JP2008200616A - Gas adsorbing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a gas adsorbing device capable of suppressing the deterioration of a gas adsorbing material at the time of non-use. <P>SOLUTION: The gas adsorbing device 1 is constituted so that a member 5 including a shape memory alloy constituted of an elastomer is inserted in the opening part 4 of a container 3 made of polyethylene terephthalate including in gas adsorbing material 2 to seal the space where the gas adsorbing material 2 is included in the container 3 under vacuum. The shape memory alloy has a shape, which is formed into a ring form by circularly bending a flat plate like one to a degree wherein both ends thereof almost come into contact with each other, at the normal temperature and deformed to an almost C-shape wherein the interval between both ends is widened when a temperature rise above the phase transformation temperature of the shape memory alloy. When the gas adsorbing device 1 is heated to the phase transformation temperature of the shape memory alloy after adapted to a vacuum heat insulating material, the outer diameter of the member 5 which covers the opening part 4 become large and the opening part 4 of the container 3 is deformed accompanying that to form the gap allowing the inside and outside of the container 3 to communicate with each other. The gas adsorbing material 2 adsorbs the gas in the outer cover material of the vacuum heat insulating material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a gas adsorption device capable of storing a gas adsorbent in the atmosphere.

  In recent years, expectations for industrial technology that requires high vacuum are increasing. For example, energy saving is strongly desired from the viewpoint of preventing global warming, and energy saving is an urgent issue for household appliances. In particular, a heat insulating material having excellent heat insulating performance is required from the viewpoint of efficiently using heat in a heat and cold insulation device such as a refrigerator, a freezer, and a vending machine.

  As general heat insulating materials, fiber materials such as glass wool and foams such as urethane foam are used. However, in order to improve the heat insulation performance of these heat insulating materials, it is necessary to increase the thickness of the heat insulating material, and there is a limit to the space that can be filled with the heat insulating material, so when space saving and effective use of the space are necessary It cannot be applied.

  Therefore, vacuum heat insulating materials have been proposed as high performance heat insulating materials. This is a heat insulator in which a core material serving as a spacer is inserted into a jacket material having gas barrier properties and the inside is decompressed and sealed.

  By increasing the degree of vacuum inside the vacuum heat insulating material, high-performance heat insulating performance can be obtained, but the gas existing inside the vacuum heat insulating material is roughly divided into the following three types. The first is the gas that cannot be evacuated during vacuum insulation material production, and the second is the gas generated from the core material and jacket material after being sealed under reduced pressure (adsorbed on the core material and jacket material). The third gas is a gas that enters from the outside through the jacket material.

  In order to adsorb these gases, a method of filling the vacuum heat insulating material with the adsorbent has been devised.

  For example, there exists what adsorb | sucks the gas in a vacuum heat insulating material using a Ba-Li alloy (for example, refer patent document 1). Of the gases to be adsorbed by the adsorbent in the vacuum heat insulating material, one of the gases that are difficult to adsorb is nitrogen. This is because the nitrogen molecule is a nonpolar molecule having a large binding energy of about 940 kJ / mol, and thus it is difficult to activate. However, nitrogen can be adsorbed by the Ba-Li alloy, and the degree of vacuum inside the vacuum heat insulating material is maintained.

For the purpose of further improving the performance of the vacuum heat insulating material, the vacuum degree inside the vacuum heat insulating material is further reduced, and it is more active than Ba-Li for equipment that requires a high vacuum such as a plasma display panel. The practical application of a gas adsorbent is desired.
Japanese National Patent Publication No. 9-512088

  However, the conventional configuration described in Patent Document 1 does not require heat treatment for activation, can adsorb nitrogen even at room temperature, and can be handled in an air atmosphere for several minutes. Under conditions for industrially manufacturing an apparatus using an adsorbent, a longer allowable time is desirable for handling.

  This is because most of the nitrogen adsorption capacity is consumed in the manufacturing process that comes into contact with air, so that the adsorption capacity for maintaining the performance over time of the equipment using the gas adsorbent becomes poor, and the performance deterioration and performance variation increase. This is to prevent this. While further improvement in performance of vacuum heat insulating materials and the like is desired, in order to maintain the degree of vacuum inside the equipment, it has been a big problem to use the adsorbent more stably and efficiently.

  The height of activity of the gas adsorbent, that is, the time until the adsorption is saturated when left in the atmosphere varies depending on the form and material specifications. For example, if the gas adsorbent is in the form of pellets, it will not saturate even if left in the atmosphere for a relatively long time. On the other hand, if the gas adsorbent is in powder form, the specific surface area becomes large, so that even if it is left in the atmosphere for a short time, it is saturated.

  Therefore, in the above structure, when a powdery gas adsorbent is used, which has a higher activity than Ba-Li, there is a possibility that the time that can be contacted with the atmosphere will be very short.

  An object of the present invention is to solve the above-described conventional problems, and an object of the present invention is to provide a gas adsorption device that can be stored in the atmosphere for a long time even when the highly active gas adsorbent is in a powder form.

  In order to achieve the above object, the gas adsorption device of the present invention comprises at least a gas adsorbent and a container containing the gas adsorbent, and when a change in a predetermined temperature occurs, the gas adsorption in the container The space where the material exists changes from a state where the space is blocked from the space outside the container to a state where the space communicates with the space outside the container.

  The change from the state in which the space where the gas adsorbent in the container exists is blocked from the space outside the container to the state in which the space where the gas adsorbent in the container exists communicates with the space outside the container is a predetermined temperature. Therefore, when the gas adsorbent is applied to a vacuum apparatus, it is not necessary to control factors other than temperature, and productivity can be improved. In addition, since the gas adsorption device can be switched by controlling the temperature after application to the vacuum device, it is possible to switch even when it is impossible to apply a force from the outside of the housing of the vacuum device.

  Here, the vacuum equipment refers to equipment that exhibits its function by evacuating the inside, such as a vacuum heat insulating material.

  The switching means that the gas adsorbing device container is released from hermeticity and the gas adsorbing material can adsorb gas outside the container.

  Since the gas adsorbing device is switched depending on the temperature, it is only necessary to control the atmospheric temperature at the time of installation in the vacuum equipment, and switching can be performed in any situation. Therefore, even when the vacuum device casing is not deformed and a force cannot be applied from the outside, it can be switched.

  Moreover, the gas adsorption device can be installed in a vacuum device and can be switched after the vacuum device is sealed. Therefore, gas that does not need to be adsorbed, that is, gas outside the vacuum device is not adsorbed, and deterioration of the gas adsorbent during storage and application to the vacuum device can be prevented. In addition, since the shape memory alloy has a large generated force per unit weight, the gas adsorption device can be miniaturized by using the shape memory alloy.

  The invention of the gas adsorption device according to claim 1 of the present invention comprises at least a gas adsorbent and a container containing the gas adsorbent, and when a predetermined temperature change occurs, the gas adsorption in the container The space where the material exists changes from a state where the space is blocked from the space outside the container to a state where the space communicates with the space outside the container.

  The higher the activity of the gas adsorbent and the greater the specific surface area, the more severe the handling conditions. That is, in order to maintain the activity of the gas adsorbent, the time that can be contacted with air is shortened, and the pressure that can be contacted is also reduced.

  Therefore, such a gas adsorbing material also has a problem of deterioration when it is installed in a vacuum apparatus in addition to storage. Therefore, when installing the gas adsorbent in the vacuum equipment, it is necessary to communicate after the space in which the gas to be adsorbed, that is, the pressure inside the vacuum equipment is as low as possible.

  As an example of vacuum equipment, when a gas adsorbent is applied to a vacuum heat insulating material, a core material and a gas adsorbent inserted into a gas barrier outer jacket material are placed in the chamber, the chamber is decompressed, After decompressing the inside of the material, the opening of the jacket material is sealed.

  At this time, the pressure in the chamber is reduced by a vacuum pump. In the normal pressure region, that is, before vacuum sealing, the pressure can be reduced by either a pump or an adsorbent. On the other hand, in the low pressure region, that is, inside the jacket material after vacuum sealing, there is a gas that could not be decompressed by the vacuum pump, a gas that penetrates through the jacket material after vacuum sealing, and a gas generated from the core material, These can be adsorbed only with a gas adsorbent. Therefore, in order to fully demonstrate the capability of the gas adsorbent inside the outer jacket material after vacuum sealing, it is necessary to communicate with the outside after vacuum sealing.

  Since the vacuum equipment is sealed after the gas adsorbing material is installed inside, it is difficult to switch the gas adsorbing device by applying a force directly from the outside. Therefore, it is desirable to switch the gas adsorbent by remote control. As a means for switching by remote operation, a method of releasing the sealing of the gas adsorption device by changing the temperature of the gas adsorption device is effective.

  After the vacuum apparatus is sealed, the temperature of the internal gas adsorption device is also changed by changing the temperature, and switching is possible by reaching a predetermined temperature. As a method for switching due to temperature change, there are methods such as deformation of the container due to thermal expansion and contraction, deformation of the container due to phase change, and the like. An example of a phase change is melting due to an increase in temperature, that is, a change from a solid phase to a liquid phase. It is also effective to use an object whose shape is deformed by a change in temperature. Such materials include shape memory alloys.

  By using the method as described above, the gas adsorbing device can be deformed without applying force, the sealing property of the container can be released, and the adsorbing ability can be exhibited.

Here, the container is one that divides the space into the inside and outside like a spherical shell, for example. Further, the container is excellent in gas barrier properties, and the gas permeability is preferably 10 ⁴ [cm ³ / m ² · day · atm] or less, and more preferably 10 ³ [cm ³ / m ² · day · atm] or less. It will be.

  The invention of the gas adsorption device according to claim 2 is the invention according to claim 1, wherein the container has an opening, and the opening is covered with a member covering the opening.

  When the closed space is formed by the opening and the member that covers the opening, the gas can be prevented from entering the space where the gas adsorbent exists, and the deterioration of the gas adsorbent can be suppressed.

  On the other hand, in order for the gas adsorbing material to adsorb gas, it is necessary for the gas to enter the periphery of the gas adsorbing material. This is done by the difference in temperature change rate between the opening and the member covering the opening, and is specifically as follows.

  For example, when both the opening and the member covering the opening expand and the temperature change rate of the opening is larger, both the opening and the member covering the opening contract and the temperature change of the member covering the opening If the rate is larger, if the opening expands or the member covering the opening contracts, a space is created between the opening and the member covering the opening, allowing gas to pass through. Become.

  Therefore, if a switching method by changing the temperature after installing the gas adsorbent inside the vacuum device is used, deterioration during storage can be suppressed and gas can be adsorbed inside the vacuum device.

  Here, the member covering the opening forms a closed space by covering the opening of the container having the opening.

  The invention of the gas adsorption device according to claim 3 is the invention according to claim 1 or claim 2, wherein the temperature change rate of at least one of the components is equal to the temperature change rate of the other components. Is different.

  At normal temperature, the components of the gas adsorption device are in close contact with each other to form a closed space, so that gas does not enter the closed space where the gas adsorbent exists and suppresses deterioration of the gas adsorbent during storage. Can do.

  A closed space is a space that does not pass through an object having a certain shape, such as the inside of a spherical shell, and does not connect to other spaces.

  On the other hand, since the temperature change rate of at least one component is different from the temperature change rate of other components, when the temperature of the gas adsorption device changes, a space is created in the closely adhering portion at room temperature, and external gas is generated. Adsorption is possible.

  Therefore, if a switching method by changing the temperature after installing the gas adsorbent inside the vacuum device is used, deterioration during storage can be suppressed and gas can be adsorbed inside the vacuum device.

  An invention of a gas adsorption device according to claim 4 is the invention according to claim 3, wherein at least a part of at least one of the components is a shape memory alloy.

  Here, the shape memory alloy has a predetermined shape. Even if the shape memory alloy is deformed, the shape memory alloy is deformed without depending on an external force and returns to the original shape even when a predetermined temperature is reached. This temperature that can be returned to the original is called the phase transformation temperature. The main shape memory alloys are Ni-Ti alloys, Cu alloys, and Fe alloys, and any of these can be used.

  Since the shape memory alloy is largely deformed before and after the phase transformation temperature, the gas adsorption device is more reliably switched at a predetermined temperature. In addition, since the temperature change rate other than the phase transformation temperature is small, switching is not performed due to slight temperature fluctuations, and handling during storage becomes easy.

  Further, shape memory alloys have different phase transformation temperatures depending on the composition. Further, when the shape memory alloy is used for switching the gas adsorption device, the switching temperature of the gas adsorption device is equal to the phase transformation temperature of the shape memory alloy. Therefore, it is possible to control the switching temperature of the gas adsorption device by using a shape memory alloy having an appropriate phase transformation temperature.

  According to a fifth aspect of the present invention, there is provided the gas adsorption device according to the second aspect, wherein the member covering the opening is an elastic body including a shape memory alloy.

  When the gas adsorption device is stored, the member covering the opening is in contact with the opening via the elastic body. The elastic body is deformed according to the shape of the contacting object and forms a closed space in close contact with the opening. Therefore, it is possible to suppress gas intrusion and suppress deterioration of the gas adsorbent during storage. .

  On the other hand, an elastic body typified by rubber or the like is not suitable for switching the gas adsorption device because the temperature change rate is small. Here, this problem is solved by the included shape memory alloy. Since the shape memory alloy is in contact with the elastic body, when the shape memory alloy is deformed, the elastic body is also deformed. Accordingly, the temperature change rate of the member covering the opening is increased. When the shape memory alloy reaches the phase transformation temperature, the member covering the opening is deformed, the sealing with the opening is released, and external gas can be adsorbed.

  Here, the elastic body is deformed substantially in proportion to external stress and returns to a normal state where no stress is applied when the stress stops working, and rubber or the like corresponds to this.

  The invention of the gas adsorption device according to claim 6 is the invention according to claim 5, wherein the apparent volume of the elastic body is increased by the phase transformation of the shape memory alloy.

  When the gas adsorption device is stored, the elastic body is deformed according to the shape of the opening of the container, and the opening of the container receives pressure from the elastic body. When the shape memory alloy undergoes phase transformation, the pressure applied from the elastic body increases, and the apparent volume of the elastic body increases, so that the pressure applied to the opening of the container increases. As a result, the container is deformed, a space is created between the opening and the member covering the opening, and external gas can be adsorbed.

  An invention of a gas adsorption device according to claim 7 is the invention according to claim 5, wherein the apparent volume of the elastic body is reduced by the phase transformation of the shape memory alloy.

  When storing the gas adsorption device, the elastic body is deformed in accordance with the shape of the opening of the container to ensure sealing. The phase transformation of the shape memory alloy weakens the force applied to the elastic body, reduces the apparent volume of the elastic body, creates a space between the opening and the member covering the opening, and can absorb external gas It becomes.

  An invention of a gas adsorption device according to an eighth aspect is the invention according to the fourth aspect, wherein at least a shape memory alloy is contained in a closed space formed by a container.

  If the shape memory alloy contained in the closed space formed by the container becomes longer due to phase transformation and the shape memory alloy does not extend even when the shape memory alloy contacts the inside of the container, the shape memory alloy Will apply force to the container through the contacts. When the container is deformed by this force and a through hole is formed, external gas can be adsorbed.

