JP2009043829A - Coater and coating method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coater and a coating method which can prevent the yield from falling. <P>SOLUTION: The amount of particles in the air can be confirmed before a substrate is floated, since the amount of particles in the air is measured for a predetermined part having an effect directly or indirectly on the moving passage of a substrate by means of an instrument for measuring the amount of particles in the air. The possibility that the particles adhere to the substrate can be determined based on the amount of particles in the air thus measured, since the amount of particles in the air can be confirmed before the substrate is floated. Consequently, the yield can be prevented from falling. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a coating apparatus and a coating method.

  A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. In general, such a pattern is formed by a technique such as photolithography. In the photolithography method, a step of forming a resist film on a glass substrate, a step of pattern exposing the resist film, and a step of developing the resist film are performed.

As a device for applying a resist film on the surface of a substrate, a coating device for fixing a slit nozzle and applying a resist to a glass substrate that moves under the slit nozzle is known. Among them, a coating apparatus that moves a substrate up and down by jetting gas onto a stage is known.
Japanese Patent Laid-Open No. 2005-236092

  However, there is a possibility that particles in the air are rolled up by the gas ejected when the substrate is levitated and adhere to the substrate. A substrate on which a resist is applied with particles adhering to the substrate becomes a defective substrate, which causes a decrease in yield.

  In view of the circumstances as described above, an object of the present invention is to provide a coating apparatus and a coating method capable of preventing a decrease in yield.

  In order to achieve the above object, a coating apparatus according to the present invention includes a substrate transport unit that floats and transports a substrate, and a coating unit that applies a liquid material to the substrate while transporting the substrate by the substrate transport unit. A coating apparatus comprising a measuring device that measures the amount of airborne particles in a predetermined portion that directly or indirectly affects a path along which the substrate moves.

  According to the present invention, since the amount of airborne particles in a predetermined portion that directly or indirectly affects the path along which the substrate moves is measured by the measuring instrument, before the substrate is levitated or the operation of the coating apparatus is performed. The amount of airborne particles can be confirmed on the way. By checking the amount of airborne particles before the substrate is lifted or during the operation of the coating apparatus, it is possible to determine the possibility of the particles adhering to the substrate based on the measured amount of airborne particles.

In the coating apparatus, the predetermined portion includes at least one of the substrate transport unit and the coating unit.
If the amount of air particles around the substrate transport unit and the application unit is too large, there is a high possibility that air particles adhere to the substrate while the substrate is being transported or applied. According to the present invention, since the predetermined part includes at least one of the substrate transport unit and the coating unit, the amount of air particles in the substrate transport unit and the coating unit is confirmed, and the possibility of particles adhering to the substrate is determined. can do.

The coating apparatus further includes a management unit that manages a state of the coating unit, and the predetermined portion includes the management unit.
In the management unit, an operation for managing the state of the application unit is performed. This operation may cause air particles around the management unit to be wound up and adhere to the substrate. According to the present invention, the apparatus further includes a management unit that manages the state of the coating unit, and the predetermined part includes the management unit. Therefore, the amount of particles in the air including the management unit is confirmed, and the particles may adhere to the substrate. Can be judged.

In the coating apparatus, the management unit is provided at a position overlapping the substrate transport unit in plan view, and the predetermined portion includes a region between the substrate transport unit and the management unit. And
When air particles are included in the region between the substrate transport unit and the management unit, the possibility that the particles adhere to the substrate is further increased. According to the present invention, the management unit is provided at a position overlapping the substrate transport unit in plan view, and the predetermined portion includes an area between the substrate transport unit and the management unit. The amount of airborne particles in the area between the two can be confirmed, and the possibility of particles adhering to the substrate can be determined.

In the coating apparatus, the substrate transport unit includes a gas ejection unit for controlling the flying height of the substrate, and the predetermined portion includes a path through which gas passes in the gas ejection unit. It is characterized by.
Since the gas ejection section provided in the coating apparatus ejects gas onto the substrate transport section, if there are too many air particles contained in the gas passage path of this gas ejection section, The possibility of being blown up and adhering to the substrate increases. According to the present invention, the substrate transport unit has the gas ejection part for controlling the flying height of the substrate, and the predetermined part includes the inside of the gas ejection part through which the gas passes. Among them, the amount of particles in the air in the path through which the gas passes can be confirmed to determine the possibility of particles adhering on the substrate.

In the coating apparatus, a suction unit for controlling the flying height of the substrate is provided in a region corresponding to the coating unit in the substrate transport unit. Of these, the inside of the path through which the gas passes is included.
A suction unit provided in the coating apparatus performs suction in order to control the flying height of the substrate in the substrate transport unit. For this reason, when there are too many air particles contained in the gas passage path of the suction part, the air particles are attracted to the substrate together with the gas, and the possibility of adhering to the substrate increases. According to the present invention, a suction portion for controlling the flying height of the substrate is provided in a region corresponding to the coating portion in the substrate transport portion, and the predetermined portion is in a path through which gas passes in the suction portion. Therefore, the amount of particles in the air in the path through which the gas passes can be confirmed, and the possibility of particles adhering to the substrate can be determined.

