JP2008007254A - Conveyance method and conveyance device for sheet-like substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and device for conveying a sheet-like substrate having a gripping part without dropping it and causing its positional deviation during conveyance. <P>SOLUTION: The method conveys the sheet-like substrate 1 having a first main face and a second main face, and also having the gripping part 1g connected with an end part of the sheet-like substrate 1 and protruding onto a second main face side. The method comprises steps of: loading and sucking the sheet-like substrate 1 so that the second main face comes into contact with a substrate supporting base 11 having thickness being larger than length of protrusion of the gripping part 1g from the second main face; and moving the substrate supporting base 11 sucking the sheet-like substrate 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a transport method and transport device for a sheet-like substrate. More specifically, the present invention relates to a transport method and transport device for a sheet-like substrate including a grip portion at an end portion.

  Currently, the wafers used for solar cells that are rapidly spreading are mainly polycrystalline silicon. Recently, for the purpose of further cost reduction and silicon raw material saving, it has been kept below the melting point of silicon as a promising method for obtaining a sheet-like silicon substrate directly from molten silicon instead of the slicing process instead of the casting method. A method of obtaining a sheet-like silicon substrate by bringing a substrate (hereinafter referred to as a substrate growth substrate) into contact with a silicon melt has been proposed (see, for example, Patent Document 1).

  As disclosed in Patent Document 1, when a sheet-like silicon substrate is manufactured on a substrate growth substrate, a grip portion is formed at the end of the sheet-like silicon substrate, thereby growing the sheet-like silicon substrate. It is known that the fall rate from the substrate can be reduced. In addition, as disclosed in Patent Document 1, in particular, when the substrate growth base is enlarged, by providing a groove along the peripheral edge of the substrate growth base, the sheet-like silicon substrate and the substrate growth base It is known that silicon (hereinafter referred to as burrs) grown on the peripheral edge can be separated and the peelability can be improved.

For example, as disclosed in Patent Document 2, a vacuum suction type belt conveyor is known as a method for conveying a plate-like body. According to this method, it is possible to suppress misalignment, dropping, and the like by conveying the plate-like body to be conveyed while adsorbing it.
International Publication No. 2004/016836 Pamphlet JP 2000-74640 A

  For example, when processing a silicon sheet substrate grown on the surface of the substrate growth substrate into a product such as a solar cell, the sheet substrate is peeled off from the substrate growth substrate, and the peeled sheet substrate is cut to the cutting device. It is necessary to transport and cut the sheet-like substrate into a size required as a product by a cutting device.

  However, a sheet-like substrate having a grip portion, which is manufactured using a substrate growth substrate having a predetermined shape and can produce a sheet-like substrate with a high yield, has a main surface portion used as a product and a main surface portion. Since it has a three-dimensional shape due to the grip portion connected to the end portion of the surface portion, for example, it cannot be transported while being held by an adsorption method as disclosed in Patent Document 2, so that the sheet-like substrate is There is a problem of dropping or misalignment during transportation.

  The present invention has been made in view of the above-described problems, and transports a sheet-like substrate having a grip portion manufactured using a substrate-growing substrate having a predetermined shape without dropping and misalignment during transportation. It is an object to provide a method and apparatus.

  A sheet-like substrate conveyance method according to the present invention is a sheet-like substrate conveyance method having a first main surface and a second main surface, and the sheet-like substrate is connected to an end portion and is connected to the second main surface. The sheet-like substrate is mounted so that the second main surface comes into contact with a substrate support having a grip portion protruding to the surface side and having a thickness larger than the protruding length of the grip portion from the second main surface. Placing and adsorbing, and moving the substrate support on which the sheet-like substrate is adsorbed. With such a transport method, even a sheet-like substrate having a three-dimensional grip portion can be transported to a predetermined position without dropping or causing a positional shift during transport.

  A sheet-like substrate conveyance device according to the present invention is a sheet-like substrate conveyance device having a first main surface and a second main surface, and the sheet-like substrate is connected to an end portion and has a second main surface. The substrate has a gripping portion protruding to the surface side, and the transport device has a substrate support base having a thickness larger than the protruding length of the grip portion from the second main surface, and a substrate for adsorbing the sheet-like substrate to the substrate support base It includes a suction device and a substrate moving device that moves the substrate support. With such a transport device, even a sheet-like substrate having a three-dimensional grip portion can be transported to a predetermined position without dropping or causing a positional shift during transport.