  The invention of the gas adsorption device according to claim 9 is the invention according to claim 2, wherein at least a shape memory alloy is included in a closed space formed by a member and a member covering the opening of the container. is there.

  The shape memory alloy contained in the closed space formed by the member that covers the container and the opening becomes longer due to the phase transformation, and the shape memory even if the shape memory alloy contacts the inside of the container or the opening and the shape memory alloy. If the alloy is not fully extended, the shape memory alloy will exert a force on the container through the contacts. When the container is deformed by this force and a through hole is formed, external gas can be adsorbed.

  There are a method of deforming the container and a method of detaching the member covering the opening from the container in order to generate the through-hole by the shape memory alloy. Of these, by using a technique that requires a small force, the shape memory is used. The generation force required for the alloy can be reduced. Therefore, the cost of the gas adsorption device can be reduced.

  The invention of the gas adsorption device according to claim 10 is the invention according to any one of claims 4 to 9, wherein the shape memory alloy has a spring shape.

  The length of the spring-shaped shape memory alloy contained in the container or the closed space formed by the member covering the container and the opening of the container becomes longer due to the phase transformation, and the container and the shape memory alloy are in contact with each other. If the spring-shaped shape memory alloy is not fully extended, the spring-shaped shape memory alloy applies a force to the container through the contact. When this force is applied to the member covering the opening, it acts as a force for separating the opening and the member covering the opening. Therefore, the member covering the opening is detached from the container, and external gas can be adsorbed through the opening.

  Since the shape memory alloy is spring-like, a stroke that greatly increases the amount of deformation of the shape memory alloy as a bulk can be obtained.

  Here, the shape of the spring is not limited, and a plate spring, a coil spring, a bamboo spring, a spiral spring, a ring spring, a disc spring, or the like is used.

  The invention of the gas adsorption device according to claim 11 is the shape memory alloy or the member bonded to the shape memory alloy according to any one of claims 4, 8, 9, and 10. At least one of the protrusions.

  Since at least one of the shape memory alloy or the member bonded to the shape memory alloy has the protrusion, the force per unit area that the shape memory alloy applies to the container or the opening of the container is increased. Therefore, a through-hole is easily generated in the member covering the container or the opening.

  Thereby, even if it is a case where a shape memory alloy with small generating force is used, a through-hole can be made in a container and external gas can be adsorbed.

  The invention of the gas adsorption device according to claim 12 is the invention according to any one of claims 9 to 11, wherein the member covering the opening is a film or sheet having excellent gas barrier properties. .

  Since the member covering the opening is a film or sheet having excellent gas barrier properties, the gas adsorbent can be prevented from being deteriorated with little gas penetration during storage. On the other hand, since it is a film or a sheet, a through hole is easily generated by applying a piercing force, and external gas can be adsorbed.

Here, the film or sheet having an excellent gas barrier property has a gas permeability of 10 ⁴ [cm ³ / m ² · day · atm] or less, and more desirably 10 ³ [cm ³ / m ^2]. [Day-atm]

  Specifically, a plastic film or sheet such as an ethylene-vinyl alcohol copolymer, nylon, polyethylene terephthalate, or polypropylene is made into a bag, but is not limited thereto.

  Furthermore, it is desirable to laminate a metal foil on a plastic film or to further improve the gas barrier property by depositing a metal. Gold, copper, aluminum, or the like can be used as the metal foil or metal that can be used for vapor deposition, but is not limited thereto.

  The invention of the gas adsorption device according to claim 13 is the invention according to any one of claims 8, 10, and 11, wherein the container is made of a film or sheet having excellent gas barrier properties. It is.

  Since the container is a film or sheet excellent in gas barrier properties, the gas adsorbent can be prevented from deteriorating with little gas intrusion during storage. On the other hand, since the entire container is a film or a sheet, it can be easily penetrated by the included shape memory alloy and can adsorb external gas.

Here, the film or sheet having an excellent gas barrier property has a gas permeability of 10 ⁴ [cm ³ / m ² · day · atm] or less, and more desirably 10 ³ [cm ³ / m ^2]. [Day-atm]

  Specifically, a plastic film or sheet such as an ethylene-vinyl alcohol copolymer, nylon, polyethylene terephthalate, or polypropylene is made into a bag, but is not limited thereto. Furthermore, it is desirable to laminate a metal foil on a plastic film or to further improve the gas barrier property by depositing a metal. Gold, copper, aluminum, or the like can be used as the metal foil or metal that can be used for vapor deposition, but is not limited thereto.

  The invention of a gas adsorption device according to claim 14 is the invention according to any one of claims 8 to 13, wherein the shape memory alloy is in a space partitioned by a support.

  When the container is in the form of a film or a sheet, when the inside of the container is depressurized, the shape memory alloy contained therein comes into contact with the container by atmospheric compression. At this time, if the shape memory alloy has a sharp shape, the container may be broken by the sharp portion of the shape memory alloy. Since the shape memory alloy is in the space delimited by the support, the shape memory alloy can be prevented from being pressed against the container even when the inside of the container is decompressed. Therefore, the gas adsorption device excellent in preservability can be obtained.

  Here, since the support is hollow, the object can be included, and deformation is small even when atmospheric pressure is applied, so that atmospheric pressure is not applied to the included object.

  The invention of the gas adsorption device according to claim 15 is the invention according to claim 14, wherein the support is cylindrical and has an opening in at least one of them.

  Since the support is cylindrical, the direction of the included shape memory alloy can be easily determined. Here, the cylindrical shape is hollow and can contain an object. In the three-dimensional space, one direction is longer than the other direction. The shape of the cross section includes a circle, an ellipse, a polygon such as a triangle and a rectangle, and a rhombus, but is not particularly limited as long as it does not hinder the operation of the contained object.

  When the aspect ratio of the shape memory alloy is large, the length direction of the shape memory alloy faces substantially the same direction as the length direction of the support. Therefore, by directing the shape memory alloy protrusion toward the opening of the support and defining the opening of the support, it is possible to direct the shape memory alloy protrusion in a direction in which a through hole is likely to occur. Therefore, external gas can be adsorbed through the through-hole generated by the shape memory alloy.

  The invention of the gas adsorption device according to claim 16 is the invention according to claim 4, wherein at least two or more containers are joined by a joint of a shape memory alloy containing an elastic body through an opening. It is.

  Since the gas adsorbent is in a closed space formed by the container and the joint, deterioration during storage is suppressed. When the gas adsorption device is installed in a vacuum device and the temperature is raised, the inner diameter of the joint containing the shape memory alloy increases, creating a space between the opening of the container and allowing adsorption of external gas . Moreover, since the surface which a joint contacts with the opening part of a container is comprised with the elastic body, airtightness is ensured by deform | transforming according to the shape of the opening part of a container.

  Since it is not necessary to enclose components other than the adsorbent in the container, the inside of the container can be closely packed with the adsorbent. Further, the joint including the shape memory alloy can have a simple shape such as a cylinder having openings at both ends. Therefore, the ratio of the volume of the gas adsorbent to the volume of the gas adsorption device can be increased. Therefore, it is possible to cope with a case where a large amount of gas adsorbing material is required because the space where the gas adsorbing device can be installed in the vacuum equipment is small and high vacuum is required.

  The invention of the gas adsorption device according to claim 17 is the invention according to claim 2, wherein a linear shape memory alloy is enclosed in a closed space formed by a container having an opening and a member covering the opening. It is what.

  Since the gas adsorbent is in a closed space formed by a member covering the container and the opening, there is little gas intrusion during storage, and deterioration of the gas adsorbent is suppressed. A part of the member covering the opening is made of a brittle material, and one end of a linear shape memory alloy is joined to the brittle material. The other end of the linear shape memory alloy is joined to the container so as not to bend.

  The linear shape memory alloy has a short length at the phase transformation temperature, but does not bend, and therefore applies a tensile force to the member covering the opening and the container. By this force, the member covering the opening is deformed. Therefore, a space is created between the opening of the container and the member covering the container, and external gas can be adsorbed.

  Here, the brittle material is one that is discontinuously deformed by slight deformation, and glass or the like corresponds to this. “Linear” means that one of the three-dimensional directions is extremely long, and a thread, a wire, or the like corresponds to this.

  The invention of the gas adsorption device according to claim 18 is the invention according to any one of claims 4 to 17, wherein the shape memory alloy is a Ni-Ti system.

  Ni-Ti alloys are the most industrially produced shape memory alloys. Therefore, the technical reliability is high, and the yield of manufacturing the gas adsorption device is improved. Therefore, the cost of the gas adsorption device can be reduced.

  The invention of the gas adsorption device according to claim 19 is the invention according to any one of claims 4 to 18, wherein the phase transformation temperature of the shape memory alloy is 50 ° C or higher and 100 ° C or lower. .

  The lower limit of the phase transformation temperature is 50 ° C., and since it is very rare to reach this temperature under normal circumstances, the shape memory alloy does not undergo phase transformation during storage and can be stored for a long time. . In addition, since the phase transformation occurs at 100 ° C or lower, damage to the vacuum equipment due to overheating after installation in the vacuum equipment can be reduced, energy required for heating can be kept low, and the overall cost of the vacuum equipment can be reduced. can do.

  The invention of the gas adsorption device according to claim 20 is the invention according to any one of claims 1 to 19, wherein the gas adsorbent is CuZSM-5.

  Since switching can be performed at an arbitrary atmospheric pressure, it is possible to effectively utilize the adsorption capacity of CuZSM-5, which is a very highly active gas adsorbent.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 is a cross-sectional view before switching of the gas adsorption device according to Embodiment 1 of the present invention. FIG. 2 is an explanatory diagram illustrating a change in size of the member covering the opening according to the first embodiment of the present invention before and after switching in the AA cross section in FIG. 1. FIG. 3 is a cross-sectional view after switching of the gas adsorption device according to Embodiment 1 of the present invention.

  As shown in FIGS. 1 to 3, the gas adsorption device 1 according to the present embodiment includes a gas adsorbent 2, a container 3 made of polyethylene terephthalate having a bottomed cylindrical shape containing the gas adsorbent 2 and one end opened. And a member 5 that is formed of an elastic body 6 made of butyl rubber, includes a shape memory alloy 7 and has an outer peripheral surface that is in close contact with the inner surface of the opening 4 of the container 3 and covers the opening 4 of the container 3. A space in the container 3 where the gas adsorbent 2 is present is sealed with a member 5 covering the opening 4 and vacuum-sealed.

  In addition, the shape memory alloy 7 has a shape in which a flat plate is bent into a ring shape so that both ends are substantially in contact with each other at room temperature, and the ring of the shape memory alloy 7 covers the opening 4. 5 embedded in the elastic body 6 made of butyl rubber along the cylindrical outer peripheral surface, and when a predetermined temperature rise change (temperature rise exceeding the phase transformation temperature of the shape memory alloy 7) occurs, The gap is widened and deformed from a ring shape to a substantially C shape.

  Further, on the outer peripheral surface in the vicinity of the opening 4 of the container 3, the depth is longer than the length of the member 5 covering the opening 4 in the length direction of the container 3 from the opening end of the container 3 and shallower than the thickness of the container 3. The groove is provided.

  When a predetermined temperature increase change (temperature increase equal to or higher than the phase transformation temperature of the shape memory alloy 7) occurs, the shape memory alloy 7 is deformed from a ring shape to a substantially C shape to cover the opening 4. As a result, the opening 4 of the container 3 is expanded by the member 5 covering the opening 4, so that the opening 4 of the container 3 and the member 5 covering the opening 4 are A space is formed so that the space in which the gas adsorbent 2 is present in the container 3 changes from a state where it is blocked from the space outside the container 3 to a state where it communicates with the space outside the container 3. ing.

  FIG. 4 is a cross-sectional view of a vacuum heat insulating material in which the gas adsorption device according to the first embodiment is included in a jacket material together with a core material.

  As shown in FIG. 4, the vacuum heat insulating material 8 is obtained by covering the gas adsorbing device 1 and the core material 9 with a jacket material 10 and sealing the inside of the jacket material 10 under reduced pressure.

  Regarding the gas adsorption device 1 of the present embodiment configured as described above, the operation and action of the gas adsorption device 1 will be described below.

  Initially, the gas adsorbent 2 is vacuum-sealed in a closed space formed by a container 3 and a member 5 that covers the opening 4 of the container 3.

  Therefore, even if the gas adsorbing device 1 is left in the atmosphere for a long time, the gas adsorbing material 2 does not touch the gas, so that it does not deteriorate and can be stored in the air for a long time.

  When the gas adsorbing device 1 is stored, the member 5 covering the opening 4 is in close contact with the container 3 by the elastic force of the elastic body 6 to ensure hermeticity.

  After sealing the gas adsorbing device 1 together with the core material 9 in the envelope material 10 under reduced pressure, the vacuum heat insulating material 8 is heated to raise the temperature of the gas adsorbing device 1 (below the phase transformation temperature of the shape memory alloy 7). 2), the contact of the shape memory alloy 7 is released, and the cross section is deformed from a ring shape to a substantially C shape as shown in FIG. This increases the apparent diameter of the shape memory alloy 7. The elastic body 6 in contact with the shape memory alloy 7 receives a force spreading outward. Further, the elastic body 6 applies a force to push the container 3 in close contact. As a result, the container 3 is deformed, the groove provided on the outer peripheral surface near the opening 4 of the container 3 is torn, and a space (gap) is formed between the opening 4 of the container 3 and the member 5 covering the opening 4. As a result, the gas adsorbing material 2 can adsorb an external gas (a space between the outer covering material 10 and the gas adsorbing device 1).

  With the mechanism as described above, the gas adsorbent 2 can be applied to the vacuum heat insulating material 8 without deterioration in both cases of storage and application to the vacuum heat insulating material 8. It is possible to maintain the degree of vacuum over a long period of time.

  The gas adsorption device 1 according to the first embodiment includes a gas adsorbent 2 and a container 3 containing the gas adsorbent 2, and a predetermined temperature change (a temperature rise that is equal to or higher than the phase transformation temperature of the shape memory alloy 7). When the change occurs, the space in which the gas adsorbent 2 in the container 3 exists changes from a state where it is blocked from the space outside the container 3 to a state where it communicates with the space outside the container 3. From the state where the space where the gas adsorbent 2 in the container 3 exists is blocked from the space outside the container 3 to the state where the space where the gas adsorbent 2 inside the container 3 exists communicates with the space outside the container 3. Since this change occurs due to a change in the predetermined temperature, when the gas adsorbent 2 is applied to a vacuum apparatus, it is not necessary to control factors other than the temperature, and productivity can be improved.

  In addition, since the gas adsorption device 1 can be switched by controlling the temperature after application to the vacuum equipment, it is possible to switch even if it is impossible to apply force from outside the housing of the vacuum equipment.

  Further, after the gas adsorption device 1 is sealed in the vacuum device 8, the temperature of the internal gas adsorption device 1 is also changed by changing the temperature, and can be switched by reaching a predetermined temperature. The adsorption device 1 can be deformed without applying a force to release the hermeticity of the container 3 and exhibit the adsorption ability.