In the coating apparatus, the substrate transport unit includes a moving mechanism that holds and moves the floating substrate, and the predetermined portion includes the moving mechanism.
The moving mechanism provided in the substrate transport unit holds and moves the substrate that has floated along with its own movement. For this reason, when there are too many air particles contained around the moving mechanism, the air particles are rolled up by the movement of the moving mechanism, and the possibility of adhering to the substrate increases. According to the present invention, the substrate transport unit has a moving mechanism that holds and moves the substrate in a floating state, and the predetermined portion includes the moving mechanism. Therefore, the amount of air particles around the moving mechanism is reduced. Confirmation can be made to determine the possibility of particles adhering to the substrate.

  A coating method according to the present invention, which is a coating method in which a liquid material is coated on a substrate while the substrate is being transported, and a predetermined portion of air that directly or indirectly affects a path along which the substrate moves. The air particle amount of the predetermined portion is measured by a measuring device that measures the amount of medium particles.

  According to the present invention, since the amount of air particles in the predetermined portion is measured by the measuring device that measures the amount of air particles in the predetermined portion that directly or indirectly affects the path along which the substrate moves, the substrate is levitated. The amount of particles in the air can be confirmed before. By checking the amount of air particles before the substrate is lifted, it is possible to determine the possibility that the particles adhere to the substrate based on the measured amount of air particles.

The coating method is characterized in that the amount of airborne particles is measured before the liquid material is coated on the substrate.
According to the present invention, since the amount of particles in the air is measured before applying the liquid material on the substrate, it is possible to determine the possibility of particles adhering to the substrate. Particles can be prevented from adhering to the substrate. Note that it is more preferable to measure the amount of particles in the air before transporting the substrate because it can more reliably prevent particles from adhering to one substrate.

The coating method is characterized in that the amount of airborne particles is measured at a predetermined time interval.
According to the present invention, since the amount of air particles is measured at a predetermined time interval, the amount of air particles can be periodically confirmed. Thereby, it is possible to periodically determine the possibility that air particles adhere to the substrate.

The coating method is characterized in that the transport of the substrate and the coating of the liquid material are stopped when the measured amount of air particles is larger than a predetermined value.
According to the present invention, when the measured amount of particles in the air is larger than a predetermined value, the conveyance of the substrate and the application of the liquid material are stopped, so that the particles adhere to the substrate. This can be prevented more reliably.

  ADVANTAGE OF THE INVENTION According to this invention, the coating device and the coating method which can prevent a yield fall can be obtained.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of a coating apparatus 1 according to this embodiment.
As shown in FIG. 1, a coating apparatus 1 according to the present embodiment is a coating apparatus that coats a resist on a glass substrate used for a liquid crystal panel, for example, and includes a substrate transport unit 2, a coating unit 3, and a management unit. 4 is the main component. In the coating apparatus 1, a resist is applied onto the substrate by the coating unit 3 while the substrate is lifted and transported by the substrate transport unit 2, and the state of the coating unit 3 is managed by the management unit 4. It has become so. The substrate transport unit 2 is provided with air particle amount measuring devices 81 to 85 which are characteristic components of the present embodiment.

  2 is a front view of the coating apparatus 1, FIG. 3 is a plan view of the coating apparatus 1, and FIG. The detailed configuration of the coating apparatus 1 will be described with reference to these drawings.

(Substrate transport section)
First, the structure of the board | substrate conveyance part 2 is demonstrated.
The substrate transport unit 2 includes a substrate carry-in region 20, a coating processing region 21, a substrate carry-out region 22, a transport mechanism 23, and a frame unit 24 that supports them. In the substrate transport unit 2, the transport mechanism 23 transports the substrate S sequentially to the substrate carry-in area 20, the coating processing area 21, and the substrate carry-out area 22. The substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate carrying direction. The transport mechanism 23 is provided on one side of each part so as to straddle each part of the substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22.

  Hereinafter, in describing the configuration of the coating apparatus 1, for simplicity of description, directions in the drawing will be described using an XYZ coordinate system. The substrate transport direction is the longitudinal direction of the substrate transport unit 2 and the substrate transport direction is referred to as the X direction. A direction orthogonal to the X direction (substrate transport direction) in plan view is referred to as a Y direction. A direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as a Z direction. In each of the X direction, the Y direction, and the Z direction, the arrow direction in the figure is the + direction, and the direction opposite to the arrow direction is the-direction.

