JP2009105357A - Conveying method and device for chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To greatly improve conveyance efficiency of chips cut out of a semiconductor wafer, to decrease the number of components, and to lower the cost of a device. <P>SOLUTION: In a conveying method for the chip in which the chip 4 cut out of the wafer 1 is conveyed from a pickup position 6 to a placement position 9 of a tray 8, a collet portion 12 for picking up the chip from the wafer is moved reciprocally by a Z-axial driving mechanism in a Z-axial direction to slightly approach or leave the wafer, and translated by an arm member 45 reciprocally swinging and rotating by a θ-axial rotating mechanism 14 to convey the chip from the pickup position to the placement position through the slight Z-axial movement of the collet portion in the translational motion and the reciprocal swinging movement of the arm member. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

Detailed Description of the Invention

The present invention relates to a method and an apparatus for transferring a semiconductor wafer chip, and in particular, substantially moves the movement of a conventional collet part by adsorbing a chip to a collet part that is transferred from a pickup position to a place position. By reducing the number of operations, it is possible to achieve a significant improvement in chip transfer efficiency, a reduction in the number of parts required for the device, a reduction in drive motor consumption due to a reduction in the drive motor operating rate, and a significant cost reduction in the device. The present invention relates to a periodic chip transfer method and apparatus.

Conventionally, as shown in FIG. 7, in a semiconductor manufacturing process, a semiconductor wafer 1 (hereinafter simply referred to as “wafer”) is pasted on an adhesive tape 2, a semiconductor element 3 is formed on the wafer 1, and dicing is performed. The semiconductor elements 3 are cut and separated one by one by an apparatus (not shown) to form semiconductor chips 4 (hereinafter simply referred to as “chips”), and then the adhesive tape 2 is stretched to separate the chips 4 from each other. In addition, the suction lip 5a of the collet portion 5 is separated and picked up one by one by separation (pickup). The chip 4 taken out is transported by the collet unit 5 from the pickup position 6 to the place position 9 such as the tray 8.

The operation of the collet unit 5 at this time will be described. As shown in FIGS. 7 and 8, at the start, the collet unit 5 is placed at a standby position 7 (for example, 30 mm from the pickup position 6 by 30 mm away from the place position 9). Waiting at the position near the position 9). This is because the collet unit 5 cannot be at the pickup position 6 during the chip image recognition operation, so that the collet unit 5 is picked up after the image recognition operation is completed (in some cases, after the chip position correction is completed). It is made to move to position 6.

In addition, if the collet unit 5 is completely at the place position 9 during the image recognition operation or the chip position correction operation, wasted time is caused due to the movement distance of the collet unit 5 in the X-axis direction (for example, 120 mm in total). Therefore, the collet unit 5 is moved to the place position 9, and the image processing is started when the collet unit 5 disappears from the front of the image processing camera. When the operation is completed, the robot moves from the place position 9 by 90 mm, for example, as shown by an arrow T, and waits. After the image recognition operation is completed (in some cases, after the chip position correction is completed), the standby position 7 For example, the operation is moved by 30 mm and positioned at the pickup position 6 to save operation time.

First, in step S1, the chip image is recognized. In step S2, the wafer 1 side is moved to correct the chip position of the collet unit 5. In step S3, the collet unit 5 moves from the standby position 7 as indicated by the arrow F. It moves by 30 mm in the X-axis direction and moves to the pickup position 6. In step S 4, the collet Z-axis is lowered by 35 mm down to the pickup position 6 of the chip 4 as indicated by arrow A. As a result, the suction lip 5a of the collet portion 5 lightly contacts the chip 4 and sucks the chip 4 by sucking air.

In step S5, a pickup operation (chip peeling operation) is performed, and a needle (not shown) gently pushes up the chip 4 and the adhesive tape 2 from below to separate the chip 4 from the adhesive tape 2 and separate from the wafer 1. The

Next, in step S6, the collet unit 5 performs the collet Z-axis ascending by moving 35 mm to the collet transfer position 10 of the chip 4 as indicated by an arrow B.

Then, in step S7, the collet X-axis movement, that is, the movement of 120 mm to the place position 9 of the chip 4 is performed as indicated by the arrow C. In step S8, the place operation (chip delivery operation) of the chip 4, that is, as indicated by the arrow D. The collet unit 5 is moved downward (35 mm), and is lowered until the chip 4 adsorbed to the tray 8 on the suction lip 5a of the collet unit 5 comes into light contact, and the suction of air in the collet unit 5 is stopped. As a result, the chip 4 is moved away from the suction lip 5a and placed on the tray 8, whereby the place operation of the chip 4 is completed, and the collet unit 5 moves up to the collet transport position 10 as indicated by the arrow E (35 mm). I do.

Next, in step S9, the collet X-axis movement as shown by the arrow T, that is, the 90-mm X-axis movement up to the standby position 7, is performed, and the collet unit 5 stands by at the standby position 7 as described above. Then, the process returns to step S1, and the transfer of the chip 4 from the pick-up position 6 to the place position 9 on the wafer 1 is repeated in the same manner.

