JP2008147140A - Backlight unit and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a backlight unit excelling in heat radiation capability and mass productivity. <P>SOLUTION: This backlight unit is provided with a light source, a substrate with the light source arranged thereon, a light guide body guiding light from the light source, and a housing having a recessed part for housing them therein. The backlight unit is characterized in that the substrate has a first substrate arranged on a sidewall of the recessed part, and a second substrate arranged on the bottom surface of the recessed part; and the first substrate with the light source arranged thereon and the second substrate are connected to each other by a connection member. In addition, at least one of the first substrate and the second substrate has holes penetrated in its thickness direction; and projecting parts formed on the connection member are fitted in the holes. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a backlight structure used for a liquid crystal display module or the like.

  For example, in the backlight unit described in Japanese Patent Application Laid-Open No. 2003-90993, a flexible wiring board (hereinafter sometimes referred to as “flexible board”) on which a light emitting diode is mounted is oriented in the direction of the end face of the light guide plate. The light emitting surface of the light emitting diode is opposed to the end surface of the light guide plate. This light-emitting diode is configured by mounting an LED chip on a package, and an electrode provided in the package is soldered to a conductor wiring of a flexible substrate. Thereby, the light emitting diode is electrically and mechanically connected to the flexible substrate.

JP2003-90993A.

  However, the heat radiation from the light emitting diode in the backlight unit is mainly from the side edge of the flexible substrate on which the light emitting diode is mounted to the side wall of the housing that the back of the side edge contacts. Therefore, it has become impossible to sufficiently dissipate the heat generated with the higher output of the light emitting diode.

  Further, by using a solder having a high melting point, when the light emitting diode is soldered, the heat transmitted to the wiring board is increased. For this reason, it may be better to use a thick non-flexible wiring board having higher heat resistance than a thin flexible board.

  Also, when placing the wiring board on which the light-emitting diode is mounted on the housing, the main surface side where the light emitting surface is provided faces the end surface of the light guide plate, and the thin side surface is placed on the bottom surface side of the housing It was difficult in the manufacturing process, and it took time to manufacture the backlight unit.

  Therefore, an object of the present invention is to provide a backlight unit with improved heat dissipation from a light source and easy to manufacture.

  In order to achieve the above object, a backlight unit according to the present invention includes a light source, a substrate on which the light source is disposed, a light guide that guides light from the light source, and a recess in which they are accommodated. A housing having a first substrate disposed on a side wall of the recess, and a second substrate disposed on a bottom surface of the recess, and the light source is disposed on the substrate. The first substrate and the second substrate are connected by a connecting member.

  At least one of the first substrate or the second substrate has a hole penetrating in the thickness direction, and a protrusion provided on the connecting member is inserted into the hole. The first substrate and the second substrate are preferably connected.

  It is preferable that the connecting member has a flat portion that contacts at least one main surface of the first substrate or the second substrate, and the protruding portion protrudes from the flat portion.

  It is preferable that an end portion of the protruding portion protrudes from the back surface of at least one of the first substrate and the second substrate.

  The protrusion of the connecting member is preferably made of a metal material, and the flat portion is preferably made of a heat-resistant resin material.

  The protrusion of the connecting member is soldered to the first substrate or the second substrate, protrudes from the flat portion, and another protrusion made of a resin material is the first substrate or the second substrate. It is preferably welded to the substrate.

  In order to achieve the above-described object, a method for manufacturing a backlight unit according to the present invention includes a light source, a substrate on which the light source is disposed, a light guide that guides light from the light source, and the light source. And a housing having a recess, and a manufacturing method of a backlight unit, a side end portion of the first substrate on which the light source is arranged, and a second substrate different from the first substrate, A first step of connecting the two through the connecting member, a second step of arranging the second substrate on the bottom surface of the recess of the housing, and disposing a light guide on the second substrate. And a third step of causing the end face of the light guide to face the light emitting surface of the light source.

