JP2008060318A - Table for sheet pasting machine, and wafer positioning method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To paste a protective sheet well to a wafer and to facilitate assembling work of an apparatus. <P>SOLUTION: The table 11 is constituted of an inner table section 14 having a surface 14A for mounting a wafer W, an outer table section 15 having a surface 15A for mounting a protective sheet H projecting to the outside of the wafer W mounted on the wafer mounting surface 14A, and an elevating apparatus 19 provided to support the inner table section 14. The elevating apparatus 19 has an upper tapered portion 22 provided below the inner table section 14, and a lower tapered portion 23 arranged oppositely to the upper tapered portion 22. The elevating apparatus 19 elevates/lowers the inner table section 14 by moving the tapered portions 22 and 23 relatively such that the circuit surface W1 of the wafer W mounted on the wafer mounting surface 14A is positioned in flush with the sheet mounting surface 15A. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a sheet sticking apparatus table and a wafer positioning method, and more particularly to a sheet sticking apparatus table and a wafer positioning method capable of firmly sticking a protective sheet to a semiconductor wafer.

  2. Description of the Related Art Conventionally, in a semiconductor wafer manufacturing process, a protective sheet is attached to a circuit surface of a semiconductor wafer. As an apparatus for attaching such a protective sheet, for example, the type shown in Patent Document 1 is known. It has been. The apparatus includes an inner table portion on which a semiconductor wafer is placed, an outer table portion provided at a position surrounding the inner table portion, a drive device that moves the inner table portion up and down by a feed screw shaft and a motor, and an inner table. And a pressing roller for pressing and attaching the protective sheet to the semiconductor wafer on the part. In such a configuration, before attaching the protective sheet to the semiconductor wafer, the inner table portion is raised and lowered via the driving device, and the circuit surface of the semiconductor wafer placed on the inner table portion and the outer table Adjustment is performed so that the upper surface of the portion is positioned on the same plane.

JP 2004-47976 A

In Patent Document 1, when the inner table portion is assembled, the wafer mounting surface of the inner table portion is the outer table portion so that the circuit surface of the semiconductor wafer and the upper surface of the outer table portion are positioned on the same surface. It is necessary to set it in parallel with the upper surface.
However, in Patent Document 1, since the inner table portion is supported in a scattered manner by the feed screw shaft and the guide portion, the feed screw shaft and the guide portion are slightly connected to make the surfaces parallel in the apparatus assembly stage. The adjustment work is indispensable, and the work is complicated and takes a long time. In addition, the parallel accuracy becomes unstable, and as a result, the pressing force applied from the pressing roller on the circuit surface is partly too strong, causing damage to the wafer, or the pressing force is too weak. There is an inconvenience that the protective sheet is not fully applied.
Moreover, in Patent Document 1, since the pressing force from the pressing roller is applied in the extending direction of the feed screw shaft, that is, in the vertical direction, the time passes between the feed screw shaft and the nut screwed to the feed screw shaft or in the guide portion. As a result, rattling occurs, and the parallel accuracy is more likely to decrease.
Here, if the number of the guide portions is increased, the rigidity is increased, but there is another inconvenience that the adjustment operation described above is further complicated.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to be able to attach a protective sheet to a semiconductor wafer with high accuracy and to simplify the adjustment work of the attaching device. Another object of the present invention is to provide a sheet sticking device table and a wafer positioning method.

In order to achieve the above object, the present invention provides a sheet pasting apparatus table for pasting a sheet onto a surface of a semiconductor wafer via a pressing roller.
An inner table portion having a wafer placement surface on which the semiconductor wafer is placed, and a sheet placement surface on which the protective sheet that protrudes outside the wafer placed on the wafer placement surface is placed. And an elevating device provided to support the inner table portion,
The lifting device includes an upper taper portion provided at a lower portion of the inner table portion, and a lower taper portion disposed to face the lower side of the upper taper portion, and the inner table is moved by relatively moving the taper portion. The part is provided so that it can be moved up and down.

  In the present invention, it is preferable that at least one of the upper taper portion and the lower taper portion is formed of a plate-like member having a substantially entire region facing the other taper portion having a tapered surface.

  One of the upper taper portion and the lower taper portion includes a plurality of rail members extending in the inclination direction, and the other taper portion is movable along the rail member. A configuration including a slider is preferably employed.

  Further, the lower taper portion may be slidably disposed on a support plate having an upper surface portion positioned substantially parallel to the wafer mounting surface.

