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JP2009135599A - Crystal device for surface mounting - Google Patents

Crystal device for surface mounting Download PDF

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Publication number
JP2009135599A
JP2009135599A JP2007307889A JP2007307889A JP2009135599A JP 2009135599 A JP2009135599 A JP 2009135599A JP 2007307889 A JP2007307889 A JP 2007307889A JP 2007307889 A JP2007307889 A JP 2007307889A JP 2009135599 A JP2009135599 A JP 2009135599A
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metal cover
jetty
container body
opening end
face
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JP5171228B2 (en
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Hiromi Otake
浩実 大竹
Kenichi Sugawara
賢一 菅原
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Nihon Dempa Kogyo Co Ltd
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Nihon Dempa Kogyo Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a crystal device for surface mounting whose productivity is enhanced by surely positioning a metal cover. <P>SOLUTION: In the crystal device for surface mounting formed by housing at least a quartz crystal piece 2 in a recessed container body 1 which has a bottom surface 1a and a frame wall 1b formed of laminated ceramic and is rectangular in a planar view, providing a metal film 6 having a ground electrode 6a at an opened end face of the container body 1, and connecting a metal cover 3 over the metal film 6 separately from an outer circumferential end of the opened end face to hermetically seal the of the quartz crystal piece 2, projections 10 for positioning the metal cover 3 are formed at least on four respective sides on an outer circumferential surface to be an outer side of the metal cover 3 of the opened end face in the container body, and the projections 10 include outer circumferential ends of the outer circumferential surfaces and are lower than the metal cover 3 in height. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は表面実装用の水晶デバイスを技術分野とし、特に金属カバーの位置合わせを容易にして離脱を防止した表面実装デバイスに関する。   The present invention relates to a crystal device for surface mounting, and more particularly to a surface mounting device that facilitates alignment of a metal cover and prevents detachment.

表面実装デバイス例えば水晶振動子(以下、表面実装振動子とする)は、小型・軽量であることから携帯電話で代表される携帯型の電子機器に、周波数や時間の基準源として発振回路とともに組み込まれる。このようなものの一つに、共晶合金を用いて容器本体の開口端面を封止したものがある。   Surface mount devices such as crystal resonators (hereinafter referred to as surface mount resonators) are small and light, so they are incorporated into portable electronic devices typified by mobile phones together with an oscillation circuit as a frequency and time reference source. It is. One of them is one in which the open end face of the container body is sealed using a eutectic alloy.

(従来技術の一例)
第4図は一従来例を説明する図で、同図(a)は表面実装振動子の断面図、同図(b)は点線○印で示す部分の一部拡大断面図、同図(c)は水晶片の平面図である。
(Example of conventional technology)
FIG. 4 is a diagram for explaining a conventional example, in which FIG. 4 (a) is a sectional view of a surface-mounted vibrator, FIG. 4 (b) is a partially enlarged sectional view of a portion indicated by a dotted line, and FIG. ) Is a plan view of the crystal piece.

表面実装振動子は凹状とした容器本体1に水晶片2を収容し、金属カバー3を接合して密閉封入してなる。容器本体1は底壁1aと枠壁1bを有する積層セラミックからなり、内底面には一対の水晶端子4を、外底面には外部端子5を有する。容器本体1の開口端面(枠壁1b上面)には例えば外周端から離間した金属膜6を有する。   The surface-mounted vibrator is formed by housing a crystal piece 2 in a concave container body 1 and joining a metal cover 3 in a hermetically sealed manner. The container body 1 is made of a laminated ceramic having a bottom wall 1a and a frame wall 1b, and has a pair of crystal terminals 4 on the inner bottom surface and an external terminal 5 on the outer bottom surface. For example, a metal film 6 separated from the outer peripheral end is provided on the opening end surface (the upper surface of the frame wall 1b) of the container body 1.

