JP2009147356A - Vaporizer, and film forming device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vaporizer capable of suppressing the generation of particles, by circumventing the situation where a solvent valorizes to turn into particles, while micro-mist flies in the inside of a vaporization chamber, and creating an environment where micro-mist can be surely vaporized, and to provide a structure of a film forming device equipped with the vaporizer. <P>SOLUTION: This vaporizer 410 includes a spray means 411 for spraying a solution material prepared, by dissolving a material in a solvent; a vaporization chamber 412 having a heated vaporization surface for vaporizing the sprayed solution material; and a gas lead-out port 413 for leading out the material gas produced in the vaporization chamber. In the vaporizer, the vaporization surface located in the spray direction of the spray means is formed with a filter 414 having air permeability. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a vaporizer and a film forming apparatus, and more particularly to a configuration of a vaporizer for spraying and vaporizing a solution raw material.

  In general, a chemical vapor deposition apparatus (CVD apparatus) that forms a film by a gas reaction is used as a film forming apparatus that forms an insulating thin film on the surface of a substrate such as a semiconductor wafer. When a multi-component metal oxide thin film such as PZT is formed in such a CVD apparatus, the organometallic compound as a raw material is often a solid at room temperature and normal pressure. There is a need to supply the membrane processing chamber. In this case, normally, the solid raw material is dissolved in an appropriate solvent to form a liquid (referred to as a solution raw material), which is vaporized in a vaporizer and supplied to the film forming chamber. Such a raw material supply method is called a solution vaporization method and has been actively researched and developed in recent years as one of promising gasification methods to replace the bubbling method and the solid sublimation method (for example, see Patent Document 1).

  For example, a case where a ternary metal oxide thin film is formed using the above solution vaporization method will be described. Here, a film forming apparatus 100 shown in FIG. 9 is used. The film forming apparatus 100 includes a raw material supply system 101A, a vaporizer 110, and a film forming apparatus main body 120. In the raw material supply system 101A, raw material containers divided into three systems, for example, a raw material container 101a storing a lead-based raw material solution, a raw material container 101b storing a zirconium-based raw material solution, and a raw material container storing a titanium-based raw material solution The raw material solution accumulated in each of the 101c is pushed out to the raw material supply lines 103a, 103b and 103c by the supply of the pressurized gas A through the pressurized gas pipe 102, and the raw material solution is passed through the flow rate controllers 105a, 105b and 105c. Extruded to the conveying line 107. A carrier gas B such as an inert gas (for example, He, Ar) is supplied to the raw material transfer line 107, and the raw material transfer line 107a to 103c is connected to the raw material transfer line 107 by a manifold structure. The solution raw material and the carrier gas are mixed in the line 107 and sent to the vaporizer 110 in a gas-liquid mixed state. A solvent container 101d that contains a solvent such as butyl acetate, octane, or THF (tetrahydrofuran) is also provided. The solvent stored in the solvent container 101 d is also pushed out to the solvent supply line 104 by the pressurized gas A and supplied to the raw material transfer line 107 via the flow rate controller 106.

  The vaporizer 110 is provided with a spray nozzle 111, and the raw material transport line 107 is connected to the spray nozzle 111. Further, the spray gas C is supplied to the spray nozzle 111 through the flow rate controller 109 through the gas supply pipe 108. The spray nozzle 111 is provided with a spray port having a double tube structure. For example, the solution raw material and the carrier gas supplied to the inner tube are sprayed into the vaporization chamber 112 by the spray gas C supplied to the outer tube. . Here, since the vaporization temperature of the solvent used and the vaporization temperature of the raw material itself are usually different, the nozzle portion is cooled to about room temperature so that the solvent having a low vaporization temperature does not vaporize first. For example, the vaporization temperature of various raw materials (usually solid at normal temperature and normal pressure) used for film formation of PZT is approximately 180 to 250 ° C., whereas the vaporization temperature of butyl acetate as a solvent is 126 ° C.