As described above, the conventional chip conveying method and apparatus are as follows: 30 mm X-axis movement from the standby position 7 of the collet unit 5 to the pickup position 6; 35 mm stroke vertical Z-axis movement at the pickup position 6; 120mm horizontal X-axis movement from pickup position 6 to place position 9 at position 10, Z-axis movement in the vertical direction of 35mm stroke at place position 9, and 90mm X-axis from place position 9 to standby position 7 A total of nine movements are essential, and the movement trajectory of the collet unit 5 is in a right-angled, stepwise and complicated manner. Therefore, the tact time of one cycle of transferring the chip 4 is 0.319 seconds as an example. In other words, it is impossible to shorten it further by the conventional technology, and the chip transfer efficiency is poor.

As for the operation rate of the components, for example, when looking at the operation rate of a drive motor (not shown) that is a drive source for movement of the collet unit 5 in the X-axis direction and Z-axis direction, The X-axis movement of the collet unit 5 requires 6 rotations of the drive motor, and the Z-axis movement requires 2 rotations of the drive motor, which requires a total of 8 rotations. It was impossible to execute the cycle.

As for the number of parts required for the conveying apparatus for the chip 4, the conventional apparatus needs 98 parts as an example, and the apparatus cannot be realized with a smaller number of parts.

For this reason, the cost of the apparatus is increased accordingly, and the cost reduction of the apparatus has reached its limit, and the conventional conveyance and the apparatus cannot be expected to further reduce the cost.

  JP 2005-353873 A

The present invention has been made in order to eliminate the above-described drawbacks of the prior art, and an object of the present invention is to provide a chip transport method for transporting a chip cut from a wafer from a pickup position to a place position on a tray. The collet part that picks up the chip from the wafer is reciprocated in the Z-axis direction slightly approaching or leaving the wafer by the Z-axis drive mechanism, and translated by the arm member that reciprocally swings and rotates by the θ-axis rotation drive mechanism. Compared with the conventional transfer method and device by moving the tip from the pickup position to the place position by a slight Z-axis direction movement and reciprocating rocking rotation movement of the arm member by the collet part that moves and translates The movement of the collet part is reduced by 3 movements, and the movement of the collet part is orthogonal and stepwise. The movement time of the chip is changed to a very smooth movement, and the tact time of the chip transfer is reduced from 0.319 seconds to 0.22 seconds, that is, about 31% at a stroke. Is to dramatically improve.
Another object is to increase the operating rate of the drive motor necessary for the operation of the collet part in one cycle of chip conveyance, that is, the required rotation speed of the drive motor from the conventional 8 rotations to 1.2 rotations, that is, 85. % To reduce the consumption of the drive motor, thereby extending the life of the apparatus.
Another object of the present invention is to reduce the number of parts of the apparatus by about 20% and reduce the manufacturing cost of the apparatus by about 25%, thereby achieving a reduction in the cost of the apparatus.

Another object of the present invention is to provide a chip transfer method in which a chip cut from a wafer is transferred from a pickup position to a tray place position, and a collet portion for picking up a chip from the wafer is slightly attached to the wafer by a Z-axis drive mechanism. A pulley with a fixed tooth fixed to the base of the θ-axis rotation drive mechanism at a position concentric with the center of the reciprocating rocking rotation of the arm member, and fixed to the collet portion. The arm member is reciprocally swung by relative movement with a toothed belt wound around a rotating toothed pulley that rotates together with a rotating shaft of a collet portion rotatably supported by an arm member of a θ-axis rotation drive mechanism. The collet portion is translated by rotating the collet portion in the other direction by the amount that the arm member is rotated in one direction. Two toothed pulleys by conveying the tip from the pickup position to the place position by a slight Z-axis direction movement and a reciprocating rocking rotation movement of the arm member by the collet portion that is moved and translated; A very simple configuration of one toothed belt enables a very smooth translational movement of the collet part, and in this way, the movement of the collet part is reduced by three movements in the conveyance of the chip. It is to enable the chip to be transferred from the pick-up position to the place position very efficiently by a very smooth movement compared to the collet section at right angles and in a stepwise manner. Shortening, reducing the number of parts, drastically reducing the operating rate of the drive motor for moving the collet, and extending the life of the equipment Rutotomoni is to achieve a significant cost reduction of the apparatus.

Still another object of the present invention is to provide a chip transfer device for transferring a chip cut from a wafer from a pickup position to a tray place position, and a collet portion for picking up the chip from the wafer, and the collet portion slightly approaching the wafer. Or a Z-axis drive mechanism that reciprocates in the Z-axis direction to be detached, and a θ-axis rotation drive mechanism that translates the collet by an arm member that reciprocally swings and rotates. By moving the tip from the pick-up position to the place position by moving the direction and the reciprocating oscillating movement of the arm member, the collet operation is reduced by three movements, and the tact time of chip transfer is greatly reduced. , Reduction of the number of parts, drastic reduction of the operating rate of the drive motor for moving the collet part, and Together prolong the life of the location is to achieve a significant cost reduction of the apparatus.