  A step of connecting at least one of the substrates or the connecting member by fitting a projection of the connecting member into a through-hole formed in at least one of the first substrate or the second substrate. Is preferred.

  It is preferable to include a step of connecting the connecting member to the second substrate after arranging the connecting member on the first substrate.

  The protrusion made of the metal material of the connecting member is soldered to the first substrate or the second substrate, and another protrusion made of the resin material of the connecting member is soldered to the first substrate or the above It is preferable to have a step of welding to the second substrate.

  In the backlight unit according to the present invention, since the substrate on which the light source is disposed and the substrate disposed on the bottom surface of the housing are connected, heat radiation from the light source can also be performed on the bottom surface side of the housing. . Therefore, a backlight unit with improved heat dissipation can be obtained.

  In addition, a manufacturing method in which a plurality of substrates are connected in advance and then a predetermined substrate is disposed on the bottom surface of the housing makes it easy to dispose the substrate on which the light source is disposed on the housing. Therefore, it can be set as the backlight unit which is easy to manufacture.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the backlight unit for embodying the technical idea of the present invention, and the present invention does not limit the backlight unit to the following.

  Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. The dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the description unless otherwise specified. It is just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members, and detailed description will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.

  FIG. 1 is a perspective view showing each constituent member in the backlight unit of the present embodiment. FIG. 2 is a perspective view showing a connecting member in the backlight unit of the present embodiment.

  The backlight unit according to the present invention includes a light source 221, a substrate on which the light source 221 is disposed, a light guide that guides light from the light source, and a housing 101 having a recess in which they are housed, It is related with the backlight unit provided with. In such a backlight unit, in order to ensure sufficient heat dissipation accompanying the increase in the output of the light source, the backlight unit according to the present invention includes the first substrate 201 disposed on the side wall of the recess, A second substrate 202 disposed on the bottom surface of the recess, and the first substrate 201 and the second substrate 202 on which the light source is disposed are connected by a connecting member 203. It is characterized by.

  In the backlight unit according to the present invention, since the substrate on which the light source is disposed and the substrate disposed on the bottom surface of the housing are connected, heat radiation from the light source can also be performed on the bottom surface side of the housing. . Therefore, a backlight unit with further improved heat dissipation can be obtained. In the backlight unit of the present embodiment, the light source is arranged on the first substrate, but this does not exclude the form in which the light source is arranged on the second substrate in addition to the first substrate. In other words, the backlight unit of the present embodiment uses the first substrate as the main light source arrangement, and the present invention includes another embodiment in which an auxiliary or additional light source is arranged on the second substrate. Shall be.

  At least one of the first substrate 201 on which the light source is disposed or the second substrate 202 disposed on the bottom surface of the housing 101 has holes 211 and 212 that are penetrated in the thickness direction, and further, It is preferable that the first substrate and the second substrate are connected by inserting the protrusions 213 and 223 provided on the member 203 into the holes 211 and 212. The connection between the connecting member and each substrate can be made by bonding or welding with an adhesive, but the first substrate 201 and the second substrate 202 are firmly fixed by the protrusion of the connecting member and the hole in the substrate. can do.

  The connecting member 203 in this embodiment has a flat portion 243 that contacts at least one main surface of the first substrate or the second substrate, and the protruding portion 213 protrudes from the plane of the flat portion. Is preferred. The flat portion 243 provided on the connecting member is brought into contact with the main surfaces of the first substrate and the second substrate, so that each member is accurately positioned. Further, when the flat portion 243 and the main surface of the substrate are in contact with each other, the protruding portion protruding by a predetermined length from the flat portion is inserted into the through hole, and the end of the protruding portion is set to the predetermined length. That is, it can protrude from the back surface of the substrate. Note that the number of protrusions provided on one flat portion may be one, or a plurality of protrusions in order to obtain a strong connection. In addition, the number of protrusions on the first substrate side and the number of protrusions on the second substrate side and the number of corresponding through holes may be the same or different in consideration of the size and shape of each member. Good. Further, one connecting member may correspond to the pair of through holes, or one connecting member provided with a plurality of protrusions may correspond to a plurality of pairs of through holes. In the case of the latter, since the plurality of protrusions can be inserted into the plurality of through holes with a single connecting member, the working efficiency of connecting the connecting member to the substrate can be improved.