The inner surface of the vaporization chamber 112 is a vaporization surface 112a for vaporizing the raw material, and is heated to about 200 ° C., for example. The mist-like solution raw material ejected from the nozzle 111 collides with the vaporization surface 112 a and is instantly vaporized to become a raw material gas in the vaporization chamber 112. This source gas is led out from the gas outlet 113 through the filter 114 and supplied to the film forming chamber 121 of the film forming apparatus main body 120 through the gas transport pipe 116. In the film forming chamber 121, a shower head 122 to which the gas transport pipe 116 is connected, a susceptor 123 for placing the substrate W, and the like are arranged. The shower head 122 is also supplied with an oxidizing gas such as O ₂ through the reaction gas supply pipe 117. In the film forming chamber 121, a thin film is formed on the substrate W by the reaction between the source gas and the oxidizing gas.

JP-A-7-94426

  However, in the conventional film forming apparatus, when the solution raw material is sprayed from the nozzle 111 of the vaporizer 110, the vaporization state of the raw material gas in the vaporization chamber 112 varies due to the variation of the spray state of the solution raw material. There is a problem that the supply state of the source gas to the film forming chamber 121 becomes unstable. Further, there is a problem in that particles formed by solidification of the solution raw material are generated in the vaporization chamber 112 or in the piping on the downstream side thereof, and the particles are introduced into the film formation chamber 121 to cause film formation reproducibility and film quality deterioration. There is also.

  More specifically, most of the mist-like solution raw material sprayed from the spray nozzle 111 into the vaporization chamber 112 is vaporized at the moment when it hits the high-temperature vaporized surface 112a, but some mist is The vapor is not completely vaporized and becomes a fine mist, and the solvent escapes into the spherical particles inside the vaporization chamber 112 or in the piping downstream thereof. When the particles actually remaining inside the vaporizer were observed with a scanning electron microscope, the size of the spherical particles varied and was widely distributed to a diameter of 0.1 to 1.8 μm. Here, assuming that the solvent is simply volatilized from the mist sprayed in the vaporization chamber 112 and spherical particles are generated, the size of the sprayed mist is not uniform and is widely distributed in the range of 20 to 370 μm in diameter. It is estimated that Therefore, when a relatively large mist collides with the vaporization surface 112 a, the solution raw material is not completely vaporized, resulting in a finer mist (spray), and the solvent while the fine mist is flying inside the vaporization chamber 112. It is considered that is volatilized and particles are generated.

  In addition, the generation of the particles can be partially removed by a filter (mesh) 114 disposed in front of the gas outlet 113, but the minute mist passes through the filter 114 to cause particles in the downstream pipe. In addition, there is a problem that the filter 114 is likely to be clogged if the eyes are made fine in order to improve the particle removal performance.

  Therefore, the present invention solves the above-mentioned problems, and its problem is to avoid a situation where the solvent is volatilized and particles while the fine mist flies inside the vaporization chamber, and the fine mist is reliably obtained. It is an object of the present invention to provide a vaporizer capable of suppressing generation of particles by creating an environment that can be vaporized and a configuration of a film forming apparatus including the vaporizer.

  The vaporizer of the present invention includes a spray means for spraying a solution raw material obtained by dissolving a raw material in a solvent, a vaporization chamber having a heated vaporization surface for vaporizing the sprayed solution raw material, and the vaporization chamber In the vaporizer having a gas outlet for deriving the raw material gas generated in the step, the vaporization surface in the spray direction of the spray means is constituted by a filter having air permeability.

  According to the present invention, since the solution raw material is sprayed on the filter by the spraying means, even if the mist is scattered inside the filter to become a fine mist, a part of the fine mist is scattered inside the filter. Since it is vaporized again by hitting the part of the filter, the vaporization rate can be increased and the generation of particles can be suppressed as in the case where the interval between the plurality of vaporization surfaces is substantially reduced. In addition, vaporization may be performed in a state where the solution raw material permeates the filter and spreads on the surface of the filter material.