The substrate carry-in area 20 is a portion for carrying the substrate S carried from the outside of the apparatus, and has a carry-in stage 25 and a lift mechanism 26.
The carry-in stage 25 is provided on the upper portion of the frame portion 24, and is a rectangular plate-like member made of, for example, SUS or the like in plan view. The carry-in stage 25 has a long X direction. The carry-in stage 25 is provided with a plurality of air ejection holes 25a and a plurality of elevating pin retracting holes 25b. The air ejection holes 25 a and the lifting pin retracting holes 25 b are provided so as to penetrate the carry-in stage 25.

  The air ejection holes 25a are holes for ejecting air onto the stage surface 25c of the carry-in side stage 25. For example, the air ejection holes 25a are arranged in a matrix in a plan view in a region of the carry-in side stage 25 through which the substrate S passes. An air supply source (not shown) is connected to the air ejection hole 25a. In the carry-in stage 25, the substrate S can be floated in the + Z direction by the air ejected from the air ejection holes 25a.

  The elevating pin retracting hole 25b is provided in an area of the loading side stage 25 where the substrate S is loaded. The elevating pin retracting hole 25b is configured such that air supplied to the stage surface 25c does not leak out.

  One alignment device 25d is provided at each end of the carry-in stage 25 in the Y direction. The alignment device 25d is a device that aligns the position of the substrate S carried into the carry-in stage 25. Each alignment device 25d has a long hole and an alignment member (not shown) provided in the long hole, and mechanically holds the substrate loaded into the loading stage 25 from both sides. .

  An air particle amount measuring device 81 for measuring the amount of air particles is provided on the side of the alignment device 25d on the Y direction side and on the frame 24. This air particle amount measuring device 81 is capable of measuring the amount of air particles in the vicinity of the substrate carry-in area in the carry-in stage 25.

  The lift mechanism 26 is provided on the back side of the carry-in stage 25 at a position corresponding to the substrate carry-in position. The lift mechanism 26 includes an elevating member 26a and a plurality of elevating pins 26b. The elevating member 26a is connected to a driving mechanism (not shown), and the elevating member 26a is moved in the Z direction by driving the driving mechanism. The plurality of elevating pins 26b are erected from the upper surface of the elevating member 26a toward the carry-in stage 25. Each raising / lowering pin 26b is arrange | positioned in the position which overlaps with said raising / lowering pin retracting hole 25b, respectively by planar view. As the elevating member 26a moves in the Z direction, each elevating pin 26b appears and disappears on the stage surface 25c from the elevating pin appearing hole 25b. Ends in the + Z direction of the lift pins 26b are provided so that their positions in the Z direction are aligned, so that the substrate S transported from the outside of the apparatus can be held in a horizontal state. .

The coating processing region 21 is a portion where resist coating is performed, and a processing stage 27 that floats and supports the substrate S is provided.
The processing stage 27 is a rectangular plate-like member in a plan view in which the stage surface 27 c is covered with a light absorbing material mainly composed of hard anodized, for example, and is provided on the + X direction side with respect to the loading side stage 25. . In the portion of the processing stage 27 covered with the light absorbing material, reflection of light such as laser light is suppressed. The processing stage 27 has a longitudinal Y direction. The dimension of the processing stage 27 in the Y direction is substantially the same as the dimension of the loading stage 25 in the Y direction. The processing stage 27 is provided with a plurality of air ejection holes 27a for ejecting air onto the stage surface 27c and a plurality of air suction holes 27b for sucking air on the stage surface 27c. The air ejection holes 27 a and the air suction holes 27 b are provided so as to penetrate the processing stage 27. In addition, a plurality of grooves (not shown) are provided inside the processing stage 27 to give resistance to the pressure of the gas passing through the air ejection holes 27a and the air suction holes 27b. The plurality of grooves are connected to the air ejection holes 27a and the air suction holes 27b inside the stage.

  In the processing stage 27, the pitch of the air ejection holes 27 a is narrower than the pitch of the air ejection holes 25 a provided in the carry-in side stage 25, and the air ejection holes 27 a are provided more densely than the carry-in stage 25. Therefore, in this processing stage 27, the flying height of the substrate can be adjusted with higher accuracy than in other stages, and the flying height of the substrate is controlled to be, for example, 100 μm or less, preferably 50 μm or less. Is possible.

  The substrate carry-out area 22 is a part where the substrate S coated with resist is carried out of the apparatus, and includes a carry-out stage 28 and a lift mechanism 29. The carry-out stage 28 is provided on the + X direction side with respect to the processing stage 27, and is composed of substantially the same material and dimensions as the carry-in stage 25 provided in the substrate carry-in region 20. Similarly to the carry-in stage 25, the carry-out stage 28 is provided with an air ejection hole 28a and a lift pin retracting hole 28b. The lift mechanism 29 is provided on the back side of the carry-out stage 28 at a position corresponding to the substrate carry-out position. The lift member 29 a and the lift pin 29 b of the lift mechanism 29 have the same configuration as each part of the lift mechanism 26 provided in the substrate carry-in area 20. The lift mechanism 29 can lift the substrate S by lift pins 29b for transferring the substrate S when the substrate S on the unloading stage 28 is unloaded to an external device.

