JP2008226976A - Device and method for treating substrate or the like - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method for treating a substrate or the like, which has a sufficient effect as the whole system containing a holding jig. <P>SOLUTION: The device for treating a substrate or the like has: a pair of substrate housing vessels 30 and 30A aligning and housing at least one of a semiconductor wafer 1, the holding jig 10 for the semiconductor wafer and the holding jig 10 detachably sucking the semiconductor wafer 1 and a sucking plate 40 sucking the semiconductor wafer 1, the holding jig 10 for the semiconductor wafer, and the holding jig 10 sucking the semiconductor wafer 1. The device further has: an articulated type carrier robot 50 treating the semiconductor wafer 1, the holding jig 10 or the holding jig 10 detachably sucking the semiconductor wafer 1 between a pair of the substrate housing vessels 30 and 30A and the sucking plate 40; a hand 60 being fitted to an arm 53 for the carrier robot 50 and detachably holding the holding jig 10; and an alignment device 70 for the holding jig 10 detachably sucking the holding jig 10 for the semiconductor wafer or the semiconductor wafer 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate handling apparatus and a substrate handling method used in a semiconductor wafer back grinding process and a dicing process.

  Although not shown, the semiconductor wafer is sliced into a disk having a thickness of, for example, 775 μm, and after the back surface is thinned back to a thickness of 100 μm or less by a back grinding apparatus, it is subjected to a dicing process. Since it is thin and easy to break and often warps in a bow shape, there is a problem that it is easily broken during operations such as handling (see Patent Documents 1 and 2).

Therefore, in order to solve such problems, the applicant is provided with a base having a diameter larger than that of the semiconductor wafer, a large number of protrusions disposed in the recessed holes on the surface of the base, and a peripheral portion of the base surface. The adhesive layer for a deformable semiconductor wafer covering a large number of protrusions, a through-hole penetrating the base and the adhesive layer, and communicating with the space between the large number of protrusions and the adhesive layer by being drilled in the base A holding jig provided with a communicating path is proposed, and the semiconductor wafer is held in close contact with the holding jig.
JP 2005-223359 A Japanese Patent Application Laid-Open No. 2000-1000092

  However, even if an excellent holding jig is proposed, only the holding jig is proposed, and there are specifications such as a substrate storage container around the holding jig, a suction device for semiconductor wafers, and a transfer robot for handling semiconductor wafers. If it is insufficient, the whole system cannot always be optimized for preventing or protecting the semiconductor wafer, and the whole system may not function sufficiently.

  The present invention has been made in view of the above, and an object of the present invention is to provide a handling device for a substrate and the like and a handling method for the substrate and the like that can be expected to have a sufficient effect as a whole system including a holding jig.

In the present invention, in order to solve the above problems, at least one of a substrate, a holding jig for the substrate, and a holding jig that detachably adsorbs the substrate (attached by suction force or adhesive force such as negative pressure) is provided. A substrate storage container to be stored, a substrate, a holding jig for the substrate, and an adsorption means for adsorbing at least one of the holding jig that detachably adsorbs the substrate, and at least between the substrate storage container and the adsorption means And a holding robot or a transfer robot that handles the holding jig that detachably adsorbs the substrate, and a hand that is provided on the transfer robot and holds the holding jig in a detachable manner.
The holding jig includes at least a base having substantially the same width as the substrate, a plurality of protrusions provided on the base, an adhesive layer for the deformable substrate provided on the base and covering the plurality of protrusions, A through passage that penetrates the base and the adhesion layer, and a communication path that is provided on the base and communicates with a space between the plurality of protrusions and the adhesion layer (in which a gas flows),
The hand is rotatably provided on the transfer robot and can hold the base of the holding jig in a detachable manner, and the hand is provided in the hand main body and communicates with the through path of the holding jig and adheres to the substrate. A first exhaust path that guides the gas between the plurality of protrusions and the adhesion layer, the second exhaust path that is provided in the hand body and communicates with the communication path of the holding jig. And an exhaust passage.

It is possible to provide a holding jig for the substrate or an alignment means for the holding jig that detachably sucks the substrate.
In addition, the substrate storage container is configured such that a container main body for storing at least one of a substrate, a holding jig for the substrate, and a holding jig that detachably adsorbs the substrate, and an open front of the container main body are detachable. It is good to include the cover body to cover.

In addition, the substrate storage container is configured such that the container main body that stores at least one of the substrate, the holding jig for the substrate, and the holding jig that detachably adsorbs the substrate, and the open upper surface of the container main body are removable. It is good to include the cover body to cover.
Further, the suction means includes a breathable porous body that detachably adsorbs the substrate, the substrate holding jig, and the holding jig that detachably adsorbs the substrate by being negatively pressured. Can be included.

In addition, a first holding groove for a holding jig communicating with the first exhaust path can be formed in the hand main body of the hand.
A second holding groove for a holding jig that communicates with the second exhaust path can also be formed in the hand body of the hand.