  In addition, since the gas adsorption device 1 is switched depending on the temperature, it is only necessary to control the atmospheric temperature at the time of installation in the vacuum equipment, and the switching can be performed in any situation. Therefore, even when the vacuum device casing is not deformed and a force cannot be applied from the outside, it can be switched.

  Moreover, the gas adsorption | suction device 1 is installed in a vacuum equipment, and the switching after sealing a vacuum equipment is possible. Therefore, gas that does not need to be adsorbed, that is, gas outside the vacuum device is not adsorbed, and deterioration of the gas adsorbent 2 during storage and application to the vacuum device can be prevented. Further, since the shape memory alloy 7 has a large generated force per unit weight, the gas adsorption device 1 can be downsized by using the shape memory alloy 7.

  In the gas adsorption device 1 according to the first embodiment, the container 3 has an opening 4, and the opening 4 is covered with a member 5 that covers the opening 4.

  When the closed space is formed by the opening 4 and the member 5 that covers the opening 4, the gas can be prevented from entering the space where the gas adsorbent 2 exists and the deterioration of the gas adsorbent 2 can be suppressed. .

  On the other hand, in order for the gas adsorbent 2 to adsorb gas, it is necessary for the gas to enter the periphery of the gas adsorbent 2. This is done due to the difference in temperature change rate between the opening 4 and the member 5 covering the opening 4. In this embodiment, the member 5 covering the opening 4 expands to open and widen the opening 4. A gap is formed between the portion 4 and the member 5 covering the opening 4 so that gas can pass therethrough.

  Therefore, if a switching method by changing the temperature after the gas adsorbing material 2 is installed inside the vacuum device is used, deterioration during storage can be suppressed and gas can be adsorbed inside the vacuum device.

  Further, in the gas adsorption device 1 according to the first embodiment, the temperature change rate of at least one element (the temperature change rate of the member 5 covering the opening 4) among the components is the temperature change rate of the other components. This is different from the (temperature change rate of the opening 4).

  At normal temperature, the components of the gas adsorption device 1 are in close contact with each other to form a closed space, so that the gas does not enter the closed space where the gas adsorbent 2 exists, and the gas adsorbent 2 deteriorates during storage. Can be suppressed.

  When the temperature of the gas adsorbing device 1 changes, a space (gap) is created in the closely contacting portion at room temperature, and external gas can be adsorbed.

  Further, in the gas adsorption device 1 according to the first embodiment, at least a part of at least one element (the member 5 covering the opening 4) is the shape memory alloy 7, and the gas adsorption device 1 can be switched more. Surely done. In addition, since the temperature change rate other than the phase transformation temperature is small, switching is not performed due to slight temperature fluctuations, and handling during storage becomes easy.

  Further, the shape memory alloy 7 has a different phase transformation temperature depending on the composition. Further, when the shape memory alloy 7 is used for switching the gas adsorption device 1, the switching temperature of the gas adsorption device 1 is equal to the phase transformation temperature of the shape memory alloy. Therefore, the switching temperature of the gas adsorption device 1 can be controlled by using the shape memory alloy 7 having an appropriate phase transformation temperature.

  In the gas adsorption device 1 according to the first embodiment, the member 5 covering the opening 4 is an elastic body 6 including a shape memory alloy 7.

  When the gas adsorbing device 1 is stored, the member 5 covering the opening 4 is in contact with the opening 4 via the elastic body 6. The elastic body 6 is deformed according to the shape of the object to be contacted, and is in close contact with the opening 4 to form a closed space, so that gas intrusion is suppressed and deterioration of the gas adsorbent 2 during storage is suppressed. be able to.

  Since the shape memory alloy 7 is in contact with the elastic body 6, when the shape memory alloy 7 is deformed, the elastic body 6 is also deformed. Therefore, the temperature change rate of the member 5 covering the opening 4 is increased. When the shape memory alloy 7 reaches the phase transformation temperature, the member 5 covering the opening 4 is deformed, the hermeticity with the opening 4 is released, and external gas can be adsorbed.

  Further, in the gas adsorption device 1 of the first embodiment, the apparent volume of the elastic body 6 of the member 5 covering the opening 4 is increased by the phase transformation of the shape memory alloy 7.

  When the gas adsorption device 1 is stored, the elastic body 6 of the member 5 covering the opening 4 is deformed according to the shape of the opening 4 of the container 3, and the opening 4 of the container 3 applies pressure from the elastic body 6. is recieving. When the shape memory alloy 7 undergoes phase transformation, the pressure applied from the elastic body 6 increases, and the apparent volume of the elastic body 6 increases, so that the pressure applied to the opening 4 of the container 3 increases. As a result, the container 3 is deformed, and a space (gap) is generated between the opening 4 and the member 5 covering the opening 4, and external gas can be adsorbed.

(Embodiment 2)
FIG. 5 is a cross-sectional view before switching the gas adsorption device according to the second embodiment of the present invention. FIG. 6 is an explanatory diagram showing a change in size of the member covering the opening according to the second embodiment of the present invention before and after switching in the BB cross section in FIG. 5. FIG. 7 is a cross-sectional view after switching the gas adsorption device according to the second embodiment of the present invention.

  As shown in FIGS. 5 to 7, the gas adsorbing device 1 of the present embodiment includes a gas adsorbing material 2 and a container 3 made of polyethylene terephthalate having a bottomed cylindrical shape containing the gas adsorbing material 2 and having one end opened. And a member 5 that is composed of an elastic body 6 made of butyl rubber, includes a shape memory alloy 7 and has a cylindrical shape whose outer peripheral surface is in close contact with the inner surface of the opening 4 of the container 3, and covers the opening 4 of the container 3, A space in the container 3 where the gas adsorbent 2 is present is sealed with a member 5 covering the opening 4 and vacuum-sealed.

  In addition, the shape memory alloy 7 has a shape of a flat plate bent at a normal temperature so that the cross section is substantially C-shaped, and the substantially C-shape of the shape memory alloy 7 covers the opening 4. When embedded in the elastic body 6 made of butyl rubber along the cylindrical outer peripheral surface of the member 5 and a predetermined temperature rise change (temperature rise exceeding the phase transformation temperature of the shape memory alloy 7) occurs, both ends The cross section is deformed into a circular shape (ring shape) to such an extent that the distance between the two ends is reduced and both ends are substantially in contact with each other.

  When a predetermined temperature increase change (temperature increase equal to or higher than the phase transformation temperature of the shape memory alloy 7) occurs, the shape memory alloy 7 is deformed from a substantially C shape into a ring shape and covers the opening 4. As a result, a space is formed between the opening 4 of the container 3 and the member 5 covering the opening 4 so that the space in which the gas adsorbent 2 is present in the container 3 is the container 3. It changes so that it may change from the state interrupted | blocked by the outer space of this to the state connected with the outer space of the container 3. FIG.

  In the present embodiment and the first embodiment, the shape change due to a predetermined temperature rise change of the shape memory alloy 7 is opposite (the shape memory alloy 7 of the first embodiment is substantially C-shaped from a ring shape with a predetermined temperature rise change. The shape memory alloy 7 of Embodiment 2 changes from a substantially C shape to a ring shape with a predetermined temperature rise change), and when the shape memory alloy 7 changes shape with a predetermined temperature rise change In the first embodiment, the outer diameter of the member 5 covering the opening 4 is larger than the initial inner diameter of the opening 4 of the container 3 (before the temperature rise change), whereas in the second embodiment, the opening is opened. The difference is only in that the outer diameter of the member 5 covering the portion 4 is smaller than the inner diameter of the opening 4 of the container 3, and the other configurations are the same.

  Regarding the gas adsorption device 1 of the present embodiment configured as described above, the operation and action of the gas adsorption device 1 will be described below.

  Initially, the gas adsorbent 2 is vacuum-sealed in a closed space formed by a container 3 and a member 5 that covers the opening 4 of the container 3.

  Therefore, even if the gas adsorbing device 1 is left in the atmosphere for a long time, the gas adsorbing material 2 does not touch the gas, so that it does not deteriorate and can be stored in the air for a long time.

  When the gas adsorbing device 1 is stored, the member 5 covering the opening 4 is in close contact with the container 3 by the elastic force of the elastic body 6 to ensure hermeticity.

  After sealing the gas adsorbing device 1 together with the core material 9 in the envelope material 10 under reduced pressure, the vacuum heat insulating material 8 is heated to raise the temperature of the gas adsorbing device 1 (below the phase transformation temperature of the shape memory alloy 7). As the temperature rises, both ends of the shape memory alloy 7 approach each other, and as shown in FIG. 6, the cross section is deformed from a substantially C shape to a ring shape. As a result, the apparent diameter of the shape memory alloy 7 is reduced. The elastic body 6 in contact with the shape memory alloy 7 receives a force that narrows inward, and the outer diameter of the member 5 that covers the opening 4 is reduced. As a result, the opening 4 of the container 3 and the opening 4 are covered. A space is generated between the member 5 and the gas adsorbing material 2 can adsorb an external gas (a space between the covering material 10 and the gas adsorbing device 1).

  With the mechanism as described above, the gas adsorbent 2 can be applied to the vacuum heat insulating material 8 without deterioration in both cases of storage and application to the vacuum heat insulating material 8. It is possible to maintain the degree of vacuum over a long period of time.

  The gas adsorption device 1 according to the second embodiment includes a gas adsorbent 2 and a container 3 that encloses the gas adsorbent 2, and a predetermined temperature change (a temperature rise that is equal to or higher than the phase transformation temperature of the shape memory alloy 7). When the change occurs, the space in which the gas adsorbent 2 in the container 3 exists changes from a state where it is blocked from the space outside the container 3 to a state where it communicates with the space outside the container 3. From the state where the space where the gas adsorbent 2 in the container 3 exists is blocked from the space outside the container 3 to the state where the space where the gas adsorbent 2 inside the container 3 exists communicates with the space outside the container 3. Since this change occurs due to a change in the predetermined temperature, when the gas adsorbent 2 is applied to a vacuum apparatus, it is not necessary to control factors other than the temperature, and productivity can be improved.

  In addition, since the gas adsorption device 1 can be switched by controlling the temperature after application to the vacuum equipment, it is possible to switch even if it is impossible to apply force from outside the housing of the vacuum equipment.

  Further, after the gas adsorption device 1 is sealed in the vacuum device 8, the temperature of the internal gas adsorption device 1 is also changed by changing the temperature, and can be switched by reaching a predetermined temperature. The adsorption device 1 can be deformed without applying a force to release the hermeticity of the container 3 and exhibit the adsorption ability.

  In addition, since the gas adsorption device 1 is switched depending on the temperature, it is only necessary to control the atmospheric temperature at the time of installation in the vacuum equipment, and the switching can be performed in any situation. Therefore, even when the vacuum device casing is not deformed and a force cannot be applied from the outside, it can be switched.

  Moreover, the gas adsorption | suction device 1 is installed in a vacuum equipment, and the switching after sealing a vacuum equipment is possible. Therefore, gas that does not need to be adsorbed, that is, gas outside the vacuum device is not adsorbed, and deterioration of the gas adsorbent 2 during storage and application to the vacuum device can be prevented. Further, since the shape memory alloy 7 has a large generated force per unit weight, the gas adsorption device 1 can be downsized by using the shape memory alloy 7.

  In the gas adsorption device 1 according to the second embodiment, the container 3 has an opening 4, and the opening 4 is covered with a member 5 that covers the opening 4.

  When the closed space is formed by the opening 4 and the member 5 that covers the opening 4, the gas can be prevented from entering the space where the gas adsorbent 2 exists and the deterioration of the gas adsorbent 2 can be suppressed. .

  On the other hand, in order for the gas adsorbent 2 to adsorb gas, it is necessary for the gas to enter the periphery of the gas adsorbent 2. This is done due to the difference in temperature change rate between the opening 4 and the member 5 covering the opening 4. In this embodiment, the member 5 covering the opening 4 is reduced, and the opening 4 and the opening A gap is generated between the members 5 that cover 4, and gas can pass therethrough.

  Therefore, if a switching method by changing the temperature after the gas adsorbing material 2 is installed inside the vacuum device is used, deterioration during storage can be suppressed and gas can be adsorbed inside the vacuum device.

  Further, in the gas adsorption device 1 according to the second embodiment, the temperature change rate of at least one of the components (the temperature change rate of the member 5 covering the opening 4) is the temperature change rate of the other components. This is different from the (temperature change rate of the opening 4).

  At normal temperature, the components of the gas adsorption device 1 are in close contact with each other to form a closed space, so that the gas does not enter the closed space where the gas adsorbent 2 exists, and the gas adsorbent 2 deteriorates during storage. Can be suppressed.

  When the temperature of the gas adsorbing device 1 changes, a space (gap) is created in the closely contacting portion at room temperature, and external gas can be adsorbed.

  Further, in the gas adsorption device 1 of the second embodiment, at least a part of at least one element (the member 5 covering the opening 4) is the shape memory alloy 7, and the gas adsorption device 1 can be switched more. Surely done. In addition, since the temperature change rate other than the phase transformation temperature is small, switching is not performed due to slight temperature fluctuations, and handling during storage becomes easy.

  Further, the shape memory alloy 7 has a different phase transformation temperature depending on the composition. Further, when the shape memory alloy 7 is used for switching the gas adsorption device 1, the switching temperature of the gas adsorption device 1 is equal to the phase transformation temperature of the shape memory alloy. Therefore, the switching temperature of the gas adsorption device 1 can be controlled by using the shape memory alloy 7 having an appropriate phase transformation temperature.

  In the gas adsorption device 1 according to the second embodiment, the member 5 covering the opening 4 is an elastic body 6 including a shape memory alloy 7.

  When the gas adsorbing device 1 is stored, the member 5 covering the opening 4 is in contact with the opening 4 via the elastic body 6. The elastic body 6 is deformed according to the shape of the object to be contacted, and is in close contact with the opening 4 to form a closed space, so that gas intrusion is suppressed and deterioration of the gas adsorbent 2 during storage is suppressed. be able to.

  Since the shape memory alloy 7 is in contact with the elastic body 6, when the shape memory alloy 7 is deformed, the elastic body 6 is also deformed. Therefore, the temperature change rate of the member 5 covering the opening 4 is increased. When the shape memory alloy 7 reaches the phase transformation temperature, the member 5 covering the opening 4 is deformed, the hermeticity with the opening 4 is released, and external gas can be adsorbed.

  Further, in the gas adsorption device 1 of the second embodiment, the apparent volume of the elastic body 6 of the member 5 covering the opening 4 is reduced by the phase transformation of the shape memory alloy 7.

  When the gas adsorption device 1 is stored, the elastic body 6 of the member 5 that covers the opening 4 is deformed according to the shape of the opening 4 of the container 3 to ensure sealing. When the shape memory alloy 7 undergoes phase transformation, the force applied to the elastic body 6 of the member 5 covering the opening 4 is weakened, the apparent volume of the member 5 (elastic body 6) covering the opening 4 is reduced, and the opening 4 and a member 5 that covers the opening 4, a space is created, and external gas can be adsorbed.

(Embodiment 3)
FIG. 8 is a cross-sectional view before switching of the gas adsorption device according to Embodiment 3 of the present invention. FIG. 9 is a cross-sectional view after switching the gas adsorption device according to Embodiment 3 of the present invention.

