JP5303231B2 - Coating device - Google Patents

Description

  The present invention relates to a coating apparatus.

  On a glass substrate constituting a display panel such as a liquid crystal display, fine patterns such as wirings, electrodes, and color filters are formed. In general, such a pattern is formed by a technique such as photolithography. In the photolithography method, a coating process for coating a resist film on a glass substrate, an exposure process for pattern exposure of the resist film, and a development process for developing the resist film are performed.

Among these, in the coating process, a coating apparatus having a slit nozzle is used. As such a coating apparatus, for example, a configuration is known in which a resist is applied while a glass substrate is conveyed so as to pass under a slit nozzle. In the coating apparatus, after a resist is applied to the substrate, the substrate is unloaded via an external unloading robot or the like on the downstream side of the slit nozzle. In this configuration, the substrate is in a standby state on the downstream side of the slit nozzle until the substrate is carried out. In recent coating apparatuses, a configuration in which a plurality of slit nozzles are arranged in the substrate transport direction in order to shorten the processing time (tact) per substrate is known.
Japanese Patent Laid-Open No. 2005-236092

  However, in the coating apparatus that coats the resist while transporting the substrate as described above, when the resist coating operation is performed while the substrate is waiting on the downstream side in the substrate transport direction with respect to the slit nozzle, the slit nozzle is passed. The substrate and the substrate waiting at the standby position will overlap. In order to avoid the overlapping of the substrates, it is necessary to wait for the coating operation until the substrate waiting on the downstream side of the slit nozzle is retracted from the standby position (until the substrate is unloaded).

  Similarly, even when the coating process is performed using a plurality of slit nozzles, it is necessary to wait for the coating operation until the substrate is retracted from the standby position (until the substrate is unloaded). For this reason, even if it is the structure which arrange | positions a plurality of slit nozzles at a folding angle, there is a problem that the tact is not sufficiently shortened and it is difficult to improve the processing efficiency of the entire coating apparatus.

  In view of the circumstances as described above, an object of the present invention is to provide a coating apparatus capable of more reliably realizing tact shortening.

In order to achieve the above object, the coating apparatus includes a substrate transport unit that transports a substrate, and a plurality of coating units that apply the liquid material to the substrate while being transported by the substrate transport unit. A substrate carry-in area for carrying the substrate at one end in the substrate carrying direction, a substrate carry-out area for carrying out the substrate at the other end in the substrate carrying direction, and a plurality of the coating units The substrate transfer unit is disposed between the substrate carry-in region and the substrate carry-out region so that at least a distance between two adjacent coating units is larger than a dimension of the substrate in the substrate transfer direction. A floating mechanism for levitating the substrate, and a first end portion in a direction orthogonal to the substrate conveyance direction of the substrate that is levitated by the levitation mechanism is disposed so as to be movable, and is movable in the substrate conveyance direction first A feeder and a second transporter that is arranged to be able to hold a second end in a direction perpendicular to the substrate transport direction among the substrates that have been levitated by the levitation mechanism and is movable in the substrate transport direction. And when the plurality of substrates are carried into the substrate transport unit, the first transport device and the second transport device alternately transport the substrate, and the first transport device The first transport device and the second transport device are controlled so that the held substrate and the substrate held by the second transport device are transported to different coating units among the plurality of coating units. It further has a conveyance control part .

  According to the present invention, there is provided a coating apparatus having a plurality of coating units, wherein the substrate transport unit has a substrate carry-in region for carrying a substrate at one end in the substrate transport direction and at the other end in the substrate transport direction. A plurality of coating units between the substrate carry-in region and the substrate carry-out region so that a distance between at least two adjacent coating units is larger than a dimension of the substrate in the substrate carrying direction; Therefore, the substrate can be arranged at two locations between the substrate carry-out region and the two application portions. Therefore, even when the substrate after applying the liquid material is made to wait in the substrate carry-out area, there is a space for placing the substrate between the two application portions, so that the application process can be performed smoothly without waiting. Processing becomes possible. Thereby, even if it is a case where an application | coating process is performed using a some application part, shortening of a tact can be implement | achieved more reliably.

The coating apparatus is characterized in that the substrate transport unit has a floating mechanism for floating the substrate.
According to the present invention, it is possible to shorten the tact even in a configuration in which the substrate transport unit has a floating mechanism for floating the substrate, that is, a configuration in which the substrate is floated and transported.

In the coating apparatus, two adjacent coating units among the plurality of coating units have a distance in the substrate transport direction between the two coating units larger than twice the dimension of the substrate in the substrate transport direction. It arrange | positions so that it may become.
According to the present invention, two adjacent coating units among the plurality of coating units are arranged such that the distance in the substrate transport direction between the two coating units is larger than twice the dimension of the substrate in the substrate transport direction. Therefore, two or more substrates can be disposed between the two application portions. Thereby, a tact can be shortened more reliably.

The coating apparatus further includes a liquid supply unit capable of supplying the liquid independently to a plurality of the application units.
According to the present invention, since the liquid material supply unit capable of independently supplying the liquid material to the plurality of application units is further provided, each application unit can be efficiently maintained.

In the above-described coating apparatus, the distance between the coating unit provided on the most downstream side in the substrate transport direction among the plurality of coating units is larger than the dimension of the substrate in the substrate transport direction. It is arranged so that it may be arranged.
According to the present invention, the applicator provided on the most downstream side in the substrate transport direction among the plurality of applicators is arranged such that the distance to the substrate carry-out region is larger than the dimension of the substrate in the substrate transport direction. Therefore, the substrate can also be arranged between the application unit provided on the downstream side and the substrate carry-out region. Thereby, a tact can be shortened more effectively.