  Furthermore, in the present invention, in order to solve the above problems, the substrate, the holding jig for the substrate, or the substrate is detachably attached using the substrate handling apparatus according to any one of claims 1 to 7. It is characterized by handling the holding jig.

  Here, the substrate in the claims includes a substrate, a holding jig for the substrate, and a holding jig that detachably sucks the substrate. The substrate includes at least various types of semiconductor wafers (diameters 200 mm, 300 mm, 450 mm, etc.), liquid crystal glass, quartz glass, printed wiring boards, etc., and does not particularly ask whether the protective tape is adhered. In addition, the substrate storage container, the suction unit, and the transfer robot may be arranged in a line, or may be configured such that the substrate storage container and the suction unit are arranged around the transfer robot.

  The substrate storage container is not particularly required to be single, plural, transparent, opaque, or translucent. Further, the suction means may be an independent suction tool that uses negative pressure, or may be a suction mechanism provided in combination with various devices, and does not ask for a plurality. The transfer robot includes a fixed type, a self-propelled type, a ceiling type, an articulated type, and the like, but is not particularly limited, and may be a type that handles a substrate or the like between a substrate storage container, a suction unit, and an alignment unit. The hand may be plate-shaped or block-shaped. The hand body of the hand is rotatably provided on the transport robot, and this rotation includes rotation, inversion, and swinging.

  The first and second holding grooves can be formed substantially endlessly in a ring shape or a frame shape in plan view. Furthermore, the handling device such as a substrate can be used alone, but is not particularly limited. For example, it can be used in combination with a semiconductor wafer processing apparatus represented by a back grinding apparatus and a frame mounter apparatus.

According to the present invention, in addition to the holding jig, systematization is performed by defining the specifications of the substrate storage container around the holding jig, the suction means for the substrate, and the transfer robot that handles the substrate. A sufficient effect can be expected for the entire system including the jig. Further, since the substrate is attracted to the holding jig, even if the substrate is thin and easily broken, the substrate is rarely easily damaged during the operation.
Also, if the holding jig for the substrate or the alignment means for the holding jig that detachably adsorbs the substrate is provided, the holding jig for the substrate taken out from the substrate storage container or the holding jig that adsorbs the substrate can be used. Since it can be mounted and centered, it is possible to prevent the substrate and its holding jig from being displaced in the subsequent work.

  Further, if the adsorption means includes a breathable porous body that detachably adsorbs the substrate and the like by being negatively pressured, the substrate is held on the porous body in a substantially flat surface, with a simple configuration. Precise processing, precise inspection, measurement, etc. become possible. For example, when the substrate is a thin semiconductor wafer, the thin semiconductor wafer is held flat on the surface of the porous body without being damaged, and the semiconductor wafer can be precisely processed with a simple configuration.

Further, if the first holding groove for the holding jig communicating with the first exhaust path is formed in the hand main body of the hand, it is possible to carry the substrate while adsorbing the substrate.
Furthermore, if a second holding groove for a holding jig communicating with the second exhaust path is formed in the hand main body of the hand, it becomes possible to transport the adhesive layer while deforming it.

  Hereinafter, a preferred embodiment of a substrate handling apparatus according to the present invention will be described with reference to the drawings. A substrate handling apparatus according to the present embodiment includes a semiconductor wafer 1, as shown in FIGS. A pair of substrate storage containers 30 and 30A that store at least one of the holding jig 10 for the semiconductor wafer 1 and the holding jig 10 that sucks the semiconductor wafer 1, the semiconductor wafer 1, and the holding jig for the semiconductor wafer 1 A holding plate 40 that sucks at least one of the jig 10 and the holding jig 10 that sucks the semiconductor wafer 1, and at least the semiconductor wafer 1 between the pair of substrate storage containers 30 and 30 </ b> A and the suction plate 40. A tool 10, a transport robot 50 that handles the holding jig 10 that sucks the semiconductor wafer 1, and is mounted and held by the transport robot 50 A hand 60 for holding the tool 10, and a alignment device 70 for holding jig 10 which has adsorbed the holding jig 10 or the semiconductor wafer 1 of semiconductor wafer 1.

  As shown in FIGS. 1, 3 to 11, and 16, the semiconductor wafer 1 is sliced into a thin disc having a diameter of 300 mm having a thickness of, for example, 775 μm, and the back surface has a thickness of 100 μm or less by a back grinder (not shown). After being further back ground, it is subjected to a dicing process. A BG tape 2 having a slightly larger diameter than the semiconductor wafer 1 is selectively adhered to the surface of the semiconductor wafer 1 on which the pattern is formed for protection.

  As shown in FIGS. 1 and 3 to 11, the holding jig 10 includes a base 11 having a diameter larger than that of the semiconductor wafer 1 having a diameter of 300 mm, and a large number of protrusions 13 disposed on the surface of the base 11. An adhesive layer 14 for the elastically deformable semiconductor wafer 1 that is provided on the surface of the base 11 and covers a large number of protrusions 13; a through passage 16 that passes through the base 11 and the adhesive layer 14; 11 and a communication passage 17 communicating with the space 15 between the plurality of protrusions 13 and the adhesion layer 14.