Another object of the present invention is to provide a chip transfer device for transferring a chip cut from a wafer from a pickup position to a place position on a tray, and a collet part for picking up a chip from the wafer, and the collet part slightly approaching the wafer. Or a Z-axis drive mechanism that reciprocates in the Z-axis direction to be detached, a θ-axis rotation drive mechanism that reciprocally swings and rotates the arm member to which the collet portion is attached, and a base of the θ-axis rotation drive mechanism. A fixed toothed pulley fixed at a position concentric with the center of reciprocating rocking rotation, a collet rotation shaft fixed to the collet portion and rotatably supported by an arm member, and fixed to the collet rotation shaft A rotating toothed pulley that rotates together with the collet portion, and a toothed belt wound around the rotating toothed pulley and the fixed toothed pulley. The collet portion is rotated by rotating the arm member in one direction by rotating the arm member in a reciprocating manner by rotating the arm member by relative movement of the pulley with rotation, the pulley with rotation teeth and the toothed belt. By moving the chip from the pick-up position to the place position by a slight Z-axis direction movement and a reciprocating swinging movement of the arm member. This makes it possible to achieve a very smooth translational movement of the collet part with a very simple configuration of a toothed pulley and a single toothed belt. Reduces movement and picks up the chip very efficiently with a very smooth movement compared to the normal, stepwise movement of the conventional collet. It is possible to convey from the position to the place position, and this greatly reduces the tact time of chip conveyance, reduces the number of parts, drastically reduces the operation rate of the drive motor for moving the collet part, and The aim is to extend the service life and significantly reduce the cost of the device.

In short, the method of the present invention (Claim 1) is a chip transport method for transporting a chip cut from a wafer from a pickup position to a place position of a tray, and a collet portion for picking up the chip from the wafer is provided with a Z-axis drive mechanism. Is moved back and forth in the Z-axis direction slightly approaching or leaving the wafer, translated by the arm member that reciprocally swings and rotated by the θ-axis rotational drive mechanism, and the chip is slightly moved by the collet portion that translates. The chip is transported from the pick-up position to the place position by a movement in the Z-axis direction and a reciprocating oscillating rotational movement of the arm member.

According to another aspect of the present invention, there is provided a chip conveying method for conveying a chip cut from a wafer from a pickup position to a place position on a tray, wherein a collet portion for picking up the chip from the wafer is provided with a Z-axis drive mechanism. With a fixed tooth fixed to the base of the θ-axis rotation drive mechanism at a position concentric with the center of the reciprocating rocking rotation of the arm member. A toothed belt wound around a pulley and a rotating toothed pulley fixed to the collet portion and rotated together with a collet portion rotating shaft rotatably supported by an arm member of the θ-axis rotation driving mechanism By rotating the arm member in a reciprocating manner by relative movement, the collet portion is moved in the same direction as the arm member is rotated in one direction. The collet portion is translated by rotating in the direction, and the tip is moved from the pickup position to the place by a slight movement in the Z-axis direction and a reciprocating swinging rotation of the arm member by the collet portion that translates. It is transported to a position.

According to another aspect of the present invention, there is provided a chip transfer device for transferring a chip cut from a wafer from a pickup position to a place position of a tray, and a collet portion for picking up the chip from the wafer, and the collet portion. A Z-axis drive mechanism that reciprocates in the Z-axis direction slightly approaching or leaving the wafer and a θ-axis rotation drive mechanism that translates the collet by an arm member that reciprocally swings and rotates. The tip is transported from the pickup position to the place position by a slight movement in the Z-axis direction and a reciprocating rocking rotation of the arm member by the moving collet portion. .

The apparatus of the present invention (Claim 4) is a chip transfer device for transferring a chip cut from a wafer from a pickup position to a place position on a tray, and a collet portion for picking up the chip from the wafer; A Z-axis drive mechanism that reciprocates in the Z-axis direction slightly approaching or leaving the wafer, a θ-axis rotation drive mechanism that reciprocally swings and rotates the arm member to which the collet portion is attached, and the θ-axis rotation A pulley with a fixed tooth fixed to the base of the drive mechanism at a position concentric with the center of reciprocating swinging rotation of the arm member, and a collet fixed to the collet portion and rotatably supported by the arm member Rotating shaft, a pulley with a rotating tooth fixed to the rotating shaft of the collet portion and rotating together with the collet portion, a pulley with the rotating tooth and the fixed toothed pulley A toothed belt wound around a pulley, and reciprocally swinging and rotating the arm member by a relative movement of the fixed toothed pulley, the rotating toothed pulley, and the toothed belt. By rotating the collet part in the other direction by the amount of rotation in one direction, the collet part translates, and by the collet part that translates, slight movement in the Z-axis direction and reciprocal oscillation of the arm member The chip is transported from the pickup position to the place position by a rotational movement.