The wafer positioning method of the present invention is a method of positioning a semiconductor wafer on a table for sheet sticking apparatus before sticking a sheet to the surface of the semiconductor wafer via a pressure roller,
The table for the sheet sticking apparatus is provided with an inner table portion having a wafer placement surface on which a semiconductor wafer is placed, and the protective sheet protruding outside the wafer placed on the wafer placement surface. An outer table portion provided with a sheet placement surface, and an elevating device provided to support the inner table portion,
The lifting device includes an upper taper portion provided at a lower portion of the inner table, and a lower taper portion arranged to face the lower side of the upper taper portion,
A method in which the upper surface of the semiconductor wafer placed on the wafer placement surface and the sheet placement surface are positioned on the same surface by moving the lower taper portion in the horizontal direction and moving the upper taper portion up and down. Is adopted.

According to the present invention, the upper taper portion and the lower taper portion are arranged so as to face each other, and the inner table portion is supported by the upper taper portion, so that the wafer placement surface and the sheet placement surface are set in parallel. can do. That is, by simply arranging the upper taper portion and the inner table portion in order above the lower taper portion, the mounting surfaces can be made parallel easily and quickly, and the work can be simplified in the device assembly stage. Is possible.
Moreover, since the inner table is supported by the upper and lower taper portions, the pressing force from the pressing roller can be received by the surface, the rigidity can be increased compared to Patent Document 1, and the deterioration of accuracy over time can be suppressed. Is possible. In other words, the circuit surface of the wafer and the sheet mounting surface on the wafer mounting surface can be easily positioned on the same surface, and the pressing force applied from the pressing roller to the circuit surface of the wafer is made uniform. It becomes possible to achieve stabilization of the application state of the protective sheet.
Furthermore, since the inner table portion is moved up and down by the relative movement of the respective taper portions, the amount of movement up and down can be set smaller than the amount of relative movement. Accordingly, it is possible to reduce the size of the driving means such as the motor for the relative movement, and to set the minimum value of the up-and-down movement amount to be small, so that finer positioning can be performed.

  Further, when the tapered portion is formed by the tapered surface of the plate-like member, the rigidity against the pressing force from the pressing roller can be further improved, and the positional accuracy of the wafer mounting surface can be further improved.

  Further, when the taper portions are relatively moved by the rail member and the slider, the driving force required for the relative movement can be suppressed, and the inner table portion can be smoothly moved up and down.

  Moreover, when a lower taper part is arrange | positioned at the upper surface part of a support plate, the parallel of each said mounting surface can be set more easily and accurately.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic longitudinal sectional view of a sticking device to which a table according to this embodiment is applied. In this figure, a sticking device 10 includes a table 11 on which a semiconductor wafer W (hereinafter referred to as “wafer W”) having a circuit surface W1 is placed, a pressure roller 12 provided above the table 11, and a table. 11 and a pressing roller 12 and a feeding device (not shown) for feeding out the protective sheet H.
The feeding device allows the protective sheet H to pass through the table 11 through the plurality of rollers and the winding means from the raw material around which the protective sheet H is wound, and the protective sheet H is moved away from the table 11 It is provided so as to be movable in the direction of movement (vertical direction in FIG. 1).

  As shown in FIG. 2, the table 11 is provided at a position surrounding the inner table 14 with a wafer mounting surface 14 </ b> A on which the wafer W is mounted, and the inner table 14 in a plan view. An outer table portion 15, a support plate 18 that supports the outer table portion 15 from below via a spacer 16, a lifting device 19 that is provided on the support plate 18 and supports the inner table portion 14 from below, and a support A lifter 20 attached to the plate 18 is provided.

  The inner table portion 14 is provided in a plate shape having a constant thickness so that the upper surface and the lower surface are parallel to each other, and receives the suction pipe 43 of the lifter 20 and ejects air through a pipe (not shown). A hole 14B as a means is formed.

  The outer table portion 15 is provided in a plate shape in which an opening for receiving the inner table portion 14 is formed. When the protective sheet H is pasted on the upper surface of the outer table portion 15 (see FIG. 5), the sheet placement on which the protective sheet H protruding outside the wafer W placed on the wafer placement surface 14A is placed. The surface is 15A. The outer table portion 15 is installed so that the sheet placement surface 15A is accurately parallel to the upper surface portion 18A of the support plate 18.

  The lifting device 19 includes an upper taper portion 22 connected to the lower portion of the inner table portion 14, and a lower taper portion 23 provided on the upper surface portion 18 </ b> A of the support table 18 and opposed to the lower side of the upper taper portion 22. And guide means 24 provided on both sides of the upper taper portion 22 (see FIG. 2), and lifting device drive means 25 for moving the lower taper portion 23 in the horizontal direction (left and right direction in FIG. 1). Has been.