  The base 11 is formed into a rigid planar circular plate using materials such as polycarbonate, acrylic resin, vinyl chloride resin, glass, ceramic, aluminum alloy, magnesium alloy, and stainless steel, and excludes the peripheral portion of the surface. Mostly, a planar circular recess hole 12 slightly smaller than the semiconductor wafer 1 is formed to be shallow and recessed. A large number of protrusions 13 supporting the adhesion layer 14 are regularly arranged at predetermined intervals in the recessed holes 12 on the surface of the base 11, and each protrusion 13 has a height substantially equal to the depth of the recessed holes 12. -It is formed in a cylindrical shape of length. The many protrusions 13 are integrally formed on the bottom surface of the recessed hole 12 by, for example, a molding method, a sand blast method, an etching method, or the like.

  The adhesion layer 14 is formed into a flexible thin film having a diameter larger than that of the semiconductor wafer 1 using a flexible, elastic, and adhesive material, and includes a surface peripheral portion of the base 11 and a flat upper surface of each protrusion 13. In addition, the recess 15 and the numerous protrusions 13 of the base 11 are covered and a space 15 for air circulation is formed between these 12 and 13 so as to be detachable from the semiconductor wafer 1. Hold tightly. The adhesion layer 14 is formed into a flat circular shape using, for example, a silicone-based, urethane-based, olefin-based, or fluorine-based elastomer having excellent heat resistance, weather resistance, and stability over time, and the center portion is recessed in a substantially funnel cross section. To be adhered to the bottom surface of the recessed hole 12.

  The through passage 16 penetrates the recessed hole 12 of the base 11 and the center of the adhesion layer 14 in the thickness direction, and exhausts the air (see the arrow in the figure) between the adhesion layer 14 and the semiconductor wafer 1 to the outside. Thus, the semiconductor wafer 1 functions to ensure close contact with the close contact layer 14 (see FIGS. 4 and 7). Further, the communication path 17 penetrates the peripheral edge of the recessed hole 12 of the base 11 in the thickness direction, and air in the space 15 between the recessed hole 12, the numerous protrusions 13, and the adhesion layer 14 (see the arrow in the figure). ) To the outside, the adhesive layer 14 functions so as to be deformed into irregularities in accordance with the numerous protrusions 13 (see FIGS. 3, 6, 10 and the like).

  The pair of substrate storage containers 30 and 30A, the suction plate 40, the transfer robot 50, and the alignment apparatus 70 are disposed on a flat base frame 20 having a substantially flat fan shape, as shown in FIGS. A plurality of casters 21 with adjusters are mounted on the lower surface of the base frame 20 at intervals.

  The base robot 20 has a transfer robot 50 fixed on its corners, and a pair of substrate storage containers 30 and 30A pedestal 22 and suction plate 40 pedestal 23 are spaced apart in the vicinity of the bent periphery. A transparent table 24 is horizontally mounted on the plurality of pedestals 22 and 23. A plurality of positioning pins and detection sensors (not shown) for the substrate storage containers 30 and 30A are provided on the upper surface of the base 22 for each substrate storage container 30 and 30A. A plurality of positioning pins (not shown) for the suction plate 40 are erected.

  In the pair of substrate storage containers 30 and 30A, as shown in FIG. 1 and the like, for example, one substrate storage container 30 aligns and stores the required number of holding jigs 10 for the semiconductor wafer 1, and the other substrate storage container 30A is a semiconductor. The necessary number of holding jigs 10 on which the wafer 1 is detachably attached are aligned and stored. As shown in FIG. 15, each of the substrate storage containers 30 and 30 </ b> A is a container for aligning and storing at least one of the semiconductor wafer 1, the holding jig 10 for the semiconductor wafer 1, and the holding jig 10 that sucks the semiconductor wafer 1. A main body 31 and a lid 34 that opens and closes an open front surface of the container main body 31 via an endless gasket 33 are configured.

  The container main body 31 is formed into a front open box type using a molding material including, for example, polycarbonate, and the semiconductor wafer 1, the holding jig 10 for the semiconductor wafer 1, and the semiconductor wafer 1 are held on the inner surfaces of both side walls. A pair of left and right teeth 32 for storing the jig 10 substantially horizontally are arranged in the vertical direction.

  The container main body 31 has a semiconductor wafer 1, a holding jig 10 for the semiconductor wafer 1, and a plurality of rear retainers that hold the rear end of the peripheral edge of the holding jig 10 that sucks the semiconductor wafer 1 in the vertical direction. Arranged side by side, a plurality of couplings fitted to the positioning pins of the base 22 are arranged on the bottom surface, and a flange gripped by a transport mechanism (not shown) is detachably attached to the center of the ceiling Is done.

  The lid 34 is formed in a horizontally long and substantially rectangular shape corresponding to the open front of the container body 31, and the semiconductor wafer 1, the holding jig 10 for the semiconductor wafer 1, and the semiconductor wafer 1 are adsorbed on both sides of the back surface. A front retainer 35 that supports the front end of the peripheral edge of the holding jig 10 is provided. Clamp plates 36 that are detachably locked to both side walls of the container body 31 are pivotally supported on both sides of the lid 34 so as to be swingable in the front-rear direction of the substrate storage containers 30 and 30A.

