JP2008211023A - Flexible circuit board mounting body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible circuit board mounting body which can obtain a low height of the flexible circuit board mounting body, also can arrange an FPC in a narrow region, can supply a signal stably from an external device even if any load is generated in a bending part of the FPC from the external device, and has high reliability. <P>SOLUTION: The flexible circuit board mounting body is constituted in such a manner that a wiring pattern of a flexible circuit board is electrically connected to first board wiring, and also electrically connected to second board wiring via a first bending part which bends from one face toward the other face via a board side edge. Further, the body is constituted in such a manner that, in a board inside region for a mounting region of the second board wiring and the wiring pattern, the wiring pattern is laminated on the mounting region via a second bending part which bends from a board surface toward the direction of the first bending part and also the wiring pattern is arranged extending from a mounting board toward the direction of the board side edge. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flexible circuit board mounting body in which a flexible circuit board is mounted on a mounting board having wirings on both sides of the board.

  In order to display differently in each liquid crystal layer of a liquid crystal panel formed by sandwiching and arranging two liquid crystal layers between three transparent substrates in a mounting substrate having wiring on both sides of the substrate A flexible circuit board mounting body on which a flexible circuit board (hereinafter referred to as FPC) is mounted has been proposed (see, for example, Patent Document 1).

Hereinafter, the structure of this conventional flexible circuit board mounting body will be described with reference to the drawings.
FIG. 8A is a perspective view showing the configuration of the liquid crystal panel 100 in the conventional flexible circuit board mounting body, and FIG. 8B is a cross-sectional view of the mounting area of the liquid crystal panel on which the FPC is mounted. ing.

First, the structure of the liquid crystal panel will be described.
8A and 8B, the liquid crystal panel 100 is laminated by sandwiching two liquid crystal layers (not shown) between three transparent substrates 1, 2, and 3, respectively. The transparent substrate 2 (hereinafter referred to as the intermediate substrate 2) among the three transparent substrates 1 to 3 is protruded with respect to the two transparent substrates 1 and 3 (hereinafter referred to as the outer substrates 1 and 3). . The substrate wiring 6 is formed on the front surface of the middle substrate 2 and the substrate wiring 7 is formed on the back surface of the middle substrate 2. The liquid crystal panel 100 has three sides 9, 10, 11 on the outer side of the middle substrate 2. A rectangular mounting region 12 is formed so as to be a radial side. A voltage can be applied to the liquid crystal layer through the substrate wirings 6 and 7 exposed in the mounting region 12.

  Next, the configuration of the FPC connected to the substrate wirings 6 and 7 exposed in the mounting region 12 in the liquid crystal panel 100 described above will be described. FIG. 9A shows a top plan view of the FPC, and FIG. 9B shows a cross-sectional view thereof.

  As shown in FIGS. 9A and 9B, this FPC 1101 is formed by laminating and fixing two first FPCs 1013 and a second FPC 1014 via an insulating layer 1017B, and thereby a first wiring pattern 1015. And the second wiring pattern 1016 are both exposed on the same surface. In addition, the FPC 1101 is configured such that the second wiring pattern 1016 and the insulating layer 1017B that holds the second wiring pattern 1016 project and extend so as to be exposed stepwise rather than the first wiring pattern 1015. Here, the second FPC 1014 is configured to protrude from the first FPC 1013. Note that a cover film 1017A is formed so as to expose a part of the surface of the first wiring pattern 1015 that is the end face side where the second wiring pattern 1016 is exposed.

  Next, a configuration of a conventional flexible circuit board mounting body in which the liquid crystal panel 100 and the FPC 1101 described above are mounted and connected will be described. FIG. 10A shows a perspective view of a conventional flexible circuit board mounting body. FIG. 10B shows a cross-sectional view thereof.

As shown in FIGS. 10A and 10B, the second wiring pattern 1016 at one end of the second FPC 1014 in the FPC 1101 and the substrate wiring 6 exposed in the mounting region 12 of the liquid crystal panel 100 are respectively paired with each other. Connected. At this time, the extending direction of the second wiring pattern 1016 is parallel to the extending direction of the substrate wiring 6, and the end of the second wiring pattern 1016 is the edge side of the substrate wiring 6.