  Here, the gas outlet may be provided in front of the filter when viewed from the spraying means, or may be provided behind the filter material when viewed from the spraying means. In the former case, the gas outlet may be on the side of the filter as seen from the spraying means as shown in FIG. 14, or may be provided on the spraying means side (upper wall). The filter can be composed of a mesh made of a fibrous material, a filter material obtained by solidifying the fibrous material, a porous material, or the like.

  In the present invention, the surface of the filter is preferably in contact with a heat transfer material having a plurality of openings and heated through the heat transfer material. Since the surface of the filter is in contact with the heat transfer material and is heated through the heat transfer material, the entire surface of the filter can be heated more uniformly, so that the vaporization rate of mist can be increased. In addition, the generation of particles can be further suppressed. In addition, since the heat transfer material has a plurality of openings, the mist can reach the filter through these openings, or the raw material gas that has passed through the filter can be discharged through these openings. It becomes possible to do. The back surface of the filter is preferably in contact with a heat transfer material having a plurality of openings and heated through the heat transfer material. In particular, when the heat transfer material is disposed in contact with the front and back surfaces of the filter, the filter can be heated almost uniformly over the entire surface.

  In the present invention, it is preferable that a seal is provided between the filter and the vaporizing chamber. According to this, it is possible to prevent mist and particles from leaking from the gap.

  In this invention, it is preferable that the said filter has a concave-curved back surface toward the said spraying means. According to this, since the vaporization state of mist can be made more uniform, it is effective in improving the vaporization rate and reducing particles.

  In the present invention, the back surface of the filter is preferably disposed so as to contact the inner surface of the vaporization chamber. According to this, it can comprise so that heat may be transmitted to a filter from the inner surface of a vaporization chamber. In this case, in particular, since a temperature gradient can be formed in the filter so that the temperature on the back surface side is relatively higher than the temperature on the front surface side, use a wider range in the thickness direction of the filter. Since the source gas can be vaporized, the distribution of deposits can be relaxed and clogging of the filter can be suppressed.

  In this invention, it is preferable to have a purge gas supply means for supplying purge gas from the back surface of the filter. According to this, the adhesion of particles to the filter is reduced by the purge gas, and the once adhered particles can be removed.

  Next, still another vaporizer according to the present invention includes a spraying means for spraying a solution raw material obtained by dissolving the raw material in a solvent, and a vaporization surface having a heated vaporization surface for vaporizing the sprayed solution raw material. In the vaporizer having a chamber and a gas outlet for deriving the raw material gas generated in the vaporization chamber, the vaporization surface in the spraying direction of the spraying means is constituted by a porous material having a large number of holes or holes. It is characterized by being.

  According to the present invention, since a large number of holes or holes are provided on the surface of the porous material, the mist that has reached a certain inner surface portion of the holes or holes of the porous material is scattered to generate a fine mist. However, since the probability that the fine mist is vaporized by contacting the hole or another inner surface portion of the hole is increased, the same effect as when the interval between the plurality of vaporized surfaces is reduced is substantially obtained. The rate can be improved and the generation of particles can be suppressed.

  Here, the gas outlet is provided on the front side of the porous material when viewed from the spraying means, when it is provided on the spraying means side, and when the porous material is provided with a through-hole and is porous when viewed from the spraying means. It may be provided behind the material.

  In the present invention, it is preferable that the holes or holes of the porous material are through-holes having an axial distance shorter than the opening width, and the plurality of porous materials are arranged so as to overlap in the spraying direction. According to this, the mist collides between a plurality of porous materials (perforated plates), which is substantially the same as when the interval between the plurality of vaporized surfaces is reduced, improving the vaporization rate and generating particles. Can be suppressed. Here, among the plurality of porous materials, it is desirable that the through holes provided in each of the adjacent porous materials are arranged at positions where they do not overlap each other in a planar manner. As a result, since the mist that has passed through the through hole of a certain porous material comes into contact with the surface of the adjacent porous material (portion without the through hole) and is vaporized, the fine mist can be efficiently vaporized, It can be configured that a fine mist is difficult to pass through a plurality of porous material installation regions.

