JP2007043030A - Integrated circuit device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an integrated circuit device capable of realizing reduction of a circuit area, and electronic equipment. <P>SOLUTION: The integrated circuit includes first-Nth circuit blocks CB1-CBN to be arranged along a D1 direction, where the first direction D1 is a direction from a first side being a short side of the integrated circuit toward a third side opposite thereto and a second direction D2 is a direction from a second side being a long side of the integrated circuit device toward a fourth side opposite thereto. Circuit blocks on both ends of the circuit blocks CB1-CBN are first and second scanning driver blocks SB1, SB2 for driving scanning lines, and the other circuit blocks include at least one of data driver blocks DB1-DB4 for driving data lines. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an integrated circuit device and an electronic apparatus.

  There is a display driver (LCD driver) as an integrated circuit device for driving a display panel such as a liquid crystal panel. This display driver is required to reduce the chip size in order to reduce the cost.

However, the size of a display panel incorporated in a mobile phone or the like is almost constant. Therefore, if a fine process is adopted and the integrated circuit device of the display driver is simply shrunk to reduce the chip size, problems such as difficulty in mounting are caused.
JP 2001-222249 A

  The present invention has been made in view of the above technical problems, and an object of the present invention is to provide an integrated circuit device capable of reducing the circuit area and an electronic apparatus including the integrated circuit device. .

  In the present invention, the direction from the first side, which is the short side of the integrated circuit device, to the third side facing the first side is the first direction, and the second side, which is the long side of the integrated circuit device, faces the second side. 4 includes first to Nth circuit blocks (N is an integer greater than or equal to 3) arranged along the first direction, where the direction toward the four sides is the second direction. The circuit blocks at both ends of the Nth circuit block are first and second scan driver blocks for driving scanning lines, and the circuit blocks excluding the circuit blocks at both ends of the first to Nth circuit blocks Relates to an integrated circuit device including at least one data driver block for driving the data lines.

  In the present invention, the first to Nth circuit blocks are arranged along the first direction, and the circuit blocks located at both ends of the first to Nth circuit blocks are the first and second scan driver blocks. A data driver block is arranged as another circuit block. The first and second scan driver blocks are circuit blocks that realize the function of the scan driver for scanning the scanning lines of the display panel. The data driver block is a circuit block that realizes the function of a data driver for driving the data lines of the display panel. For example, a first scan signal group from the first scan driver block is input from, for example, the left side of the display panel, and a second scan signal group from the second scan driver block is input from, for example, the right side of the display panel. It becomes possible. In other words, the scan signal output pad can also be arranged in the second direction side of the first and second scan driver blocks of the integrated circuit device, and the data signal output pad from the data driver block is located near the center of the integrated circuit device. Be placed. Therefore, it is possible to realize efficient mounting of an integrated circuit device that scans the scanning lines of the display panel and drives the data lines of the display panel, and comb driving of the display panel. The output line for the scanning signal from the scanning driver block, the output line for the data signal from the data driver block, and the like can be wired efficiently and simply. As a result, the width of the integrated circuit device in the second direction can be reduced, and a slim and elongated integrated circuit device can be provided.

  In the integrated circuit device according to the present invention, the circuit blocks excluding the circuit blocks at both ends of the first to Nth circuit blocks include a logic circuit block for setting gradation characteristic adjustment data and the set adjustment. A grayscale voltage generation circuit block that generates a grayscale voltage based on data; and a power supply circuit block that generates a power supply voltage, wherein at least one of the data driver blocks includes a grayscale voltage from the grayscale voltage generation circuit block. The data line can be driven by receiving the voltage.

  In the present invention, the first to Nth circuit blocks further include a logic circuit block, a gradation voltage generation circuit block, and a power supply circuit block. In the present invention, the data driver block is disposed between the logic circuit block and the gradation voltage generation circuit block and the power supply circuit block. Therefore, wiring and transistors can be arranged using an empty space on the second direction side of the logic circuit block and the power circuit block or on the fourth direction side opposite to the logic circuit block and the power circuit block, and wiring / placement efficiency can be improved. As a result, the width of the integrated circuit device in the second direction can be further reduced, and a slim and elongated integrated circuit device can be provided.

  In the integrated circuit device according to the present invention, the power supply circuit block is disposed between the first scan driver block and the data driver block, and between the second scan driver block and the data driver block, The logic circuit block and the gradation voltage generation circuit block may be disposed.

  According to the present invention, it is possible to perform wiring using an empty space on the power circuit block, for example, on the second direction side or the fourth direction side, thereby improving wiring efficiency.

  In the integrated circuit device according to the present invention, at least one of the data driver blocks may be disposed between the logic circuit block, the grayscale voltage generation circuit block, and the power supply circuit block.

  In this way, it is possible to perform wiring using empty spaces in the second direction side and the fourth direction side of the power circuit block and logic circuit block, for example, and wiring efficiency can be improved.

  In the integrated circuit device according to the present invention, the logic circuit block and the gradation voltage generation circuit block may be disposed adjacent to each other along the first direction.

  In this way, the width of the integrated circuit device in the second direction can be reduced compared to the technique in which the logic circuit block and the gradation voltage generation circuit block are arranged along the second direction, and the slim and slender shape can be reduced. An integrated circuit device can be provided. Further, even when the circuit configuration or the like of one of the logic circuit block and the gradation voltage generation circuit block changes, the influence can be prevented from reaching the other circuit block, and the design can be made more efficient.

  In the integrated circuit device according to the present invention, the gradation voltage generation circuit block may be disposed between the data driver block and the logic circuit block.

  In this way, the adjustment data signal line and the gradation voltage output line can be efficiently wired, and the wiring efficiency can be improved.

  In the integrated circuit device according to the present invention, the circuit blocks excluding the circuit blocks at both ends of the first to Nth circuit blocks include at least one memory block for storing image data, and the memory block and the data driver The blocks may be arranged adjacently along the first direction.

  In this way, the width of the integrated circuit device in the second direction can be reduced compared with the method of arranging the memory block and the data driver block along the second direction, and a slim and slender integrated circuit device can be obtained. Can be provided. Further, when the configuration of the memory block or the data driver block is changed, the influence on other circuit blocks can be minimized.

  In the integrated circuit device according to the present invention, the circuit blocks excluding the circuit blocks at both ends of the first to Nth circuit blocks are the first to Ith memory blocks (I is an integer of 2 or more), and the first block. Each of the first to I-th memory blocks may include first to I-th data driver blocks arranged adjacent to each other along the first direction.

  In this way, it is possible to arrange the first to I-th memory blocks having the optimal number of blocks according to the number of bits of image data to be stored and the corresponding first to I-th data driver blocks. It becomes possible. In addition, the width in the second direction and the length in the first direction of the integrated circuit device can be adjusted by the number of blocks, and the width in the second direction can be particularly reduced.

  In the integrated circuit device according to the present invention, the gradation voltage generation circuit block includes a selection voltage generation circuit that outputs a selection voltage based on a power supply voltage, the adjustment data set by the logic circuit block, and the A gradation voltage selection circuit that selects and outputs a gradation voltage based on the selection voltage can be included.

  In the integrated circuit device according to the present invention, the selection voltage generation circuit is disposed on the second direction side of the gradation voltage selection circuit or on a fourth direction side opposite to the second direction. May be.

  In this way, efficient wiring of adjustment data and selection voltage signal lines becomes possible.

  In the integrated circuit device according to the present invention, a gradation voltage output line for outputting a gradation voltage from the gradation voltage generation circuit block is arranged in the first direction on the first to Nth circuit blocks. It may be wired along.

  In this way, it becomes possible to route the output line of the gradation voltage by effectively using the areas of the first to Nth circuit blocks, and the wiring efficiency can be improved.

  In the integrated circuit device according to the present invention, the circuit blocks excluding the circuit blocks at both ends of the first to Nth circuit blocks include at least one memory block for storing image data. A shield line may be wired in an upper layer, and a grayscale voltage output line for outputting a grayscale voltage from the grayscale voltage generation circuit block may be wired in an upper layer of the shield line.

  In this way, it is possible to effectively prevent a situation in which the voltage level of the bit line is erroneously changed due to the coupling capacitance.

  In the integrated circuit device according to the present invention, in the memory block, the bit line is wired along the first direction, and the shield line overlaps the bit line along the first direction. It may be wired.

  This makes it possible to effectively shield the bit line.

  In the integrated circuit device according to the present invention, the power supply circuit block includes a first interface region provided along the fourth side on the second direction side of the first to Nth circuit blocks. A plurality of types of power supply voltages to be supplied to the first to Nth circuit blocks are generated, and a power supply voltage having the highest potential among the plurality of types of power supply voltages is wired in the first interface region. It may be supplied as a power supply voltage of at least one of the first and second scan driver blocks via a power supply voltage supply line.

  In the integrated circuit device according to the present invention, a first interface region provided along the fourth side on the second direction side of the first to Nth circuit blocks, and the second direction And a second interface region provided along the second side on the fourth direction side of the first to Nth circuit blocks when the opposite direction is the fourth direction. .

  The present invention also relates to an electronic apparatus including any one of the integrated circuit devices described above and a display panel driven by the integrated circuit device.

  Hereinafter, preferred embodiments of the present invention will be described in detail. The present embodiment described below does not unduly limit the contents of the present invention described in the claims, and all the configurations described in the present embodiment are indispensable as means for solving the present invention. Not necessarily.

1. Comparative Example FIG. 1A shows an integrated circuit device 500 as a comparative example of the present embodiment. The integrated circuit device 500 of FIG. 1A includes a memory block MB (display data RAM) and a data driver block DB. The memory block MB and the data driver block DB are arranged along the direction D2. Further, the memory block MB and the data driver block DB are ultra flat blocks whose length along the D1 direction is longer than the width in the D2 direction.

  Image data from the host side is written in the memory block MB. The data driver block DB converts the digital image data written in the memory block MB into an analog data voltage and drives the data lines of the display panel. Thus, in FIG. 1A, the signal flow of the image data is in the direction D2. For this reason, in the comparative example of FIG. 1A, the memory block MB and the data driver block DB are arranged along the direction D2 in accordance with the flow of this signal. By doing so, a short path is formed between the input and the output, the signal delay can be optimized, and efficient signal transmission becomes possible.

  However, the comparative example of FIG. 1A has the following problems.

  First, in an integrated circuit device such as a display driver, a reduction in chip size is required for cost reduction. However, when a fine process is employed and the integrated circuit device 500 is simply shrunk to reduce the chip size, not only the short side direction but also the long side direction is reduced. Therefore, as shown in FIG. 2A, there is a problem of difficulty in mounting. That is, the output pitch is desirably 22 μm or more, for example, but a simple shrink as shown in FIG. 2A has a pitch of 17 μm, for example, which makes mounting difficult due to the narrow pitch. Moreover, the frame of the glass of the display panel is widened, the number of pieces of glass is reduced, and the cost is increased.

  Secondly, in the display driver, the configuration of the memory and data driver varies depending on the type of display panel (amorphous TFT, low-temperature polysilicon TFT), the number of pixels (QCIF, QVGA, VGA), product specifications, and the like. Therefore, in the comparative example of FIG. 1A, in some products, as shown in FIG. 1B, even if the pad pitch, the memory cell pitch, and the data driver cell pitch match, the configuration of the memory and data driver changes. As shown in FIG. 1C, these pitches do not match. If the pitches do not match as shown in FIG. 1C, a useless wiring region for absorbing the pitch mismatch must be formed between the circuit blocks. In particular, in the comparative example of FIG. 1A in which the block is flat in the D1 direction, a useless wiring area for absorbing the pitch mismatch becomes large. As a result, the width W of the integrated circuit device 500 in the D2 direction is increased, the chip area is increased, and the cost is increased.