  In the sheet substrate transfer apparatus according to the present invention, the substrate transfer device may include a conveyor belt for moving the substrate support. By moving the substrate support with the conveyor belt, it becomes easy to transport the sheet-like substrate to a predetermined position without dropping or causing positional deviation during the transportation.

  In addition, the substrate moving apparatus according to the present invention can include a drive device that causes the substrate support to shuttle. By causing the substrate support to shuttle, it becomes easy to transport the sheet-like substrate to a predetermined position without dropping or causing a positional shift during transportation.

  According to the present invention, it is possible to transport a sheet-like substrate having a grip portion to a predetermined position without dropping or causing a position shift during transportation.

  An embodiment according to the present invention will be described by taking a sheet-like silicon substrate as an example of the sheet-like substrate. The main point of the present invention is to convey a sheet-like substrate having a three-dimensional grip portion without dropping and misalignment. Accordingly, the sheet-like substrate that is the subject of the present invention is not limited to a sheet-like silicon substrate, and may be a sheet-like metal substrate, a sheet-like plastic substrate, or the like, as long as it is a sheet-like substrate having a three-dimensional grip portion. .

(Embodiment 1)
One embodiment of a sheet-like substrate conveyance device according to the present invention is a sheet-like substrate 1 conveyance device having a first main surface 1a and a second main surface 1b with reference to FIG. 1 and FIG. The sheet-like substrate 1 has a grip portion 1g connected to the end portion and projecting to the second main surface side 1b, and the conveying device projects the grip portion 1g from the second main surface 1b. It includes a substrate support 11 having a length L _g is greater than the thickness L, a and the substrate adsorption device for adsorbing the sheet-like substrate 1 on the substrate support table 11, a substrate moving device moving the substrate support table 11. Here, the substrate suction device includes a suction hole 12, a vacuum groove 14 and a vacuum tube 15 provided on the substrate support. Further, the substrate moving device includes a conveyor belt 13 and a roll 16 that move the substrate support 11.

  Further, in the transfer apparatus of the present embodiment, the placement suction unit 17 for placing the sheet-like substrate 1 on the substrate support 11 and the sheet-like substrate are taken out from the moved substrate support 11. And a take-out suction unit 18.

  Referring to FIG. 3, a sheet-like silicon substrate (sheet-like substrate 1) to be conveyed in the present embodiment has a grip portion 1g connected to an end portion and projecting to the second main surface side 1b. Have. That is, the grip part 1g which the edge part of the sheet-like silicon substrate (sheet-like board | substrate 1) bent and protruded to the 2nd main surface 1b side is formed. Here, the shape of the grip portion 1g is not particularly limited, and may be a shape in which the end portion of the sheet-like silicon substrate (sheet-like substrate 1) is bent as shown in FIG. 3 (a). As shown, the end of the sheet-like silicon substrate (sheet-like substrate 1) may be curved. Here, the main surface refers to a surface used for a certain purpose such as a cell surface of a solar battery. A method and apparatus for manufacturing such a sheet-like substrate will be described later.

  Regarding the substrate moving device, the conveyor belt 13 is held by a pair of rolls 16 provided before and after the moving direction of the substrate support 11, and travels in the horizontal direction by the rotation of the rolls 16.

  In the suction device, a plurality of suction holes 12 formed in the substrate support 11 fixed to the conveyor belt 13 are provided for sucking the sheet-like silicon substrate (sheet-like substrate 1). Vacuum is provided to the suction holes 12 through the vacuum grooves 14 provided in the lower part of the conveyor belt 13 within a range where it is necessary to suck the sheet-like silicon substrate (sheet-like substrate 1). The vacuum groove 14 is connected to a vacuum line through a vacuum tube 15. In FIG. 1, a vacuum pump or a vacuum ejector, a pressure gauge, an air filter, etc. are omitted.

  The mounting suction unit 17 is for mounting a sheet-like silicon substrate (sheet-like substrate 1) on the substrate support base 11, and the taking-out suction unit 18 is a sheet-like silicon substrate transported to a desired position ( For example, the sheet-like substrate 1) is taken out to a predetermined position such as a laser cutting device jig. The placement suction unit 17 and the removal suction unit 18 are connected to a moving device such as a multi-axis robot so that the sheet-like silicon substrate can be transferred to a required position.