  Moreover, it can also comprise so that the temperature fall of the center part of a porous material may not arise by hollowing out the center part of a porous material. For example, an opening larger than the above holes and holes may be provided in the center of the perforated plate, or a larger hole may be provided as the center of the perforated plate is closer. This is because when a large amount of mist hits the porous material, the temperature at the center of the porous material decreases due to the heat of vaporization of the mist.

  In the present invention, it is preferable that the hole or hole of the porous material has an axial distance longer than an opening width. According to this, even when a fine mist that is not partially vaporized remains when the mist that has penetrated into the hole or hole of the porous material (porous body) contacts the inner surface of the hole or hole and is vaporized, Immediate contact with the hole or other part of the hole causes vaporization again, so that the vaporization rate can be improved and particles can be reduced.

  In this invention, it is preferable to have a vibration means for vibrating the porous material. According to this, vaporization of mist can be promoted, and adhesion of particles can be prevented.

  Next, the film forming apparatus of the present invention uses any of the above vaporizers, a raw material supply system for supplying the solution raw material to the vaporizer, and the raw material gas derived from the vaporizer. And a film formation chamber for film formation. Since the particles can be reduced by having the above vaporizer, the film quality can be improved in the film formation process performed in the film formation chamber.

The longitudinal cross-sectional view which shows the structure of the vaporizer | carburetor of 1st Embodiment. The longitudinal cross-sectional view which shows the structure of the vaporizer | carburetor of 2nd Embodiment. The longitudinal cross-sectional view which shows the structure of the vaporizer | carburetor of 3rd Embodiment. The longitudinal cross-sectional view which shows the structure of the vaporizer | carburetor of 4th Embodiment. The longitudinal cross-sectional view which shows the structure of the vaporizer | carburetor of 5th Embodiment. The longitudinal cross-sectional view which shows the structure of the vaporizer | carburetor of 6th Embodiment. The longitudinal cross-sectional view which shows the structure of the vaporizer | carburetor of 7th Embodiment. The longitudinal cross-sectional view which shows the structure of the vaporizer | carburetor of 8th Embodiment. The schematic block diagram which shows the whole structure of the film-forming apparatus containing the conventional vaporizer | carburetor.

  Next, an embodiment of a vaporizer and a film forming apparatus according to the present invention will be described with reference to the drawings. The following embodiments of the vaporizer and the film forming apparatus are basically the same as those described in the film forming apparatus 100 including the raw material supply system 101A, the vaporizer 110, and the film forming apparatus main body 120 shown in FIG. They have the same general structure, and in particular, a description of a case where a film forming apparatus is configured using a vaporizer described below will be omitted.

[First Embodiment]
First, the vaporizer 410 according to the first embodiment of the present invention will be described with reference to FIG. The vaporizer 410 of this embodiment includes a spray nozzle 411, a vaporization chamber 412 heated by a heating means 412c, and the like, and a gas outlet 413 is provided.

  In this embodiment, a filter 414 is disposed inside the vaporization chamber 412, and the surface 414 a of the filter 414 is disposed to face the spray port 411 a of the spray nozzle 411, thereby becoming a substantially main vaporization surface. ing. The filter 414 is made of a mesh made of a fibrous material such as metal, a filter material obtained by compressing the fibrous material, a porous material, or the like. It is desirable that the filter 414 and the vaporizing chamber 412 be sealed with a sealing means such as an O-ring or a gasket so that mist and particles do not leak from the gap.

  In the present embodiment, the gas outlet 413 is disposed behind the filter 414 when viewed from the spray port 411a. Therefore, the vaporization space 412S is constituted by a space between the spray port 411a inside the vaporization chamber 412 and the filter 414, and the raw material gas generated in the vaporization space 412S passes through the filter 414 or the filter 414. The raw material gas generated in the inside is discharged from the filter 414, and is led out from the gas outlet 413.

