JP2008248234A - Antistatic thermoplastic resin composition and molded product - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition which can form a molded product having a stable lasting antistatic property and being excellent in moldability, external appearances, and mechanical properties, and to provide a molded article comprising the same. <P>SOLUTION: The antistatic thermoplastic resin composition is obtained by combining 100 parts by weight of the thermoplastic resin composition comprising 3-94 parts by weight of styrenic resin, 3-94 parts by weight of aromatic polyester resin and 3-45 parts by weight of polyether ester amide with 0.01-20 parts by weight of an organic ionically conductive agent, and the molded product comprises the same. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an antistatic thermoplastic resin composition comprising a styrenic resin, an aromatic polyester resin, a polyether ester amide (also referred to as a polyamide elastomer) and an organic ionic conductive agent, and the antistatic thermoplastic thereof. The present invention relates to a molded article made of a resin composition.

  In recent years, thermoplastic resin molded products have been used in a wide range of fields including parts such as household electric appliances, OA appliances, and automobiles. However, most of the thermoplastic resins that make up thermoplastic resin molded products are electrically insulating, and in various devices equipped with precise electrical and electronic control products, the malfunction of the control device occurs due to the electrostatic charge generated. There was a problem. As a method for solving these problems caused by charging, a method of adding an amine antistatic agent to a thermoplastic resin is known. As a method for continuously imparting antistatic properties to a thermoplastic resin, a method of blending a thermoplastic elastomer with a polyamide elastomer such as polyether ester amide is known. However, the thermoplastic resin to which antistatic performance is imparted by these methods does not necessarily have sufficient antistatic properties depending on the application of the product, and may not satisfy the required performance.

  Further, as another method of imparting antistatic properties to a thermoplastic resin, a method of blending carbon black as a conductive filler into the thermoplastic resin is known. However, the thermoplastic resin compounded with carbon black has a problem that the thermoplastic resin molded product is limited to black, and a relatively large amount of carbon black needs to be compounded in order to obtain a stable resistance value of the charged region. Therefore, there is a problem that the mechanical properties of the thermoplastic resin molded product are lowered.

  Furthermore, as another method for imparting antistatic properties to a thermoplastic resin, a method of blending carbon fiber, metal fiber or metal powder as a conductive filler into the thermoplastic resin has been proposed. However, the thermoplastic resin molded products obtained by these methods have a problem that the appearance of the product is bad and the mechanical properties are lowered.

As a method to solve the problems of the thermoplastic resin imparted with antistatic properties by these conventional methods, recently, an ionic salt comprising a non-polymeric nitrogen onium cation and a weakly coordinating fluorine-containing organic anion is added to the thermoplastic resin. (Refer to Patent Document 1), a method of blending a perfluoroalkyl sulfonate with a thermoplastic resin (refer to Patent Document 2), and a composite compound of a cyclic amidine or an onium salt of pyridine with a high molecular compound. And the like (see Patent Document 3). However, these proposals did not satisfy the high level of antistatic properties required particularly in the field of electronic / electrical equipment parts. Further, there is no specific disclosure about application to styrene-based thermoplastic resins, and its applicability was unknown.
Special table 2003-511505 gazette Special table 2003-507510 gazette JP-A-10-265673

  An object of the present invention is to solve the conventional technical problems as described above, and has superior antistatic properties, that is, low surface specific resistance, stable and stable antistatic properties, and molding. An object of the present invention is to provide a thermoplastic resin composition capable of obtaining a molded article having excellent processability and excellent surface appearance and mechanical properties, and a molded article comprising the same.

  As a result of intensive studies to solve the above problems, the inventors of the present invention have developed a specific amount of organic ion conductive material into a thermoplastic resin composition comprising a styrene resin and a copolymer containing an alkylene oxide unit as a constituent component. It has been found that the above object can be efficiently achieved by blending an agent, and the present invention has been achieved.

  That is, the antistatic thermoplastic resin composition of the present invention comprises 3 to 94 parts by weight of a styrene resin (A), 3 to 94 parts by weight of an aromatic polyester resin (B), and 3 to 45 polyetheresteramide (C). An antistatic thermoplastic resin composition obtained by blending 0.01 to 20 parts by weight of an organic ionic conductive agent (D) with respect to 100 parts by weight of a thermoplastic resin composition containing parts by weight.

  According to a preferred embodiment of the antistatic thermoplastic resin composition of the present invention, the organic ionic conductive agent (D) is an imidazolium salt, a pyridinium salt, an ammonium salt or a phosphonium salt.

  Moreover, according to the preferable aspect of the antistatic thermoplastic resin composition of this invention, the said organic ion electrically conductive agent (D) is following General formula (1) or (2).

(Wherein R ¹ , R ² and R ⁴ each independently represent an alkyl group having 1 to 5 carbon atoms, and R ³ , R ⁵ and R ⁶ each independently represent hydrogen or an alkyl group having 1 to 5 carbon atoms. represents an anion component [X] ^- is X constituting the _{(CF 3 SO 2) 2 N} , represents a _{(C 2 F 5 SO 2)} 2 N, (CF 3 SO 2) 3 C or _{CF 3} SO 3). Any one of the compounds

  According to a preferred embodiment of the antistatic thermoplastic resin composition of the present invention, the polyether ester amide (C) includes a poly (alkylene oxide) glycol having a number average molecular weight of 200 to 6000 and a number average molecular weight of 1,000. The following general formulas (I) to (III)

(Wherein R ⁷ and R ⁸ each independently represents an ethylene group or a propylene group, Y represents a covalent bond, an alkylene group having 1 to 6 carbon atoms, an alkylidene group having 2 to 6 carbon atoms, or an alkyl group having 7 to 17 carbon atoms. A cycloalkylidene group, an arylalkylidene group having 7 to 17 carbon atoms, O, SO, SO ₂ , CO, S, CF ₂ , C (CF ₃ ) ₂ or NH, wherein X ^{1 to} X ¹² are each independently hydrogen, 1 or 2 or more types of compounds selected from the group consisting of diol compounds represented by (C 1-6 alkyl group, halogen, SO ₃ H or a metal salt thereof). is there.

  Moreover, according to the preferable aspect of the antistatic thermoplastic resin composition of this invention, said polyetheresteramide (C) contains the polyethylene oxide glycol of number average molecular weight 200-6000 as a structural component. .

  According to a preferred embodiment of the antistatic thermoplastic resin composition of the present invention, the polyether ester amide (C) is an aminocarboxylic acid having 6 or more carbon atoms or a lactam having 6 or more carbon atoms, or It contains a reaction product of a diamine having 6 or more carbon atoms and a dicarboxylic acid as a constituent component.

  According to a preferred embodiment of the antistatic thermoplastic resin composition of the present invention, the styrenic resin (A) includes an aromatic vinyl monomer and other copolymerizable with the aromatic vinyl monomer. It contains a vinyl copolymer copolymerized with the vinyl monomer. In addition, the styrene resin (A) is obtained by graft polymerizing an aromatic vinyl monomer and another vinyl monomer copolymerizable with the aromatic vinyl monomer onto a rubber polymer. The graft copolymer obtained is obtained. Furthermore, the styrene resin (A) is a vinyl copolymer obtained by copolymerizing an aromatic vinyl monomer and another vinyl monomer copolymerizable with the aromatic vinyl monomer. A graft obtained by graft-polymerizing an aromatic vinyl monomer and another vinyl monomer copolymerizable with the aromatic vinyl monomer onto the rubber polymer. It contains a copolymer.

