JP2009141183A - Laminated cooler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase the cooling performance of a laminated cooler that cools multiple types of heating elements having different maximum heating values. <P>SOLUTION: A laminated cooler includes: multiple cooling tubes 3; first and second communication members 4a and 4b that are positioned on both ends of the cooling tubes 3 in a longitudinal direction so as to communicate the multiple cooling tubes 3 with each other; and a divider 43 that divides the inside of at least one communication member 4a of the first and second communication members 4a and 4b into an upstream-side section and a downstream-side section. The multiple cooling tubes 3 are laminated so that each electronic component 2 sandwiched between two cooling tubes 3 is held from both sides; and comprise two outer cooling tubes 31a and 31b that are positioned on both ends in a laminating direction, and multiple inner cooling tubes 3b positioned between the two outer cooling tubes 31a and 31b. Among multiple types of electronic components 2, a second electronic component 22 having a maximum heating value relatively greater than that of a first electronic component 21 is preferentially positioned so as to be in contact with the outer cooling tube 31a, of the two outer cooling tubes 31a and 31b, which is positioned on the upstream side of cooling medium flow relative to the divider 43. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a stacked cooler for cooling a plurality of heating elements from both sides.

2. Description of the Related Art Conventionally, in order to dissipate heat from a semiconductor module (heating element) incorporating a semiconductor element, a stacked type cooler configured by arranging a cooling pipe so as to sandwich the semiconductor module from both sides is known. Such a stacked type cooler has a configuration in which semiconductor modules and cooling pipes are alternately stacked, and the plurality of stacked cooling pipes communicate with each other through a communication member, and a cooling medium flows to each cooling pipe. (For example, refer patent document 1).
JP 2005-191527 A

  By the way, in the conventional stacked cooler described above, when the semiconductor elements are integrated in the semiconductor module in order to reduce the size and the cost, the amount of heat generated in the entire semiconductor module increases. Therefore, in order not to exceed the allowable temperature of the semiconductor element, it is necessary to cope with it by improving the cooling performance of the stacked cooler.

  On the other hand, a method of improving the heat transfer rate by changing the shape inside the cooling pipe, such as changing the shape of the inner fin, and thereby improving the cooling performance can be considered. However, since the flow rate of the cooling medium in the laminated cooler is fixed and small, a conventional laminated structure in which a so-called all-pass structure in which the cooling medium flows in one direction through all of the plurality of cooling pipes is adopted for reasons such as mountability. In the mold cooler, even if the shape inside the cooling pipe is improved, the cooling performance cannot be sufficiently improved.

  In view of the above points, an object of the present invention is to improve cooling performance in a stacked cooler that cools a plurality of types of heating elements having different maximum heat generation amounts.

  In order to achieve the above object, the invention according to claim 1 is formed in a flat shape having a main surface (311a, 311b) in contact with the heating element (2) and a refrigerant passage (30) through which a cooling medium flows. A plurality of cooling pipes (3), first and second communication members (4a, 4b) arranged at both longitudinal ends of the cooling pipe (3) and communicating with the plurality of cooling pipes (3), Partitioning means (43) for partitioning the inside of at least one communication member (4a) among the first and second communication members (4a, 4b) into an upstream side and a downstream side, and the plurality of heating elements (2), It consists of a plurality of types of heating elements (21, 22) with different maximum heat generation amounts, and the plurality of cooling pipes (3) can sandwich the heating elements (2) arranged alternately with the cooling pipes (3) from both sides. Two outer cooling pipes (31a, 31a, arranged at both ends in the stacking direction as well as stacked 1b) and a plurality of inner cooling pipes (3b) disposed between the two outer cooling pipes (31a, 31b), and the maximum heating value of the plurality of types of heating elements (2) is the other heating element. A heating element (22) that is relatively larger than (21) is placed in the outer cooling pipe (31a) arranged upstream of the cooling medium flow from the partition means (43) of the two outer cooling pipes (31a, 31b). It is characterized by being preferentially disposed so as to abut.

  By providing partition means (43) for partitioning the inside of at least one communication member (4a) out of the first and second communication members (4a, 4b) into an upstream side and a downstream side, the cooling medium is a stacked type cooler. You can make it flow like it turns inside. Thereby, even if the flow rate of the cooling medium flowing into the stacked cooler is fixed, the flow rate of the cooling medium per cooling pipe (3) can be increased.

  However, if the cooling medium is simply configured to turn inside the stacked cooler, cooling at the inlet of the cooling pipe (3) disposed after the turn, that is, downstream of the cooling medium flow from the partition means (43). The medium temperature rises extremely. For this reason, in the cooling pipe (3) arranged downstream of the cooling medium flow from the partitioning means (43), the heating element (2) cannot be sufficiently cooled.