  In this embodiment, the mist sprayed from the spray port 411a is sprayed directly on the surface 414a of the filter 414. The mist sprayed on the surface 414a is in a state where the filter 414 is heated by the heating means 412c, and thus is instantly vaporized by receiving heat from the filter 414. At this time, the fine mist remaining without being vaporized A part proceeds inside the filter 414 due to a pressure difference (pressure gradient) between the vaporization space 412 </ b> S and the gas outlet 413, and further vaporizes in contact with the other part of the filter 414. Therefore, since the mist discharged from the spray port 411a collides with the surface 414a and is partly vaporized in contact with the other part of the filter 414 at a slight flight distance, Effects similar to the case where the interval between the first vaporization surface opposed to the spray nozzle and the second vaporization surface opposed to the first vaporization surface is narrowed, that is, improvement of vaporization rate and reduction of particles, etc. An effect can be obtained.

  In this embodiment, since the filter 414 is disposed in a state of being separated from the bottom surface of the vaporization chamber 412 (the inner surface around the gas outlet port 413), a high filter effect is obtained by effectively using almost the entire surface of the filter 414. be able to. However, the filter 414 is brought into contact with the bottom surface of the vaporizing chamber 412, and the filter 414 is heated through the bottom surface, so that the solution raw material is sprayed from the spray port 411a of the spray nozzle 411. A temperature gradient may be formed in the thickness direction of the filter 414 so that the temperature of the filter 414 is relatively low and the temperature of the surface 414a is relatively low. Accordingly, the uneven distribution of deposits in the thickness direction in the filter 414 can be alleviated, so that clogging of the filter 414 can be suppressed and the life of the filter 414 can be extended.

  Note that, in each embodiment, the gas outlet 413 may be provided on the surface 414a side of the filter 414 as in each embodiment described later. In this case, the filter effect of the filter 414 cannot be given to the source gas passing through the gas outlet 413, but the improvement of the vaporization rate and the effect of reducing the particles can be obtained similarly. In this case, a filter different from the filter 414 may be installed at the gas outlet 413.

[Second Embodiment]
Next, a vaporizer 420 according to a second embodiment of the present invention will be described with reference to FIG. In the vaporizer 420 of this embodiment, the surface 424a of the filter 424 similar to that of the twelfth embodiment is disposed as a vaporization surface so as to face the spray port 421a of the spray nozzle 421. It arrange | positions so that an inner surface may be contacted. The gas outlet 423 is provided on the side surface of the filter 424 on the surface 424a side.

  In this embodiment, since the heat generated by the heating means 422c is transmitted from the inner surface of the vaporizing chamber 422 to the filter 424, the solution raw material is sprayed from the spray port 421a of the spray nozzle 421. A temperature gradient can be formed in the thickness direction of the filter 424 so that the temperature on the back surface side of the filter 424 is high and the temperature of the front surface 424a is relatively low. As a result, the vaporization of the raw material gas can be caused by using a wider range in the thickness direction of the filter 424, the deposit distribution in the thickness direction in the filter 424 is relaxed, and clogging of the filter 424 is suppressed. can do.

  In the vaporizer 420 of this embodiment, as in the first embodiment, the mist sprayed from the spray port 421a is sprayed on the surface 424a of the filter 424, receives heat from the filter 424, and is instantly vaporized. If it is not completely vaporized, fine mist is scattered around. Of these fine mists, the ones facing the inside of the filter 424 come into contact with other parts of the filter 424 and are vaporized here. The source gas generated by the filter 424 is led out to the outside from the vaporization space 422S through the gas outlet 423. In particular, when it is desired to avoid clogging of the filter (mesh) or to regenerate the filter by expelling particles clogged in the filter, a purge gas may be separately supplied from the back surface of the filter 424. The purge gas reduces the adhesion of particles to the filter, and the once adhered particles can be removed.