  According to a preferred embodiment of the antistatic thermoplastic resin composition of the present invention, the aromatic polyester resin (B) contains polyethylene terephthalate, polypropylene terephthalate or polybutylene terephthalate.

  The antistatic thermoplastic resin composition of the present invention can be molded into a molded product having an arbitrary shape.

  According to the present invention, an antistatic thermoplastic resin composition having a stable surface antistatic property with a low surface resistivity, excellent molding processability, and a molded product having excellent product appearance and mechanical properties. Can be obtained. By using the antistatic thermoplastic resin composition of the present invention, a molded article having these excellent characteristics can be obtained. The antistatic thermoplastic resin composition of the present invention has an excellent surface specific resistance value that could not be achieved in the past. Therefore, according to the present invention, in particular, an IC carrying case or an IC tray that dislikes metal salts, or an electrostatic objection. A thermoplastic resin molded article having excellent antistatic properties suitable as an electronic / electric equipment part can be obtained.

  The antistatic thermoplastic resin composition of the present invention comprises 3 to 94 parts by weight of a styrene resin (A), 3 to 94 parts by weight of an aromatic polyester resin (B), and 3 to 45 parts by weight of a polyether ester amide (C). Is an antistatic thermoplastic resin composition obtained by blending 0.01 to 20 parts by weight of the organic ionic conductive agent (D) with respect to 100 parts by weight of the thermoplastic resin composition.

  The styrenic resin (A) used in the present invention comprises a polymer containing an aromatic vinyl monomer as its component. Examples of the aromatic vinyl monomer include styrene, α-methylstyrene, p-methylstyrene, vinyltoluene, t-butylstyrene, o-ethylstyrene, o-chlorostyrene, and o, p-dichlorostyrene. Among them, styrene and α-methylstyrene are preferably used. One type of aromatic vinyl monomer may be used, or two or more types may be used in combination.

  In addition, the styrene resin (A) is an aromatic vinyl monomer and other vinyl resins copolymerizable with the aromatic vinyl monomer for the purpose of imparting characteristics such as chemical resistance and heat resistance. You may contain the vinyl copolymer which copolymerized the monomer. Examples of these other vinyl monomers include acrylonitrile, methacrylonitrile, ethacrylonitrile, (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, and (meth) acrylic acid n. -Propyl, n-butyl (meth) acrylate, t-butyl (meth) acrylate, n-hexyl (meth) acrylate, glycidyl (meth) acrylate, allyl glycidyl ether, styrene-p-glycidyl ether, p- Glycidylstyrene (meth) acrylic acid 2-hydroxyethyl, (meth) acrylic acid 3-hydroxypropyl, (meth) methacrylic acid 3-hydroxypropyl, (meth) acrylic acid 2,3,4,5,6-pentahydroxyhexyl , (Meth) methacrylic acid 2,3,4,5,6-pentahydroxyhexyl, 2,3,4,5-tetrahydroxypentyl crylate, maleic acid, maleic anhydride, maleic acid monoethyl ester, itaconic acid, itaconic anhydride, phthalic acid, N-methylmaleimide, N-ethylmaleimide, N-cyclohexyl Maleimide, N-phenylmaleimide, acrylamide, methacrylamide, N-methylacrylamide, butoxymethylacrylamide, N-propylmethacrylamide, aminoethyl acrylate, propylaminoethyl acrylate, dimethylaminoethyl methacrylate, ethylaminipropyl methacrylate, Phenylaminoethyl methacrylate, cyclohexylaminoethyl methacrylate, N-vinyldiethylamine, N-acetylvinylamine, allylamine, methallylamine, N-methylallylamine Emissions, p- aminostyrene, 2-isopropenyl - oxazoline, 2-vinyl - oxazoline, 2-acryloyl - oxazoline, and 2-styryl - such as oxazoline. Among these, acrylonitrile and methyl methacrylate are particularly preferably used.

  The proportion of the aromatic vinyl monomer contained in the styrene resin (A) is preferably 10 to 100 parts by weight, more preferably 20 to 90 parts by weight from the viewpoint of moldability.

  The polystyrene equivalent weight average molecular weight of the styrenic resin (A) is preferably 50,000 to 300,000 in order to maintain the physical property balance. The weight average molecular weight can be measured by a generally known technique using gel permeation chromatography (GPC).

  There is no restriction | limiting in particular in the manufacturing method of a styrene resin (A), A normal manufacturing method, such as a block polymerization method, a suspension polymerization method, an emulsion polymerization method, a block-suspension polymerization method, can be used. Moreover, you may manufacture by melt-kneading the 1 type (s) or 2 or more types of styrene resin obtained by either of these methods.

  For the purpose of dramatically improving the impact resistance and other characteristics of the styrenic resin (A), the styrenic resin has a rubbery material in a matrix made of an aromatic vinyl (co) polymer. It is preferable to use a rubber-modified styrene resin in which a polymer is dispersed. That is, as a styrene resin, a graft polymer obtained by graft polymerization of an aromatic vinyl monomer and another vinyl monomer copolymerizable with the aromatic vinyl monomer on a rubber polymer. A rubber-modified styrenic resin containing a copolymer can be preferably used. An aromatic vinyl monomer, a vinyl copolymer obtained by copolymerization with another vinyl monomer copolymerizable with the aromatic vinyl monomer, and a rubbery polymer, A rubber-modified styrene resin containing a graft copolymer obtained by graft polymerization of a vinyl monomer and another vinyl monomer copolymerizable with the aromatic vinyl monomer is also preferable. Can be used.

  Examples of the rubber polymer include polybutadiene, styrene-butadiene copolymer, acrylonitrile-butadiene copolymer, block copolymer of styrene-butadiene, diene rubber such as butyl acrylate-butadiene copolymer, and polyacryl. Examples thereof include acrylic rubbers such as butyl acid, polyisoprene, and ethylene-propylene-diene terpolymers, among which polybutadiene and butadiene copolymers are preferably used.

  From the viewpoint of excellent impact resistance, the rubber particle diameter of the rubber polymer is preferably rubber particles having an average particle diameter in the range of 0.15 to 0.60 μm, and an average particle diameter of 0.2 to 0.55 μm. A range of rubber particles is more preferred. Among these, rubber particles having an average particle diameter in the range of 0.20 to 0.25 μm and rubber having a range of 0.50 to 0.65 μm are obtained because the impact resistance and the falling weight impact of the thin molded product are remarkably excellent. A rubbery polymer having a weight ratio of 90:10 to 60:40 is particularly preferable.

  Here, the average weight particle diameter of the rubber particles is the cumulative sodium alginate concentration described in “Rubber Age, Vol. 88, p. 484 to 490, (1960), by E. Schmidt, PH Biddison”. It can be measured by a method for obtaining a particle size of 50% cumulative weight fraction from the weight fraction.