In the coating apparatus, the plurality of coating units are provided to be movable in the substrate transport direction.
According to the present invention, since the plurality of application units are provided to be movable in the substrate transport direction, the intervals between the plurality of application units can be adjusted as necessary.

The coating apparatus further includes a management unit that manages states of the plurality of coating units.
According to the present invention, since the management unit that manages the states of the plurality of application units is further provided, the states of the plurality of application units can be efficiently managed.

In the coating apparatus, the management unit is individually provided corresponding to each of the plurality of coating units.
According to the present invention, since the management unit is individually provided corresponding to each of the plurality of application units, it is possible to cause the plurality of application units to perform processing by the management unit individually.

In the coating apparatus, the management unit is arranged on the upstream side in the substrate transport direction with respect to the coating unit.
According to the present invention, since the management unit is arranged on the upstream side in the substrate transport direction with respect to the coating unit, the space on the substrate transport unit can be efficiently used.

The coating apparatus determines whether or not the coating process in the plurality of coating units and the transport process of the substrate in the substrate transport unit are possible based on the position of the substrate. It is characterized by comprising a control device for performing the above-described processing.
According to the present invention, it is determined based on the position of the substrate whether or not the coating process in the plurality of coating units and the substrate transport process in the substrate transport unit are possible, and the process determined to be possible is performed. Therefore, the substrate can be processed more safely and efficiently. Thereby, the tact time can be further shortened.

  According to the present invention, the tact can be shortened.

A first embodiment of the present invention will be described based on the drawings.
FIG. 1 is a perspective view of a coating apparatus 1 according to this embodiment. As shown in the figure, a coating apparatus 1 according to the present embodiment is a coating apparatus that coats a resist on a glass substrate used for a liquid crystal panel, for example, and includes a substrate transport unit 2 and coating units 3 (3A, 3B). ), The management unit 4 (4A, 4B), and the control device 5 are main components. In the present embodiment, two application units 3 and two management units 4 are provided.

  In the coating apparatus 1, the substrate is transported in a floating state in the substrate transport unit 2 under the control of the control device 5, a resist is coated on the substrate in the coating unit 3, and the state of the coating unit 3 is managed in the management unit 4. It has become so. The coating apparatus 1 is preferably used in a clean environment such as a clean room.

  2 is a front view of the coating apparatus 1, FIG. 3 is a plan view of the coating apparatus 1, and FIG. The detailed configuration of the coating apparatus 1 will be described with reference to these drawings. Hereinafter, in describing the configuration of the coating apparatus 1, for simplicity of description, directions in the drawing will be described using an XYZ coordinate system. The substrate transport direction is the longitudinal direction of the substrate transport unit 2 and the substrate transport direction is referred to as the X direction. A direction orthogonal to the X direction (substrate transport direction) in plan view is referred to as a Y direction. A direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as a Z direction. In each of the X direction, the Y direction, and the Z direction, the arrow direction in the figure is the + direction, and the direction opposite to the arrow direction is the-direction.

(Substrate transport section)
First, the structure of the board | substrate conveyance part 2 is demonstrated.
The substrate transport unit 2 includes a frame 21, a stage 22, and a transport mechanism 23. In the substrate transport unit 2, the substrate S is transported on the stage 22 in the + X direction by the transport mechanism 23.

  For example, the frame 21 is a support member that is placed on the floor surface and supports the stage 22 and the transport mechanism 23. The frame 21 is divided into three parts, and the three parts are arranged in the Y direction. The frame center portion 21 a is a portion arranged at the center in the Y direction among the three divided portions, and supports the stage 22. The frame side portion 21 b is disposed on the −Y direction side of the frame center portion 21 a and supports the transport mechanism 23. A gap is provided between the frame side portion 21b and the frame center portion 21a. The frame side portion 21 c is disposed on the + Y direction side of the frame central portion 21 a and supports the transport mechanism 23. A gap is provided between the frame side portion 21c and the frame center portion 21a. The frame center portion 21a, the frame side portion 21b, and the frame side portion 21c are elongated in the X direction, and the dimensions of the respective portions in the X direction are substantially the same.

  The stage 22 includes a carry-in stage 25, a processing stage 27, a central stage 29, and a carry-out stage 28. In the present embodiment, two processing stages 27 are provided, and a central stage 29 is arranged between the two processing stages 27. The arrangement of each stage will be described more specifically. From the upstream side to the downstream side in the substrate transfer direction (+ X direction), the loading stage 25, the processing stage 27, the central stage 29, the processing stage 27, and the unloading stage 28 Arranged in order.

  The carry-in stage 25 is made of, for example, stainless steel and is a substantially square plate-like member in plan view. By making the shape of the carry-in stage 25 substantially square in plan view, even when a substrate having a longitudinal direction and a short direction is transported, the substrate can be transported in any direction. ing. In the present embodiment, the area on the carry-in stage 25 is the substrate carry-in area 25S. The substrate carry-in area 25S is an area for carrying the substrate S that has been carried from the outside of the apparatus.

  The carry-in stage 25 is provided with a plurality of air ejection holes 25a and a plurality of elevating pin retracting holes 25b. The air ejection hole 25a and the lifting pin retracting hole 25b are provided so as to penetrate the carry-in stage 25, respectively.

  The air ejection holes 25a are holes for ejecting air onto the stage surface 25c of the carry-in stage 25, and are arranged in a matrix in a plan view. An air supply source (not shown) is connected to the air ejection hole 25a. In the carry-in stage 25, the substrate S can be lifted in the + Z direction by the air ejected from the air ejection holes 25a.