  As shown in FIGS. 1, 12 to 14, 16, and 17, the suction plate 40 includes, for example, a cylindrical housing 41 with a bottom. A porous body 42 made of ceramic is fitted, and the semiconductor wafer 1, the holding jig 10 for the semiconductor wafer 1, and the semiconductor wafer 1 are attached to the surface of the porous body 42 having high flatness. The sucked holding jig 10 is detachably vacuum-sucked by the difference between the negative pressure and the atmospheric pressure.

  The housing 41 is provided with a plurality of positioning tools for positioning pins of the pedestal 23 on its lower surface, and is connected to a vacuum pump 43 for generating negative pressure via an electromagnetic valve. Further, the porous body 42 is formed in a disk having a diameter larger than that of the semiconductor wafer 1, and a large number of grains forming pores are formed finely. Such an adsorption plate 40 is driven / sucked by the vacuum pump 43, and the semiconductor wafer 1, the holding jig 10 for the semiconductor wafer 1, and the holding jig 10 that adsorbs the semiconductor wafer 1 to the surface of the porous body 42. Is vacuum-adsorbed.

  As shown in FIGS. 1, 12 to 14, and 18, the transfer robot 50 includes a substantially cylindrical first shaft 51 erected on a substantially right-angled corner of the base frame 20, and the first shaft The multi-joint type includes a second shaft 52 that is rotatably supported by 51 and can be moved up and down, and an arm 53 that is rotatably supported on the upper portion of the second shaft 52. The transfer robot 50 is connected to, for example, a plurality of sequencers 54, a controller 55, and a vacuum pump, and operates in the XYZ directions under the control of the controller 55.

  As shown in FIGS. 1, 12 to 14, and 19, the hand 60 is attached to the arm 53 of the transfer robot 50 so as to be rotatable in the vertical direction, and can detachably hold the back surface of the base of the holding jig 10. A first hand body 61 and a first hole which is perforated in the hand body 61 and communicates with the through passage 16 of the holding jig 10 to guide the air (see the arrow in the figure) between the semiconductor wafer 1 and the adhesion layer 14 to the outside. The air passage 63 and the hand main body 61 are perforated, communicated with the communication passage 17 of the holding jig 10, and air (see arrows in the figure) between the numerous protrusions 13 of the recessed holes 12 and the adhesion layer 14 is externally provided. And a second exhaust passage 64 that leads to

  The hand body 61 includes a long plate 62 that is attached to the tip of the arm 53 of the transport robot 50 via a fastener, and the tip of the flat plate 62 corresponds to the back surface of the base 11 of the holding jig 10. It is formed in a disc shape or a polygonal shape, and a pressure sensor or the like for detecting the holding jig 10 is attached to the tip portion. The hand body 61 is formed of a molding material including, for example, polycarbonate, and first and second exhaust passages 63 and 64 are formed at intervals in the front and rear longitudinal directions. Two exhaust passages 63 and 64 are connected to a plurality of external vacuum pumps 65 via electromagnetic valves in the transfer robot 50, respectively.

  A first holding groove 66 for the holding jig 10 communicating with the first exhaust path 63 is formed in the surface of the distal end portion of the hand main body 61 by cutting out in a substantially ring shape and a second exhaust path 64. A second holding groove 67 for the holding jig 10 communicating with is cut out in a substantially plane shape. The first and second holding grooves 66 and 67 are formed concentrically, the second holding groove 67 is formed to have a diameter larger than that of the first holding groove 66, and a vacuum pump 65 for generating negative pressure. It functions to ensure the suction and conveyance of the hand main body 61 with respect to the back surface of the base 11 by driving and sucking.

  As shown in FIGS. 1, 12 to 14, and 16, the alignment device 70 includes, for example, a plurality of opposing centering fixing pins 71 and a plurality of approaching or separating from each other based on driving of an air cylinder (not shown). A centering movable pin 72 is provided, and is arranged between the pedestal 23 for the suction plate 40 or the suction plate 40 of the table 24 and the transport robot 50. Such an alignment apparatus 70 is mounted with the holding jig 10 for the semiconductor wafer 1 taken out from the substrate storage container 30 or 30A, which is likely to be loose, and the holding jig 10 that sucks the semiconductor wafer 1 for centering. It works so as not to cause problems such as misalignment.

  In the above, between the suction plate 40 that sucks the semiconductor wafer 1, the substrate storage container 30 that stores the holding jig 10 for the semiconductor wafer 1, and the substrate storage container 30A that stores the holding jig 10 that sucks the semiconductor wafer 1. When the semiconductor wafer 1 and the holding jig 10 are stored, first, the hand 60 of the transfer robot 50 enters the substrate storage container 30 that stores the holding jig 10 for the semiconductor wafer 1 horizontally and the holding jig 10 is moved. Is adsorbed from below (see FIG. 20).

