JP2009076461A - 改善された電極層を有する溶液処理された有機電子構造素子 - Google Patents
改善された電極層を有する溶液処理された有機電子構造素子 Download PDFInfo
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- 229920000642 polymer Polymers 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000002019 doping agent Substances 0.000 claims abstract description 5
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims abstract 2
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical class [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 7
- -1 sulfonic acid cesium salt Chemical class 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 229920006395 saturated elastomer Polymers 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 239000002243 precursor Substances 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 125000004076 pyridyl group Chemical group 0.000 claims description 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 2
- 125000002030 1,2-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([*:2])C([H])=C1[H] 0.000 claims 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims 1
- 238000010129 solution processing Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 55
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 239000011229 interlayer Substances 0.000 abstract description 3
- 150000001663 caesium Chemical class 0.000 abstract 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 14
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 229910052788 barium Inorganic materials 0.000 description 8
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000002800 charge carrier Substances 0.000 description 5
- 238000004020 luminiscence type Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- WLZGEDNSZCPRCJ-UHFFFAOYSA-M cesium;octadecanoate Chemical compound [Cs+].CCCCCCCCCCCCCCCCCC([O-])=O WLZGEDNSZCPRCJ-UHFFFAOYSA-M 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229920000144 PEDOT:PSS Polymers 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 2
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- COHCXWLRUISKOO-UHFFFAOYSA-N [AlH3].[Ba] Chemical compound [AlH3].[Ba] COHCXWLRUISKOO-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 description 1
- 229910000024 caesium carbonate Inorganic materials 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 159000000006 cesium salts Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- DHVNKULLTQLJRC-UHFFFAOYSA-L dicesium;decanedioate Chemical compound [Cs+].[Cs+].[O-]C(=O)CCCCCCCCC([O-])=O DHVNKULLTQLJRC-UHFFFAOYSA-L 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- HYWCXWRMUZYRPH-UHFFFAOYSA-N trimethyl(prop-2-enyl)silane Chemical compound C[Si](C)(C)CC=C HYWCXWRMUZYRPH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
- H10K50/171—Electron injection layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/81—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
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- Electrodes Of Semiconductors (AREA)
Abstract
【解決手段】基板、少なくとも2つの単層もしくは複層の電極、その間にある少なくとも1つの活性有機半導体層、電極層と活性有機半導体層との間の中間層及び/又は界面層を含む溶液処理された有機電子構造素子であって、有機のモノ−、オリゴ−及びポリ−カルボン酸もしくはスルホン酸のセシウム塩が、中間層/界面層中のn型ドーパントとして含まれていることを特徴とする有機電子構造素子を提供する。
【選択図】なし
