into contact with the radiation curable pressure-sensitive adhesive layer, an air layer is formed between the two films, and oxygen contained in the air. Is considered to penetrate the film and effectively inhibit the radical polymerization reaction of the pressure-sensitive adhesive. The surface side that comes into contact with the radiation curable pressure-sensitive adhesive layer of the base film or release film is not roughened because the pressure-sensitive adhesive layer is very soft. This is because the pressure-sensitive adhesive absorbs irregularities and cannot maintain the formation of an air layer.

  The arithmetic average roughness (Ra) of the other surface side surface of the base film and / or the release film that comes into contact with the radiation curable pressure-sensitive adhesive layer is preferably 1.5 μm or more, more preferably 2 μm or more. It is. When the arithmetic average roughness (Ra) of the film surface is less than 1 μm, an air layer is not sufficiently formed between the base film and the release film, and the inflow of air (oxygen) is reduced and sealed. Therefore, the radical polymerization reaction during storage cannot be effectively inhibited.

  The weight of the radical polymerization inhibitor contained in the radiation curable pressure-sensitive adhesive layer is preferably less than 800 ppm, more preferably less than 600 ppm. When the weight of the radical polymerization inhibitor is 1000 ppm or more, the polymerization inhibitory action becomes remarkable, the radiation polymerization reaction when using the pressure-sensitive adhesive sheet is inhibited, and the characteristics of the radiation curable pressure-sensitive adhesive layer tend to be lost. In addition, when there is too little, since there exists a tendency which lacks stability at the time of high temperature and long-term storage, it is preferable that it is 10 ppm or more, More preferably, it is 50 ppm or more.

  In the present invention, it is preferable that the ten-point average roughness (Rz) of the other surface side surface of the base film and / or the release film that contacts the radiation curable pressure-sensitive adhesive layer is 8 μm or more. More preferably, it is 10 μm or more, and particularly preferably 12 μm or more. If the ten-point average roughness (Rz) of the film surface is 8 μm or more, the radical polymerization reaction during storage can be effectively inhibited.

  Further, the present invention provides a roll-shaped wafer processing pressure-sensitive adhesive sheet in which a base film, a radiation curable pressure-sensitive adhesive layer, and a release film are laminated in this order, and the base film or release film. A slip sheet film is laminated on the other side of the surface of the mold film that contacts the radiation curable pressure-sensitive adhesive layer, and the arithmetic average roughness (Ra) of one or both surfaces of the slip sheet film is 1 μm or more, The radiation-curable pressure-sensitive adhesive, which is a material for forming the radiation-curable pressure-sensitive adhesive layer, has a weight of radical polymerization inhibitor contained in the radiation-curable pressure-sensitive adhesive layer of less than 1000 ppm, and a polymer having a hydroxyl group and 2 -A base polymer having a carbon-carbon double bond obtained by addition reaction of methacryloyloxyethyl isocyanate in the presence of a catalyst. Adhesive sheet roll for wafer processing relates.

  Instead of roughening the other surface of the surface of the base film and / or the release film that comes into contact with the radiation curable pressure-sensitive adhesive layer as described above, a slip sheet is used, and one or both surfaces of the slip film are used. May be arithmetic mean roughness (Ra) of 1 μm or more. Transparency of the pressure-sensitive adhesive sheet is necessary for appearance inspection of the pressure-sensitive adhesive sheet and wafer surface inspection after sticking the pressure-sensitive adhesive sheet, but transparency is obtained when the surface of the base film or release film is rough. It tends to be difficult. Therefore, by using a slip sheet film, an air layer can be formed between the films without roughening the surface of the base film or the release film. And when using an adhesive sheet, an external appearance test | inspection etc. can be performed favorably by peeling an interleaf paper film.

  The arithmetic average roughness (Ra) of one or both surfaces of the interleaf film is preferably 1.5 μm or more, more preferably 2 μm or more. When the arithmetic mean roughness (Ra) of the surface of the interleaf paper is less than 1 μm, an air layer is not sufficiently formed between the base film and the release film, and the inflow of air (oxygen) is reduced. Therefore, the radical polymerization reaction during storage cannot be effectively inhibited.

  The weight of the radical polymerization inhibitor contained in the radiation curable pressure-sensitive adhesive layer is preferably less than 800 ppm, more preferably less than 600 ppm, as described above.

  In the present invention, the ten-point average roughness (Rz) of one or both surfaces of the slip sheet film is preferably 8 μm or more, more preferably 10 μm or more, and particularly preferably 12 μm or more. If the ten-point average roughness (Rz) on the surface of the interleaf paper is 8 μm or more, the radical polymerization reaction during storage can be effectively inhibited.

  The arithmetic average roughness (Ra) and ten-point average roughness (Rz) are values calculated according to JIS B 0601-1994, and are described in detail in the examples.

  The pressure-sensitive adhesive sheet for wafer processing according to the present invention is obtained by cutting the pressure-sensitive adhesive sheet for wafer processing into rolls according to the shape of the semiconductor wafer. However, it is not necessary to cut exactly according to the shape of the semiconductor wafer, and can be appropriately adjusted according to the purpose of use.