  In this suction, when the hand main body 61 of the hand 60 comes into contact with the back surface of the holding jig 10 from below, the air in the second holding groove 67 closed on the back surface of the holding jig 10 by driving / suctioning the vacuum pump 65. (Refer to the arrows in the figure) is exhausted to the outside, and the hand main body 61 is adsorbed to the holding jig 10 with the adhesive layer 14 deformed by the exhaust of air.

  When the hand 60 sucks the holding jig 10 from below, the hand 60 of the transfer robot 50 is horizontally retracted from the substrate storage container 30 and reversed, and the transfer robot 50 is moved from the substrate storage container 30 to the alignment device 70. After transporting and centering, the transport robot 50 transports the holding jig 10 from the alignment device 70 to the semiconductor wafer 1 on the suction plate 40 and opposes it from above (see FIGS. 20 and 21).

  When the holding jig 10 faces the semiconductor wafer 1 from above, the hand 60 of the transfer robot 50 adheres and adsorbs the uneven contact layer 14 of the holding jig 10 to the semiconductor wafer 1 (see FIG. 22), and the adsorption plate 40. After the suction of the semiconductor wafer 1 is released, the transfer robot 50 transfers the holding jig 10 integrated with the semiconductor wafer 1 from the suction plate 40 to the substrate storage container 30A, and reverses and stores it (FIG. 23). reference).

  When the uneven adhesion layer 14 of the holding jig 10 adheres to the semiconductor wafer 1, the air between the semiconductor wafer 1 and the adhesion layer 14 is exhausted to the outside by driving / suctioning the vacuum pump 65 (FIGS. 3 and 4). (Refer to FIG. 5) Then, when the vacuum pump 65 is stopped, the uneven adhesion layer 14 is flattened and properly adhered to the semiconductor wafer 1 (see FIG. 5). Further, when the holding jig 10 is stored, if the vacuum pump 65 is stopped and the exhaust of the air using the through passage 16 is stopped, the air is exhausted from the first holding groove 66 closed on the back surface of the holding jig 10. Therefore, the hand main body 61 can be separated from the back surface of the holding jig 10 integrated with the semiconductor wafer 1.

  When the uneven adhesion layer 14 of the holding jig 10 is in close contact with the semiconductor wafer 1, the air between the semiconductor wafer 1 and the adhesion layer 14 is exhausted to the outside by driving / suctioning the vacuum pump 65 (see FIG. 6, refer to FIG. 7), the semiconductor wafer 1 is conveyed in this state, and then the vacuum pump 65 is stopped to flatten the uneven adhesion layer 14 so that the semiconductor wafer 1 and the adhesion layer 14 are properly adhered. Yes (see FIG. 8).

  Next, when the holding jig 10 that sucks the semiconductor wafer 1 is transferred from the substrate storage container 30A to the suction plate 40, and the semiconductor wafer 1 is sucked to the suction plate 40, the semiconductor wafer 1 is first sucked. The hand 60 of the transfer robot 50 enters the substrate storage container 30A for storing the holding jig 10 horizontally and sucks the back surface of the holding jig 10 from below (see FIG. 23). The hand 60 retreats horizontally and reverses, and the transfer robot 50 transfers and centers the holding jig 10 integrated with the semiconductor wafer 1 from the substrate storage container 30A to the alignment apparatus 70, and the transfer robot 50 aligns the alignment apparatus 70. Then, the holding jig 10 integrated with the semiconductor wafer 1 is transferred onto the suction plate 40 (see FIG. 24).

  When the holding jig 10 integrated with the semiconductor wafer 1 is transferred onto the suction plate 40, the holding jig 10 is disposed on the suction plate 40 (see FIG. 25), and the suction plate 40 sucks the semiconductor wafer 1. At the same time, the hand 60 of the transfer robot 50 releases the close contact between the semiconductor wafer 1 and the adhesive layer 14 of the holding jig 10 (see FIG. 26), and the transfer robot 50 stores the holding jig 10 for the semiconductor wafer 1. The holding jig 10 is transferred to the storage container 30 to be reversed and stored (see FIG. 27).

  At this time, when the semiconductor wafer 1 is adsorbed to the adsorption plate 40 (see FIG. 9), the adhesion layer 14 is deformed into irregularities by driving / suctioning the vacuum pump 65 to form a gap with the semiconductor wafer 1. (See FIG. 10), the semiconductor wafer 1 is separated from the adhesion layer 14 deformed into the irregularities (see FIG. 11).

  According to the above configuration, not only the proposal of the holding jig 10, but also the specifications of the substrate storage containers 30 and 30 </ b> A around the holding jig 10, the suction plate 40 for the semiconductor wafer 1, the transfer robot 50 that handles the semiconductor wafer 1, and the like. Therefore, the entire system can be optimized, and the protection of the semiconductor wafer 1 can be sufficiently functioned as the entire system. Further, since the semiconductor wafer 1 is attracted to the holding jig 10, even if the semiconductor wafer 1 is very thin and easily broken, it does not warp in a bow and can be easily damaged during handling. Absent.