  As shown in FIGS. 8 and 9, the gas adsorbing device 1 according to the present embodiment includes a gas adsorbing material 2 and a container 3 made of polyethylene terephthalate having a bottomed cylindrical shape containing the gas adsorbing material 2 and having an open end. A member 5 that covers the opening 4 made of a laminate film excellent in gas barrier properties laminated in the order of polyethylene terephthalate film, aluminum foil, polyethylene terephthalate film, and joined to the opening 4 of the container 3 by a known method; The space in which the gas adsorbent 2 and the shape memory alloy 7 in the container 3 exist is sealed with a member 5 that covers the opening 4. And vacuum sealed.

  The shape memory alloy 7 has a protrusion at one end on the side of the member 5 that covers the opening 4 in a spring shape, and the spring of the shape memory alloy 7 is contracted at room temperature, and the protrusion covers the opening 4. Even when the protrusion 5 is not in contact with the member 5 or the protrusion is in contact with the member 5 covering the opening 4, a force sufficient to cause the protrusion to break through the laminate film of the member 5 covering the opening 4 is not applied. When a predetermined temperature rise change (temperature rise equal to or higher than the phase transformation temperature of the shape memory alloy 7) occurs, the spring of the shape memory alloy 7 is extended, and the end opposite to the protrusion is the container. 3 is in contact with the step 11 portion in the vicinity of the opening 4 in the region 3, and thereafter, the step 11 portion moves in a direction in which the end opposite to the spring protrusion of the shape memory alloy 7 is away from the opening 4 of the container 3. To prevent. Further, the protrusion of the shape memory alloy 7 spring comes into contact with the member 5 covering the opening 4, and as the spring of the shape memory alloy 7 extends, the force by which the protrusion pierces the member 5 covering the opening 4 increases. The protrusions are configured to break through the laminate film of the member 5 covering the opening 4.

  The present embodiment is different from the first embodiment or the second embodiment in the shape of the member 5 covering the opening 4 (fixing means to the opening 4) and the material, and the first embodiment or the second embodiment. Then, the shape memory alloy 7 in the member 5 covering the opening 4 is changed from the shape 5 of the shape memory alloy 7 independently of the member 5 covering the opening 4 in this embodiment. The form is different only in that a shape memory alloy 7 is newly held and a step 11 that restricts the expansion and contraction operation of the shape memory alloy 7 is provided, and the other configurations are the same.

  Regarding the gas adsorption device 1 of the present embodiment configured as described above, the operation and action of the gas adsorption device 1 will be described below.

  Initially, the gas adsorbent 2 is vacuum-sealed in a closed space formed by a container 3 and a member 5 that covers the opening 4 of the container 3.

  Therefore, even if the gas adsorbing device 1 is left in the atmosphere for a long time, the gas adsorbing material 2 does not touch the gas, so that it does not deteriorate and can be stored in the air for a long time.

  When the gas adsorption device 1 is stored (when stored at room temperature), the shape memory alloy 7 is between the member 5 covering the opening 4 and the step 11 portion, and the protrusion of the shape memory alloy 7 is the opening. The laminate film of the member 5 covering 4 is not broken through.

  After the gas adsorption device 1 is installed in a vacuum device, the shape memory alloy 7 becomes longer as the temperature rises to the phase transformation temperature of the shape memory alloy 7. Since the shape memory alloy 7 cannot move further to the step 11 side after the end of the shape memory alloy 7 on the side opposite to the projection contacts the step 11 portion, the shape memory alloy 7 covers the opening 4. It extends toward the member 5. And the protrusion part of the spring of shape memory alloy 7 contact | abuts to the member 5 which covers the opening part 4, and the force which a protrusion part pierces the member 5 which covers the opening part 4 becomes large as the spring of the shape memory alloy 7 expands, and eventually. The protrusions break through the laminate film of the member 5 covering the opening 4, and a through hole is formed in the member 5 covering the opening 4. The gas adsorbing material 2 is outside the gas adsorbing device 1 (the gas adsorbing device 1 is connected to the core 9. At the same time, when the envelope material 10 is sealed under reduced pressure, the gas in the space between the envelope material 10 and the gas adsorption device 1 can be adsorbed.

  The gas adsorption device 1 according to the third embodiment includes a gas adsorbent 2 and a container 3 that encloses the gas adsorbent 2, and a predetermined temperature change (a temperature rise that is equal to or higher than the phase transformation temperature of the shape memory alloy 7). When the change occurs, the space in which the gas adsorbent 2 in the container 3 exists changes from a state where it is blocked from the space outside the container 3 to a state where it communicates with the space outside the container 3. From the state where the space where the gas adsorbent 2 in the container 3 exists is blocked from the space outside the container 3 to the state where the space where the gas adsorbent 2 inside the container 3 exists communicates with the space outside the container 3. Since this change occurs due to a change in the predetermined temperature, when the gas adsorbent 2 is applied to a vacuum apparatus, it is not necessary to control factors other than the temperature, and productivity can be improved.

  In addition, since the gas adsorption device 1 can be switched by controlling the temperature after application to the vacuum equipment, it is possible to switch even if it is impossible to apply force from outside the housing of the vacuum equipment.

  Further, after the gas adsorption device 1 is sealed in the vacuum device 8, the temperature of the internal gas adsorption device 1 is also changed by changing the temperature, and can be switched by reaching a predetermined temperature. The adsorption device 1 can be deformed without applying a force to release the hermeticity of the container 3 and exhibit the adsorption ability.

  In addition, since the gas adsorption device 1 is switched depending on the temperature, it is only necessary to control the atmospheric temperature at the time of installation in the vacuum equipment, and the switching can be performed in any situation. Therefore, even when the vacuum device casing is not deformed and a force cannot be applied from the outside, it can be switched.

  Moreover, the gas adsorption | suction device 1 is installed in a vacuum equipment, and the switching after sealing a vacuum equipment is possible. Therefore, gas that does not need to be adsorbed, that is, gas outside the vacuum device is not adsorbed, and deterioration of the gas adsorbent 2 during storage and application to the vacuum device can be prevented. Further, since the shape memory alloy 7 has a large generated force per unit weight, the gas adsorption device 1 can be downsized by using the shape memory alloy 7.

  In the gas adsorption device 1 according to the third embodiment, the container 3 has an opening 4, and the opening 4 is covered with a member 5 that covers the opening 4.

  When the closed space is formed by the opening 4 and the member 5 that covers the opening 4, the gas can be prevented from entering the space where the gas adsorbent 2 exists and the deterioration of the gas adsorbent 2 can be suppressed. .

  In addition, the gas adsorption device 1 according to the third embodiment includes at least a shape memory alloy 7 in a closed space formed by a container 3 and a member 5 that covers the opening 4 of the container 3.

  The shape memory alloy 7 contained in the closed space formed by the member 5 that covers the container 3 and the opening 4 becomes longer due to the phase transformation, and the member 5 that covers the inside of the container 3 or the opening 4 and the shape memory alloy If the shape memory alloy 7 is not fully extended even if the contact 7 is made, the shape memory alloy 7 applies a force to the member 5 covering the container 3 and the opening 4 via the contact. When the member 5 covering the opening 4 is deformed by this force and a through hole is generated, external gas can be adsorbed.

  In order to generate an external gas flow path by the shape memory alloy 7, there are a method of deforming the member 5 covering the opening 4 and a method of detaching the member 5 covering the opening 4 from the container 3. By using a technique that requires a small force, the generated force required for the shape memory alloy 7 can be reduced. Therefore, the cost of the gas adsorption device 1 can be reduced.

  Further, in the gas adsorption device 1 according to the third embodiment, the shape memory alloy 7 has a spring shape.

  The shape of the spring-like shape memory alloy 7 contained in the closed space formed by the container 3 or the member 5 that covers the container 3 and the opening 4 of the container 3 becomes longer due to the phase transformation, and the shape inside the container 3 If the spring-shaped shape memory alloy does not extend even when the memory alloy 7 comes into contact, the spring-shaped shape memory alloy 7 applies a force to the member 5 covering the container 3 and the opening 4 via the contact. Become. When this force is applied to the member 5 that covers the opening 4, the member 5 that covers the opening 4 is deformed, and when a through hole is formed, external gas can be adsorbed.

  Since the shape memory alloy 7 is spring-shaped, a stroke that greatly increases the amount of deformation of the shape memory alloy 7 as a bulk can be obtained.

  Here, the shape of the spring is not limited, and includes a leaf spring, a coil spring, a bamboo shoot spring, a spiral spring, a ring spring, a disc spring, and the like.

  In addition, the gas adsorption device 1 of the third embodiment has a protrusion on at least one of the shape memory alloy 7 or a member bonded to the shape memory alloy 7.

  Since at least one of the shape memory alloy 7 or the member bonded to the shape memory alloy 7 has the protrusion, the force per unit area that the shape memory alloy 7 applies to the member 5 that covers the opening 4 of the container 3 is increased. Therefore, a through-hole is easily generated in the member 5 covering the opening 4.

  Thereby, even if it is a case where the shape memory alloy 7 with small generating force is used, a through-hole can be made to the member 5 which covers the opening part 4, and external gas can be adsorb | sucked.

  Further, in the gas adsorption device 1 according to the third embodiment, the member 5 covering the opening 4 is a film or sheet excellent in gas barrier properties.

  Since the member 5 covering the opening 4 is a film having excellent gas barrier properties, the gas adsorbent 2 can be prevented from being deteriorated with little gas penetration during storage. On the other hand, since the member 5 that covers the opening 4 is a film, a penetrating force is applied, so that a through hole is easily generated, and external gas can be adsorbed.

(Embodiment 4)
FIG. 10 is a cross-sectional view before switching of the gas adsorption device according to Embodiment 4 of the present invention. FIG. 11 is a cross-sectional view after switching the gas adsorption device according to the fourth embodiment of the present invention.

  As shown in FIGS. 10 and 11, the gas adsorption device 1 of the present embodiment holds a gas adsorbent 2 made of CuZSM-5, a shape memory alloy 7, a shape memory alloy 7 and a shape memory alloy 7. The bottomed cylindrical support body 12 provided with a step that restricts the expansion and contraction operation of the inside is put in a container 3 in which a film is laminated in the order of low density polyethylene, aluminum foil, polyethylene terephthalate from the inner layer side, The inside of the container 3 is sealed by reducing the pressure to a substantially vacuum.

  The support 12 is arranged so that the opening of the support 12 is covered with the container 3 so that the gas adsorbent 2 does not enter the support 12.

  The shape memory alloy 7 is made of Ni—Ti, has a phase transformation temperature of 70 ° C., has a spring shape, and has a protrusion at one end on the container 3 side that covers the opening of the support 12. In the shape memory alloy 7, at room temperature, the spring of the shape memory alloy 7 is contracted, and the protrusion is not in contact with the container 3 covering the opening of the support 12, or the protrusion is an opening of the support 12. Even when the container 3 is in contact with the container 3, it is in a state where a force sufficient to break the container 3 is not applied, and when the temperature of the shape memory alloy 7 rises to 70 ° C. or more, which is a phase transformation temperature. Then, the spring of the shape memory alloy 7 is extended, and the end portion on the opposite side to the protruding portion comes into contact with the stepped portion of the support 12, and thereafter, the stepped portion is on the side opposite to the protruding portion of the spring of the shape memory alloy 7. The end portion is prevented from moving away from the container 3 covering the opening of the support 12. Further, the protrusion of the shape memory alloy 7 spring contacts the container 3 covering the opening of the support 12, and the protrusion pierces the container 3 covering the opening of the support 12 as the spring of the shape memory alloy 7 extends. The force is increased, and the projection portion is configured to break through the container 3 that covers the opening of the support 12 over time.

  In the present embodiment and the third embodiment, the material and shape of the container 3 are changed. In the third embodiment, the shape memory alloy 7 is held in the container 3 and the expansion and contraction operation of the shape memory alloy 7 is limited. In contrast to the step 11, in the present embodiment, the shape memory alloy 7 is held on the support 12 that is to be newly put in the container 3 together with the gas adsorbent 2 and the shape memory alloy 7 is expanded and contracted. The present embodiment is different only in that the material of the shape memory alloy 7 and the phase transformation temperature are clarified, and the other configurations are the same.

  Regarding the gas adsorption device 1 of the present embodiment configured as described above, the operation and action of the gas adsorption device 1 will be described below.

  At first, since the gas adsorbent 2 is vacuum-sealed in a container 3 made of a laminate film having excellent gas barrier properties, the gas adsorbent 2 is gas even if the gas adsorbing device 1 is left in the atmosphere for a long time. It can be stored in the atmosphere for a long time without deterioration. At this time, the container 3 is highly flexible due to its shape and comes into close contact with the object (the gas adsorbent 2 and the support 12) that is deformed and contained by atmospheric pressure, but the protrusion of the shape memory alloy 7 The portion is inside the support 12 and does not contact the container 3, or even if it contacts the container 3, it is in a state where a force sufficient to break the container 3 is not applied. Don't break the bag.

  If the temperature of the gas adsorption device 1 is set to 70 ° C. or more which is the phase transformation temperature of the shape memory alloy 7 after the gas adsorption device 1 is installed in the vacuum apparatus, the length of the shape memory alloy 7 becomes long. Then, the end opposite to the protrusion comes into contact with the stepped portion of the support 12, and thereafter the step opposite to the protrusion of the spring of the shape memory alloy 7 is the opening of the support 12. Is prevented from moving away from the container 3 covering the container. Further, the protrusion of the shape memory alloy 7 spring contacts the container 3 covering the opening of the support 12, and the protrusion pierces the container 3 covering the opening of the support 12 as the spring of the shape memory alloy 7 extends. As the force increases, the protrusions break through the container 3 that covers the opening of the support 12 and a through hole is formed in the container 3. The gas adsorbent 2 is outside the gas adsorbing device 1 (the gas adsorbing device 1 is the core material). 9 and the envelope material 10 under reduced pressure sealing, the gas in the space between the envelope material 10 and the gas adsorption device 1 can be adsorbed.

  The gas adsorption device 1 according to the fourth embodiment includes a gas adsorbent 2 and a container 3 that encloses the gas adsorbent 2, and a predetermined temperature change (a temperature rise that is equal to or higher than the phase transformation temperature of the shape memory alloy 7). When the change occurs, the space in which the gas adsorbent 2 in the container 3 exists changes from a state where it is blocked from the space outside the container 3 to a state where it communicates with the space outside the container 3. From the state where the space where the gas adsorbent 2 in the container 3 exists is blocked from the space outside the container 3 to the state where the space where the gas adsorbent 2 inside the container 3 exists communicates with the space outside the container 3. Since this change occurs due to a change in the predetermined temperature, when the gas adsorbent 2 is applied to a vacuum apparatus, it is not necessary to control factors other than the temperature, and productivity can be improved.

  In addition, since the gas adsorption device 1 can be switched by controlling the temperature after application to the vacuum equipment, it is possible to switch even if it is impossible to apply force from outside the housing of the vacuum equipment.

