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JP2009076878A5 - - Google Patents

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Publication number
JP2009076878A5
JP2009076878A5 JP2008204313A JP2008204313A JP2009076878A5 JP 2009076878 A5 JP2009076878 A5 JP 2009076878A5 JP 2008204313 A JP2008204313 A JP 2008204313A JP 2008204313 A JP2008204313 A JP 2008204313A JP 2009076878 A5 JP2009076878 A5 JP 2009076878A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008204313A
Other languages
Japanese (ja)
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JP2009076878A (en
JP5184253B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2008204313A priority Critical patent/JP5184253B2/en
Priority claimed from JP2008204313A external-priority patent/JP5184253B2/en
Priority to DE102008044753A priority patent/DE102008044753A1/en
Priority to US12/230,436 priority patent/US7749333B2/en
Priority to KR1020080085136A priority patent/KR101267631B1/en
Publication of JP2009076878A publication Critical patent/JP2009076878A/en
Publication of JP2009076878A5 publication Critical patent/JP2009076878A5/ja
Application granted granted Critical
Publication of JP5184253B2 publication Critical patent/JP5184253B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008204313A 2007-08-29 2008-08-07 Substrate processing apparatus, substrate processing method, and storage medium Active JP5184253B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008204313A JP5184253B2 (en) 2007-08-29 2008-08-07 Substrate processing apparatus, substrate processing method, and storage medium
DE102008044753A DE102008044753A1 (en) 2007-08-29 2008-08-28 Substrate processing apparatus and method
US12/230,436 US7749333B2 (en) 2007-08-29 2008-08-28 Substrate processing apparatus and method
KR1020080085136A KR101267631B1 (en) 2007-08-29 2008-08-29 Substrate processing device, substrate processing method and recording medium

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007222135 2007-08-29
JP2007222135 2007-08-29
JP2008204313A JP5184253B2 (en) 2007-08-29 2008-08-07 Substrate processing apparatus, substrate processing method, and storage medium

Publications (3)

Publication Number Publication Date
JP2009076878A JP2009076878A (en) 2009-04-09
JP2009076878A5 true JP2009076878A5 (en) 2009-05-28
JP5184253B2 JP5184253B2 (en) 2013-04-17

Family

ID=40611516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008204313A Active JP5184253B2 (en) 2007-08-29 2008-08-07 Substrate processing apparatus, substrate processing method, and storage medium

Country Status (3)

Country Link
JP (1) JP5184253B2 (en)
KR (1) KR101267631B1 (en)
TW (1) TWI367525B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153462B2 (en) 2010-12-09 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Spin chuck for thin wafer cleaning
JP5642574B2 (en) * 2011-01-25 2014-12-17 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
US8944080B2 (en) * 2011-08-02 2015-02-03 Visera Technologies Company Limited Cleaning system, cleaning device, and method of using cleaning device
JP6234736B2 (en) * 2013-08-30 2017-11-22 芝浦メカトロニクス株式会社 Spin processing device
KR102343635B1 (en) * 2014-12-30 2021-12-29 세메스 주식회사 Apparatus and method for treatinf substrate
KR200482998Y1 (en) 2015-12-14 2017-03-24 한전케이피에스 주식회사 grease injection type cover device for power generation equipments
JP6845696B2 (en) * 2016-02-25 2021-03-24 芝浦メカトロニクス株式会社 Substrate processing equipment, substrate processing method and substrate manufacturing method
JP6990602B2 (en) * 2018-02-27 2022-01-12 東京エレクトロン株式会社 Board processing equipment, board processing method and computer-readable recording medium
KR102139605B1 (en) * 2018-11-06 2020-08-12 세메스 주식회사 Method and apparatus for processing substrate
CN111146123B (en) * 2019-12-26 2022-07-26 厦门通富微电子有限公司 Liquid collection device, developing/etching machine and developing/etching method
CN111112186B (en) * 2019-12-27 2022-08-09 上海至纯洁净系统科技股份有限公司 Wafer cleaning equipment
CN111001606B (en) * 2019-12-27 2022-03-11 上海至纯洁净系统科技股份有限公司 Semiconductor cleaning equipment
KR102624576B1 (en) * 2020-11-23 2024-01-16 세메스 주식회사 Apparatuse for treating substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3089846B2 (en) * 1992-09-03 2000-09-18 富士通株式会社 Wafer processing equipment
JP3035451B2 (en) * 1994-07-19 2000-04-24 大日本スクリーン製造株式会社 Substrate surface treatment equipment
JP2003093979A (en) * 2001-09-25 2003-04-02 Hitachi Ltd Spinning apparatus
JP2004063982A (en) * 2002-07-31 2004-02-26 Seiko Epson Corp Cleaning apparatus and cleaning method
JP2005302746A (en) * 2004-03-05 2005-10-27 Dainippon Screen Mfg Co Ltd Substrate processing method and substrate processor

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