  Further, in the second FPC 1014, the protruding portion protruding from the first FPC 1013 is bent around the outer side 10 of the intermediate substrate 2 as shown in FIG. 10A, and as shown in FIG. 10B. The end portion of the first wiring pattern 1015 is parallelly connected to the substrate wiring 7 provided on the back side of the middle substrate 2.

  Accordingly, the FPC 1101 can input an external signal independent to the mounting board having the board wirings 6 and 7 on both sides of the middle board 2. The contact connection provided at one end of the first and second FPCs 1013 and 1014 is electrically connected by anisotropic conductive members 18A and 18B as shown in FIG. The other ends of the first and second FPCs 1013 and 1014 are connected to the printed wiring board 1019.

Japanese Patent Application Laid-Open No. 60-112221 (page 2-7, FIG. 1-7)

  However, in the flexible circuit board mounting body 1110 described in Patent Document 1, the first and second FPCs 1013 and 1014 are bent at the edge of the mounting area 12 of the board wiring 7 as shown in FIG. Since the portion 1120 is bent at a right angle and connected to the printed wiring board 1019, the thickness of the flexible circuit board mounting body 1110 in the thickness direction (hereinafter referred to as the mounting body thickness) at the mounting portion side edge is increased. There is.

  Accordingly, the object of the present invention is to solve the above-mentioned problems, to realize a reduction in the height of the flexible circuit board mounting body, and to arrange an FPC in a narrow region, and some load is generated from the outside in the bent portion of the FPC. However, it is to provide a flexible circuit board mounting body with high reliability that can stably supply signals from the outside.

  The flexible circuit board mounting body of the present invention basically has the following constituent elements in order to achieve the above object.

  The flexible circuit board mounting body of the present invention includes a mounting board having a first board wiring formed on one surface and a second board wiring formed on the other surface, and first and second boards. And a flexible circuit board having a wiring pattern for connecting to the wiring. In this flexible circuit board, the wiring pattern is electrically connected to the first board wiring, and the first bending is performed from one side to the other side via the board side edge. And is electrically connected to the second substrate wiring via the portion, and is an inner region of the substrate with respect to the mounting region of the second substrate wiring and the wiring pattern from the substrate surface toward the first bent portion. It is characterized in that it is laminated with the mounting region via a second bent portion that is bent in this manner and is extended from the mounting substrate toward the substrate side edge portion.

  In the flexible circuit board mounting body of the present invention, the flexible circuit board covers the substrate surface including the wiring pattern formed on the surface of the base substrate, and is directed from the second bent portion toward the substrate outer edge portion. It has a cover film formed only on the surface.

The flexible circuit board mounting body of the present invention is a surface opposite to the surface on which the wiring pattern is formed on the base substrate, is on both sides of the bent line in the second bent portion, and this bent The first and second projecting members provided on the inner side of the second bent portion are arranged at positions equidistant from the line.

  Moreover, the flexible circuit board mounting body of the present invention is characterized in that the first and second projecting members are formed of a linear body.

  Moreover, you may make it form the 1st and 2nd protrusion member by the same number of several linear body groups, respectively.

  Furthermore, you may make it form the 1st and 2nd protrusion member in dotted line shape.

  Furthermore, the first and second projecting members may be disposed so as to overlap the region where the wiring pattern is formed.

  Furthermore, the 1st and 2nd protrusion member is integrally formed by the linear body straddling the bending line, and the some opening part may be formed along the bending line.

  The flexible circuit board mounting body of the present invention is characterized in that the mounting board is a transparent substrate of a liquid crystal panel in which board wiring is formed on both sides.

  According to the present invention, the thickness of the mounting body at the side edge of the flexible circuit board mounting body can be further reduced, and the FPC can be mounted and arranged in a narrow region of the mounting board.

  Further, by using the configuration of the flexible circuit board mounting body of the present invention, the thickness of the mounting body is made as thin as possible to suppress disconnection of the wiring pattern, and some load is generated at the bent portion of the FPC from the outside. Even in this case, it is possible to provide a highly reliable mounting body that can stably supply a signal from the outside.

  Exemplary embodiments of a flexible circuit board mounting body according to the present invention will be described below in detail with reference to the accompanying drawings. In addition, although the structure of the following attached drawing demonstrates the mounting board in a flexible circuit board mounting body taking the wiring board of a liquid crystal panel as an example, this invention is not limited to this, Other mountings It should be noted that the present invention is applicable to a flexible circuit board mounting body in which the thickness of the substrate, particularly the mounting body, is desired to be as thin as possible. It should also be noted that the dimensions are different from the actual dimensions for ease of explanation.