  The elevating pin retracting hole 25 b is provided at the substrate loading position of the loading side stage 25. The elevating pin retracting hole 25b is disposed at a position avoiding the air ejection hole 25a, and is configured such that the air supplied to the stage surface 25c does not leak out.

  One alignment device 25d is provided at each end of the carry-in stage 25 in the Y direction. The alignment device 25d is a device that aligns the position of the substrate S carried into the carry-in stage 25. Each alignment device 25d has a long hole and an alignment member provided in the long hole, and aligns the position of the substrate by mechanically holding the substrate loaded into the loading side stage 25 from both sides. It is like that. The alignment device 25d is not limited to the above-described configuration, and may be a configuration in which two or more are arranged at both ends in the Y direction of the carry-in stage 25, or may be arranged at both ends in the X direction of the carry-in stage 25. You may be the structure to arrange.

  A lift mechanism 26 is provided on the −Z direction side of the carry-in stage 25, that is, on the back side of the carry-in stage 25. The lift mechanism 26 is provided so as to overlap the substrate loading position of the loading side stage 25 in plan view. The lift mechanism 26 includes an elevating member 26a and a plurality of elevating pins 26b. The elevating member 26a is connected to a driving mechanism (not shown), and the elevating member 26a is moved in the Z direction by driving the driving mechanism. The plurality of elevating pins 26b are erected from the upper surface of the elevating member 26a toward the carry-in stage 25. Each raising / lowering pin 26b is arrange | positioned in the position which overlaps with said raising / lowering pin retracting hole 25b, respectively by planar view. As the elevating member 26a moves in the Z direction, each elevating pin 26b appears and disappears on the stage surface 25c from the elevating pin appearing hole 25b. Ends in the + Z direction of the lift pins 26b are provided so that their positions in the Z direction are aligned, so that the substrate S transported from the outside of the apparatus can be held in a horizontal state. . A substrate sensor (not shown) is provided on the carry-in stage 25. The substrate sensor can detect whether or not the substrate S is on the carry-in stage 25.

  The processing stage 27 is a rectangular plate-like member whose main surface 27c is mainly composed of hard anodized, for example, and is provided on the + X direction side with respect to the carry-in stage 25. The processing stage 27 has a longitudinal Y direction. The dimension of the processing stage 27 in the Y direction is substantially the same as the dimension of the loading stage 25 in the Y direction. In the present embodiment, the region on the processing stage 27 is a coating processing region 27S where resist coating is performed.

  The processing stage 27 is provided with a plurality of air ejection holes 27a for ejecting air onto the stage surface 27c and a plurality of air suction holes 27b for sucking air on the stage surface 27c. The air ejection holes 27 a and the air suction holes 27 b are provided so as to penetrate the processing stage 27.

  In the processing stage 27, the flying height of the substrate can be adjusted with higher precision than in other stages, and the flying height of the substrate can be controlled to be, for example, 100 μm or less, preferably 50 μm or less. ing. A substrate sensor (not shown) is provided on the processing stage 27. Whether or not the substrate S is on the processing stage 27 can be detected by the substrate sensor.

  The carry-out stage 28 is provided on the + X direction side with respect to the processing stage 27 on the downstream side in the substrate carrying direction, and is configured with substantially the same material and dimensions as the carry-in stage 25 provided in the substrate carry-in region 25S. ing. Therefore, the shape of the carry-out stage 28 is also substantially square in plan view. In the present embodiment, the area on the carry-out stage 28 is the substrate carry-out area 28S. The substrate carry-out area 28S is a substrate carry-out area 28S where the resist-coated substrate S is carried out of the apparatus.

  Similarly to the carry-in stage 25, the carry-out stage 28 is provided with an air ejection hole 28a and a lift pin retracting hole 28b. A lift mechanism 26 is provided on the −Z direction side of the carry-out stage 28, that is, on the back side of the carry-out stage 28. The lift mechanism 26 is provided so as to overlap the substrate carry-out position of the carry-out stage 28 in plan view. The lift mechanism 26 has the same configuration as the lift mechanism 26 provided on the carry-in stage 25. The lift mechanism 26 can lift the substrate S by lift pins 26b for delivery of the substrate S when the substrate S on the unloading stage 28 is unloaded to an external device. A substrate sensor (not shown) is provided on the carry-out stage 28. Whether or not the substrate S is on the carry-out stage 28 can be detected by the substrate sensor.

  The central stage 29 is made of, for example, stainless steel, as in the carry-in stage and the carry-out stage, and is a substantially square plate-like member in plan view. The central stage 29 is provided with a plurality of air ejection holes 29a. The air ejection holes 29a are holes for ejecting air onto the stage surface 29c of the central stage 29, and are arranged in a matrix in a plan view. An air supply source (not shown) is connected to the air ejection hole 29a. In the central stage 29, the substrate S can be floated in the + Z direction by the air ejected from the air ejection holes 29a. A substrate sensor (not shown) is provided on the central stage 29. Whether or not the substrate S is on the central stage 29 can be detected by the substrate sensor.

  The transport mechanism 23 has a mechanism for holding the substrate S and transporting the substrate S in the + X direction, and a pair is provided on the frame side portion 21b and the frame side portion 21c. The pair of transport mechanisms 23 has a line-symmetric configuration with respect to the center of the stage 22 in the Y direction, and has the same configuration except that the line-symmetrical point. Therefore, hereinafter, the conveyance mechanism 23 provided in the frame side portion 21b will be described as an example.

  The transport mechanism 23 includes a transport machine 23a, a substrate holding unit 23b, and a rail 23c. The conveyor 23a has a configuration in which, for example, a linear motor is provided therein, and the conveyor 23a can move on the rail 23c when the linear motor is driven.