  On the other hand, in order to avoid such a situation, if the layout of the memory or data driver is changed so that the pad pitch and the cell pitch are aligned, the development period becomes longer, resulting in an increase in cost. That is, in the comparative example of FIG. 1A, the circuit configuration and layout of each circuit block are individually designed, and then the pitch and the like are adjusted, resulting in useless empty areas and inefficient design. Problems arise.

2. Configuration of Integrated Circuit Device FIG. 3 shows a configuration example of the integrated circuit device 10 of the present embodiment that can solve the above problems. In the present embodiment, the direction from the first side SD1 which is the short side of the integrated circuit device 10 to the third side SD3 facing the first direction D1 is the first direction D1, and the opposite direction of D1 is the third direction D3. Yes. The direction from the second side SD2 which is the long side of the integrated circuit device 10 to the fourth side SD4 facing the second side D2 is a second direction D2, and the opposite direction of D2 is a fourth direction D4. In FIG. 3, the left side of the integrated circuit device 10 is the first side SD1 and the right side is the third side SD3. However, the left side is the third side SD3 and the right side is the first side SD1. May be.

  As shown in FIG. 3, the integrated circuit device 10 of this embodiment includes first to Nth circuit blocks CB1 to CBN (N is an integer of 2 or more) arranged along the direction D1. That is, in the comparative example of FIG. 1A, the circuit blocks are arranged in the D2 direction, but in this embodiment, the circuit blocks CB1 to CBN are arranged in the D1 direction. Further, each circuit block is not a very flat block as in the comparative example of FIG. 1A, but is a relatively square block.

  The integrated circuit device 10 also includes an output-side I / F region 12 (first interface region in a broad sense) provided along the side SD4 on the D2 direction side of the first to Nth circuit blocks CB1 to CBN. Further, it includes an input-side I / F area 14 (second interface area in a broad sense) provided along the side SD2 on the D4 direction side of the first to Nth circuit blocks CB1 to CBN. More specifically, the output-side I / F region 12 (first I / O region) is arranged on the D2 direction side of the circuit blocks CB1 to CBN without using, for example, other circuit blocks. The input-side I / F area 14 (second I / O area) is arranged on the D4 direction side of the circuit blocks CB1 to CBN, for example, without passing through other circuit blocks. That is, at least in the portion where the data driver block exists, there is only one circuit block (data driver block) in the direction D2. When the integrated circuit device 10 is used as an IP (Intellectual Property) core and incorporated in another integrated circuit device, etc., it may be configured such that at least one of the I / F regions 12 and 14 is not provided.

  The output side (display panel side) I / F area 12 is an area serving as an interface with the display panel, and includes various elements such as a pad, an output transistor connected to the pad, and a protection element. Specifically, it includes an output transistor for outputting a data signal to the data line and a scanning signal to the scanning line. In the case where the display panel is a touch panel, an input transistor may be included.

  The input side (host side) I / F area 14 is an area serving as an interface with a host (MPU, image processing controller, baseband engine), and is a pad or an input (input / output) transistor connected to the pad. Various elements such as an output transistor and a protection element can be included. Specifically, an input transistor for inputting a signal (digital signal) from the host, an output transistor for outputting a signal to the host, and the like are included.

  Note that an output-side or input-side I / F area along the short sides SD1 and SD3 may be provided. Further, bumps or the like serving as external connection terminals may be provided in the I / F (interface) regions 12 and 14, or may be provided in other regions (first to Nth circuit blocks CB1 to CBN). In the case where it is provided in a region other than the I / F regions 12 and 14, it is realized by using a small bump technology (such as a bump technology using a resin as a core) other than the gold bump.

  The first to Nth circuit blocks CB1 to CBN can include at least two (or three) different circuit blocks (circuit blocks having different functions). Taking the case where the integrated circuit device 10 is a display driver as an example, the circuit blocks CB1 to CBN include at least two blocks of a data driver, a memory, a scan driver, a logic circuit, a gradation voltage generation circuit, and a power supply circuit. be able to. More specifically, the circuit blocks CB1 to CBN can include at least a data driver block and a logic circuit block, and can further include a grayscale voltage generation circuit block. In the case of a built-in memory type, a memory block can be further included.

  For example, FIG. 4 shows examples of various types of display drivers and circuit blocks incorporated therein. In a display driver for an amorphous TFT (Thin Film Transistor) panel with a built-in memory (RAM), circuit blocks CB1 to CBN include a memory, a data driver (source driver), a scanning driver (gate driver), a logic circuit (gate array circuit), It includes a gradation voltage generation circuit (γ correction circuit) and a power supply circuit block. On the other hand, in a display driver for a low-temperature polysilicon (LTPS) TFT panel with a built-in memory, the scanning driver can be formed on a glass substrate, so that the scanning driver block can be omitted. Also, the memory block can be omitted for an amorphous TFT panel without a memory, and the memory and scan driver blocks can be omitted for a low-temperature polysilicon TFT panel without a memory. Further, for a CSTN (Collar Super Twisted Nematic) panel and a TFD (Thin Film Diode) panel, the block of the gradation voltage generation circuit can be omitted.

  FIGS. 5A and 5B show examples of a planar layout of the integrated circuit device 10 of the display driver of this embodiment. 5A and 5B are examples for an amorphous TFT panel with a built-in memory. FIG. 5A targets, for example, a display driver for QCIF and 32 gradations, and FIG. The display driver for gradation is targeted.

  5A and 5B, the first to Nth circuit blocks CB1 to CBN are first to fourth memory blocks MB1 to MB4 (first to Ith memory blocks in a broad sense. I is 2). Including the above integer). The first to fourth data driver blocks DB1 to DB4 (first in a broad sense, the first to fourth memory blocks MB1 to MB4) are arranged adjacent to each other along the direction D1. To I-th data driver block). Specifically, the memory block MB1 and the data driver block DB1 are arranged adjacently along the D1 direction, and the memory block MB2 and the data driver block DB2 are arranged adjacently along the D1 direction. The image data (display data) used by the data driver block DB1 to drive the data lines is stored in the adjacent memory block MB1, and the image data used by the data driver block DB2 to drive the data lines is adjacent. Memory block MB2 stores it.

  In FIG. 5A, MB1 of the memory blocks MB1 to MB4 (Jth memory block in a broad sense, 1 ≦ J <I) is placed on the D3 direction side of the data driver blocks DB1 to DB4. In a broad sense, the Jth data driver block) is arranged adjacent to each other. Further, a memory block MB2 (J + 1th memory block in a broad sense) is arranged adjacent to the D1 direction side of the memory block MB1. A data driver block DB2 (J + 1th data driver block in a broad sense) is arranged adjacent to the D1 direction side of the memory block MB2. The arrangement of the memory blocks MB3 and MB4 and the data driver blocks DB3 and DB4 is the same. In this way, in FIG. 5A, MB1, DB1, and MB2, DB2 are arranged symmetrically with respect to the boundary lines of MB1 and MB2, and MB3, DB3, and MB4 are arranged symmetrically with respect to the boundary lines of MB3 and MB4. , DB4 are arranged. In FIG. 5A, DB2 and DB3 are arranged adjacent to each other, but other circuit blocks may be arranged between them without adjoining them.

  On the other hand, in FIG. 5B, DB1 (Jth data driver block) of the data driver blocks DB1 to DB4 is on the D3 direction side of MB1 (Jth memory block) of the memory blocks MB1 to MB4. Adjacent to each other. Further, DB2 (J + 1th data driver block) is arranged on the D1 direction side of MB1. MB2 (J + 1th memory block) is arranged on the D1 direction side of DB2. DB3, MB3, DB4, and MB4 are similarly arranged. In FIG. 5B, MB1 and DB2, MB2 and DB3, and MB3 and DB4 are arranged adjacent to each other, but other circuit blocks may be arranged between them without being adjacent to each other. Good.

  5A has an advantage that the column address decoder can be shared between the memory blocks MB1 and MB2 and between the MB3 and MB4 (between the Jth and J + 1th memory blocks). On the other hand, according to the layout arrangement of FIG. 5B, there is an advantage that the wiring pitch of the data signal output lines from the data driver blocks DB1 to DB4 to the output side I / F region 12 can be equalized and the wiring efficiency can be improved. is there.

  The layout arrangement of the integrated circuit device 10 of the present embodiment is not limited to FIGS. For example, the number of memory blocks or data driver blocks may be 2, 3 or 5 or more, or the memory block or data driver block may be configured not to be divided into blocks. Further, a modification can be made so that the memory block and the data driver block are not adjacent to each other. In addition, a configuration in which a memory block, a scan driver block, a power supply circuit block, a gradation voltage generation circuit block, or the like is not provided may be employed. Further, a circuit block having a very narrow width in the D2 direction (elongated circuit block of WB or less) may be provided between the circuit blocks CB1 to CBN and the output-side I / F region 12 or the input-side I / F region 14. The circuit blocks CB1 to CBN may include circuit blocks in which different circuit blocks are arranged in multiple stages in the D2 direction. For example, the scan driver circuit and the power supply circuit may be configured as one circuit block.

  FIG. 6A shows an example of a cross-sectional view along the direction D2 of the integrated circuit device 10 of the present embodiment. Here, W1, WB, and W2 are the widths in the D2 direction of the output side I / F region 12, the circuit blocks CB1 to CBN, and the input side I / F region 14, respectively. W is the width of the integrated circuit device 10 in the direction D2.

  In this embodiment, as shown in FIG. 6A, in the direction D2, other circuit blocks are arranged between the circuit blocks CB1 to CBN (data driver block DB) and the output side and input side I / F regions 12 and 14. Can be configured without intervening. Therefore, W1 + WB + W2 ≦ W <W1 + 2 × WB + W2 can be satisfied, and a narrow integrated circuit device can be realized. Specifically, the width W in the D2 direction can be set to W <2 mm, and more specifically, W <1.5 mm. In consideration of chip inspection and mounting, it is desirable that W> 0.9 mm. The length LD in the long side direction can be 15 mm <LD <27 mm. The chip shape ratio SP = LD / W can be set to SP> 10, and more specifically, SP> 12.

  The widths W1, WB, and W2 in FIG. 6A are respectively the transistor formation regions (bulk region and active region) of the output side I / F region 12, circuit blocks CB1 to CBN, and input side I / F region 14. Width. That is, in the I / F regions 12 and 14, an output transistor, an input transistor, an input / output transistor, a transistor of an electrostatic protection element, and the like are formed. In the circuit blocks CB1 to CBN, transistors constituting the circuit are formed. W1, WB, and W2 are determined based on a well region, a diffusion region, or the like where such a transistor is formed. For example, in order to realize a slimmer integrated circuit device, it is desirable to form bumps (active surface bumps) also on the transistors of the circuit blocks CB1 to CBN. Specifically, a resin core bump having a core formed of a resin and a metal layer formed on the surface of the resin is formed on the transistor (active region). The bumps (external connection terminals) are connected to pads arranged in the I / F regions 12 and 14 by metal wiring. In the present embodiment, W1, WB, and W2 are not the width of the bump formation region but the width of the transistor formation region formed under the bump.

  The widths of the circuit blocks CB1 to CBN in the D2 direction can be unified to the same width, for example. In this case, the widths of the circuit blocks may be substantially the same. For example, a difference of about several μm to 20 μm (several tens of μm) is within an allowable range. When circuit blocks having different widths exist in the circuit blocks CB1 to CBN, the width WB can be the maximum width among the circuit blocks CB1 to CBN. The maximum width in this case can be, for example, the width of the data driver block in the D2 direction. Alternatively, in the case of an integrated circuit device with a built-in memory, the width in the direction D2 of the memory block can be set. An empty area with a width of about 20 to 30 μm can be provided between the circuit blocks CB1 to CBN and the I / F areas 12 and 14, for example.