  By the way, the maximum heat generation amount of the plurality of heating elements (2) mounted on the stacked cooler may not be uniform in all the heating elements (2). In the stacked cooler, since only one side of the two outer cooling pipes (31a, 31b) disposed at both ends in the stacking direction is in contact with the heating element (2), the inner cooling pipe (3b) Compared with the cooling performance. Further, of the two outer cooling pipes (31a, 31b), the outer cooling pipe (31a) arranged upstream of the cooling medium flow from the partitioning means (43) is arranged downstream of the cooling medium flow from the dividing means (43). The cooling performance is higher than that of the outer cooling pipe (32a). That is, of the two outer cooling pipes (31a, 31b), the outer cooling pipe (31a) arranged on the upstream side of the cooling medium flow from the partition means (43) has the most cooling performance among the plurality of cooling pipes (3). It is high.

  Therefore, the heat generating element (22) having a maximum heat generation amount that is relatively larger than the other heat generating elements (21) among the plurality of types of heat generating elements (2) is divided into the two outer cooling pipes (31a, 31b). (43) Heat generation that maximizes the maximum amount of heat generation among the plurality of types of heating elements (2) by preferentially disposing the outer cooling pipe (31a) disposed upstream of the cooling medium flow. A body (22) can be arrange | positioned so that it may contact | abut to the cooling pipe (31a) with the highest cooling performance among several cooling pipes (3). For this reason, it becomes possible to improve the cooling performance as the whole laminated cooler.

  Moreover, in invention of Claim 2, the heat generating body (22) in which the largest calorific value is relatively larger than another heat generating body (21) among several types of heat generating bodies (2) is provided with a plurality of cooling pipes ( 3) of the cooling pipe (3) which is arranged upstream of the cooling medium flow from the partition means (43) and whose flow velocity of the cooling medium flowing inside is relatively larger than that of the other cooling pipes (3). It is characterized by being preferentially disposed so as to abut.

  According to this, the heating element (22) whose maximum heating value is larger than the other heating elements (21) is brought into contact with the cooling pipe (3) having a high flow rate of the cooling medium flowing inside, that is, a high heat transfer coefficient. Therefore, it is possible to improve the cooling performance of the entire stacked cooler.

  Moreover, in invention of Claim 3, a heat generating body (2) arrange | positions between two partition side cooling pipes (3c) adjacent to a partition means (43) among several inner side cooling pipes (3b). The heating element non-arrangement region (5) is not formed, and the heating element (22) having a maximum heat generation amount relatively larger than the other heating elements (21) among the plurality of types of heating elements (2) The cooling pipe (3c) is preferentially disposed so as to abut on the main surface (311a, 311b) opposite to the side facing the heating element non-arrangement region (5).

  Since only one side of the partition side cooling pipe (3c) is in contact with the heating element (2), the cooling performance is higher than that of the other inner cooling pipe (3b). For this reason, the heating element (22) whose maximum heating value is larger than the other heating element (21) is disposed on the main surface opposite to the side facing the heating element non-arrangement region (5) in the partition side cooling pipe (3c) ( 311a and 311b), the cooling performance of the stacked cooler as a whole can be improved.

  In the invention according to claim 4, the heat generating body (22) having a maximum heat generation amount relatively larger than that of the other heat generating bodies (21) among the plurality of types of heat generating bodies (2) includes two outer cooling pipes. (31a, 31b) is preferentially disposed so as to abut on the outer cooling pipe (32a) disposed on the downstream side of the cooling medium flow from the partition means (43).

  Since only one side of the outer cooling pipe (32b) is in contact with the heating element (2), the cooling performance is higher than that of the inner cooling pipe (3b). For this reason, the heating element (22) whose maximum heat generation amount is larger than that of the other heating elements (21) is preferentially disposed so as to come into contact with the outer cooling pipe (32a), thereby cooling the entire laminated cooler. The performance can be improved.

  In the invention according to claim 5, the heating element (22) having a maximum calorific value relatively larger than that of the other heating elements (21) among the plurality of types of heating elements (2) is divided into the partitioning means (43). It is characterized by being preferentially disposed so as to abut on the cooling pipe (3) disposed on the upstream side of the cooling medium flow.

  Among the plurality of cooling pipes (3), the cooling pipe (3) arranged on the upstream side of the cooling medium flow from the partitioning means (43) is the cooling pipe (3) arranged on the downstream side of the cooling medium flow from the dividing means (43). ) Cooling performance will be higher. For this reason, the heating element (22) whose maximum heating value is larger than the other heating elements (21) is arranged so as to abut on the cooling pipe (3) arranged on the upstream side of the cooling medium flow from the partition means (43). As a result, it is possible to improve the cooling performance of the entire stacked cooler.

  Further, in the invention described in claim 6, overhang portions (34) projecting in the stacking direction of the cooling pipe (3) are formed at both ends in the longitudinal direction of the cooling pipe (3), and adjacent cooling pipes are formed. The overhanging portion (34) of the tube (3) is joined to each other in the stacking direction of the cooling tube (3) and communicates with the through hole (341b) formed in the joining portion of the overhanging portion (34). Thus, the communication member (4) is configured, and the partitioning means (34) uses a part of the protruding portion (34) as a through hole non-forming portion (341c) where the through hole (341b) is not formed. It is characterized in that it is configured by bringing adjacent projecting portions (34) into a non-communication state. According to this, it becomes possible to manufacture a communicating member (4) and a partition means (43) easily.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing the stacked cooler 1 according to the first embodiment.

