JP2009074823A - Wiring board for electronic component inspection device, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board used for an electronic component inspection device, which is used for the electronic component inspection device such as a prove card, capable of inspecting accurately and surely an electric characteristic, even in the case of, for example, electronic components formed in great numbers on a large-size Si wafer; and its manufacturing method. <P>SOLUTION: This wiring board 1 for the electronic component inspection device includes a relay substrate 2 having a ceramic layer S having a single layer, whose thermal expansion coefficient in the range of -40 to +150°C is 3.0-4.5×10<SP>-6</SP>/°C, and a plurality of penetration conductors 6 penetrating the interval between the front surface 3 and the rear surface 4 of the ceramic layer S; a multilayer ceramic wiring board 10 arranged on the rear surface 4 side of the relay substrate 2, and including a plurality of ceramic layers s1-s4, wiring layers 13-15 formed between the ceramic layers s1-s4, and via conductors v penetrating the plurality of ceramic layers s1-s4 to conduct the wiring layers 13-15 mutually; and a plurality of connection conductors 18 arranged between the relay substrate 2 and the wiring board 10, for conducting electrically the plurality of penetration conductors 6 on the relay substrate 2 to the wiring layers 13-15 on the multilayer ceramic wiring board 10. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to, for example, a wiring board used in an electronic component inspection apparatus such as a probe card, and more particularly to an electronic component inspection apparatus capable of accurately inspecting electrical characteristics of each electronic component formed on a large diameter Si wafer or the like. The present invention relates to a wiring board used and a manufacturing method thereof.

A probe card, which is a kind of electronic component inspection device, has a large number of fine probes on its surface, and by bringing such probes into contact with electrodes for each electronic component such as a semiconductor chip formed on a Si wafer. It is used to inspect the electrical characteristics of electronic parts.
By the way, the Si wafer tends to increase in diameter to 300 mm or more. Accordingly, due to the difference in thermal expansion coefficient between the Si wafer and the probe card, the electrical connection between the electrode and the probe becomes insufficient in some electronic components. There is a risk that the physical characteristics cannot be accurately inspected.

For this reason, for example, a measurement wiring substrate having a plurality of insulating substrates and a wiring layer disposed between them, and a plurality of measurement terminals (probes) provided on each of a plurality of pads formed on the surface thereof An average thermal expansion coefficient of the wiring board at −40 to + 400 ° C. is 2 × 10 ⁻⁵ / ° C. to 5 × 10 ⁻⁶ / ° C., and the elongation of the wiring board and the semiconductor wafer is increased in the temperature range. A probe card having a difference of 0.02% or less has been proposed (see, for example, Patent Document 1).
JP 2006-284541 A (pages 1 to 13 and FIGS. 1 to 4)

The wiring board for measurement used in the probe card of Patent Document 1 includes at least one kind of ZnO, CaO, SrO, BaO, and ZrO _{2 in} the insulating substrate, the content is 15% by mass or less, and the cordier A sintered body containing a light crystal phase is used.
However, such an insulating substrate is baked after laminating a plurality of green sheets made of the above materials and forming a plurality of pads to which probes are attached on the surface thereof. It will shift. Furthermore, since a plurality of wiring layers along the plane direction and via conductors connecting between the wiring layers are formed inside the measurement wiring board, the measurement wiring board is caused by their thermal expansion. The volume of may change.
The position of the plurality of probes formed on the surface of the wiring board shifts due to the displacement of the pad and the change in volume of the wiring board. Especially, in the probe located on the peripheral side of the surface, the electronic component on the Si wafer side There is a risk that the electrical connection with the electrode may become unstable or the connection may be poor, making it impossible to inspect the electronic component.

  The present invention solves the problems described in the background art, and is used in an electronic component inspection apparatus such as a probe card. For example, even an electronic component formed on a large diameter Si wafer or the like is electrically It is an object of the present invention to provide a wiring board used in an electronic component inspection apparatus capable of accurately and reliably inspecting characteristics and a method for manufacturing the same.

