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JP2007012807A5 - - Google Patents

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Publication number
JP2007012807A5
JP2007012807A5 JP2005190388A JP2005190388A JP2007012807A5 JP 2007012807 A5 JP2007012807 A5 JP 2007012807A5 JP 2005190388 A JP2005190388 A JP 2005190388A JP 2005190388 A JP2005190388 A JP 2005190388A JP 2007012807 A5 JP2007012807 A5 JP 2007012807A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005190388A
Other versions
JP4541237B2 (ja
JP2007012807A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2005190388A external-priority patent/JP4541237B2/ja
Priority to JP2005190388A priority Critical patent/JP4541237B2/ja
Priority to SG200604375A priority patent/SG128646A1/en
Priority to US11/476,382 priority patent/US8392011B2/en
Priority to KR1020060058380A priority patent/KR101269290B1/ko
Priority to TW095123279A priority patent/TWI408738B/zh
Priority to MYPI20063109A priority patent/MY143974A/en
Priority to DE102006029961.2A priority patent/DE102006029961B4/de
Priority to CN2006101007304A priority patent/CN1892982B/zh
Priority to GB0612953A priority patent/GB2428136B/en
Publication of JP2007012807A publication Critical patent/JP2007012807A/ja
Publication of JP2007012807A5 publication Critical patent/JP2007012807A5/ja
Publication of JP4541237B2 publication Critical patent/JP4541237B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2005190388A 2005-06-29 2005-06-29 半導体ウエハ処理テープ巻装体およびそれを用いた半導体ウエハ処理テープ貼着装置ならびに半導体ウエハ加工処理装置 Active JP4541237B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2005190388A JP4541237B2 (ja) 2005-06-29 2005-06-29 半導体ウエハ処理テープ巻装体およびそれを用いた半導体ウエハ処理テープ貼着装置ならびに半導体ウエハ加工処理装置
SG200604375A SG128646A1 (en) 2005-06-29 2006-06-27 Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body
US11/476,382 US8392011B2 (en) 2005-06-29 2006-06-28 Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body
KR1020060058380A KR101269290B1 (ko) 2005-06-29 2006-06-28 반도체 웨이퍼 처리 테이프 와인딩 바디 및 그것을 사용한반도체 웨이퍼 처리 테이프 첩착장치 및 반도체 웨이퍼가공처리장치
TW095123279A TWI408738B (zh) 2005-06-29 2006-06-28 半導體晶圓處理膠帶捲裝體及使用該捲裝體之半導體晶圓處理膠帶貼著裝置，以及半導體晶圓加工處理裝置
DE102006029961.2A DE102006029961B4 (de) 2005-06-29 2006-06-29 Wicklungskörper mit einem Bearbeitungsband für einen Halbleiterwafer und Vorrichtung zum Ankleben eines Bearbeitungsbandes an einen Halbleiterwafer, welche den Wicklungskörper mit dem Bearbeitungsband für den Halbleiterwafer verwendet
MYPI20063109A MY143974A (en) 2005-06-29 2006-06-29 Semiconductor wafer processing tape winding body,semiconductors wafer processing tape sticking apparatus and semiconductors wafer processing apparatus that use the semiconductors wafer processing tape winding body
CN2006101007304A CN1892982B (zh) 2005-06-29 2006-06-29 半导体晶片处理带卷装体、贴付装置及加工处理装置
GB0612953A GB2428136B (en) 2005-06-29 2006-06-29 Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005190388A JP4541237B2 (ja) 2005-06-29 2005-06-29 半導体ウエハ処理テープ巻装体およびそれを用いた半導体ウエハ処理テープ貼着装置ならびに半導体ウエハ加工処理装置

Publications (3)

Publication Number Publication Date
JP2007012807A JP2007012807A (ja) 2007-01-18
JP2007012807A5 true JP2007012807A5 (ja) 2008-05-15
JP4541237B2 JP4541237B2 (ja) 2010-09-08

Family

ID=36888336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005190388A Active JP4541237B2 (ja) 2005-06-29 2005-06-29 半導体ウエハ処理テープ巻装体およびそれを用いた半導体ウエハ処理テープ貼着装置ならびに半導体ウエハ加工処理装置

Country Status (9)

Country Link
US (1) US8392011B2 (ja)
JP (1) JP4541237B2 (ja)
KR (1) KR101269290B1 (ja)
CN (1) CN1892982B (ja)
DE (1) DE102006029961B4 (ja)
GB (1) GB2428136B (ja)
MY (1) MY143974A (ja)
SG (1) SG128646A1 (ja)
TW (1) TWI408738B (ja)

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JP5690615B2 (ja) * 2011-03-03 2015-03-25 リンテック株式会社 リングフレーム、及び工程管理システム
JP5856397B2 (ja) * 2011-06-30 2016-02-09 リンテック株式会社 帯状シートの軸芯部材
JP6105312B2 (ja) 2013-02-13 2017-03-29 リンテック株式会社 支持装置及びデータ管理方法
JP6740444B2 (ja) * 2017-02-20 2020-08-12 株式会社Ｆｕｊｉ スプライシングテープ管理システム
JP2020198408A (ja) * 2019-06-05 2020-12-10 株式会社ディスコ テープユニット及びテープ貼り機
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