  The substrate holding unit 23b is a holding unit that holds the side edge of the substrate S on the −Y direction side. The said side edge part of the board | substrate S is a part protruded with respect to the stage 22, and is one side part along a board | substrate conveyance direction. For example, four substrate holding portions 23b are provided along the Y direction on the surface on the + X direction side of the transport machine 23a, and are attached to the transport machine 23a. Each substrate holding portion 23b is provided with a suction pad, and the substrate S is sucked and held by the suction pad.

  The rail 23c is provided on the frame side portion 21b, and extends across the stages on the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28. By moving the rail 23c, the transporter 23a can move along the respective stages.

  In addition, each conveyance mechanism 23 provided in the frame side part 21b and the frame side part 21c can convey the board | substrate S independently. For example, as shown in FIG. 3, different substrates S can be held by the transport mechanism 23 provided on the frame side portion 21b and the transport mechanism 23 provided on the frame side portion 21c. In this case, since the substrates can be alternately conveyed by the respective conveyance mechanisms 23, the throughput is improved. Further, when a substrate having an area about half the size of the substrate S is transported, for example, the two transport mechanisms 23 hold one by one, and the two transport mechanisms 23 are translated in the + X direction to obtain 2 It is also possible to carry a single substrate simultaneously.

(Applying part)
The configuration of the application unit 3 will be described.
Each application unit 3 is disposed at a position overlapping the processing stage 27 in plan view. The coating unit 3A corresponds to the processing stage 27 on the upstream side in the substrate transport direction. The coating unit 3B corresponds to the processing stage 27 on the downstream side in the substrate transport direction. The coating unit 3A and the coating unit 3B are respectively disposed between the substrate carry-in area 25S and the substrate carry-out area 28S. As shown in FIG. 3, the distance L1 between the coating part 3A and the coating part 3B is larger than the dimension L2 of the substrate S in the substrate transport direction. The application part 3A and the application part 3B are parts for applying a resist on the substrate S, and each have a portal frame 31 and a nozzle 32. The application part 3A and the application part 3B have the same configuration.

  The portal frame 31 includes a support member 31a and a bridging member 31b, and is provided so as to straddle the processing stage 27 in the Y direction. One column member 31a is provided so as to sandwich the processing stage 27 in the Y direction, and each column member 31a is supported by the frame side portion 21b and the frame side portion 21c, respectively. Each strut member 31a is provided so that the height positions of the upper end portions are aligned. The bridging member 31b is bridged between the upper end portions of the respective column members 31a, and can be moved up and down with respect to the column members 31a.

  The portal frame 31 is connected to a moving mechanism 34. The moving mechanism 34 includes a rail member 35 and a drive mechanism 36. For example, one rail member 35 is provided in the groove 21d of the frame side portion 21b and the frame side portion 21c, and each rail member 35 extends in the X direction. Each rail member 35 is provided so as to extend to the −X direction side from the management unit 4. The drive mechanism 36 is connected to the portal frame 31 and moves the application unit 3 along the rail member 35.

  The nozzle 32 is formed in a long and long shape in one direction, and is provided on the surface on the −Z direction side of the bridging member 31 b of the portal frame 31. A slit-like opening 32a is provided along the longitudinal direction of the nozzle 32 at the tip in the -Z direction, and a resist is discharged from the opening 32a. The nozzle 32 is disposed so that the longitudinal direction of the opening 32 a is parallel to the Y direction and the opening 32 a faces the processing stage 27. The dimension in the longitudinal direction of the opening 32a is smaller than the dimension in the Y direction of the substrate S, so that the resist is not applied to the peripheral region of the substrate S. A flow passage (not shown) through which the resist flows through the opening 32a is provided inside the nozzle 32, and a resist supply source 39 (39A, 39B) is connected to the flow passage. The resist supply source 39 (39A, 39B) has a pump (not shown), for example, and the resist is ejected from the opening 32a by pushing the resist to the opening 32a with the pump. The resist supply sources 39 (39A, 39B) are provided separately for the nozzles 32 provided in the coating unit 3A and the coating unit 3B, respectively, and the resist is independently supplied to the coating unit 3A and the coating unit 3B. It has become so.

  The support member 31a is provided with a moving mechanism (not shown), and the nozzle 32 held by the bridging member 31b is movable in the Z direction by the moving mechanism. The nozzle 32 is provided with a moving mechanism (not shown), and the moving mechanism allows the nozzle 32 to move in the Z direction with respect to the bridging member 31b. On the lower surface of the bridging member 31b of the portal frame 31, a sensor that measures the distance in the Z direction between the opening 32a of the nozzle 32, that is, the tip 32c of the nozzle 32 and the facing surface facing the nozzle tip 32c. 33 is attached. For example, three sensors 33 are provided along the Y direction.

(Management Department)
The configuration of the management unit 4 will be described.
The management unit 4 is a part that manages the nozzles 32 so that the discharge amount of the resist (liquid material) discharged onto the substrate S is constant. The management unit 4A is provided on the upstream side (−X direction side) in the substrate transport direction with respect to the coating unit 3A, and manages the nozzles 32 provided in the coating unit 3A. The management unit 4B is provided on the upstream side in the substrate transport direction with respect to the coating unit 3B, and manages the nozzles 32 provided in the coating unit 3B. The management unit 4A and the management unit 4B have the same configuration. Each of the management unit 4A and the management unit 4B includes a preliminary discharge mechanism 41, a dip tank 42, a nozzle cleaning device 43, a storage unit 44 that stores these, and a holding member 45 that holds the storage unit. Yes.