  In the present embodiment, the output-side I / F region 12 can be provided with pads having one or more stages in the D2 direction. Therefore, considering the pad width (for example, 0.1 mm) and the pad pitch, the width W1 in the D2 direction of the output I / F region 12 can be 0.13 mm ≦ W1 ≦ 0.4 mm. In addition, since a pad having one step in the D2 direction can be arranged in the input side I / F region 14, the width W2 of the input side I / F region 14 is set to 0.1 mm ≦ W2 ≦ 0.2 mm. be able to. In order to realize an elongated integrated circuit device, a logic signal from the logic circuit block, a gradation voltage signal from the gradation voltage generation circuit block, and a power supply wiring are arranged on the circuit blocks CB1 to CBN. These wiring widths are, for example, about 0.8 to 0.9 mm in total. Therefore, in consideration of these, the width WB of the circuit blocks CB1 to CBN can be set to 0.65 mm ≦ WB ≦ 1.2 mm.

  Even if W1 = 0.4 mm and W2 = 0.2 mm, since 0.65 mm ≦ WB ≦ 1.2 mm, WB> W1 + W2 holds. When W1, WB, and W2 are the smallest values, W1 = 0.13 mm, WB = 0.65 mm, and W2 = 0.1 mm, and the width of the integrated circuit device is about W = 0.88 mm. Therefore, W = 0.88 mm <2 × WB = 1.3 mm holds. When W1, WB, and W2 are the largest values, W1 = 0.4 mm, WB = 1.2 mm, and W2 = 0.2 mm, and the width of the integrated circuit device is about W = 1.8 mm. Therefore, W = 1.8 mm <2 × WB = 2.4 mm holds. Therefore, a relational expression of W <2 × WB is established, and an elongated integrated circuit device can be realized.

  In the comparative example of FIG. 1A, as shown in FIG. 6B, two or more circuit blocks are arranged along the direction D2. In the D2 direction, a wiring region is formed between the circuit blocks or between the circuit block and the I / F region. Therefore, the width W of the integrated circuit device 500 in the D2 direction (short side direction) becomes large, and a slim elongated chip cannot be realized. Therefore, even if the chip is shrunk using a fine process, the length LD in the D1 direction (long side direction) is also shortened as shown in FIG. Incurs difficulty in implementation.

  On the other hand, in this embodiment, as shown in FIGS. 3, 5A and 5B, a plurality of circuit blocks CB1 to CBN are arranged along the direction D1. Further, as shown in FIG. 6A, a transistor (circuit element) can be disposed under the pad (bump) (active surface bump). In addition, signal lines between circuit blocks, between circuit blocks and I / F regions, and the like can be formed by global wiring formed in a layer above the local wiring (lower layer than the pad) that is a wiring in the circuit block. Therefore, as shown in FIG. 2B, the width W in the D2 direction can be narrowed while maintaining the length LD in the D1 direction of the integrated circuit device 10, and an ultra slim slim chip can be realized. As a result, the output pitch can be maintained at, for example, 22 μm or more, and mounting can be facilitated.

  In the present embodiment, since the plurality of circuit blocks CB1 to CBN are arranged along the direction D1, it is possible to easily cope with a change in product specifications and the like. In other words, since it is possible to design products with various specifications using a common platform, the design efficiency can be improved. For example, in FIGS. 5A and 5B, even when the number of pixels and the number of gradations of the display panel increase or decrease, the number of memory blocks and data driver blocks, the number of times image data is read out in one horizontal scanning period, etc. Just increase or decrease the number. FIGS. 5A and 5B are examples for an amorphous TFT panel with a built-in memory. When developing a product for a low-temperature polysilicon TFT panel with a built-in memory, scanning is performed from among the circuit blocks CB1 to CBN. Just remove the driver block. When developing a product without a memory, the memory block can be removed. Even if the circuit block is removed in accordance with the specifications as described above, in this embodiment, the influence of the circuit block on the other circuit blocks can be minimized, so that the design efficiency can be improved.

  In the present embodiment, the width (height) of each circuit block CB1 to CBN in the D2 direction can be unified with, for example, the width (height) of the data driver block and the memory block. When the number of transistors in each circuit block increases / decreases, the design can be made more efficient because it can be adjusted by increasing / decreasing the length of each circuit block in the D1 direction. For example, in FIGS. 5A and 5B, even when the configuration of the gradation voltage generation circuit block or the power supply circuit block is changed and the number of transistors is increased or decreased, the direction of the gradation voltage generation circuit block or the power supply circuit block in the direction D1 This can be dealt with by increasing or decreasing the length.

  As a second comparative example, there is also a method in which, for example, the data driver block is elongated in the D1 direction, and other circuit blocks such as a memory block are arranged along the D1 direction on the D4 direction side of the data driver block. Conceivable. However, in the second comparative example, a data driver block having a large width is interposed between another circuit block such as a memory block and the output-side I / F region. Therefore, in the D2 direction of the integrated circuit device. The width W becomes larger, and it becomes difficult to realize a slim elongated chip. In addition, a useless wiring area is generated between the data driver block and the memory block, and the width W is further increased. Further, when the configuration of the data driver block or the memory block is changed, the pitch mismatch problem described with reference to FIGS. 1B and 1C occurs, and the design efficiency cannot be improved.

  Further, as a third comparative example of the present embodiment, a method in which only circuit blocks having the same function (for example, data driver blocks) are divided into blocks and arranged in the D1 direction is also conceivable. However, in the third comparative example, since the integrated circuit device can have only the same function (for example, the function of the data driver), various product development cannot be realized. On the other hand, in the present embodiment, the circuit blocks CB1 to CBN include circuit blocks having at least two different functions. Accordingly, as shown in FIGS. 4, 5A and 5B, there is an advantage that various types of integrated circuit devices corresponding to various types of display panels can be provided.

3. Circuit Configuration FIG. 7 shows a circuit configuration example of the integrated circuit device 10. The circuit configuration of the integrated circuit device 10 is not limited to that shown in FIG. 7, and various modifications can be made. The memory 20 (display data RAM) stores image data. The memory cell array 22 includes a plurality of memory cells and stores image data (display data) for at least one frame (one screen). In this case, one pixel is composed of, for example, three subpixels (3 dots) of R, G, and B, and image data of, for example, 6 bits (k bits) is stored for each subpixel. The row address decoder 24 (MPU / LCD row address decoder) performs a decoding process on the row address and performs a word line selection process of the memory cell array 22. A column address decoder 26 (MPU column address decoder) performs a decoding process on the column address and performs a selection process of a bit line of the memory cell array 22. The write / read circuit 28 (MPU write / read circuit) performs image data write processing to the memory cell array 22 and image data read processing from the memory cell array 22. The access area of the memory cell array 22 is defined by, for example, a rectangle having a start address and an end address as opposite vertices. That is, an access area is defined by the column address and row address of the start address and the column address and row address of the end address, and memory access is performed.

  The logic circuit 40 (for example, an automatic placement and routing circuit) generates a control signal for controlling display timing, a control signal for controlling data processing timing, and the like. The logic circuit 40 can be formed by automatic placement and routing such as a gate array (G / A). The control circuit 42 generates various control signals and controls the entire apparatus. Specifically, gradation characteristic (γ characteristic) adjustment data (γ correction data) is output to the gradation voltage generation circuit 110 and voltage generation of the power supply circuit 90 is controlled. Further, it controls the write / read processing to the memory using the row address decoder 24, the column address decoder 26, and the write / read circuit 28. The display timing control circuit 44 generates various control signals for controlling the display timing, and controls reading of image data from the memory to the display panel side. The host (MPU) interface circuit 46 implements a host interface that generates an internal pulse for each access from the host and accesses the memory. The RGB interface circuit 48 realizes an RGB interface that writes moving image RGB data to a memory using a dot clock. Note that only one of the host interface circuit 46 and the RGB interface circuit 48 may be provided.

  In FIG. 7, the host interface circuit 46 and the RGB interface circuit 48 access the memory 20 in units of pixels. On the other hand, to the data driver 50, image data designated by a line address and read in units of lines is sent for each line period at an internal display timing independent of the host interface circuit 46 and the RGB interface circuit 48.

  The data driver 50 is a circuit for driving the data lines of the display panel, and FIG. 8A shows a configuration example thereof. The data latch circuit 52 latches digital image data from the memory 20. The D / A conversion circuit 54 (voltage selection circuit) performs D / A conversion of the digital image data latched by the data latch circuit 52 and generates an analog data voltage. Specifically, a plurality of (for example, 64 levels) gradation voltages (reference voltages) are received from the gradation voltage generation circuit 110, and a voltage corresponding to digital image data is selected from the plurality of gradation voltages. And output as a data voltage. The output circuit 56 (drive circuit, buffer circuit) buffers the data voltage from the D / A conversion circuit 54 and outputs it to the data line of the display panel to drive the data line. Note that a part of the output circuit 56 (for example, an output stage of an operational amplifier) may not be included in the data driver 50 but may be arranged in another region.

  The scan driver 70 is a circuit for driving the scan lines of the display panel, and FIG. 8B shows a configuration example thereof. The shift register 72 includes a plurality of flip-flops sequentially connected, and sequentially shifts the enable input / output signal EIO in synchronization with the shift clock signal SCK. The level shifter 76 converts the voltage level of the signal from the shift register 72 into a high voltage level for scanning line selection. The output circuit 78 buffers the scanning voltage converted and output by the level shifter 76 and outputs it to the scanning line of the display panel to selectively drive the scanning line. Note that the scan driver 70 may have the configuration shown in FIG. In FIG. 8C, the scan address generation circuit 73 generates and outputs a scan address, and the address decoder performs a scan address decoding process. A scanning voltage is output via the level shifter 76 and the output circuit 78 to the scanning line specified by this decoding process.

  The power supply circuit 90 is a circuit that generates various power supply voltages, and FIG. The booster circuit 92 is a circuit that boosts the input power supply voltage and the internal power supply voltage by a charge pump method using a boosting capacitor and a boosting transistor, and generates a boosted voltage, and includes primary to quaternary boosting circuits and the like. be able to. The booster circuit 92 can generate a high voltage used by the scan driver 70 and the gradation voltage generation circuit 110. The regulator circuit 94 adjusts the level of the boosted voltage generated by the booster circuit 92. The VCOM generation circuit 96 generates and outputs a VCOM voltage supplied to the counter electrode of the display panel. The control circuit 98 controls the power supply circuit 90 and includes various control registers.

  A gradation voltage generation circuit (γ correction circuit) 110 is a circuit that generates a gradation voltage, and FIG. 9B shows a configuration example thereof. The selection voltage generation circuit 112 (voltage division circuit) generates selection voltages VS0 to VS255 (R selection voltages in a broad sense) based on the high voltage power supply voltages VDDH and VSSH generated by the power supply circuit 90. Output. Specifically, the selection voltage generation circuit 112 includes a ladder resistor circuit having a plurality of resistor elements connected in series. Then, voltages obtained by dividing VDDH and VSSH by the ladder resistor circuit are output as selection voltages VS0 to VS255. Based on the gradation characteristic adjustment data set in the adjustment register 116 by the logic circuit 40, the gradation voltage selection circuit 114 is selected from among the selection voltages VS0 to VS255, for example, 64 in the case of 64 gradations ( In a broad sense, S voltages (R> S) are selected and output as gradation voltages V0 to V63. In this way, it is possible to generate a gradation voltage having an optimum gradation characteristic (γ correction characteristic) according to the display panel. In the case of polarity inversion driving, a positive ladder resistance circuit and a negative ladder resistance circuit may be provided in the selection voltage generation circuit 112. Further, the resistance value of each resistance element of the ladder resistor circuit may be changed based on the adjustment data set in the adjustment register 116. Further, the selection voltage generation circuit 112 and the gradation voltage selection circuit 114 may be provided with an impedance conversion circuit (an operational amplifier having a voltage follower connection).