Means for Solving the Problems and Effects of the Invention

In order to solve the above problems, the present invention separates a low thermal expansion coefficient relay board to which a probe is attached and a multilayer ceramic wiring board including a wiring layer for signal processing, and connects them via a conductor. Invented.
That is, the wiring board for an electronic component inspection apparatus according to the present invention (Claim 1) is a single layer and a ceramic layer having a thermal expansion coefficient of 3.0 to 4.5 × 10 ⁻⁶ / ° C. at −40 to + 150 ° C., And a relay substrate having a plurality of through conductors passing between the front surface and the back surface of the ceramic layer, and a plurality of ceramic layers disposed on the back surface side of the relay substrate and formed between the ceramic layers And a multilayer ceramic wiring board including a via conductor that passes through the plurality of ceramic layers and conducts between the wiring layers, and is disposed between the relay board and the multilayer ceramic wiring board. And a plurality of connecting conductors that electrically connect the through conductor and the wiring layer of the multilayer ceramic wiring board.

According to this, the single-layer ceramic layer forming the relay substrate having a plurality of through conductors has a thermal expansion coefficient of about 3 × at −40 to + 150 ° C. of Si forming a wafer including a large number of electronic components. It is approximated to 10 ⁻⁶ / ° C. For this reason, even if it receives the thermal change in the said temperature range, it can ensure the electrical connection with the several probe attached to the surface of a relay substrate, and the electrode for many electronic components formed in Si wafer. It becomes easy. Furthermore, since the relay substrate and the multilayer ceramic wiring substrate are joined via a plurality of connecting conductors, it is possible to reliably absorb the influence due to the difference in the thermal expansion coefficient between them. For this reason, the signal detected from each probe can be output to the outside from the back side pad via the plurality of connection conductors and the wiring layer in the multilayer ceramic wiring board. Therefore, even if electronic components are formed in large numbers on a Si wafer having a large diameter of 300 mm or more, the electrical characteristics can be accurately and reliably inspected.
Moreover, since the wiring layer is formed only on the multilayer ceramic substrate and not on the relay substrate, the multilayer ceramic substrate can be formed by simply changing the design of the relay substrate according to the electronic component to be inspected. It can be used in common or can be handled easily and in a short time without major changes.
The through conductor formed in the relay substrate may be a via conductor in which the entire through hole penetrating between the front surface and the back surface of the relay substrate is formed in a substantially cylindrical shape, or the through hole described above. The shape of the through-hole conductor formed in a generally cylindrical shape along the inner wall is filled with resin, metal, or the like.

The present invention also includes a wiring board for an electronic component inspection apparatus (Claim 2), wherein the ceramic layer of the relay board is made of any one of machinable ceramic, AlN, and mullite.
Furthermore, the present invention includes a wiring board for an electronic component inspection apparatus (Claim 3), wherein the machinable ceramic is a mixture of SiO ₂ and Al ₂ O ₃ or a mixture of AlN and BN. .
According to these, the relay substrate is a machinable ceramic having a thermal expansion coefficient in the temperature range of about 4.5 × 10 ⁻⁶ / ° C., AlN of about 4.3 × 10 ⁻⁶ / ° C., or about 4.2. It is formed of a ceramic layer made of mullite at × 10 ⁻⁶ / ° C. For this reason, since the thermal expansion coefficient of the Si wafer having a thermal expansion coefficient in the temperature range of about 3.0 × 10 ⁻⁶ / ° C. is approximately similar, many electronic components formed on the Si wafer can be inspected. It becomes possible to carry out accurately and reliably.
The machinable ceramic refers to a ceramic that can be easily machined, in particular, machined. For example, mica ceramic that uses significant cleavage of crystals contained in a ceramic material, or selective destruction of grain boundaries. Also used are aluminum titanate ceramics.

The present invention also includes an electronic component inspection device wiring board (Claim 4) in which the thickness of the ceramic layer forming the relay board is 1 mm or less.
According to this, even if a multilayer ceramic substrate is bonded to the relay substrate having a thin wall thickness of 1 mm or less and a low thermal expansion coefficient via a plurality of connecting conductors, the overall thickness is relatively thin, about 5 to 6 mm. The wiring board can be used, and a small space is required in the inspection process of the electronic component, and it can contribute to facilitating handling.
The shape of the ceramic layer forming the relay substrate in a plan view is arbitrary. For example, when an electronic component to be inspected is formed on a Si wafer, the entire circular shape of the Si wafer in a plan view is formed. In addition to a perfect circle that can cover, a regular polygon such as a regular hexagon, a regular octagon, or a regular dodecagon may be employed.