金属膜6は下地電極6aをW(タングステン)やMo(モリブテン)として印刷によって形成され、容器本体1とともに焼成された後、導電層6bとしてNi及びAuメッキされる。水晶端子4は一組の対角部の外部端子5に、金属膜6は他組の外部端子5に、図示しないスルーホールや積層面を経て電気的に接続する。   The metal film 6 is formed by printing with the base electrode 6a as W (tungsten) or Mo (molybdenum), baked together with the container body 1, and then plated with Ni and Au as the conductive layer 6b. The crystal terminal 4 is electrically connected to a pair of diagonal external terminals 5, and the metal film 6 is electrically connected to another set of external terminals 5 through a through hole or a laminated surface (not shown).

水晶片2は両主面に励振電極7aを有し、例えば一端部両側に引出電極7bを延出する。引出電極7bの延出した水晶片2の一端部両側は水晶端子4に導電性接着剤8によって固着される。金属カバー3は熱膨張係数が比較的セラミックに接近したコバール(Fe、Ni、Coの合金)を母材とし、表面には図示しない例えばNiメッキが設けられる。   The crystal piece 2 has excitation electrodes 7a on both main surfaces, and for example, extraction electrodes 7b extend on both sides of one end. Both sides of one end of the crystal piece 2 from which the extraction electrode 7 b extends are fixed to the crystal terminal 4 by the conductive adhesive 8. The metal cover 3 is made of Kovar (alloy of Fe, Ni, Co) whose thermal expansion coefficient is relatively close to that of ceramic, and the surface is provided with Ni plating (not shown), for example.

金属カバー3の少なくとも一主面の外周には、封止材としての共晶合金9例えばAuSn(金錫)が例えば溶融によって固着される。共晶合金(AuSn)9の融点(液相温度)は約278℃となる。そして、金属カバー3を図示しない治具等を用いて容器本体1の開口端面に位置決めし、共晶合金9を加熱溶融する。これにより、金属カバー3の外周を開口端面に接合し、水晶片2を密閉封入する。   A eutectic alloy 9 such as AuSn (gold tin) as a sealing material is fixed to the outer periphery of at least one main surface of the metal cover 3 by, for example, melting. The melting point (liquidus temperature) of the eutectic alloy (AuSn) 9 is about 278 ° C. Then, the metal cover 3 is positioned on the opening end surface of the container body 1 using a jig or the like (not shown), and the eutectic alloy 9 is heated and melted. Thereby, the outer periphery of the metal cover 3 is joined to the opening end face, and the crystal piece 2 is hermetically sealed.

このようなものでは、例えば金属カバー3のNi(ニッケル、融点が1455℃)をジュール熱によって溶融して接合するシーム溶接に比較すると、溶融温度(177℃)が格段に低くなる。したがって、金属カバー3と容器本体1との熱膨張係数差による容器本体1の湾曲や欠損を防止できる。そして、この分、枠壁1bの幅を小さくして内積を大きくできる。さらには、溶融温度が低いので、溶融時のスプラッシュの発生を防止できる等の効果を奏する。但し、共晶合金9としてAuを含むので、高価になる。
特開2001−102894号公報 特開2005−184746号公報 特開2005−340662号公報
In such a case, for example, the melting temperature (177 ° C.) is significantly lower than that of seam welding in which Ni (nickel, melting point: 1455 ° C.) of the metal cover 3 is melted and joined by Joule heat. Therefore, it is possible to prevent the container body 1 from being bent or broken due to the difference in thermal expansion coefficient between the metal cover 3 and the container body 1. Then, the inner product can be increased by reducing the width of the frame wall 1b. Furthermore, since the melting temperature is low, effects such as prevention of occurrence of splash during melting can be achieved. However, since Au is contained as the eutectic alloy 9, it becomes expensive.
JP 2001-102894 A JP 2005-184746 A Japanese Patent Laying-Open No. 2005-340661

(従来技術の問題点)
しかしながら、上記構成の表面実装振動子では、金属カバー3を容器本体1の開口端面へ位置決めする治具を用いた位置決精度によって、金属カバー3が開口端面からはみ出ることがある。したがって、この場合には、外観不良等を含めて表面実装振動子を廃棄処分とせざるを得なく、生産性を低下させる。特に、高価なAuを含む共晶合金9を使用するので損失が大きい。
(Problems of conventional technology)
However, in the surface mount vibrator having the above-described configuration, the metal cover 3 may protrude from the opening end surface due to positioning accuracy using a jig for positioning the metal cover 3 on the opening end surface of the container body 1. Therefore, in this case, the surface-mounted vibrator must be disposed of, including defective appearance, and productivity is reduced. Particularly, since the eutectic alloy 9 containing expensive Au is used, the loss is large.