  The preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order in the −X direction side. The preliminary ejection mechanism 41 is a part that ejects the resist preliminary. The preliminary ejection mechanism 41 is provided at a position closest to the nozzle 32 in a state where the coating unit 3 is disposed on the coating processing region 27S. The dip tank 42 is a liquid tank in which a solvent such as thinner is stored. The nozzle cleaning device 43 is a device for rinsing and cleaning the vicinity of the opening 32a of the nozzle 32, and includes a cleaning mechanism (not shown) that moves in the Y direction and a moving mechanism (not shown) that moves the cleaning mechanism. This moving mechanism is provided on the −X direction side of the cleaning mechanism. The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the dip tank 42 because the moving mechanism is provided. In addition, about arrangement | positioning of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle washing | cleaning apparatus 43, it is not restricted to arrangement | positioning of this embodiment, Other arrangement | positioning may be sufficient.

  The dimension of the accommodating portion 44 in the Y direction is smaller than the distance between the support members 31a of the portal frame 31 so that the portal frame 31 can move in the X direction beyond the accommodating portion 44. . Further, the portal frame 31 can access the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 provided in the accommodating portion 44 so as to straddle these portions.

  The holding member 45 is connected to the management unit moving mechanism 46. The management unit moving mechanism 46 includes a rail member 47 and a drive mechanism 48. The rail members 47 are respectively provided in the grooves 21e of the frame side part 21b and the frame side part 21c, and each extend in the X direction. Each rail member 47 is disposed between the rail members 35 connected to the portal frame 31 of the application unit 3. The end portions in the −X direction of the rail members 47 are provided, for example, to the end portions in the −X direction of the frame side portion 21b and the frame side portion 21c. The drive mechanism 48 is connected to the holding member 45 and moves the management unit 4 along the rail member 47.

  Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated using FIGS. 5 to 10 are plan views showing the coating operation of the coating apparatus 1. 5 to 10, the coordinate system shown in FIG. 5 is used in common in FIGS. FIG. 11 is a diagram illustrating a nozzle management operation of the coating apparatus 1. In FIG. 5 to FIG. 11, the configuration of the coating apparatus 1 is schematically described, for example, by omitting the illustration of the transport mechanism 23 in order to facilitate the discrimination of the drawings. In the following description, the portion where the operation is performed will be mainly described, but each operation is actually performed based on the control of the control device 5.

(Coating operation)
In this embodiment, the substrate S is carried into the substrate carry-in area so that the short side direction is parallel to the carrying direction, the resist is applied in the coating treatment area while the substrate S is lifted and carried, and the resist is applied. The board | substrate S which carried out is carried out from a board | substrate carrying-out area | region.

  In the present embodiment, the application operation is alternately performed in the two application units 3A and 3B. In the following example, a coating operation is performed using the nozzle 32 provided in the coating unit 3A for the first substrate, and a coating operation is performed using the nozzle 32 provided in the coating unit 3B for the next substrate. To do. Further, for the third substrate, the coating operation is performed again using the nozzle 32 provided in the coating unit 3A. Note that the order in which the application portions 3A and 3B are used may be the reverse order of the example of the present embodiment.

  First, the operation until the substrate is carried into the coating apparatus 1 will be described. Before the substrate is carried into the substrate carry-in area, the coating apparatus 1 is put on standby. Specifically, the transfer device 23a is arranged in the substrate carry-in area of the carry-in stage 25, and the height position of the suction pad is matched with the flying height position of the substrate. In this case, the −Y side transfer machine 23a in FIG. In addition, air is ejected or sucked from the air ejection holes 25 a of the carry-in stage 25, the air ejection holes 27 a and 27 b of the processing stage 27, and the air ejection holes 28 a of the carry-out stage 28, respectively. Air is supplied to such an extent that the air floats.

  After the coating apparatus 1 is on standby as described above, for example, when the substrate S1 is transported from the outside to the substrate loading position by a transport arm (not shown), the elevating member 26a provided on the loading stage 25 is moved in the + Z direction. Thus, the elevating pin 26b is projected from the elevating pin retracting hole 25b to the stage surface 25c. By the operation of the elevating member 26a, the substrate S1 is lifted by the elevating pins 26b, and the substrate S1 is received. Further, an alignment member is projected from the long hole of the alignment device 25d to the stage surface 25c.

  After receiving the board | substrate S1, the raising / lowering member 26a is lowered | hung and the raising / lowering pin 26b is accommodated in the raising / lowering pin retracting hole 25b. At this time, since an air layer is formed on the stage surface 25c, the substrate S1 is held in a state of being floated with respect to the stage surface 25c by the air. When the substrate S1 reaches the surface of the air layer, the alignment of the substrate S1 is performed by the alignment member of the alignment device 25d. After alignment, the suction pad of each substrate holding part 23b arranged on the −Y direction side of the substrate carry-in position is attracted to the back surface of the substrate S to hold the substrate, and the loading of the substrate is completed.

  After carrying in board | substrate S1, the conveyance machine 23a is moved along the rail 23c. The substrate S1 starts moving in the + X direction with the movement of the transfer device 23a. When the front end of the substrate S1 in the transport direction reaches the position of the opening 32a of the nozzle 32 provided in the coating unit 3A, the resist R is discharged from the opening 32a of the nozzle 32 toward the substrate S1. The resist is discharged while the position of the nozzle 32 is fixed and the substrate S1 is transported by the transporter 23a. As the substrate S1 moves, a resist film R is applied on the substrate S1, as shown in FIG. As the substrate S1 passes under the opening 32a for discharging the resist, a resist film R is formed in a predetermined region of the substrate S1.