  When the above rubber-modified styrene resin is used as the styrene resin (A), the rubber polymer and the styrene resin as the matrix are incompatible with each other. Therefore, the rubber polymer is compatible with the matrix. When the component to be grafted is subjected to graft polymerization, the impact resistance can be further improved. That is, it is preferable to use a graft copolymer obtained by graft-polymerizing an aromatic vinyl monomer or a monomer mixture to a rubber polymer. As the monomer used for the graft polymerization, it is preferable to use the same monomer component as the monomer component in the aromatic vinyl (co) polymer as the matrix in the same ratio. The composition and graft amount are preferably adjusted to a composition and graft amount that do not impair the dispersibility of the rubbery polymer. The graft ratio is preferably 5 to 200% by weight, more preferably 20 to 100% by weight. The graft ratio here is a value calculated by the following (Formula 1).

  From the viewpoint of obtaining a resin composition having excellent impact resistance, the intrinsic viscosity [η] (measured at 30 ° C.) of methyl ethyl ketone-soluble matter is obtained for the characteristics of the (co) polymer not graft-polymerized. Preferably it is the range of 0.25-0.60 dl / g, More preferably, it is the range of 0.25-0.50 dl / g.

  As a method for producing a rubber-modified styrene resin, specifically, a graft copolymer obtained by graft polymerization of a monomer or a monomer mixture containing an aromatic vinyl monomer to a rubber polymer. A method for producing a rubber-modified styrenic resin by melt-kneading a polymer and a styrene (co) polymer obtained by polymerizing a monomer or a monomer mixture containing an aromatic vinyl monomer. , Industrially and economically suitable.

  The graft copolymer contained in the rubber-modified styrene resin can be obtained by a known polymerization method such as emulsion polymerization or bulk polymerization. Among them, a method in which emulsion polymerization is performed by continuously supplying a monomer or a mixture of monomers, a mixture of a radical generator and a chain transfer agent to a polymerization vessel in the presence of a rubbery polymer latex is suitable for operation. It is.

  Specific examples of the styrene resin (A) used in the present invention include, for example, polystyrene, high impact polystyrene, AS resin, AAS resin, AES resin, ABS resin, MAS resin, MS resin, MABS resin, and MBS resin. There are also alloys of these resins with other resins.

  The aromatic polyester resin (B) used in the present invention is a polymer or copolymer obtained by a polycondensation reaction mainly comprising a dicarboxylic acid (or an ester-forming derivative thereof) and a diol (or an ester-forming derivative thereof). It is a coalescence.

  Examples of the dicarboxylic acid include terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, bis (p-carboxyphenyl) methane, anthracene dicarboxylic acid, 4,4-diphenyl ether dicarboxylic acid, Examples thereof include aromatic dicarboxylic acids such as biphenyl-4,4-dicarboxylic acid and 5-sodium sulfoisophthalic acid, and ester-forming derivatives thereof. Examples of the diol component include aliphatic or alicyclic glycols having 2 to 20 carbon atoms, that is, ethylene glycol, propylene glycol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6- Examples include hexanediol, decamethylene glycol, cyclohexanedimethanol, cyclohexanediol, and ester-forming derivatives thereof.

  Preferable examples of these polymers or copolymers include polyethylene terephthalate, polypropylene terephthalate, and polybutylene terephthalate. These may be used alone or in admixture of two or more. The aromatic polyester resin (B) has a relative viscosity in the range of 1.15 to 2.0, particularly 1.30 when measured at a temperature of 25 ° C. using a 0.5% o-chlorophenol solution. Those in the range of ˜1.85 are preferably used. If the relative viscosity is less than 1.15, the mechanical properties tend to be lowered, and if the relative viscosity exceeds 2.0, the moldability tends to be deteriorated.

  The polyether ester amide (C) used in the present invention is composed of a diol compound to which poly (alkylene oxide) glycol or alkylene oxide is added, a lactam having 6 or more carbon atoms, and the like, which are block bonds or graft bonds. It is an equivalent copolymer.

  The polyether ester amide (C) is a poly (alkylene oxide) glycol and the following general formulas (I) to (III)

(Here, in general formulas (I) to (III), R ⁷ and R ⁸ each independently represents an ethylene group or a propylene group, Y represents a covalent bond, an alkylene group having 1 to 6 carbon atoms, and 2 to 2 carbon atoms. 6 alkylidene group, cycloalkylidene group having 7 to 17 carbon atoms, arylalkylidene group having 7 to 17 carbon atoms, O, SO, SO ₂ , CO, S, CF ₂ , C (CF ₃ ) ₂ or NH; X ^{1 to} X ¹² each independently comprises a diol compound represented by hydrogen, an alkyl group having 1 to 6 carbon atoms, halogen, SO ₃ H or a metal salt thereof (SO ₃ Na, SO ₃ K, etc.). A copolymer containing one or two or more compounds selected from the group as a constituent component is preferable.

M and n in the above general formulas (I) to (III) represent the degree of polymerization of “— (R ⁷ O) —” and “— (R ⁸ O) —”, respectively. The sum (m + n) depends on the diol compounds of the general formulas (I) to (III) to be used, but is preferably in the range of 8 to 65. The average value of (m + n) can be obtained by calculation from the structure (molecular weight of the monomer) and the number average molecular weight of the diol compounds of the general formulas (I) to (III).

  In the present invention, the number average molecular weight is the amount of potassium hydroxide (mg) required to neutralize the produced acetylated product by heating 1 g of a sample with an excess of an acetylating agent such as acetic anhydride. The number can be calculated by the following (Equation 2), where G is G and H is the amount (mg number) of potassium hydroxide required to neutralize 1 g of the sample before acetylation.

  Poly (alkylene oxide) glycols used in the present invention include polyethylene oxide glycol, poly (1,2-propylene oxide) glycol, poly (1,3-propylene oxide) glycol, poly (tetramethylene oxide) glycol, poly ( Hexamethylene oxide) glycol, block or random copolymer of ethylene oxide and propylene oxide, and block or random copolymer of ethylene oxide and tetrahydrofuran, among which polyethylene oxide glycol is preferably used.

  The number average molecular weight of the poly (alkylene oxide) glycol is preferably in the range of 200 to 6000, more preferably in the range of 300 to 4000. Moreover, both ends of the poly (alkylene oxide) glycol component may be aminated or carboxylated as necessary.

As the diol compound selected from the group consisting of the above general formulas (I) to (III), R ⁷ and R ⁸ are each independently an ethylene group or a propylene group, and Y is an alkylene having 1 to 6 carbon atoms, A diol compound in which X ^{1 to} X ¹² are each independently hydrogen or an alkyl group having 1 to 6 carbon atoms is preferred, and among these, a diol compound in which X ^{1 to} X ¹² is hydrogen is particularly preferred.

  Specific diol compounds include bisphenol A, tetrabromobisphenol A, dimethyl bisphenol A, tetramethyl bisphenol A, 2,2-bis (4,4′-hydroxyphenyl-3,3′-sulfonic acid sodium) propane, Bisphenol S, dimethyl bisphenol S, tetramethyl bisphenol S, 4,4 ′-(hydroxy) biphenyl, bis (4-hydroxyphenyl) sulfide, bis (4-hydroxyphenyl) sulfoxide, bis (4-hydroxyphenyl) methane, bis (4-hydroxyphenyl) difluoromethane, bis (4-hydroxyphenyl) hexafluoropropane, bis (4-hydroxyphenyl) ether, bis (4-hydroxyphenyl) amine, 2,2-bis (4-hydroxyphenyl) Nyl) ethane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 4,4′-dihydroxybenzophenone, hydroquinone, ethylene oxide and / or propylene oxide adducts such as sodium 1,4-dihydroxybenzenesulfonate, and dihydroxynaphthalene Or those block copolymers etc. are mentioned. Among these, more preferred diol compounds are hydroquinone ethylene oxide adduct, bisphenol A ethylene oxide adduct, bisphenol S ethylene oxide adduct, dihydroxynaphthalene ethylene oxide adduct, and block copolymers thereof. In particular, an ethylene oxide adduct of bisphenol A or a block copolymer thereof is preferable from the viewpoint of polymerizability and economy.