  It is preferable that an end portion of the protruding portion of the connecting member 203 protrudes from the back surface of at least one of the first substrate 201 and the second substrate 202. Thereby, it is possible to form a solder fillet that spreads from the end of the protrusion protruding from the back surface of the substrate to the back surface of the substrate, or to weld the end of the protrusion to the substrate. By setting it as such a fixing method, a board | substrate and a connection member can be fixed firmly.

  The protrusion of the connecting member 203 is preferably made of a metal material, and the flat portion is preferably made of a resin material. By using a metal material for the protrusions inserted into the holes of the substrates, heat transfer between the substrates can be improved. In addition, by using a resin portion that is preferably used as an insulator as a flat portion, a short circuit due to the flat portion that may come into contact with the wiring on the substrate surface can be eliminated. Furthermore, the first substrate 201 and the second substrate 202 can be electrically connected by using a part of the connecting member 203 as a metal material. For example, the connecting member 203 is made of brass, copper, iron, or an alloy thereof, and a rod-shaped body having an outer diameter corresponding to the diameter of the hole provided in the substrate is easily connected to the substrate such as an L-shape. Bend into shape. Further, the flat portion of the connecting member 203 is made of a resin material such as polycarbonate or nylon having high heat resistance, and a resin material so that a rod-shaped material bent into a desired shape is inserted into the inside from the flat surface. Is molded. Note that the protrusion may be formed by bonding another member to the main body having a flat portion, or may be formed integrally with the formation of the main body.

  The protruding portion of the connecting member 203 is soldered to the first substrate 201 or the second substrate 202. Further, apart from the protruding portion made of a metal material protruding from the flat portion of the connecting member 203, a resin material is used. It is preferable that the protruding portion to be welded to the first substrate or the second substrate. Even if the connection strength between the projection part of one of the metal material or resin material and the substrate decreases depending on the usage environment of the backlight unit, the connection can be maintained with the other connection strength, so a highly reliable backlight It can be a light unit. For example, even if the solder fillet formed on the protrusion made of the metal material and the back surface of the substrate is damaged, the connection state in which the protrusion made of the resin material and the back surface of the substrate are welded is maintained. In addition, another protrusion part which consists of resin materials can also be formed with the same material as the flat part of the above-mentioned connection member, and can also be shape | molded integrally with the shaping | molding of the flat part.

  The manufacturing method of the backlight unit of the present embodiment includes a light source, a substrate on which the light source is disposed, a light guide that guides light from the light source, and a housing having a recess in which they are accommodated. The present invention relates to a method of manufacturing a provided backlight unit. In order to facilitate the manufacturing method of such a backlight unit, the manufacturing method of the backlight unit of the present invention includes a side end portion of the first substrate 201 on which a light source is arranged in advance, the first substrate 201, Includes a first step of connecting another second substrate 202 via the connecting member 203, a second step of disposing the second substrate 202 on the bottom surface of the recess of the housing 101, and the second step. And a third step of arranging the light guide 100 on the substrate 202 and causing the end face of the light guide 100 to face the light emitting surface of the light source 221.