The sheet-like silicon substrate (sheet-like substrate 1) is conveyed using the conveying apparatus of the present embodiment shown in FIG. 1 by the protruding length L of the grip portion 1g from the second main surface 1b as shown in FIG. A step of arranging and adsorbing a sheet-like silicon substrate (sheet-like substrate 1) such that the second main surface 1b contacts the substrate support 11 having a thickness L larger than _g (hereinafter referred to as substrate) And a step of moving the substrate support 11 by adsorbing the (sheet-like substrate 1) to the substrate support 11 (hereinafter referred to as a substrate moving step).

  In the substrate adsorption step, the following is performed. When the substrate support 11 is in a position (hereinafter referred to as a placement position) for receiving the placement of the sheet-like silicon substrate (sheet-like substrate 1), the sheet-like silicon substrate (sheet-like substrate 1) is placed on the placement adsorption unit 17. Is placed on the substrate support 11. The vacuum groove 14 is provided up to this mounting position, and the sheet-like silicon substrate is placed on the substrate support 11 and is sucked by the suction holes 12 of the substrate support 11 connected to the vacuum groove 14. Is done.

Here, the substrate support 11 has a thickness L larger than the protruding length L _g of the grip portion from the second main surface 1b of the sheet-like silicon substrate (sheet-like substrate 1). The protruding portions of the (sheet-like substrate 1) are installed on the conveyor belt 13 with an interval so as not to be placed on the substrate support base 11. In this way, the sheet-like silicon substrate (sheet-like substrate 1) can be placed on the substrate support 11 so that the second main surface 1b contacts the substrate support 11 and can be easily adsorbed. .

  Next, the substrate support 11 is moved by one pitch by rotating the roll 16 by one pitch. A new sheet-like silicon substrate (sheet-like substrate 1) is placed and adsorbed on the substrate support 11 that has newly reached the placement position by the method described above.

  In the substrate moving step, the substrate support 11 on which the sheet-like silicon substrate (sheet-like substrate 1) is adsorbed is moved to a desired take-out position by the rotation of the roll 16.

  Thus, the conveyed sheet-like silicon substrate (sheet-like substrate 1) is taken out from the substrate support 11 by the pick-up suction unit 18. The vacuum groove 14 is installed so that a part of the suction hole 12 of the substrate support 11 can be sucked when the substrate support 11 is in this take-out position. By providing the vacuum groove 14 in this manner, the sheet-like silicon substrate (sheet-like substrate 1) is transported to the take-out position without causing a positional shift, and at the same time, the suction force is weakened at the take-out position. Then, it is easily removed from the substrate support 11 by the take-out suction unit 18.

In this embodiment, the box-shaped substrate support 11 fixed on the conveyor belt 13 is used as the substrate support 11, but the substrate support 11 can be integrated with the conveyor belt 13. For example, a groove deeper than the protrusion length L _g of the grip portion from the second main surface 1b of the sheet-like silicon substrate (sheet-like substrate 1) is formed in the conveyor belt 13 at regular intervals, and suction holes are formed in the conveyor belt 13. (Not shown) is formed, and a sheet-like silicon substrate (sheet-like substrate 1) is directly placed on and adsorbed on a conveyor belt 13 as a substrate support base 11, and then a conveyor belt as a substrate support base 11 is attached. It is also possible to move it.

  Here, it is preferable to use a material having high heat resistance for the portion of the substrate support 11 that contacts the sheet-like silicon substrate (sheet-like substrate 1). This is because the sheet-like silicon substrate immediately after being formed by immersing the substrate growth base in the silicon melt is at a relatively high temperature, so the sheet-like silicon substrate (sheet-like substrate 1) immediately after the silicon melt immersion is transported. In this case, if the material has low heat resistance, there is a risk of deformation or the like. Furthermore, it is preferable to use a flexible material for the portion of the substrate support 11 that contacts the sheet-like silicon substrate (sheet-like substrate 1). By using a supple material, not only the impact on the sheet-like silicon substrate during transportation is softened, but even if the sheet-like silicon substrate has minute irregularities, the minute irregularities are absorbed by deformation, and adsorption is facilitated. Because it can. As a material having both heat resistance and flexibility, for example, fluorine rubber, silicon rubber and the like can be preferably cited.

(Embodiment 2)
Another embodiment of the sheet-like substrate conveying apparatus according to the present invention is a sheet-like substrate 1 conveying apparatus having a first main surface 1a and a second main surface 1b, with reference to FIGS. The sheet-like substrate 1 has a grip portion 1g connected to the end portion and protruding to the second main surface side 1b, and the transport device includes a grip portion 1g from the second main surface 1b. includes a substrate support 11 having a protruding length L _g is greater than the thickness L, a and the substrate adsorption device for adsorbing the sheet-like substrate 1 on the substrate support table 11, a substrate moving device moving the substrate support table 11. Here, the substrate suction apparatus includes a suction hole 12, a vacuum tube 25, and a vacuum control unit 29 provided in the substrate support 11. The substrate moving device includes a ball screw 23, a guide rail 24, and a motor 26.