First, the structural example of the flexible circuit board mounting body of this invention is demonstrated in detail.
FIG. 1A is a perspective view showing a configuration example of a flexible circuit board mounting body of the present invention, and FIG. 1B is a cross-sectional view showing a state in which an FPC is mounted and connected to an inner substrate of a liquid crystal panel. FIG.

  As shown in FIGS. 1A and 1B, the flexible circuit board mounting body 110 of the present invention has a configuration in which the FPC 101 is mounted on the mounting region 12 of the liquid crystal panel 100, and the mounting configuration has been described above. It is similar to the prior art.

The FPC 101 includes a wiring pattern 15 for transmitting an external signal to the liquid crystal panel 100, a base substrate 16 that holds the wiring pattern 15, and a cover film 17 that is insulated so as to cover the wiring pattern 15. The FPC 101 is bent at the first bent portion 19A so that the pattern 15 overlaps the substrate wirings 6 and 7 formed on the front and back surfaces of the middle substrate 2 of the liquid crystal panel 100, thereby sandwiching the mounting region 12 of the middle substrate 2; An external signal can be input to the two liquid crystal layers. With this configuration, an external signal can be input to the mounting area 12 of the liquid crystal panel 100 described above. Further, the FPC 101 is bent by 180 ° at the second bent portion 19B, and is arranged to extend from the liquid crystal panel 100 toward the side edge portion of the middle substrate 2. Note that the substrate wirings 6 and 7 on both front and back surfaces of the middle substrate 2 in the mounting region 12 and the wiring pattern 15 are connected using anisotropic conductive members 18A and 18B.

  In the conventional configuration, since the FPC 101 mounted on the middle substrate 2 is bent at a right angle by the second bent portion 19B, an external signal is input to the mounting region 12 of the liquid crystal panel 100. And the thickness of the mounting body in the thickness direction at the side edge portion of the flexible circuit board mounting body including the FPC 101 is increased. By bending the second bent portion at 180 ° with the above configuration, the mounting body thickness can be reduced. It can be made as thin as possible.

  However, when the FPC 101 is bent 180 ° at the second bent portion 19B to reduce the thickness of the mounting body, the angle of the bent portion of the FPC 101 becomes an acute angle at the second bent portion 19B, and an external signal is transmitted. It is conceivable that the wiring pattern 15 is disconnected.

  Here, the best mode of the FPC to be mounted on the liquid crystal panel which is the mounting substrate in the flexible circuit board mounting body will be described with reference to FIG. 2A is a front view showing the configuration of the FPC according to the present invention, and FIG. 2B is a cross-sectional view thereof.

  As shown in FIGS. 2A and 2B, the FPC 111 according to the present invention holds a wiring pattern 15 for transmitting an external signal to the mounting substrate (the middle substrate 2 in the liquid crystal panel 100), and the wiring pattern 15. The base substrate 16 and the cover film 17 that insulates the wiring pattern 15 so as to cover the wiring pattern 15, and the first projecting member 20 </ b> A and the second projecting member 20 </ b> A are formed on the surface opposite to the surface on which the wiring pattern 15 is formed. A protruding member 20B is formed. The first and second projecting members 20A and 20B are formed of a linear body as shown in FIG. 2A, and are bent at the second bent portion 19B (see FIG. 1B). Each is formed at a position equidistant from the line (center line when bent).

  Further, the cover film 17 is formed only on the surface from the second bent portion 19B toward the outer edge portion of the mounting substrate. By arranging the cover film 17 in this way, the FPC 111 can be easily bent at the second bent portion 19B. The wiring pattern 15 is exposed at the second bent portion 19B. If there is a problem with this, the exposed portion may be covered with an insulating resin or the like. By configuring in this way, not only the exposure of the wiring pattern 15 can be eliminated, but also the adhesive force of the FPC 101 to the mounting substrate can be enhanced.

  Next, a configuration in which the FPC 111 according to the present invention is mounted on a mounting substrate will be described with reference to FIGS. FIG. 3A is a perspective view showing a configuration when the FPC 111 according to the present invention is mounted on a mounting board, and FIG. 3B is a cross-sectional view showing the mounting portion.