  As described above, a manufacturing method in which a plurality of substrates including a substrate on which a light source is arranged in advance is connected, and then a predetermined substrate is arranged on the bottom surface of the housing. Thereby, in the backlight unit in which the light source needs to be disposed on the end face of the light guide, the substrate on which the light source is disposed can be easily disposed on the casing. Therefore, it can be set as the backlight unit which is easy to manufacture. The backlight unit in this embodiment is configured to receive light from the light source from the side surface of the light guide plate. Therefore, the side surface of the first substrate is the side edge of the second substrate so that the first substrate on which the light source is disposed is substantially perpendicular to the second substrate disposed on the bottom surface of the housing. It is in contact with the upper surface and connected. If the light emitting surface of the light source faces the end surface of the light guide plate, there is no need to connect the first substrate and the second substrate vertically (90 °), and the first substrate and the second substrate The angle formed by can be any angle.

  By fitting the projections 213 and 223 provided on the connecting member 203 into the through holes formed in at least one of the first substrate 201 and the second substrate 202, the at least one of the substrates or the connecting member 203 is attached. It is preferable to have a step of connecting. By connecting a board | substrate and a connection member via a projection part, a board | substrate and a connection member can be connected with a sufficient precision compared with the method of adhere | attaching only with an adhesive material.

  It is preferable to include a step of connecting the connecting member 203 to the second substrate 202 after arranging the connecting member 203 on the first substrate 201 on which the light source is previously arranged. By adopting such an order of steps, the connecting member 203 is arranged on the second substrate 202 in advance, and then compared with the method of connecting the connecting member 203 and the first substrate on which the light source is arranged. In addition, the arrangement of the connecting members can be performed with high accuracy together with the arrangement of the light sources. Therefore, the backlight unit can be easily manufactured without considering interference between the light source of the first substrate 201 and the connecting member disposed on the second substrate 202.

  The protrusion made of a metal material provided on the connecting member 203 is soldered to the first substrate 201 or the second substrate 202, and another protrusion made of the resin material of the connecting member 203 is It is preferable to have a step of welding to the first substrate 201 or the second substrate 202. Thereby, a board | substrate and the connection member 203 can be connected firmly. Hereinafter, each structure of this form is explained in full detail.

(light source)
The light source in this embodiment emits light that can be incident on a light guide, such as a semiconductor light emitting element such as a light emitting diode or a semiconductor laser, a cold cathode ray tube, or a composite light source that is selected and combined variously. Say. Regarding the arrangement of the light source on the light guide, it may be an edge light system in which the light source is arranged on the side end surface of the light guide, or directly under the light source arranged on the lower surface opposite to the light emission observation surface of the light guide. A mold method may be used, or a method using them together.

  Hereinafter, although a light emitting diode is demonstrated, it is not limited to this. The light emitting diode can be variously selected depending on the dominant wavelength of light emitted from the semiconductor layer. In particular, light-emitting diodes that emit white mixed light are widely used. Such light-emitting diodes include various combinations of LED chips that emit RGB colors, light-emitting diodes including LED chips, and phosphors that emit light excited by light emitted from the LED chips. Things. An LED chip capable of emitting blue light can emit light with high brightness by using, for example, a gallium nitride compound semiconductor.

  In addition, the light emitting diode in this embodiment is an LED chip mounted on a package. The electrode arranged in the package and the electrode of the LED chip are electrically connected by a conductive wire such as a gold wire or a conductive paste such as an Ag-containing epoxy resin. The LED chip and the conductive wire are covered with a light-transmitting resin such as an epoxy resin or a silicone resin, and are protected from the external environment.

  The package used in this embodiment is preferably a frame insert molded body having a recess in which an LED chip is disposed. Examples of the package material include epoxy resin, acrylic resin, PBT (polybutylene terephthalate), liquid crystal polymer, and aromatic nylon. And the like in which additives such as white pigment are mixed.

  As another package, a ceramic package obtained by laminating and firing ceramic green sheets can be obtained. Since the ceramic package is superior in heat resistance and light resistance as compared with a package made of a resin material, it can be a light emitting diode with high output and high reliability.