  In addition, since the semiconductor wafer 1 and the adhesion layer 14 can be brought into close contact with each other by releasing the deformation of the adhesion layer 14, or the semiconductor wafer 1 can be sucked and conveyed by suction using the through passage 16. 1 and the adhesion layer 14 need not be physically adhered using a roller or the like. Further, since the first holding groove 66 communicates with the first exhaust path 63, the semiconductor wafer 1 can be conveyed while being sucked.

  Further, since the second holding groove 67 communicates with the second exhaust path 64, the holding jig 10 can be transported while the adhesion layer 14 is deformed. Furthermore, by forming the first and second holding grooves 66 and 67 in communication, it is possible to reduce the number of dedicated vacuum pumps and solenoid valves for holding the holding jig 10 in the hand body 61 of the hand 60. Become.

  Next, FIG. 28 to FIG. 36 show a second embodiment of the present invention. In this case, of the pair of substrate storage containers 30 and 30B, the other substrate storage container 30B is configured as a coin stack type. The coin stack type substrate storage container 30B stores the required number of holding jigs 10 on which the semiconductor wafer 1 is attracted.

  As shown in FIGS. 28 and 32, the coin stack type substrate storage container 30 </ b> B stacks and stores the semiconductor wafer 1, the holding jig 10 for the semiconductor wafer 1, and the holding jig 10 that sucks the semiconductor wafer 1. The container body 31A has a cylindrical shape with a bottom, and a lid body 34A having a substantially U-shaped cross-section that removably opens and closes the opened upper surface of the container body 31A.

  In the above, between the suction plate 40 that sucks the semiconductor wafer 1, the substrate storage container 30 that stores the holding jig 10 for the semiconductor wafer 1, and the substrate storage container 30B that stores the holding jig 10 that sucks the semiconductor wafer 1. When the semiconductor wafer 1 and the holding jig 10 are stored, first, the hand 60 of the transfer robot 50 enters the substrate storage container 30 that stores the holding jig 10 for the semiconductor wafer 1 horizontally and the holding jig 10 is moved. Is adsorbed from below (see FIG. 29).

  When the hand 60 sucks the holding jig 10, the hand 60 of the transfer robot 50 moves backward from the substrate storage container 30 and reverses, and the transfer robot 50 transfers the holding jig 10 from the substrate storage container 30 to the alignment device 70. After the centering, the transfer robot 50 transfers the holding jig 10 from the alignment device 70 to the semiconductor wafer 1 on the suction plate 40 and opposes it from above (see FIG. 30).

  When the holding jig 10 is opposed to the semiconductor wafer 1 from above, the hand 60 of the transfer robot 50 causes the uneven adhesion layer 14 of the holding jig 10 to adhere to the semiconductor wafer 1 and sucks it (see FIG. 31). After the suction of the semiconductor wafer 1 is released, the transport robot 50 transports and holds the holding jig 10 integrated with the semiconductor wafer 1 from the suction plate 40 to the substrate storage container 30B (see FIG. 32).

  Next, when the holding jig 10 that sucks the semiconductor wafer 1 is transferred from the substrate storage container 30B to the suction plate 40, and the semiconductor wafer 1 is sucked to the suction plate 40, the semiconductor wafer 1 is first sucked. The hand 60 of the transfer robot 50 enters the substrate storage container 30B that stores the holding jig 10 from above and sucks the back surface of the holding jig 10 from above (see FIG. 32). The hand 60 is reversed and retracted, and the transfer robot 50 transfers and centers the holding jig 10 integrated with the semiconductor wafer 1 from the substrate storage container 30B to the alignment device 70, and the transfer robot 50 transfers the suction plate from the alignment device 70. The holding jig 10 integrated with the semiconductor wafer 1 is transported onto 40 (see FIG. 33).

  When the holding jig 10 integrated with the semiconductor wafer 1 is transferred onto the suction plate 40, the holding jig 10 is disposed on the suction plate 40 (see FIG. 34), and the suction plate 40 sucks the semiconductor wafer 1. At the same time, the hand 60 of the transfer robot 50 releases the close contact between the semiconductor wafer 1 and the adhesive layer 14 of the holding jig 10 (see FIG. 35), and the transfer robot 50 stores the holding jig 10 for the semiconductor wafer 1. The holding jig 10 is transported to the storage container 30 and reversed and stored (see FIG. 36). The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  In this embodiment, the same effect as the above embodiment can be expected, and it is obvious that the different types of substrate storage containers 30B can be easily used.

  In addition, the handling apparatus, such as a substrate, according to the present invention is not limited to the above embodiment. For example, the BG tape 2 may not be adhered to the semiconductor wafer 1 and may be omitted. Further, the substrate storage containers 30, 30 </ b> A, 30 </ b> B, the suction plate 40, the transfer robot 50, and the alignment device 70 for the holding jig 10 may have the same height or different heights. Further, in the above embodiment, the planar circular holding jig 10, the base 11, and the adhesion layer 14 are shown, but these may be a planar ellipse, a polygon, or the like.