  The transport mechanism 23 includes a transport machine 23a, a vacuum pad 23b, and a rail 23c. The conveyor 23a has a configuration in which, for example, a linear motor is provided therein, and the conveyor 23a can move on the rail 23c when the linear motor is driven. The transporter 23a is arranged such that the predetermined portion 23d overlaps the end portion of the substrate S in the −Y direction in plan view. The portion 23d overlapping the substrate S is provided at a position lower than the height position of the back surface of the substrate when the substrate S is lifted.

  A plurality of vacuum pads 23b are arranged in a portion 23d overlapping the substrate S in the transport machine 23a. The vacuum pad 23b has a suction surface for vacuum-sucking the substrate S, and is arranged so that the suction surface faces upward. The vacuum pad 23b can hold the substrate S by the suction surface adsorbing the back surface end portion of the substrate S. The height position of each vacuum pad 23b from the upper surface of the transfer machine 23a can be adjusted. For example, the height position of the vacuum pad 23b can be raised or lowered according to the flying height of the substrate S. . The rail 23c extends across the stages on the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28, and the conveyor 23a slides along the respective stages by sliding on the rail 23c. Can move.

  An air particle amount measuring device 82 for measuring the amount of air particles is provided on the frame 24 on the X direction side of the transport mechanism 23. The air particle amount measuring device 82 can measure the air particle amount in the vicinity of the transport mechanism 23. In the drawing, an example is shown that is provided on the side of the carry-in side stage 25, but it may be provided on the side of the processing stage 27 and the side of the carry-out side stage 28, for example. When performing detailed measurement of the amount of particles in the air, they may be arranged in all of them.

(Applying part)
Next, the configuration of the application unit 3 will be described.
The application unit 3 is a part for applying a resist on the substrate S, and includes a portal frame 31 and a nozzle 32.
The portal frame 31 includes a support member 31a and a bridging member 31b, and is provided so as to straddle the processing stage 27 in the Y direction. One support member 31 a is provided on the Y direction side of the processing stage 27, and each support member 31 a is supported on both side surfaces of the frame portion 24 on the Y direction side. Each strut member 31a is provided so that the height positions of the upper end portions are aligned. The bridging member 31b is bridged between the upper end portions of the respective column members 31a, and can be moved up and down with respect to the column members 31a.

  The portal frame 31 is connected to a moving mechanism 31c and is movable in the X direction. The portal frame 31 is movable between the management unit 4 by the moving mechanism 31c. That is, the nozzle 32 provided in the portal frame 31 can move between the management unit 4. Further, the portal frame 31 can be moved in the Z direction by a moving mechanism (not shown).

  The nozzle 32 is formed in a long and long shape in one direction, and is provided on the surface on the −Z direction side of the bridging member 31 b of the portal frame 31. A slit-like opening 32a is provided along the longitudinal direction of the nozzle 32 at the tip in the -Z direction, and a resist is discharged from the opening 32a. The nozzle 32 is disposed so that the longitudinal direction of the opening 32 a is parallel to the Y direction and the opening 32 a faces the processing stage 27. The dimension in the longitudinal direction of the opening 32a is smaller than the dimension in the Y direction of the substrate S to be transported, so that the resist is not applied to the peripheral region of the substrate S. A flow passage (not shown) through which the resist flows through the opening 32a is provided inside the nozzle 32, and a resist supply source (not shown) is connected to the flow passage. The resist supply source has a pump (not shown), for example, and the resist is discharged from the opening 32a by pushing the resist to the opening 32a with the pump. The support member 31a is provided with a moving mechanism (not shown), and the nozzle 32 held by the bridging member 31b is movable in the Z direction by the moving mechanism. The nozzle 32 is provided with a moving mechanism (not shown), and the moving mechanism allows the nozzle 32 to move in the Z direction with respect to the bridging member 31b. On the lower surface of the bridging member 31b of the portal frame 31, there is a sensor 33 that measures the distance in the Z direction between the opening 32a of the nozzle 32, that is, between the tip of the nozzle 32 and the facing surface facing the nozzle tip. It is attached.

  An air particle amount measuring device 83 for measuring the amount of air particles is provided in the vicinity of the support member 31a on the Y direction side in the portal frame 31 and on the frame 24. The air particle amount measuring device 83 is capable of measuring the air particle amount in the vicinity of the application unit 3. In the drawing, an example provided on the frame 24 in the vicinity of the support member 31a on the Y direction side is shown, but on the frame 24, it is provided in the vicinity of the support member 31a on the −Y direction side. It doesn't matter. When performing detailed measurement of the amount of particles in the air, they may be arranged in both.