Here, the translucent resin that covers the LED chip may contain a fluorescent material as necessary. The fluorescent material used in the present embodiment converts the wavelength of the LED chip light. That is, the fluorescent material absorbs at least a part of the light of the LED chip and emits light having a different wavelength. Here, the phosphor is preferably a phosphor that converts light from the LED chip to a longer wavelength side. When the light from the LED chip is high-energy short-wavelength visible light, YAG: Ce (for example, YAlO ₃ : Ce, Y ₃ Al ₅ O ₁₂ : Ce, etc.), which is a kind of aluminum oxide phosphor, or Eu Inorganic phosphors such as nitrogen-containing CaO—Al ₂ O ₃ —SiO ₂ activated by Cr and / or Cr are suitably used. In particular, the YAG: Ce phosphor absorbs part of the blue light from the LED chip depending on its content and emits yellow light that is a complementary color. Can be formed relatively easily.

(substrate)
A board | substrate is a board | plate material for mounting a light source, and the conductor wiring for supplying electric power to a light source is given. A normal printed circuit board can be suitably used as the substrate of this embodiment. For example, it can be suitably formed by a glass epoxy substrate provided with a conductive pattern made of copper foil or the like, or a metal body bonded with an insulating resin.

  Or it can be set as the board | substrate with high heat dissipation by which conductor wiring was given to the metal material which consists of aluminum and copper via the insulating material. Moreover, it is preferable that a board | substrate is closely_contact | adhered and arrange | positioned through a heat-conductive member like a heat dissipation sheet.

(Light guide)
The light guide in this embodiment refers to a light which can guide light from a light source incident from a part of an end face by utilizing internal reflection and emit light in a desired shape from a predetermined light exit surface. It is an optical member. Therefore, depending on the desired shape of the light emitting surface, various shapes such as a needle shape that can be used as a meter needle and a plate shape that can be used as a liquid crystal backlight light source can be used. The light guide has translucency in order to efficiently emit light from the light emitting diode or light obtained by wavelength conversion of the light from the light emitting surface. As a material for such a light guide, various materials such as acrylic resin, epoxy resin, polycarbonate, glass and the like can be preferably cited.

(Casing)
The housing in this embodiment has a recess that accommodates a substrate on which a light source is disposed, a light guide, and an optical sheet portion including a diffusion sheet and a prism sheet, and a frame body is provided at the opening of the recess. It is a member which is arrange | positioned and hold | maintains those members.

  As the material for the housing, various materials such as resins and metals containing various light diffusing agents are preferably exemplified. In particular, in consideration of heat dissipation and light reflection of a light emitting diode that generates heat, metals such as nickel, iron, copper, and aluminum, and various alloys such as stainless steel are more preferably used. The size and shape of the housing can be variously selected according to the size and shape of the member to be accommodated.

  Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.

  FIG. 3 is a cross-sectional view of the backlight unit of the present embodiment. Note that the casing is not shown for simplicity.

  The backlight unit 300 according to the present embodiment includes a plurality of light emitting diodes 302, a first substrate 301 on which the light emitting diodes 302 are disposed, a light guide that guides light incident from the light emitting diodes 302, And a housing having a recess in which they are accommodated. Further, the two first substrates 301 on which the plurality of light emitting diodes are arranged are respectively arranged at two side end portions extending in the longitudinal direction of the second substrate 307, and the second substrate 301 to which the first substrate 301 is connected. The substrate 307 is disposed on the bottom surface of the recess of the casing. Here, the side surface of the first substrate 301 is disposed on the upper surface of the side end portion of the second substrate 307 and is connected by the connecting member 303. Further, the first substrate 301 is disposed on the inner surface side of the housing.