The present invention provides a chip conveying method for conveying a chip cut out from a wafer as described above from a pickup position to a place position on a tray. A collet portion for picking up a chip from a wafer is slightly attached to the wafer by a Z-axis drive mechanism. Reciprocating in the Z-axis direction approaching or detaching from the Z-axis, translational movement is performed by the arm member that reciprocally swings and rotates by the θ-axis rotation drive mechanism, and the tip moves the arm slightly by the collet part that translates. Since the chip is transported from the pick-up position to the place position by the reciprocating rocking rotation of the member, the operation of the collet unit can be reduced by 3 movements compared to the conventional transport method and apparatus, and the movement of the collet unit can be reduced. There is an effect that can be changed from right-angled, stepped movement to very smooth movement, and The results chips tact time of the transfer from conventional 0.319 seconds to 0.22 seconds, ie, a stroke reduced by approximately 31%, there is an effect that it is possible to dramatically improve the transport efficiency of the chip.
Another object is to increase the operating rate of the drive motor necessary for the operation of the collet part in one cycle of chip conveyance, that is, the required rotation speed of the drive motor from the conventional 8 rotations to 1.2 rotations, that is, 85. % Can be reduced at a stretch, and as a result, the consumption of the drive motor can be reduced and the life of the apparatus can be extended.
In addition, the above configuration can reduce the number of parts of the apparatus by about 20%, reduce the manufacturing cost of the apparatus by about 25%, and achieve an effect of reducing the cost of the apparatus.

Further, in a chip transport method for transporting a chip cut from a wafer from a pickup position to a place position on a tray, a collet portion for picking up a chip from the wafer is slightly moved toward or away from the wafer by a Z-axis drive mechanism. While reciprocating in the axial direction, the pulley with fixed teeth fixed to the base of the θ-axis rotation drive mechanism at the position concentric with the center of reciprocating rocking rotation of the arm member, and the θ-axis rotation fixed to the collet portion The arm member is reciprocally oscillated and rotated by a relative movement with a toothed belt wound around a rotating toothed pulley that rotates together with a collet rotating shaft that is rotatably supported by an arm member of a driving mechanism. By rotating the collet part in the other direction by the amount of rotation of the member in one direction, the collet part is translated and moved in parallel. With the collet portion that moves forward, the chip is transported from the pickup position to the place position by a slight Z-axis direction movement and a reciprocating rocking rotation movement of the arm member. The extremely simple construction of the toothed belt of the book has the effect of enabling a very smooth translational movement of the collet part. As a result, the operation of the collet part can be reduced by three movements in the chip transfer, and the conventional collet can be reduced. Compared to the normal and stepwise movement of the part, the movement is extremely smooth compared to the movement of the chip, so that the chip can be transferred from the pick-up position to the place position very efficiently. As a result, the tact time of the chip transfer is greatly reduced. , It is possible to reduce the number of parts, drastically reduce the operating rate of the drive motor for moving the collet part, and extend the life of the device. Both the effect capable of reducing the substantial cost of the device.

Furthermore, in a chip transfer device that transfers chips cut from a wafer from a pickup position to a tray place position, a collet part that picks up chips from the wafer, and the collet part slightly approaches or leaves the wafer. Equipped with a Z-axis drive mechanism that reciprocates in the Z-axis direction and a θ-axis rotation drive mechanism that translates the collet part by an arm member that reciprocally swings and rotates, and a slight movement in the Z-axis direction by the collet part that translates Since the chip is transported from the pick-up position to the place position by the reciprocating swinging movement of the arm member, the operation of the collet part can be reduced by 3 operations, the tact time of chip transport can be greatly reduced, and the number of parts , Drastically reduce the operating rate of the drive motor to move the collet and extend the life of the equipment It is possible to achieve an effect capable of reducing the substantial cost of the device.

Also, in a chip transfer device for transferring a chip cut from a wafer from a pickup position to a place position on a tray, a collet part for picking up the chip from the wafer, and a Z axis for slightly moving the collet part toward or away from the wafer A Z-axis drive mechanism that reciprocates in the direction, a θ-axis rotation drive mechanism that reciprocally swings and rotates the arm member to which the collet portion is attached, and a reciprocating swing rotation of the arm member on the base of the θ-axis rotation drive mechanism. A pulley with a fixed tooth fixed at a position concentric with the center, a collet part rotation shaft fixed to the collet part and rotatably supported by an arm member, and fixed to the collet part rotation axis and rotated together with the collet part A rotating toothed pulley, and a toothed belt wound around the rotating toothed pulley and the fixed toothed pulley. By reciprocally swinging and rotating the arm member by the relative movement of the pulley with the toothed teeth and the toothed belt, the collet portion is translated by rotating the collet portion in the other direction by the amount the arm member is rotated in one direction. And the collet portion that translates is configured to convey the chip from the pick-up position to the place position by a slight Z-axis direction movement and a reciprocating oscillating rotational movement of the arm member. In addition, an extremely simple configuration of one toothed belt has an effect of enabling a very smooth translational movement of the collet portion. In addition, as a result of this, it is possible to reduce the movement of the collet part by three movements in the transfer of the chip, and the chip is moved from the pick-up position to the place position very efficiently by a very smooth movement compared to the perpendicular and stepwise movement of the conventional collet part. As a result, the tact time of chip transfer can be greatly reduced, the number of parts can be reduced, the operation rate of the drive motor for moving the collet can be greatly reduced, and the life of the device can be extended. In addition, the cost of the apparatus can be greatly reduced.