  As shown in FIG. 1, the multilayer cooler 1 of this embodiment cools a plurality of electronic components 2 from both sides, and has a plurality of flat shapes having refrigerant passages 30 (see FIG. 2) for circulating a cooling medium. The cooling pipe 3 and a communication member 4 that communicates the plurality of cooling pipes 3 are provided. A plurality of cooling tubes 3 are arranged in a stacked manner so that the electronic component 2 can be sandwiched from both sides. The communication member 4 includes a first communication member 4a disposed on the left side of the paper and a second communication member 4b disposed on the right side of the paper. The first and second communication members 4a and 4b are arranged in the vertical direction. It is an extended shape.

  FIG. 2 is a cross-sectional view taken along the line AA of FIG. As shown in FIG. 2, the cooling pipe 3 includes a first refrigerant passage 301 facing the first pipe wall 311b having a first main surface 311a that contacts the electronic component 2, and a side opposite to the first main surface 311a. A second refrigerant passage 302 facing the second pipe wall 312b having a second main surface 312a that contacts the electronic component 2 is provided.

  Specifically, the cooling pipe 3 of this embodiment has a so-called drone cup structure. That is, the cooling pipe 3 has a pair of outer shell plates 31 and an intermediate plate 32 disposed between the pair of outer shell plates 31. Thus, a first refrigerant passage 301 and a second refrigerant passage 302 are formed between the outer shell plate 31 and the intermediate plate 32, respectively. Therefore, the coolant pipe 30 is formed in two stages in the cooling pipe 3 in the thickness direction of the cooling pipe 3, that is, in the stacking direction of the cooling pipe 3.

  Hereinafter, of the pair of outer shell plates 31, the one that forms the first refrigerant passage 301 together with the intermediate plate 32 is referred to as the first outer shell plate 311, and the one that forms the second refrigerant passage 302 together with the intermediate plate 32 is the second. Also called outer shell plate 312. Therefore, the first outer shell plate 311 constitutes the first tube wall 311b, and the second outer shell plate 312 constitutes the second tube wall 312b.

  Inner fins 33 that increase the heat transfer area between the cooling medium and the cooling pipe 3 are disposed between the outer shell plate 31 and the intermediate plate 32, that is, in the first refrigerant passage 301 and the second refrigerant passage 302. ing. The inner fin 33 is formed in a wave shape, whereby each of the refrigerant passages 301 and 302 is divided into a plurality of sections in a direction orthogonal to the longitudinal direction and the thickness direction of the cooling pipe 3 (hereinafter referred to as the width direction of the cooling pipe 3). Has been. In the present embodiment, the width direction of the cooling pipe 3 coincides with the flow direction of the cooling air.

  3 is a cross-sectional view taken along line BB in FIG. As shown in FIG. 3, two inner fins 33 are arranged in series in the flow direction of the cooling medium, and a predetermined gap 320 is formed between the inner fins 33.

  Returning to FIG. 1, the plurality of cooling pipes 3 are composed of two outer cooling pipes 3 a arranged on the outermost side in the stacking direction and a plurality of inner cooling pipes 3 b arranged between the two outer cooling pipes 3 a. Yes. Hereinafter, of the two outer cooling pipes 3a, the pipe disposed on the upstream side of the cooling medium flow is referred to as a first outer cooling pipe 31a, and the pipe disposed on the downstream side of the cooling medium flow is also referred to as a second outer cooling pipe 32a. .

  And the refrigerant | coolant inlet 41 for introducing a cooling medium into the laminated cooler 1 is connected to the edge part by the side connected to the 1st communicating member 4a in the longitudinal direction of the 1st outer side cooling pipe 31a. . Further, a refrigerant discharge port 42 for discharging the cooling medium from the stacked cooler 1 is connected to the end of the second outer cooling pipe 32a on the side connected to the first communication member 4a in the longitudinal direction. . The refrigerant inlet 41 and the refrigerant outlet 42 are joined to the first and second outer cooling pipes 31a and 32a by brazing, respectively.

  In addition, the cooling pipe 3, the communication member 4, the refrigerant introduction port 41, and the refrigerant discharge port 42 of the present embodiment are made of aluminum. As the cooling medium, water mixed with an ethylene glycol-based antifreeze is used in the present embodiment.

  4 is a cross-sectional view taken along the line CC in FIG. 1, and FIG. 5 is a cross-sectional view taken along the line DD in FIG. As shown in FIGS. 4 and 5, the electronic component 2 of the present embodiment is a semiconductor module in which a semiconductor element (heating element) 20 such as an IGBT and a diode (not shown) are built. And the semiconductor module comprises a part of inverter for motor vehicles.

  In the present embodiment, as shown in FIG. 4, one semiconductor element 20 is disposed in one semiconductor module (electronic component 2) (hereinafter referred to as first electronic component 21), and shown in FIG. As described above, two types of electronic components 2 are provided such as one in which two semiconductor elements 20 are arranged in one semiconductor module (electronic component 2) (hereinafter referred to as second electronic component 22). The maximum heat generation amount of the second electronic component 22 is about twice the maximum heat generation amount of the first electronic component 21. In the second electronic component 22, the two semiconductor elements 20 are arranged in series with respect to the cooling medium flow direction in the cooling pipe 3 as shown in FIG. It is arrange | positioned in the approximate center part.