  The FPC 111 according to the present invention is formed by bending the FPC 111 at the first bent portion 19A so as to overlap the substrate wirings 6 and 7 formed on the front and back surfaces of the middle substrate 2 of the liquid crystal panel 100 that is a mounting substrate. The two mounting areas are sandwiched between the two liquid crystal layers so that external signals can be input. With this configuration, an external signal is input to the mounting area of the liquid crystal panel 100 described above. The substrate wirings 6 and 7 on both front and back surfaces of the middle substrate 2 in the mounting region and the wiring pattern 15 are connected using anisotropic conductive members 18A and 18B.

  Further, an R-shaped second bent portion 19B having a predetermined inner diameter is provided by the first protruding member 20A and the second protruding member 20B provided in the FPC 111. Thus, when the FPC 111 is bent at the second bent portion 19B, the first and second projecting members 20A and 20B are positioned inside the bent flexible circuit board 111, and the first and second The protruding members 20A and 20B abut. Further, the bent FPC 111 is extended from the liquid crystal panel 100 toward the side edge portion of the middle substrate 2.

  By bending the FPC 111 by bringing the first and second projecting members 20A and 20B into contact with each other and bending the FPC 111, the second bent portion 19B can be formed into an R shape having a certain inner diameter. Further, the FCP 111 can be bent accurately and easily at the designed position by providing a bent line of the second bent portion 19B at a position that is equidistant between the first and second projecting members 20A and 20B. I can do it.

  Thus, since the flexible circuit board mounting body 110 is mounted on the mounting board using the configuration of the FPC 111, even when the mounting body thickness is made as thin as possible, the second bent portion 19B 1. It has an R shape defined by the height of the second projecting members 20A and 20B, and the FPC 111 can be bent to prevent disconnection of the wiring pattern 15 formed on the FPC 111 as much as possible. . Further, since the FPC 111 can be bent at the target position (the position of the bent line in the second bent portion 19) by the first and second projecting members 20A and 20B, the flexible circuit board can be mounted with a stable outer shape. The body 110 can be manufactured. Note that the inner diameter of the R shape can be easily controlled by changing the shapes of the first and second projecting members 20A and 20B.

  Next, another configuration example of the FPC according to the present invention and another configuration example of the flexible circuit board mounted body including the FPC will be described. FIG. 4 shows a configuration example in which the protruding members of the FPC are formed to form a linear body group. In addition, this figure (a) is a front view which shows the structure of FPC based on this invention, and this figure (b) is the sectional drawing.

  4A and 4B, the flexible circuit board 112 according to the present invention includes a wiring pattern 15 for transmitting an external signal to the mounting board, a base board 16 holding the wiring pattern 15, It is comprised from the cover film 17 insulated so that the wiring pattern 15 may be covered, and also the 1st-4th protrusion members 21A-21D are each formed in the surface on the opposite side to the surface in which the wiring pattern 15 was formed. Yes. The first to fourth projecting members 21 </ b> A to 21 </ b> D are formed of a striated body group composed of a plurality of striated bodies, and are equidistant from the bent line of the second bent portion shown in the first embodiment. Formed in position.

  Next, a configuration example of a flexible circuit board mounting body in which the FPC 112 according to the present invention is mounted on a mounting board will be described with reference to FIG. FIG. 4C is a cross-sectional view showing the configuration of the mounting portion of the flexible circuit board mounting body of the present invention in which the FPC shown in FIGS. 4A and 4B is mounted on the mounting board.

  The FPC 112 according to the present invention is connected to the substrate wirings 6 and 7 formed on the front and back surfaces of the middle substrate 2 of the liquid crystal panel 100 as a mounting substrate in the same configuration as in the first embodiment.

Further, the FPC 112 is bent at the second bent portion 19B so that the first to fourth projecting members 21A to 21D are positioned inside. Further, the first to fourth projecting members 21 </ b> A to 21 </ b> D are bent so that the projecting portions abut when the FPC 112 is folded. Then, the FPC 112 bent at the second bent portion 19B is extended from the liquid crystal panel 100 toward the side edge portion of the middle substrate 2 as described in the first embodiment.