(Management Department)
The configuration of the management unit 4 will be described.
The management unit 4 is a part that manages the nozzles 32 so that the discharge amount of the resist (liquid material) discharged to the substrate S is constant, and the management unit 4 overlaps the coating unit 3 so as to overlap the substrate transport unit 2 in plan view. The -X direction side (upstream side in the substrate transport direction). The management unit 4 includes a preliminary discharge mechanism 41, a dip tank 42, a nozzle cleaning device 43, a storage member 44 for storing them, and a holding member 45 for holding the storage portion. The holding member 45 is connected to the moving mechanism 45a. The accommodating member 44 is movable in the X direction by the moving mechanism 45a.

  The preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order in the −X direction side. The dimensions of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 in the Y direction are smaller than the distance between the columnar members 31a of the portal frame 31, and the portal frame 31 straddles each part. It can be accessed at.

  The preliminary ejection mechanism 41 is a part that ejects the resist preliminary. The preliminary discharge mechanism 41 is provided closest to the nozzle 32. The dip tank 42 is a liquid tank in which a solvent such as thinner is stored. The nozzle cleaning device 43 is a device that rinses and cleans the nozzle 32.

  The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the dip tank 42 because the moving mechanism is provided.

  The arrangement of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 is not limited to the arrangement of the present embodiment, and other arrangements may be used.

  In addition, an air particle amount measuring device 85 that measures the amount of air particles is provided on a surface (a surface on the −Z direction side) facing the substrate transport unit 2 of the housing member 44. The air particle amount measuring device 85 can measure the air particle amount in the region between the management unit 4 and the substrate transport unit 2. In the figure, the air particle amount measuring device 85 is provided at substantially the center in the Y direction, but it may be provided at the + Y direction side end or the −Y direction side end. When performing detailed measurement of the amount of airborne particles, they may be arranged at all these positions. The air particle amount measuring device 85 is not limited to the surface of the housing member 44 facing the substrate transport unit 2, and for example, the surface of the housing member 44 on the substrate loading area side (surface on the −X direction side) Further, it may be arranged on the surface on the substrate carry-out region side (surface on the + X direction side).

(Processing stage)
FIG. 5 is a diagram showing the configuration of the air ejection mechanism / suction mechanism of the carry-in stage 25, the process stage 27, and the carry-out stage 28 of the substrate processing unit 2. Based on the same figure, the structure regarding the air ejection and air suction of each said stage is demonstrated.

  The carry-in stage 25 and the carry-out stage 28 are provided with only air ejection mechanisms 50 and 55, and no suction mechanism is provided. The configurations of the air ejection mechanisms 50 and 55 are the same in both stages. These air ejection mechanisms 50 and 55 have blowers 51 and 56 and buffer tanks 52 and 57, respectively.

  The blowers 51 and 56 are connected to an air supply line in a factory or the like, and the blowers 51 and 56 are connected to buffer tanks 52 and 57 by pipes 50a and 55a, respectively. The buffer tanks 52 and 57 are configured so that, for example, the temperature of supplied air is kept constant, and are connected to the manifolds 53 and 58 by pipes 50b and 55b, respectively.

  Pressure gauges are attached to the pipes 50b and 55b, and are connected to the carry-in stage 25 and the carry-out stage 28 by the pipes 50c and 55c, respectively. Various valves are provided in each of the pipes 50a to 50c and 55a to 55c. The pipes 50a to 50c and 55a to 55c may be provided with an air particle amount measuring device for measuring the air particle amount.

The processing stage 27 is provided with an air ejection mechanism 60 and a suction mechanism 70.
The air ejection mechanism 60 includes a blower 61, a buffer tank 62, an auto pressure controller (APC) 63, a manifold 64, and an ejection pressure monitoring port 65.

  The blower 61 is an air supply source that supplies air to the air ejection mechanism, and is connected to the buffer tank 62 by a pipe 60a. As an air supply source, an air supply line such as a factory may be connected instead of the blower 61. The buffer tank 62 is configured, for example, so that the temperature of supplied air is kept constant, and is connected to the APC 63 by a pipe 60b.

  The APC 63 is provided with a butterfly valve 63a and a controller 63b for adjusting the air supply amount. The manifold 64 is connected to the processing stage 27 by a pipe 60c. The piping 60c is branched on the processing stage 27 side, and the branched portion is connected to each of the plurality of grooves. Therefore, the air from the APC 63 is ejected from the air ejection hole 27a through the pipe 60c and the plurality of grooves. The manifold 64 is connected to the APC 63 by a pipe 60f. Note that the manifold 64 may not be provided.

  The ejection pressure monitoring port 65 is connected to the processing stage 27 by a pipe 60e. Specifically, the piping 60e is connected to the plurality of grooves, and the ejection pressure monitoring port 65 is connected to the air ejection holes 27a of the processing stage 27 through the piping 60e and the grooves. In this configuration, the pipe 60e is connected to the pipe 60c through the plurality of grooves. The ejection pressure monitoring port 65 has a configuration in which a pressure detection port is provided in the groove, and the gas pressure immediately below the stage can be detected by the pressure detection port. A pressure gauge 66 is provided in the ejection pressure monitoring port 65 so that the ejection pressure of air ejected from the air ejection hole 27a can be measured, and the measurement result is transmitted to the controller 63b in the APC 63. It has become. Moreover, various valves are provided in each of the pipes 60a to 60e. Further, a pressure gauge may be provided between the ACU 63 and the air ejection hole 27a, and the measurement result may be transmitted to the controller 63b in the APC 63.