  The number average molecular weight of these diol compounds selected from the group consisting of the above general formulas (I) to (III) is preferably 1,000 to 3,000. When the number average molecular weight is in this range, it is possible to improve the antistatic property and shorten the polymerization time of the resulting polyether ester amide.

  The polyether ester amide (C) includes an aminocarboxylic acid having 6 or more carbon atoms, a lactam having 6 or more carbon atoms, or a reaction product of a diamine having 6 or more carbon atoms and a dicarboxylic acid having 6 or more carbon atoms. A graft copolymer or a block copolymer containing as a constituent component a diol compound selected from the group consisting of the above poly (alkylene oxide) glycols and the above general formulas (I) to (III) is preferable.

  The aminocarboxylic acid having 6 or more carbon atoms constituting the polyether ester amide (C) is preferably an aminocarboxylic acid having 6 to 20 carbon atoms, specifically, ω-aminocaproic acid, ω-aminoenanthate. Examples include aminocarboxylic acids such as acids, ω-aminocaprylic acid, ω-aminopergonic acid, ω-aminocapric acid, 11-aminoundecanoic acid, and 12-aminododecanoic acid. The lactam having 6 or more carbon atoms is preferably a lactam having 6 to 20 carbon atoms. Specific examples include ε-caprolactam, enantolactam, capryllactam, and laurolactam. The reaction product of a diamine having 6 or more carbon atoms and a dicarboxylic acid having 6 or more carbon atoms is a reaction product of a diamine having 6 to 20 carbon atoms and a dicarboxylic acid having 6 to 20 carbon atoms. Preferable examples include a reaction product of a salt (nylon salt) of diamine and dicarboxylic acid such as hexamethylenediamine-adipate, hexamethylenediamine-sebacate, and hexamethylenediamine-isophthalate. .

  In the polyetheresteramide (C), a reaction product of an aminocarboxylic acid having 6 or more carbon atoms, a lactam having 6 or more carbon atoms, or a diamine having 6 or more carbon atoms and a dicarboxylic acid having 6 or more carbon atoms, The bond with the diol compound is preferably an ester bond or an amide bond.

  Further, the polyether ester amide (C) may further contain a third component such as dicarboxylic acid or diamine as a reaction component. In this case, the dicarboxylic acid component is preferably a carboxylic acid having 4 to 20 carbon atoms in view of polymerizability, color tone and physical properties. Examples thereof include terephthalic acid, isophthalic acid, phthalic acid, and naphthalene-2,7-dicarboxylic acid. Acid, diphenyl-4,4-dicarboxylic acid, diphenoxyethanedicarboxylic acid, aromatic dicarboxylic acid such as sodium 3-sulfoisophthalate, 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, dicyclohexyl-4, Aliphatic dicarboxylic acids such as 4-dicarboxylic acid, and aliphatic dicarboxylic acids such as succinic acid, oxalic acid, adipic acid, sebacic acid, and 1,10-decanedicarboxylic acid. On the other hand, as the diamine component, aromatic, alicyclic or aliphatic diamines are used, and among them, hexamethylenediamine which is an aliphatic diamine is preferably used.

  Content of polyetheresteramide (C) is 3-45 weight part in a thermoplastic resin, Preferably it is 5-40 weight part. When the content of the polyether ester amide (C) is less than 3 parts by weight, that is, when the total amount of the styrene resin (A) and the aromatic polyester resin (B) exceeds 97 parts by weight, the thermoplastic resin is not controlled. Electric characteristics are lowered. When the blending amount of the polyether ester amide (C) exceeds 45 parts by weight, that is, when the total blending amount of the styrene resin (A) and the aromatic polyester resin (B) is less than 55 parts by weight, thermoplasticity The flexural modulus of the resin decreases.

  It does not specifically limit about the manufacturing method of polyetheresteramide (C) used by this invention, A well-known manufacturing method can be utilized. For example, in the case of a polyether ester amide, an aminocarboxylic acid, a lactam or a salt of a diamine having 6 or more carbon atoms and a dicarboxylic acid having 6 or more carbon atoms is reacted with a dicarboxylic acid that can be contained as the third component. Then, a polyamide prepolymer having carboxylic acid groups at both ends is prepared, and poly (alkylene oxide) glycol and a diol compound selected from the group consisting of the above general formulas (I) to (III) are reacted to the prepolymer under vacuum. Can be applied.

  In addition, aminocarboxylic acid, lactam or a salt of a diamine having 6 or more carbon atoms and a dicarboxylic acid having 6 or more carbon atoms, dicarboxylic acid that can be contained as the third component, poly (alkylene oxide) glycol, and the above general formula Three compounds of diol compounds selected from the group consisting of (I) to (III) are charged into a reaction vessel, and a carboxylic acid-terminated polyamide elastomer is produced by heating at high temperature in the presence or absence of water. Then, a method of proceeding polymerization under normal pressure or reduced pressure can also be applied. Furthermore, it is also possible to apply a method in which these three compounds are charged into a reaction vessel at the same time and subjected to melt polymerization, and then the polymerization is advanced all at once under high vacuum.

  The antistatic thermoplastic resin composition of the present invention is a modified vinyl (co) polymer containing at least one functional group selected from a carboxyl group, a hydroxyl group, an epoxy group, an amino group and an oxazoline group, if necessary. It can also contain a coalescence (hereinafter sometimes abbreviated as a modified vinyl polymer). This modified vinyl polymer includes one or more vinyl monomers and the above functional group (at least one functional group selected from a carboxyl group, a hydroxyl group, an epoxy group, an amino group, and an oxazoline group). A polymer obtained by polymerization or copolymerization with a vinyl-based monomer for introducing the monomer can be used. The content of the compound having these functional groups in the modified vinyl polymer is preferably in the range of 0.01 to 20% by weight per 100 parts by weight of the modified vinyl polymer.