  Thus, since the FPC 112 is mounted and connected to the flexible circuit board mounting body 110 shown in the second embodiment, the same effects as those of the first embodiment are obtained, and a plurality of projecting members arranged as a linear body group are obtained. Can be brought into contact with each other to increase the R-shaped diameter of the second bent portion 19B. Further, by increasing the R-shaped diameter of the second bent portion 19B, the disconnection of the wiring pattern 15 provided in the FPC 112 can be further suppressed.

  Next, still another configuration example of the FPC according to the present invention and another configuration example of the flexible circuit board mounted body including the FPC will be described. FIG. 5 is a diagram showing a configuration example in which the protruding members of the FPC are formed in a dotted line shape. FIG. 5A is a front view showing the configuration of the FPC according to the present invention, and FIG. These are figures when FPC is seen from the opposite surface.

  As shown in FIGS. 5A and 5B, the FPC 113 according to the present invention includes a wiring pattern 15 for transmitting an external signal to the mounting board, a base board 16 holding the wiring pattern 15, and a wiring pattern. The cover film 17 is insulated so as to cover 15, and the protruding member 22 is formed on the surface opposite to the surface on which the wiring pattern 15 is formed. The projecting member 22 is provided on the opposite side of the wiring pattern 15 through the base substrate, is formed in a dotted line, and at a position that is equidistant from the bent line in the second bent portion shown in the first embodiment. Yes.

  The mounting form of the flexible circuit board mounting body in which the FPC 113 according to the present invention is mounted on the mounting board is the same as the configuration shown in FIG. 3 shown in the first embodiment, and the effect is the same as that of the first embodiment. Detailed explanation here is omitted.

  Next, still another configuration example of the FPC according to the present invention and another configuration example of the flexible circuit board mounted body including the FPC will be described. In FIG. 6, the protruding member 23 formed on the FPC is configured to cover the entire second bent portion shown in the first embodiment, and an opening is formed in a part of the protruding member 23. Shows the configuration. In addition, this figure (a) is a front view which shows the structure of FPC which concerns on this invention, and this figure (b) is a figure when the FPC is seen from the opposite surface.

  As shown in FIGS. 6A and 6B, the FPC 114 according to the present invention includes a wiring pattern 15 for transmitting an external signal to the mounting substrate, a base substrate 16 holding the wiring pattern 15, and a wiring pattern. The cover film 17 is insulated so as to cover 15, and a protruding member 23 is formed on the surface opposite to the surface on which the wiring pattern 15 is formed. The protruding member 23 is provided on the opposite side of the wiring pattern 15 via the base substrate 16 and is configured to cover the entire second bent portion 19B (see FIG. 1B). In addition, a plurality of openings are formed in a part of the protruding member 23 on the opposite side through the base substrate 16 in the center of the second bent portion 19B where the wiring pattern 15 is not formed. .

  By adopting the configuration of the FPC 114, the strength of the second bent portion 19B in the bending direction can be increased. Therefore, when the FPC 114 is mounted and connected to the mounting substrate, the wiring pattern 15 which is concerned about the second bent portion 19B can be used. Disconnection can be prevented as much as possible. In addition, since an opening is provided in the center of the second bent portion 19B, and the strength at the second bent portion 19B is partially weakened, a stable position is obtained as in the configuration shown in the previous embodiment. The FPC 114 can be bent.

  Next, still another configuration example of the FPC according to the present invention will be described. FIG. 7 is a front view showing still another configuration of the FPC according to the present invention.

  As shown in FIG. 7, the FPC 115 according to the present invention includes a first wiring pattern 25A, a second wiring pattern 25B, a first and a second wiring pattern 25A for transmitting an external signal to the mounting board. The base substrate 16 holding the 26B and the cover film 17 that covers and insulates the first and second wiring patterns 25A and 26B. Note that the substrate wirings formed on both the front and back surfaces of the mounting substrate are arranged at positions where the front and back substrate wirings do not overlap when the mounting region on which the FPC 115 is mounted is seen through.

  When the FPC 115 is bent at the first bent portion 19A (see FIG. 1B) and mounted so as to sandwich the mounting area of the mounting board, the first wiring pattern 25A is mounted on one side of the mounting board. It overlaps with the substrate wiring formed in the region. The second wiring pattern 25B is mounted so as to overlap with the substrate wiring formed in the other mounting region of the mounting substrate. By configuring in this way and transmitting different signals to the first and second wiring patterns 25A and 25B, different signals can be input to both the front and back surfaces of the mounting board. Then, projecting members 20A to 20B, 21A to 21D, 22, and 23 formed on the FPCs 111 to 114 described in the first to fourth embodiments are arranged on the FPC 115 shown in the present embodiment, and the FPC 115 is mounted on the mounting substrate. By mounting and connecting, the same effect as in the previous embodiment can be obtained.

