JP2008170301A - Electrostatic chuck type sample fixing tool, cutting device for observation surface exposure, and surface layer physical property analyzer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To analyze a physical property of the surface layer of an extremely thin sample. <P>SOLUTION: An electrostatic chuck type sample fixing tool 1 for attracting and fixing a sample P by an electrostatic chuck onto a sample fixing surface 1a whose surface roughness (Rmax) is 5 μm or less, and a surface layer physical property analyzer body 2 for cutting the sample P fixed onto the sample fixing surface 1a with a cutting blade 2a from the surface and analyzing the physical property based on the cutting result are provided, Hereby, the surface layer of the extremely thin sample such as an extremely thin polymer film of about 15 μm can be cut properly, and the physical property of the surface layer can be analyzed properly. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electrostatic chuck type sample fixing jig, a cutting device for exposing an observation surface, and a surface layer property analyzing apparatus, and more particularly, an electrostatic chuck capable of suitably performing a surface property analysis of a very thin sample. The present invention relates to a type specimen fixing jig, a cutting device for exposing an observation surface, and a surface layer property analyzing apparatus.

2. Description of the Related Art Conventionally, a surface property analyzer that cuts the surface of a sample having a coating film with a cutting blade and measures the shear strength and peel strength of the coating film based on the cutting result is known (see, for example, Patent Document 1). . A sample fixing jig for holding a sample is known (for example, refer to Patent Document 2).
In addition, an instrumental analysis such as infrared analysis or TOF-SIMS is performed on a surface that is cut obliquely so that the depth of cut gradually increases (for example, a surface that is cut so that a depth of 0.5 μm from the surface appears uniformly). And analyzing the change in physical properties in the depth direction of the surface layer is known (for example, see Non-Patent Document 1).
On the other hand, an electrostatic chuck that holds a semiconductor wafer or the like by electrostatic force is known (for example, see Patent Document 3).
JP 2003-254894 A JP 2000-193571 A JP 2005-142591 A N.Man et al. "Depth profile analysis of chemically amplified resist by using TOF-SIMS with gradient shaving preparations" Applied Surface Science 231-232 (2004) 353-356

In a conventional surface physical property analyzer, a sample is pressed and fixed to a sample fixing surface of a sample table, or a sample is fixed by vacuum suction from a fine hole formed in the sample fixing surface.
However, in the case of a sample such as a very thin polymer film having a thickness of about 15 μm, there is a problem that the sample is damaged when pressed, and the sample cannot be cut due to undulation when vacuumed.

On the other hand, it is conceivable to use a conventional electrostatic chuck as a sample fixing means of the surface property analyzing apparatus.
However, in the conventional electrostatic chuck, when a sample such as a very thin polymer film of about 15 μm is held, the sample surface is uneven due to the unevenness of the adsorption surface, and the depth of cut gradually increases from the surface toward the inside. Therefore, it becomes impossible to cut obliquely, and an error is likely to occur in the analysis in the depth direction of the surface layer.

  Accordingly, an object of the present invention is to provide an electrostatic chuck type sample fixing jig, a cutting device for exposing an observation surface, and a surface layer property analyzing apparatus that can suitably perform surface property analysis of a very thin sample. is there.

In a first aspect, the present invention includes a sample fixing surface having a surface roughness (Rmax) of 5 μm or less, and electrostatic adsorption means for adsorbing and fixing the sample to the sample fixing surface by an electrostatic chuck. An electrostatic chuck type sample fixing jig is provided.
In the electrostatic chuck type sample fixing jig according to the first aspect, the sample is attracted and fixed to the sample fixing surface having a surface roughness (Rmax) of 5 μm or less by the electrostatic chuck. Thereby, even in the case of a sample such as a very thin polymer film of about 15 μm, the sample can be fixed in a flat state without being damaged. Therefore, it is possible to cut a very thin sample at a certain depth from the surface, or obliquely so that the depth of cut gradually increases.

In a second aspect, the present invention comprises the electrostatic chuck type sample fixing jig of the first aspect and a cutting means for cutting from the surface of the sample fixed to the sample fixing surface using a cutting blade. An observation surface exposure cutting device is provided.
In the observation surface exposure cutting apparatus according to the second aspect, the sample is attracted and fixed to the sample fixing surface having a surface roughness (Rmax) of 5 μm or less by an electrostatic chuck, and cutting is performed using a cutting blade. As a result, even in the case of a sample such as a very thin polymer film of about 15 μm, the sample can be fixed in a flat state without being damaged, and can be cut at a certain depth from the surface or gradually deepened. Can be cut diagonally.