  Further, in the transport apparatus of this embodiment, the sheet-like substrate is taken out from the placement suction unit 17 for placing the sheet-like substrate 1 on the substrate support 11 and the moved substrate support 11. And a suction unit 18 for taking out. The placement suction unit 17 and the removal suction unit 18 are the same as those in the first embodiment.

  Further, the sheet-like silicon substrate (sheet-like substrate 1) to be conveyed in the present embodiment is the same as the sheet-like silicon substrate in the first embodiment.

  With respect to the substrate moving device, the substrate support 11 can be shuttled by rotating the ball screw 23 connected to the substrate support 11 forward or backward by the motor 26.

  In the suction device, a plurality of suction holes 12 formed in the substrate support 11 are provided for sucking a sheet-like silicon substrate (sheet-like substrate 1). The suction hole 12 is connected to a vacuum line via a vacuum tube 15 and a vacuum control unit 29. In FIG. 2, a vacuum pump or a vacuum ejector, a pressure gauge, an air filter, etc. are omitted.

The sheet-like silicon substrate (sheet-like substrate 1) is conveyed using the conveying device of the present embodiment shown in FIG. A step of placing and adsorbing the sheet-like silicon substrate (sheet-like substrate 1) so that the second main surface 1b contacts the substrate support 11 having a thickness L larger than _g (substrate adsorption step) And a step of moving the substrate support 11 by adsorbing the (sheet-like substrate 1) to the substrate support 11 (substrate moving step).

  In the substrate adsorption step, the following is performed. When the substrate support 11 is at a position (placement position) for receiving the placement of the sheet-like silicon substrate (sheet-like substrate 1), the sheet-like silicon substrate (sheet-like substrate 1) is supported by the placement adsorption unit 17 on the substrate. Placed on the table 11. When the sheet-like silicon substrate (sheet-like substrate 1) is placed on the substrate support 11, it is adsorbed by the suction holes 12 of the substrate support 11 connected to the vacuum tube 15 by operating the vacuum control unit 29. The

Here, the substrate support 11 has a gripping projection length L _g is greater than the thickness of the portion L from the second principal surface 1b of the sheet-shaped silicon substrate (sheet-like substrate 1). In this way, the sheet-like silicon substrate (sheet-like substrate 1) can be placed on the substrate support 11 so that the second main surface 1b contacts the substrate support 11 and can be easily adsorbed. .

  In the substrate moving step, the substrate 26 is moved to a desired removal position by operating the motor 26 and rotating the ball screw 23 forward.

  Thereafter, the vacuum state of the suction hole 12 is released by the vacuum control unit 29, and the sheet-like silicon substrate (sheet-like substrate 1) is released from the suction to the substrate support base 11, and at the same time, the take-out suction unit 18 supports the substrate. It is taken out from the table 11. By controlling the vacuum state of the suction holes 12 in this way, the sheet-like silicon substrate (sheet-like substrate 1) is transported to the take-out position without causing a positional shift, and at the same time, is taken to the substrate support 11 at the take-out position. Is removed from the substrate support 11 by the take-out adsorption unit 18.

  In the conveyance of the sheet-like silicon substrate (sheet-like substrate 1) by the conveyance device of the present embodiment, a sheet-like silicon substrate having a grip portion protruding toward the second main surface 1b is used, and the second main surface 1b is used as the substrate. This is performed by making the substrate support table 11 perform a shuttle motion by contacting and adsorbing the support table 11. Therefore, the substrate support 11 is not limited to the shape shown in FIG. 2 as long as the above-described adsorption and shuttle motion are possible. Further, the driving device that causes the substrate support 11 to perform the shuttle motion is not limited to the motor 26 and the ball screw 23 as shown in FIG. 2, and may be an air thin cylinder, for example.