  FIG. 10A shows a configuration example of each DAC (Digital Analog Converter) included in the D / A conversion circuit 54 of FIG. Each DAC in FIG. 10A can be provided, for example, for each subpixel (or for each pixel), and is configured by a ROM decoder or the like. Then, based on the 6-bit digital image data D0 to D5 from the memory 20 and the inverted data XD0 to XD5, any one of the gradation voltages V0 to V63 from the gradation voltage generation circuit 110 is selected. Data D0 to D5 are converted into analog voltages. The obtained analog voltage signal DAQ (DAQR, DAQG, DAQB) is output to the output circuit 56.

  In addition, when the data signals for R, G, and B are multiplexed and sent to the display driver by the display driver for the low-temperature polysilicon TFT (in the case of FIG. 10C), for R and G , B image data can also be D / A converted using one common DAC. In this case, each DAC in FIG. 10A is provided for each pixel.

  FIG. 10B shows a configuration example of each output unit SQ included in the output circuit 56 of FIG. Each output unit SQ in FIG. 10B can be provided for each pixel. Each output unit SQ includes impedance conversion circuits OPR, OPG, and OPB (voltage follower-connected operational amplifiers) for R (red), G (green), and B (blue), and signals DAQR and DAQQ from the DAC , DAQB impedance conversion is performed, and data signals DATAR, DATAG, and DATAB are output to the R, G, and B data signal output lines. For example, in the case of a low-temperature polysilicon TFT panel, switch elements (switch transistors) SWR, SWG, and SWB as shown in FIG. 10C are provided, and data signals for R, G, and B are multiplexed. The impedance conversion circuit OP may output the data signal DATA that has been processed. Further, the data signal may be multiplexed over a plurality of pixels. Further, the output unit SQ may be provided with only a switch element or the like without providing the impedance conversion circuit as shown in FIGS.

4). 4.1 Arrangement of Blocks of Scan Driver, Data Driver, Power Supply Circuit, etc. 4.1 Arrangement of Scan Driver Block In this embodiment, as shown in FIG. 11, circuit blocks CB1 to CBN perform the first scan for driving the scan lines. A driver block SB1 and a second scan driver block SB2 are included. Specifically, the first scan driver block SB1 is arranged as the first circuit block CB1 (circuit block on the side SD1 side) among the circuit blocks CB1 to CBN. A second scan driver block SB2 is arranged as the Nth circuit block CBN (circuit block on the side SD3 side) among the CB1 to CBN. That is, the circuit blocks at both ends of the circuit blocks CB1 to CBN arranged along the direction D1 of the integrated circuit device 10 are the first and second scan driver blocks SB1 and SB2. In this case, the number of circuit blocks arranged along the direction D1 of the integrated circuit device 10 is 3 or more (N ≧ 3).

  In FIG. 11, among the circuit blocks CB1 to CBN, the circuit blocks excluding the scan driver blocks SB1 and SB2 include at least one data driver block (data driver blocks DB1 to DB4 in FIG. 11) for driving the data lines. be able to.

  In FIG. 11, the power supply circuit block PB is arranged between the scan driver block SB1 and the data driver blocks DB1 to DB4. A logic circuit block LB and a gradation voltage generation circuit block GB are arranged between the scan driver block SB2 and the data driver blocks DB1 to DB4.

  As shown in FIG. 11, if the scan driver blocks SB1 and SB2 are arranged as circuit blocks CB1 and CBN located at both ends of the integrated circuit device 10, the first scan signal group from SB1 is input from the left side of the display panel, for example. Then, it becomes possible to input the second scanning signal group from SB2 from, for example, the right side of the display panel. By doing so, it is possible to realize efficient mounting, comb drive of the display panel, and the like.

  When the scanning driver blocks SB1 and SB2 are arranged at both ends of the integrated circuit device 10 as shown in FIG. 11, it is possible to arrange the output pads for the scanning signals at both ends of the output side I / F region 12 to reduce the wiring efficiency. This is desirable. On the other hand, in FIG. 11, the data driver blocks DB <b> 1 to DB <b> 4 are arranged near the center of the integrated circuit device 10. Therefore, it is desirable to arrange the output pad for the data signal near the center of the output-side I / F region 12 in consideration of the wiring efficiency.

  As shown in FIG. 11, if power supply circuit blocks PB and logic circuit blocks LB having a relatively large circuit area are arranged on both sides of the data driver blocks DB1 to DB4, empty spaces on the D2 direction side of these PBs and LBs. By using (spaces indicated by C3 and C4), an output pad for scanning signals and an output transistor formed under the pad can be arranged. Accordingly, the wiring efficiency in the output-side I / F region 12 can be improved, the width W of the integrated circuit device 10 in the D2 direction can be reduced, and a slim and slender integrated circuit device 10 can be realized.

  FIGS. 12A and 12B show configuration examples of output transistors formed under the scan signal output pads. The shift register 72 in FIG. 8B includes flip-flops FF1 to FFn in which flip-flops corresponding to the scanning lines S1 to Sn are cascade-connected, and FIG. 12A is replaced with FIG. 8B. In the scanning driver 70 shown, the configuration per one output to the scanning line St (1 ≦ t ≦ n, t is an integer) is shown. Similarly, FIG. 12B shows a configuration per output to the scanning line St in the scanning driver 70 shown in FIG.

  As shown in FIG. 12A, the voltage level of the output signal of the flip-flop FFt is converted by the level shifter 76t. The level shifter 76t is supplied with the high potential side power supply voltage VDDHG and the low potential side power supply voltage VEE, and the voltage level of the output signal of the flip-flop FFt is set to the voltage level of the high potential side power supply voltage VDDHG or the low potential side power supply voltage VEE. Convert. The output of the level shifter 76t becomes the gate signal of the output transistor constituting the output circuit 78t. The output transistor includes, for example, a P-type metal oxide semiconductor (MOS) transistor pDTrt and an N-type MOS transistor nDTrt whose drains are connected to each other. The high-potential-side power supply voltage VDDHG is supplied to the source of the transistor pDTrt, and the low-potential-side power supply voltage VEE is supplied to the source of the transistor nDTrt. The high potential side power supply voltage VDDHG and the low potential side power supply voltage VEE are generated by the booster circuit 92 of FIG. 9A in the power supply circuit block PB.

  Of the outputs of the scan driver 70 shown in FIG. 12A, at least one of the transistors pDTrt and nDTrt of the output circuit 78t is formed under the output pad.

  On the other hand, in FIG. 12B, the voltage level of the output signal decoded by the address decoder 74 is converted by the level shifter 76t. Then, at least one of the transistors pDTrt and nDTrt of the output circuit 78t among the outputs of the scan driver 70 shown in FIG. 12B is formed under the output pad.

  By forming part or all of the output transistor under the output pad in this way, the width W of the integrated circuit device 10 in the D2 direction can be further reduced, and a slim and slender integrated circuit device 10 can be realized.

  In FIG. 11, the logic circuit block LB and the scan driver block SB2 are adjacently disposed along the direction D1. That is, the circuit block to which the signal line is connected to the scan driver block SB2 among the CB1 to CBN is only the logic circuit block LB, and thus LB and SB2 are adjacent to each other. However, it is possible to perform a modification in which LB and SB2 are not adjacent to each other. In FIG. 11, the high voltage power supply (20V, −20V) generated by the power supply circuit block PB uses the wiring formed along the D1 direction on the output-side I / F region 12 to scan the driver block SB2. It is desirable to supply to. By so doing, it is possible to minimize the adverse effects of the wiring of the high voltage power supply on other circuit blocks.

  FIG. 13 shows an example of the potential relationship of various power supply voltages generated in the power supply circuit block PB. In the power supply circuit block PB, the voltage between the system power supply voltage VDD and the system ground power supply voltage VSS is boosted by the booster circuit 92 shown in FIG. 9A to generate the power supply voltage VOUT. The booster circuit 92 boosts the voltage between the system power supply voltage VDD and the system ground power supply voltage VSS in the negative direction to generate a voltage VOUTM having a lower potential than the system ground power supply voltage VSS. Further, the booster circuit 92 boosts the system power supply voltage VDD or a predetermined internal voltage VDC in the positive direction to generate the high potential power supply voltage VDDHG, and boosts the high potential power supply voltage VDDHG in the negative direction to lower the low potential side. A power supply voltage VEE is generated.

  The regulator circuit 94 adjusts the potential of the power supply voltage VOUT to generate the high potential side voltage VCOMH of the VCOM voltage. The regulator circuit 94 adjusts the potential of the voltage VOUTM to generate the low potential side voltage VCOML of the VCOM voltage. Further, the regulator circuit 94 can generate a power supply voltage VCORE (not shown) by lowering the potential of the system power supply voltage VDD.

  Here, the voltage VOUT is supplied as a power supply voltage for the data driver blocks DB1 to DB4 and the gradation voltage generation circuit block GB. The power supply voltage VCORE is supplied as the power supply voltage of the logic circuit block LB (memory block MB when a memory is incorporated). The high potential side voltage VCOMH and the low potential side voltage VCOML of the VCOM voltage are supplied as the common voltage of the display panel as the VCOM voltage. The high-potential-side power supply voltage VDDHG and the low-potential-side power supply voltage VEE are supplied as power supply voltages for the scan driver block (for example, the source voltage of the output transistor shown in FIGS. 12A and 12B).

  Thus, the power supply circuit block PB generates a plurality of types of power supply voltages supplied to the circuit blocks CB1 to CBN. A high-potential-side power supply voltage VDDHG, which is the power supply voltage having the highest potential among a plurality of types of power-supply voltages, is wired in the output-side I / F region 12 (first interface region in a broad sense). Is supplied as the power supply voltage of at least one of the scan driver blocks SB1 and SB2.

  In FIG. 11, the scanning driver block SB1 and the power supply circuit block PB are arranged adjacent to each other along the direction D1. That is, it is necessary to supply the scan driver block SB1 with a high voltage (for example, 20 V, −20 V) power generated by the power supply circuit block PB (boost circuit). If the scanning driver block SB1 and the power supply circuit block PB are arranged adjacent to each other, the wiring of the high voltage power supply can be connected by a short path, and the adverse effect of noise generated from the wiring of the high voltage power supply is minimized. be able to.

  Although the number of wirings connecting the scan driver block SB1 and other circuit blocks (for example, the power supply circuit block PB and the logic circuit block LB) is small, there is no connection between the scan driver block SB1 and the output side I / F region 12. The number of wires is very large. That is, it is necessary to connect a large number of output signal lines from the scan driver block SB1 to the output transistors formed under the pads in the output-side I / F region 12 or under the pads. Therefore, if the scan driver block SB1 and the power supply circuit block PB are arranged adjacent to each other along the direction D1, the empty space (space indicated by C3) existing in the output-side I / F area 12 on the D2 direction side of PB An output pad for scanning signals can be arranged. A large number of output signal lines from the scan driver block SB1 can be connected to the output transistor formed at or below the pad. Accordingly, the wiring efficiency in the output-side I / F region 12 can be improved, the width W of the integrated circuit device 10 in the D2 direction can be reduced, and a slim and elongated integrated circuit device 10 can be realized.