  As shown in FIG. 6, the substrate S1 on which the resist film R is formed is transported to the central stage 29 side. While the substrate S1 is moving on the central stage 29, the substrate S2 to be processed next is carried in. In the carry-in operation of the substrate S2, for example, the substrate S2 is held by the + Y side transfer machine 23a in FIG. After the substrate S2 is carried in, the + Y-side transport device 23a transports the substrate in the + X direction while holding the substrate S2. The substrate S2 is coated with a resist R by a nozzle 32 provided in the coating unit 3B.

  The transport operation of the substrate S1 is performed in parallel with the carry-in operation and the transport operation of the substrate S2. As shown in FIG. 7, the substrate S <b> 1 passes from below the central stage 29 to below the coating unit 3 </ b> B and is transported to the carry-out stage 28, and a carry-out operation is performed. Further, the substrate S2 passes below the coating unit 3A and is conveyed to the central stage 29. At this time, the application operation is not performed in the application unit 3A and the application unit 3B.

  Here, the substrate carry-out operation will be described. In the carry-out stage 28, the substrate S is carried to the substrate carry-out position in a state where it floats with respect to the stage surface 28c. When the substrate reaches the substrate carry-out position, the elevating member 26a of the lift mechanism 26 is moved in the + Z direction. By the movement of the elevating member 26a, the elevating pin 26b protrudes from the elevating pin retracting hole 28b to the back surface of the substrate S, and the substrate S is lifted by the elevating pin 26b. In this state, for example, an unillustrated external transfer arm provided on the + X direction side of the carry-out stage 28 accesses the carry-out stage 28 and receives the substrate S.

  After unloading the substrate S1 by such unloading operation, the transporter 23a is returned again to the substrate loading position of the loading-side stage 25, and waits until the third substrate S3 is transported. After unloading the substrate S1, the elevating member 26b is lowered and the elevating pins 26b are accommodated in the elevating pin retracting holes 28b, and then the substrate S2 is moved to the + X side as shown in FIG. The resist R is applied on the substrate S2 by the nozzle 32 thus formed.

  In performing the coating operation of the substrate S2, the control device 5 checks whether or not the unloading operation of the substrate S1 is completed. Confirmation of the completion of the unloading operation is performed by detecting whether or not the substrate S1 is present on the unloading side stage 28 by the above-described substrate sensor (not shown), for example. When it is detected that the substrate S1 is on the unloading stage 28, the control device 5 determines that the unloading process of the substrate S1 is not completed and the coating process by the coating unit 3B and the transport process of the substrate S2 are not possible. Then, the substrate S2 is put on standby on the central stage 29. Further, when it is detected that there is no substrate S1 and the lifting pins 26b are accommodated in the lifting pins retracting holes 28b, it is determined that the unloading operation has already been completed and the coating operation and the transporting operation are possible. The conveyance of the substrate S2 is started. By causing the control device 5 to make such a determination, it is possible to avoid a situation in which the substrate is transported overlapping the substrate unloading position.

  In parallel with this coating operation, the third substrate S3 is carried in. In carrying in the substrate S3, the -Y side transport machine 23a shown in FIG. 3 which has been returned to the substrate carry-in position is used. The substrate S3 is coated with a resist R by a nozzle 32 provided in the coating unit 3A.

  As shown in FIG. 9, the substrate S2 for which the coating operation by the coating unit 3B has been completed is transported to the substrate unloading position of the unloading stage 28, and the transport operation is performed. Moreover, as shown in FIG. 9, the carried-in substrate S3 is transported in the + X direction, and a coating operation is performed by the coating unit 3A. In performing the coating operation, the control device 5 performs the same confirmation as in the coating operation of the substrate S2. Specifically, it is confirmed whether or not the substrate S2 is present on the central stage 29. If it is confirmed that there is no substrate S2, the coating process at the coating unit 3A and the transport process of the substrate S3 are possible. And the substrate S3 is transported to the coating unit 3A side. When it is confirmed that there is the substrate S2, it is determined that the coating process and the transport process are not possible, and the substrate S3 is made to wait on the upstream side of the coating unit 3A.

  The substrate S3 for which the coating operation has been completed is transported to the central stage 29 by the transport machine 23a as shown in FIG. Here, the control device 5 confirms whether or not the unloading process of the substrate S2 has been completed, and upon completion of the unloading operation of the substrate S2, the substrate S3 is transported to the unloading stage 28, and the unloading operation of the substrate S3 is performed. Let it be done. Further, when the substrate S3 is transported to the unloading stage 28, a fourth substrate loading operation is performed. In this way, the coating operation is sequentially performed on a plurality of substrates while alternately using the coating units 3A and 3B.

(Nozzle management operation)
In the application units 3A and 3B, preliminary discharge for maintaining the discharge state of the nozzle 32 is performed. The nozzle management operation of the nozzles 32 provided in the coating unit 3A is performed in the management unit 4A. The nozzle management operation of the nozzles 32 provided in the application unit 3B is performed in the management unit 4B. When the nozzle management operation is performed, as shown in FIG. 11, the portal frame 31 of the application unit 3 (3 </ b> A, 3 </ b> B) is −X to the position of the corresponding management unit 4 (4 </ b> A, 4 </ b> B) by the rail member 35. Move in the direction.

  After the portal frame 31 is moved to the position of the management unit 4, the position of the portal frame 31 is adjusted so that the tip of the nozzle 32 is accessed to the nozzle cleaning device 43, and the nozzle tip 32 c is cleaned by the nozzle cleaning device 43. To do.