It is the perspective view which shows the structural example of the flexible circuit board mounting body of this invention, and sectional drawing which shows the mounting form of a mounting area | region. (Example 1) It is the front view which shows the structural example of the flexible circuit board in the flexible circuit board mounting body of this invention, and sectional drawing. (Example 1) It is a perspective view which shows the structural example of the flexible circuit board in the flexible circuit board mounting body of this invention, and sectional drawing which shows the mounting form of the flexible circuit board of a mounting area | region. (Example 1) It is the front view which shows the structural example of the flexible circuit board in the flexible circuit board mounting body of this invention, sectional drawing, and sectional drawing which shows the mounting form of the flexible circuit board of a mounting area | region. (Example 2) It is the front view and back view which show the structural example of the flexible circuit board in the flexible circuit board mounting body of this invention. (Example 3) It is the front view and back view which show the structural example of the flexible circuit board in the flexible circuit board mounting body of this invention. Example 4 It is a front view which shows the structural example of the flexible circuit board in the flexible circuit board mounting body of this invention. (Example 5) It is the perspective view and sectional drawing which show the structure of the liquid crystal panel in the conventional flexible circuit board mounting body. It is the top view and sectional drawing of a flexible circuit board in the conventional flexible circuit board mounting body. It is a perspective view which shows the structure of the conventional flexible circuit board mounting body, and sectional drawing which shows the structure of a mounting area | region.

Explanation of symbols

1, 2, 3 Transparent substrate 6, 7 Substrate wiring 9, 10, 11 External side 12 Mounting area 15 Wiring pattern 16 Base substrate 17 Cover film 18A, 18B Anisotropic conductive member 19A First bent portion 19B Second bent Part 20A, 20B, 21A-21D, 22, 23 Projection member 100 Liquid crystal panel 110 Flexible circuit board mounting body 111, 112, 113, 114, 115 Flexible circuit board (FPC)

Claims (9)

A mounting substrate having a first substrate wiring formed on one surface and a second substrate wiring formed on the other surface;
A flexible circuit board having a wiring pattern for connecting to the first and second board wirings,
The flexible circuit board is
The wiring pattern is electrically connected to the first substrate wiring and via a first bent portion that is bent from the one surface to the other surface via the substrate side edge portion. And electrically connected to the second substrate wiring,
In addition, in the substrate inner region with respect to the mounting region of the second substrate wiring and the wiring pattern, the mounting region is stacked with the mounting region via a second bent portion that is bent toward the first bent portion direction from the substrate surface. And a flexible circuit board mounting body characterized in that the flexible circuit board mounting body is arranged so as to extend from the mounting board toward the board side edge portion. The flexible circuit board covers the substrate surface including the wiring pattern formed on the surface of the base substrate, and is formed only on the surface from the second bent portion toward the substrate outer edge portion. The flexible circuit board mounting body according to claim 1, comprising: On the base substrate, the surface opposite to the surface on which the wiring pattern is formed, on both sides of the bent line in the second bent portion, and at a position equidistant from the bent line. 3. The flexible circuit board mounting body according to claim 1, wherein first and second projecting members disposed on the inner side of the two bent portions are disposed. The flexible circuit board mounting body according to claim 3, wherein the first and second projecting members are formed of a linear body. The flexible circuit board mounting body according to claim 4, wherein the first and second projecting members are each formed of the same number of a plurality of linear body groups. The flexible circuit board mounting body according to claim 3, wherein the first and second projecting members are formed in dotted lines. The flexible circuit board mounting body according to claim 6, wherein the first and second projecting members are disposed so as to overlap with a region where the wiring pattern is formed. The first and second projecting members are integrally formed by a linear body straddling the bending line, and a plurality of openings are formed along the bending line. The flexible circuit board mounting body according to claim 3. The flexible circuit board mounting body according to any one of claims 1 to 8, wherein the mounting board is a transparent substrate of a liquid crystal panel in which the board wiring is formed on both surfaces.

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