  The suction mechanism 70 includes a blower 71, an auto pressure controller (APC) 72, a drain 73, a manifold 74, and a suction pressure monitoring port 75. The blower 71, the APC 72, the drain part 73, and the manifold 74 are connected to each other by pipes 70a to 70d, and various valves are attached to the pipes 70a to 70d. Instead of the blower 71, an air suction line such as a factory may be used. Moreover, the structure which does not provide the manifold 74 may be sufficient.

  The APC 72 is provided with a butterfly valve 72a and a controller 72b for adjusting the air supply amount. The suction pressure monitoring port 75 is connected to the processing stage 27 by a pipe 70e. Specifically, the piping 70e is connected to the plurality of grooves, and the suction pressure monitoring port 75 is connected to the air suction hole 27b of the processing stage 27 through the piping 70e and the grooves. Further, the pipe 70e is connected to the pipe 70d through the plurality of grooves. The suction pressure monitoring port 75 has a configuration in which a pressure detection port is connected to the plurality of grooves, and the gas pressure immediately below the processing stage 27 can be detected by the pressure detection port. . A pressure gauge 76 is attached to the suction pressure monitoring port 75 so that the suction pressure of the air sucked through the air suction hole 27b can be measured, and the measurement result is transmitted to the controller 72b in the APC 72. It has become. A pressure gauge may be provided between the APC 72 and the air suction hole 27b, and the measurement result may be transmitted to the controller 72b in the APC 72.

  The ejection pressure monitoring port 65 is provided with an air particle amount measuring device 84 for measuring the amount of air particles, for example, in the middle of the pipe 60e. The air particle amount measuring device 84 can measure the air particle amount in the supply path of the air ejected onto the processing stage 27. In the figure, an example in which the air particle amount measuring device 84 is arranged in the ejection pressure monitoring port 65 is shown, but, in addition, for example, it may be configured to be arranged in the suction pressure monitoring port 75. When arranged in the suction pressure monitoring port 75, the amount of airborne particles contained in the air sucked from the processing stage 27 can be measured. Further, in the case where detailed measurement of the amount of airborne particles is performed, it may be configured to be disposed in both the ejection pressure monitoring port 65 and the suction pressure monitoring port 75.

(Applicator operation)
Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated.
6-9 is a top view which shows the operation | movement process of the coating device 1. FIG. With reference to each figure, the operation | movement which apply | coats a resist to the board | substrate S is demonstrated. In this operation, the substrate S is carried into the substrate carry-in region 20, a resist is applied in the coating treatment region 21 while the substrate S is floated and conveyed, and the substrate S coated with the resist is carried out from the substrate carry-out region 22. . In FIGS. 6 to 9, only the outlines of the portal frame 31 and the management unit 4 are indicated by broken lines, so that the configuration of the nozzle 32 and the processing stage 27 can be easily discriminated. Hereinafter, detailed operations in each part will be described.

  Before the substrate is carried into the substrate carry-in area 20, the coating apparatus 1 is put on standby. Specifically, the amount of airborne particles in each part is measured by the airborne particle measuring devices 81 to 85 provided in the respective parts of the coating apparatus 1. When it is determined that the amount of airborne particles is large, specifically, when it is determined that airborne particles are likely to adhere to the substrate and become a defective substrate, airborne particles are required before performing the substrate loading operation. The atmosphere of the coating apparatus 1 is cleaned around a portion where the amount measuring device 81 to 85 determines that the amount of particles is large.

  Further, the transfer machine 23a is disposed on the −Y direction side of the substrate loading position of the loading side stage 25, the height position of the vacuum pad 23b is adjusted to the flying height position of the substrate, and the air ejection of the loading side stage 25 is performed. Air was blown out or sucked from the holes 25a, the air ejection holes 27a of the processing stage 27, the air suction holes 27b, and the air ejection holes 28a of the carry-out stage 28, and air was supplied to such an extent that the substrate floated on the surface of each stage. Leave it in a state.

  In this state, for example, when the substrate S is transferred from the outside to the substrate carry-in position shown in FIG. 8 by a transfer arm (not shown), the elevating member 26a is moved in the + Z direction to move the elevating pin 26b from the elevating pin retracting hole 25b. Project to the surface 25c. And the board | substrate S is lifted by the raising / lowering pin 26b, and the said board | substrate S is received. Further, an alignment member is projected from the long hole of the alignment device 25d to the stage surface 25c.