[Third Embodiment]
Next, a vaporizer 430 according to a third embodiment of the present invention will be described with reference to FIG. In the vaporizer 430 of this embodiment, a filter 434 is disposed inside the vaporization chamber 432, and the surface 434a of the filter 434 is disposed opposite to the spray port 431a of the spray nozzle 431, as in the second embodiment. . The gas outlet 433 is provided behind the filter 434 when viewed from the spray port 431a.

  In the present embodiment, the heat transfer materials 435 and 436 made of a material having good thermal conductivity such as aluminum are disposed so as to contact the front and back surfaces of the filter 434. These heat transfer materials 435 and 436 have a function of contacting the inner surface of the vaporizing chamber 432 and transferring the heat generated from the heating means 432c to the filter 434. The heat transfer materials 435 and 436 have a plurality of openings 435a and 436a, and are configured such that the front and back surfaces of the filter 434 are exposed by the openings 435a and 436a. These openings preferably have dimensions that are significantly larger than the eyes of the filter, and the openings are preferably arranged vertically and horizontally along the front and back surfaces of the filter 434.

  In this embodiment, since the heat transfer materials 435 and 436 are disposed in contact with the front and back surfaces of the filter 434, the filter 434 can be heated almost uniformly over the entire surface. Can be reduced. At this time, the openings 435a and 436a of the heat transfer materials 435 and 436 allow the mist to be directly sprayed on the surface of the filter 434, and the source gas moves from the back surface of the filter 434 toward the gas outlet 433 without any problem. I can do it. In this embodiment, only one of the heat transfer materials 435 and 436 may be used. Further, heating means such as a heater may be directly incorporated in the heat transfer materials 435 and 436.

[Fourth Embodiment]
Next, a vaporizer 440 according to a fourth embodiment of the present invention will be described with reference to FIG. In the vaporizer 440 of this embodiment, a filter 444 having a concavely curved surface 444a toward the spray port 441a of the spray nozzle 441 is disposed inside the vaporization chamber 442. The filter 444 is disposed in contact with a heat transfer material 445 having a concave curved surface. The heat transfer material 445 is provided with a plurality of openings 445a as in the fourteenth embodiment.

  In this embodiment, since the surface 444a of the filter 444 is formed in a concave curved surface shape, the distance from the spray port 441a can be made substantially the same over the entire surface. Accordingly, the vaporization state of the mist can be made more uniform, which is effective in improving the vaporization rate and reducing particles. Here, it is more preferable that the surface 444a has a spherical shape (hemispherical shape) centered around the vicinity of the spray port 441a.

[Fifth Embodiment]
Next, a vaporizer 450 according to a fifth embodiment of the present invention will be described with reference to FIG. In the vaporizer 450 of this embodiment, perforated plates 454 and 455 which are porous materials provided with a large number of holes 454a and 455a are disposed inside the vaporization chamber 452. The perforated plates 454 and 455 are arranged so as to overlap each other when viewed from the spray port 451a. At this time, it is desirable that the hole 454a of the porous plate 454 and the hole 454a of the porous plate 455 are configured to be arranged at different positions in a plan view when viewed from the spray port 451a. The gas outlet 453 is provided on the wall surface of the vaporization chamber 452 on the spray port 451a side. Further, the perforated plates 454 and 455 may be heated by receiving conduction heat from the vaporizing chamber, or a heating means such as a heater may be directly incorporated inside the perforated plate.

  In this embodiment, the mist sprayed from the spray port 451a is heated and vaporized on the surfaces of the perforated plates 454 and 455, but some fine mist that could not be completely vaporized is other than the holes 454a and 455a. It comes into contact with the inner surface and the front or back surface of another perforated plate, and again receives heat and vaporizes. Therefore, since the flight distance of fine mist can be substantially shortened, the evaporation rate can be improved and the generation of particles can be suppressed.