  After cleaning the nozzle tip 32 c, the nozzle 32 is accessed to the preliminary discharge mechanism 41. The preliminary discharge mechanism 41 moves the opening 32 a at the tip of the nozzle 32 to a predetermined position in the Z direction while measuring the distance between the opening 32 a and the preliminary discharge surface, and moves the nozzle 32 in the −X direction or + X. The resist is preliminarily discharged from the opening 32a while moving in the direction.

  After performing the preliminary discharge operation, the portal frame 31 is returned to the original position. When the next substrate S is transported by the transport mechanism 23 provided on the frame side portion 21c, the nozzle 32 is moved to a predetermined position in the Z direction. In this way, a high-quality resist film R is formed on the substrate S by repeatedly performing the coating operation for applying the resist film R on the substrate S and the preliminary ejection operation.

  If necessary, for example, each time the management unit 4 is accessed a predetermined number of times, the nozzle 32 may be accessed in the dip tank 42. In the dip tank 42, drying of the nozzle 32 is prevented by exposing the opening 32 a of the nozzle 32 to a vapor atmosphere of a solvent (thinner) stored in the dip tank 42.

  In this embodiment, since it is an offensive comprising a plurality of coating units 3A and 3B and a plurality of management units 4A and 4B, for example, while the coating unit 3A is performing a coating operation, the coating unit 3B has a nozzle management operation. Can be made to do. On the contrary, it is possible to cause the application unit 3A to perform the nozzle management operation while the application unit 3B performs the application operation.

  As described above, according to the present embodiment, in the coating apparatus 1 having the two coating units 3 (3A, 3B), the substrate transport unit 2 loads the substrate S to one end in the substrate transport direction. It has a substrate carry-in region 25S which has a substrate carry-in region 25S and carries out the substrate S at the other end in the substrate carrying direction, and the distance L1 between the two coating portions 3A and 3B is the dimension of the substrate S in the substrate carrying direction. Since the two application parts 3A and 3B are arranged between the substrate carry-in area 25S and the substrate carry-out area 28S so as to be larger than L2, the substrate carry-out area 28S and the two application parts 3A and Substrate S can be arranged at two locations between 3B. Therefore, even when the substrate S after applying the resist is made to stand by in the substrate carry-out region 28S, the space for placing the substrate S is vacant between the two application portions 3A and 3B, so that the application process is performed. Smooth processing is possible without waiting. Thereby, even if it is a case where application processing is performed using a plurality of application parts 3A and 3B, tact shortening can be realized more reliably.

  Further, according to the present embodiment, since the resist supply source 39 (39A, 39B) capable of supplying the resist independently to the plurality of coating units 3A and 3B is further provided, the coating units 3A and 3B are provided. The resist can be supplied independently to each nozzle 32 provided in the nozzle. Thereby, the some application | coating part 3A and 3B can be maintained efficiently.

  Further, according to the present embodiment, since the plurality of application units 3A and 3B are provided to be movable in the substrate transport direction, the interval between the plurality of application units 3A and 3B is adjusted as necessary. can do. For this reason, since the space | interval of the application parts 3A and 3B can be adjusted according to the magnitude | size of the board | substrate S processed with the coating device 1, it becomes possible to perform a wide process.

  Moreover, according to this embodiment, since the management part 4 (4A, 4B) was provided separately corresponding to each of the some application part 3 (3A, 3B), the some application part 3 is provided. (3A, 3B) can be individually processed by the management unit 4 (4A, 4B). For example, while one of the plurality of application units is performing the nozzle management operation, a process of causing the other to perform the application operation can be performed.

  According to the present invention, it is possible to determine whether or not the coating process in the plurality of coating units 3 (3A, 3B) and the substrate transport process in the substrate transport unit 2 are possible based on the position of the substrate. Since the control device 5 that performs the processing determined to be present is provided, the substrate S can be processed more safely and efficiently. Thereby, the tact time can be further shortened.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, as shown in FIG. 12, the two coating units 3A and 3B are arranged such that the distance L1 between the two coating units 3A and 3B is larger than twice the dimension L2 of the substrate S in the substrate transport direction. You may be the structure which is. In this configuration, since two substrates can be arranged between the two application portions 3A and 3B, the tact time can be shortened more reliably. In addition, the range of processing in the coating apparatus 1 is increased. There may be a configuration in which a substrate sensor (not shown) corresponding to a position where two substrates are arranged between the coating units 3A and 3B is provided.

  For example, as shown in FIG. 13, the coating is performed such that the distance L3 between the coating unit 3B provided on the downstream side in the substrate transport direction and the substrate carry-out region 28S is larger than the dimension L2 of the substrate S in the substrate transport direction. A configuration in which the portion 3B is arranged may be used. In this configuration, the substrate S can be disposed between the coating unit 3B provided on the downstream side and the substrate carry-out region 28S. Thereby, a tact can be shortened more effectively. Also in this case, a configuration may be employed in which a substrate sensor (not shown) corresponding to a position where two substrates are arranged is provided.

  Further, for example, as shown in FIG. 14, the coating is performed such that the distance L4 between the coating unit 3A provided on the upstream side in the substrate transport direction and the substrate carry-in region 25S is larger than the dimension L2 of the substrate S in the substrate transport direction. A configuration in which the portion 3A is arranged may be used. In this configuration, the substrate S can also be disposed between the coating unit 3A provided on the upstream side and the substrate carry-in region 25S. Thereby, a tact can be shortened more effectively. Also in this case, a configuration may be employed in which a substrate sensor (not shown) corresponding to a position where two substrates are arranged is provided.

  Moreover, in the said embodiment, although it was set as the structure by which the some management part 4 (4A, 4B) was each arrange | positioned in the upstream of the some application | coating part 3 (3A, 3B), it is not restricted to this, Of course, the configuration may be such that the management unit 4 (4A, 4B) is disposed on the downstream side of the application unit 3 (3A, 3B).