また、開口端面の表面に設けた下地電極6aを含む金属膜6は共晶合金9の溶融後の収縮によって剥離を生ずることがある。特に、この例では、容器本体1の開口端面に形成された金属膜6は外周端から離間するので剥離しやすい問題があった。なお、金属カバー3が例えば開口端面の外周端からはみ出ることを防止するため、金属膜6は外周端から離間して形成される。   Further, the metal film 6 including the base electrode 6 a provided on the surface of the opening end face may be peeled off due to shrinkage after the eutectic alloy 9 is melted. In particular, in this example, there is a problem that the metal film 6 formed on the opening end face of the container body 1 is easily separated because it is separated from the outer peripheral end. In order to prevent the metal cover 3 from protruding from the outer peripheral end of the opening end face, for example, the metal film 6 is formed away from the outer peripheral end.

(発明の目的)
本発明は金属カバーの位置決めを確実にして生産性を高めた表面実装用の水晶デバイスを提供することを目的とする。
(Object of invention)
It is an object of the present invention to provide a surface-mount crystal device in which positioning of a metal cover is ensured and productivity is improved.

本発明は、特許請求の範囲(請求項1)に示したように、積層セラミックからなる底壁と枠壁を有する凹状とした平面視矩形状の容器本体内に少なくとも水晶片を収容し、前記容器本体の開口端面には下地電極を有する金属膜が設けられ、前記開口端面の外周端から離間して前記金属膜上に金属カバーが接合され、前記水晶片を密閉封入してなる表面実装用の水晶デバイスにおいて、前記容器本体における開口端面の前記金属カバーの外側となる外周表面には前記金属カバーを位置決めする突堤が少なくとも各4辺に設けられ、前記突堤は前記外周表面の外周端を含むとともに前記金属カバーの高さよりも低くした構成とする。   According to the present invention, as shown in the claims (Claim 1), at least a crystal piece is accommodated in a container body having a rectangular shape in a plan view and having a bottom wall and a frame wall made of multilayer ceramic, A metal film having a base electrode is provided on the opening end face of the container body, a metal cover is bonded on the metal film apart from the outer peripheral end of the opening end face, and the crystal piece is hermetically sealed. In the quartz crystal device, a jetty for positioning the metal cover is provided on each of the four sides on the outer peripheral surface that is the outside of the metal cover of the opening end surface of the container body, and the jetty includes the outer peripheral edge of the outer peripheral surface. And it is set as the structure made lower than the height of the said metal cover.

このような構成であれば、容器本体の各4辺に設けた突堤によって金属カバーを位置決めするので、金属カバーが容器本体の開口端面からはみ出すことがない。したがって、外観不良等によっての廃棄を防止し、生産性を高められる。この場合、一組の対角部に鉤状に設けた突堤でもよいことは勿論である。   With such a configuration, the metal cover is positioned by the jetty provided on each of the four sides of the container body, so that the metal cover does not protrude from the opening end surface of the container body. Therefore, it is possible to prevent disposal due to poor appearance and the like and to improve productivity. In this case, needless to say, a jetty provided in a bowl shape at a pair of diagonal portions may be used.

本発明の請求項2では、請求項1において、前記突堤は前記開口端面の外周を周回する枠とする。これにより、請求項1での構成をさらに具体的にする。   In Claim 2 of this invention, let the said jetty be a frame which goes around the outer periphery of the said opening end surface in Claim 1. Thereby, the structure in Claim 1 is made more concrete.

同請求項3では、請求項1において、前記突堤は前記開口端面にセラミックが印刷されて焼成される。これにより、容器本体とともに焼成によって一体的に形成できる。   In the third aspect of the present invention, in the first aspect, the jetty is fired by printing ceramic on the opening end face. Thereby, it can form integrally with baking with a container main body.