  It should be noted that a modification in which another circuit block is inserted between the scan driver block SB1 and the power supply circuit block PB is also possible. In this case, the power supply circuit block PB may be disposed at least between the scan driver block SB1, the gradation voltage generation circuit block GB, and the logic circuit block LB (data driver block).

  14A and 14B show arrangement examples of power supply voltage supply lines from the power supply circuit block PB to the scan driver blocks SB1 and SB2. In FIG. 14A, the power supply voltage is supplied to both of the scan driver blocks SB1 and SB2 via the power supply voltage supply line PWL1 wired in the output I / F region 12. As shown in FIG. 14A, when the power supply circuit block PB is arranged adjacent to the scan driver block SB1, both blocks are not connected via the power supply voltage supply line PWL1 in the output-side I / F region 12. A power supply voltage may be supplied via a power supply voltage supply line PWL2 provided therebetween.

  On the other hand, as shown in FIG. 14B, when the power supply circuit block PB is not arranged adjacent to the scan driver block SB1, the power supply voltage is supplied via the power supply voltage supply line PWL3 in the output side I / F region 12. It is desirable to supply.

  In FIG. 13, the low-potential-side power supply voltage VEE has been described as being lower than the system ground power-supply voltage VSS, but the present embodiment is not limited to this. For example, the low potential side power supply voltage VEE can be the same potential as the system ground power supply voltage VSS or a high potential. However, when the low potential side power supply voltage VEE is lower than the system ground power supply voltage VSS and is a high voltage with respect to the system ground power supply voltage VSS, the low potential side power supply voltage VEE is also the high potential side power supply voltage. Similarly to VDDHG, it is desirable to supply the scan driver block via power supply voltage supply lines PWL1, PWL2, and PWL3.

  By doing so, the high voltage power generated by the power circuit block PB is supplied via the power line passing through the data driver block, the gradation voltage generating circuit block, and the logic circuit block, and has an adverse effect on other circuit blocks. It is possible to suppress the increase of the wiring area by avoiding the data driver block, the gradation voltage generating circuit block, and the logic circuit block and arranging the power supply line.

4.2 Arrangement of Data Driver Block In this embodiment, as shown in FIG. 15, the circuit block excluding the scan driver blocks SB1 and SB2 among the circuit blocks CB1 to CBN sets the adjustment data of the gradation characteristics. A block LB and a gradation voltage generation circuit block GB that generates a gradation voltage based on the set adjustment data are included. In addition, the data driver blocks DB1 to DB4 (at least one data driver block in a broad sense) for receiving the grayscale voltage from the grayscale voltage generation circuit block GB and driving the data lines, and the power supply circuit block for generating the power supply voltage Includes PB. In this embodiment, the data driver blocks DB1 to DB4 are arranged between the logic circuit block LB and the gradation voltage generation circuit block GB and the power supply circuit block PB.

  According to the arrangement of FIG. 15, the logic circuit block LB, the gradation voltage generation circuit block GB, and the power supply circuit block PB having a relatively large circuit area are arranged on both sides of the data driver blocks DB1 to DB4. Therefore, using the empty space (space shown by C1) on the D4 direction side of the logic circuit block LB and the gradation voltage generating circuit block GB, the logic circuit pads and the input transistors formed under the pads are arranged. become able to. Further, by using the empty space (space indicated by C2) on the D4 direction side of the power supply circuit block PB, it becomes possible to arrange boosting transistors and the like of the power supply circuit having a large transistor size. Further, according to the arrangement shown in FIG. 15, the data driver blocks DB1 to DB4 can be concentrated and arranged near the center of the integrated circuit device. Therefore, the output lines of the data signals from DB1 to DB4 are connected to the output side I / F. In the area 12, wiring can be performed efficiently and simply. Therefore, the wiring efficiency and the placement efficiency in the output I / F region 12 and the input I / F region 14 can be improved, the width W in the D2 direction of the integrated circuit device can be reduced, and a slim elongated integrated circuit device can be obtained. realizable.

  Further, according to the arrangement of FIG. 15, the output line of the gradation voltage generated by the gradation voltage generation circuit block GB based on the adjustment data from the logic circuit block LB is efficiently wired using a global line or the like. The data driver blocks DB1 to DB4 can be connected. Therefore, the wiring efficiency can be improved, the width of the circuit blocks CB1 to CBN in the D2 direction can be reduced, and a slim and slender integrated circuit device can be realized.

  In FIG. 15, the logic circuit block LB and the gradation voltage generation circuit block GB are arranged adjacent to each other along the direction D1. The reason is as follows.

  For example, FIG. 16 shows a detailed circuit configuration example of the gradation voltage generation circuit block GB. Although FIG. 16 shows a circuit for positive polarity, a circuit for negative polarity can also be realized with the same configuration. In the amplitude adjustment register 300, the inclination adjustment register 302, and the fine adjustment register 304, gradation characteristic adjustment data is set. This adjustment data is set (written) by the logic circuit block LB. For example, by setting adjustment data in the amplitude adjustment register 300, the voltage levels of the power supply voltages VDDH and VSSH change as shown by B1 and B2 in FIG. 17A, and the amplitude of the gradation voltage can be adjusted. Further, by setting adjustment data in the inclination adjustment register 302, as shown in B3 to B6 in FIG. 17B, the gradation voltage at the four points of the gradation level changes, and the inclination of the gradation characteristics can be adjusted. become. That is, based on the 4-bit adjustment data VRP3 set in the inclination adjustment register 302, the resistance value of the resistance element RL12 constituting the ladder resistor changes, and the inclination adjustment as shown in B3 becomes possible. The same applies to VRP2 to VRP0. Further, by setting adjustment data in the fine adjustment register 304, as shown in B7 to B14 of FIG. 17C, the gradation voltage at 8 points of the gradation level changes, and the gradation characteristics can be finely adjusted. become. That is, based on the 3-bit adjustment data VP8 set in the fine adjustment register 304, the 8to1 selector 318 selects one tap from the eight taps of the resistance element RL11, and sets the voltage of the selected tap to VOP8. Output as. As a result, fine adjustment as shown by B7 in FIG. The same applies to VP7 to VP1.

  The gradation amplifier unit 320 outputs gradation voltages V0 to V63 based on the outputs VOP1 to VOP8 of the 8to1 selectors 311 to 318, VDDH, and VSSH. Specifically, the gradation amplifier unit 320 includes first to eighth impedance conversion circuits (operational amplifiers connected to voltage followers) to which VOP1 to VPOP8 are input. Then, for example, by dividing the output voltage of the adjacent impedance conversion circuit among the first to eighth impedance conversion circuits by resistance, the gradation voltages V1 to V62 are generated.

  By performing the adjustment as described above, it is possible to obtain the optimum gradation characteristic (γ characteristic) according to the type of the display panel, and to improve the display quality.

  However, the number of bits of adjustment data for performing such adjustment is large as shown in FIG. Therefore, the number of adjustment data signal lines from the logic circuit block LB to the gradation voltage generation circuit block GB is also large. Therefore, if the logic circuit block LB and the gradation voltage generation circuit block GB are not disposed adjacent to each other, the chip area may increase due to the wiring area for the adjustment data signal line.

  Therefore, in this embodiment, as shown in FIG. 15, the logic circuit block LB and the gradation voltage generation circuit block GB are arranged adjacent to each other along the direction D1. In this way, the adjustment data signal line from the logic circuit block LB can be connected to the gradation voltage generation circuit block GB through a short path, and thus an increase in chip area due to the wiring region can be prevented.

  As a comparative example of the present embodiment, a method of arranging the gradation voltage generation circuit block GB and the logic circuit block LB adjacent to each other along the direction D2 is also conceivable. However, according to the method of this comparative example, since two circuit blocks are stacked and arranged in the D2 direction, the width of the integrated circuit device in the D2 direction is increased accordingly. In addition, the circuit configuration of one of the circuit blocks stacked in the D2 direction changes depending on the type of display panel, the number of pixels, the display driver specifications, and the like, and the width of the one circuit block in the D2 direction. If the length in the D1 direction is changed, the influence is exerted on the other circuit block, and the design becomes inefficient.

  On the other hand, in the present embodiment, the gradation voltage generation circuit block GB and the logic circuit block LB are arranged along the direction D1. Therefore, the width W of the integrated circuit device in the direction D2 can be reduced, and a slim and slender chip as shown in FIG. 2B can be realized. Further, when the circuit configuration of one of the adjacent circuit blocks changes according to the type of the display panel, it is only necessary to adjust the length of the one circuit block in the D1 direction. . Therefore, the influence of one circuit block can be prevented from affecting the other circuit block, and the design can be made more efficient.

  In FIG. 15, the gradation voltage generation circuit block GB is disposed between the data driver blocks DB1 to DB4 and the logic circuit block LB.

  That is, in FIG. 15, adjustment data signal lines are wired between the gradation voltage generation circuit block GB and the logic circuit block LB, and the number thereof is large as described with reference to FIG. The gradation voltage generation circuit block GB needs to output gradation voltages to the data driver block DB, and the number of gradation voltage output lines is very large. Therefore, in FIG. 15, when the gradation voltage generation circuit block GB is not arranged between the data driver block DB and the logic circuit block LB but arranged on the D1 direction side of the LB, the adjustment data between the GB and LB is stored. It is necessary to wire not only the signal line but also the gradation voltage output line. Therefore, it becomes difficult to wire other signal lines and power supply lines between GB and LB with global lines or the like, and the wiring efficiency is lowered.

  On the other hand, in FIG. 15, the gradation voltage generation circuit block GB is arranged between the data driver block DB and the logic circuit block LB, and therefore, a gradation voltage output line is wired between GB and LB. You don't have to. Therefore, other signal lines and power supply lines can be wired between the GB and the LB by a global line or the like, and the wiring efficiency can be improved.

  In this embodiment, as shown in FIG. 15, the output line DQL of the data signal from the data driver block DB is wired along the direction D2 in the DB. On the other hand, the data signal output line DQL is wired along the direction D1 (D3) in the output-side I / F region 12 (first interface region). Specifically, in the output-side I / F region 12, the data signal output line DQL is arranged along the direction D1 using a global line that is lower than the pad and higher than the local line (transistor wiring) in the region. Wiring. In this way, as shown in FIG. 15, the adjustment data, gradation voltage, and data signal signal lines are wired without waste, and the data signals from the data driver block DB are properly output to the display panel via the pads. become able to. If the data signal output line DQL is wired as shown in FIG. 15, the data signal output line DQL can be connected to a pad or the like using the output side I / F region 12, and the integrated circuit device can be connected in the D2 direction. It is possible to prevent the width W from increasing.

  In FIG. 15, the logic circuit block LB and the gradation voltage generation circuit block GB are arranged adjacent to each other, but a modification in which these are not adjacent is also possible. Further, a modification is possible in which the gradation voltage generation circuit block GB is not disposed between the logic circuit block LB and the data driver blocks DB1 to DB4. Further, the gradation voltage generation circuit block GB and the data driver block DB4 may be disposed adjacent to each other or may not be disposed adjacent to each other. Further, the power supply circuit block PB and the data driver block DB1 may be disposed adjacent to each other or may not be disposed adjacent to each other.

4.3 Details of Arrangement of Grayscale Voltage Generation Circuit Block As shown in FIG. 18A, the grayscale voltage generation circuit block GB is a selection voltage that outputs a selection voltage (divided voltage) based on the power supply voltage. A generation circuit SVG (voltage division circuit) is included. Further, a gradation voltage selection circuit GVS that selects and outputs a gradation voltage based on the adjustment data set by the logic circuit block LB and the selection voltage is included. An adjustment register AR for setting adjustment data is also included. The adjustment register AR may be included in the logic circuit block LB.