  FIG. 6 is a cross-sectional view schematically showing the stacked cooler 1 according to the first embodiment. As shown in FIG. 6, the first communication member 4 a includes a partition portion 43 that partitions the inside of the first communication member 4 a into an upstream side and a downstream side. The partition portion 43 allows the internal space of the first communication member 4 a to communicate with one end of the upstream side cooling pipe group 30 </ b> A disposed on the upstream side (upper side in the drawing) of the plurality of cooling pipes 3 and the refrigerant inlet 41. The upstream space 4A is partitioned into one end of a downstream cooling tube group 30B disposed on the downstream side (lower side in the drawing) and the downstream space 4B communicating with the refrigerant discharge port 42 among the plurality of cooling tubes 3. . In addition, the partition part 43 is equivalent to the partition means of this invention.

  As a result, the cooling medium flows from the refrigerant inlet 41 into the upstream space 4A of the first communication member 4a, and flows into the internal space of the second communication member 4b through the upstream cooling pipe group 30A. Subsequently, it flows into the downstream space 4B of the first communication member 4a through the downstream cooling pipe group 30B and flows in a U-turn shape to flow out of the refrigerant discharge port 42. Thus, while the cooling medium flows through the refrigerant passage 30 in the cooling pipe 3, heat exchange is performed with the electronic component 2 to cool the electronic component 2.

  7 is a cross-sectional view taken along the line EE in FIG. 1, and FIG. 8 is a cross-sectional view taken along the line FF in FIG. As shown in FIGS. 1, 7, and 8, overhang portions 34 that project in the stacking direction of the cooling tubes 3 are formed at both longitudinal ends of the outer shell plate 31 of the cooling tubes 3. The overhanging portions 34 of the adjacent cooling pipes 3 are joined to each other in the stacking direction of the cooling pipes 3 and communicated by through-holes 341b described later formed in the joining portions of the overhanging parts 34. A member 4 is configured.

  More specifically, the overhanging portion (hereinafter referred to as the second overhanging portion 342) of the second outer shell plate 312 disposed on the lower side in FIG. 1 is formed in a substantially cylindrical shape with both ends opened. Yes. On the other hand, of the pair of outer shell plates 3, the overhanging portion of the first outer shell plate 311 (hereinafter referred to as the first overhanging portion 341) disposed on the upper side in FIG. It is formed in a cylindrical shape (cup shape) in which the end on the side facing the outer shell plate 311 is closed. Hereinafter, the closed end portion of the first overhang portion 341 on the side facing the first outer shell plate 311 in the stacking direction of the cooling pipe 3 is referred to as a closed end portion 341a. As shown in FIG. 7, the closed end 341a is formed with a through hole 341b.

  Then, by connecting the projecting portions 34 of the adjacent cooling pipes 3 by brazing while the outer wall surface of the first projecting portion 341 and the inner wall surface of the second projecting portion 342 are in contact with each other, the communication member 4 is formed. At this time, since the through hole 341b is formed in the closed end portion 341a of the first overhang portion 341, a plurality of cooling pipes 3 can be communicated with each other.

  Further, as shown in FIG. 8, the closed end portion of one second bulging portion 342 among the plurality of second overhanging portions 342 constituting the first communication member 4 a, that is, arranged on the left side in FIG. 1. 341a is a through hole non-forming part 341c in which no through hole is provided. For this reason, in the through-hole non-forming part 341c, the adjacent first and second bulging parts 341 and 342 are not in communication with each other. Therefore, the space in the first communication member 4a is partitioned into an upstream side and a downstream side by the through hole non-forming portion 341c. That is, the partition part 43 (refer FIG. 6) of this embodiment is comprised by the through-hole non-formation part 341c. By the above, the communication member 4 and the partition part 43 can be manufactured easily.

  Returning to FIG. 6, in this embodiment, two electronic components 2 are provided for each of the first and second outer shell plates 311 and 312 of the cooling pipe 3. In other words, two electronic components 2 are provided for one first outer shell plate 311, and two electronic components 2 are provided for one second outer shell plate 312. The two electronic components 2 provided on the outer shell plates 311 and 312 are respectively arranged in series in the flow direction of the cooling medium.

  In the laminated cooler 1, it is necessary to cool the electronic component 2 from both sides. For this reason, in the outer cooling pipe 3b, the electronic component 2 comes into contact with only the outer shell plate arranged on the inner side in the stacking direction of the cooling pipe 3 among the first and second outer shell plates 311 and 312. ing. That is, of the first and second outer shell plates 311 and 312 of the outer cooling tube 3b, the electronic component 2 is not disposed on the outer shell plate disposed outside the cooling tube 3 in the stacking direction.