Hereinafter, the present invention will be described based on embodiments shown in the drawings. 1 to 5, a chip transport device 11 according to the present invention is a chip transport device that transports a chip 4 cut out from a wafer 1 from a pickup position 6 to a place position 9 of a tray 8. 12, a Z-axis drive mechanism 13, a θ-axis rotation drive mechanism 14, a fixed toothed pulley 15, a collet portion rotating shaft 16, a rotating toothed pulley 18, and a toothed belt 19.

In FIG. 2, the collet portion 12 is for picking up the chip 4 from the wafer 1 and has a suction lip 12a at the lower end, is formed hollow inside, and is provided with an air suction port 12b on the side surface. An air suction pipe (not shown) is connected, and the inside is evacuated to a state close to a vacuum by an external vacuum pump (not shown) or the like. A hollow shaft 23 integral with the collet portion 12 is slidably fitted to a ball bush 22 fixed to the bracket 20 fixed to the collet portion rotating shaft 16 with a screw 21, and is always downwardly moved by a compression spring 24. It is pressed and urged toward the wafer, and is configured to elastically reciprocate in the Z-axis direction so that it can come into soft contact with the wafer 1. A stopper 25 for height adjustment is attached to the upper end of the hollow shaft 23. The collet portion 12 can be moved by loosening a plurality of nuts 26 and moving the bolts 28 up and down so that the lower ends of the bolts hit the bracket 20. The range can be regulated.

A fixing bar 30 implanted at one end of an arm member 29 integral with the collet unit rotating shaft 16 is fitted into a bush 31 press-fitted into the bracket 20 to prevent the bracket 20 from rotating with respect to the collet unit rotating shaft 16. ing.

The Z-axis drive mechanism 13 in FIG. 1 is a mechanism for reciprocating the collet portion 12 slightly (about 5 mm) in the Z-axis direction (vertical direction) that approaches or separates from the wafer 1. A pair of guide rails 33 is fixed to the base 32 by screws 37, and a Z-axis drive motor 34 is fixed by screws 35. The rotation shaft 34a of the Z-axis drive motor 34 is A bearing 36 fixed to 32 is rotatably supported and connected to a Z-axis drive screw 38.
The Z-axis drive screw 38 is screwed into a nut 40 integral with the slide table 39, and the slide table 39 is respectively screwed into a pair of linear guides 41 that are slidably fitted to the pair of guide rails 33. It is fixed. A base 44 of the θ-axis rotation drive mechanism 14 is attached to the slide table 39 with screws 43.

In FIG. 2, a θ-axis rotation drive mechanism 14 reciprocally swings and rotates an arm member 45 to which the collet portion 12 is attached. A θ-axis rotation drive motor 46 is mounted on a base 44 of the θ-axis rotation drive mechanism. The θ-axis rotation driving motor is a built-in reduction gear type in which a reduction gear 49 is integrated by a screw 48 and is attached to the base 44 via a bracket 50 to which the reduction gear 49 is fixed. It has been.
The rotation shaft 46a of the θ-axis rotation drive motor 46 (the output shaft of the speed reducer 49) is connected to the θ-rotation shaft 53 via a joint 52, and the θ-rotation shaft 53 is a bearing fixed to the base 44. 54, the one end 53a is formed to have a large diameter, the stepped portion 53b is in contact with the inner race portion 54a of the bearing 54, and the nut 55 is formed in the male screw portion 53d formed in the other end 53c. It is screwed and fastened to the inner race portion 54b.

The arm member 45 has a base end 45 a fixed to one end 53 a of the θ rotation shaft 53 by a screw 56, and a collet portion rotation shaft 16 supported by the one end 45 b via a bearing 58. The stepped portion 16b of the large-diameter portion 16a and the nut 59 screwed to the male threaded portion 16c are abutted and fixed to the inner race portions 58a and 58b, respectively. As a result, the collet portion rotating shaft 16 is fixed to the arm member 45. On the other hand, it is configured to be rotatable.

2 and 3, the fixed-tooth pulley 15 is fixed to the base 44 of the θ-axis rotation drive mechanism 14 at a position concentric with the rotation center O of the reciprocating swinging rotation of the arm member 45, and by a screw 60. The bracket 61 fixed to the base 44 is fastened and fixed by a screw 62 so that it cannot rotate. The fixed toothed pulley 15 and the rotating toothed pulley 18 have the same number of teeth.
The rotation of the arm member 45 causes the toothed belt 19 to rotate around the non-rotatable fixed toothed pulley 15, and the teeth of the toothed belt 19 mesh with the teeth of the fixed toothed pulley 15 while the arm member 45 rotates. As a result, the pulley 18 with the rotating teeth is rotated by the same angle in the direction opposite to the rotation of the arm member 45.