  The upper taper portion 22 is formed by a plate-like member having a substantially entire area of the lower surface serving as a taper surface 22A, and the taper surface 22A is directed in a direction inclined upward to the right in FIG. In the surface of the upper taper portion 22, a hole 22 </ b> B through which an adsorption tube 43 described later passes is provided.

  The lower taper portion 23 is formed of a plate-like member having a substantially entire area of the upper surface thereof serving as a taper surface 23A, and the taper surface 22A of the upper taper portion 22 is placed in surface contact with the taper surface 23A. The taper surface 23A of the lower taper portion 23 is set to have the same gradient as the taper surface 22A of the upper taper portion 22 (5% gradient in this embodiment), and when they are brought into surface contact with each other, the upper taper The upper surface of the part 22 and the lower surface of the lower taper part 23 are parallel to each other. Further, the lower taper portion 23 is provided so as to be movable in the horizontal direction by sliding with the upper surface portion 18A of the support plate 18. At this time, the taper surfaces 22A and 23A slide along the surface direction, so that the upper taper portion 22 and the lower taper portion 23 are relatively movable. In the surface of the lower taper portion 23, a long hole 23 </ b> B that extends to the left and right is provided at a position below the hole 22 </ b> B.

  As shown in FIG. 2, the guide means 24 is provided between a plurality of rollers 24 </ b> A rotatably connected to two opposing surfaces of the upper taper portion 22, and the support plate 18. And a guide plate 24B standing from the top, restricting the movement of the upper taper portion 22 in the left-right direction and guiding the up-and-down movement.

  The elevating device driving means 25 is connected to the lower taper portion 23 and penetrates the support plate 18, a nut member 28 mounted on the connection member 27, and screwed into the nut member 28. A feed screw shaft 29 extending in the horizontal direction, a pair of left and right bearings 31 attached to the lower surface of the support plate 18 and supporting the feed screw shaft 29, and one end side (right end side in FIG. 1) of the feed screw shaft 29 are provided. A pulley 32, a motor 34 having an output rotation shaft connected to the pulley 32 via a belt 33, and the other end side (left end side in FIG. 1) of the feed screw shaft 29. And a brake 35 for regulating. The elevating device driving means 25 rotates the feed screw shaft 29 via the belt 33 and the pulley 32 by the rotation of the motor 34, and moves the nut member 28 and the connecting member 27 in the extending direction of the feed screw shaft 29, that is, in the horizontal direction. It is designed to move.

  The lifter 20 includes a lifter driving means 38 supported on the lower surface of the support plate 18 via a bracket 37, a rail member 39 provided on the vertical surface portion 37 </ b> A of the bracket 37, and a vertical movement along the rail member 39. And a suction pipe base 42 connected to the slider 40, a suction pipe 43 extending upward from the suction pipe base 42, and a suction pad 43A as a support means. Is connected to a vacuum pump via a hose (not shown).

  The lifter drive means 38 is constituted by a motor 38A that moves the shaft member 38B up and down, and this motor 38A restricts the movement of the shaft member 38B at an arbitrary position between the ascending limit and the descending limit of the shaft member 38B. It is provided as possible. Further, the lifter drive means 38 is provided so that the speed at which the shaft member 38B moves up and down can be adjusted, whereby the lifting speed can be gradually increased or decreased. The upper end of the shaft member 38B is connected to the suction pipe base 42 so as to raise and lower the suction pad 43A.

  The pressing roller 12 is supported by a biaxial moving device 45 and is provided so as to be movable in the vertical direction and the horizontal direction. Therefore, the pressing roller 12 can roll on the protective sheet H while applying a force for pressing the protective sheet H downward.

  Note that the feeding device (not shown), the motor 34, the brake 35, the motor 38A, the pressure reducing pump (not shown), the biaxial moving device 45, and the like described above are entirely controlled through control means (not shown).

  Next, the overall operation of the sticking device 10 in the present embodiment will be described.

  First, as shown in FIG. 3, the motor 38A of the lifter driving means 38 is operated to keep the suction pad 43A protruding from the wafer mounting surface 14A. In this state, after the wafer W is transported and placed on the suction pad 43A by the arm 46 indicated by a two-dot chain line, the lower surface of the wafer W is sucked by the suction pad 43A. Thereafter, the arm 46 is retracted from the table 11, the suction pad 43 </ b> A is lowered, and the wafer W is placed on the inner table portion 14. The mounted wafer W is sucked and held through suction pads 43A and suction holes (not shown) formed on the upper surface of the inner table portion 14.