In a third aspect, the present invention provides a surface layer physical property analyzing apparatus comprising the observation surface exposure cutting device of the second aspect and an analysis means for performing physical property analysis based on the cutting result. To do.
In the surface layer physical property analyzer according to the third aspect, the sample is attracted and fixed by an electrostatic chuck to a sample fixing surface having a surface roughness (Rmax) of 5 μm or less, and cutting is performed using a cutting blade. Perform physical property analysis. As a result, even in the case of a sample such as a very thin polymer film of about 15 μm, the sample can be fixed in a flat state without being damaged, and can be cut at a certain depth from the surface or gradually deepened. Thus, it is possible to analyze the physical properties of a surface having a certain depth from the surface and the physical property changes in the depth direction of the surface layer.

  According to the electrostatic chuck type sample fixing jig, the observation surface exposure cutting device, and the surface layer physical property analysis device of the present invention, the surface layer of a very thin sample such as a very thin polymer film of about 15 μm is suitably cut. Thus, the physical property analysis of the surface layer can be suitably performed.

  Hereinafter, the present invention will be described in more detail with reference to embodiments shown in the drawings. Note that the present invention is not limited thereby.

FIG. 1 is a perspective view of a main part showing a surface layer physical property analyzing apparatus 100 according to the first embodiment.
The surface layer physical property analyzing apparatus 100 includes an electrostatic chuck type sample fixing jig 1 for attracting and fixing a sample P by an electrostatic chuck to a sample fixing surface 1a having a surface roughness (Rmax) of 5 μm or less, and a surface layer physical property analyzing apparatus main body. 2 is provided.

  As shown in FIG. 2, the electrostatic chuck type sample fixing jig 1 is provided on a base 10, an electrode portion 11 that is supplied with a voltage from a power source 15 and generates an electrostatic force, and an upper surface side of the electrode portion 11. A protective layer 12 and a hard coat layer 13 provided on the upper surface side of the protective layer 12.

  The protective layer 12 is, for example, an epoxy resin.

The hard coat layer 13 is, for example, Atom Compound HCS or Atom Compound HUV-628A manufactured by Atomics.
For example, since the epoxy resin protective layer 12 has irregularities, the above-described hybrid resin paint is coated on the upper surface of the protective layer 12 with a bar coater, and is allowed to cure at room temperature for 3 hours. Thereby, the surface roughness (Rmax) of the sample fixing surface 1a can be reduced to 5 μm or less.

  The surface layer physical property analyzing apparatus main body 2 has a conventionally known configuration (for example, a configuration described in Patent Document 1), and a cutting unit that uses the cutting edge 2a to cut from the surface of the sample P fixed to the sample fixing surface 1a; And an analysis unit that performs physical property analysis based on the cutting result.

According to the surface layer property analyzing apparatus 100 of the first embodiment, the following effects can be obtained.
(1) Even a very thin sample P such as a very thin polymer film of about 15 μm can be fixed in a flat state without being damaged by the electrostatic chuck type sample fixing jig 1.
(2) Even a very thin sample P such as a very thin polymer film of about 15 μm can be cut at a certain depth from the surface or can be cut obliquely so that the depth of cut gradually increases.
(3) Even with a very thin sample P such as a very thin polymer film of about 15 μm, it is possible to analyze physical properties of a surface having a certain depth from the surface and changes in physical properties in the depth direction of the surface layer.

  The surface of the protective layer 12 made of epoxy resin may be mechanically polished so that the surface roughness (Rmax) is 5 μm or less. In this case, the hard coat layer 13 may be provided or omitted.

  For example, it can be used to analyze the physical properties of the surface layer of a very thin sample such as a polyethylene film having a thickness of 15 μm.

1 is a perspective view of a main part showing a surface layer property analyzing apparatus according to Example 1. FIG. It is sectional drawing of an electrostatic chuck type sample fixing jig.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electrostatic chuck type sample fixing jig 1a Sample fixing surface 2 Surface layer physical property analyzer main body 2a Cutting edge 100 Surface physical property analyzer P Sample

Claims (3)

An electrostatic chuck type sample fixing jig comprising: a sample fixing surface having a surface roughness (Rmax) of 5 μm or less; and an electrostatic adsorption means for adsorbing and fixing the sample to the sample fixing surface by an electrostatic chuck. . An observation surface exposure cutting apparatus comprising: the electrostatic chuck type sample fixing jig according to claim 1; and a cutting means for cutting from the surface of the sample fixed to the sample fixing surface using a cutting blade. . A surface layer physical property analyzing apparatus comprising the observation surface exposure cutting device according to claim 2 and physical property analyzing means for performing physical property analysis based on the cutting result.

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