In FIG. 2, as described above, the collet unit rotating shaft 16 is fixed to the collet unit 12 and rotatably supported by the arm member 45, and can be pivoted to the arm member 45 via the bearing 58. It is attached.

In FIG. 2, the rotating toothed pulley 18 is fixed to the collet portion rotating shaft 16 by a screw 63 and is rotated together with the collet portion 12, and the rotation is the toothed belt 19 accompanying the rotation of the arm member 45. The rotation angle is the same as that of the arm member 45, the rotation direction is opposite to that of the arm member 45, and the reverse rotation of the rotary toothed pulley 18 with respect to the arm member 45 causes the collet portion 12 to translate. It is configured to make it.

2 and 3, the toothed belt 19 is a so-called timing belt, and is wound around a rotating toothed pulley 18 and a fixed toothed pulley 15, and in the middle is an idle pulley for adjusting tension. 65 is attached.

Then, the collet portion 12 is translated by rotating the collet portion 12 in the other direction by the amount of rotation of the arm member 45 in one direction by the relative movement of the pulley 15 with fixed teeth, the pulley 18 with rotation teeth and the belt 19 with teeth. The tip 4 is transported from the pickup position 6 to the place position 9 by a slight movement in the Z-axis direction and a reciprocating rocking rotation of the arm member 45 by the collet portion 12 that is moved and translated.

The chip transfer method according to the present invention (Claim 1) is a chip transfer method in which the chip 4 cut out from the wafer 1 is transferred from the pickup position 6 to the place position 9 of the tray 8. The collet portion 12 to be picked up is reciprocated in the Z-axis direction slightly approaching or leaving the wafer 1 by the Z-axis drive mechanism 13 and translated by the arm member 45 that reciprocally swings and rotates by the θ-axis rotation drive mechanism 14. In this method, the tip 4 is transported from the pick-up position 6 to the place position 9 by a slight movement in the Z-axis direction and a reciprocating oscillating rotational movement of the arm member 45 by the collet portion 12 that is moved and translated.

The chip transfer method according to the present invention (Claim 2) is a chip transfer method in which the chip 4 cut out from the wafer 1 is transferred from the pickup position 6 to the place position 9 of the tray 8, wherein the chip 4 is transferred from the wafer 1. The collet portion 12 to be picked up is reciprocated in the Z-axis direction slightly approaching or leaving the wafer 1 by the Z-axis drive mechanism 13 and at the position concentric with the center O of the reciprocating swinging rotation of the arm member 45. A pulley 15 with fixed teeth fixed to a base 44 of the shaft rotation drive mechanism 14 and a collet portion rotation shaft fixed to the collet portion 12 and rotatably supported by an arm member 45 of the θ-axis rotation drive mechanism 14. The arm member 45 is reciprocally oscillated and rotated by the relative movement of the toothed belt 19 wound around the rotating toothed pulley 18 that rotates together with the rotating toothed pulley 16. The collet portion 12 is translated by rotating the collet portion 12 in the other direction by the amount that the arm member is rotated in one direction, and the collet portion 12 that translates moves slightly in the Z-axis direction. In this method, the chip 4 is transported from the pickup position 6 to the place position 9 by the reciprocating rocking rotation of the arm member 45.

The present invention is configured as described above, and the operation thereof will be described below. First, the basic operation of the mechanism of the chip transfer device 11 will be described. In FIG. 1, in the Z-axis drive mechanism 13, when the Z-axis drive motor 34 rotates, the rotation shaft 34a and the Z-axis drive screw 38 are changed. Since the nut 40 rotated and screwed to move in the Z-axis direction, the pair of linear guides 41 are guided by the pair of guide rails 33 and moved in the Z-axis direction. As a result, the θ-axis rotation drive mechanism 14 The whole moves in the Z-axis direction. Thereby, the position of the collet portion 12 and its suction lip 12a in the Z-axis direction (vertical direction) with respect to the wafer 1 or the tray 8 can be freely controlled.

Next, the operation of the θ-axis rotation drive mechanism 14 will be described with reference to FIGS. 2 to 5. When the θ-axis rotation drive motor 46 rotates (reciprocally swings and rotates), the rotation shaft 46 a rotates and the joint 52 is rotated. , The θ rotation shaft 53 rotates, and the arm member 45 fixed to the θ rotation shaft 53 reciprocally swings in the direction of the arrow G or H around the rotation center O. Then, the collet portion rotating shaft 16 revolves around the rotation center O as indicated by arrows I and J along with the rotating toothed pulley 18 and the collet portion 12 while being rotatable with respect to the arm member 45.