  Further, after the gas adsorption device 1 is sealed in the vacuum device 8, the temperature of the internal gas adsorption device 1 is also changed by changing the temperature, and can be switched by reaching a predetermined temperature. The adsorption device 1 can be deformed without applying a force to release the hermeticity of the container 3 and exhibit the adsorption ability.

  In addition, since the gas adsorption device 1 is switched depending on the temperature, it is only necessary to control the atmospheric temperature at the time of installation in the vacuum equipment, and the switching can be performed in any situation. Therefore, even when the vacuum device casing is not deformed and a force cannot be applied from the outside, it can be switched.

  Moreover, the gas adsorption | suction device 1 is installed in a vacuum equipment, and the switching after sealing a vacuum equipment is possible. Therefore, gas that does not need to be adsorbed, that is, gas outside the vacuum device is not adsorbed, and deterioration of the gas adsorbent 2 during storage and application to the vacuum device can be prevented. Further, since the shape memory alloy 7 has a large generated force per unit weight, the gas adsorption device 1 can be downsized by using the shape memory alloy 7.

  Further, the gas adsorption device 1 according to the fourth embodiment has at least the shape memory alloy 7 included in the closed space formed by the container 3.

  When the shape memory alloy 7 contained in the closed space formed by the container 3 becomes longer due to the phase transformation, and the shape memory alloy 7 is not fully extended even if the shape memory alloy 7 contacts the inside of the container 3 The shape memory alloy 7 applies a force to the container 3 through the contact. When the container 3 is deformed by this force and a through hole is formed, external gas can be adsorbed.

  Further, in the gas adsorption device 1 according to the fourth embodiment, the shape memory alloy 7 has a spring shape.

  Even if the spring-shaped shape memory alloy 7 contained in the closed space formed by the container 3 becomes longer due to the phase transformation and the inside of the container 7 and the shape memory alloy 7 come into contact with each other, the spring-shaped shape memory alloy 7 When 7 is not fully extended, the spring-shaped shape memory alloy 7 applies a force to the container 3 through the contact. When the container 3 is deformed and a through hole is generated, it is possible to adsorb an external gas.

  Since the shape memory alloy 7 is spring-shaped, a stroke that greatly increases the amount of deformation of the shape memory alloy 7 as a bulk can be obtained.

  Here, the shape of the spring is not limited, and includes a leaf spring, a coil spring, a bamboo shoot spring, a spiral spring, a ring spring, and a disc spring.

  Further, the gas adsorption device 1 according to the fourth embodiment has a protrusion on at least one of the shape memory alloy 7 or a member bonded to the shape memory alloy 7.

  Since at least one of the shape memory alloy 7 or the member bonded to the shape memory alloy 7 has the protrusion, the force per unit area that the shape memory alloy 7 applies to the container 3 increases. Therefore, a through hole is easily generated in the container 3.

  Thereby, even if it is a case where the shape memory alloy 7 with small generating force is used, a through-hole can be produced in the container 3 and external gas can be adsorbed.

  Moreover, the gas adsorption device 1 of this Embodiment 4 is a thing in which the container 3 bag-made the film excellent in gas barrier property.

  Since the container 3 is a film having excellent gas barrier properties, the gas adsorbent 2 can be prevented from deteriorating with little gas intrusion during storage. On the other hand, since the entire container 3 is a film, it is easily penetrated by the encapsulated shape memory alloy 7 so that external gas can be adsorbed.

  Further, the gas adsorption device 1 according to the fourth embodiment is such that the shape memory alloy 7 is in a space partitioned by the support 12.

  Even if the container 3 is made of a film, the shape memory alloy 7 is hollow, so that the object can be contained, and even when atmospheric pressure is applied, the deformation is small, and the support that prevents atmospheric pressure from being applied to the enclosed object. Since it is in the space delimited by 12, the shape memory alloy 7 can be prevented from being pressed against the container 3 even when the inside of the container 3 is decompressed. Therefore, the gas adsorption device 1 excellent in storability can be obtained.

  Further, in the gas adsorption device 1 of the fourth embodiment, the support 12 is cylindrical, and has an opening in at least one of them.

  Since the support 12 is cylindrical, the direction of the shape memory alloy 7 contained can be easily determined. When the aspect ratio of the shape memory alloy 7 is large, the length direction of the shape memory alloy 7 faces substantially the same direction as the length direction of the support 12. Therefore, by directing the protrusion of the shape memory alloy 7 toward the opening of the support 12 and defining the opening of the support 12, it is possible to direct the protrusion of the shape memory alloy 7 in a direction in which a through hole is likely to occur. It is. Therefore, external gas can be adsorbed through the through-hole generated by the shape memory alloy 7.

  Further, in the gas adsorption device 1 of the fourth embodiment, the shape memory alloy 7 is a Ni—Ti system.

  The Ni—Ti alloy has the most industrial production as the shape memory alloy 7. Therefore, the technical reliability is high, and the production yield of the gas adsorption device 1 is improved. Therefore, the cost of the gas adsorption device 1 can be reduced.

  Further, in the gas adsorption device 1 of the fourth embodiment, the phase transformation temperature of the shape memory alloy 7 is 50 ° C. or higher and 100 ° C. or lower.

  Although the lower limit of the phase transformation temperature is 50 ° C., it is very rare to reach a temperature of 50 ° C. under normal circumstances. Therefore, the shape memory alloy 7 does not undergo phase transformation during storage and should be stored for a long time. Is possible. In addition, since the phase transformation is performed at 100 ° C. or less, damage to the vacuum device 8 due to overheating after installation in the vacuum device 8 can be reduced, energy required for heating can be suppressed low, and the entire vacuum device 8 can be reduced. Cost can be reduced.

  Moreover, since the gas adsorption device 1 of this Embodiment 4 is what the gas adsorbent 2 is CuZSM-5 and can be switched by arbitrary atmospheric pressures, it is a very highly active gas adsorbent 2. It becomes possible to effectively utilize the adsorption ability of a certain CuZSM-5.

(Embodiment 5)
FIG. 12 is a cross-sectional view before switching the gas adsorption device according to the fifth embodiment of the present invention. FIG. 13 is a cross-sectional view after switching the gas adsorption device according to the fifth embodiment of the present invention.

  As shown in FIG. 12 and FIG. 13, the gas adsorption device 1 of the present embodiment is made of polyethylene terephthalate having two gas adsorbents 2 and a bottomed cylindrical shape containing each gas adsorbent 2 and having one end opened. From two containers 3 and a shape memory alloy 7 having a substantially cylindrical shape (substantially cylindrical shape having openings at both ends) having a butyl rubber sheet (elastic body 6) on an inner peripheral surface closely contacting the outer peripheral surface of the container 3. The openings of the two containers 3 each containing the gas adsorbent 2 face each other with a predetermined interval (an interval shorter than the length of the shape memory alloy 7) facing each other, and the gap between the openings of the two containers 3 is on the outer peripheral side. The space in which the gas adsorbent 2 is present in the container 3 is sealed with the shape memory alloy 7 covering the gap between the openings of the two containers 3 and vacuum sealed. It has been stopped.

  In addition, the shape memory alloy 7 has a shape in which a flat plate is bent into a ring shape so that both ends are substantially in contact with each other at room temperature, and an inner peripheral surface provided with a butyl rubber sheet is the container 3. It has a size capable of being in close contact with the outer peripheral surface, and when a predetermined temperature increase change (temperature increase exceeding the phase transformation temperature of the shape memory alloy 7) occurs, the distance between both ends of the shape memory alloy 7 increases. The inner diameter of the inner peripheral surface on which the butyl rubber sheet is provided by deforming from a ring shape to a substantially C shape is larger than the outer diameter of the outer peripheral surface of the container 3.

  Then, when a predetermined temperature rise change (temperature rise equal to or higher than the phase transformation temperature of the shape memory alloy 7) occurs, the inner diameter of the inner peripheral surface of the shape memory alloy 7 becomes larger than the outer diameter of the outer peripheral surface of the container 3. A space is formed between the shape memory alloy 7 covering the gap between the openings of the two containers 3 and the two containers 3, and the space in which the gas adsorbent 2 exists in the container 3 is outside the container 3. It is configured to change from a state blocked from the space to a state communicating with the space outside the container 3.

  In the present embodiment, two containers 3 containing the gas adsorbent 2 in the first embodiment are used, and the outer peripheral surface of the container 3 is used as the inner peripheral surface instead of the member 5 that covers the opening 4 in the first embodiment. It corresponds to the one using a substantially cylindrical shape memory alloy 7 that has a sheet made of butyl rubber in close contact with and covers the gap between the openings of the two containers 3 from the outer peripheral side.

  Regarding the gas adsorption device 1 of the present embodiment configured as described above, the operation and action of the gas adsorption device 1 will be described below.

  At first, the gas adsorbent 2 is vacuum-sealed in a closed space formed by two containers 3 and a shape memory alloy 7 that covers the gap between the openings of the two containers 3 from the outer peripheral side. Even if the adsorption device 1 is left in the atmosphere for a long time, the gas adsorbent 2 does not touch the gas, so that it does not deteriorate and can be stored in the atmosphere for a long time.

  When the gas adsorbing device 1 is stored, the member 5 covering the opening 4 is in close contact with the container 3 by the elastic force of the elastic body 6 to ensure hermeticity.

  When the temperature of the gas adsorption device 1 is increased to be equal to or higher than the phase transformation temperature of the shape memory alloy 7, the inner diameter of the shape memory alloy 7 is increased. As a result, the force by which the butyl rubber sheet is brought into close contact with the outer peripheral surface of the container 3 by the shape memory alloy 7 is reduced, and a gap is formed between the butyl rubber sheet on the inner peripheral surface of the shape memory alloy 7 and the two containers 3. The gas adsorbing material 2 is external (when the gas adsorbing device 1 is sealed under reduced pressure in the outer covering material 10 together with the core material 9, the space between the outer covering material 10 and the gas adsorbing device 1). The gas can be adsorbed.

  The gas adsorption device 1 according to the fifth embodiment includes a gas adsorbent 2 and a container 3 containing the gas adsorbent 2, and a predetermined temperature change (a temperature rise equal to or higher than the phase transformation temperature of the shape memory alloy 7). When the change occurs, the space in which the gas adsorbent 2 in the container 3 exists changes from a state where it is blocked from the space outside the container 3 to a state where it communicates with the space outside the container 3. From the state where the space where the gas adsorbent 2 in the container 3 exists is blocked from the space outside the container 3 to the state where the space where the gas adsorbent 2 inside the container 3 exists communicates with the space outside the container 3. Since this change occurs due to a change in the predetermined temperature, when the gas adsorbent 2 is applied to a vacuum apparatus, it is not necessary to control factors other than the temperature, and productivity can be improved.

  In addition, since the gas adsorption device 1 can be switched by controlling the temperature after application to the vacuum equipment, it is possible to switch even if it is impossible to apply force from outside the housing of the vacuum equipment.

  Further, after the gas adsorption device 1 is sealed in the vacuum device 8, the temperature of the internal gas adsorption device 1 is also changed by changing the temperature, and can be switched by reaching a predetermined temperature. The adsorption device 1 can be deformed without applying a force to release the hermeticity of the container 3 and exhibit the adsorption ability.

  In addition, since the gas adsorption device 1 is switched depending on the temperature, it is only necessary to control the atmospheric temperature at the time of installation in the vacuum equipment, and the switching can be performed in any situation. Therefore, even when the vacuum device casing is not deformed and a force cannot be applied from the outside, it can be switched.

  Moreover, the gas adsorption | suction device 1 is installed in a vacuum equipment, and the switching after sealing a vacuum equipment is possible. Therefore, gas that does not need to be adsorbed, that is, gas outside the vacuum device is not adsorbed, and deterioration of the gas adsorbent 2 during storage and application to the vacuum device can be prevented. Further, since the shape memory alloy 7 has a large generated force per unit weight, the gas adsorption device 1 can be downsized by using the shape memory alloy 7.

  Further, in the gas adsorption device 1 according to the fifth embodiment, the container 3 has an opening 4, and the opening 4 is an abbreviation having a member (an inner peripheral surface in close contact with the outer peripheral surface of the container 3 with a butyl rubber sheet). It is covered with a shape memory alloy 7) having a cylindrical shape (substantially cylindrical shape having openings at both ends).

  When a closed space is formed by the container 3 and a member that covers the opening 4 of the container 3 (a substantially cylindrical shape memory alloy 7 having a butyl rubber sheet on the inner peripheral surface in close contact with the outer peripheral surface of the container 3), gas adsorption Intrusion of gas into the space where the material 2 exists can be suppressed, and deterioration of the gas adsorbent 2 can be suppressed.

  On the other hand, in order for the gas adsorbent 2 to adsorb gas, it is necessary for the gas to enter the periphery of the gas adsorbent 2. This is the temperature change rate between the opening 4 of the container 3 and the member covering the opening 4 (substantially cylindrical shape memory alloy 7 having a butyl rubber sheet on the inner peripheral surface in close contact with the outer peripheral surface of the container 3). In the present embodiment, a member covering the opening 4 (a substantially cylindrical shape memory alloy 7 having a butyl rubber sheet on the inner peripheral surface closely contacting the outer peripheral surface of the container 3) is increased in the present embodiment. 3 and the inner peripheral surface of a member that covers the opening 4 (a substantially cylindrical shape memory alloy 7 having a butyl rubber sheet on the inner peripheral surface in close contact with the outer peripheral surface of the container 3). A gap is created between them, allowing gas to pass through.

  Therefore, if a switching method by changing the temperature after the gas adsorbent 2 is installed inside the vacuum device 8 is used, deterioration during storage can be suppressed and gas can be adsorbed inside the vacuum device 8.

  Further, the gas adsorption device 1 according to the fifth embodiment includes at least one element (a substantially cylindrical shape memory alloy 7 having a butyl rubber sheet on the inner peripheral surface thereof in close contact with the outer peripheral surface of the container 3. ) Is different from the temperature change rate of the other components (the container 3 opening 4).

  At normal temperature, the components of the gas adsorption device 1 are in close contact with each other to form a closed space, so that the gas does not enter the closed space where the gas adsorbent 2 exists, and the gas adsorbent 2 deteriorates during storage. Can be suppressed.

  When the temperature of the gas adsorbing device 1 changes, a space (gap) is created in the closely contacting portion at room temperature, and external gas can be adsorbed.

  Further, the gas adsorption device 1 according to the fifth embodiment has at least a part of at least one element (substantially cylindrical shape memory alloy 7 having a butyl rubber sheet on the inner peripheral surface thereof in close contact with the outer peripheral surface of the container 3). Is the shape memory alloy 7, and the gas adsorption device 1 can be switched more reliably. In addition, since the temperature change rate other than the phase transformation temperature is small, switching is not performed due to slight temperature fluctuations, and handling during storage becomes easy.

  Further, the shape memory alloy 7 has a different phase transformation temperature depending on the composition. Further, when the shape memory alloy 7 is used for switching the gas adsorption device 1, the switching temperature of the gas adsorption device 1 is equal to the phase transformation temperature of the shape memory alloy. Therefore, the switching temperature of the gas adsorption device 1 can be controlled by using the shape memory alloy 7 having an appropriate phase transformation temperature.