  Examples of the vinyl monomer used in the production of the modified vinyl polymer include, for example, styrene, α-methyl styrene, p-methyl styrene, vinyl toluene, t-butyl styrene, o-ethyl styrene, o-chloro. Examples include styrene and aromatic vinyl monomers such as o, p-dichlorostyrene. It is also possible to use another vinyl monomer copolymerizable with the aromatic vinyl monomer. Examples of the other vinyl monomers include acrylonitrile, methacrylonitrile, ethacrylonitrile, (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, and (meth) acrylic acid n. -Propyl, n-butyl (meth) acrylate, t-butyl (meth) acrylate, n-hexyl (meth) acrylate, glycidyl (meth) acrylate, allyl glycidyl ether, styrene-P-glycidyl ether, p- Glycidylstyrene, 2-hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) methacrylate, 2,3,4,5,6-pentahydroxy (meth) acrylate Hexyl, (meth) methacrylic acid 2,3,4,5,6-pentahydroxyhexyl, 2,3,4,5-tetrahydroxypentyl crylate, maleic acid, maleic anhydride, maleic acid monoethyl ester, itaconic acid, itaconic anhydride, phthalic acid, N-methylmaleimide, N-ethylmaleimide, N-cyclohexyl Maleimide, N-phenylmaleimide, acrylamide, methacrylamide, N-methylacrylamide, butoxymethylacrylamide, N-propylmethacrylamide, aminoethyl acrylate, propylaminoethyl acrylate, dimethylaminoethyl methacrylate, ethylaminipropyl methacrylate, Phenylaminoethyl methacrylate, cyclohexylaminoethyl methacrylate, N-vinyldiethylamine, N-acetylvinylamine, allylamine, methallylamine, N-methylallylamine Emissions, p- aminostyrene, 2-isopropenyl - oxazoline, 2-vinyl - oxazoline, 2-acryloyl - oxazoline, and 2-styryl - oxazoline, etc. can also be used.

  Examples of vinyl monomers for introducing a carboxyl group as a functional group into the modified vinyl polymer include acrylic acid, methacrylic acid, maleic acid, maleic acid monoethyl ester, maleic anhydride, phthalic acid, and itacone. A carboxylic acid or carboxylic anhydride having an unsaturated bond such as an acid can be used.

  In addition, a polymerization generator and / or thio having a carboxyl group such as γ, γ′-azobis (γ-cyanovaleric acid), α, α′-azobis (α-cyanoethyl) -p-benzoic acid, and succinic peroxide. A polymerization degree regulator having a carboxyl group such as glycolic acid, α-mercaptopropionic acid, β-mercaptopropionic acid, α-mercapto-isobutyric acid, and 2,3 or 4-mercaptobenzoic acid is used. A method of (co) polymerizing vinyl monomers can also be used. Furthermore, copolymers of (meth) acrylic acid ester monomers such as methyl methacrylate and methyl acrylate and aromatic vinyl monomers, or (meth) acrylic acid ester monomers, aromatic vinyl monomers A method of saponifying a copolymer of a monomer and a vinyl cyanide monomer with an alkali can also be used.

  Examples of the vinyl monomer for introducing a hydroxyl group as the functional group into the modified vinyl polymer include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 3-hydroxypropyl acrylate, methacrylic acid. 3-hydroxypropyl acid, 2,3,4,5,6-pentahydroxyhexyl acrylate, 2,3,4,5,6-pentahydroxyhexyl methacrylate, 2,3,4,5-tetrahydroxy acrylate Pentyl, 2,3,4,5-tetrahydroxypentyl methacrylate, 3-hydroxy-1-propene, 4-hydroxy-1-butene, cis-4-hydroxy-2-butene, trans-4-hydroxy-2- Butene, 3-hydroxy-2-methyl-1-propene, cis-5-hydroxy-2-pentene, It can be used a vinyl monomer having a Nsu-5-hydroxy-2-pentene, and 4-dihydroxy-2-butene hydroxyl groups such.

  Examples of vinyl monomers for introducing an epoxy group as a functional group into the modified vinyl polymer include glycidyl acrylate, glycidyl methacrylate, glycidyl ethacrylate, glycidyl itaconate, allyl glycidyl ether, styrene- Vinyl monomers having an epoxy group such as p-glycidyl ether and p-glycidyl styrene can be used.

  Examples of the vinyl monomer for introducing an amino group as the functional group into the modified vinyl polymer include acrylamide, methacrylamide, N-methyl acrylamide, butoxymethyl acrylamide, N-propyl methacrylamide, and acrylic acid. Aminoethyl, propylaminoethyl acrylate, dimethylaminoethyl methacrylate, ethylaminopropyl methacrylate, phenylaminoethyl methacrylate, cyclohexylaminoethyl methacrylate, N-vinyldiethylamine, N-acetylvinylamine, allylamine, methallylamine, N Vinyl monomers having an amino group or an amide group such as methyl allylamine and p-aminostyrene can be used.

  Examples of vinyl monomers for introducing an oxazoline group into the modified vinyl polymer as the functional group include 2-isopropenyl-oxazoline, 2-vinyl-oxazoline, 2-acryloyl-oxazoline, and Vinyl monomers having an oxazoline group such as 2-styryl-oxazoline can be used.

  The modified vinyl polymer preferably has an intrinsic viscosity [η] measured in a methyl ethyl ketone solvent at a temperature of 30 ° C. in the range of 0.20 to 0.65 dl / g, preferably 0.35 to 0.60 dl / g. The thing of the range of is more preferable. Moreover, when it measures at the temperature of 30 degreeC in a N, N- dimethylformamide solvent, that whose intrinsic viscosity [(eta)] is 0.30-0.90 dl / g is preferable, and 0.40-0. The thing of the range of 75 dl / g is more preferable. By using a modified vinyl polymer having an intrinsic viscosity in these ranges, the thermoplastic resin composition of the present invention having more excellent impact resistance and molding processability can be obtained.

  The organic ionic conductive agent (D) used in the present invention is an organic compound salt having an ionic characteristic while being an organic substance, and is also called an ionic liquid or ionic liquid having a low melting point and a liquid at room temperature. Organic compound salts. Examples of such organic compound salts include those composed of cations such as imidazolium, pyridinium, ammonium and phosphonium and anions containing fluorine such as fluoride ions and triflate.

  The organic ionic conductive agent (D) used in the present invention is preferably an organic compound salt called an ionic liquid such as an imidazolium salt, a pyridinium salt, an ammonium salt or a phosphonium salt which is liquid at room temperature. Specifically, as the organic ion conductive agent, the following general formulas (3) to (6)

(Here, in General Formulas (3) to (6), R ¹ represents an alkyl group having 1 to 5 carbon atoms, R ² represents an alkyl group having 1 to 8 carbon atoms or a tridecafluorooctyl group, R ³ represents hydrogen or an alkyl group having 1 to 5 carbon atoms, R ⁴ represents an alkyl group having 1 to 5 carbon atoms, R ⁵ and R ⁶ each independently represent hydrogen or an alkyl group having 1 to 5 carbon atoms. , R ⁹ and R ¹⁰ each independently represents an alkyl group having 1 to 5 carbon atoms, and R ¹¹ and R ¹² each independently represents an alkyl group having 1 to 15 carbon atoms, and these anion components [X] ^- X constituting the _{can, (CF 3 SO 2) 2} N, (C 2 F 5 SO 2) 2 N, (CF 3 SO 2) 3 C, CF 3 SO 3, I, Br, Cl, PF 6, BF ₄ , NO ₃ , CH ₃ SO ₄ , p-CH ₃ C ₆ H ₄ SO ₃ ( Tosyl), CH ₃ O (C ₂ H ₄ O) ₂ SO ₃ , C ₈ H ₁₇ SO ₃ , SCN, CH ₃ SO ₃ , CH ₃ (CH ₂ ) ₈ CO ₂ , N (CN) ₂ , CF ₃ ( An organic compound salt represented by CF ₂ ) ₇ SO ₃ , CF ₃ (CF ₂ ) ₃ SO ₃ , [(CH ₃ ) ₃ CCH ₂ CH (CH ₃ ) CH ₂ ] ₂ PO ₂ or AlCl ₄ . preferable.