With the revolution of the collet portion rotating shaft 16 and the rotating toothed pulley 18, the toothed belt 19 revolves with its teeth meshing with the teeth of the stationary toothed pulley 15 so as to be wound around the stationary toothed pulley 15. Here, since the fixed toothed pulley 15 is not rotatable, the toothed belt 19 revolves while shifting its meshing position with the teeth of the fixed toothed pulley 15 as it revolves. When rotated in the direction 1, the toothed belt 19 moves in the direction of arrow K (clockwise in FIG. 4), and when the arm member 45 rotates in the direction of arrow J, the toothed belt 19 moves in the direction of arrow L (FIG. 4). In the counterclockwise direction).

As a result, the fixed toothed pulley 15 and the rotating toothed pulley 18 are set to have the same number of teeth. Therefore, when the arm member 45 rotates in the direction of arrow I, the rotating toothed pulley via the toothed belt 19. When 18 rotates in the direction of arrow M, that is, in the other direction (reverse direction) (rotates while revolving), and the arm member 45 rotates in the direction of arrow J, the pulley 18 with rotating teeth is rotated in the direction of arrow N via the toothed belt 19 That is, the collet portion 12 rotates in the other direction, and always rotates at the same angle in the opposite direction (arrow M direction or N direction) from the arm member 45 via the collet portion rotation shaft 16. By reciprocating rocking rotation, the collet part 12 moves between the pickup position 6 and the place position 9 without changing the position in the rotation direction, that is, the posture in the Z-axis direction, and can move in translation. .

In short, the collet portion 12 moves extremely smoothly between the pickup position 6 and the place position 9 by translational movement as shown in FIGS. 3 to 5 by reciprocating swinging rotation of the arm member 45 in the directions of arrows I and J. be able to.

Next, with reference to FIG. 6 as well, the operation (chip transport method) of the chip transport device 11 according to the present invention will be described. First, at the start position, the collet unit 12 is at the place position 9, and there is no need to move the collet unit 12 to the standby position as in the prior art. Chip image processing is performed in step S1, and chip position correction is performed in step S2. I do.

In step S3, the arm member 45 is rotated by 207 ° in the direction of arrow J, and the collet portion 12 is immediately moved to the pickup 6 by translational movement. Here, the Z-axis drive mechanism 13 is operated to move the collet portion 12 in the direction of arrow P. As described above, the Z axis is lowered slightly (about 5 mm), and the suction lip 12a of the collet portion 12 is brought into light contact with the chip 4 of the wafer 1.

In step S4, a pickup operation (chip peeling operation) is performed. That is, the adhesive tape 2 is pressed upward by the needle 64 as indicated by the arrow R from below the wafer 1, and air is sucked from the collet portion 12 as indicated by the arrow S at this time, so that the chip 4 is attracted to the suction lip 12a. It is adsorbed and separated from the wafer 1 and peeled off. Here, the Z-axis drive mechanism 13 is actuated to raise the collet portion 12 slightly (about 5 mm) as indicated by the arrow Q, and away from the wafer 1 while holding the chip 4 with the suction lip 12a of the collet portion 12. .

Next, in step S5, the arm member 45 is rotated by 207 ° in the direction of the arrow I, and the collet portion 12 is moved to the place position 9 together with the chip 4. Here, the Z-axis drive mechanism 13 is actuated again, and the collet portion 12 is slightly lowered (about 5 mm) as shown by the arrow P to approach the tray 8.

Finally, in step S 6, the suction of air from the collet unit 12 is stopped, and the chip 4 is separated from the suction lip 12 a of the collet unit 12 and placed on the tray 8. Thereby, the place operation of the chip 4, that is, the transfer operation of the chip 4 is completed.

According to the chip conveying method and apparatus according to the present invention as described above, the collet portion 12 can move between the pickup position 6 and the place position 9 by an extremely smooth translational movement, and the movement is simple and speedy. Therefore, the operation required for one cycle of the transfer of the chip 4 can be reduced by 3 operations compared with the conventional one. As a result, the tact time can be reduced to 0.22 seconds (the conventional one is 0.319 mm). It has been found that the operating rate of the motor can be reduced by about 85%, the number of parts can be reduced by about 20%, and the product cost can be reduced by about 25%.