Furthermore, the present invention includes an electronic component inspection device wiring board (Claim 5) in which the plurality of ceramic layers forming the multilayer ceramic wiring board are made of a high-temperature fired ceramic or a low-temperature fired ceramic.
According to this, an electrical signal is transmitted to each electrode of the electronic component via the plurality of connecting conductors, the through conductors of the relay board and the pads on the front and back surfaces, or conversely, inspection is performed from each electronic component. After receiving the signal and performing voltage amplification and signal current rectification in the internal wiring layer, the signal can be output from the back surface side pad to an external circuit board or the like.
The high-temperature fired ceramic is made of alumina, for example, and wiring layers, via conductors, and pads made of W or Mo are formed on the inside, front and back surfaces, while the low-temperature fired ceramic is made of glass-ceramic, for example. A wiring layer made of Cu or Ag, a via conductor, and a pad are formed in the inside and front and back surfaces.

In addition, according to the present invention, the connection conductor is formed on the back surface of the relay substrate and is connected to the through conductor, and is formed on the surface of the multilayer ceramic wiring substrate and is electrically connected to the wiring layer. A wiring board for an electronic component inspection apparatus (Claim 6) comprising a side pad and solder for connecting these two pads is also included.
According to this, the low thermal expansion relay board and the higher and lower thermal expansion multilayer ceramic wiring board are joined via the plurality of connecting conductors, and therefore the influence of the difference in thermal expansion coefficient between the two is applied. It is possible to reliably absorb the connecting conductor. Therefore, the electrical connection between the probe on the relay board side and the electrode for each electronic component can be ensured, and the obtained signal can be reliably output to the outside by performing electrical processing on the wiring layer in the multilayer ceramic wiring board. It becomes possible to make it.
For example, a solder made of a Sn—Ag—Cu alloy is used as the solder.

On the other hand, the method for manufacturing a wiring board for an electronic component inspection apparatus according to the present invention (Claim 7) provides a ceramic layer having a thermal expansion coefficient of 3.0 to 4.5 × 10 ⁻⁶ / ° C. at −40 to + 150 ° C. The ceramic sheet is formed by firing a green sheet to form a single ceramic layer, forming a plurality of through conductors penetrating between the front and back surfaces of the ceramic layer, and exposing both end faces of the through conductor. A step of forming a relay substrate including forming a plurality of pads for each back surface and then heating the plurality of through conductors and pads, and a plurality of holes penetrating between the front and back surfaces of the plurality of green sheets. A via conductor is formed for each via hole, a wiring layer or a pad is formed on at least one of the front and back surfaces of the plurality of green sheets, and the plurality of green sheets are laminated and fired to obtain a multilayer ceramic. Forming a wiring board, a surface-side pad formed on the surface of the multilayer ceramic wiring board, and a back-side pad formed on the back surface of the relay board between the relay board and the multilayer ceramic wiring board. And a step of connecting via solder.

According to this, the single ceramic layer forming the relay substrate is pre-fired and then drilled to form a plurality of through holes with high positional accuracy. Each time, a through conductor in the form of a via conductor or a through-hole conductor is formed. Since the through conductor and the plurality of pads formed on the front and back surfaces of the ceramic layer are heated (cured), the plurality of pads are formed with high positional accuracy on the surface of the low thermal expansion relay substrate. Therefore, it is possible to reliably manufacture a wiring board that can secure the electrical connection between the probe attached to each pad and the electrode for each electronic component formed on a large number of Si wafers, etc., while minimizing the influence of temperature changes. It becomes possible. In addition, it is possible to provide a wiring board in which signals detected from each probe can be output to the outside from the back-side pad via a plurality of connection conductors and a wiring layer in the multilayer ceramic wiring board.
Moreover, the present invention further includes a step of attaching a probe that contacts an electrode of an electronic component to be inspected on a plurality of front surface pads formed on the surface of the relay substrate. A manufacturing method (claim 8) is also included.
According to this, since the probe is attached to each pad on the surface side of the relay substrate, for example, reliable electrical connection with electrodes for each of a large number of electronic components formed on the Si wafer is possible. Therefore, it is possible to provide an inspection apparatus such as a probe with high accuracy.