  More specifically, examples of the organic ionic conductive agent that is an imidazolium salt include 1,3-dimethylimidazolium methylsulfate and 1-ethyl-3-methylimidazolium bis (pentafluoroethylsulfonyl) imide. 1-ethyl-3-methylimidazolium bis (trifluoroethylsulfonyl) imide, 1-ethyl-3-methylimidazolium bromide, 1-ethyl-3-methylimidazolium chloride, 1-ethyl-3- Methylimidazolium nitrate, 1-ethyl-3-methylimidazolium hexafluorophosphate, 1-ethyl-3-methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium tosylate, 1-ethyl-3-methylimidazolium tetrafluoroborate Ethyl-3-methylimidazolium trifluorome Sulfonate, 1-n-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-butyl-3-methylimidazolium bromide, 1-butyl-3-methylimidazolium chloride, 1-butyl-3-methylimidazolium hexafluorophosphate, 1-butyl-3-methylimidazolium 2- (2-methoxyethoxy) ethyl sulfate, 1 -Butyl-3-methylimidazolium methylsulfate, 1-butyl-3-methylimidazolium tetrafluoroborate, 1-hexyl-3-methylimidazolium chloride, 1-hexyl-3-methylimidazolium Hexafluorophosphate, 1-he Sil-3-methylimidazolium tetrafluoroborate, 1-methyl-3-octylimidazolium chloride, 1-methyl-3-octylimidazolium tetrafluoroborate, 1,2-dimethyl-3-propyloctyl Imidazolium tris (trifluoromethylsulfonyl) methide, 1-butyl-2,3-dimethylimidazolium chloride, 1-butyl-2,3-dimethylimidazolium hexafluorophosphate, 1-butyl-2,3 -Dimethylimidazolium tetrafluoroborate, 1-methyl-3- (3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl) imidazolium Hexafluorophosphate and 1-butyl-3- (3,3,4,4,5,5,6,6,7,7 , 8,8,8-tridecafluorooctyl) imidazolium hexafluorophosphate and the like.

  Examples of the organic ionic conductive agent that is a pyridinium salt include 3-methyl-1-propylpyridinium bis (trifluoromethylsulfonyl) imide, 1-butyl-3-methylpyridinium bis (trifluoromethylsulfonyl) imide, 1 -Propyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-4-methylpyridinium bromide, 1-butyl-4-methylpyridinium chloride, 1 -Butyl-4-methylpyridinium hexafluorophosphate, 1-butyl-4-methylpyridinium tetrafluoroborate and the like.

  Examples of the organic ionic conductive agent that is an ammonium salt include tetrabutylammonium heptadecafluorooctane sulfonate, tetrabutylammonium nonafluorobutane sulfonate, tetrapentylammonium methanesulfonate, tetrapentylammonium thiocyanate, and methyl. -Tri-n-butylammonium methylsulfate etc. are mentioned.

  Examples of the organic ionic conductive agent that is a phosphonium salt include tetrabutylphosphonium methanesulfonate, tetrabutylphosphonium p-toluenesulfonate, trihexyltetradecylphosphonium bis (trifluoroethylsulfonyl) imide, and trihexyltetradecyl. Phosphonium bis (2,4,4-trimethylpentyl) phosphinate, trihexyl tetradecyl phosphonium bromide, trihexyl tetradecyl phosphonium chloride, trihexyl tetradecyl phosphonium decanoate, trihexyl tetradecyl phosphonium hexafluorophosphinate , Triethyltetradecylphosphonium tetrafluoroborate, and tributylmethylphosphonium tosylate.

  Among such organic ionic conductive agents, imidazolium salts and pyridinium salts are preferable, and among them, the following general formula (1) or (2)

(Wherein R ¹ , R ² and R ⁴ each independently represent an alkyl group having 1 to 5 carbon atoms, and R ³ , R ⁵ and R ⁶ each independently represent hydrogen or an alkyl group having 1 to 5 carbon atoms. And X represents (CF ₃ SO ₂ ) ₂ N, (C ₂ F ₅ SO ₂ ) ₂ N, (CF ₃ SO ₂ ) ₃ C or CF ₃ SO ₃ ). Or a pyridinium salt is preferably used.

In the above general formula (1) or (2), X constituting the anion component is preferably one having a fluoro group from the viewpoint of the thermal stability of the antistatic thermoplastic resin composition of the present invention. Is preferably CF ₃ SO ₃ (trifluoromethanesulfonate) or (CF ₃ SO ₂ ) ₂ N [bis (trifluoromethanesulfonyl) imide].

  The compounding amount of the organic ionic conductive agent (D) is based on 100 parts by weight of the thermoplastic resin composition containing the styrene resin (A), the aromatic polyester resin (B) and the polyether ester amide (C). 0.01 to 20 parts by weight. The preferable compounding quantity of an organic ion electrically conductive agent (D) is 0.05-10 weight part, More preferably, it is 0.1-5 weight part. When the addition amount of the organic ionic conductive agent (D) is less than 0.01 parts by weight, the antistatic property of the antistatic thermoplastic resin composition of the present invention is low, and the content exceeds 20 parts by weight. Decreases the heat resistance. The range of said compounding quantity is preferable also from the surface of cost.

In the present invention, a commercially available organic ionic conductive agent (D) can be used as it is. Examples of commercially available products include 1-butyl-3-methylpyridinium bis (trifluoromethanesulfonyl) imide (manufactured by Nippon Carlit) and 1-butyl-3-methylpyridinium trifluoromethanesulfonate (manufactured by Nippon Carlit). .
In addition, organic ionic conductivity produced by using a known method, for example, a method in which a tertiary amine is quaternized with an alkyl halide and then subjected to an anion exchange reaction using a salt having a target anion component. An agent can be used.

  There are no particular restrictions on the method for producing the antistatic thermoplastic resin composition of the present invention, and for example, it can be produced by melt-kneading with a Banbury mixer, roll, extruder, kneader, etc. From the viewpoint of performance, it is preferable to use a twin screw extruder. Moreover, although the temperature at the time of melt-kneading depends on a compounding component, it is usually about 180-260 degreeC.

  The antistatic thermoplastic resin composition of the present invention has antistatic properties with low surface resistivity, charged voltage, and charged voltage decay half-life.

  In the antistatic thermoplastic resin composition of the present invention, various thermoplastic resins may be blended within a range that does not impair the object of the present invention. For example, by blending polyolefin resins such as polyethylene and polypropylene, other polyester resins, polyamide resins such as nylon 6 and nylon 6, 6, modified PPE resins, polycarbonate resins, polyacetal resins, or modified products and elastomers thereof. The performance can be further improved as a molding resin composition.

  In addition, the antistatic thermoplastic resin composition of the present invention may include a hindered phenol-based, sulfur-containing compound-based or phosphorus-containing organic compound-based antioxidant, phenol-based, acrylate-based, etc., as necessary. Stabilizers, UV absorbers such as benzotriazoles, benzophenones or succinates, light stabilizers such as organic nickels and hindered amines, higher fatty acid metal salts, lubricants such as higher fatty acid amides, phthalates and phosphorus Plasticizers such as acid esters, brominated compounds, various flame retardants such as phosphate esters or red phosphorus, flame retardant aids such as antimony trioxide and antimony pentoxide, metal salts of alkyl carboxylic acids and alkyl sulfonic acids, carbon Blacks, pigments, dyes and the like can be added. Further, various reinforcing materials, fillers, neutralizing agents when each component is acid / basic, and the like can be added.