  The connecting member 303 of the present embodiment is obtained by inserting a metal bar made of copper into a main body made of nylon. The main body of the connecting member 303 has a substantially rectangular parallelepiped shape, and includes a plane including two flat portions provided by adjacent side surfaces in contact with the main surfaces of the first substrate 301 and the second substrate 307. Thus, the ends of the metal bar bent in an L shape are projected into a plurality of pairs of protrusions. In the following description, of the two flat portions, the one facing the first substrate 201 is referred to as a “first flat portion”, and the one facing the second substrate 202 is a “second flat portion”. And Of the protrusions protruding from the two flat portions, the protrusion inserted into the through hole 211 of the first substrate 201 is referred to as a “first protrusion 304”, and the through hole of the second substrate 202 is used. The protrusion inserted through 212 is referred to as a “second protrusion 305”.

  Protrusions 213 and 223 protruding from the first and second flat portions of the connecting member 303 are inserted into holes 211 and 212 formed in the first substrate 201 and the second substrate 202, and from the back surface of the substrate. The protruding end is soldered. A solder fillet is formed from the back surface of the substrate to the protruding portion. Furthermore, another protrusion of the connecting member is a part that protrudes from the main body, and is made of the same material nylon as the main body, and the part that protrudes from the back surface of the substrate passes through the hole of the substrate. It is welded.

  The connecting members 303 of this embodiment are arranged one by one at the side end portions that extend in the longitudinal direction (perpendicular to the paper surface of FIG. 3) of each substrate. After the first substrate 201 is connected to the second substrate 307, the light emitting diode 302 is arranged in the longitudinal direction of the first substrate 201 so that the light emitting diode 302 is positioned on the connecting member 303 as shown in the figure. Is arranged in multiple. Further, the resin frame 306 is disposed on the second substrate 307, avoiding the space where the connecting portion 303 is disposed, the light guide plate 308 is placed on the resin frame, and the opposite end surfaces of the light guide plate 308 are respectively It faces the light emitting surface of the light emitting diode 302 arranged on the two first substrates.

  Next, the manufacturing method of the backlight unit 300 of the present embodiment will be described in detail. As a first substrate 301, an electrode of a light emitting diode (manufactured by Nichia Corporation, product model number NCCW002) 302 is soldered to a conductor wiring mainly made of copper applied to a glass epoxy substrate. A through hole is previously formed in the thickness direction in the side edge of the substrate. The thickness of the first substrate is 1.2 mm, and the size and shape thereof correspond to the size of the side wall that forms the recess of the housing. Further, the first protrusion 304 of the connecting member 303 is inserted into the through hole of the first substrate 301, and the first flat portion from which the first protrusion 304 is protruded is the main portion of the first substrate 301. The end of the first protrusion 304 protruding from the back surface is brought into contact with the surface and soldered to the back surface of the substrate. The second protrusion 305 provided on the connecting member 303 together with the first protrusion 304 protrudes from the side surface of the first substrate 301 by a predetermined size in consideration of the thickness of the second substrate 307. .

  The second substrate 307 in this embodiment is made of the same material as that of the first substrate 301, has a size that is substantially the same as the size of the bottom surface of the housing, and has a thickness of 1.2 mm. The second substrate 307 is also provided with conductor wiring in the same manner as the first substrate 301. The second substrate 307 is electrically connected to the first substrate 301 or an external power source, and the metal of the conductor wiring. The heat dissipation by the material can also be improved. Similar to the first substrate 301, a plurality of through holes 212 are also formed in the second substrate 307 in advance, and the second protrusions 305 of the connecting member are inserted into the through holes 212, The second flat portion and the side surface of the first substrate are brought into contact with the main surface of the second substrate 307, and the end of the second protrusion 305 protruding from the back surface and the back surface of the second substrate 307 are soldered. To do. In addition, the 2nd projection part 305 in a present Example is not what protruded from the 2nd flat part, The metal bar protruded from the side surface adjacent to a 2nd flat part is used as a rectangular parallelepiped connection member. It is bent along the surface and protrudes from the same plane as the second flat portion. Thus, the protrusion of the connecting member of the present invention does not need to be a protrusion directly protruding from the flat portion facing the main surface of the substrate, and can be formed into a desired shape by bending the metal bar.