  The present invention provides a pressure-sensitive adhesive sheet with a semiconductor wafer, comprising a step of bonding a semiconductor wafer to a radiation-curable pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for processing a rolled wafer, and a step of cutting the pressure-sensitive adhesive sheet according to the shape of the semiconductor wafer. The present invention relates to a method and an adhesive sheet with a semiconductor wafer produced by the method. However, similarly to the above, it is not necessary to strictly cut according to the shape of the semiconductor wafer, and it can be appropriately adjusted according to the purpose of use.

  The present invention also relates to a method for manufacturing a semiconductor element, wherein the semiconductor wafer is processed in a state in which a radiation curable pressure-sensitive adhesive layer of the wafer processing pressure-sensitive adhesive sheet is bonded to the semiconductor wafer.

  The present invention also relates to a method for manufacturing a semiconductor element, characterized in that the semiconductor wafer of the pressure-sensitive adhesive sheet with a semiconductor wafer is processed.

  Furthermore, the present invention relates to a semiconductor device manufactured by the above method.

Schematic which shows the structure of the adhesive sheet for roll-shaped wafer processing of this invention. Schematic which shows the other structure of the adhesive sheet for roll-shaped wafer processing of this invention.

  As shown in FIG. 1, the roll-shaped wafer processing pressure-sensitive adhesive sheet 1 of the present invention includes a laminated film in which a base film 2, a radiation curable pressure-sensitive adhesive layer 3, and a release film 4 are laminated in this order. It is rolled up into a tape shape. From the convenience of use, it is preferable that a long length of an adhesive sheet of about several tens or several hundreds of meters is wound around a circular cylinder.

  As the material of the base film, various materials used for the wafer processing pressure-sensitive adhesive sheet can be used without any particular limitation. However, in order to cure the pressure-sensitive adhesive layer by radiation, X-rays, ultraviolet rays, electron beams, etc. Use at least partly transparent. For example, as its material, low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolyprolene, polybutene, polyolefin such as polymethylpentene, Ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene-hexene copolymer Polymers, polyesters such as polyurethane and polyethylene terephthalate, polyimides, polyether ether ketones, polyvinyl chloride, polyvinylidene chloride, fluororesins, cellulosic resins, and cross-linked polymers thereofAs each substrate film, the same kind or different kinds can be appropriately selected and used, and if necessary, those obtained by blending several kinds can be used.

  The base film may be used unstretched or may be uniaxially or biaxially stretched as necessary. The surface of the base film can be subjected to conventional physical or chemical treatment such as mat treatment, corona discharge treatment, primer treatment, and crosslinking treatment (chemical crosslinking (silane)) as necessary. Moreover, the thickness of the said base film is 10-400 micrometers normally, Preferably it is about 30-250 micrometers.

  Examples of the radiation curable pressure-sensitive adhesive used for forming the radiation curable pressure-sensitive adhesive layer include, for example, a radiation-curable monomer component and an oligomer component in a general pressure-sensitive pressure-sensitive adhesive such as an acrylic pressure-sensitive adhesive and a rubber-based pressure-sensitive adhesive. Additive-type pressure-sensitive adhesives (blend type) blended can be mentioned. Among these, an acrylic pressure-sensitive adhesive having an acrylic polymer as a base polymer is preferable from the viewpoints of adhesion to a semiconductor wafer and each substrate film, ease of molecular design, and the like. Further, as the radiation curable pressure-sensitive adhesive, those whose adhesive strength is reduced by irradiation with ultraviolet rays are particularly desirable.

  Examples of the monomer component forming the acrylic polymer include (meth) acrylic acid alkyl esters (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl). Ester, pentyl ester, isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester C1-C30 of alkyl groups, such as ester, hexadecyl ester, octadecyl ester, and eicosyl ester, especially C4-C18 linear or branched chain Alkyl ester, etc.) and (meth) acrylic acid cycloalkyl esters (e.g., cyclopentyl ester and cyclohexyl ester) and the like, such as. These may be used alone or in combination of two or more. In addition, (meth) acrylic acid ester means acrylic acid ester and / or methacrylic acid ester, and (meth) of the present invention has the same meaning.

  The acrylic polymer may contain a unit corresponding to another monomer component copolymerizable with the monomer component, if necessary, for the purpose of modification such as cohesive strength and heat resistance. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate Hydroxyl group-containing monomers such as 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; The Sulfonic acid groups such as lensulfonic acid, allylsulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamidepropanesulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalenesulfonic acid Containing monomers; Phosphoric acid group-containing monomers such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile and the like. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less based on the total monomer components.

  Furthermore, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization as necessary. Examples of such polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) Examples include acrylates. These polyfunctional monomers can also be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

  The acrylic polymer can be obtained by polymerizing a single monomer or a mixture of two or more monomers. The polymerization can be performed by any method such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like. As described above, the pressure-sensitive adhesive layer preferably has a low content of low molecular weight components from the viewpoint of preventing contamination of a semiconductor wafer or the like. From this point, the weight average molecular weight of the acrylic polymer is preferably 100,000 to 2,000,000, more preferably about 300,000 to 1,200,000.