  In FIG. 18A, the selection voltage generation circuit SVG is disposed on the D4 direction side of the gradation voltage selection circuit GVS. SVG may be arranged on the D2 direction side of GVS. The gradation voltage selection circuit GVS is arranged between the data driver block DB and the logic circuit block LB.

  According to the arrangement of FIG. 18A, the gradation voltage selection circuit GVS receives adjustment data from the logic circuit block LB arranged on the D1 direction side via the adjustment register AR. A selection voltage is received from a selection voltage generation circuit SVG arranged on the D4 direction side. Then, the gradation voltage generated based on the adjustment data and the selection voltage is output to the data driver block DB arranged on the D3 direction side. Therefore, there is no waste in the flow of these adjustment data, selection voltage, and gradation voltage signals, and the portion where the signal lines cross can be minimized. Further, since the adjustment data, selection voltage, and gradation voltage signal lines can be efficiently wired using a global line or the like, the wiring efficiency can be improved.

  FIG. 18B shows a detailed arrangement example in the case where the integrated circuit device has a built-in memory. In FIG. 18B, among the circuit blocks CB1 to CBN, the memory block MB and the data driver block DB are arranged adjacently along the D1 direction as circuit blocks excluding the scan driver blocks SB1 and SB2. The memory block MB is arranged between the data driver block DB and the gradation voltage generation circuit block GB.

  For example, in the comparative example of FIG. 1A, the memory block MB and the data driver block DB are arranged along the D2 direction, which is the short side direction, in accordance with the signal flow. For this reason, the width of the integrated circuit device in the D2 direction is increased, and it is difficult to realize a slim and slender chip. If the number of pixels on the display panel, display driver specifications, memory cell configuration, etc. change, and the width in the D2 direction and the length in the D1 direction of the memory block MB and data driver block DB change, the effect will be different. The design block becomes inefficient.

  On the other hand, in FIG. 18B, since the data driver block DB and the memory block MB are arranged along the direction D1, the width W of the integrated circuit device in the direction D2 can be reduced. A slim and slender chip as shown can be realized. In addition, when the number of pixels of the display panel changes, it is possible to cope with this by dividing the memory block, so that the design can be made more efficient.

  Further, in the comparative example of FIG. 1A, since the word line WL is arranged along the direction D1, which is the long side direction, the signal delay in the word line WL is increased, and the image data reading speed is decreased. In particular, since the word line WL connected to the memory cell is formed of a polysilicon layer, this signal delay problem is serious. In this case, there is a method of providing a buffer circuit between the memory cell arrays in order to reduce the signal delay. However, when this method is adopted, the circuit scale increases correspondingly, resulting in an increase in cost.

  On the other hand, in FIG. 18B, in the memory block MB, the word lines WL are wired along the D2 direction which is the short side direction, and the bit lines BL are arranged along the D1 direction which is the long side direction. The In this embodiment, the width W of the integrated circuit device in the direction D2 is short. Therefore, the length of the word line WL in the memory block MB can be shortened, and the signal delay at WL can be remarkably reduced as compared with the comparative example of FIG. Further, since it is not necessary to provide a buffer circuit between the memory cell arrays, the circuit area can be reduced. In the comparative example of FIG. 1A, even when a part of the access area of the memory is accessed from the host, the word line WL that is long in the D1 direction and has a large parasitic capacitance is selected. Become. On the other hand, if the method of dividing the memory in the D1 direction as in the present embodiment is adopted, only the word line WL of the memory block corresponding to the access area is selected at the time of host access. Power consumption can be realized. Note that WL in FIG. 18B is a word line connected to the memory cell (transfer transistor) of the memory block MB. On the other hand, BL in FIG. 18B is a bit line through which image data stored in the memory block MB is output to the data driver block DB.

5. Details of Memory Block and Data Driver Block 5.1 Block Division As shown in FIG. 19A, the display panel has a number of pixels in the vertical scanning direction (data line direction) of VPN = 320, and the horizontal scanning direction (scanning). Assume that the QVGA panel has HPN = 240 pixels in the line direction. Further, it is assumed that the bit number PDB of image (display) data for one pixel is 6 bits for each of R, G, and B, and PDB = 18 bits. In this case, the number of bits of image data necessary for displaying one frame of the display panel is VPN × HPN × PDB = 320 × 240 × 18 bits. Therefore, the memory of the integrated circuit device stores image data for at least 320 × 240 × 18 bits. Further, the data driver displays HPN = 240 data signals (data signals corresponding to 240 × 18 bits of image data) every horizontal scanning period (every period during which one scanning line is scanned). Output to the panel.

  In FIG. 19B, the data driver is divided into DBN = 4 data driver blocks DB1 to DB4. The memory is also divided into MBN = DBN = 4 memory blocks MB1 to MB4. Accordingly, each data driver block DB1 to DB4 outputs HPN / DBN = 240/4 = 60 data signals to the display panel every horizontal scanning period. Each of the memory blocks MB1 to MB4 stores (VPN × HPN × PDB) / MBN = (320 × 240 × 18) / 4 bits of image data. In FIG. 19B, the memory block MB1 and MB2 share the column address decoder CD12, and the memory block MB3 and MB4 share the column address decoder CD34.

5.2 Reading Multiple Times in One Horizontal Scan Period In FIG. 19B, each data driver block DB1 to DB4 outputs 60 data signals in one horizontal scan period. Therefore, it is necessary to read image data corresponding to 240 data signals for each horizontal scanning period from the memory blocks MB1 to MB4 corresponding to DB1 to DB4.

  However, if the number of bits of image data to be read for each horizontal scanning period increases, it is necessary to increase the number of memory cells (sense amplifiers) arranged in the D2 direction. As a result, the width W in the direction D2 of the integrated circuit device is increased, and the slimming of the chip is prevented. In addition, the word line WL becomes long, which causes a problem of WL signal delay.

  Therefore, in the present embodiment, a method of reading image data stored in each of the memory blocks MB1 to MB4 from the memory blocks MB1 to MB4 a plurality of times (RN times) for each data driver block DB1 to DB4 in one horizontal scanning period. Is adopted.

  For example, in FIG. 20, as indicated by A1 and A2, the memory access signal MACS (word selection signal) becomes active (high level) only RN = 2 times in one horizontal scanning period. Thus, image data is read from each memory block to each data driver block RN = 2 times in one horizontal scanning period. Then, the data latch circuits included in the data drivers DRa and DRb of FIG. 21 provided in the data driver block latch the read image data based on the latch signals LATa and LATb indicated by A3 and A4. A D / A conversion circuit included in DRa and DRb performs D / A conversion of the latched image data, and an output circuit included in DRa and DRb converts the data signals DATAa and DATAb obtained by the D / A conversion into A5. , A6 is output to the data signal output line. Thereafter, as shown at A7, the scanning signal SCSEL inputted to the gate of the TFT of each pixel of the display panel becomes active, and the data signal is inputted and held in each pixel of the display panel.

  In FIG. 20, the image data is read twice in the first horizontal scanning period, and the data signals DATAa and DATAb are output to the data signal output line in the same first horizontal scanning period. However, the image data is read and latched twice in the first horizontal scanning period, and the data signals DATAa and DATAb corresponding to the latched image data are supplied to the data signal output lines in the next second horizontal scanning period. It may be output. FIG. 20 shows the case where the number of times of reading RN = 2, but RN ≧ 3 may be possible.

  According to the method of FIG. 20, as shown in FIG. 21, image data corresponding to 30 data signals is read from each memory block, and each data driver DRa, DRb outputs 30 data signals. To do. As a result, 60 data signals are output from each data driver block. As described above, in FIG. 20, it is only necessary to read image data corresponding to 30 data signals from each memory block in one reading. Therefore, the number of memory cells and sense amplifiers in the direction D2 in FIG. 21 can be reduced as compared with the method of reading only once in one horizontal scanning period. As a result, the width of the integrated circuit device in the D2 direction can be reduced, and an ultra slim slim chip as shown in FIG. 2B can be realized. In particular, the length of one horizontal scanning period is about 52 μsec in the case of QVGA. On the other hand, the memory read time is, for example, about 40 nsec, which is sufficiently shorter than 52 μsec. Therefore, even if the number of readings in one horizontal scanning period is increased from one to a plurality of times, the influence on the display characteristics is not so great.

  FIG. 19A shows a display panel of QVGA (320 × 240). If the number of readings in one horizontal scanning period is set to RN = 4, for example, it corresponds to a display panel of VGA (640 × 480). It is also possible to increase the degree of design freedom.

  The plurality of readings in one horizontal scanning period may be realized by a first method in which a row address decoder (word line selection circuit) selects a plurality of different word lines in each memory block in one horizontal scanning period. Alternatively, the same word line in each memory block may be realized by a second method in which a row address decoder (word line selection circuit) selects a plurality of times in one horizontal scanning period. Alternatively, it may be realized by a combination of both the first and second methods.

5.3 Arrangement of Data Driver and Driver Cell FIG. 21 shows an arrangement example of the data driver and the driver cell included in the data driver. As shown in FIG. 21, the data driver block includes a plurality of data drivers DRa and DRb (first to mth data drivers) arranged side by side along the direction D1. Each data driver DRa, DRb includes a plurality of 30 (Q in a broad sense) driver cells DRC1 to DRC30.

  When the word line WL1a of the memory block is selected and the first image data is read from the memory block as shown by A1 in FIG. 20, the data driver DRa is read based on the latch signal LATa shown by A3. Latch image data. Then, D / A conversion of the latched image data is performed, and a data signal DATAa corresponding to the first read image data is output to the data signal output line as indicated by A5.

  On the other hand, when the word line WL1b of the memory block is selected and the second image data is read from the memory block as shown in A2 of FIG. 20, the data driver DRb reads out based on the latch signal LATb shown in A4. Latched image data. Then, the latched image data is D / A converted, and a data signal DATAb corresponding to the second read image data is output to the data signal output line as indicated by A6.

  In this way, each data driver DRa, DRb outputs 30 data signals corresponding to 30 pixels, so that 60 data signals corresponding to 60 pixels in total are output. It becomes like this.

  If a plurality of data drivers DRa and DRb are arranged (stacked) along the D1 direction as shown in FIG. 21, the width of the integrated circuit device in the D2 direction is caused by the size of the data driver. The situation where W becomes large can be prevented. The data driver has various configurations depending on the type of the display panel. Also in this case, according to the method of arranging a plurality of data drivers along the direction D1, data drivers having various configurations can be efficiently laid out. FIG. 21 shows a case where the number of data drivers arranged in the direction D1 is two, but the number of arranged data drivers may be three or more.

  In FIG. 21, each data driver DRa, DRb includes 30 (Q) driver cells DRC1 to DRC30 arranged side by side along the direction D2. Here, each of driver cells DRC1 to DRC30 receives image data for one pixel. Then, D / A conversion of the image data for one pixel is performed, and a data signal corresponding to the image data for one pixel is output. Each of the driver cells DRC1 to DRC30 can include a data latch circuit, a DAC of FIG. 10A (DAC for one pixel), and an output unit SQ of FIGS. 10B and 10C.

  In FIG. 21, the number of pixels in the horizontal scanning direction of the display panel (in the case where the data lines of the display panel are driven by sharing with a plurality of integrated circuit devices) Suppose that the number of data driver blocks (the number of block divisions) is DBN, and the number of input image data input to the driver cell in one horizontal scanning period is IN. Note that IN is equal to the number of read times RN of the image data in one horizontal scanning period described with reference to FIG. In this case, the number Q of driver cells DRC1 to DRC30 arranged along the direction D2 can be expressed as Q = HPN / (DBN × IN). In the case of FIG. 21, since HPN = 240, DBN = 4, and IN = 2, Q = 240 / (4 × 2) = 30.