<Method for producing sheet-like substrate>
In the first and second embodiments, a method for manufacturing a sheet-like substrate to be conveyed will be described using a sheet-like silicon substrate as an example. First, a substrate growth base 41 for growing a sheet-like silicon substrate (sheet-like substrate 1) will be described with reference to FIG. The substrate growth base 41 is provided with a protrusion 41g for forming a grip portion 1g on a sheet-like silicon substrate. A gripping portion 1g of the sheet-like silicon substrate is formed so as to surround the protruding portion 41g, and the sheet-like silicon substrate (sheet-like substrate 1) is peeled off from the substrate growth base 41 when the sheet-like silicon substrate is manufactured. Can be prevented and the recovery rate can be improved. The groove 41d provided in the substrate growth base 41 facilitates separation of the burrs 1n from the sheet-like silicon substrate (sheet-like substrate 1).

  Next, with reference to FIG. 5, the manufacturing apparatus and manufacturing method of a sheet-like board | substrate are demonstrated. In the sheet-shaped silicon substrate manufacturing apparatus shown in FIG. 5, a crucible 51 is placed on a crucible lifting / lowering base 54 via a heat insulating material 53 and a crucible base 52. Is maintained above the melting point by a heater 55 disposed around the periphery of the heater. The heat insulating material 53 is used to keep the melt temperature uniform and to suppress heat removal from the crucible bottom. Further, this apparatus is designed such that the surface of the substrate growth base 41 fixed to the base fixing leg 56 is immersed in the silicon melt 50. The heat insulating material 53 is provided with a crucible lifting / lowering base 54 having a crucible lifting / lowering mechanism. This is because the sheet-like silicon substrate (sheet-like substrate 1) grows on the surface of the substrate growth base 41, so that the substrate growth base 41 can always be immersed at the same depth from the melt surface of the silicon melt 50. It is for moving up and down.

  When a sheet-like silicon substrate (sheet-like substrate 1) is grown on the substrate growth base 41 using such a sheet-like silicon substrate manufacturing apparatus, for example, the substrate growth base 41 shown in FIG. 1 is moved from the left side to the right side in the direction of the arrow in FIG. 5 so that the first main surface 41a faces downward and the protrusion 41g becomes the front surface in the traveling direction. At this time, the first main surface 41a and the protrusion 41g of the substrate growth base 41 are moved so as to contact the silicon melt 50, whereby the substrate growth base 41 has a sheet-like silicon substrate (having a grip portion 1g). A sheet-like substrate 1) grows.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is the schematic which shows one Embodiment of the conveying apparatus of a sheet-like board | substrate. It is the schematic which shows other embodiment of the conveying apparatus of a sheet-like board | substrate. It is a schematic sectional drawing which shows the sheet-like board | substrate mounted on the board | substrate support stand. Here, (a) shows one embodiment of the sheet-like substrate, and (b) shows another embodiment of the sheet-like substrate. (A) is the schematic which shows a substrate growth base | substrate and a sheet-like board | substrate. (B) is a schematic sectional drawing in line segment IVB-IVB of (a). It is the schematic which shows one Embodiment of the manufacturing apparatus of a sheet-like silicon substrate.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Sheet-like board | substrate, 1a, 41a 1st main surface, 1b 2nd main surface, 1g Grab part, 1n burr | flash, 11 Substrate support stand, 12 Adsorption hole, 13 Belt conveyor, 14 Vacuum groove, 15 Vacuum tube, 16 Roll, 17 Placement suction unit, 18 Takeout suction unit, 23 Ball screw, 24 Guide rail, 26 Motor, 29 Vacuum control unit, 41 Substrate growth base, 41d Groove, 41g Protrusion, 50 Silicon melt, 51 Crucible, 52 crucible base, 53 heat insulating material, 54 crucible lifting base, 55 heater, 56 base fixing leg.

Claims (4)

A method for conveying a sheet-like substrate having a first main surface and a second main surface,
The sheet-like substrate has a grip portion connected to an end portion and protruding toward the second main surface side,
Placing and adsorbing the sheet-like substrate so that the second main surface comes into contact with a substrate support having a thickness larger than the protruding length of the grip portion from the second main surface;
Moving the substrate support on which the sheet-like substrate has been adsorbed. A sheet substrate transport apparatus having a first main surface and a second main surface,
The sheet-like substrate has a grip portion connected to an end portion and protruding toward the second main surface side,
The transport device includes a substrate support base having a thickness larger than a protruding length of the grip portion from the second main surface, a substrate suction device for attracting the sheet-like substrate to the substrate support base, and the substrate support A sheet-like substrate transfer device including a substrate moving device for moving a table.   The sheet substrate transport device according to claim 2, wherein the substrate moving device includes a conveyor belt that moves the substrate support.   The sheet-like substrate transfer device according to claim 2, wherein the substrate moving device includes a driving device that shuttles the substrate support.

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