  Moreover, the gas adsorption device 1 of this Embodiment 5 joins the two containers 3 through the opening part 4 with the joint of the shape memory alloy 7 which included the elastic body 6 (butyl rubber sheet). is there.

  Since the gas adsorbing material 2 is in a closed space formed by the container 3 and a joint (a substantially cylindrical shape memory alloy 7 having a butyl rubber sheet on the inner peripheral surface in close contact with the outer peripheral surface of the container 3), Deterioration of is suppressed. When the gas adsorbing device 1 is installed in the vacuum device 8 and the temperature is raised, the inner diameter of the joint containing the shape memory alloy 7 is increased, and a space (gap) is created between the opening 4 of the container 3 and the outside. Gas adsorption. Further, the surface of the joint (substantially cylindrical shape memory alloy 7 having a butyl rubber sheet on the inner peripheral surface in close contact with the outer peripheral surface of the container 3) in contact with the opening 4 of the container 3 is an elastic body 6 (made of butyl rubber). Sheet), the airtightness is ensured by deformation according to the shape of the opening 4 of the container 3.

  Since it is not necessary to enclose components other than the gas adsorbent 2 in the container 3, the inside of the container 3 can be closely packed with the gas adsorbent 2, and the volume of the gas adsorbent 2 with respect to the volume of the gas adsorption device 1. The ratio of can be increased. Therefore, it is possible to cope with a case where a large amount of the gas adsorbent 2 is required because the space in which the gas adsorbing device 1 can be installed in the vacuum device 8 is small and a high vacuum is required.

(Embodiment 6)
FIG. 14 is a cross-sectional view before switching the gas adsorption device according to the sixth embodiment of the present invention. FIG. 15 is a cross-sectional view after switching the gas adsorption device according to the sixth embodiment of the present invention.

  As shown in FIGS. 14 and 15, the gas adsorbing device 1 of the present embodiment includes a gas adsorbing material 2, a container 3 made of polyethylene terephthalate having a bottomed cylindrical shape containing the gas adsorbing material 2 and one end opened. A member 5 that is formed of an elastic body 6 and has an outer peripheral surface that is in close contact with the inner surface of the opening 4 of the container 3 and covers the opening 4 of the container 3, and a shape memory alloy 7 held in the container 3; The space in which the gas adsorbent 2 and the shape memory alloy 7 in the container 3 exist is hermetically sealed with a member 5 that covers the opening 4 and is vacuum-sealed (or reduced-pressure sealed).

  In addition, the shape memory alloy 7 is a spring shape that expands and contracts in the length direction of the container 3, and one end on the side far from the opening 4 is held by the protrusion near the opening 4 in the container 3. In a state where the spring of the shape memory alloy 7 is contracted and the free end of the shape memory alloy 7 near the opening 4 (or the member 5 covering the opening 4) is not in contact with the member 5 covering the opening 4. Yes, when a predetermined temperature rise change (temperature rise equal to or higher than the phase transformation temperature of the shape memory alloy 7) occurs, the spring of the shape memory alloy 7 expands, and the opening 4 (or the opening 4 in the shape memory alloy 7). As the shape memory alloy 7 spring expands, the free end on the side close to the member 5) covering the opening 5 comes into contact with the member 5 covering the opening 4, and the spring 5 of the shape memory alloy 7 expands the member 5 covering the opening 4 to the opening 4. The force that pushes to the outside increases, and the spring of the shape memory alloy 7 opens the opening. When the force pushing the member 5 covering the opening 4 outward of the opening 4 exceeds the frictional force between the outer peripheral surface of the member 5 covering the opening 4 and the inner surface of the opening 4 of the container 3, the spring force of the shape memory alloy 7 Thus, the member 5 that covers the opening 4 is moved to the outside of the opening 4, and the member 5 that covers the opening 4 is eventually detached from the opening 4.

  In the present embodiment, instead of removing the shape memory alloy 7 from the member 5 covering the opening 4 in the first embodiment or the second embodiment, the shape memory alloy 7 is provided in the container 3, and the shape memory alloy 7 This corresponds to a configuration in which the member 5 covering the opening 4 is pushed to the outside of the opening 4 when the temperature becomes equal to or higher than the phase transformation temperature.

  Regarding the gas adsorption device 1 of the present embodiment configured as described above, the operation and action of the gas adsorption device 1 will be described below.

  At first, since the gas adsorbent 2 is vacuum-sealed in a closed space formed by the container 3 and the member 5 covering the opening 4 of the container 3, the gas adsorbing device 1 is left in the atmosphere for a long time. However, since the gas adsorbent 2 does not touch the gas, it does not deteriorate and can be stored in the atmosphere for a long time.

  When the gas adsorbing device 1 is stored (when stored at room temperature), the shape memory alloy 7 is not in contact with the member 5 covering the opening 4, and the member 5 covering the opening 4 has the opening 4 No force is applied to push the member 5 covering the outside to the outside of the opening 4.

  After the gas adsorption device 1 is installed in the vacuum apparatus, the shape memory alloy 7 becomes longer as the temperature rises to the phase transformation temperature of the shape memory alloy 7, but the end of the shape memory alloy 7 far from the opening 4. Is fixed to the protrusion in the container 3, the shape memory alloy 7 extends toward the member 5 covering the opening 4.

  Then, the free end of the shape memory alloy 7 near the opening 4 (or the member 5 covering the opening 4) abuts on the member 5 covering the opening 4, and the spring of the shape memory alloy 7 gradually becomes the opening 4. The force for pushing the member 5 covering the opening 4 to the outside of the opening 4 is increased, and the force for the spring of the shape memory alloy 7 to push the member 5 for covering the opening 4 to the outside of the opening 4 When the frictional force between the outer peripheral surface and the inner surface of the opening 4 of the container 3 is exceeded, the member 5 that covers the opening 4 is moved to the outside of the opening 4 by the spring force of the shape memory alloy 7, and eventually the opening The member 5 covering 4 is detached (detached) from the opening 4.

  As a result, the gas adsorbing material 2 is external to the gas adsorbing device 1 (if the gas adsorbing device 1 is sealed under reduced pressure in the outer covering material 10 together with the core material 9, It becomes possible to adsorb the gas in the space.

  The gas adsorption device 1 according to the sixth embodiment includes a gas adsorbent 2 and a container 3 containing the gas adsorbent 2, and a predetermined temperature change (a temperature rise equal to or higher than the phase transformation temperature of the shape memory alloy 7). When the change occurs, the space in which the gas adsorbent 2 in the container 3 exists changes from a state where it is blocked from the space outside the container 3 to a state where it communicates with the space outside the container 3. From the state where the space where the gas adsorbent 2 in the container 3 exists is blocked from the space outside the container 3 to the state where the space where the gas adsorbent 2 inside the container 3 exists communicates with the space outside the container 3. Since this change occurs due to a change in the predetermined temperature, when the gas adsorbent 2 is applied to a vacuum apparatus, it is not necessary to control factors other than the temperature, and productivity can be improved.

  In addition, since the gas adsorption device 1 can be switched by controlling the temperature after application to the vacuum equipment, it is possible to switch even if it is impossible to apply force from outside the housing of the vacuum equipment.

  Further, after the gas adsorption device 1 is sealed in the vacuum device 8, the temperature of the internal gas adsorption device 1 is also changed by changing the temperature, and can be switched by reaching a predetermined temperature. The adsorption device 1 can be deformed without applying a force to release the hermeticity of the container 3 and exhibit the adsorption ability.

  In addition, since the gas adsorption device 1 is switched depending on the temperature, it is only necessary to control the atmospheric temperature at the time of installation in the vacuum equipment, and the switching can be performed in any situation. Therefore, even when the vacuum device casing is not deformed and a force cannot be applied from the outside, it can be switched.

  Moreover, the gas adsorption | suction device 1 is installed in a vacuum equipment, and the switching after sealing a vacuum equipment is possible. Therefore, gas that does not need to be adsorbed, that is, gas outside the vacuum device is not adsorbed, and deterioration of the gas adsorbent 2 during storage and application to the vacuum device can be prevented. Further, since the shape memory alloy 7 has a large generated force per unit weight, the gas adsorption device 1 can be downsized by using the shape memory alloy 7.

  Further, in the gas adsorption device 1 of the sixth embodiment, the container 3 has the opening 4, and the opening 4 is covered with a member 5 that covers the opening 4.

  When the closed space is formed by the opening 4 and the member 5 that covers the opening 4, the gas can be prevented from entering the space where the gas adsorbent 2 exists and the deterioration of the gas adsorbent 2 can be suppressed. .

  In addition, the gas adsorption device 1 according to the sixth embodiment includes at least a shape memory alloy 7 in a closed space formed by a container 3 and a member 5 that covers the opening 4 of the container 3.

  The shape memory alloy 7 contained in the closed space formed by the member 5 that covers the container 3 and the opening 4 becomes longer due to the phase transformation, and the member 5 that covers the inside of the container 3 or the opening 4 and the shape memory alloy If the shape memory alloy 7 is not fully extended even if the contact 7 is made, the shape memory alloy 7 applies a force to the member 5 covering the container 3 and the opening 4 via the contact. When the member 5 covering the opening 4 is moved to the outside of the container 3 by this force and separated from the opening 4 of the container 5 container 3, the external gas can be adsorbed.

  Further, in the gas adsorption device 1 of the sixth embodiment, the shape memory alloy 7 has a spring shape.

  The spring-shaped shape memory alloy 7 contained in the closed space formed by the container 3 or the member 5 covering the container 3 and the opening 4 of the container 3 becomes longer due to the phase transformation, and the shape memory alloy 7 If the spring-shaped shape memory alloy 7 is not fully extended even if both ends are in contact with the inside of the container 3 and the member 5 covering the opening 4, the spring-shaped shape memory alloy 7 is connected to the container 3 and the opening via the contacts. A force is applied to the member 5 covering 4. When this force is applied to the member 5 that covers the opening 4, it acts as a force that separates the member 5 that covers the opening 4 from the opening. When the member 5 covering the opening 4 moves to the outside of the container 3 and separates from the opening 4 of the container 5 container 3 that covers the opening 4, external gas can be adsorbed.

  Since the shape memory alloy 7 is spring-shaped, a stroke that greatly increases the amount of deformation of the shape memory alloy as 7 bulk can be obtained.

  Here, the shape of the spring is not limited, and includes a leaf spring, a coil spring, a bamboo shoot spring, a spiral spring, a ring spring, and a disc spring.

(Embodiment 7)
FIG. 16 is a cross-sectional view before switching the gas adsorption device according to the seventh embodiment of the present invention. FIG. 17 is a cross-sectional view after switching the gas adsorption device according to the seventh embodiment of the present invention.

  As shown in FIGS. 16 and 17, the gas adsorbing device 1 according to the present embodiment includes a gas adsorbing material 2 and a container 3 made of polyethylene terephthalate having a bottomed cylindrical shape containing the gas adsorbing material 2 and having an open end. A member 5 having a cylindrical shape in which a brittle material at the center is covered with an elastic body 6 and whose outer peripheral surface is in close contact with the inner surface of the opening 4 of the container 3 to cover the opening 4 of the container 3, and one end of the container 3. The space in which the gas adsorbent 2 and the shape memory alloy 7 exist in the container 3 is sealed with a member 5 that covers the opening 4, and vacuum sealed (or reduced pressure) Sealed).

  The shape memory alloy 7 has a linear shape (bar shape) in which one end is fixed to the bottom surface of the container 3 and the other end is joined to a brittle material portion at the center of the member 5 that covers the opening 4, and a predetermined temperature rise change. When (a temperature rise equal to or higher than the phase transformation temperature of the shape memory alloy 7) occurs, the shape memory alloy 7 is contracted to pull the brittle material portion at the center of the member 5 covering the opening 4 into the container 3. ing.

  In the present embodiment, the member 5 covering the opening 4 in the sixth embodiment is changed to one having a brittle material in the central portion, and the member covering the opening 4 when the temperature becomes equal to or higher than the phase transformation temperature in the sixth embodiment. Corresponding to the shape memory alloy 7 that pushes 5 to the outside of the opening 4 is changed to one that pulls the brittle material portion at the center of the member 5 that covers the opening 4 into the container 3 when the temperature becomes equal to or higher than the phase transformation temperature. To do.

  Regarding the gas adsorption device 1 of the present embodiment configured as described above, the operation and action of the gas adsorption device 1 will be described below.

  At first, since the gas adsorbent 2 is vacuum-sealed in a closed space formed by the container 3 and the member 5 covering the opening 4 of the container 3, the gas adsorbing device 1 is left in the atmosphere for a long time. However, since the gas adsorbent 2 does not touch the gas, it does not deteriorate and can be stored in the atmosphere for a long time.

  When the gas adsorbing device 1 is stored (when stored at room temperature), the shape memory alloy 7 is not pulling the brittle material portion at the center of the member 5 covering the opening 4 into the container 3 or pulling it. The member 5 covering the opening 4 is not deformed, and the member 5 covering the opening 4 seals the opening 4 of the container 3.

  After the gas adsorption device 1 is installed in a vacuum device, the shape memory alloy 7 tends to shrink when the temperature rises to the phase transformation temperature of the shape memory alloy 7. However, since both ends of the shape memory alloy 7 are fixed, a force is applied to the bottom surface of the container 3 and the central portion of the member 5 covering the opening 4 in a direction to bring them closer to each other. Since the member 5 covering the opening 4 is in close contact with the inner surface of the opening 4 of the container 3, the entire member 5 covering the opening 4 does not move to the bottom side of the container 3, and this force eventually opens. A member that covers the opening 4 as a force that deforms the brittle material portion at the center of the member 5 that covers the portion 4 and eventually the brittle material portion cannot withstand the force that deforms the brittle material portion and the brittle material portion is destroyed. 5 breaks. As a result, the sealing of the opening 4 of the container 3 by the member 5 covering the opening 4 is released, and the gas adsorbing material 2 is disposed outside the gas adsorbing device 1 (the gas adsorbing device 1 together with the core material 9 in the outer covering material 10 If it is sealed under reduced pressure, it becomes possible to adsorb gas in the space between the jacket material 10 and the gas adsorption device 1.

  The gas adsorption device 1 according to the seventh embodiment includes a gas adsorbent 2 and a container 3 that encloses the gas adsorbent 2, and a predetermined temperature change (a temperature rise that is equal to or higher than the phase transformation temperature of the shape memory alloy 7). When the change occurs, the space in which the gas adsorbent 2 in the container 3 exists changes from a state where it is blocked from the space outside the container 3 to a state where it communicates with the space outside the container 3. From the state where the space where the gas adsorbent 2 in the container 3 exists is blocked from the space outside the container 3 to the state where the space where the gas adsorbent 2 inside the container 3 exists communicates with the space outside the container 3. Since this change occurs due to a change in the predetermined temperature, when the gas adsorbent 2 is applied to a vacuum apparatus, it is not necessary to control factors other than the temperature, and productivity can be improved.

  In addition, since the gas adsorption device 1 can be switched by controlling the temperature after application to the vacuum equipment, it is possible to switch even if it is impossible to apply force from outside the housing of the vacuum equipment.