  When the width (pitch) in the D2 direction of the driver cells DRC1 to DR30 is WD, the width WB (maximum width) in the D2 direction of the first to Nth circuit blocks CB1 to CBN is Q × WD ≦ It can be expressed as WB <(Q + 1) × WD. Further, when the width in the D2 direction of the peripheral circuit portion (row address decoder RD, wiring region, etc.) included in the memory block is WPC, it can be expressed as Q × WD ≦ WB <(Q + 1) × WD + WPC.

  Further, the number of pixels in the horizontal scanning direction of the display panel is HPN, the number of bits of image data for one pixel is PDB, the number of memory blocks is MBN (= DBN), and data is read from the memory block in one horizontal scanning period. Assume that the number of times of reading image data is RN. In this case, the number P of sense amplifiers (sense amplifiers that output 1-bit image data) arranged in the direction D2 in the sense amplifier block SAB is expressed as P = (HPN × PDB) / (MBN × RN). be able to. In the case of FIG. 21, since HPN = 240, PDB = 18, MBN = 4, and RN = 2, P = (240 × 18) / (4 × 2) = 540. Note that the number P is the number of effective sense amplifiers corresponding to the number of effective memory cells, and does not include the number of ineffective sense amplifiers such as sense amplifiers for dummy memory cells.

  When the width (pitch) in the D2 direction of each sense amplifier included in the sense amplifier block SAB is WS, the width WSAB in the D2 direction of the sense amplifier block SAB (memory block) is WSAB = P × WS. Can be represented. The width WB (maximum width) in the D2 direction of the circuit blocks CB1 to CBN is P × WS ≦ WB <(P + PDB) when the width in the D2 direction of the peripheral circuit portion included in the memory block is WPC. It can also be expressed as × WS + WPC.

5.4 Memory Cell FIG. 22A shows a configuration example of a memory cell (SRAM) included in the memory block. This memory cell includes transfer transistors TRA1 and TRA2, load transistors TRA3 and TRA4, and drive transistors TRA5 and TRA6. When the word line WL becomes active, the transfer transistors TRA1 and TRA2 are turned on, and image data can be written to the nodes NA1 and NA2 and image data can be read from the nodes NA1 and NA2. The written image data is held in the nodes NA1 and NA2 by a flip-flop circuit composed of transistors TRA3 to TRA6. Note that the memory cell of this embodiment is not limited to the configuration shown in FIG. 22A, and modifications such as using resistance elements as the load transistors TRA3 and TRA4 and adding other transistors are possible.

  22B and 22C show layout examples of memory cells. FIG. 22B shows a layout example of a horizontal cell, and FIG. 22C shows a layout example of a vertical cell. Here, as shown in FIG. 22B, the horizontal cell is a cell in which the word line WL is longer than the bit lines BL and XBL in each memory cell. On the other hand, as shown in FIG. 22C, the vertical cell is a cell in which the bit lines BL and XBL are longer than the word line WL in each memory cell. Note that WL in FIG. 22C is a local word line formed of a polysilicon layer and connected to the transfer transistors TRA1 and TRA2, but a metal layer word line for preventing signal delay of WL and stabilizing the potential. May be further provided.

  FIG. 23 shows an arrangement example of memory blocks and driver cells when the horizontal cell shown in FIG. 22B is used as the memory cell. FIG. 23 shows in detail a portion corresponding to one pixel in the driver cell and the memory block.

  As shown in FIG. 23, a driver cell DRC that receives image data for one pixel includes data latch circuits DLATR, DLATG, and DLATB for R (red), G (green), and B (blue). Each data latch circuit DLATR, DLATG, DLATB latches image data when a latch signal LAT (LATa, LATb) becomes active. The driver cell DRC includes the R, G, and B DACR, DACG, and DACB described with reference to FIG. The output unit SQ described with reference to FIGS. 10B and 10C is also included.

  The portion corresponding to one pixel in the sense amplifier block SAB includes R sense amplifiers SAR0 to SAR5, G sense amplifiers SAG0 to SAG5, and B sense amplifiers SAB0 to SAB5. The bit lines BL and XBL of the memory cells MC arranged along the D1 direction on the D1 direction side of the sense amplifier SAR0 are connected to SAR0. In addition, the bit lines BL and XBL of the memory cells MC arranged along the D1 direction on the D1 direction side of the sense amplifier SAR1 are connected to the SAR1. The same applies to the relationship between other sense amplifiers and memory cells.

  When the word line WL1a is selected, image data is read from the memory cell MC to which the gate of the transfer transistor is connected to WL1a to the bit lines BL and XBL, and sense amplifiers SAR0 to SAR5, SAG0 to SAG5, and SAB0. ... SAB5 performs signal amplification operation. DLATR latches 6-bit R image data D0R to D5R from SAR0 to SAR5, DACR performs D / A conversion of the latched image data, and output unit SQ outputs data signal DATAAR. . DLATG latches 6-bit G image data D0G to D5G from SAG0 to SAG5, DACG performs D / A conversion of the latched image data, and output unit SQ outputs data signal DATAT. . DLATB latches 6-bit B image data D0B to D5B from SAB0 to SAB5, DACB performs D / A conversion of the latched image data, and output unit SQ outputs data signal DATAB. .

  In the case of the configuration shown in FIG. 23, readout of image data a plurality of times in one horizontal scanning period shown in FIG. 20 can be realized as follows. That is, in the first horizontal scanning period (first scanning line selection period), first, the word line WL1a is selected to read the image data for the first time, and the first data is displayed as indicated by A5 in FIG. The signal DATAa is output. Next, in the same first horizontal scanning period, the word line WL1b is selected, the image data is read for the second time, and the second data signal DATAb is output as indicated by A6 in FIG. In the next second horizontal scanning period (second scanning line selection period), the word line WL2a is first selected to read the image data for the first time, and the first data signal DATAa is output. Next, in the same second horizontal scanning period, the word line WL2b is selected, the image data is read for the second time, and the second data signal DATAb is output. When horizontal cells are used in this way, a plurality of different word lines (WL1a, WL1b) in the memory block are selected in one horizontal scanning period, so that multiple readings in one horizontal scanning period can be realized.

  FIG. 24 shows an arrangement example of memory blocks and driver cells when the vertical cell shown in FIG. 22C is used as the memory cell. In the vertical cell, the width in the D2 direction can be made shorter than that in the horizontal cell. Therefore, the number of memory cells in the D2 direction can be doubled as compared with the horizontal cells. In the vertical cell, the column of memory cells connected to each sense amplifier is switched using column selection signals COLa and COLb.

  For example, in FIG. 24, when the column selection signal COLa becomes active, the memory cell MC on the column Ca side among the memory cells MC on the D1 direction side of the sense amplifiers SAR0 to SAR5 is selected and connected to the sense amplifiers SAR0 to SAR5. Is done. The signals of the image data stored in these selected memory cells MC are amplified and output as D0R to D5R. On the other hand, when the column selection signal COLb becomes active, the memory cell MC on the column Cb side among the memory cells MC on the D1 direction side of the sense amplifiers SAR0 to SAR5 is selected and connected to the sense amplifiers SAR0 to SAR5. The signals of the image data stored in these selected memory cells MC are amplified and output as D0R to D5R. The same applies to reading of image data of memory cells connected to other sense amplifiers.

  In the case of the configuration shown in FIG. 24, the image data can be read a plurality of times in one horizontal scanning period shown in FIG. 20 as follows. That is, in the first horizontal scanning period, first, the word line WL1 is selected, the column selection signal COLa is activated, the first reading of the image data is performed, and the first data signal is displayed as indicated by A5 in FIG. DATAa is output. Next, the same word line WL1 is selected in the same first horizontal scanning period, the column selection signal COLb is activated, and the second reading of the image data is performed. As shown in A6 in FIG. 20, the second data is read. The signal DATAb is output. In the next second horizontal scanning period, the word line WL2 is selected, the column selection signal COLa is activated, the image data is read for the first time, and the first data signal DATAa is output. Next, the same word line WL2 is selected in the same second horizontal scanning period, the column selection signal COLb is activated, the image data is read a second time, and the second data signal DATAb is output. As described above, in the case of a vertical cell, the same word line in the memory block is selected a plurality of times in one horizontal scanning period, so that reading can be performed a plurality of times in one horizontal scanning period.

  The configuration and arrangement of the driver cell DRC are not limited to FIGS. 23 and 24, and various modifications can be made. For example, when a data driver for R, G, and B is multiplexed and sent to a display panel as shown in FIG. 10C by a display driver for a low-temperature polysilicon TFT, one common DAC is used. It is possible to perform D / A conversion of image data for R, G, and B (image data for one pixel). Therefore, in this case, the driver cell DRC may include one shared DAC having the configuration shown in FIG. 23 and 24, the R circuit (DLATR, DACR), the G circuit (DLATG, DACG), and the B circuit (DLATB, DACB) are arranged along the direction D2 (D4). Yes. However, the R, G, and B circuits may be arranged along the direction D1 (D3).

5.5 Grayscale Voltage Output Line Wiring, Bit Line Shielding As shown in FIG. 25A, in this embodiment, the grayscale voltage output line from which the grayscale voltage from the grayscale voltage generation circuit block GB is output. Are wired along the direction D1 on the circuit blocks CB1 to CBN. Specifically, the gradation voltage output line is formed by a global line GL that is an upper layer than the local line in the circuit block.

  That is, as shown in FIG. 25A, the gradation voltage from the gradation voltage generation circuit block GB needs to be supplied to the data driver blocks DB1 to DB4 arranged along the direction D1. When the gradation voltage output line is wired on the I / F regions 12 and 14, it is difficult to wire other signal lines and power supply lines with global lines in these I / F regions 12 and 14. Therefore, the wiring efficiency in the I / F regions 12 and 14 is lowered, and a situation occurs in which the width of the I / F regions 12 and 14 in the D2 direction must be increased. In particular, in the output side I / F region 12, since it is necessary to wire a large number of data signal output lines from the data driver block and a large number of scanning signal output lines from the scan driver block, the gradation voltage output line is connected to the output side I Wiring on the / F region 12 is not desirable.

  In this regard, in FIG. 25A, the grayscale voltage output line from the grayscale voltage generation circuit block GB is wired along the D1 direction on the circuit blocks CB1 to CBN. Accordingly, the global lines in the I / F regions 12 and 14 can be used for wiring of signal lines and power supply lines other than the gradation voltage output line, and wiring efficiency can be improved.

  However, if the global line GL such as the gradation voltage output line is wired on the memory blocks MB1 to MB4, the following problem may occur. For example, in FIG. 25B, the word line WL becomes active and the voltage level of the bit line BL becomes higher than the voltage level of the bit line XBL, so that the output SAQ of the sense amplifier has a normal logic “1”. Is output.

  On the other hand, in FIG. 25C, when the voltage level of the global line GL changes, the voltage level of XBL changes due to the coupling capacitance between the GL and the bit line XBL below it. As a result, the output SAQ of the sense amplifier may output an abnormal logic “0”.

  Therefore, in the present embodiment, in the memory blocks MB1 to MB4 in FIG. 25A, a shield line is wired above the bit line, and the gradation voltage output line from the gradation voltage generation circuit block GB is disposed above the shield line. Wiring.