In the following, the best mode for carrying out the present invention will be described.
FIG. 1 is a schematic view showing a cross section of a wiring board for an electronic component inspection apparatus (hereinafter, simply referred to as an inspection apparatus wiring board) 1 according to the present invention and a use state thereof.
As shown in FIG. 1, the inspection apparatus wiring board 1 includes a single ceramic layer S and a relay board 2 through which a plurality of via conductors 6 pass between the front surface 3 and the back surface 4, and the relay board 2. A multi-layer ceramic substrate 10 including a plurality of ceramic layers s1 to s4 and wiring layers 13 to 15 formed between the ceramic layers s1 to s4 and a connecting conductor including a solder 18 that electrically connects them. The total thickness is about 5 to 6 mm.
The ceramic layer S forming the relay substrate 2 is made of any one of machinable ceramic having a thickness of 1 mm or less, AlN, or mullite, and has a thermal expansion coefficient (hereinafter simply referred to as CTE) at −40 to + 150 ° C. It is 0-4.5x10 < ^-6 > / degreeC.
In addition, the CTE of AlN in the above temperature range is about 4.3 × 10 ⁻⁶ / ° C., and the CTE of mullite is about 4.2 × 10 ⁻⁶ / ° C. The machinable ceramic is made of a mixture of SiO ₂ and Al ₂ O ₃ or a mixture of AlN and BN, and their CTE is about 4.5 × 10 ⁻⁶ / ° C.

As shown in FIG. 1, a plurality of through holes 5 are drilled between the front surface 3 and the back surface 4 of the ceramic layer S of the relay substrate 2, and through conductors 6 similar to the via conductors are formed inside these. Is formed. The through conductor 6 may have a substantially cylindrical shape along the inner wall surface of each through hole 5 and may be a through hole conductor filled with metal or resin.
A front surface side pad 7 and a rear surface side pad 8 connected to the through conductor 6 are formed on the front surface 3 and the back surface 4 of each through conductor 6. A probe 9 that is in contact with the electrode 19 of each of a large number of electronic components (not shown) formed on the Si wafer 20 to be inspected and is electrically connected thereto is attached on the surface side pad 7 later. It is done. The through conductor 6, the front surface side pad 7, and the back surface side pad 8 are made of, for example, Ag or Cu, or an alloy based on one of them.

As shown in FIG. 1, the multilayer ceramic substrate 10 has ceramic layers s1 to s4 made of, for example, alumina (high temperature fired ceramic) or glass-ceramic (low temperature fired ceramic), and a required pattern formed therebetween. The wiring layers 13 to 15, the front surface side pad 16 formed on the front surface 11 of the ceramic layer s1, the back surface side pad 17 formed on the rear surface 12 of the ceramic layer s4, and the ceramic layers s1 to s4 for connecting these conductors. And a plurality of via conductors v penetrating through.
Furthermore, the back surface side pad 8 of the relay substrate 2 and the front surface side pad 16 of the multilayer ceramic substrate 10 are connected by, for example, solder 18 made of Sn—Ag—Cu alloy. The solder 18, the back surface side pad 8, and the front surface side pad 16 form the connection conductor of the present invention, and through these, the through conductor 6 and the front surface side pad 7 of the relay substrate 2 and the wiring of the multilayer ceramic substrate 10. The layers 13 to 15, the via conductor v, and the back surface side pad 17 can be electrically connected.

According to the inspection apparatus wiring board 1 as described above, the single-layer ceramic layer S forming the relay substrate 2 having the plurality of through conductors 6 forms a wafer including a large number of electronic components. Since the thermal expansion coefficient at 40 to + 150 ° C. is approximately 3 × 10 ⁻⁶ / ° C., a plurality of probes that are attached to the surface side pad 7 of the relay substrate 2 even when subjected to a thermal change in the above temperature range 9 and the electrode 19 of each electronic component formed on the Si wafer 20 can be easily secured. Further, since the relay substrate 2 and the multilayer ceramic substrate 10 are joined via a plurality of connecting conductors including the solder 18, the influence of the difference in thermal expansion coefficient between the two can be reliably absorbed by the connecting conductor. Is possible. For this reason, signals detected from the probes 9 can be output to the outside from the back surface side pad 17 via the plurality of connection conductors, the wiring layers 13 to 15 in the multilayer ceramic substrate 1 and the via conductors v. Therefore, even if the electronic component is formed on the Si wafer 20 having a large diameter of 300 mm or more, the electrical characteristics can be accurately and reliably inspected.
Moreover, since the wiring layer 13 and the like are formed only on the multilayer ceramic substrate 10 and not on the relay substrate 2, only the design change such as a shape change is performed on the relay substrate 2 according to the electronic component to be inspected. Thus, the multilayer ceramic substrate 10 can be used as it is, or can be handled easily and in a short time without any major change.