  The antistatic thermoplastic resin composition of the present invention is formed by a known molding method currently used for molding thermoplastic resins such as injection molding, extrusion molding, blow molding, vacuum molding, compression molding and gas assist molding. can do.

  A molded article made of the antistatic thermoplastic resin composition of the present invention has a low surface resistivity, a stable sustained antistatic property, and excellent molding processability, surface appearance and mechanical properties. Taking advantage of such characteristics, the molded article of the present invention can be suitably used as an electric / electronic component, an electric / electronic component conveying component and a display-related component conveying component.

  Examples of electrical / electronic equipment parts include parts of various equipment equipped with precise electrical / electronic control devices, such as car navigation systems, car audio systems, and fuel cell peripheral equipment mounted on electric vehicles. Automotive peripheral parts, IC peripheral parts or casings such as business or household electronic toys equipped with ICs, commercial or household digital electronic equipment parts, slot machines, and pachinko or electronic game machines・ Entertainment equipment parts. Examples of the parts for transporting electric / electronic parts include an IC chip tray, an IC transport tray, and a silicone wafer transport box. Examples of the display-related parts transport parts include a carrier reel, a TAB tape reel, a COF tape reel, a liquid crystal display transport tray, and a plasma display transport tray.

  In order to explain the antistatic thermoplastic resin composition of the present invention more specifically, the following examples are given, but the present invention is not limited to these examples. In the following examples and comparative examples, unless otherwise specified, “parts” and “%” represent “parts by weight” and “% by weight”, respectively.

  First, evaluation methods for various physical properties of the antistatic thermoplastic resin composition are described below.

(1) Charpy impact strength (KJ / m ² )
In accordance with ISO 179 regulations (1993), Charpy impact strength was measured under the conditions of 80 × 10 × 4 mm, type A notch, and a temperature of 23 ° C. The number of test pieces was five.

(2) Flexural modulus (MPa)
The flexural modulus was evaluated in accordance with the provisions of ISO 178 (1993). The number of test pieces was five.

(3) Surface resistivity (Ω)
With a PS60E molding machine manufactured by Nissei Plastic Industry Co., Ltd., set at a cylinder set temperature of 250 ° C. and a mold temperature of 60 ° C., a square plate molded product of 40 × 50 × 3 mm thickness obtained by injection molding has a temperature of 23 ° C. and humidity of 50% After leaving for 24 hours in an Rh environment, the surface resistivity was measured in accordance with ASTM D257 (1990). An applied voltage of 500 V and a surface specific resistance value after 1 minute were read. Here, when the surface specific resistance value is 5 × 10 ⁸ Ω or less, the measurement is difficult under the above conditions, and therefore, measurement was performed with a 3452 MΩ HiTESTER manufactured by Hioki Electric Co., Ltd. The number of test pieces was three.

(4) Charge voltage (V) and charge voltage decay half-life (electrostatic dissipation performance) (seconds)
With respect to the square plate molded product obtained in the above (4), the charged voltage and the charged voltage decay half-life were measured with a static Honest meter (manufactured by Shishido). The distance between the molded product and the applied electrode was 15 mm, the distance from the detection electrode was 10 mm, and a voltage of 8 kV was applied for 1 minute, and the charged voltage at that time was read. For the half-life of the charged voltage decay, application was stopped and the time until the charged voltage was halved was read. The number of test pieces was three. It can be said that the lower the charged voltage and the shorter the half-life of the charged voltage decay, the better the electrostatic dissipation performance. Note that the maximum value of the charged voltage that can be measured by the above-mentioned device is 2900V.

(5) Evaluation of surface specific resistance value, charged voltage and half-life of charged voltage after washing with water The surface of the test piece evaluated in (3) and (4) above was washed with running water (tap water) for 5 minutes. Thereafter, the moisture was wiped off with a dry cloth and left in a temperature control room of 23 ° C. × 50% RH for 1 hour to dry. The washed and dried test pieces were measured in the same manner for each item. This evaluation is an index of durability in actual use. The fact that there is no difference between before and after washing indicates that the durability is good.

[Reference Example 1] Preparation of Styrenic Resin (A) The graft ratio of each graft copolymer was determined by the following method. Acetone was added to a predetermined amount (m) of the graft copolymer and refluxed for 4 hours. This solution was centrifuged at 8000 rpm (centrifugal force 10,000 G (about 100 × 10 ³ m / s ² )) for 30 minutes, and the insoluble matter was filtered. This insoluble matter was dried under reduced pressure at a temperature of 70 ° C. for 5 hours, and the weight (n) was measured. The graft ratio was determined by the following formula.
Graft ratio = [(n) − (m) × L] / [(m) × L] × 100
(Wherein L is the rubber content of the graft copolymer).

Preparation of graft copolymer (A-1) Monomer mixture comprising 70% styrene and 30% acrylonitrile in 60 parts (converted to solid content) of polybutadiene latex (average rubber particle diameter 0.3 μm, gel content 85%) 40 parts were added and emulsion polymerization was performed. The obtained graft copolymer was coagulated with sulfuric acid, neutralized with sodium hydroxide, washed, filtered and dried to obtain a powdered graft copolymer (A-1).

  The graft ratio of the obtained graft copolymer (A-1) was 36%. This graft copolymer (A-1) contained 18.1% of a non-grafting copolymer composed of 70% styrene structural units and 30% acrylonitrile structural units. The intrinsic viscosity of the N, N-dimethylformamide-soluble component was 0.48 dl / g.

Preparation of Vinyl Copolymer (A-2) A monomer mixture composed of 70% styrene and 30% acrylonitrile was subjected to suspension polymerization to obtain a vinyl copolymer (A-2). The intrinsic viscosity of the N, N-dimethylformamide-soluble component of the obtained vinyl copolymer (A-2) was 0.73 dl / g.

Modified vinyl copolymer (A-3)
71 parts of styrene, 28 parts of acrylonitrile, and 1 part of glycidyl methacrylate were subjected to suspension polymerization to obtain a bead-like modified vinyl copolymer (A-3). The obtained modified vinyl copolymer <A-3> had an intrinsic viscosity of 0.56 dl / g in methyl ethyl ketone at a temperature of 30 ° C.

[Reference Example 2] Aromatic polyester resin (B-1)
A polybutylene terephthalate (PBT) resin “Trecon” (registered trademark) 1401-X06 manufactured by Toray Industries, Inc. was used.

[Reference Example 3] Preparation of polyetheresteramide (C) 45 parts of ε-caprolactam, 45 parts of ethylene oxide adduct of bisphenol A having a number average molecular weight of 1,800, 5 parts of polyethylene glycol having a number average molecular weight of 1,800, terephthal A homogeneous homogeneous solution prepared by charging 5.2 parts of acid and 0.2 part of “Irganox” (registered trademark) 1098 (antioxidant) into a reaction vessel, purging with nitrogen and heating and stirring at 260 ° C. for 60 minutes. Then, the pressure was reduced to 0.07 kPa or less. 0.1 part of tetrabutyl titanate was added, and the reaction was carried out for 2 hours under the conditions of a pressure of 0.07 kPa or less and a temperature of 260 ° C. The obtained polymer was discharged in the form of strands and cut to obtain pellets of polyetheresteramide (C-1).