Next, the inner table unit 14 is moved up and down via the lifting device 19 and the positioning is adjusted so that the circuit surface W1 of the wafer W on the wafer mounting surface 14A and the sheet mounting surface 15A are located on the same surface (FIG. 4). Specifically, the motor 34 is operated to rotate the feed screw shaft 29, and the lower taper portion 23 is slid horizontally on the upper surface portion 18 </ b> A of the support plate 18 through the nut member 28 and the connecting member 27. At this time, although the upper taper portion 22 also tries to move in the same direction as the lower taper portion 23, the movement in the horizontal direction is restricted by the guide portion 24, so that the taper surfaces 22 </ b> A and 23 </ b> A move relatively. Then, the upper taper portion 22 and the inner table portion 14 are moved up and down. At this time, the suction pad 43 </ b> A is also controlled to be lifted and lowered via the lifter driving means 38 in the same manner as the lifting and lowering of the inner table portion 14. Then, when the circuit surface W1 and the sheet placement surface 15A are located on the same surface, the motors 34 and 38A are stopped and the brake 35 is operated, whereby the state shown in FIG. 4 is obtained.
Note that the height of the inner table portion 14 may be adjusted before the wafer W is placed on the wafer placement surface 14A. In this case, the height position of the wafer placement surface 14A is the sheet placement surface. The inner table unit 14 is positioned in advance so as to be lower than the thickness of the wafer W by 15A.

  Next, as shown in FIG. 5, after the protective sheet H positioned on the table 11 is placed on the circuit surface W <b> 1 of the wafer W and the sheet placement surface 15 </ b> A, the protective sheet H is interposed via the biaxial moving device 45. The pressure roller 12 is rolled up, and the protective sheet H is pressed against the circuit surface W1 and pasted. Thereafter, the pressing roller 12 is retracted to the initial position, and after the protective sheet H is cut out along the outer periphery of the wafer W using a cutting means (not shown), the excessive protective sheet H is also retracted.

Then, as shown in FIG. 6, the wafer W on which the protective sheet H is pasted is lifted from the wafer placement surface 14 </ b> A by the lifter driving means 38 so that the wafer W can be transported by the arm 46. At this time, the suction by the inner table portion 14 is stopped, and the suction pipe 43 is slowly raised so that a slight gap is formed between the lower surface of the wafer W and the wafer mounting surface 14A. This is because even if the suction between the wafer W and the wafer mounting surface 14 </ b> A is released, the vacuum region does not necessarily disappear completely, so the wafer W is added to the wafer W by slowly rising from the central region of the wafer W. This is to relieve stress. Furthermore, if the air is ejected from the hole 14B as the air ejection means, the stress applied to the wafer W due to the remaining vacuum region can be effectively reduced. Even when the wafer W is stuck to the wafer mounting surface 14A due to static electricity, the wafer W is stressed when the wafer W is lifted, so that the air ejected from the hole 14B contains ions for removing static electricity. It can also be made.
Thereafter, the suction pipe 43 is raised at a speed higher than the speed until the gap is generated by the lifter driving means 38, and when the position reaches the position shown in FIG. 3, the ascent movement is stopped and the height position is maintained. . In this state, after the suction by the suction pad 43A is released, the wafer W is unloaded to a predetermined position via the arm 46, and the next wafer W is placed on the suction pad 43A as described above.

Therefore, according to such an embodiment, by placing the lower taper portion 23, the upper taper portion 22 and the inner table portion 14 on the support plate 18 in this order, the wafer placement surface 14A and the sheet placement surface 15A can be easily and It becomes possible to set parallel in a short time. As a result, the adjustment work in the assembly stage of the sticking device can be simplified, and the parallel accuracy can be improved. Moreover, since the lower taper portion 23, the upper taper portion 22 and the inner table portion 14 are in surface contact with the vertically adjacent members, it is possible to increase the rigidity against the pressing force in the vertical direction and to suppress the deformation with time. it can. Thereby, the parallel accuracy is better maintained, and the circuit surface W1 and the sheet placement surface 15A can be accurately positioned on the same surface, and the sticking of the protective sheet H is stabilized through the uniform pressing force by the pressing roller 12. Can help.
Furthermore, since the gradient of the tapered surfaces 22A and 23B is set to 5%, for example, when the nut member 28 is horizontally moved by 1 mm via the feed screw shaft 29, the inner table portion 14 is moved up and down by 0.05 mm. . That is, as in Patent Document 1, the amount of movement of the feed screw shaft with respect to the rotational speed can be set smaller than in the case where the feed screw shaft is directed in the vertical direction, and the power of the motor 34 and the like is reduced to reduce the size. In addition, even when a motor having the same resolution is used, finer positioning, that is, positioning with 20 times accuracy can be performed.