  For example, FIG. 26A shows a wiring example of the shield line SDL in the case of a horizontal cell. In FIG. 26A, the first metal wiring ME1 in the lowermost layer is used for node connection, and the second metal wiring ME2 in the upper layer is connected to bit lines BL and XBL and VDD (second power supply in a broad sense). ) Used for power lines. The third metal wiring ME3 is used for the power line of the word line WL and VSS (first power supply in a broad sense), and the fourth metal wiring ME4 is used for the shield line SDL connected to VSS. The The uppermost fifth metal wiring ME5 is used for a global line GL such as a gradation voltage output line.

  FIG. 26B shows a wiring example of the shield line SDL in the case of a vertical cell. In FIG. 26B, the metal wiring ME1 is used for node connection, and the metal wiring ME2 is used for the word line WL and the VDD power supply line. The metal wiring ME3 is used for the bit lines BL and XBL and the VSS power supply line, and the metal wiring ME4 is used for the shield line SDL. The metal wiring ME5 is used for a global line GL such as a gradation voltage output line.

  26A and 26B, the bit lines BL and XBL are wired along the direction D1 (long side direction of the integrated circuit device) so that the shield line SDL overlaps the bit lines BL and XBL. Wired in the D1 direction. That is, the shield line SDL is formed in the upper layer of BL and XBL so as to cover the bit lines BL and XBL.

  In this way, it is possible to shield the change in the voltage level of the global line GL such as the gradation voltage output line from being transmitted to the bit lines BL and XBL by the coupling capacitance. Therefore, as shown in FIG. 25C, it is possible to effectively prevent a situation in which the voltage level of the bit lines BL and XBL changes and the sense amplifier erroneously outputs.

  If the shield line SDL is wired to each memory cell as shown in FIGS. 26A and 26B, the shield line SDL is not a solid line, and a slit is formed between the shield lines. By forming such slits, degassing between the metal layer and the insulating film is possible, and reliability and yield can be improved.

  In FIG. 26B, the VSS power supply line is wired at the slit between the adjacent shield lines SDL. In this way, the upper shield can be realized by the shield line SDL, and the horizontal shield can be realized by the VSS power supply line, thereby enabling effective shielding.

6). Electronic Device FIGS. 27A and 27B show examples of electronic devices (electro-optical devices) including the integrated circuit device 10 of the present embodiment. Note that the electronic device may include components other than those shown in FIGS. 27A and 27B (for example, a camera, an operation unit, a power supply, or the like). The electronic device according to the present embodiment is not limited to a mobile phone, and may be a digital camera, a PDA, an electronic notebook, an electronic dictionary, a projector, a rear projection television, a portable information terminal, or the like.

  27A and 27B, the host device 410 is, for example, an MPU (Micro Processor Unit), a baseband engine (baseband processor), or the like. The host device 410 controls the integrated circuit device 10 that is a display driver. Alternatively, processing as an application engine or baseband engine, or processing as a graphic engine such as compression, decompression, or sizing can be performed. In addition, the image processing controller (display controller) 420 in FIG. 27B performs processing as a graphic engine such as compression, decompression, and sizing on behalf of the host device 410.

  The display panel 400 includes a plurality of data lines (source lines), a plurality of scanning lines (gate lines), and a plurality of pixels specified by the data lines and the scanning lines. A display operation is realized by changing the optical characteristics of the electro-optical element (in a narrow sense, a liquid crystal element) in each pixel region. The display panel 400 can be constituted by an active matrix panel using switching elements such as TFTs and TFDs. Note that the display panel 400 may be a panel other than the active matrix method, or may be a panel other than the liquid crystal panel.

  In the case of FIG. 27A, the integrated circuit device 10 having a built-in memory can be used. That is, in this case, the integrated circuit device 10 once writes the image data from the host device 410 into the built-in memory, reads the written image data from the built-in memory, and drives the display panel. On the other hand, in the case of FIG. 27B, an integrated circuit device 10 without a built-in memory can be used. That is, in this case, the image data from the host device 410 is written into the built-in memory of the image processing controller 420. The integrated circuit device 10 drives the display panel 400 under the control of the image processing controller 420.

  Although the present embodiment has been described in detail as described above, it will be easily understood by those skilled in the art that many modifications can be made without departing from the novel matters and effects of the present invention. Accordingly, all such modifications are intended to be included in the scope of the present invention. For example, in the specification or drawings, terms (output-side I / F region, input-side I / F) described at least once together with different terms having a broader meaning or the same meaning (first interface region, second interface region, etc.) (Area, etc.) can be replaced with the different terms anywhere in the specification or drawings. Further, the configuration, arrangement, and operation of the integrated circuit device and the electronic device are not limited to those described in this embodiment, and various modifications can be made.

1A, 1B, and 1C are explanatory diagrams of a comparative example of the present embodiment. FIGS. 2A and 2B are explanatory views for mounting an integrated circuit device. 1 is a configuration example of an integrated circuit device according to an embodiment. Examples of various types of display drivers and the circuit blocks they contain. 5A and 5B are plan layout examples of the integrated circuit device of this embodiment. 6A and 6B are examples of cross-sectional views of the integrated circuit device. 6 is a circuit configuration example of an integrated circuit device. 8A, 8B, and 8C are configuration examples of a data driver and a scan driver. 9A and 9B are configuration examples of a power supply circuit and a gradation voltage generation circuit. 10A, 10B, and 10C are configuration examples of a D / A conversion circuit and an output circuit. Explanatory drawing of the arrangement method of the block of a scanning driver. 12A and 12B show configuration examples of output transistors of the scan driver. The figure which shows an example of the electrical potential relationship of several power supply voltage. 14A and 14B are explanatory diagrams of power supply voltage supply lines. FIG. 5 is an explanatory diagram of a block arrangement method of a logic circuit, a gradation voltage generation circuit, a power supply circuit, and a data driver. 3 is a detailed circuit configuration example of a gradation voltage generation circuit block. 17A, 17B, and 17C are explanatory diagrams for adjustment of gradation characteristics. 18A and 18B show detailed arrangement examples of the gradation voltage generation circuit block. 19A and 19B are explanatory diagrams of the arrangement of memory blocks and data driver blocks. Explanatory drawing of the method of reading image data in multiple times in 1 horizontal scanning period. Data driver and driver cell arrangement example. 22A, 22B, and 22C show configuration examples of memory cells. An arrangement example of memory blocks and driver cells in the case of a horizontal cell. An arrangement example of memory blocks and driver cells in the case of a vertical cell. 25A, 25B, and 25C are explanatory diagrams of a wiring method of the gradation voltage output line. 26 (A) and 26 (B) are explanatory diagrams of a method for forming a shield line. 27A and 27B are configuration examples of electronic devices.

Explanation of symbols

CB1 to CBN 1st to Nth circuit blocks, 10 integrated circuit devices,
12 output side I / F area, 14 input side I / F area, 20 memory,
22 memory cell array, 24 row address decoder,
26 column address decoder, 28 write / read circuit,
40 logic circuit, 42 control circuit, 44 display timing control circuit,
46 host interface circuit, 48 RGB interface circuit,
50 data drivers, 52 data latch circuits, 54 D / A conversion circuits,
56 output circuit, 70 scan driver, 72 shift register,
73 scanning address generation circuit, 74 address decoder, 76 level shifter,
78 output circuit, 90 power supply circuit, 92 booster circuit, 94 regulator circuit,
96 VCOM generation circuit, 98 control circuit, 110 gradation voltage generation circuit,
112 selection voltage generation circuit, 114 gradation voltage selection circuit, 116 adjustment register

Claims (16)

The direction from the first side, which is the short side of the integrated circuit device, to the third side facing the first side is defined as the first direction, and the second side, which is the long side of the integrated circuit device, is directed to the fourth side facing the first side. Including the first to Nth circuit blocks (N is an integer of 3 or more) arranged along the first direction,
The circuit blocks at both ends of the first to Nth circuit blocks are:
First and second scan driver blocks for driving scan lines;
The circuit blocks excluding the circuit blocks at both ends of the first to Nth circuit blocks are:
An integrated circuit device comprising at least one data driver block for driving the data line. In claim 1,
The circuit blocks excluding the circuit blocks at both ends of the first to Nth circuit blocks are:
A logic circuit block for setting gradation characteristic adjustment data;
A gradation voltage generation circuit block for generating a gradation voltage based on the set adjustment data;
A power supply circuit block for generating a power supply voltage,
At least one of the data driver blocks is
An integrated circuit device, which receives a gradation voltage from the gradation voltage generation circuit block and drives a data line. In claim 2,
The power supply circuit block is disposed between the first scan driver block and the data driver block,
The integrated circuit device, wherein the logic circuit block and the grayscale voltage generation circuit block are arranged between the second scan driver block and the data driver block. In claim 2 or 3,
At least one of the data driver blocks is
An integrated circuit device, wherein the integrated circuit device is disposed between the logic circuit block, the gradation voltage generation circuit block, and the power supply circuit block. In any of claims 2 to 4,
The integrated circuit device, wherein the logic circuit block and the gradation voltage generation circuit block are arranged adjacent to each other along the first direction. In any of claims 2 to 5,
2. The integrated circuit device according to claim 1, wherein the gradation voltage generation circuit block is disposed between the data driver block and the logic circuit block. In any one of Claims 2 thru | or 6.
The circuit blocks excluding the circuit blocks at both ends of the first to Nth circuit blocks are:
Including at least one memory block for storing image data;
The integrated circuit device, wherein the memory block and the data driver block are arranged adjacent to each other along the first direction. In claim 7,
The circuit blocks excluding the circuit blocks at both ends of the first to Nth circuit blocks are:
First to I-th memory blocks (I is an integer of 2 or more);
An integrated circuit comprising: a first to a first data driver block arranged adjacent to each of the first to I-th memory blocks along the first direction; Circuit device. In any of claims 2 to 8,
The gradation voltage generation circuit block includes:
A selection voltage generation circuit that outputs a selection voltage based on a power supply voltage;
An integrated circuit device comprising: a gradation voltage selection circuit that selects and outputs a gradation voltage based on the adjustment data set by the logic circuit block and the selection voltage. In claim 9,
The integrated circuit device, wherein the selection voltage generation circuit is arranged on the second direction side of the gradation voltage selection circuit or on a fourth direction side opposite to the second direction. In any of claims 2 to 10,
A grayscale voltage output line for outputting a grayscale voltage from the grayscale voltage generation circuit block is wired along the first direction on the first to Nth circuit blocks. Integrated circuit device. In any of claims 2 to 11,
The circuit blocks excluding the circuit blocks at both ends of the first to Nth circuit blocks are:
Including at least one memory block for storing image data;
In the memory block,
An integrated circuit characterized in that a shield line is wired above the bit line, and a gradation voltage output line for outputting a gradation voltage from the gradation voltage generation circuit block is wired above the shield line. apparatus. In claim 12,
In the memory block,
The integrated circuit device, wherein the bit line is wired along the first direction, and the shield line is wired along the first direction so as to overlap the bit line. In any of claims 2 to 13,
Including a first interface region provided along the fourth side on the second direction side of the first to Nth circuit blocks;
The power supply circuit block is
Generating a plurality of types of power supply voltages to be supplied to the first to Nth circuit blocks;
The power supply voltage having the highest potential among the plurality of types of power supply voltages is
An integrated circuit device, wherein the power supply voltage is supplied as a power supply voltage of at least one of the first and second scan driver blocks via a power supply voltage supply line wired in the first interface region. In any one of Claims 1 thru | or 13.
A first interface region provided along the fourth side on the second direction side of the first to Nth circuit blocks;
A second interface region provided along the second side on the fourth direction side of the first to Nth circuit blocks when a direction opposite to the second direction is a fourth direction. And an integrated circuit device. An integrated circuit device according to any one of claims 1 to 15,
A display panel driven by the integrated circuit device;
An electronic device comprising:

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