1 to 6 relate to the present invention, and FIG. 1 is a side view of a chip transfer device. It is a partial longitudinal cross-sectional side view of a θ-axis rotation drive mechanism. It is a principal part front view of a chip conveyance apparatus. It is a front view which shows the effect | action of the principal part of a chip | tip conveying apparatus. It is a schematic perspective view which shows the effect | action of the principal part of a chip | tip conveying apparatus. It is a flowchart figure which shows the routine of a chip | tip conveying apparatus. 7 and 8 relate to a conventional example, and FIG. 7 is a schematic perspective view showing the operation of the main part of the chip transfer device. It is a flowchart figure which shows the routine of a chip | tip conveying apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wafer 2 Adhesive tape 3 Semiconductor element 4 Chip 5 Collet part 5a Adsorption lip 6 Pickup position 7 Standby position 8 Tray 9 Place position 10 Collet conveyance position 11 Chip conveying apparatus 12 Collet part 12a Adsorption lip 12b Air suction port 13 Z-axis drive Mechanism 14 θ-axis rotation drive mechanism 15 Fixed tooth pulley 16 Collet portion rotation shaft 16a Large diameter portion 16b Stepped portion 16c Male thread portion 18 Rotating toothed pulley 19 Toothed belt 20 Bracket 21 Screw 22 Ball bushing 23 Hollow shaft 24 Compression spring 25 Stopper 26 Nut 28 Bolt 29 Arm member 30 Fixed bar 31 Bush 32 Base 33 Guide rail 34 Z-axis drive motor 34a Rotating shaft 35 Screw 36 Bearing 37 Screw 38 Z-axis drive screw 39 Slide table 40 Nut 41 Linear guide 42 Screw 43 Screw 44 The base 45 of the θ-axis rotational drive mechanism Arm member 45a Base end 45b One end 46 θ-axis rotational drive motor 46a Rotating shaft 48 Screw 49 Reducer 50 Bracket 52 Joint 53 θ Rotating shaft 53a One end 53b Stepped portion 53c The other end 53d Male thread portion 54 Bearing 54a Inner race portion 54b Inner race portion 55 Nut 56 Screw 58 Bearing 58a Inner race portion 58b Inner race portion 59 Nut 60 Screw 61 Bracket 62 Screw 63 Screw 64 Needle 65 Idle pulley A Arrow B Arrow C Arrow D Arrow E arrow F arrow G arrow H arrow I arrow J arrow K arrow L arrow M arrow N arrow O rotation center P arrow Q arrow R arrow S arrow T arrow X X axis direction Z Z axis direction

Claims (4)

In a chip transfer method for transferring a chip cut from a wafer from a pickup position to a place position on a tray, a collet portion for picking up the chip from the wafer is slightly approached or separated from the wafer by a Z-axis drive mechanism. Reciprocally move in the Z-axis direction, and translate by the arm member that reciprocally swings and rotates by the θ-axis rotational drive mechanism, and slightly moves in the Z-axis direction and reciprocally swings the arm member by the collet portion that translates. A method for conveying chips, wherein the chips are conveyed from the pickup position to the place position by a rotational motion. In a chip transfer method for transferring a chip cut from a wafer from a pickup position to a place position on a tray, a collet portion for picking up the chip from the wafer is slightly approached or separated from the wafer by a Z-axis drive mechanism. A fixed toothed pulley fixed to the base of the θ-axis rotation drive mechanism at a position concentric with the center of the reciprocating rocking rotation of the arm member, and fixed to the collet portion. The arm member is reciprocally oscillated and rotated by a relative motion of a toothed belt wound around a rotating toothed pulley that rotates together with a rotating shaft of a collet portion rotatably supported by an arm member of the θ-axis rotation driving mechanism. By rotating the collet part in the other direction by the amount by which the arm member is rotated in one direction, The collet portion is translated, and the tip is transported from the pickup position to the place position by a slight movement in the Z-axis direction and a reciprocating rocking rotation of the arm member by the collet portion that translates. A method for conveying chips. In a chip transfer device for transferring a chip cut from a wafer from a pickup position to a place position on a tray, a collet part for picking up the chip from the wafer, and the collet part slightly approaching or leaving the wafer A Z-axis drive mechanism that reciprocates in the Z-axis direction and a θ-axis rotation drive mechanism that translates the collet portion by an arm member that reciprocally swings and rotates, and a slight Z-axis direction by the collet portion that translates. A chip transfer apparatus configured to transfer the chip from the pickup position to the place position by the movement of the arm member and the reciprocating rocking rotation of the arm member. In a chip transfer device for transferring a chip cut from a wafer from a pickup position to a place position on a tray, a collet part for picking up the chip from the wafer, and the collet part slightly approaching or leaving the wafer A Z-axis drive mechanism that reciprocates in the Z-axis direction, a θ-axis rotation drive mechanism that reciprocally swings and rotates the arm member to which the collet portion is attached, and a reciprocation of the arm member on the base of the θ-axis rotation drive mechanism A pulley with a fixed tooth fixed at a position concentric with the center of swinging rotation, a collet portion rotating shaft fixed to the collet portion and rotatably supported by the arm member, and the collet portion rotating shaft A rotating toothed pulley fixed and rotating together with the collet portion, and a toothed belt wound around the rotating toothed pulley and the fixed toothed pulley. And a reciprocating swinging rotation of the arm member by the relative movement of the fixed toothed pulley, the rotating toothed pulley, and the toothed belt, thereby rotating the arm member in one direction. By rotating the collet part in the other direction, the collet part translates, and the collet part that translates moves the chip by the slight Z-axis movement and the reciprocating rocking rotation of the arm member. A chip transfer device configured to transfer from a position to the place position.

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