The inspection device wiring board 1 was manufactured by the following method.
In advance, the required amount of machinable ceramic (a mixture of SiO ₂ and Al ₂ O ₃ or a mixture of AlN and BN), AlN or mullite, a resin binder, a solvent, etc. is bottled and mixed in the required amounts. A ceramic slurry was prepared, and a green sheet having a thickness of about 1 mm was formed from the ceramic slurry by a doctor blade method.
Next, the green sheet is fired at a predetermined temperature, and as shown in the cross-sectional view of FIG. 2, the green sheet has a front surface 3 and a back surface 4, a thickness t is 1 mm or less, and CTE at −40 to + 150 ° C. A ceramic layer S of 3.0 to 4.5 × 10 ⁻⁶ / ° C. was obtained.

Next, the ceramic layer S was drilled with a drill to form a plurality of through holes 5 penetrating between the front surface 3 and the back surface 4 as shown in FIG.
Further, electroless Ag plating and electrolytic Ag plating, or electroless Cu plating and electrolytic Cu plating are applied to the vicinity of each through-hole 5 in the ceramic layer S so that the whole is substantially cylindrical as shown in FIG. A plurality of plated bodies 6a were formed.
Next, the hollow portion of the plated body 6a is filled and filled with a conductive paste containing Ag powder or Cu powder, so that both end surfaces are from the front and back surfaces 3, 4 of the ceramic layer S as shown in FIG. A slightly projecting through conductor 6b was formed. The hollow part of the plated body 6a may be filled with resin.

Next, the front surface 3 and the back surface 4 of the ceramic layer S are polished with a grindstone or a belt sander, and as shown in FIG. Formed every 5th.
In addition, after the conductive paste containing Ag powder or Cu powder is directly printed and filled in the through hole 5 to form the through conductor 6, the same polishing as described above may be performed.
Furthermore, as shown in FIG. 7, the conductive paste containing Ag powder or Cu powder is screen-printed for each position where the end face of each through conductor 6 is exposed on the front and back surfaces 3 and 4 of the ceramic layer S. The front surface side pad 7 and the back surface side pad 8 were formed.
Then, the through conductor 6, the front surface side pad 7, and the back surface side pad 8 were heated (cured) at a predetermined temperature (about 150 to 250 ° C.) to be cured.
As a result, the relay substrate 2 shown in FIG. 1 was obtained.

On the other hand, a ceramic slurry is prepared by mixing and mixing required amounts of alumina powder, resin binder, solvent, and the like, and the ceramic slurry is about 100 to 500 μm in thickness as shown in FIG. 8 by the doctor blade method. Green sheets gs1 to gs4 were formed. In addition, it may replace with the said alumina powder and you may use the glass-ceramic powder whose glass component and alumina powder are about 4: 6-6: 4 by weight ratio.
Next, the predetermined positions in the green sheets gs1 to gs4 were punched to form a plurality of via holes h penetrating them as shown in FIG.
Next, a conductive paste containing W powder or Mo powder was printed and filled inside each via hole h to form a via conductor v as shown in FIG.

Further, the conductive paste similar to the above is screen-printed on at least one of the front and back surfaces of the green sheets gs1 to gs4, and as shown in FIG. Pads 16 and 17 were formed. At this time, each via conductor v was connected to the wiring layers 13 to 15 and the front and back side pads 16 and 17 of the same green sheets gs1 to gs4.
In addition, in the case of the green sheets gs1-gs4 containing glass-ceramic powder, the electrically conductive paste containing Ag powder or Cu powder was used.
Next, the green sheets gs1 to gs4 on which the via conductors v, the wiring layers 13 to 15 and the front and back pads 16 and 17 are formed are laminated and pressure-bonded, and as shown in FIG. SS was obtained. At this time, each via conductor v was connected to the wiring layers 13 to 15 of the adjacent green sheets gs2 to gs4.