  Moreover, although the management part 4 (4A, 4B) was set as the structure provided separately corresponding to each of the application part 3 (3A, 3B), it is not restricted to this, The application part 3 (3A, 3B) may have a configuration in which one management unit is provided in common. In this case, a configuration in which the management unit is disposed between the application unit 3A and the application unit 3B is preferable.

  In the above-described embodiment, the resist supply sources 39A and 39B are configured so that the resist can be independently supplied to the plurality of coating units 3 (3A, 3B). However, the present invention is not limited to this. The resist may be simultaneously supplied to the plurality of application portions 3 (3A, 3B).

  Moreover, in the said embodiment, although it was set as the structure by which the application part 1 has arrange | positioned the two application parts 3 (application part 3A and application part 3B), it is not restricted to this, For example, three or more are mounted. The present invention can be applied even with a different configuration.

  Moreover, in the said embodiment, although it was set as the structure which is a floating conveyance type which floats and conveys a board | substrate, the coating apparatus 1 is not restricted to this, For example, it is a coating apparatus which has other conveyance forms, such as roller conveyance. Even if it exists, application of this invention is possible.

  In the above-described embodiment, the carry-in stage 25, the carry-out stage 28, and the center stage 29 are described as being formed in a substantially square shape in plan view. However, the present invention is not limited to this, and other shapes are used. But of course.

  Moreover, in the said embodiment, although it was set as the structure which is a coating device which apply | coats a resist on a glass substrate, it is not restricted to this, For example, a to-be-coated substrate may be a metal piece and a coating liquid is SOG (silica type | system | group). Even if it is a liquid), the present invention can be applied.

  In the above embodiment, the nozzle 32 is provided with the slit-shaped opening 32a. However, the present invention is not limited to this. For example, the nozzle 32 may be a roll type nozzle, an ink jet type nozzle, or a spray type nozzle. However, the present invention can be applied.

The perspective view which shows the structure of the coating device which concerns on embodiment of this invention. The front view which shows the structure of the coating device which concerns on this embodiment. The top view which shows the structure of the coating device which concerns on this embodiment. The side view which shows the structure of the coating device which concerns on this embodiment. The schematic diagram which shows operation | movement of the coating device which concerns on this embodiment. FIG. FIG. FIG. FIG. FIG. FIG. The schematic diagram which shows the other structure of the coating device which concerns on this invention. The schematic diagram which shows the other structure of the coating device which concerns on this invention. The schematic diagram which shows the other structure of the coating device which concerns on this invention.

Explanation of symbols

  S, S1 to S3 ... Substrate R ... Resist 1 ... Coating device 2 ... Substrate transport unit 3 (3A, 3B) ... Coating unit 4 (4A, 4B) ... Management unit 5 ... Control device 25S ... Substrate loading area 28S ... Substrate unloading Area 32 ... Nozzle 39 (39A, 39B) ... Resist supply source

Claims (9)

A coating apparatus comprising a substrate transport unit that transports a substrate, and a plurality of coating units that apply a liquid material to the substrate while being transported by the substrate transport unit,
The substrate transport unit has a substrate carry-in region for carrying the substrate at one end in the substrate transport direction, and has a substrate carry-out region for carrying out the substrate at the other end in the substrate transport direction,
A plurality of the coating portion is disposed between at least two adjacent said substrate the substrate to be larger than the conveying direction dimension carrying region and the substrate carry-out region of the distance the substrate between the coating unit ,
The substrate transport unit is
A levitating mechanism for levitating the substrate;
A first transporter that is arranged so as to be able to hold a first end portion in a direction orthogonal to the substrate transport direction among the substrates that have been levitated by the levitation mechanism, and is movable in the substrate transport direction;
A second transporter that is disposed so as to be able to hold a second end portion in a direction orthogonal to the substrate transport direction among the substrates that have been levitated by the levitation mechanism, and is movable in the substrate transport direction;
Have
When the plurality of substrates are carried into the substrate transport unit, the first transport device and the second transport device are alternately transported by the first transport device and held by the first transport device. A conveyance control unit that controls the first conveyance device and the second conveyance device so that the substrate and the substrate held by the second conveyance device are conveyed to different application units among the plurality of application units. An applicator further comprising: Two adjacent coating units among the plurality of coating units are arranged such that the distance in the substrate transport direction between the two coating units is greater than twice the dimension of the substrate in the substrate transport direction. The coating apparatus according to claim 1 , wherein: Coating apparatus according to claim 1 or claim 2 independently for a plurality of the coating section and further comprising a liquid material supply unit capable of supplying the liquid material. Among the plurality of coating units, the coating unit provided on the most downstream side in the substrate transport direction is arranged such that the distance from the substrate carry-out region is larger than the dimension of the substrate in the substrate transport direction. The coating apparatus according to any one of claims 1 to 3 , wherein the coating apparatus is characterized by that. The coating device according to any one of claims 1 to 4 , wherein the plurality of coating units are provided to be movable in the substrate transport direction. Coating device as claimed in any one of claims 1 to 5, characterized by further comprising a management unit for managing a plurality of states of the coating portion. The coating apparatus according to claim 6 , wherein the management unit is individually provided corresponding to each of the plurality of coating units. The coating apparatus according to claim 7 , wherein the management unit is disposed upstream of the coating unit in the substrate transport direction. Control for determining whether or not coating processing in the plurality of coating units and transporting of the substrate in the substrate transport unit are possible based on the position of the substrate, and performing the processing determined to be possible An apparatus is provided. The coating device as described in any one of Claims 1-8 characterized by the above-mentioned.

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