JP2006520090A - 流体冷却システム - Google Patents
流体冷却システム Download PDFInfo
- Publication number
- JP2006520090A JP2006520090A JP2005518661A JP2005518661A JP2006520090A JP 2006520090 A JP2006520090 A JP 2006520090A JP 2005518661 A JP2005518661 A JP 2005518661A JP 2005518661 A JP2005518661 A JP 2005518661A JP 2006520090 A JP2006520090 A JP 2006520090A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- fluid
- temperature
- rack
- enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 60
- 239000012530 fluid Substances 0.000 title claims abstract description 56
- 238000012544 monitoring process Methods 0.000 claims abstract description 21
- 238000010992 reflux Methods 0.000 claims abstract description 14
- 239000012809 cooling fluid Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000006378 damage Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (8)
- ラック(2)またはエンクロージャに収容されかつ冷却すべき各電子コンポーネント(1)に個別に割り当てられる複数の冷却ユニット(4)と、さらに冷却温度を監視する監視および制御ユニット(9)とを有する流体冷却システムにおいて、
前記冷却ユニット(4)は、流体冷却ユニットとして構成されており、かつラック(2)またはエンクロージャに組み込まれる共通の中央流体管路システム(5)に分岐箇所(5.1)を介して接続されており、
前記監視および制御ユニット(9)が、中央流体管路システム(5)における冷却温度を監視するように構成されており、またあらかじめ設定されたまたはあらかじめ設定可能な流体環流分岐路(5.3)における境界温度を上回った際、供給分岐路(5.2)における温度と、環流分岐路(5.3)における温度との間のあらかじめ設定されたまたはあらかじめ設定可能な境界温度差を上回った際、または流体の流量があらかじめ設定されたまたはあらかじめ設定可能な境界値を下回った際にエラー信号を出力するように構成されていることを特徴とする
流体冷却システム。 - 前記エラー信号を利用して、警報をトリガするおよび/またはすべての電子コンポーネント(1)に共通の電力供給を遮断する、
請求項1に記載の流体冷却システム。 - 前記冷却ユニット(4)は冷却素子を有し、
該冷却素子は、温度を感知し、熱を発生する電子コンポーネントに熱的に結合され、当該冷却素子を冷却流体が貫流する、
請求項1または2に記載の冷却システム。 - 前記の中央流体管路システム(5)は、供給チャネルおよび環流チャネルが設けられた管路ユニット(5.4)を有しており、
該管路ユニットは、垂直に配向されてラック(2)またはエンクロージャに取り付けられており、またその長さにわたって分岐箇所(5.1)を形成するため、等間隔に配置された結合手段が設けられている、
請求項1から3までのいずか1項に記載の冷却システム。 - 前記のラック(2)またはエンクロージャに延在する中央流体管路システム(5)の区分は、垂直なフレーム脚部、少なくとも1つの取り付けレール、または被覆部の内側に取り付けられている、
請求項1から4までのいずれか1項に記載の冷却システム。 - 前記のフレーム脚部にまたは当該フレーム脚部内に、ラック(2)またはエンクロージャの内部に向かって、その長さにわたって開いた垂直の受容部が組み込まれており、
該受容部に前記の中央流体管路システム(5)の区分がはめ込まれている、
請求項5に記載の冷却システム。 - 前記中央流体管路システム(5)は空気/流体熱交換器(8)および/または流体/流体熱交換器(6)に接続されている、
請求項1から6までのいずれか1項に記載の冷却システム。 - 前記流体/流体熱交換器(6)は再冷装置(7)に接続されている、
請求項7に記載の冷却システム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10310282A DE10310282A1 (de) | 2003-03-07 | 2003-03-07 | Flüssigkeits-Kühlsystem |
PCT/EP2004/001084 WO2004080132A2 (de) | 2003-03-07 | 2004-02-06 | Flüssigkeits-kühlsystem |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006520090A true JP2006520090A (ja) | 2006-08-31 |
JP4180604B2 JP4180604B2 (ja) | 2008-11-12 |
Family
ID=32864316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005518661A Expired - Lifetime JP4180604B2 (ja) | 2003-03-07 | 2004-02-06 | 流体冷却システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US7559209B2 (ja) |
EP (1) | EP1604262B1 (ja) |
JP (1) | JP4180604B2 (ja) |
CN (1) | CN100343783C (ja) |
DE (2) | DE10310282A1 (ja) |
WO (1) | WO2004080132A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010025408A (ja) * | 2008-07-17 | 2010-02-04 | Fujitsu Ltd | 冷却システム |
JP2013187251A (ja) * | 2012-03-06 | 2013-09-19 | Sohki:Kk | 電子装置の冷却システムおよび方法 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SI21941B (sl) * | 2004-11-03 | 2013-06-28 | Andraž Ogorevc | Javni prikazovalnik |