  The base polymer may be one kind or a mixture of two or more kinds, but even when two or more kinds are mixed, the content of the low molecular weight component having a molecular weight of 100,000 or less is 15% by weight. It is preferable to adjust so that it may become% or less.

  Moreover, an external crosslinking agent can also be added to the said adhesive. Specific examples of the external crosslinking method include a method in which a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, or a melamine crosslinking agent is added and reacted. When using an external cross-linking agent, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked, and further depending on the intended use as an adhesive. Generally, it is preferable to mix about 1 to 5 parts by weight with respect to 100 parts by weight of the base polymer. Furthermore, you may use additives, such as conventionally well-known various tackifiers and anti-aging agent, as needed other than the said component for an adhesive.

  Examples of the radiation-curable monomer component to be blended in the pressure-sensitive adhesive include urethane oligomer, urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, and pentaerythritol tri (meth) acrylate. Pentaerythritol tetra (meth) acrylate, dipentaerystol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, and the like. Examples of the radiation curable oligomer component include various oligomers such as urethane, polyether, polyester, polycarbonate, and polybutadiene, and those having a molecular weight in the range of about 100 to 30000 are suitable. . The compounding amount of the radiation-curable monomer component or oligomer component can be appropriately determined in accordance with the type of the pressure-sensitive adhesive layer, and the amount capable of reducing the adhesive strength of the pressure-sensitive adhesive layer. Generally, the amount is preferably 0.1 to 200 parts by weight, more preferably 0.1 to 150 parts by weight with respect to 100 parts by weight of the base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.

  In addition to the additive-type radiation-curable pressure-sensitive adhesive described above, the radiation-curable pressure-sensitive adhesive has a carbon-carbon double bond as a base polymer in the polymer side chain, main chain, or main chain terminal. Intrinsic radiation-curing pressure-sensitive adhesive (adduct type) is used. Intrinsic radiation curable adhesives do not need to contain oligomer components, which are low molecular components, or do not contain many of them, so that oligomer components do not move through the adhesive over time and are stable. This is preferable because an adhesive layer having a layered structure can be formed.

  As the base polymer having a carbon-carbon double bond, those having a carbon-carbon double bond and having adhesiveness can be used without particular limitation. As such a base polymer, an acrylic polymer having a basic skeleton is preferable. Examples of the basic skeleton of the acrylic polymer include the acrylic polymers exemplified above.

  The method for introducing the carbon-carbon double bond into the acrylic polymer is not particularly limited, and various methods can be adopted. However, the carbon-carbon double bond can be easily introduced into the polymer side chain for easy molecular design. . For example, after a monomer having a functional group is copolymerized in advance with an acrylic polymer, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is converted into a radiation-curable carbon-carbon double bond. Examples of the method include condensation or addition reaction while maintaining the above.

  Examples of combinations of these functional groups include carboxylic acid groups and epoxy groups, carboxylic acid groups and aziridyl groups, hydroxyl groups and isocyanate groups. Among these combinations of functional groups, a combination of a hydroxyl group and an isocyanate group is preferable because of easy tracking of the reaction. In addition, the functional group may be on either side of the acrylic polymer and the compound as long as the acrylic polymer having the carbon-carbon double bond is generated by the combination of these functional groups. In the preferable combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate, and the like. Further, as the acrylic polymer, those obtained by copolymerizing the above-exemplified hydroxy group-containing monomers, ether compounds of 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, or the like are used.

  As the intrinsic radiation curable pressure-sensitive adhesive, the base polymer (particularly acrylic polymer) having the carbon-carbon double bond can be used alone, but the radiation curable monomer does not deteriorate the characteristics. Components and oligomer components can also be blended. The radiation-curable oligomer component is usually 200 parts by weight or less, preferably 100 parts by weight or less, based on 100 parts by weight of the base polymer.

  The radiation curable pressure-sensitive adhesive contains a photopolymerization initiator for curing with ultraviolet rays or the like. Examples of the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α′-dimethylacetophenone, 2-methyl-2-hydroxypropio Α-ketol compounds such as phenone and 1-hydroxycyclohexyl phenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- ( Acetophenone compounds such as methylthio) -phenyl] -2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether and anisoin methyl ether; ketal compounds such as benzyldimethyl ketal; 2 -Naphthalenesulfoni Aromatic sulfonyl chloride compounds such as luchloride; Photoactive oxime compounds such as 1-phenone-1,1-propanedione-2- (o-ethoxycarbonyl) oxime; benzophenone, benzoylbenzoic acid, 3,3′-dimethyl Benzophenone compounds such as -4-methoxybenzophenone; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2 Thioxanthone compounds such as 1,4-diethylthioxanthone and 2,4-diisopropylthioxanthone; camphorquinone; halogenated ketone; acyl phosphinoxide; acyl phosphonate. The compounding quantity of a photoinitiator is 1-10 weight part with respect to 100 weight part of base polymers, such as an acryl-type polymer which comprises an adhesive, Preferably it is about 3-5 weight part.