And this laminated body was baked at predetermined | prescribed temperature (about 800-1000 degreeC).
As a result, the multilayer ceramic substrate 10 shown in FIG. 1 having an overall thickness of about 3 to 5 mm was obtained.
Next, as shown in FIG. 11, between the surface 11 side of the multilayer ceramic substrate 10 and the back surface 4 side of the relay substrate 2, the Sn—Ag—Cu-based alloy is formed on each former surface side pad 16. After mounting a substantially ball-shaped solder 18 (not shown), it was heated in a temperature range slightly above its melting point. The solder 18 may be placed on each back surface side pad 8 of the relay substrate 2 and each surface side pad 16 of the multilayer ceramic substrate 10 may be placed thereon, and then heated in the same manner as described above. .

As a result, as shown in FIG. 12, the back and front side pads 8 and 16 are joined via the solder 18, and the relay substrate 2 and the multilayer ceramic substrate 10 are joined via a plurality of connecting conductors composed of these. In addition, the wiring board 1 for an inspection apparatus of the present invention was obtained. At the same time, the through conductor 6 and the front surface side pad 7 of the relay substrate 2 can be electrically connected to the wiring layers 13 to 15, the via conductor v, and the back surface side pad 17 of the multilayer ceramic substrate 10.
And the principal part of the electronic component inspection apparatus was able to be formed by attaching the probe 9 on each surface side pad 7 of the relay substrate 2. Note that an electronic circuit inspection device such as a probe card can be formed by further connecting an external circuit board (not shown) to the back surface side pad 17 of the multilayer ceramic substrate 10.

  According to the manufacturing method of the wiring board 1 for an inspection apparatus as described above, the single ceramic layer S forming the relay substrate 2 is pre-fired after the low thermal expansion coefficient green sheet is fired, A plurality of through holes h are formed with high positional accuracy, and a through conductor 6 in the form of a via conductor or a through hole conductor is formed for each through hole h. Since the through conductor 6 and the plurality of pads 7 and 8 formed for the front and back surfaces 3 and 4 of the ceramic layer S are heated (cured), the plurality of pads 7 are formed on the surface 3 of the low thermal expansion relay substrate 2. Can be formed with high positional accuracy. Therefore, the wiring board 1 for an inspection apparatus that can secure the electrical connection between the probe 9 attached to each pad 7 and the electrode 19 for each electronic component formed on the Si wafer 20 with the least influence of temperature change. Can be reliably manufactured. Moreover, the signals detected from each probe 9 can be output to the outside from the back surface side pad 17 through the plurality of connection conductors 18 and the wiring layers 13 to 15 in the multilayer ceramic substrate 10. It is possible to reliably provide the wiring board 1.

The present invention is not limited to the above embodiment.
For example, the front surface 3 and the back surface 4 of the ceramic layer S in the relay substrate 2 may be formed with wirings connecting the front surface pads 7 and 7 or between the back surface pads 8 and 8.
The connecting conductor solder 18 may be made of Sn—Ag, Sn—Cu, or Sn—Zn alloy.
Further, a resin or glass for sealing is filled between the relay substrate 2 and the multilayer ceramic wiring substrate 10 so as to surround the periphery of the solder 18 that is the plurality of connection conductors formed at such positions. It is also possible.
Further, the ceramic layers s1 to s4 of the multilayer ceramic wiring board 10 may be formed of a high-temperature fired ceramic such as mullite or AlN.
In addition, the multilayer ceramic wiring board 10 can have a cavity opened on the back surface 12 side, and various electronic components can be mounted in the cavity.

Sectional drawing which shows the wiring board for electronic component inspection apparatuses of this invention. FIG. 6 is a schematic cross-sectional view showing one manufacturing process for obtaining the relay substrate. FIG. 3 is a schematic cross-sectional view showing a manufacturing process subsequent to FIG. 2. FIG. 4 is a schematic cross-sectional view showing a manufacturing process following FIG. 3. FIG. 5 is a schematic cross-sectional view showing a manufacturing process following FIG. 4. FIG. 6 is a schematic cross-sectional view showing a manufacturing process subsequent to FIG. 5. FIG. 7 is a schematic cross-sectional view showing a manufacturing process subsequent to FIG. 6. FIG. 3 is a schematic cross-sectional view showing one manufacturing process of the multilayer ceramic wiring board. FIG. 9 is a schematic cross-sectional view showing a manufacturing process following FIG. 8. FIG. 10 is a schematic cross-sectional view showing a manufacturing process following FIG. 9. FIG. 5 is a schematic cross-sectional view showing one manufacturing process for obtaining the inspection apparatus wiring board. FIG. 12 is a schematic cross-sectional view showing a manufacturing process following FIG. 11.