  Further, the base 11 and the adhesion layer 14 may be formed to have the same width as the semiconductor wafer 1. Further, the protrusion 13 can be formed in a prismatic shape, a truncated cone shape, a truncated pyramid shape, or the like having substantially the same height and length as the depth of the recessed hole 12. Further, the adhesion layer 14 may be formed using a single elastomer, or may be laminated by combining a plurality of elastomers. Further, the base 22 for the substrate storage containers 30, 30 </ b> A, and 30 </ b> B may have a fixed configuration or a configuration that moves between other apparatuses.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall perspective explanatory view schematically showing an embodiment of a substrate handling apparatus and a substrate handling method according to the present invention. It is a section explanatory view showing typically a holding jig in an embodiment of a handling device such as a substrate and a handling method of a substrate concerning the present invention. It is a section explanatory view showing typically the state where the adhesion layer which changed into the unevenness of a holding jig is stuck to the semiconductor wafer in the embodiment of the handling device such as the substrate concerning the present invention, and the handling method of the substrate. FIG. 4 is a cross-sectional explanatory view schematically showing a state of suction using a through path of the holding jig of FIG. 3. FIG. 5 is an explanatory cross-sectional view schematically showing a state where the deformation of the adhesion layer in FIG. 4 is released. It is a section explanatory view showing typically the state where the adhesion layer which changed into the unevenness of a holding jig is stuck to the semiconductor wafer in the embodiment of the handling device such as the substrate concerning the present invention, and the handling method of the substrate. FIG. 7 is an explanatory cross-sectional view schematically showing a state in which suction is performed using the through path of the holding jig of FIG. 6. FIG. 8 is an explanatory cross-sectional view schematically illustrating a state where the deformation of the adhesion layer in FIG. 7 is released. It is sectional explanatory drawing which shows typically the conveyance state of the holding jig which adsorb | sucked the semiconductor wafer in embodiment of handling apparatuses, such as a board | substrate concerning this invention, and a handling method, such as a board | substrate. FIG. 10 is an explanatory cross-sectional view schematically showing a state where the adhesion layer of FIG. FIG. 11 is a cross-sectional explanatory view schematically showing a state where a semiconductor wafer is peeled from the holding jig of FIG. 10. It is plane explanatory drawing which shows typically embodiment of handling apparatuses, such as a board | substrate concerning this invention, and a handling method, such as a board | substrate. It is explanatory drawing which shows typically embodiment of handling apparatuses, such as a board | substrate concerning this invention, and a handling method, such as a board | substrate. It is explanatory drawing which shows typically embodiment of handling apparatuses, such as a board | substrate concerning this invention, and a handling method, such as a board | substrate. It is an exploded perspective explanatory view showing typically the substrate storage container in the embodiment of the handling device such as the substrate and the handling method of the substrate according to the present invention. It is explanatory drawing which shows typically the adsorption | suction plate in embodiment of handling apparatuses, such as a board | substrate concerning this invention, and a handling method, such as a board | substrate. It is explanatory drawing which shows concretely the relationship between the suction plate and the vacuum pump etc. in the embodiment of the handling device for substrates and the handling method for substrates according to the present invention. It is explanatory drawing which shows typically the conveyance robot in embodiment of the handling apparatus, such as a board | substrate concerning this invention, and the handling method, such as a board | substrate. It is plane explanatory drawing which shows typically the hand in embodiment of handling apparatuses, such as a board | substrate concerning this invention, and a handling method, such as a board | substrate. It is explanatory drawing which shows typically the state which takes out the holding jig for semiconductor wafers from embodiment of the handling apparatus, such as a substrate concerning the present invention, and the handling method, such as a substrate, from a substrate storage container. It is explanatory drawing which shows typically the state which conveys a holding jig and opposes the semiconductor wafer on the adsorption | suction plate in embodiment of handling apparatuses, such as a board | substrate concerning this invention, and the handling method of a board | substrate. FIG. 22 is a partial cross-sectional explanatory view schematically showing a state in which a holding jig is adsorbed to the semiconductor wafer of FIG. 21. FIG. 5 is a partial cross-sectional explanatory view schematically showing a state in which a holding jig in an embodiment of a substrate handling apparatus and a substrate handling method according to the present invention is taken out from a substrate storage container or conveyed. It is a partial section explanatory view showing typically the state where a holding jig is conveyed on the suction plate in an embodiment of a handling device such as a substrate and a handling method of a substrate concerning the present invention. FIG. 25 is a partial cross-sectional explanatory view schematically showing a state in which a holding jig is arranged on the suction plate of FIG. 24. FIG. 26 is a partial cross-sectional explanatory view schematically showing a state in which the suction plate of FIG. 25 sucks the semiconductor wafer and the hand of the transfer robot releases the close contact between the semiconductor wafer and the close contact layer of the holding jig. FIG. 27 is a partial cross-sectional explanatory view schematically showing a state where the semiconductor wafer of FIG. 26 and the adhesion layer of the holding jig are separated. It is a perspective explanatory view showing typically a 2nd embodiment of a handling device, such as a substrate concerning the present invention, and a handling method, such as a substrate. It is explanatory drawing which shows typically the state which the hand of a conveyance robot approachs into the board | substrate storage container in 2nd Embodiment of the handling apparatus and board | substrate handling method concerning this invention, and adsorb | sucks a holding jig. . It is explanatory drawing which shows typically the state which conveys a holding jig and opposes the semiconductor wafer on the suction plate in 2nd Embodiment of handling apparatuses, such as a board | substrate concerning this invention, and the handling method of a board | substrate. FIG. 31 is a partial cross-sectional explanatory view schematically showing a state in which a holding jig is attracted to the semiconductor wafer of FIG. 30. It is a fragmentary sectional view showing typically the state where a holding jig in a 2nd embodiment of a handling device and a handling method of a substrate concerning the present invention is taken out from a substrate storage container, or is conveyed. It is a fragmentary sectional view showing typically the state where a holding jig is conveyed on the suction plate in the second embodiment of the handling device for substrates and the handling method for substrates according to the present invention. FIG. 34 is a partial cross-sectional explanatory view schematically showing a state in which a holding jig is arranged on the suction plate of FIG. 33. FIG. 35 is a partial cross-sectional explanatory view schematically showing a state in which the suction plate of FIG. 34 sucks the semiconductor wafer and the transfer robot hand releases the close contact between the semiconductor wafer and the close contact layer of the holding jig. FIG. 27 is a partial cross-sectional explanatory view schematically showing a state where the semiconductor wafer of FIG. 26 and the adhesion layer of the holding jig are separated.