[Reference Example 4] Organic ion conductive agent (D)
Organic ion conductive agent (D-1)
1-butyl-3-methylpyridinium bis (trifluoromethanesulfonyl) imide (manufactured by Nippon Carlit) was used.

Organic ion conductive agent (D-2)
1-butyl-3-methylpyridinium trifluoromethanesulfonate (manufactured by Nippon Carlit) was used.

[Examples 1-7, Comparative Examples 1-4]
Styrenic resins (A-1) to (A-3), aromatic polyester resins (B-1), polyetheresteramides (C-1), and organic ionic conductive agents shown in Reference Examples 1 to 5 above (D-1) and (D-2) were blended at the blending ratios shown in Table 1, respectively, and melt-kneaded (barrel setting) using a vented 30 mmφ twin-screw extruder (Ikegai PCM-30). The temperature was 240 ° C.) and extrusion was performed to produce a pellet-shaped thermoplastic resin composition. Moreover, when mix | blending glass fiber, it injected from the side feeder. Subsequently, the test piece which consists of said thermoplastic resin composition was shape | molded with the cylinder temperature of 250 degreeC and the mold temperature of 60 degreeC using the injection molding machine. The test pieces were measured for physical properties under the above conditions, and the results are shown in Table 1.

  As shown in Table 1, each of the antistatic thermoplastic resin compositions (Examples 1 to 7) of the present invention is excellent in surface resistivity, charged voltage, and charged voltage decay half-life, and mechanical. Excellent physical properties and moldability. In addition, the electrical performance is maintained after washing with water, and the durability is excellent.

  On the other hand, as shown in Table 1, the thermoplastic resin composition (Comparative Example 3) in which the organic ionic conductive agent was less than 0.01 parts by weight (not included) had high surface resistivity and charged voltage. Further, the thermoplastic resin composition (Comparative Example 4) in which the organic ionic conductive agent exceeds 20 parts by weight has a problem in extrudability and could not be granulated. In addition, the thermoplastic resin composition (Comparative Examples 1 and 2) containing 3 parts by weight or less of polyetheresteramide (Comparative Examples 1 and 2) has a high surface resistivity, and can measure a charged voltage or a charged voltage decay half-life. It was not possible (indicated by * in Table 1). In addition, the performance deteriorated after washing with water.

The thermoplastic resin composition of the present invention has a stable continuous antistatic property with a low surface resistivity, and is excellent in molding processability, surface appearance and mechanical properties. Therefore, the thermoplastic resin composition of the present invention takes advantage of the characteristic of having an excellent surface resistivity that has not been obtained so far, and is used for electrical / electronic parts, parts for transporting electrical / electronic parts, and display-related parts. It can be suitably used as a molded product such as a conveying component, particularly as an IC conveying case or IC tray that dislikes metal salts, or an electronic / electrical device component that dislikes static electricity.

Claims (13)

  For 100 parts by weight of thermoplastic resin composition containing 3 to 94 parts by weight of styrene resin (A), 3 to 94 parts by weight of aromatic polyester resin (B) and 3 to 45 parts by weight of polyetheresteramide (C) An antistatic thermoplastic resin composition comprising 0.01 to 20 parts by weight of the organic ionic conductive agent (D).   The antistatic thermoplastic resin composition according to claim 1, wherein the organic ionic conductive agent (D) is an imidazolium salt, a pyridinium salt, an ammonium salt or a phosphonium salt. The organic ionic conductive agent (D) is represented by the following general formula (1) or (2)

(Wherein R ¹ , R ² and R ⁴ each independently represent an alkyl group having 1 to 5 carbon atoms, and R ³ , R ⁵ and R ⁶ each independently represent hydrogen or an alkyl group having 1 to 5 carbon atoms. And X represents (CF ₃ SO ₂ ) ₂ N, (C ₂ F ₅ SO ₂ ) ₂ N, (CF ₃ SO ₂ ) ₃ C or CF ₃ SO ₃ ). The antistatic thermoplastic resin composition as described. The antistatic thermoplastic resin composition according to claim 3, wherein the organic ionic conductive agent (D) is represented by the general formula (1) or (2), wherein X is CF ₃ SO ₃ or (CF ₃ SO ₂ ) ₂ N. .   2. The antistatic heat according to claim 1, wherein the organic ionic conductive agent (D) is 1-butyl-3-methylpyridinium trifluoromethanesulfonate or 1-butyl-3-methylpyridinium bis (trifluoromethanesulfonyl) imide. Plastic resin composition. The polyether ester amide (C) is a poly (alkylene oxide) glycol having a number average molecular weight of 200 to 6000 and the following general formulas (I) to (III) having a number average molecular weight of 1,000 to 3,000:

(In the formula, R ⁷ and R ⁸ each independently represent an ethylene group or a propylene group, Y represents a covalent bond, an alkylene group having 1 to 6 carbon atoms, an alkylidene group having 2 to 6 carbon atoms, or an alkyl group having 7 to 17 carbon atoms. Represents a cycloalkylidene group, an arylalkylidene group having 7 to 17 carbon atoms, O, SO, SO ₂ , CO, S, CF ₂ , C (CF ₃ ) ₂ or NH, and X ^{1 to} X ¹² each independently represent hydrogen, An alkyl group having 1 to 6 carbon atoms, halogen, SO ₃ H or a metal salt thereof, and m and n represent the degree of polymerization.) The antistatic thermoplastic resin composition according to claim 1, comprising a compound as a constituent component.   The antistatic thermoplastic resin composition according to claim 1, wherein the polyetheresteramide (C) contains polyethylene oxide glycol having a number average molecular weight of 200 to 6000 as a constituent component.   The polyetheresteramide (C) constitutes a reaction product of an aminocarboxylic acid having 6 or more carbon atoms, a lactam having 6 or more carbon atoms, or a diamine having 6 or more carbon atoms and a dicarboxylic acid having 6 or more carbon atoms. The antistatic thermoplastic resin composition according to claim 1, which is contained as a component.   The styrene resin (A) contains a vinyl copolymer obtained by copolymerization of an aromatic vinyl monomer and another vinyl monomer copolymerizable with the aromatic vinyl monomer. The antistatic thermoplastic resin composition according to claim 1.   A styrene resin (A) was obtained by graft-polymerizing an aromatic vinyl monomer and another vinyl monomer copolymerizable with the aromatic vinyl monomer to a rubbery polymer. 2. The antistatic thermoplastic resin composition according to claim 1, comprising a graft copolymer.   A vinyl copolymer in which a styrene resin (A) is copolymerized with an aromatic vinyl monomer and another vinyl monomer copolymerizable with the aromatic vinyl monomer, and rubber The polymer contains an aromatic vinyl monomer and a graft copolymer obtained by graft polymerization of another vinyl monomer copolymerizable with the aromatic vinyl monomer. The antistatic thermoplastic resin composition according to claim 1.   The antistatic thermoplastic resin composition according to claim 1, wherein the aromatic polyester resin (B) contains polyethylene terephthalate, polypropylene terephthalate or polybutylene terephthalate. A molded article comprising the antistatic thermoplastic resin composition according to any one of claims 1 to 12.