  The radical polymerization inhibitor to be added to the radiation curable pressure-sensitive adhesive is not particularly limited as long as it can exhibit effects such as phenol, amine, phosphorus, and sulfur, but a phenol is preferably used. For example, hydroquinone, methoquinone (MEHQ: hydroquinone monomethyl ether), p-benzoquinone, phenothiazine, mono-t-butylhydroquinone, catechol, pt-butylcatechol, benzoquinone, 2,5-di-t-butylhydroquinone, anthraquinone 2,6-di-t-butylhydroxytoluene (BHT) and the like.

  The various additives such as the crosslinking agent, photopolymerization initiator, and radiation curable monomer component and oligomer component are materials that can react with the polymer although they are low molecular weight components. Since it is taken in as a part, it does not become a source of transfer contaminants.

  The thickness of the radiation curable pressure-sensitive adhesive layer is not particularly limited, but is usually 1 to 300 μm, preferably 3 to 200 μm, and more preferably 5 to 100 μm.

  Examples of the material for forming the release film include synthetic resin films such as polyethylene, polypropylene, polytetrafluoroethylene, and polyethylene terephthalate. The surface of the release film may be subjected to release treatment such as silicone treatment, long-chain alkyl treatment, and fluorine treatment as necessary in order to enhance the peelability from the pressure-sensitive adhesive layer. The thickness of the release film is usually about 10 to 200 μm, preferably about 25 to 100 μm.

  Arithmetic average roughness (Ra) of the other surface side of the surface to be bonded to the radiation curable pressure-sensitive adhesive layer of the base film and / or release film is 1 μm or more, and further 10-point average roughness (Rz) is 8 μm. As a method for making the above, for example, immediately after the film is heated and extruded, a method of bringing the film into contact with a metal roll or the like on which fine irregularities are formed, a method of spraying / contacting the molded film with sand (sand blast method), Or the method of etching the shape | molded film with an alkaline solution is mentioned.

  The pressure-sensitive adhesive sheet for processing a rolled wafer according to the present invention can be produced, for example, by forming a pressure-sensitive adhesive layer on a base film and bonding a release film on the pressure-sensitive adhesive layer. In addition, the method for forming the pressure-sensitive adhesive layer is not particularly limited, and is a method in which the pressure-sensitive adhesive is directly applied to the base film, or separately, after forming the pressure-sensitive adhesive layer on the release film, and then forming them on the base film. A method of bonding can be employed. The adhesive sheet produced in this way can be produced by winding it into a roll by wrapping around a circular cylinder multiple times. When winding, a base film may be wound inside, or a release film may be wound inside.

  Moreover, as shown in FIG. 2, the roll-shaped wafer processing pressure-sensitive adhesive sheet 1 of the present invention is a laminate in which at least a base film 2, a radiation curable pressure-sensitive adhesive layer 3, and a release film 4 are laminated in this order. A film in which an interleaving film 5 is laminated on the other side of the surface of the base film 2 or the release film 4 that comes into contact with the radiation curable pressure-sensitive adhesive layer 3 is wound into multiple tapes. It may be a thing.

  The material for forming the interstitial film is not particularly limited. For example, a polyester film such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, a biaxially oriented polypropylene, a polyolefin film such as low-density polyethylene, and a multilayer including the film A film etc. are mentioned. The thickness is preferably 8 to 100 μm, more preferably 10 to 40 μm. When the thickness is less than 8 μm, in the step of winding the laminated film, wrinkles are likely to occur when the interleaf film is inserted into the winding portion, and the tape appearance tends to deteriorate. On the other hand, when the thickness exceeds 100 μm, the roll size of the roll-shaped wafer processing pressure-sensitive adhesive sheet becomes large, resulting in high costs in terms of transportation costs and waste disposal.

  As a method for setting the arithmetic average roughness (Ra) of one or both surfaces of the interleaf paper film to 1 μm or more, and further to setting the ten-point average roughness (Rz) to 8 μm or more, the method described above can be adopted. . In addition, the surface of the base film and / or the release film in contact with the slip sheet film may be smooth or rough.

  Examples of the method for producing a pressure-sensitive adhesive sheet for processing a rolled wafer having a slip-sheet film of the present invention include, for example, forming a pressure-sensitive adhesive layer on a base film or a release film, and then sticking the release film or the base film. A laminated film is produced by laminating on the agent layer. Thereafter, 1) a method of laminating a slip sheet film on the other side of the base film or release film, and winding the length of the produced pressure-sensitive adhesive sheet around a circular cylinder to form a roll. 2) Lamination When winding a film into a roll, a method of winding an interleaf film between a base film and a release film, and 3) winding a laminated film into a roll and then unwinding the interleaf film And 4) a method of cutting the laminated film into a product size and winding it while sandwiching a slip sheet film after cutting. In order to inspect foreign matter in the pressure-sensitive adhesive sheet for processing a rolled wafer, the method 4) is preferable. When winding, the interleaving film may be wound inward, or the interleaving film may be wound outward.

  From the viewpoint of workability at the time of use, the pressure-sensitive adhesive sheet for processing a roll-shaped wafer of the present invention is preferably 1 to 500 m, more preferably 10 to 200 m, and particularly preferably 20 to 100 m. It is a form taken. As described above, by subjecting the specific film to the surface roughness treatment, air (oxygen) enters between the base film and the release film when continuously wound in a roll shape. The infiltrated oxygen further permeates through the base film and the release film and penetrates into the adhesive layer to suppress the radical polymerization reaction. Therefore, even when the amount of the polymerization inhibitor is very small, polymerization during transportation and storage The reaction can be effectively suppressed.