同請求項4では、請求項1において、前記下地電極は前記開口端面の外周端を含んで形成され、前記突堤は前記下地電極上に形成される。これにより、下地電極は突堤の下となって加圧されるので、共晶合金の熱収縮時の剥離を確実に防止する。   In the fourth aspect of the present invention, in the first aspect, the base electrode is formed including an outer peripheral end of the opening end face, and the jetty is formed on the base electrode. As a result, the base electrode is pressed under the jetty, so that peeling of the eutectic alloy during thermal contraction is surely prevented.

同請求項5では、請求項1において、前記下地電極は前記開口端面の外周端から離間するとともに前記容器本体の素地を露出して形成され、前記突堤は前記下地電極及び前記素地上に形成される。これにより、請求項4と同様に下地電極の剥離を防止する。そして、突堤は容器本体の素地上にも形成されるので、接合強度を高められる。   In the fifth aspect of the present invention, in the first aspect, the base electrode is formed to be separated from the outer peripheral end of the opening end surface and to expose the base of the container body, and the jetty is formed on the base electrode and the base. The This prevents the base electrode from peeling off as in the fourth aspect. And since a jetty is formed also on the ground surface of a container main body, joining strength can be raised.

同請求項6では、請求項1において、前記下地電極は前記開口端面の外周端から離間するとともに前記容器本体の素地を露出して形成され、前記突堤は前記素地上に形成される。これにより、突堤は全面的に容器本体の素地上に形成されるので、さらに接合強度を高められる。   In the sixth aspect of the present invention, in the first aspect, the base electrode is formed so as to be separated from the outer peripheral end of the opening end surface and the base of the container body is exposed, and the jetty is formed on the base. Thereby, since the jetty is formed on the entire surface of the container main body, the joint strength can be further increased.

請求項7では、請求項1において、前記金属カバーは前記開口端面の金属膜に対し、少なくともAuを含む共晶合金を加熱溶融して接合される。これにより、封止手段をさらに明確にし、Auを含む製品を廃棄しないので、さらに生産性を高める。   According to a seventh aspect of the present invention, in the first aspect, the metal cover is bonded to the metal film on the opening end surface by heating and melting a eutectic alloy containing at least Au. As a result, the sealing means is further clarified, and the product containing Au is not discarded, which further increases productivity.

第1図は本発明の第1実施形態を説明する図で、同図(a)は表面実装振動子の断面図、同図(b)は一部拡大断面図、同図(b)はシート状容器本体の一部断面図である。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。   FIG. 1 is a diagram for explaining a first embodiment of the present invention. FIG. 1 (a) is a sectional view of a surface-mounted vibrator, FIG. 1 (b) is a partially enlarged sectional view, and FIG. It is a partial cross section figure of a cylindrical container main body. In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.

表面実装振動子は前述したように、底壁1a及び枠壁1bを有する積層セラミックからなる凹状とした容器本体1に水晶片2を収容し、共晶合金9によって金属カバー3を開口端面に接合して密閉封入する。共晶合金9はAuSnとし、金属カバー3の外周に設けられる。金属カバー3は母材をコバールとしてNiメッキとする。   As described above, the surface-mount vibrator accommodates the crystal piece 2 in the concave container body 1 made of the laminated ceramic having the bottom wall 1a and the frame wall 1b, and joins the metal cover 3 to the opening end face by the eutectic alloy 9. And sealed. The eutectic alloy 9 is AuSn and is provided on the outer periphery of the metal cover 3. The metal cover 3 is Ni plated with the base material being Kovar.

そして、この実施形態では、金属カバー3の外側となる開口端面(枠壁1b上面)の外周には外周端を含んで突堤10としての環状の枠が設けられる。突堤10(環状の枠)は、金属カバー3の加熱溶融による接合時に、開口端面に対する位置決めとして機能する。   And in this embodiment, the cyclic | annular frame as the jetty 10 is provided in the outer periphery of the opening end surface (frame wall 1b upper surface) used as the outer side of the metal cover 3 including an outer peripheral end. The jetty 10 (annular frame) functions as positioning with respect to the opening end face when the metal cover 3 is joined by heating and melting.