  After receiving the board | substrate S, the raising / lowering member 26a is lowered | hung and the raising / lowering pin 26b is accommodated in the raising / lowering pin retracting hole 25b. Since an air layer is formed on the stage surface 25c, the substrate S is held in a state of being floated with respect to the stage surface 25c by the air. When the substrate S reaches the surface of the air layer, the alignment member 25d aligns the substrate S, and the vacuum pad 23b of the transfer device 23a disposed on the −Y direction side of the substrate loading position is used as the substrate. Vacuum adsorption is performed on the end portion of S in the −Y direction. FIG. 6 shows a state in which the −Y direction side end portion of the substrate S is adsorbed. After the end of the −Y direction side of the substrate S is adsorbed by the vacuum pad 23b, the transporter 23a is moved along the rail 23c. Since the substrate S is in a floating state, the substrate S moves smoothly along the rail 23c even if the driving force of the transporter 23a is relatively small.

  When the front end of the substrate S in the transport direction reaches the position of the opening 32a of the nozzle 32, the resist is discharged from the opening 32a of the nozzle 32 toward the substrate S as shown in FIG. The resist is discharged while the position of the nozzle 32 is fixed and the substrate S is transported by the transport machine 23a. As the substrate S moves, a resist film R is applied onto the substrate S as shown in FIG. As the substrate S passes under the opening 32a for discharging the resist, a resist film R is formed in a predetermined region of the substrate S.

  When discharging the resist, the substrate S is transported while controlling the flying height of the substrate S by the air ejection mechanism. Specifically, the air ejection pressure is controlled so that the air ejection pressure is constant. At the ejection pressure monitoring port 65 of the air ejection mechanism 60, the ejection pressure is measured by the pressure gauge 66, and the measured value is fed back to the APC 63. The controller 63b of the APC 63 performs control to increase the air supply amount when the ejection pressure is higher than a predetermined value and to decrease the air supply amount when the ejection pressure is higher than the predetermined value. By this control, the ejection pressure of the air ejected from the air ejection holes 27a is kept constant, and the flying height of the substrate S is stabilized.

  The substrate S on which the resist film R is formed is transported to the unloading stage 28 by the transport machine 23a. In the carry-out stage 28, the substrate S is transported to the substrate carry-out position shown in FIG.

  When the substrate S reaches the substrate unloading position, the suction of the vacuum pad 23b is released, and the elevating member 29a of the lift mechanism 29 is moved in the + Z direction. Then, the elevating pins 29b protrude from the elevating pin retracting holes 28b to the back surface of the substrate S, and the substrate S is lifted by the elevating pins 29b. In this state, for example, an external transfer arm provided on the + X direction side of the carry-out stage 28 accesses the carry-out stage 28 and receives the substrate S. After the substrate S is transferred to the transport arm, the transport machine 23a is returned to the substrate loading position of the carry-in stage 25 again and waits until the next substrate S is transported.

  Until the next substrate S is transported, the application unit 3 performs preliminary discharge for maintaining the discharge state of the nozzles 32. As shown in FIG. 10, the portal frame 31 is moved in the −X direction to the position of the management unit 4 by the moving mechanism 31 c.

  After the portal frame 31 is moved to the position of the management unit 4, the position of the portal frame 31 is adjusted, the nozzle 32 is accessed to the nozzle cleaning device 43, and the nozzle 32 is cleaned by the nozzle cleaning device 43.

  After cleaning the nozzle 32, the nozzle 32 is accessed to the preliminary discharge unit 42. In the preliminary discharge unit 42, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while measuring the distance between the opening 32a and the preliminary discharge surface, and the nozzle 32 is moved in the −X direction. A resist is preliminarily discharged from the opening 32a.

  After performing the preliminary discharge operation, the portal frame 31 is returned to the original position. When the next substrate S is transported, the nozzle 32 is moved to a predetermined position in the Z direction as shown in FIG. In this way, a high-quality resist film R is formed on the substrate S by repeatedly performing the coating operation for applying the resist film R on the substrate S and the preliminary ejection operation.

  If necessary, for example, each time the management unit 4 is accessed a predetermined number of times, the nozzle 32 may be accessed in the dip tank 42. In the dip layer 42, drying of the nozzle 32 is prevented by exposing the opening 32 a of the nozzle 32 to a vapor atmosphere of a solvent (thinner) stored in the dip tank 42.

  Further, in the above series of operations, the air particle amount measuring devices 81 to 85 measure the air particle amount every certain time. As a result of this measurement, when it is determined that the amount of airborne particles is large, specifically, when it is determined that airborne particles are likely to adhere to the substrate and become a defective substrate, the operation is temporarily stopped ( interlock). The operation is restarted after cleaning the atmosphere of the coating apparatus 1 with the air particle amount measuring devices 81 to 85 determining that the amount of particles is large.

  As described above, according to the present embodiment, the air particle amount measuring devices 81 to 85 measure the amount of air particles in a predetermined portion that directly or indirectly affects the path along which the substrate S moves. Therefore, the amount of airborne particles can be confirmed before the substrate is levitated or during the operation of the coating apparatus. By checking the amount of airborne particles before the substrate is levitated or during the operation of the coating apparatus, it is possible to determine the possibility of the particles adhering to the substrate based on the measured amount of airborne particles. Thereby, it becomes possible to prevent a yield fall.