  The roll-shaped wafer processing pressure-sensitive adhesive sheet of the present invention can be made into a label-shaped wafer processing pressure-sensitive adhesive sheet by cutting (punching) into a shape according to the application. For example, among various semiconductor manufacturing processes, an adhesive sheet used to protect the wafer surface in a grinding process for grinding the back surface of a semiconductor wafer, or a semiconductor wafer is cut and divided into element pieces, and the element pieces are picked up. In the dicing process of automatic collection at, it can be used as an adhesive sheet for fixed support to be attached to the back surface of the wafer.

  Moreover, the roll-shaped wafer processing pressure-sensitive adhesive sheet is rewound, a semiconductor wafer is bonded onto the rewound pressure-sensitive adhesive sheet, and then the pressure-sensitive adhesive sheet is cut in accordance with the shape of the semiconductor wafer. It is good also as an adhesive sheet with a semiconductor wafer.

  The adhesive strength of the pressure-sensitive adhesive layer may be appropriately determined according to the purpose of use, etc., but is generally determined from the standpoint of maintaining adhesion to a semiconductor wafer, peelability from the wafer, and the like. When fixing and protecting the wafer, it is preferable that the 180 ° peel (23 ° C., tensile speed 300 mm / min) adhesive strength before irradiation is 1 N / 20 mm tape width or more. On the other hand, when the pressure-sensitive adhesive sheet is peeled from the wafer, a material that is easy to peel is preferable. For example, it is preferable that the 180 ° peel adhesive strength of the pressure-sensitive adhesive layer after radiation irradiation is adjusted to be 0.5 N / 20 mm or less.

  The pressure-sensitive adhesive sheet for wafer processing of the present invention is used according to a conventional method. Affixing the adhesive sheet to the pattern surface of the semiconductor wafer is done by placing the semiconductor wafer on the table so that the pattern surface is on top, and then overlaying the adhesive layer of the adhesive sheet on the pattern surface. Affixing while pressing with the pressing means. In addition, the semiconductor wafer and the pressure-sensitive adhesive sheet are stacked as described above in a pressurizable container (for example, an autoclave), and the inside of the container can be attached to the wafer by pressurizing. At this time, it may be attached while being pressed by the pressing means. Further, it can be attached in the same manner as described above in a vacuum chamber. The pasting method is not limited to these, and when pasting, the base film can be heated to the melting point or lower.

For example, conventional methods can be used for thin processing. Examples of the thin processing machine include a grinding machine (back grind) and a CMP pad. Thin processing is performed until the semiconductor wafer has a desired thickness. The pressure-sensitive adhesive sheet is peeled from the semiconductor wafer after thinning, but the radiation-curing pressure-sensitive adhesive layer is irradiated with radiation to reduce the adhesive strength, and then peeled. The means for radiation irradiation is not particularly limited, but for example, ultraviolet irradiation is performed.

  EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples.

<Measurement of arithmetic average roughness (Ra) and ten-point average roughness (Rz)>
Based on JIS B 0601-1994, it measured on condition of the following using the ultra deep shape measuring microscope (the Keyence company make, VK-8510 type).
Magnification: 1000 times measurement MODE: Color ultra-deep measurement measurement (scan) distance: 13-20 μm
Scan pitch: 0.02 μm
Laser gain: Auto laser Sensitivity: Gamma1
<Measurement of adhesive strength>
The produced pressure-sensitive adhesive sheet for wafer processing before storage was cut according to the size of the silicon mirror wafer to prepare a label-shaped adhesive sheet for wafer processing. A release film (also a slip-sheet film in some cases) was peeled off from the wafer processing adhesive sheet, and an adhesive layer was attached to the silicon mirror wafer. And the adhesive force of the adhesive layer before radiation hardening was measured on condition of the following using the TENSILON: RTM-100 type | mold made from Orientec. Furthermore, the adhesive layer was irradiated with ultraviolet rays under the following conditions, and the adhesive strength of the adhesive layer after radiation curing was measured in the same manner as described above.

Further, after the produced pressure-sensitive adhesive sheet for processing a rolled wafer was stored for 300 hours under the conditions of 50 ° C. and 60% humidity, the pressure-sensitive adhesive sheet on the inner side of 50 m was cut out from the starting end of the pressure-sensitive adhesive sheet for processing a rolled wafer. And the adhesive layer was affixed on the silicon mirror wafer like the above, and the adhesive force of the adhesive layer before radiation curing was measured. Furthermore, the adhesive layer was irradiated with ultraviolet rays under the following conditions, and the adhesive strength of the adhesive layer after radiation curing was measured in the same manner as described above.
Measurement temperature and humidity: 23 ° C, 60%
Peel angle: 180 °
Peeling speed: 300mm / min
Ultraviolet (UV) irradiation device: NEL UM-810, manufactured by Nitto Seiki Co., Ltd.
UV irradiation integrated light quantity: 500 mJ / cm ²