DE102006019578A1 (de) * | 2006-04-27 | 2007-10-31 | Abb Patent Gmbh | Vorrichtung zur Messung der Gas oder Lufttemperatur in einem Gehäuse |
US7447026B2 (en) * | 2006-08-31 | 2008-11-04 | Hewlett-Packard Development Company, L.P. | System for hot swapping heat exchangers |
US7886983B2 (en) * | 2007-07-10 | 2011-02-15 | Liebert Corporation | Condensation prevention system and methods of use |
US8164901B2 (en) * | 2008-04-16 | 2012-04-24 | Julius Neudorfer | High efficiency heat removal system for rack mounted computer equipment |
US7848106B2 (en) * | 2008-04-17 | 2010-12-07 | Teradyne, Inc. | Temperature control within disk drive testing systems |
DE102008030308A1 (de) | 2008-06-30 | 2009-12-31 | Lindenstruth, Volker, Prof. | Gebäude für ein Rechenzentrum mit Einrichtungen zur effizienten Kühlung |
US20100058798A1 (en) * | 2008-09-11 | 2010-03-11 | Der-Yin Hsieh | Coolant-circulation cooling device for computer servo |
DE102010005192B4 (de) | 2010-01-21 | 2014-12-04 | Rittal Gmbh & Co. Kg | Regelungsverfahren einer Kühlanlage |
CN102361234B (zh) * | 2011-05-27 | 2015-08-05 | 三一重型综采成套装备有限公司 | 一种电控箱及矿山机械 |
US9155230B2 (en) * | 2011-11-28 | 2015-10-06 | Asetek Danmark A/S | Cooling system for a server |
CN102566605A (zh) * | 2012-01-17 | 2012-07-11 | 华为技术有限公司 | 单板冷却装置 |
CH706146A2 (de) * | 2012-02-29 | 2013-08-30 | Oblamatik Ag | Verfahren und System zum Temperieren von Bauteilen. |
DE102012007089B4 (de) * | 2012-04-11 | 2015-12-24 | Rittal Gmbh & Co. Kg | Verfahren zur Kühlung von Luft im Innern eines Schaltschrankes und ein entsprechendes Kühlgerät für einen Schaltschrank |
US10312180B2 (en) | 2012-04-23 | 2019-06-04 | Enermax Technology Corporation | Water-cooling thermal dissipating system and thermal dissipating method |
TWI436559B (zh) * | 2012-04-23 | 2014-05-01 | Enermax Technology Corp | 水冷散熱系統及其散熱方法 |
CN108966594B (zh) * | 2012-05-02 | 2021-07-13 | 保锐科技股份有限公司 | 水冷散热系统 |
EP2663172A1 (en) | 2012-05-11 | 2013-11-13 | eCube Computing GmbH | Method for operating a data centre with efficient cooling means |
US9016352B2 (en) | 2012-05-21 | 2015-04-28 | Calvary Applied Technologies, LLC | Apparatus and methods for cooling rejected heat from server racks |
US8436246B1 (en) | 2012-10-19 | 2013-05-07 | Calvary Applied Technologies, LLC | Refrigerant line electrical ground isolation device for data center cooling applications |
DE102013104627B3 (de) * | 2013-05-06 | 2014-09-25 | R. Stahl Schaltgeräte GmbH | Anordnung aus einem druckfest gekapselten Gehäuse und einer Temperiervorrichtung und Verfahren zu deren Überwachung |
EP4087379A1 (de) | 2019-09-23 | 2022-11-09 | Rittal GmbH & Co. KG | Schaltschrankanordnung mit mindestens einem it-rack oder schaltschrankgehäuse und mit mindestens einem kühlgerät sowie ein entsprechendes verfahren |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1012389B (de) * | 1943-05-08 | 1957-07-18 | Dr Heinrich Herbst | Elektronen- oder Ionenmikroskop |
US4229437A (en) * | 1978-07-18 | 1980-10-21 | Lucille Likens Filson | Paste or dough-like salve for treating skin |