この実施形態では、各容器本体1はセラミック生地からなる図示しないシート状底壁1A及び枠壁1Bを積層してその後分割される。例えば縦横に開口部11を有する図示しないシート状枠壁1Bの上面(開口端面)には、予め、WやMoとした下地電極6aが内周端及び外周端含む全面に形成される。この場合、水晶端子4や外部端子5等の回路パターンも同様にして形成される。   In this embodiment, each container body 1 is divided by laminating a sheet-like bottom wall 1A and a frame wall 1B (not shown) made of ceramic fabric. For example, a base electrode 6a made of W or Mo is formed in advance on the entire surface including the inner and outer peripheral ends on the upper surface (opening end surface) of the sheet-like frame wall 1B (not shown) having the openings 11 in the vertical and horizontal directions. In this case, circuit patterns such as the crystal terminals 4 and the external terminals 5 are formed in the same manner.

次に、開口端面の枠幅の両側を除いた金属膜6の中央領域にシート状突堤10を印刷によって形成する。シート状枠壁1Bはシート状底壁1Aに積層され、下地電極6a及びシート状突堤10を含めて一体的に焼成される。そして、例えば電界メッキによって下地電極6a上に導通電極6bとしてのNi及びAuを設ける。   Next, the sheet-like jetty 10 is formed by printing in the central region of the metal film 6 excluding both sides of the frame width of the opening end face. The sheet-like frame wall 1B is laminated on the sheet-like bottom wall 1A, and is integrally fired including the base electrode 6a and the sheet-like jetty 10. Then, for example, Ni and Au as the conductive electrodes 6b are provided on the base electrode 6a by electroplating.

次に、シート状容器本体1′の各凹部の内底面に設けられた水晶端子4に、図示しない引出電極7bの延出した水晶片2の一端部両側を固着して収容する。次に、環状の枠壁1b(突堤10)内となる開口端面上に金属カバー3を位置決めする。そして、図示しない加熱炉に搬入して金属カバー3の共晶合金9を加熱溶融し、各凹部の開口端面に接合する。最後に、シート状容器本体1′の開口端面に設けた突堤10の中心線A−A上を縦横に分割し、個々の表面実装振動子を得る。   Next, both sides of one end of the crystal piece 2 where the lead electrode 7b (not shown) extends are fixedly accommodated in the crystal terminal 4 provided on the inner bottom surface of each recess of the sheet-like container body 1 '. Next, the metal cover 3 is positioned on the opening end surface in the annular frame wall 1b (the jetty 10). And it carries in to the heating furnace which is not shown in figure, the eutectic alloy 9 of the metal cover 3 is heat-melted, and it joins to the opening end surface of each recessed part. Lastly, the center line AA of the jetty 10 provided on the opening end surface of the sheet-like container body 1 'is divided vertically and horizontally to obtain individual surface-mounted vibrators.

なお、この例では、シート状容器本体1′の状態で水晶片2を各凹部に収容して金属カバー3を接合したが、シート状容器本体1′を個々の容器本体1に分割した後、水晶片2を収容して金属カバー3を被せてもよい。   In this example, in the state of the sheet-like container body 1 ′, the crystal piece 2 is accommodated in each recess and the metal cover 3 is joined. However, after the sheet-like container body 1 ′ is divided into individual container bodies 1, The crystal piece 2 may be accommodated and the metal cover 3 may be covered.

このような構成であれば、容器本体1の開口端面に環状の枠からなる突堤10を設けたので、格別の治具を用いることなく、開口端面上に金属カバー3を位置決めできる。したがって、金属カバー3を簡単に位置決できて、金属カバー3が開口端面からはみ出すこともない。したがって、外観不良等を含めて不良品となることもないので、生産性を高められる。特に、金を含んだ共晶合金9をも廃棄することがないので、安価にできる。   With such a configuration, since the jetty 10 made of an annular frame is provided on the opening end surface of the container body 1, the metal cover 3 can be positioned on the opening end surface without using a special jig. Therefore, the metal cover 3 can be easily positioned, and the metal cover 3 does not protrude from the opening end surface. Therefore, since it does not become inferior goods including an external appearance defect etc., productivity can be improved. In particular, since the eutectic alloy 9 containing gold is not discarded, the cost can be reduced.