Example 1
(Production of laminated film)
A blend composition comprising 100 parts by weight of ethyl acrylate (MEHQ concentration: 100 ppm), 25 parts by weight of 2-hydroxyethyl acrylate (MEHQ concentration: 300 ppm), and 0.2 parts by weight of benzoyl peroxide as a polymerization initiator was added in toluene. It mix | blended so that it might become weight%, and it was made to copolymerize at 60 degreeC by nitrogen atmosphere for 6 hours, and obtained the acrylic type copolymer solution. Next, 20 parts by weight of 2-methacryloyloxyethyl isocyanate (BHT concentration: 400 ppm) is added to 100 parts by weight of this acrylic copolymer in the presence of 0.1 part by weight of an organic tin catalyst (dibutyltin dilaurate). An addition reaction was carried out at 12 ° C. for 12 hours to introduce a carbon-carbon double bond into the polymer molecule inner chain to obtain a radiation curable polymer solution. The residual total concentration of the polymerization inhibitor (BHT + MEHQ) in the radiation curable polymer (solid content) was 50 ppm (these polymerization inhibitors were contained in the monomer as a raw material). And 100 parts by weight of the polymer (solid content), 1 part by weight of a polyisocyanate crosslinking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., Coronate L), photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure) 651) 2.5 parts by weight were mixed in the solution to obtain an adhesive composition. Then, 2,6-di-t-butylhydroxytoluene (BHT) was added so that the total concentration of the polymerization inhibitor in the solid content in the pressure-sensitive adhesive composition was 100 ppm to obtain a radiation-curable pressure-sensitive adhesive.

  The other side of the base film (PET, thickness 50 μm) whose arithmetic average roughness (Ra) on one side is adjusted to 1.6 μm and the ten-point average roughness (Rz) is adjusted to 15.0 μm by sandblasting in advance. The radiation-curable pressure-sensitive adhesive was applied to the side and dried to form a radiation-curable pressure-sensitive adhesive layer (thickness 30 μm). Furthermore, the other side (peeled) of a release film (PET, thickness 38 μm) having an arithmetic average roughness (Ra) on one side of 0.3 μm and a ten-point average roughness (Rz) of 5.0 μm. A laminated film was prepared by bonding to the pressure-sensitive adhesive layer.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
A cutting blade is inserted into the laminated film having a width of 300 mm so as to have a width of 230 mm, and both ends of the laminated film are cut while being wound around a winding core made of ABS resin having a diameter of 75 mm. Produced. The winding length of the pressure-sensitive adhesive sheet was 100 m.

Example 2
(Production of laminated film)
Formulation composition comprising 30 parts by weight of ethyl acrylate (MEHQ concentration: 100 ppm), 70 parts by weight of 2-ethylhexyl acrylate (MEHQ concentration: 100 ppm), 10 parts by weight of acrylic acid, and 0.2 part by weight of benzoyl peroxide as a polymerization initiator Was blended in ethyl acetate to be 35% by weight and copolymerized at 60 ° C. for 6 hours under a nitrogen atmosphere to obtain an acrylic copolymer solution. Next, 100 parts by weight of dipentaerythritol hexaacrylate (MEHQ concentration: 500 ppm) was added to 100 parts by weight of the acrylic copolymer. The concentration of the polymerization inhibitor (MEHQ) in the solid content of the solution was 270 ppm. Then, 0.1 part by weight of an epoxy crosslinking agent (manufactured by Mitsubishi Gas Chemical Company, Tetrad C) and a photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 651) with respect to 100 parts by weight of the acrylic copolymer. 2.5 parts by weight were mixed into the solution to obtain an adhesive composition. Then, 2,6-di-t-butylhydroxytoluene (BHT) was added so that the total concentration of the polymerization inhibitor in the solid content in the pressure-sensitive adhesive composition was 500 ppm to obtain a radiation-curable pressure-sensitive adhesive.

  The other side of the base film (PET, thickness 50 μm) whose arithmetic average roughness (Ra) on one side is adjusted to 2.6 μm and the ten-point average roughness (Rz) is adjusted to 16.0 μm by sandblasting in advance. The radiation-curable pressure-sensitive adhesive was applied to the side and dried to form a pressure-sensitive adhesive layer (thickness 30 μm). Further, the other side of the release film (PET, thickness 38 μm) having an arithmetic average roughness (Ra) on one side of 0.3 μm and a ten-point average roughness (Rz) of 5.0 μm (exfoliated) Was laminated on the pressure-sensitive adhesive layer to prepare a laminated film.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
A pressure-sensitive adhesive sheet for processing a rolled wafer was produced in the same manner as in Example 1.

Example 3
(Production of laminated film)
The heated and melted ethylene-vinyl acetate copolymer was extruded from a die and molded into a film. Immediately after molding, the film is brought into contact with a silicon rubber roll having an arithmetic average roughness (Ra) of 3.5 μm and a ten-point average roughness (Rz) of 12 μm, and simultaneously cooled, so that the arithmetic average roughness on one side (Ra) Was 1.5 μm, and a base film (ethylene-vinyl acetate copolymer, thickness 115 μm) having a ten-point average roughness (Rz) of 8.3 μm was produced.