Explanation of symbols

1 ………………………… Wiring board for electronic component inspection equipment 2 ………………………… Relay board 3, 11 ………………… Surface 4 ………………… ……… Back 6 ………………………… Penetration conductor 7, 16 ………………… Front side pad 8 ………………………… Back side pad 9 …………… …………… Probe 10 ……………………… Multilayer Ceramic Wiring Board 13 ~ 15 ……………… Wiring Layer 18 ……………………… Solder (Connection Conductor)
19 …………………… Electrode 20 ……………………… Si wafer (electronic parts)
v ………………………… Via conductor S, s1-s4 ………… Ceramic layer gs1-gs4 ………… Green sheet

Claims (8)

A ceramic layer having a single layer and a thermal expansion coefficient of 3.0 to 4.5 × 10 ⁻⁶ / ° C. at −40 to + 150 ° C., and a plurality of through conductors penetrating between the front surface and the back surface of the ceramic layer Having a relay board;
A multilayer including a plurality of ceramic layers, a wiring layer formed between the ceramic layers, and a via conductor that passes through the plurality of ceramic layers and is conducted between the wiring layers, disposed on the back side of the relay substrate. A ceramic wiring board;
A plurality of connecting conductors disposed between the relay board and the multilayer ceramic wiring board and electrically conducting the plurality of through conductors of the relay board and the wiring layer of the multilayer ceramic wiring board;
A wiring board for an electronic component inspection apparatus. The ceramic layer of the relay substrate is made of either machinable ceramic, AlN, or mullite.
The wiring board for an electronic component inspection apparatus according to claim 1. The machinable ceramic is a mixture of SiO ₂ and Al ₂ O ₃ or a mixture of AlN and BN.
The wiring board for an electronic component inspection apparatus according to claim 2. The thickness of the ceramic layer forming the relay substrate is 1 mm or less.
The wiring board for an electronic component inspection apparatus according to any one of claims 1 to 3. The plurality of ceramic layers forming the multilayer ceramic wiring board are made of a high-temperature fired ceramic or a low-temperature fired ceramic.
The wiring board for an electronic component inspection apparatus according to any one of claims 1 to 4, wherein: The connection conductor is formed on the back surface of the relay substrate and connected to the through conductor, the back surface side pad formed on the surface of the multilayer ceramic wiring substrate and connected to the wiring layer, and these two pads Consisting of solder connecting,
The wiring board for an electronic component inspection apparatus according to any one of claims 1 to 5. A green sheet serving as a ceramic layer having a thermal expansion coefficient at −40 to + 150 ° C. of 3.0 to 4.5 × 10 ⁻⁶ / ° C. is fired to form a single ceramic layer, and the front and back surfaces of the ceramic layer And forming a plurality of pads for each of the front and back surfaces of the ceramic layer where both end faces of the through conductor are exposed, and then heating the plurality of through conductors and pads. A step of forming a relay substrate including:
A via conductor is formed for each of a plurality of via holes penetrating between the front and back surfaces of the plurality of green sheets, and a wiring layer or a pad is formed on at least one of the front and back surfaces of the plurality of green sheets. Laminating and firing the sheets to form a multilayer ceramic wiring board;
Between the relay substrate and the multilayer ceramic wiring substrate, connecting a front surface side pad formed on the surface of the multilayer ceramic wiring substrate and a back surface side pad formed on the back surface of the relay substrate via solder; The manufacturing method of the wiring board for electronic component inspection apparatuses characterized by these. A step of attaching a probe in contact with an electrode of an electronic component to be inspected on a plurality of surface side pads formed on the surface of the relay substrate;
The method for manufacturing a wiring board for an electronic component inspection apparatus according to claim 7.

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