  In the present embodiment, the electronic component non-arrangement region 5 in which the electronic component 2 is not disposed between the two cooling pipes adjacent to the partition portion 43 of the first communication member 4a (hereinafter referred to as the partition portion side cooling pipe 3c). It has become. Therefore, the electronic component 2 is not disposed on the outer shell plate facing the electronic component non-arrangement region 5 among the first and second outer shell plates 311 and 312 of the partition portion side cooling pipe 3c.

  Then, the arrangement | positioning method of the some electronic component 2 in the laminated cooler 1 of the said structure is demonstrated. A plurality of electronic components 2 are arranged in the multilayer cooler 1, but after the arrangement position of the second electronic component 22 having the largest heat generation amount larger than that of the first electronic component 21 is determined preferentially, the first electronic component 21 is arranged. Is trying to arrange.

  First, the second electronic component 22 is disposed so as to contact the first outer cooling pipe 31a. More specifically, the second electronic component 22 is connected to the second outer shell plate 312 of the first outer cooling pipe 31a (that is, the outer side of the pair of outer shell plates 311 and 312 facing the adjacent inner cooling pipe 3b). It arrange | positions so that it may contact | abut to the shell plate 312).

  Next, the second electronic component 22 whose arrangement position has not been determined is arranged so as to abut on the cooling pipe 3 among the plurality of cooling pipes 3 where the flow rate of the cooling medium in the cooling pipe 3 is the highest.

  FIG. 9 is a characteristic diagram showing the relationship between the number of stages of the cooling pipes 3 and the flow rate of the cooling medium. As shown in FIG. 9, among the plurality of cooling pipes 3 constituting the laminated cooler 1, the second stage cooling pipe, that is, the inner cooling pipe adjacent to the outer cooling pipe 3a to which the refrigerant inlet 41 is connected. In 3b, the flow rate of the cooling medium inside the cooling pipe is larger than that of the other cooling pipes 3.

  Therefore, in the present embodiment, the second electronic component 22 is disposed so as to contact the inner cooling pipe 3b adjacent to the first outer cooling pipe 31a. More specifically, the second electronic component 22 is disposed between the first outer cooling pipe 31a and the inner cooling pipe 3b adjacent to the first outer cooling pipe 31a.

  Next, the second electronic component 22 whose arrangement position has not been determined is arranged so as to abut against the partition-side cooling pipe 3 c adjacent to the electronic component non-arrangement region 5. More specifically, the second electronic component 22 is disposed so as to abut on the outer shell plate that does not face the electronic component non-arrangement region 5 out of the pair of outer shell plates 311 and 312 of the partition side cooling pipe 3c. To do.

  Next, the second electronic component 22 whose arrangement position is not determined is arranged so as to contact the second outer cooling pipe 32a. More specifically, the second electronic component 22 is connected to the first outer shell plate 311 of the second outer cooling pipe 32a (that is, the outer side of the pair of outer shell plates 311 and 312 facing the adjacent inner cooling pipe 3b). It arrange | positions so that it may contact | abut to the shell plate 311).

  Since the arrangement positions of the plurality of second electronic components 22 are all determined as described above, the first electronic component 21 is arranged at a location where the second electronic component 22 is not arranged. Thereby, all of the plurality of electronic components 2 are mounted on the multilayer cooler 1.

  In the present embodiment, an upstream laminated structure in which the upstream cooling tube group 30A and the electronic component 2 are alternately laminated, and a downstream laminated structure in which the downstream cooling officer group 30B and the electronic component 2 are alternately laminated. The laminated cooler 1 is produced by separately manufacturing the body and then joining the two laminated structures.

  Like this embodiment, by providing the partition part 43 which partitions the inside of the 1st communicating member 4a into an upstream side and a downstream side, a cooling medium can be flowed so that it may make a U-turn inside the multilayer cooler 1. FIG. it can. Thereby, even if the flow rate of the cooling medium flowing into the multilayer cooler 1 is fixed, the flow rate of the cooling medium per cooling pipe 3 can be increased.

  However, if the cooling medium is simply configured to make a U-turn inside the stacked cooler 1, the cooling medium temperature at the inlet of the cooling pipe 3 disposed after the turn, that is, downstream of the cooling medium flow from the partition 43. Will rise extremely. For this reason, in the cooling pipe 3 arrange | positioned downstream from the partition part 43 at the cooling medium flow, ie, the cooling pipe 3 which belongs to the downstream cooling pipe group 30B, the electronic component 2 cannot fully be cooled.

  By the way, the maximum heat generation amount of the electronic component 2 may not be uniform in all the electronic components 2. For example, when the semiconductor element 20 is integrated in a part of the plurality of electronic components 2 as in the present embodiment, the second electronic component 22 in which the semiconductor element 20 is integrated and the semiconductor element 20 are integrated. In the first electronic component 21 that is not converted, the maximum heat generation amount is different.

  In the stacked cooler 1, since only one side of the two outer cooling pipes 31a and 31b is in contact with the electronic component 2, the cooling performance is higher than that of the inner cooling pipe 3b. Further, the first outer cooling pipe 31a arranged on the upstream side of the cooling medium flow from the partition part 43 has higher cooling performance than the second outer cooling pipe 32a arranged on the downstream side of the cooling medium flow from the partition part 43. Become. That is, the cooling performance of the first outer cooling pipe 31 a disposed on the upstream side of the cooling medium flow from the partition portion 43 is the highest among the cooling pipes 3.