Although the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, the present invention is not limited to this.
That is, the present invention has been illustrated and described with particular reference to particular embodiments, but is not limited to the technical idea and scope of the present invention. On the other hand, those skilled in the art can make various modifications in shape, quantity, and other detailed configurations.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

For example, the configuration for moving each of the tapered portions 22 and 23 can be variously modified, and the configurations shown in FIGS. 7 and 8 can be exemplified. In FIG. 7, a plurality of rail members 50 are provided on the upper surface portion 18 </ b> A of the support table 18, and a plurality of sliders 51 are provided on the lower surface of the lower taper portion 23 for each rail member 50, and the rail members 50 and the sliders 51 are interposed therebetween. The lower table 23 is moved horizontally.
8, in addition to the rail member 50 and the slider 51, the upper tapered portion 22 includes a plurality of rail members 53 extending in the inclination direction of the tapered surface 22A, and a plurality of lower tapered portions 23 are provided for each rail member 53. The slider 54 is movable along the rail member 53.
According to such a configuration, the taper portions 22 and 23 can be moved more smoothly when the inner table portion 14 is raised and lowered.

The schematic longitudinal cross-sectional view of the sticking apparatus with which the table which concerns on embodiment was applied. The top view of FIG. Sectional drawing similar to FIG. 1 of the state which raised the wafer from the wafer mounting surface. FIG. 2 is a cross-sectional view similar to FIG. 1 in a state where the circuit surface of the wafer and the sheet placement surface are set on the same surface. Sectional drawing similar to FIG. 1 immediately after sticking a protective sheet on the circuit surface of a wafer. FIG. 2 is a cross-sectional view similar to FIG. 1 in a state where the wafer is slightly raised from the wafer placement surface after the protective sheet is attached. Sectional drawing similar to FIG. 1 which concerns on a modification. Sectional drawing similar to FIG. 1 which concerns on another modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sticking apparatus 11 Table 12 Press roller 14 Inner table part 14A Wafer mounting surface 15 Outer table part 15A Sheet mounting surface 18 Support plate 19 Lifting device 22 Upper taper part 22A Taper surface 23 Lower taper part 23A Taper surface H Protective sheet W Wafer W1 circuit surface

Claims (5)

In a table for a sheet sticking device for sticking a sheet to a surface of a semiconductor wafer via a pressure roller,
An inner table portion having a wafer placement surface on which the semiconductor wafer is placed, and a sheet placement surface on which the protective sheet that protrudes outside the wafer placed on the wafer placement surface is placed. And an elevating device provided to support the inner table portion,
The lifting device includes an upper taper portion provided at a lower portion of the inner table portion, and a lower taper portion disposed to face the lower side of the upper taper portion, and the inner table is moved by relatively moving the taper portion. A table for a sheet sticking apparatus, wherein the part is provided so as to be movable up and down.   2. The taper portion of at least one of the upper taper portion and the lower taper portion is formed by a plate-like member having a substantially entire region opposed to the other taper portion. Table for sheet pasting device.   One of the upper taper portion and the lower taper portion includes a plurality of rail members extending in the inclined direction, and the other taper portion is a slider that is movable along the rail member. The table for a sheet sticking apparatus according to claim 1, wherein the table is provided.   4. The sheet sticking according to claim 1, wherein the lower taper portion is slidably disposed on a support plate having an upper surface portion positioned substantially parallel to the wafer placement surface. Device table. A method for positioning a semiconductor wafer on a table for a sheet sticking device before sticking a sheet to a surface of a semiconductor wafer via a pressure roller,
The table for the sheet sticking apparatus is provided with an inner table portion having a wafer placement surface on which a semiconductor wafer is placed, and the protective sheet protruding outside the wafer placed on the wafer placement surface. An outer table portion provided with a sheet placement surface, and an elevating device provided to support the inner table portion,
The lifting device includes an upper taper portion provided at a lower portion of the inner table, and a lower taper portion arranged to face the lower side of the upper taper portion,
By moving the lower taper portion in the horizontal direction and moving the upper taper portion up and down, the upper surface of the semiconductor wafer placed on the wafer placement surface and the sheet placement surface are positioned on the same plane. Wafer positioning method.

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