  Here, depending on the case, the central portions of the perforated plates 454 and 455 may be cut out (largely) so that the mist from the nozzle directly hits the inner wall of the vaporizer. For example, an opening larger than the above holes and holes may be provided in the center of the perforated plate, or a larger hole may be provided as the center of the perforated plate is closer. As a result, it is possible to prevent the temperature of the central portion of the perforated plate from being lowered when a large amount of mist hits the perforated plate. This is because the temperature of the central portion of the porous material is likely to decrease due to the heat of vaporization of the mist, so that it is necessary to prevent solids from being deposited in the central portion.

[Sixth Embodiment]
Next, a vaporizer 460 according to a sixth embodiment of the present invention will be described with reference to FIG. The vaporizer 460 of this embodiment is the same as the fifth embodiment in that a porous body (porous block) 464, which is a porous material having a large number of holes, is disposed inside the vaporization chamber 462. The hole 464a of the porous body 464 differs from the above in that it has an axial distance (penetration distance or depth) longer than its opening width (opening diameter). The porous body 464 can have, for example, a honeycomb structure. When the gas outlet port 463 is disposed behind the porous body 464 when viewed from the spray port 461a of the spray nozzle 461 as in the illustrated example, the hole 464a is configured as a through hole. Further, although different from the illustrated example, the gas outlet port is located on the side of the porous body 464 on the spray port 461a side as shown in FIG. 2, or the gas outlet port is connected to the spray port similarly to that shown in FIG. When provided on the 461a side, the hole 464a may be a hole having a bottom.

  The cross-sectional shape of the hole of the porous body 464 may be a circle, a triangle, a rectangle, a hexagon, or the like. In some cases, a fin-like material (such as a radiator) may be used instead of the porous material. The porous body 464 is heated by conduction heat from the vaporizing chamber 462 or by a heating means such as a heater built in directly. Further, the porous body 464 may be vibrated by an ultrasonic vibrator or the like in order to promote vaporization of mist or prevent adhesion of particles.

  In this embodiment, the mist sprayed from the spray port 461a contacts the inner surface of the hole 464a of the porous body 464 and is vaporized in the same manner as described above, but here, the fine mist remaining without being vaporized is Instead of flying a long distance, it contacts the other inner surface part in its hole 464a and is vaporized there again. Accordingly, the vaporization rate is improved as described above, and the generation of particles can be suppressed.

[Seventh Embodiment]
Next, a vaporizer 470 according to a seventh embodiment of the present invention will be described with reference to FIG. In the vaporizer 470 of this embodiment, the porous body 474 configured in the same manner as in the sixth embodiment and the porous plates 475 and 476 configured in the same manner as in the sixteenth embodiment are spray nozzles in the vaporization chamber 472. The nozzles 471 are sequentially arranged in the spray direction of the spray ports 471a. The gas outlet 473 is provided behind the perforated plates 475 and 476.

  In this embodiment, since the fine mist that has passed through the porous body 474 can be further captured and vaporized by the porous plates 475 and 476, the vaporization rate can be further improved and particles can be reduced. More specifically, the mist and particles that have passed through the porous body 474 are almost straight along the axial direction of the hole in the vicinity of the outlet due to the rectifying action of the porous body. While the mist and particles that have traveled straight collide with the perforated plates 475 and 476 perpendicularly, the gas can pass through the holes of the perforated plate. Mist and particles that collide with the perforated plate are vaporized there or captured by the perforated plate by van der Waals force. In this embodiment, a porous plate may be disposed on the spray port 471a side and a porous material may be disposed on the gas outlet port 473 side.

[Eighth Embodiment]
Finally, with reference to FIG. 8, a vaporizer 480 according to an eighth embodiment of the present invention will be described. In the vaporizer 480 of this embodiment, the perforated plates 484 and 485 configured in the same manner as in the fifth embodiment inside the vaporization chamber 482 are disposed to face the spray port 481 a of the spray nozzle 481. And the porous body 486 comprised similarly to 6th Embodiment is provided in the position before the gas outlet 483. FIG.