そして、この場合には、容器本体1の開口端面の外周端を含む表面上に設けた下地電極6a上に環状の枠壁1b(突堤10)を設ける。したがって、下地電極6aは突堤10の下になって加圧された状態なので、共晶合金9の溶融時における収縮によって、下地電極6aが剥離することを防止できる。   In this case, the annular frame wall 1b (the jetty 10) is provided on the base electrode 6a provided on the surface including the outer peripheral edge of the opening end surface of the container body 1. Therefore, since the base electrode 6a is pressed under the jetty 10, it is possible to prevent the base electrode 6a from being peeled off due to shrinkage when the eutectic alloy 9 is melted.

(第2実施形態)
第2図は本発明の第2実施形態を説明する表面実装振動子の図で、同図(a)は表面実装振動子の一部拡大断面図、同図(b)はシート状容器本体の一部断面図である。なお、前実施形態と同一部分には同番号を付与してその説明は簡略又は省略する。
(Second Embodiment)
FIG. 2 is a view of a surface-mounted vibrator for explaining a second embodiment of the present invention. FIG. 2A is a partially enlarged sectional view of the surface-mounted vibrator, and FIG. FIG. In addition, the same number is given to the same part as previous embodiment, and the description is simplified or abbreviate | omitted.

第2実施形態では、容器本体1の開口端面上の下地電極6aは外周端から離間し、セラミックの素地を露出して形成される。そして、突堤10としての環状の枠壁1bは、開口端面のセラミックの素地と下地電極6a上にまたがって形成される。この場合でも、表面実装振動子は第1実施形態と同様に、シート状とした状態で形成され、環状の枠壁1bは前述同様にセラミックの印刷及び焼成によって形成される。   In the second embodiment, the base electrode 6a on the opening end face of the container body 1 is formed away from the outer peripheral end and exposing the ceramic base. And the annular frame wall 1b as the jetty 10 is formed over the ceramic base of the opening end face and the base electrode 6a. Even in this case, the surface-mounted vibrator is formed in a sheet-like state as in the first embodiment, and the annular frame wall 1b is formed by printing and firing ceramics as described above.

このような構成であれば、前述同様に環状の枠壁1b(突堤10)が金属カバー3の位置決として機能するので、外観不良等を防止して生産性を高める。そして、この場合には、突堤10の外周寄りとなる一部がセラミックの素地に直接に接合するので、接合強度を高められる。また、突堤10の内周寄りとなる一部が金属膜6上に接合するので、前述同様に共晶合金9の溶融時における金属膜6の剥離を防止する。   With such a configuration, the annular frame wall 1b (the jetty 10) functions as a positioning of the metal cover 3 in the same manner as described above. In this case, a portion closer to the outer periphery of the jetty 10 is directly bonded to the ceramic substrate, so that the bonding strength can be increased. Moreover, since a part near the inner periphery of the jetty 10 is bonded onto the metal film 6, the metal film 6 is prevented from being peeled when the eutectic alloy 9 is melted as described above.

(第3実施形態)
第3図は本発明の第3実施形態を説明する表面実装振動子の図で、同図(a)は表面実装振動子の一部拡大断面図、同図(b)はシート状容器本体の一部断面図である。なお、前実施形態と同一部分には同番号を付与してその説明は簡略又は省略する。
(Third embodiment)
FIG. 3 is a view of a surface-mounted vibrator for explaining a third embodiment of the present invention. FIG. 3 (a) is a partially enlarged sectional view of the surface-mounted vibrator, and FIG. FIG. In addition, the same number is given to the same part as previous embodiment, and the description is simplified or abbreviate | omitted.