  Further, after the gas adsorption device 1 is sealed in the vacuum device 8, the temperature of the internal gas adsorption device 1 is also changed by changing the temperature, and can be switched by reaching a predetermined temperature. The adsorption device 1 can be deformed without applying a force to release the hermeticity of the container 3 and exhibit the adsorption ability.

  In addition, since the gas adsorption device 1 is switched depending on the temperature, it is only necessary to control the atmospheric temperature at the time of installation in the vacuum equipment, and the switching can be performed in any situation. Therefore, even when the vacuum device casing is not deformed and a force cannot be applied from the outside, it can be switched.

  Moreover, the gas adsorption | suction device 1 is installed in a vacuum equipment, and the switching after sealing a vacuum equipment is possible. Therefore, gas that does not need to be adsorbed, that is, gas outside the vacuum device is not adsorbed, and deterioration of the gas adsorbent 2 during storage and application to the vacuum device can be prevented. Further, since the shape memory alloy 7 has a large generated force per unit weight, the gas adsorption device 1 can be downsized by using the shape memory alloy 7.

  In the gas adsorption device 1 according to the seventh embodiment, the container 3 has an opening 4, and the opening 4 is covered with a member 5 that covers the opening 4.

  When the closed space is formed by the opening 4 and the member 5 that covers the opening 4, the gas can be prevented from entering the space where the gas adsorbent 2 exists and the deterioration of the gas adsorbent 2 can be suppressed. .

  In addition, the gas adsorption device 1 according to the seventh embodiment includes at least the shape memory alloy 7 in a closed space formed by the container 3 and the member 5 that covers the opening 4 of the container 3.

  The shape memory alloy 7 contained in the closed space formed by the member 5 covering the container 3 and the opening 4 is fixed to the brittle material portion at the center of the member 5 covering the container 3 and the opening 4 respectively. Has been. The shape memory alloy 7 tries to shrink due to the phase transformation, and a force is applied to the bottom surface of the container 3 and the central portion of the member 5 covering the opening 4 in a direction to bring them closer together. This force eventually becomes a force that deforms the brittle material portion at the center of the member 5 that covers the opening 4, and eventually the brittle material portion cannot withstand the force that deforms the brittle material portion, and the brittle material portion is destroyed, The member 5 covering the opening 4 is broken, the sealing of the opening 4 of the container 3 by the member 5 covering the opening 4 is released, and the gas adsorbing material 2 is outside the gas adsorbing device 1 (the gas adsorbing device 1 is a core material). 9 and the envelope material 10 under reduced pressure sealing, the gas in the space between the envelope material 10 and the gas adsorption device 1 can be adsorbed.

  Further, the gas adsorption device 1 according to the seventh embodiment includes a linear shape memory alloy 7 included in a closed space formed by a container 3 having an opening 4 and a member 5 covering the opening 4. is there.

  Since the gas adsorbent 2 is in a closed space formed by the member 5 that covers the container 3 and the opening 4, there is little gas intrusion during storage, and deterioration of the gas adsorbent 2 is suppressed. Part of the member 5 covering the opening 4 is made of a brittle material, and one end of a linear shape memory alloy 7 is joined to the brittle material. The other end of the linear shape memory alloy 7 is joined to the container 3 so as not to bend.

  The linear shape memory alloy 7 has a short length at the phase transformation temperature, but does not bend, and therefore applies a tensile force to the member 5 covering the opening 4 and the container 3. The member 5 covering the opening 4 is deformed by this force. Therefore, a space (gap) is created between the opening 4 of the container 3 and the member 5 covering the container 3, and external gas can be adsorbed.

(Example 1)
Hereinafter, although the specific example of the gas adsorption device 1 of Embodiment 1 demonstrated previously is demonstrated as Example 1, some description is abbreviate | omitted about the part which overlaps with description of Embodiment 1. FIG.

  In the gas adsorption device 1 of Example 1, powdery CuZSM-5 was used as the gas adsorbent 2, and a container made of polyethylene terephthalate was used as the container 3.

  The shape of the container 3 is a bottomed cylindrical shape having a thickness of 1 mm, an inner diameter of 10 mm, and a length of 100 mm, one of which is open. Furthermore, there is a notch with the opening 4 as a base point, a depth of 0.8 mm from the surface and a length of 10 mm, one on each side of the cylinder.

  The member 5 covering the opening 4 of the container 3 is a bottomed cylindrical butyl rubber having an opening on one side, and has an outer diameter of 10 mm so as to match the inner diameter of the container, and includes a ring-shaped shape memory alloy 7. is doing. The ring-shaped shape memory alloy 7 is obtained by bending a plate-shaped member having a width of 10 mm and a length of 31 mm into a ring shape so that both ends thereof are substantially in contact with each other. The ring-shaped shape memory alloy 7 has a phase transformation temperature of 70 ° C. When heated to reach the phase transformation temperature, both substantially contacting ends are separated and deformed into a substantially C shape, leaving 2.5 mm apart.

  At normal temperature, the sealing property is secured by the member 5 covering the container 3 and the opening 4, and gas can be prevented from entering during storage.

  The vacuum heat insulating material 8 was produced using the gas adsorption device 1 of the present Example configured as described above, and the physical properties were evaluated.

  As the core material 9, an aggregate of short glass fibers was thermoformed into a plate shape, and together with the gas adsorption device 1, the core material 9 was formed into a bag shape with three sides sealed in advance and one side opened. It inserted in the rectangular outer covering material 10, installed in the vacuum chamber, and after reducing pressure to 100 Pa, the opening of the bag-shaped outer covering material 10 was sealed.

  When the vacuum heat insulating material 8 is heated to 70 ° C., the ring of the shape memory alloy 7 spreads, and a force for expanding the opening 4 to the outer peripheral side is applied in the vicinity of the opening 4 of the container 3. The container 3 is deformed with a groove provided in advance on the outer peripheral surface of the opening 4 as a base point, and a gap is formed between the container 3 and the member 5 covering the opening 4 so that the gas inside the jacket material 10 can be adsorbed. .

  When the pressure inside the vacuum heat insulating material 8 is measured, it is 5 Pa, and it can be seen that the internal pressure of the jacket material 10 has decreased as a result of the adsorption by the gas adsorbent 2.

  Further, the internal pressure after the vacuum heat insulating material 8 is stored in the atmosphere for one month is 5 Pa, and it can be seen that the gas entering through the jacket material 10 is adsorbed.

  In Example 1, the phase transformation temperature of the shape memory alloy 7 is 50 ° C. or higher and 70 ° C., and it is very rare to reach this temperature in a normal environment. It can be stored for a long time without phase transformation. Further, since the phase transformation is performed at 70 ° C. of 100 ° C. or less, damage to the vacuum device 8 due to overheating after being installed in the vacuum device 8 can be reduced, energy required for heating can be kept low, and the vacuum device The cost of the entire 8 can be reduced.

  In Example 1, CuZSM-5 is used for the gas adsorbent 2 and can be switched at an arbitrary atmospheric pressure. Therefore, the adsorption capability of CuZSM-5, which is a very highly active gas adsorbent, is effectively used. It becomes possible to utilize.

(Example 2)
Hereinafter, although the specific example of the gas adsorption device 1 of Embodiment 2 demonstrated previously is demonstrated as Example 2, description is partially abbreviate | omitted about the part which overlaps with description of Embodiment 2. FIG.

  In the gas adsorption device 1 of Example 2, powdery CuZSM-5 was used as the gas adsorbent 2, and the one made of polyethylene terephthalate was used as the container 3.

  The shape of the container 3 is a bottomed cylindrical shape having a thickness of 1 mm, an inner diameter of 10 mm, and a length of 100 mm, one of which is open.

  The member 5 covering the opening 4 of the container 3 is a bottomed cylindrical butyl rubber having an opening on one side, and the outer shape is 10 mm so as to match the inner diameter of the container 3, and the ring-shaped shape memory alloy 7 is included. is doing. The ring-shaped shape memory alloy 7 is obtained by bending a plate-shaped member having a width of 10 mm and a length of 25 mm into a substantially C shape so that both ends are separated by 3 mm. The substantially C-shaped shape memory alloy 7 has a phase transformation temperature of 70 ° C. When heated to reach the phase transformation temperature, the distance between both ends of the substantially C-shaped shape memory alloy 7 becomes narrower and both ends are substantially Deforms into a ring shape to the extent of contact

  At normal temperature, the sealing property is secured by the member 5 covering the container 3 and the opening 4, and gas can be prevented from entering during storage.

  The vacuum heat insulating material 8 was produced using the gas adsorption device 1 of the present Example configured as described above, and the physical properties were evaluated.

  As the core material 9, an aggregate of short glass fibers was thermoformed into a plate shape, and together with the gas adsorption device 1, the core material 9 was formed into a bag shape with three sides sealed in advance and one side opened. It inserted in the rectangular outer covering material 10, installed in the vacuum chamber, and after reducing pressure to 100 Pa, the opening of the bag-shaped outer covering material 10 was sealed.

  When the vacuum heat insulating material 8 is heated to 70 ° C., the substantially C-shaped shape memory alloy 7 is deformed into a ring shape to reduce the outer diameter of the member 5 covering the opening 4, and the inner surface of the container 3 and the opening 4 A gap is formed between the outer peripheral surface of the member 5 covering the gas and the gas inside the jacket material 10 can be adsorbed.

  When the pressure inside the vacuum heat insulating material 8 is measured, it is 5 Pa, and it can be seen that the internal pressure of the jacket material 10 has decreased as a result of the adsorption by the gas adsorbent 2. Further, the internal pressure after the vacuum heat insulating material 8 is stored in the atmosphere for one month is 5 Pa, and it can be seen that the gas entering through the jacket material 10 is adsorbed.

  In Example 2, the phase transformation temperature of the shape memory alloy 7 is 50 ° C. or higher and 70 ° C., and it is very rare to reach this temperature under a normal environment. It can be stored for a long time without phase transformation. Further, since the phase transformation is performed at 70 ° C. of 100 ° C. or less, damage to the vacuum device 8 due to overheating after being installed in the vacuum device 8 can be reduced, energy required for heating can be kept low, and the vacuum device The cost of the entire 8 can be reduced.

  In Example 2, CuZSM-5 is used for the gas adsorbent 2 and can be switched at any atmospheric pressure, so that the adsorption capability of CuZSM-5, which is a highly active gas adsorbent, is effectively used. It becomes possible to utilize.

(Example 3)
Hereinafter, although the specific example of the gas adsorption device 1 of Embodiment 3 demonstrated previously is demonstrated as Example 3, description is partially abbreviate | omitted about the part which overlaps with description of Embodiment 3. FIG.

  In the gas adsorption device 1 of Example 3, powdery CuZSM-5 was used as the gas adsorbent 2, and the one made of polyethylene terephthalate was used as the container 3.

  The shape of the container 3 is a bottomed cylindrical shape having a thickness of 1 mm, an inner diameter of 10 mm, and a length of 100 mm, one of which is open.

  The member 5 covering the opening 4 of the container 3 is a film obtained by laminating a polyethylene terephthalate film having a thickness of 50 μm, an aluminum foil having a thickness of 6 μm, and a polyethylene terephthalate film having a thickness of 12 μm in this order. The covering member 5 is joined by a known method.

  The spring-shaped shape memory alloy 7 is enclosed in the container 3, and the phase transformation temperature is 70 ° C. When the phase transformation temperature is reached, the length becomes longer.

  The vacuum heat insulating material 8 was produced using the gas adsorption device 1 of the present Example configured as described above, and the physical properties were evaluated.

  As the core material 9, an aggregate of short glass fibers was thermoformed into a plate shape, and together with the gas adsorption device 1, the core material 9 was formed into a bag shape with three sides sealed in advance and one side opened. It inserted in the rectangular outer covering material 10, installed in the vacuum chamber, and after reducing pressure to 100 Pa, the opening of the bag-shaped outer covering material 10 was sealed.

  When the vacuum heat insulating material 8 is heated to 70 ° C., the spring of the shape memory alloy 7 extends, and as a result of the piercing force acting on the member 5 covering the opening 4, a through hole is formed in the member 5 covering the opening 4. As a result, the gas adsorbing material 2 can adsorb the gas inside the jacket material 10.

  When the pressure inside the vacuum heat insulating material 8 is measured, it is 5 Pa, and it can be seen that the internal pressure of the jacket material 10 has decreased as a result of the adsorption by the gas adsorbent 2. Further, the internal pressure after the vacuum heat insulating material 8 is stored in the atmosphere for one month is 5 Pa, and it can be seen that the gas entering through the jacket material 10 is adsorbed.

  In Example 3, the phase transformation temperature of the shape memory alloy 7 is 70 ° C., which is 50 ° C. or higher, and it is very rare to reach this temperature under a normal environment. It can be stored for a long time without phase transformation. Further, since the phase transformation is performed at 70 ° C. of 100 ° C. or less, damage to the vacuum device 8 due to overheating after being installed in the vacuum device 8 can be reduced, energy required for heating can be kept low, and the vacuum device The cost of the entire 8 can be reduced.

  In Example 3, CuZSM-5 is used for the gas adsorbent 2 and can be switched at an arbitrary atmospheric pressure, so that the adsorption capability of CuZSM-5, which is a highly active gas adsorbent, is effectively used. It becomes possible to utilize.

Example 4
Hereinafter, although the specific example of the gas adsorption device 1 of Embodiment 4 demonstrated previously is demonstrated as Example 4, description is partially abbreviate | omitted about the part which overlaps with description of Embodiment 4. FIG.

  The gas adsorption device 1 of Example 4 uses powdered CuZSM-5 as the gas adsorbent 2, and as the container 3, a low-density polyethylene film having a thickness of 50 μm from the inner layer side, an aluminum foil having a thickness of 6 μm, and a thickness. A bag made of a film laminated in the order of 12 μm polyethylene terephthalate film was used. As the support 12, a bottomed cylindrical polyethylene terephthalate member having a thickness of 3 mm, an inner diameter of 4 mm, and a length of 10 mm and having an opening on one side was used. The support 12 is spring-shaped and contains a shape memory alloy 7 having a protrusion on one side. The phase transformation temperature of the spring-shaped shape memory alloy 7 is 70 ° C., and when the phase transformation temperature is reached, the length becomes longer.

  The vacuum heat insulating material 8 was produced using the gas adsorption device 1 of the present Example configured as described above, and the physical properties were evaluated.

  As the core material 9, an aggregate of short glass fibers was thermoformed into a plate shape, and together with the gas adsorption device 1, the core material 9 was formed into a bag shape with three sides sealed in advance and one side opened. It inserted in the rectangular outer covering material 10, installed in the vacuum chamber, and after reducing pressure to 100 Pa, the opening of the bag-shaped outer covering material 10 was sealed.

  When the vacuum heat insulating material 8 is heated to 70 ° C., the spring of the shape memory alloy 7 is stretched and a piercing force is applied to the container 3, resulting in a through hole in the container 3. As a result, the gas adsorbing material 2 can adsorb the gas inside the jacket material 10.

  When the pressure inside the vacuum heat insulating material 8 is measured, it is 5 Pa, and it can be seen that the internal pressure of the jacket material 10 has decreased as a result of the adsorption by the gas adsorbent 2. Further, the internal pressure after the vacuum heat insulating material 8 is stored in the atmosphere for one month is 5 Pa, and it can be seen that the gas entering through the jacket material 10 is adsorbed.