  In this embodiment, the fine mist that has passed through the porous plates 484 and 485 can be further captured and vaporized by the porous body 486 disposed in front of the gas outlet 483, so that the vaporization rate is improved and the particles are reduced. Can be achieved. Since the gas outlet 483 is provided on the spray port 481a side, the porous body 486 is also disposed on the spray port 481a side of the porous plates 484 and 485. In the present embodiment, the porous plates 484 and 485 and the porous body 486 may be replaced with each other.

  It should be noted that the vaporizer and the film forming apparatus of the present invention are not limited to the illustrated examples described above, and various changes can be made without departing from the scope of the present invention. For example, in each of the above embodiments, the description has been made on the assumption that the raw material for PZT film formation is vaporized. However, the present invention is not limited to this, and is applicable to the case of vaporizing the raw material for other film types. Is possible. As other film types, for example, when a thin film of SBT metal oxide is formed by vaporizing Sr raw material, Bi raw material, and Ta raw material, or BLT metal is vaporized by Bi raw material, La raw material, and Ti raw material. When forming a thin film of oxide, etc., when vaporizing Ba raw material, Sr raw material and Ti raw material to form a thin film of BST metal oxide, etc., or vaporizing Sr raw material and Ti raw material, STO metal oxidation For example, when a thin film of an object is formed.

DESCRIPTION OF SYMBOLS 100 ... Film-forming apparatus, 101A ... Raw material supply system, 110 ... Vaporizer, 103a, 103b, 103c ... Raw material supply line, 107 ... Raw material conveyance line, 411 ... Spray nozzle, 412 ... Vaporization chamber, 413 ... Gas outlet port, 414 ... Filter, 414a ... Surface, 435, 436 ... Heat transfer material, 454, 455 ... Perforated plate, 464 ... Porous body, 410, 420, 430, 440, 450, 460, 470, 480 ... Vaporizer

Claims (13)

  Spray means for spraying a solution raw material obtained by dissolving the raw material in a solvent, a vaporization chamber having a heated vaporization surface for vaporizing the sprayed solution raw material, and a raw material gas generated in the vaporization chamber A vaporizer having a gas outlet for deriving gas, wherein the vaporizing surface in the spray direction of the spray means is constituted by a filter having air permeability.   The vaporizer according to claim 1, wherein the surface of the filter is in contact with a heat transfer material having a plurality of openings and is heated through the heat transfer material.   The vaporizer according to claim 1, wherein a seal is provided between the filter and the vaporizing chamber.   The vaporizer according to any one of claims 1 to 3, wherein a back surface of the filter is in contact with a heat transfer material having a plurality of openings, and is heated through the heat transfer material.   The vaporizer according to any one of claims 1 to 4, wherein the filter has a concave curved back surface toward the spraying means.   The vaporizer according to claim 1, wherein a back surface of the filter is disposed so as to contact an inner surface of the vaporization chamber.   The vaporizer according to claim 6, wherein a temperature gradient is formed in the filter such that a temperature on the back surface side is relatively higher than a temperature on the front surface side.   8. The vaporizer according to claim 6, further comprising purge gas supply means for supplying a purge gas from the back surface of the filter.   Spray means for spraying a solution raw material obtained by dissolving the raw material in a solvent, a vaporization chamber having a heated vaporization surface for vaporizing the sprayed solution raw material, and a raw material gas generated in the vaporization chamber A vaporizer having a gas outlet for deriving gas, wherein the vaporization surface in the spraying direction of the spraying means is constituted by a porous material having a number of holes or holes.   The hole or hole of the porous material is a through hole having an axial distance shorter than the opening width, and the plurality of porous materials are arranged so as to overlap in the spraying direction. Vaporizer.   The vaporizer according to claim 9, wherein the hole or hole of the porous material has an axial distance longer than an opening width.   The vaporizer according to claim 9, further comprising a vibration unit that vibrates the porous material.   A vaporizer according to any one of claims 1 to 12, a raw material supply system for supplying the solution raw material to the vaporizer, and a film for forming a film using the raw material gas derived from the vaporizer. A film formation apparatus including a film formation chamber.

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