Explanation of symbols

1 Semiconductor wafer (substrate)
DESCRIPTION OF SYMBOLS 10 Holding jig 11 Base 13 Protrusion 14 Adhesion layer 15 Space 16 Through path 17 Communication path 30 Substrate storage container 30A Substrate storage container 30B Substrate storage container 31 Container main body 31A Container main body 34 Lid 34A Lid 40 Adsorption plate (adsorption means) )
41 Housing 42 Porous body 43 Vacuum pump 50 Transfer robot 53 Arm 60 Hand 61 Hand body 63 First exhaust path 64 Second exhaust path 65 Vacuum pump 66 First holding groove 64 Second holding groove 70 Alignment device ( Alignment means)
71 Fixed pin 72 Centering movable pin

Claims (8)

A substrate storage container for storing at least one of a substrate, a holding jig for the substrate, and a holding jig that detachably adsorbs the substrate, and a substrate, the holding jig for the substrate, and the substrate that are detachably adsorbed An adsorption means for adsorbing at least one of the holding jigs, and a transfer robot for handling the substrate, the holding jig, or the holding jig that detachably adsorbs the substrate between at least the substrate storage container and the adsorption means, A handling device such as a substrate provided with a hand that is provided in the transfer robot and detachably holds a holding jig,
The holding jig includes at least a base having substantially the same width as the substrate, a plurality of protrusions provided on the base, an adhesive layer for the deformable substrate provided on the base and covering the plurality of protrusions, A through passage that penetrates the base and the adhesion layer, and a communication path that is provided on the base and communicates with a space between the plurality of protrusions and the adhesion layer,
The hand is rotatably provided on the transfer robot and can hold the base of the holding jig in a detachable manner, and the hand is provided in the hand main body and communicates with the through path of the holding jig and adheres to the substrate. A first exhaust path that guides the gas between the plurality of protrusions and the adhesion layer, the second exhaust path that is provided in the hand body and communicates with the communication path of the holding jig. An apparatus for handling a substrate or the like, comprising an exhaust passage.   2. The substrate handling apparatus according to claim 1, further comprising a holding jig for the substrate or an alignment means for the holding jig that detachably sucks the substrate.   The substrate storage container includes a container main body that stores at least one of the substrate, a holding jig for the substrate, and a holding jig that detachably adsorbs the substrate, and a lid that detachably covers the front surface of the container main body. The substrate handling apparatus according to claim 1, comprising a body.   The substrate storage container includes a container main body that stores at least one of the substrate, the holding jig for the substrate, and the holding jig that detachably sucks the substrate, and a lid that detachably covers the upper surface of the container main body that is opened. The substrate handling apparatus according to claim 1, comprising a body.   The adsorbing means includes a breathable porous body that detachably adsorbs the substrate, the holding jig for the substrate, and the holding jig that detachably adsorbs the substrate by being made negative pressure. The substrate handling apparatus according to any one of claims 1 to 4.   6. The substrate handling apparatus according to claim 1, wherein a first holding groove for a holding jig communicating with the first exhaust path is formed in a hand main body of the hand.   The substrate handling apparatus according to claim 1, wherein a second holding groove for a holding jig communicating with the second exhaust path is formed in a hand main body of the hand.   A substrate, etc. characterized in that the substrate, the holding jig for the substrate, or the holding jig that detachably adsorbs the substrate is handled by using the substrate handling apparatus according to claim 1. How to handle.

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