  Therefore, as in the present embodiment, among the plurality of types of electronic components 2, the second electronic component 22 having the maximum heat generation amount larger than the first electronic component 21 is preferentially disposed so as to contact the first outer cooling pipe 31 a. By doing so, the electronic component 22 having the largest maximum calorific value among the plurality of types of electronic components 2 can be brought into contact with the cooling tube 31 a having the highest cooling performance among the plurality of cooling tubes 3. For this reason, it becomes possible to improve the cooling performance of the multilayer cooler 1 as a whole without changing the basic structure of the multilayer cooler 1.

  Further, the second electronic component 22 having a maximum calorific value larger than the first electronic component 21 among the plurality of types of electronic components 2 is arranged on the upstream side of the cooling medium flow from the partition portion 43 in the plurality of cooling pipes 3, and By arranging the cooling medium 1 so that the flow velocity of the cooling medium flowing inside becomes larger than that of the other cooling pipes 3, that is, the cooling pipe 3 whose heat transfer coefficient is higher than that of the other cooling pipes 3, As a result, the cooling performance can be further improved.

  By the way, since the partition side cooling pipe 3c adjacent to the partition part 43 is comprised so that only one side may contact | abut the electronic component 2, cooling performance becomes high compared with the other inner side cooling pipe 3b. For this reason, among the plurality of types of electronic components 2, the second electronic component 22 having a maximum calorific value larger than the first electronic component 21 is the main side opposite to the side facing the electronic component non-arrangement region 5 in the partition side cooling pipe 3 c. By preferentially arranging so as to contact the surfaces 311a and 311b, it is possible to further improve the cooling performance of the stacked cooler 1 as a whole.

  By the way, as described above, the outer cooling pipe 32b is configured such that only one surface is in contact with the electronic component 2, so that the cooling performance is higher than that of the inner cooling pipe 3b. For this reason, the second electronic component 22 having a maximum heat generation amount larger than the first electronic component 21 among the plurality of types of electronic components 2 is preferentially disposed so as to be in contact with the second outer cooling pipe 32a. It becomes possible to further improve the cooling performance of the cooler 1 as a whole.

  By the way, the laminated cooler 1 is manufactured by brazing a laminated structure in which the cooling pipes 3 and the electronic components 2 are alternately laminated from the outside in the lamination direction of the cooling pipe 3. However, when the electronic component non-arrangement region 5 is provided in the stacked cooler 1 as in this embodiment, it is difficult to press the stacked structure from the outside in the stacking direction of the cooling pipe 3.

  On the other hand, as in the present embodiment, the upstream side laminated structure in which the upstream side cooling pipe group 30A and the electronic component 2 are alternately laminated, and the downstream side cooling officer group 30B and the electronic component 2 are alternately laminated. It is possible to press from the outside of the cooling pipe 3 in the stacking direction when brazing by manufacturing the stacked cooler 1 by manufacturing the downstream stacked structure separately and then joining the two stacked structures. It becomes.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. The same parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted. FIG. 10 is a cross-sectional view schematically showing the stacked cooler 1 according to the second embodiment.

  As shown in FIG. 10, in the present embodiment, the second electronic component 22 is disposed so as to contact the plurality of cooling tubes 3 belonging to the upstream cooling tube group 30 </ b> A, and the first electronic component 21 is disposed downstream. It arrange | positions so that it may contact | abut the some cooling pipe 3 which belongs to the side cooling pipe group 30B.

  Among the plurality of cooling pipes 3, the cooling pipes 3 (that is, the plurality of cooling pipes 3 belonging to the upstream side cooling pipe group 30 </ b> A) arranged on the upstream side of the cooling medium flow from the partition portion 43 are downstream of the cooling medium flow from the partition portion 43. As compared with the cooling pipes 3 arranged on the side (that is, the plurality of cooling pipes 3 belonging to the downstream cooling pipe group 30B), the cooling performance is improved. For this reason, among the plurality of types of electronic components 2, the second electronic component 22 having a maximum calorific value larger than the first electronic component 21 is brought into contact with the cooling pipe 3 arranged on the upstream side of the cooling medium flow from the partition portion 43. By disposing, the cooling performance of the stacked cooler 1 as a whole can be improved.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. The same parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted. FIG. 11 is a cross-sectional view schematically showing the stacked cooler 1 according to the third embodiment.

  As shown in FIG. 11, the refrigerant discharge port 42 of the present embodiment is provided at an end portion on the side connected to the second communication member 4 b in the longitudinal direction of the second outer cooling pipe 32 a. Moreover, the 2nd communication member 4b is provided with the partition part 43 which partitions the inside of the 2nd communication member 4b into the upstream and the downstream. This partition part 43 is arrange | positioned rather than the partition part 43 provided in the 1st communication member 4a in the cooling-medium flow downstream (paper surface lower side). Therefore, the stacked cooler 1 of this embodiment includes two electronic component non-arrangement regions 5.