  And the laminated | multilayer film were produced by the method similar to Example 1 except having used the produced said base film.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
A pressure-sensitive adhesive sheet for processing a rolled wafer was produced in the same manner as in Example 1.

Example 4
(Production of laminated film)
A single-sided arithmetic average roughness (Ra) of 0.3 μm, a ten-point average roughness (Rz) of 5.0 μm base film (PET, thickness 50 μm), and pre-sandblasted The same procedure as in Example 1 was used except that a release film (PET, thickness 38 μm) having an arithmetic average roughness (Ra) adjusted to 1.6 μm and a ten-point average roughness (Rz) adjusted to 15.0 μm was used. A laminated film was produced.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
A pressure-sensitive adhesive sheet for processing a rolled wafer was produced in the same manner as in Example 1.

Example 5
(Production of laminated film)
A single-sided arithmetic average roughness (Ra) of 0.3 μm, a ten-point average roughness (Rz) of 5.0 μm base film (PET, thickness 50 μm), and single-sided arithmetic average roughness (Ra) Was used in the same manner as in Example 1 except that a release film (PET, thickness 38 μm) having a 10-point average roughness (Rz) of 5.0 μm was used.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
An interleaf film (PET, thickness 25 μm, base film side and release film side Ra = 1.6 μm, Rz = 15 μm) was inserted between the base film and the release film at the time of winding. A roll-shaped wafer processing pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except for the above. The winding length of the pressure-sensitive adhesive sheet was 100 m.

Example 6
(Production of laminated film)
A laminated film was produced in the same manner as in Example 5.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
Example except that a paper sheet having a width of 230 mm (PET, thickness 25 μm, base film side Ra = 1.6 μm, Rz = 15 μm, release film side Ra = 0.3 μm, Rz = 5.0 μm) was used. 5 was used to produce a roll-shaped wafer processing pressure-sensitive adhesive sheet. The winding length of the pressure-sensitive adhesive sheet was 100 m.

Example 7
(Production of laminated film)
A laminated film was produced in the same manner as in Example 5.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
Example except that a paper sheet having a width of 230 mm (PET, thickness 25 μm, base film side Ra = 0.3 μm, Rz = 5.0 μm, release film side Ra = 1.6 μm, Rz = 15 μm) was used. 5 was used to produce a roll-shaped wafer processing pressure-sensitive adhesive sheet. The winding length of the pressure-sensitive adhesive sheet was 100 m.

Comparative Example 1
(Production of laminated film)
Similar to Example 1 except that a base film (PET, thickness 50 μm) having an arithmetic average roughness (Ra) on one side of 0.3 μm and a ten-point average roughness (Rz) of 5.0 μm was used. A laminated film was produced by this method.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
A pressure-sensitive adhesive sheet for processing a rolled wafer was produced in the same manner as in Example 1.

Comparative Example 2
(Production of laminated film)
Similar to Example 2 except that a base film (PET, thickness 50 μm) having an arithmetic average roughness (Ra) on one side of 0.5 μm and a ten-point average roughness (Rz) of 6.5 μm was used. A laminated film was produced by this method.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
A pressure-sensitive adhesive sheet for processing a rolled wafer was produced in the same manner as in Example 1.

Comparative Example 3
(Production of laminated film)
Except for using a base film (ethylene-vinyl acetate copolymer, thickness 115 μm) having an arithmetic average roughness (Ra) on one side of 0.4 μm and a ten-point average roughness (Rz) of 7.8 μm. A laminated film was produced in the same manner as in Example 1.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
A pressure-sensitive adhesive sheet for processing a rolled wafer was produced in the same manner as in Example 1.

Comparative Example 4
(Production of laminated film)
2,6-di-t-butylhydroxytoluene (BHT) is added so that the total concentration of the polymerization inhibitor in the solid content in the pressure-sensitive adhesive composition is 1000 ppm, and the arithmetic average roughness (Ra) on one side is A laminated film was produced in the same manner as in Example 1 except that a base film (PET, thickness 50 μm) having a thickness of 0.3 μm and a 10-point average roughness (Rz) of 5.0 μm was used.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
A pressure-sensitive adhesive sheet for processing a rolled wafer was produced in the same manner as in Example 1.

Comparative Example 5
(Production of laminated film)
2,6-di-t-butylhydroxytoluene (BHT) is added so that the total concentration of the polymerization inhibitor in the solid content in the pressure-sensitive adhesive composition is 10,000 ppm, and the arithmetic average roughness (Ra) on one side is A laminated film was produced in the same manner as in Example 1 except that a base film (PET, thickness 50 μm) having a thickness of 0.3 μm and a 10-point average roughness (Rz) of 5.0 μm was used.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
A pressure-sensitive adhesive sheet for processing a rolled wafer was produced in the same manner as in Example 1.

Comparative Example 6
(Production of laminated film)
A laminated film was produced in the same manner as in Example 5.