JPS59119750A (ja) | 1982-12-24 | 1984-07-11 | Toshiba Corp | 水冷式サイリスタ変換器 |
JPS61125634A (ja) | 1984-11-21 | 1986-06-13 | Fujitsu Ltd | 異常監視制御方式 |
JPH02113562A (ja) | 1988-10-24 | 1990-04-25 | Hitachi Ltd | 半導体装置 |
JPH07107658B2 (ja) | 1989-03-29 | 1995-11-15 | 日本電気株式会社 | 電子装置の冷却装置 |
DE8908325U1 (de) * | 1989-07-07 | 1989-09-07 | Siemens AG, 1000 Berlin und 8000 München | Schwenkbare Kühleinrichtung für planare elektronische Baugruppen |
US5424916A (en) * | 1989-07-28 | 1995-06-13 | The Charles Stark Draper Laboratory, Inc. | Combination conductive and convective heatsink |
DE9003687U1 (de) * | 1990-03-29 | 1990-05-31 | Siemens AG, 1000 Berlin und 8000 München | Kühleinrichtung für Geräteeinschübe |
US5144811A (en) * | 1991-01-10 | 1992-09-08 | Hughes Aircraft Company | Condensation control system for water-cooled electronics |
US5509468A (en) * | 1993-12-23 | 1996-04-23 | Storage Technology Corporation | Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor |
JP2694515B2 (ja) | 1995-03-01 | 1997-12-24 | エス・ティエス株式会社 | 冷却装置 |
DE19609689B4 (de) * | 1996-03-13 | 2006-01-26 | Rittal Gmbh & Co. Kg | Schaltschrank mit einer zentralen Steuerungseinrichtung zum Überwachen, Steuern und/oder Regeln von Einbau- und/oder Anbaueinheiten |
DE19609651C2 (de) * | 1996-03-13 | 1998-01-22 | Loh Kg Rittal Werk | Schaltschrank-Klimatisierungseinrichtung |
DE10112389A1 (de) * | 2001-03-15 | 2002-10-02 | Martin Hess | Mobilfunkstation |
DE20121455U1 (de) * | 2001-03-31 | 2002-09-26 | Rittal GmbH & Co. KG, 35745 Herborn | Schaltschrank mit Temperaturüberwachung im Schaltschrankinnenraum |
JP2002374086A (ja) * | 2001-06-15 | 2002-12-26 | Hitachi Ltd | ラックマウント搭載型情報処理装置の冷却方法 |
US6714412B1 (en) * | 2002-09-13 | 2004-03-30 | International Business Machines Corporation | Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use |
-
2003
- 2003-03-07 DE DE10310282A patent/DE10310282A1/de not_active Ceased
-
2004
- 2004-02-06 JP JP2005518661A patent/JP4180604B2/ja not_active Expired - Lifetime
- 2004-02-06 US US10/525,551 patent/US7559209B2/en active Active
- 2004-02-06 CN CNB2004800001545A patent/CN100343783C/zh not_active Expired - Lifetime
- 2004-02-06 EP EP04708724A patent/EP1604262B1/de not_active Expired - Lifetime
- 2004-02-06 DE DE502004007672T patent/DE502004007672D1/de not_active Expired - Lifetime
- 2004-02-06 WO PCT/EP2004/001084 patent/WO2004080132A2/de active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010025408A (ja) * | 2008-07-17 | 2010-02-04 | Fujitsu Ltd | 冷却システム |
JP2013187251A (ja) * | 2012-03-06 | 2013-09-19 | Sohki:Kk | 電子装置の冷却システムおよび方法 |
Also Published As
Publication number | Publication date |
---|---|
DE10310282A1 (de) | 2004-09-16 |
JP4180604B2 (ja) | 2008-11-12 |
EP1604262B1 (de) | 2008-07-23 |
DE502004007672D1 (de) | 2008-09-04 |
CN100343783C (zh) | 2007-10-17 |
WO2004080132A3 (de) | 2004-11-04 |
US7559209B2 (en) | 2009-07-14 |
CN1698025A (zh) | 2005-11-16 |
WO2004080132A2 (de) | 2004-09-16 |
EP1604262A2 (de) | 2005-12-14 |
US20060037331A1 (en) | 2006-02-23 |
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