  In Example 4, the phase transformation temperature of the shape memory alloy 7 is 70 ° C., which is 50 ° C. or higher, and it is very rare to reach this temperature in a normal environment. It can be stored for a long time without phase transformation. Further, since the phase transformation is performed at 70 ° C. of 100 ° C. or less, damage to the vacuum device 8 due to overheating after being installed in the vacuum device 8 can be reduced, energy required for heating can be kept low, and the vacuum device The cost of the entire 8 can be reduced.

  In this Example 4, CuZSM-5 is used for the gas adsorbent 2 and can be switched at any atmospheric pressure, so that the adsorption capacity of CuZSM-5, which is a very highly active gas adsorbent, is effectively used. It becomes possible to utilize.

(Example 5)
Hereinafter, although the specific example of the gas adsorption device 1 of Embodiment 5 demonstrated previously is demonstrated as Example 5, some description is abbreviate | omitted about the part which overlaps with description of Embodiment 5. FIG.

  In the gas adsorption device 1 of Example 5, powdery CuZSM-5 was used as the gas adsorbent 2, and two polyethylene terephthalate-made ones were used as the container 3.

  The shape of the container 3 is a bottomed cylindrical shape having a thickness of 1 mm, an inner diameter of 10 mm, and a length of 50 mm, one of which is open. These are joined by a shape memory alloy 7 containing cylindrical butyl rubber. The cylindrical shape memory alloy 7 is obtained by bending a plate-like material into a circular shape so that both ends thereof are substantially in contact with each other. The phase transformation temperature of the shape memory alloy 7 is 70 ° C., and when it reaches the phase transformation temperature, both ends that are substantially in contact with each other are separated.

  The inner diameter of the cylindrical butyl rubber is 12 mm, and is brought into close contact with the opening 4 of the container 3 by the pressure from the shape memory alloy 7. The openings 4 of the container 3 are connected to each other through a cylindrical butyl rubber, and a closed space is formed by the container 3 and the butyl rubber. Since the gas adsorbent 2 is contained in this closed space, there is little invasion of gas, and deterioration can be suppressed.

  The vacuum heat insulating material 8 was produced using the gas adsorption device 1 of the present Example configured as described above, and the physical properties were evaluated.

  As the core material 9, an aggregate of short glass fibers was thermoformed into a plate shape, and together with the gas adsorption device 1, the core material 9 was formed into a bag shape with three sides sealed in advance and one side opened. It inserted in the rectangular outer covering material 10, installed in the vacuum chamber, and after reducing pressure to 100 Pa, the opening of the bag-shaped outer covering material 10 was sealed.

  When the vacuum heat insulating material 8 is heated to 70 ° C., the cylindrical shape memory alloy 7 spreads and the force applied to the butyl rubber is reduced. As a result, a gap is generated between the butyl rubber and the opening 4, and the gas adsorbing material 2 can adsorb the gas inside the jacket material 10.

  When the pressure inside the vacuum heat insulating material 8 is measured, it is 5 Pa, and it can be seen that the internal pressure of the jacket material 10 has decreased as a result of the adsorption by the gas adsorbent 2. Further, the internal pressure after the vacuum heat insulating material 8 is stored in the atmosphere for one month is 5 Pa, and it can be seen that the gas entering through the jacket material 10 is adsorbed.

  In Example 5, the phase transformation temperature of the shape memory alloy 7 is 50 ° C. or higher and 70 ° C., and it is very rare to reach this temperature in a normal environment. It can be stored for a long time without phase transformation. Further, since the phase transformation is performed at 70 ° C. of 100 ° C. or less, damage to the vacuum device 8 due to overheating after being installed in the vacuum device 8 can be reduced, energy required for heating can be kept low, and the vacuum device The cost of the entire 8 can be reduced.

  In Example 5, CuZSM-5 is used for the gas adsorbent 2 and can be switched at an arbitrary atmospheric pressure, so that the adsorption capability of CuZSM-5, which is a highly active gas adsorbent, is effectively used. It becomes possible to utilize.

(Example 6)
Hereinafter, although the specific example of the gas adsorption device 1 of Embodiment 6 demonstrated previously is demonstrated as Example 6, some description is abbreviate | omitted about the part which overlaps with description of Embodiment 6. FIG.

  In the gas adsorption device 1 of Example 6, powdery CuZSM-5 was used as the gas adsorbent 2, and a container made of polyethylene terephthalate was used as the container 3.

  The shape of the container 3 is a bottomed cylindrical shape having a thickness of 1 mm, an inner diameter of 10 mm, and a length of 100 mm, one of which is open. The opening 4 of the container 3 is sealed with a stopper 5 made of butyl rubber. The container 3 contains a spring made of a shape memory alloy 7, and the spring of the shape memory alloy 7 becomes longer as the temperature rises and generates a force of 5 kg at 70 ° C.

  The vacuum heat insulating material 8 was produced using the gas adsorption device 1 of the present Example configured as described above, and the physical properties were evaluated.

  As the core material 9, an aggregate of short glass fibers was thermoformed into a plate shape, and together with the gas adsorption device 1, the core material 9 was formed into a bag shape with three sides sealed in advance and one side opened. It inserted in the rectangular outer covering material 10, installed in the vacuum chamber, and after reducing pressure to 100 Pa, the opening of the bag-shaped outer covering material 10 was sealed.

  When the vacuum heat insulating material 8 is heated to 70 ° C., the spring of the shape memory alloy 7 is extended, and the butyl rubber stopper 5 is moved and detached from the container 3. As a result, the gas adsorbing material 2 can adsorb the gas inside the jacket material 10.

  When the pressure inside the vacuum heat insulating material 8 is measured, it is 5 Pa, and it can be seen that the internal pressure of the jacket material 10 has decreased as a result of the adsorption by the gas adsorbent 2. Further, the internal pressure after the vacuum heat insulating material 8 is stored in the atmosphere for one month is 5 Pa, and it can be seen that the gas entering through the jacket material 10 is adsorbed.

  In Example 6, the phase transformation temperature of the shape memory alloy 7 is 70 ° C., which is 50 ° C. or higher, and it is very rare to reach this temperature under a normal environment. It can be stored for a long time without phase transformation. Further, since the phase transformation is performed at 70 ° C. of 100 ° C. or less, damage to the vacuum device 8 due to overheating after being installed in the vacuum device 8 can be reduced, energy required for heating can be kept low, and the vacuum device The cost of the entire 8 can be reduced.

  In Example 6, CuZSM-5 is used for the gas adsorbent 2 and can be switched at any atmospheric pressure, so that the adsorption capability of CuZSM-5, which is a very high activity gas adsorbent, is effectively used. It becomes possible to utilize.

(Example 7)
Hereinafter, although the specific example of the gas adsorption device 1 of Embodiment 7 demonstrated previously is demonstrated as Example 7, some description is abbreviate | omitted about the part which overlaps with description of Embodiment 7. FIG.

  In the gas adsorption device 1 of Example 7, powdery CuZSM-5 was used as the gas adsorbent 2, and copper was used as the container 3.

  The shape of the container 3 is a bottomed cylindrical shape having a thickness of 1 mm, an inner diameter of 10 mm, and a length of 100 mm, one of which is open. The opening of the container 3 is made of a cylindrical ceramic butyl rubber having a diameter of 8 mm and a thickness of 1 mm and having a thickness of 1 mm and an inner diameter of 8 mm.

  One end of the linear shape memory alloy 7 is joined to the container 3, and the other end is joined to the ceramic portion of the member 5 covering the opening 4. The phase transformation temperature of the shape memory alloy 7 is 70 ° C., and when the phase transformation temperature is reached, the length is shortened.

  The vacuum heat insulating material 8 was produced using the gas adsorption device 1 of the present Example configured as described above, and the physical properties were evaluated.

  As the core material 9, an aggregate of short glass fibers was thermoformed into a plate shape, and together with the gas adsorption device 1, the core material 9 was formed into a bag shape with three sides sealed in advance and one side opened. It inserted in the rectangular outer covering material 10, installed in the vacuum chamber, and after reducing pressure to 100 Pa, the opening of the bag-shaped outer covering material 10 was sealed.

  When the vacuum heat insulating material 8 is heated to 70 ° C., the length of the linear shape memory alloy 7 is shortened, a tensile force is applied to the member 5 covering the opening 4, and the ceramic breaks. As a result, a gap is generated between the container 3 and the member 5 covering the opening 4, and the gas adsorbing material 2 can adsorb the gas inside the jacket material 10.

  When the pressure inside the vacuum heat insulating material 8 is measured, it is 5 Pa, and it can be seen that the internal pressure of the jacket material 10 has decreased as a result of the adsorption by the gas adsorbent 2. Further, the internal pressure after the vacuum heat insulating material 8 is stored in the atmosphere for one month is 5 Pa, and it can be seen that the gas entering through the jacket material 10 is adsorbed.

  In Example 7, the phase transformation temperature of the shape memory alloy 7 is 50 ° C. or higher and 70 ° C., and it is very rare to reach this temperature under a normal environment. It can be stored for a long time without phase transformation. Further, since the phase transformation is performed at 70 ° C. of 100 ° C. or less, damage to the vacuum device 8 due to overheating after being installed in the vacuum device 8 can be reduced, energy required for heating can be kept low, and the vacuum device The cost of the entire 8 can be reduced.

  In Example 7, CuZSM-5 is used for the gas adsorbent 2 and can be switched at an arbitrary atmospheric pressure, so that the adsorption capability of CuZSM-5, which is a very highly active gas adsorbent, is effectively used. It becomes possible to utilize.

(Comparative Example 1)
A vacuum heat insulating material was produced using the gas adsorption device described in Patent Document 1. The conditions for producing the vacuum heat insulating material are the same as in Example 1.

  The gas adsorption device described in Patent Document 1 has a configuration in which Ba-Li is sealed in a metal container having an opening and the opening is covered with calcium oxide.

  It was 100 hPa when the pressure inside the produced vacuum heat insulating material was measured. From this result, it can be seen that Ba-Li does not adsorb the gas inside the vacuum heat insulating material. This is presumably because the gas adsorption device used in this comparative example lacks the gas barrier property of calcium oxide, so that Ba-Li was adsorbed and deteriorated during the production of the vacuum heat insulating material.

(Comparative Example 2)
A vacuum heat insulating material was prepared using a gas adsorption device in which CuZSM-5 was previously enclosed in a non-woven bag. The conditions for producing the vacuum heat insulating material are the same as in Example 1.

  When the pressure inside the vacuum heat insulating material was measured, it was 100 Pa. From this result, it is understood that CuZSM-5 does not adsorb the gas inside the vacuum heat insulating material. This is considered to be because CuZSM-5 adsorbed gas and deteriorated during the production of the vacuum heat insulating material because the gas permeability of the nonwoven fabric was large.

  The gas adsorbing device according to the present invention can handle a highly active gas adsorbing material without deteriorating under atmospheric pressure. Applicable to vacuum equipment.

Sectional drawing which shows the state before switching of the gas adsorption device in Embodiment 1 of this invention Explanatory drawing which shows the change before and after switching of the member which covers the opening part used for the gas adsorption device of the embodiment Sectional drawing which shows the state after switching of the gas adsorption device of the embodiment Sectional drawing of the vacuum heat insulating material which included the gas adsorption device of the embodiment in the jacket material with the core material Sectional drawing which shows the state before switching of the gas adsorption device in Embodiment 2 of this invention Explanatory drawing which shows the change before and after switching of the member which covers the opening part used for the gas adsorption device of the embodiment Sectional drawing which shows the state after switching of the gas adsorption device of the embodiment Sectional drawing which shows the state before switching of the gas adsorption device in Embodiment 3 of this invention Sectional drawing which shows the state after switching of the gas adsorption device of the embodiment Sectional drawing which shows the state before switching of the gas adsorption device in Embodiment 4 of this invention Sectional drawing which shows the state after switching of the gas adsorption device of the embodiment Sectional drawing which shows the state before switching of the gas adsorption device in Embodiment 5 of this invention Sectional drawing which shows the state after switching of the gas adsorption device of the embodiment Sectional drawing which shows the state before switching of the gas adsorption device in Embodiment 6 of this invention Sectional drawing which shows the state after switching of the gas adsorption device of the embodiment Sectional drawing which shows the state before switching of the gas adsorption device in Embodiment 7 of this invention Sectional drawing which shows the state after switching of the gas adsorption device of the embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Gas adsorption device 2 Gas adsorption material 3 Container 4 Opening part 5 Member which covers an opening part 6 Elastic body 7 Shape memory alloy 12 Support body

Claims (20)

  It consists of at least a gas adsorbent and a container containing the gas adsorbent. When a predetermined temperature change occurs, the space where the gas adsorbent exists in the container is cut off from the space outside the container. Gas adsorbing device that changes from a closed state to a state communicating with the space outside the container.   The gas adsorption device according to claim 1, wherein the container has an opening, and the opening is covered with a member that covers the opening.   The gas adsorption device according to claim 1 or 2, wherein a temperature change rate of at least one of the components is different from a temperature change rate of the other components.   The gas adsorption device according to claim 3, wherein at least a part of at least one of the components is a shape memory alloy.   The gas adsorption device according to claim 2, wherein the member covering the opening is an elastic body including a shape memory alloy.   The gas adsorption device according to claim 5, wherein the apparent volume of the elastic body is increased by the phase transformation of the shape memory alloy.   The gas adsorption device according to claim 5, wherein the apparent volume of the elastic body is reduced by the phase transformation of the shape memory alloy.   The gas adsorption device according to claim 4, wherein at least a shape memory alloy is contained in a closed space formed by the container.   The gas adsorption device according to claim 2, wherein at least a shape memory alloy is contained in a closed space formed by a container and a member covering the opening of the container.   The gas adsorption device according to any one of claims 4 to 9, wherein the shape memory alloy has a spring shape.   The gas adsorption device according to any one of claims 4, 8, 9, and 10 having a protrusion on at least one of a shape memory alloy or a member bonded to the shape memory alloy.   The gas adsorption device according to any one of claims 9 to 11, wherein the member covering the opening is a film or a sheet excellent in gas barrier properties.   The gas adsorption device according to any one of claims 8, 10, and 11, wherein the container is a bag made of a film or sheet having excellent gas barrier properties.   The gas adsorption device according to any one of claims 8 to 13, wherein the shape memory alloy is in a space defined by a support.   The gas adsorption device according to claim 14, wherein the support is cylindrical and has an opening in at least one of them.   The gas adsorption device according to claim 4, wherein at least two or more containers are joined with a joint of a shape memory alloy containing an elastic body through an opening.   The gas adsorption device according to claim 2, wherein a linear shape memory alloy is included in a closed space formed by a container having an opening and a member covering the opening.   The gas adsorption device according to any one of claims 4 to 17, wherein the shape memory alloy is a Ni-Ti system.   The gas adsorption device according to any one of claims 4 to 18, wherein a phase transformation temperature of the shape memory alloy is 50 ° C or higher and 100 ° C or lower.   The gas adsorption device according to any one of claims 1 to 19, wherein the gas adsorbent is CuZSM-5.

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