(Preparation of pressure-sensitive adhesive sheet for roll-shaped wafer processing)
A roll is formed in the same manner as in Example 5 except that a paper sheet having a width of 230 mm (PET, thickness 25 μm, base film side and release film side Ra = 0.3 μm, Rz = 5.0 μm) is used A wafer processing adhesive sheet was prepared. The winding length of the pressure-sensitive adhesive sheet was 100 m.

  As is clear from Table 1, when the surface of the base film or the release film is rough (Examples 1 to 4), it can be seen that the decrease in adhesive strength after storage is small. This is because the radical polymerization reaction of the pressure-sensitive adhesive layer is suppressed. And after ultraviolet irradiation, the adhesive force is sufficiently reduced. On the other hand, when the surface of a base film and a release film is not rough (Comparative Examples 1-3), it turns out that the fall of the adhesive force after storage is large. This is because the radical polymerization reaction of the pressure-sensitive adhesive layer proceeds during storage. When the amount of the polymerization inhibitor in the pressure-sensitive adhesive layer is large (Comparative Examples 4 and 5), the decrease in the adhesive strength after storage is suppressed, but the decrease in the adhesive strength due to ultraviolet irradiation is significantly inhibited.

  It can also be seen that even when the surface of the slip sheet film is rough (Examples 5 to 7), the adhesive force hardly decreases after storage. This is because the radical polymerization reaction of the pressure-sensitive adhesive layer is suppressed. And after ultraviolet irradiation, the adhesive force is sufficiently reduced. On the other hand, when the surface of the slip sheet film is not rough (Comparative Example 6), it can be seen that the decrease in adhesive strength after storage is large. This is because the radical polymerization reaction of the pressure-sensitive adhesive layer proceeds during storage.

1: Roll-shaped wafer processing pressure-sensitive adhesive sheet 2: Base film 3: Radiation curable pressure-sensitive adhesive layer 4: Release film 5: Interleaf film

Claims (10)

In the pressure-sensitive adhesive sheet for rolled wafer processing in which a laminated film in which a base film, a radiation curable pressure-sensitive adhesive layer, and a release film are laminated in this order is wound, the base film and / or the release film The arithmetic mean roughness (Ra) of the surface on the other surface side in contact with the radiation curable pressure-sensitive adhesive layer is 1 μm or more, and the weight of the radical polymerization inhibitor contained in the radiation curable pressure-sensitive adhesive layer is less than 1000 ppm. The radiation-curable pressure-sensitive adhesive that is a material for forming the radiation-curable pressure-sensitive adhesive layer is a carbon-carbon double layer obtained by addition reaction of a polymer having a hydroxyl group and 2-methacryloyloxyethyl isocyanate in the presence of a catalyst. A pressure-sensitive adhesive sheet for processing rolled wafers, comprising a base polymer having a bond. 2. The roll-shaped wafer according to claim 1, wherein the ten-point average roughness (Rz) of the surface on the other surface of the base film and / or the release film that contacts the radiation curable pressure-sensitive adhesive layer is 8 μm or more. Processing adhesive sheet. In the pressure-sensitive adhesive sheet for roll-shaped wafer processing in which a base film, a radiation curable pressure-sensitive adhesive layer, and a release film are laminated in this order, a roll-shaped wafer processing pressure-sensitive adhesive sheet, the base film or the release film is cured by radiation. A slip-sheet film is laminated on the other side of the surface in contact with the mold pressure-sensitive adhesive layer, the arithmetic mean roughness (Ra) of one or both surfaces of the slip-sheet film is 1 μm or more, and the radiation curable pressure-sensitive adhesive The radiation-curable pressure-sensitive adhesive, which is a material for forming the radiation-curable pressure-sensitive adhesive layer, has a weight of radical polymerization inhibitor contained in the agent layer of less than 1000 ppm, and is a polymer having a hydroxyl group and 2-methacryloyloxyethyl isocyanate Containing a base polymer having a carbon-carbon double bond obtained by addition reaction in the presence of a catalyst. Pressure-sensitive adhesive sheet for processing. The pressure-sensitive adhesive sheet for roll-shaped wafer processing according to claim 3, wherein the ten-point average roughness (Rz) of one or both surfaces of the interleaf paper film is 8 µm or more. The pressure sensitive adhesive sheet for wafer processing formed by cutting the pressure sensitive adhesive sheet for roll wafer processing according to any one of claims 1 to 4 according to the shape of a semiconductor wafer. A semiconductor comprising a step of bonding a semiconductor wafer to the radiation-curable pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for processing a rolled wafer according to claim 1, and a step of cutting the pressure-sensitive adhesive sheet in accordance with the shape of the semiconductor wafer. Manufacturing method of adhesive sheet with wafer. A pressure-sensitive adhesive sheet with a semiconductor wafer produced by the method according to claim 6. 6. A method of manufacturing a semiconductor element, comprising: processing a semiconductor wafer in a state in which the radiation-curable pressure-sensitive adhesive layer of the wafer processing pressure-sensitive adhesive sheet is bonded to the semiconductor wafer. A method for manufacturing a semiconductor element, wherein the semiconductor wafer of the pressure-sensitive adhesive sheet with a semiconductor wafer according to claim 7 is processed. A semiconductor device manufactured by the method according to claim 8.

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