第3実施形態では、容器本体1の開口端面上の下地電極6aは外周端から第2実施形態の場合よりも離間し、セラミックの素地を露出して形成される。そして、突堤10としての環状の枠壁1bは、開口端面のセラミックの素地上に形成される。この場合でも、表面実装振動子はシート状とした状態で形成され、環状の枠壁1bはセラミックの印刷及び焼成によって形成される。   In the third embodiment, the base electrode 6a on the opening end face of the container body 1 is formed farther away from the outer peripheral end than in the second embodiment, and the ceramic base is exposed. And the annular frame wall 1b as the jetty 10 is formed in the ceramic ground surface of an opening end surface. Even in this case, the surface-mounted vibrator is formed in a sheet shape, and the annular frame wall 1b is formed by printing and firing of ceramic.

このような構成であれば、前述同様に環状の枠壁(突堤10)が金属カバー3の位置決として機能するので、外観不良等を防止して生産性を高める。そして、この場合には、突堤10のすべてがセラミックの素地に直接に接合するので、接合強度をさらに高められる。   With such a configuration, the annular frame wall (the jetty 10) functions as the positioning of the metal cover 3 in the same manner as described above. In this case, since all of the jetty 10 are directly bonded to the ceramic substrate, the bonding strength can be further increased.

(他の事項)
上記実施形態では共晶合金9はAuSnとしたが、例えばAuGe(金ゲルマニウム)でもよくAuを含む共晶合金9であればよい。なお、Auを含む共晶合金9であれば、概ねNiの溶融温度よりも大幅に低くできる。そして、共晶合金9は金属カバー3に設けたが、容器本体1の開口端面に設けてもよい。また、突堤10は環状の枠壁としたが、少なくとも各4辺に設けられていればよい。
(Other matters)
In the above embodiment, the eutectic alloy 9 is AuSn. However, for example, AuGe (gold germanium) may be used as long as it is an eutectic alloy 9 containing Au. The eutectic alloy 9 containing Au can be substantially lower than the melting temperature of Ni. And although the eutectic alloy 9 was provided in the metal cover 3, you may provide it in the opening end surface of the container main body 1. FIG. Moreover, although the jetty 10 is an annular frame wall, it should be provided at least on each of the four sides.

また、共晶合金9に代えて例えば金属カバー3のNiをシーム溶接によって要する場合でも適用できる。但し、この場合は、溶接用の金属リングは用いず、メタライズによる厚膜とした所謂ダイレクトシーム溶接とする。さらに、表面実装用の水晶デバイスは表面実装振動子としたが、ICチップと水晶片2とを一体的にした表面実装発振器の場合でも適用できる。   Moreover, it can be applied even when Ni of the metal cover 3 is required by seam welding instead of the eutectic alloy 9, for example. However, in this case, a metal ring for welding is not used, and so-called direct seam welding in which a thick film is formed by metallization is used. Further, although the surface-mount crystal device is a surface-mount resonator, it can also be applied to a surface-mount oscillator in which an IC chip and a crystal piece 2 are integrated.

同図(a)は表面実装振動子の断面図、同図(b)は一部拡大断面図、同図(b)はシート状容器本体の一部断面図である。4A is a cross-sectional view of a surface-mounted vibrator, FIG. 4B is a partially enlarged cross-sectional view, and FIG. 4B is a partial cross-sectional view of a sheet-like container body. 本発明の第2実施形態を説明する図で、同図(a)は表面実装振動子の一部拡大断面図、同図(b)はシート状容器本体の一部断面図である。FIG. 6 is a diagram for explaining a second embodiment of the present invention, in which FIG. (A) is a partially enlarged sectional view of a surface-mounted vibrator, and (b) is a partially sectional view of a sheet-like container body. 本発明の第3実施形態を説明する図で、同図(a)は表面実装振動子の一部拡大断面図、同図(b)はシート状容器本体の一部断面図である。It is a figure explaining 3rd Embodiment of this invention, The figure (a) is a partial expanded sectional view of a surface mount vibrator, The figure (b) is a partial sectional view of a sheet-like container main body. 一従来例を説明する図で、同図(a)は表面実装振動子の断面図、同図(b)は点線○印で示す部分の一部拡大断面図、同図(c)は水晶片の平面図である。FIG. 1A is a cross-sectional view of a surface-mounted vibrator, FIG. 1B is a partially enlarged cross-sectional view of a portion indicated by a dotted line, and FIG. 1C is a crystal piece. FIG.