  Further, the connecting member is formed with a protrusion (not shown) different from the protrusion made of a metal material, and the other protrusion made of the same material nylon as the main body of the connecting member The end part which protruded from the back surface of the board | substrate is inserted into the through-holes 211 and 212 of the 1st and 2nd board | substrates 201 and 202, and is welded to the back surface of a board | substrate.

  Finally, a frame 306 and a light guide plate 308 are sequentially arranged on the second substrate 307, and these are housed in a housing to form a backlight unit. The thickness of the frame 306 is adjusted so that the light emitting surface of the light emitting diode 302 fits within the end surface of the light guide plate 308 in consideration of the size of the connecting member 303 and the light emitting diode 302.

  INDUSTRIAL APPLICABILITY The present invention can be used as an in-vehicle liquid crystal display device or a large display as a backlight unit with improved heat dissipation.

FIG. 1 is a perspective view schematically showing one embodiment of the present invention. FIG. 2 is a perspective view showing an embodiment of the constituent member of the present invention. FIG. 3 is a cross-sectional view showing an embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Light guide plate 101 ... Case 201, 301 ... 1st board | substrate 202,307 ... 2nd board | substrate 203, 303 ... Connection member 211 ... 1st through-hole 212 ... second through holes 213, 304 ... first projections 223,305 ... second projections 243 ... flat portions 300 of connecting members ... backlight units 221, 302 ..Light source 306 ... frame

Claims (10)

In a backlight unit comprising a light source, a substrate on which the light source is disposed, a light guide that guides light from the light source, and a housing having a recess in which they are accommodated,
The substrate has a first substrate disposed on a side wall of the recess, and a second substrate disposed on a bottom surface of the recess,
The first substrate on which the light source is arranged and the second substrate are connected by a connecting member.   The at least one of said 1st board | substrate or said 2nd board | substrate has the hole penetrated in the thickness direction, The projection part provided in the said connection member is inserted by the hole. The backlight unit described in.   The said connection member has a flat part which contact | connects at least one main surface of said 1st board | substrate or said 2nd board | substrate, and the said protrusion part protrudes from the flat part. Backlight unit.   4. The backlight unit according to claim 2, wherein an end of the protruding portion protrudes from the back surface of at least one of the first substrate and the second substrate.   The backlight unit according to claim 3 or 4, wherein the protrusion of the connecting member is made of a metal material, and the flat portion is made of a heat-resistant resin material.   The protrusion of the connecting member is soldered to the first substrate or the second substrate, protrudes from the flat portion, and another protrusion made of a resin material is the first substrate or the second substrate. The backlight unit according to claim 5, which is welded to the substrate. A method of manufacturing a backlight unit comprising: a light source; a substrate on which the light source is disposed; a light guide that guides light from the light source; and a housing having a recess in which the light guide is housed. ,
A first step of connecting a side end portion of the first substrate on which the light source is disposed and a second substrate different from the first substrate via a coupling member;
A second step of disposing the second substrate on the bottom surface of the recess of the housing;
A third step in which a light guide is disposed on the second substrate, and an end surface of the light guide faces the light emitting surface of the light source;
The manufacturing method of the backlight unit characterized by having.   A step of connecting at least one of the substrates or the connecting member by fitting a protrusion of the connecting member into a through hole formed in at least one of the first substrate or the second substrate. Item 8. A method for manufacturing a backlight unit according to Item 7.   The method for manufacturing a backlight unit according to claim 7, further comprising a step of connecting the connecting member to the second substrate after arranging the connecting member on the first substrate.   The protrusion made of the metal material of the connecting member is soldered to the first substrate or the second substrate, and another protrusion made of the resin material of the connecting member is soldered to the first substrate or the second substrate. The method for manufacturing a backlight unit according to claim 8, further comprising a step of welding to the second substrate.

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