  Hereinafter, the partition portion 43 provided in the first communication member 4a is referred to as a first partition portion 43a, and the partition portion 43 provided in the second communication member 4a is referred to as a second partition portion 43b. Of the plurality of cooling pipes 3, the pipe arranged upstream (first side of the paper) from the first partition 43 a is referred to as an upstream side cooling pipe group 30 </ b> A, and downstream (second lower side of the page) from the second partition 43 b. The downstream cooling pipe group 30B is referred to as the downstream cooling pipe group 30B, and the downstream cooling pipe group 30B is the downstream cooling pipe group 30B, and the downstream cooling pipe group 30B is the downstream cooling pipe group 30B. It is called group 30C.

  The second partition 43b allows the internal space of the second communication member 4b to communicate with one end of the upstream cooling pipe group 30A and one end of the intermediate cooling pipe group 30C, and one end of the downstream cooling pipe group 30B. And a downstream space 4 </ b> D communicating with the refrigerant discharge port 42. Thus, the cooling medium flows from the refrigerant inlet 41 into the upstream space 4A of the first communication member 4a, and flows through the upstream cooling pipe group 30A to the upstream space 4C of the second communication member 4b. Subsequently, the refrigerant flows into the downstream space 4B of the first communication member 4a through the intermediate cooling pipe group 30C, and further flows into the downstream space 4D of the second communication member 4b through the downstream cooling pipe group 30B. It flows in an S-turn shape that flows out of the water.

  Then, the arrangement | positioning method of the some electronic component 2 in the multilayer cooler 1 of this embodiment is demonstrated.

  First, the second electronic component 22 is disposed so as to contact the first outer cooling pipe 31a. More specifically, the second electronic component 22 is connected to the second outer shell plate 312 of the first outer cooling pipe 31a (that is, the outer side of the pair of outer shell plates 311 and 312 facing the adjacent inner cooling pipe 3b). (Shell plate)

  Next, the second electronic component 22 whose arrangement position has not been determined is arranged so as to abut against the partition-side cooling pipe 3 c adjacent to the electronic component non-arrangement region 5. More specifically, the second electronic component 22 is disposed so as to abut on the outer shell plate that does not face the electronic component non-arrangement region 5 out of the pair of outer shell plates 311 and 312 of the partition side cooling pipe 3c. To do.

  Also in the laminated cooler 1 configured in this way, the same effect as in the first embodiment can be obtained.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG. The same parts as those in the third embodiment are denoted by the same reference numerals and description thereof is omitted. FIG. 12 is a cross-sectional view schematically showing the stacked cooler 1 according to the fourth embodiment.

  As shown in FIG. 12, in the present embodiment, the second electronic component 22 is disposed so as to contact the plurality of cooling tubes 3 belonging to the upstream cooling tube group 30A, and the first electronic component 21 is arranged downstream. It arrange | positions so that it may contact | abut the some cooling pipe 3 which belongs to the side cooling pipe group 30B. Further, the second electronic component 33 is arranged so as to abut on the cooling pipe 3 arranged on the most upstream side among the plurality of cooling pipes 3 belonging to the intermediate cooling pipe group 30C, and the first electronic component 21 is arranged. The plurality of cooling pipes 3 belonging to the intermediate cooling pipe group 30C are arranged so as to abut on the cooling pipes 3 arranged on the other side than the most upstream side.

  Among the plurality of cooling pipes 3, the cooling pipes 3 belonging to the upstream side cooling pipe group 30A have higher cooling performance than the plurality of cooling pipes 3 belonging to the downstream side cooling pipe group 30B. Further, the cooling pipe 3 arranged on the most upstream side among the plurality of cooling pipes 3 belonging to the intermediate cooling pipe group 30C is configured such that only one surface is in contact with the electronic component 2, so that the intermediate cooling pipe group The cooling performance is higher than that of the other inner cooling pipe 3b belonging to 30C.

  For this reason, among the plurality of types of electronic components 2, the second electronic component 22 having a maximum calorific value larger than the first electronic component 21, the cooling pipe 3 disposed on the upstream side of the cooling medium flow from the partition portion 43, and the intermediate cooling pipe By arranging the plurality of cooling pipes 3 belonging to the group 30C so as to come into contact with the cooling pipe 3 arranged on the most upstream side, it is possible to improve the cooling performance of the stacked cooler 1 as a whole. .

(Other embodiments)
In each of the embodiments described above, the second electronic component 22 in which the semiconductor elements 20 are integrated and the semiconductor element 20 are integrated, assuming that the maximum heat generation amount of the electronic components 2 is not uniform in all the electronic components 2. However, the present invention is not limited thereto, and the electronic component 2 may be a semiconductor module that constitutes a part of an automotive inverter including a boost converter and a plurality of motor generators. . Also in this case, since the maximum heat generation amounts of the semiconductor modules mounted on the boost converter and the plurality of motor generators are different, the maximum heat generation amount is not uniform in all the electronic components 2.

  Further, in each of the above embodiments, the example in which two electronic components 2 are provided for each of the first and second outer shell plates 311 and 312 of the cooling pipe 3 has been described. Three or more parts 2 may be provided for each of the first and second outer shell plates 311 and 312 of the cooling pipe 3.