符号の説明Explanation of symbols

1 容器本体、2 水晶片、3 金属カバー、4 水晶端子、5 外部端子、6 金属膜、7 励振及び引出電極、8 導電性接着剤、9 共晶合金、10 突堤。   DESCRIPTION OF SYMBOLS 1 Container body, 2 Crystal piece, 3 Metal cover, 4 Crystal terminal, 5 External terminal, 6 Metal film, 7 Excitation and extraction electrode, 8 Conductive adhesive, 9 Eutectic alloy, 10 Jetty

Claims (7)

積層セラミックからなる底壁と枠壁を有する凹状とした平面視矩形状の容器本体内に少なくとも水晶片を収容し、前記容器本体の開口端面には下地電極を有する金属膜が設けられ、前記開口端面の外周端から離間して前記金属膜上に金属カバーが接合され、前記水晶片を密閉封入してなる表面実装用の水晶デバイスにおいて、前記容器本体における開口端面の前記金属カバーの外側となる外周表面には前記金属カバーを位置決めする突堤が少なくとも各4辺に設けられ、前記突堤は前記外周表面の外周端を含むとともに前記金属カバーの高さよりも低いことを特徴とする表面実装用の水晶デバイス。   At least a crystal piece is accommodated in a rectangular container body having a rectangular shape in plan view having a bottom wall and a frame wall made of laminated ceramic, and a metal film having a base electrode is provided on the opening end surface of the container body, and the opening In a crystal device for surface mounting in which a metal cover is bonded onto the metal film at a distance from the outer peripheral end of the end surface and the crystal piece is hermetically sealed, the opening end surface of the container body is outside the metal cover. Quartz for surface mounting is characterized in that a jetty for positioning the metal cover is provided on at least four sides on the outer peripheral surface, and the jetty includes the outer peripheral end of the outer peripheral surface and is lower than the height of the metal cover. device. 請求項1において、前記突堤は前記開口端面の外周を周回する枠である表面実装用の水晶デバイス。   The surface mount crystal device according to claim 1, wherein the jetty is a frame that goes around an outer periphery of the opening end face. 請求項1において、前記突堤は前記開口端面にセラミックが印刷されて、焼成された表面実装用の水晶デバイス。   The surface mount crystal device according to claim 1, wherein the jetty has a ceramic printed on the opening end face and fired. 請求項1において、前記下地電極は前記開口端面の外周端を含んで形成され、前記突堤は前記下地電極上に形成された表面実装用の水晶デバイス。   2. The surface-mount crystal device according to claim 1, wherein the base electrode is formed to include an outer peripheral end of the opening end face, and the jetty is formed on the base electrode. 請求項1において、前記下地電極は前記開口端面の外周端から離間するとともに前記容器本体の素地を露出して形成され、前記突堤は前記下地電極及び前記素地上に形成された表面実装用の水晶デバイス。   2. The surface-mounting crystal according to claim 1, wherein the base electrode is formed to be separated from an outer peripheral end of the opening end surface and to expose a base of the container body, and the jetty is formed on the base electrode and the base for surface mounting. device. 請求項1において、前記下地電極は前記開口端面の外周端から離間するとともに前記容器本体の素地を露出して形成され、前記突堤は前記素地上に形成された表面実装用の水晶デバイス。   2. The surface-mount crystal device according to claim 1, wherein the base electrode is formed to be separated from an outer peripheral end of the opening end face and to expose a base of the container body, and the jetty is formed on the base. 請求項1において、前記金属カバーは前記開口端面の金属膜に対し、少なくともAuを含む共晶合金を加熱溶融して接合された表面実装用の水晶デバイス。   2. The surface-mount crystal device according to claim 1, wherein the metal cover is bonded to the metal film on the opening end face by heating and melting a eutectic alloy containing at least Au.
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