Description
Cs2CO3とセバシン酸との混合物を、1:1の比率でブタノール中に添加し、そしてCO2がもはや形成されなくなるまで還流温度に保持する。次いで、ブタノールを回転蒸発器上で分離除去し、残留物をエーテルと混合し、吸引分離する。
Cs2CO3とポリスチレンスルホン酸の20%水溶液との混合物を、1:2の比率で添加し、そしてCO2がもはや形成されなくなるまで短時間加熱する。次いで、ブタノールを添加し、そして水並びにブタノールを回転蒸発器上で分離除去し、残留物をエーテルと混合し、そして吸引分離する。
d1) コポリマーの合成
d1a) ラジカル重合
絶対的無水条件下で、かつ酸素不含の不活性ガスですすぎながら、0.5モルの無水マレイン酸と0.5モルのトリメチルアリルシランを500mlのジオキサン中に溶解させ、そしてラジカル開始剤として2モル%のAIBN(アゾイソ酪酸ニトリル)を添加しつつ撹拌しながら、50℃に温度調節して10時間にわたり反応させる。引き続き、溶剤を真空中で回転蒸発器上で完全に除去する。Tg:200℃;収率は定量的。
21.4gの実施例d1aにより得られたコポリマーを、撹拌しつつ40mlのジメチルホルムアミド中に溶解させ、そして50℃で2時間温める。次いで、エタノール中に沈殿させる。沈殿した生成物を、150℃で乾燥棚において乾燥させ、脱水させる。
Cs2CO3とポリ[トリメチルシリルアリル−コ−N−(4−カルボキシフェニル)マレイン酸イミドとの混合物を1:2の比率でアセトニトリル中に添加し、そしてもはやCO2が形成されなくなるまで還流温度で加熱する。次いで、アセトニトリルを回転蒸発器上で分離除去し、残留物をエーテルと混合し、吸引分離する。
電子構成部材のための例示的製造方法:
− PEDOT:PSS60〜80nmをITO基板(ガラス)上にスピンコートする。
構成部材の構造は、基板:ITO/PEDOT:PSS(60nm)/白色ポリマー(70nm)/CsSt/Alを含んでいた。
Claims (5)
- 基板、少なくとも2つの単層もしくは複層の電極、該電極間にある少なくとも1つの活性有機半導体層、及び電極層と活性有機半導体層との間にある中間層及び/又は界面層を含む溶液処理された有機電子構造素子であって、有機のモノ−、オリゴ−及びポリ−カルボン酸もしくはスルホン酸のセシウム塩が、前記の中間層/界面層中にn型ドーパントとして含まれていることを特徴とする有機電子構造素子。
- 請求項1に記載の有機電子構造素子であって、セシウム塩として、以下の一般構造型:
モノカルボン酸:
Rは、アルキル(C1〜C20を有する、非分枝鎖状の、分枝鎖状の、飽和のもしくは不飽和の及び/又はヒドロキシ置換されたもの)、フェニル(アルキル化及び/又はヒドロキシ置換及び/又はアルコキシ置換されたもの)及び/又はピリジルを表し、
R1は、アルキレン(C2〜C20を有する、非分枝鎖状の、分枝鎖状の、飽和のもしくは不飽和の並びにヒドロキシ置換されたもの)、1,2−フェニレン、1,3−フェニレン、1,4−フェニレンもしくは2,6−ピリジレンを表し、
n及びmは、前駆体材料の市販の任意の重合度を表す]
から選択される少なくとも1種の化合物を含むことを特徴とする有機電子構造素子。 - 請求項1又は2に記載の有機電子構造素子であって、セシウム塩が含まれている中間層/界面層が、溶液処理により適用されていることを特徴とする有機電子構造素子。
- 請求項1から3までのいずれか1項に記載の有機電子構造素子であって、セシウム塩が含まれている中間層/界面層が、蒸着されていることを特徴とする有機電子構造素子。
- 請求項1から4までのいずれか1項に記載の有機電子構造素子であって、セシウム塩が含まれている中間層/界面層が、0.1nm〜15nmの範囲の厚さを有することを特徴とする有機電子構造素子。
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CN103779498A (zh) * | 2014-01-23 | 2014-05-07 | 上海交通大学 | 一种导电高分子材料的电子注入方法 |
KR101421559B1 (ko) | 2010-01-20 | 2014-07-23 | 경북대학교 산학협력단 | 도핑된 유기반도체를 포함하는 유기소자 |
KR20160014682A (ko) * | 2013-05-27 | 2016-02-11 | 메르크 파텐트 게엠베하 | 유기 전자 소자용 전자 주입층에 사용하기 위한 개선된 전자 수송 조성물 |
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CN112390908B (zh) * | 2019-08-12 | 2022-07-12 | 中国石油化工股份有限公司 | 聚合物悬浮液及其制备方法和应用 |
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KR101421559B1 (ko) | 2010-01-20 | 2014-07-23 | 경북대학교 산학협력단 | 도핑된 유기반도체를 포함하는 유기소자 |
KR20160014682A (ko) * | 2013-05-27 | 2016-02-11 | 메르크 파텐트 게엠베하 | 유기 전자 소자용 전자 주입층에 사용하기 위한 개선된 전자 수송 조성물 |
JP2016534544A (ja) * | 2013-05-27 | 2016-11-04 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung | 有機電子デバイスの電子注入層における使用のための改善された電子移動組成物 |
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KR102197160B1 (ko) | 2013-05-27 | 2020-12-31 | 메르크 파텐트 게엠베하 | 유기 전자 소자용 전자 주입층에 사용하기 위한 개선된 전자 수송 조성물 |
CN103779498A (zh) * | 2014-01-23 | 2014-05-07 | 上海交通大学 | 一种导电高分子材料的电子注入方法 |
Also Published As
Publication number | Publication date |
---|---|
US9040112B2 (en) | 2015-05-26 |
EP2040317B1 (de) | 2018-04-04 |
DE102007045518B4 (de) | 2010-12-16 |
JP5692959B2 (ja) | 2015-04-01 |
DE102007045518A1 (de) | 2009-04-02 |
US20120220075A1 (en) | 2012-08-30 |
US20090085472A1 (en) | 2009-04-02 |
EP2040317A3 (de) | 2011-09-14 |
EP2040317A2 (de) | 2009-03-25 |
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