It is a front view which shows the lamination type cooler 1 which concerns on 1st Embodiment. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is CC sectional drawing of FIG. It is DD sectional drawing of FIG. 1 is a cross-sectional view schematically showing a stacked cooler 1 according to a first embodiment. It is EE sectional drawing of FIG. It is FF sectional drawing of FIG. It is a characteristic view which shows the relationship between the number of stages of the cooling pipe 3, and the flow rate of a cooling medium. It is sectional drawing which shows typically the multilayer cooler 1 which concerns on 2nd Embodiment. It is sectional drawing which shows typically the laminated | stacked cooler 1 which concerns on 3rd Embodiment. It is sectional drawing which shows typically the multilayer cooler 1 which concerns on 4th Embodiment.

Explanation of symbols

  2, 21, 22 ... electronic parts (heating elements), 3 ... cooling pipes, 3b ... inner cooling pipes, 3c ... partition side cooling pipes, 4a, 4b ... communication members, 5 ... electronic parts non-arrangement area (heating elements non-arrangement) Area), 30 ... refrigerant passage, 31a, 32a ... outer cooling pipe, 34 ... overhanging part, 43 ... partitioning part (partitioning means), 311a, 311b ... main surface, 341b ... through hole, 341c ... through hole non-forming part .

Claims (6)

A stacked cooler for cooling a plurality of heating elements (2) from both sides,
A plurality of cooling pipes (3) formed in a flat shape having a main surface (311a, 311b) in contact with the heating element (2) and a refrigerant passage (30) through which a cooling medium flows;
First and second communication members (4a, 4b) disposed at both longitudinal ends of the cooling pipe (3) and communicating with the plurality of cooling pipes (3);
Partition means (43) for partitioning the inside of at least one communication member (4a) of the first and second communication members (4a, 4b) into an upstream side and a downstream side;
The plurality of heating elements (2) are composed of a plurality of types of heating elements (21, 22) having different maximum heat generation amounts,
The plurality of cooling pipes (3) are arranged in a stacked manner so that the heating elements (2) arranged alternately with the cooling pipe (3) can be sandwiched from both sides, and are arranged at both ends in the stacking direction. It consists of two outer cooling pipes (31a, 31b) and a plurality of inner cooling pipes (3b) arranged between the two outer cooling pipes (31a, 31b),
Of the plurality of types of heating elements (2), a heating element (22) having a maximum calorific value relatively larger than that of the other heating elements (21) is the two of the two outer cooling pipes (31a, 31b). A stacked cooler characterized in that it is preferentially disposed so as to abut on an outer cooling pipe (31a) disposed upstream of the cooling medium flow from the partition means (43). Of the plurality of types of heating elements (2), a heating element (22) having a maximum calorific value relatively larger than that of the other heating elements (21) is the partitioning means of the plurality of cooling pipes (3). (43) is arranged on the upstream side of the cooling medium flow, and abuts against the cooling pipe (3) in which the flow velocity of the cooling medium flowing inside becomes relatively larger than that of the other cooling pipes (3). The stacked cooler according to claim 1, wherein the stacked cooler is preferentially arranged. Of the plurality of inner cooling pipes (3b), between the two partition-side cooling pipes (3c) adjacent to the partition means (43), the heating element non-arrangement region (5) in which the heating element (2) is not arranged. )
Among the plurality of types of heating elements (2), the heating element (22) having a maximum heat generation amount relatively larger than that of the other heating elements (21) is not disposed in the partition side cooling pipe (3c). 3. The stacked cooler according to claim 1, wherein the stacked cooler is preferentially disposed so as to come into contact with the main surface (311 a, 311 b) opposite to the side facing the region (5). Of the plurality of types of heating elements (2), a heating element (22) having a maximum calorific value relatively larger than that of the other heating elements (21) is the two of the two outer cooling pipes (31a, 31b). 4. The apparatus according to claim 1, wherein the second cooling pipe is preferentially disposed so as to abut on an outer cooling pipe (32 a) disposed on the downstream side of the cooling medium flow with respect to the partition means (43). The laminated cooler described. Of the plurality of types of heating elements (2), a heating element (22) having a relatively large maximum heating value than the other heating elements (21) is located upstream of the partitioning means (43) in the cooling medium flow. The stacked cooler according to any one of claims 1 to 3, wherein the stacked cooler is preferentially disposed so as to abut on the disposed cooling pipe (3). Overhang portions (34) projecting in the stacking direction of the cooling pipe (3) are formed at both ends in the longitudinal direction of the cooling pipe (3),
The overhang portions (34) of the adjacent cooling pipes (3) are joined to each other in the stacking direction of the cooling pipe (3), and through holes formed in the joint portion of the overhang portions (34) The communication member (4) is configured by communicating with (341b),
In the partitioning means (43), a joint portion of a part of the overhang portion (34) is a through hole non-formed portion (341c) where the through hole (341b) is not formed, and the adjacent overhang portion (34) The stacked type cooler according to any one of claims 1 to 5, wherein the stacked type cooler is configured by disabling each other.

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