  Further, according to the present embodiment, since the amount of airborne particles is measured before the substrate S is transported, it is possible to determine the possibility of particles adhering to the substrate S. Thereby, it can avoid that a particle adheres to the board | substrate S. FIG.

  Further, according to the present embodiment, since the amount of air particles is measured at a predetermined time interval for every elapse of a certain time, the air particle amount can be periodically confirmed. Thereby, it is possible to periodically determine the possibility that airborne particles adhere to the substrate S.

  Further, according to the present embodiment, when it is determined that the measured amount of airborne particles is large, the transport of the substrate S and the application of the resist are stopped, so that the particles adhere on the substrate S. Can be surely prevented.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
About the whole structure of the coating device 1, although it was set as the structure which arrange | positions the conveyance mechanism 23 in the -Y direction side of each stage in the said embodiment, it is not restricted to this. For example, the transport mechanism 23 may be arranged on the + Y direction side of each stage. As shown in FIG. 12, the transport mechanism 23 (transport machine 23a, vacuum pad 23b, rail 23c) is arranged on the −Y direction side of each stage, and the same as the transport mechanism 23 on the + Y direction side. The transport mechanism 53 (the transport machine 53a, the vacuum pad 53b, and the rail 53c) having the configuration described above may be arranged so that different substrates can be transported by the transport mechanism 23 and the transport mechanism 53. For example, as shown in the figure, the transport mechanism 23 transports the substrate S1, and the transport mechanism 53 transports the substrate S2. In this case, since the substrate can be alternately conveyed by the conveyance mechanism 23 and the conveyance mechanism 53, the throughput is improved. When transporting a substrate having an area about half that of the above-described substrates S, S1, and S2, for example, the transport mechanism 23 and the transport mechanism 53 hold the substrates one by one, and the transport mechanism 23 and the transport mechanism 53 are connected. By translating in the + X direction, two substrates can be transported simultaneously. With such a configuration, throughput can be improved.

The perspective view which shows the structure of the coating device which concerns on this embodiment. The front view which shows the structure of the coating device which concerns on this embodiment. The top view which shows the structure of the coating device which concerns on this embodiment. The side view which shows the structure of the coating device which concerns on this embodiment. The piping system figure which shows the structure of the air ejection mechanism and suction mechanism which concern on this embodiment. The figure which shows operation | movement of the coating device which concerns on this embodiment. Same operation diagram. Same operation diagram. Same operation diagram. Same operation diagram. Same operation diagram. The top view which shows the structure of the other coating device which concerns on this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Coating apparatus 2 ... Board | substrate conveyance part 3 ... Coating | coated part 4 ... Management part 27 ... Processing stage 81-85 ... Air | atmosphere particle quantity measuring device S ... Substrate R ... Resist film

Claims (11)

A coating apparatus comprising: a substrate transport unit that floats and transports a substrate; and an application unit that applies a liquid material to the substrate while being transported by the substrate transport unit,
A coating apparatus comprising: a measuring device that measures the amount of air particles in a predetermined portion that directly or indirectly affects a path along which the substrate moves. The coating apparatus according to claim 1, wherein the predetermined portion includes at least one of the substrate transport unit and the coating unit. A management unit for managing the state of the coating unit;
The coating apparatus according to claim 1, wherein the predetermined portion includes the management unit. The management unit is provided at a position overlapping the substrate transport unit in plan view,
The coating apparatus according to claim 3, wherein the predetermined portion includes a region between the substrate transfer unit and the management unit. The substrate transport unit has a gas ejection unit for controlling the flying height of the substrate,
The coating device according to any one of claims 1 to 4, wherein the predetermined portion includes a path through which a gas passes in the gas ejection portion. A suction unit for controlling the flying height of the substrate is provided in a region corresponding to the coating unit in the substrate transport unit,
The coating apparatus according to any one of claims 1 to 5, wherein the predetermined portion includes a path through which the gas passes in the suction portion. The substrate transport unit has a moving mechanism for holding and moving the floating substrate,
The coating apparatus according to any one of claims 1 to 6, wherein the predetermined portion includes the moving mechanism. An application method for applying a liquid material on the substrate while conveying the substrate,
A coating method, comprising: measuring the amount of air particles in the predetermined portion by a measuring device that measures the amount of air particles in the predetermined portion that directly or indirectly affects a path along which the substrate moves. The coating method according to claim 8, wherein the amount of airborne particles is measured before the liquid material is coated on the substrate. The coating method according to claim 8 or 9, wherein the amount of airborne particles is measured at a predetermined time interval. The transport of the substrate and the application of the liquid material are stopped when the measured amount of air particles is larger than a predetermined value. The coating method as described.

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