JP2006351734A - Semiconductor device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which does not show short-circuit of adjacent contacts even when voids are formed due to the shape of edge of a film, in the semiconductor device where the films generating different stress in the channel forming region are mutually formed through lamination, and also to provide a method of manufacturing the same semiconductor device. <P>SOLUTION: A void aperture exposed to a contact aperture is filled by depositing an insulating material after the contact aperture is formed. Accordingly, entry of a conductive material into the relevant void can be prevented and short-circuit of the adjacent contacts can also be prevented. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

    The present invention relates to a semiconductor device having a field effect transistor having a MIS structure (Metal Insulator Semiconductor) on a semiconductor substrate and a method for manufacturing the same.

Among transistors having a MIS structure, an oxide film is used as an insulating film, and nMOSFET (n Channel Metal Oxide Field Effect) is formed on the same substrate.
A CMOS (Complementary Metal Oxide Semiconductor) FET in which a pMOSFET (p Channel Metal Oxide Field Effect Transistor) is formed has been put into practical use. CMOSFETs are widely used as LSI devices because of their low power consumption, miniaturization, high integration, and high-speed operation.

In recent years, in this CMOS, an operation speed-up technique for intentionally applying stress to a channel formation region of a MOSFET to increase carrier mobility has been studied. Among them, Dual Stress Liner technology (hereinafter referred to as DSL technology) in which a film that generates tensile stress in the channel formation region of the nMOSFET and a film that generates compressive stress in the channel formation region of the pMOSFET are formed on each MOSFET. A semiconductor device used is known (Patent Document 1). (Unless otherwise specified, nMISFET and nMOSFET are collectively referred to as nFET, and pMISFET and pMOSFET are collectively referred to as pFET.)
FIG. 13 is a schematic cross-sectional view in the middle of a semiconductor device manufacturing process using a conventionally known DSL technique. A p-type semiconductor region 102 and an n-type semiconductor region 10 3 are formed in the semiconductor substrate 101. In the vicinity of the surface of the p-type semiconductor region 102, a source region or a drain region including an n-type impurity layer 105 and a conductor layer 106 is formed. A channel forming region 109 is formed on the surface of the p-type semiconductor region 102 between the source region and the drain region. A gate electrode 111 and a conductor film 112 are formed on the channel formation region 109 with a gate insulating film 110 interposed therebetween. In this way, an nFET is formed on the left side of the surface of the semiconductor substrate 101 of FIG. Similarly, near the surface of the n-type semiconductor region 103, a source region or a drain region composed of a p-type impurity layer 107 and a conductor layer 108, a channel formation region 113, a gate insulating film 114, a gate electrode 115, and a conductor film 116. Is formed. In this way, the pFET is formed on the right side of the surface of the semiconductor substrate 101 of FIG.

Next, a first film 117 is selectively formed on the nFET so as to cover the gate electrode 111, and tensile stress is generated in the channel formation region 109. Similarly, the second film 118 is selectively formed so as to cover the gate electrode of the pFET and partially cover the first film 117, and generate compressive stress in the channel formation region 113.
International Publication No. 2002/043151 Pamphlet

    When the second film 118 is etched to remove the second film 118 on the first film 117, the edge portion of the second film 118 is overetched in the vicinity of the interface of the first film 117. The overhang 120 is formed on the eaves or on the parasol. FIG. 13 shows this state.

  FIG. 14 is a schematic view during the manufacturing process of a semiconductor device in which an interlayer insulating film 119 is deposited on the first film 117 and the second film 118 and the contact opening 121 is formed by photolithography and anisotropic etching. It is sectional drawing. In the step of depositing the interlayer insulating film 119, the insulating material of the interlayer insulating film 119 cannot enter under the overhang 120 of the second film, and a void 123 is formed. When this void intersects the contact opening 121, an opening of the void 123 is formed on the side wall. Next, in order to establish electrical continuity between the FET and the external circuit, a conductive material is deposited in the contact opening 121 to form a plug. Then, the conductive material penetrates into the void 123, or conductive impurities remain on the lower surface of the overhang 120 so that the void 123 becomes electrically conductive, and a short circuit occurs between adjacent contacts, and the LSI is Caused malfunction.

  FIG. 15 is a schematic plan view of the semiconductor device shown in FIG. 14 as viewed from above. An nFET region composed of nFET1 and nFET2 and a pFET region composed of pFET1 and pFET2 are shown across the element isolation region 104. Two contact openings 121 are formed in each source region and drain region, and a void 123 is formed so as to communicate with the contact openings 121a, 121b, and 121c.

  FIG. 16 is a schematic perspective view showing the upper structure of the drain region 106 which is a conductor layer in order to facilitate understanding of the formation state of the void 123. Both contact openings 121a and 121c on the drain region 106, which is a conductor layer, communicate with each other through a void 123 caused by an overhang 120 formed at the end of the second film 118. Thereafter, when a plug is formed by depositing a conductive material in the contact opening, the plug formed in the contact opening 121a of the nFET 1 and the plug formed in the contact opening 121b of the nFET 2 are electrically connected to generate a short circuit, and thus an LSI. Cause malfunctions.

  In order to solve the above problems, the present invention has taken the following measures.

  In the present invention according to claim 1, a step of forming a first transistor and a second transistor on a substrate, a step of forming a first film for generating stress on the first transistor on the first transistor, Forming a thin insulating film on the first film, and selectively forming a second film for generating stress on the second transistor on the second transistor and on the thin insulating film. A step of forming a first insulating film on the thin insulating film and the second film, and selectively removing the first insulating film and the second film to form a contact opening. The semiconductor device manufacturing method includes a step and a step of depositing an insulator on the inner wall of the contact opening.

    In the present invention according to claim 2, the step of forming the first transistor and the second transistor on the substrate includes forming the first conductive region and the first channel forming region in the first surface region of the semiconductor substrate, and Forming a second conductive region and a second channel forming region in a second surface region different from the first surface region, wherein the first film applies tensile stress to the first channel forming region, and 2. The method of manufacturing a semiconductor device according to claim 1, wherein the film generates a compressive stress in the second channel formation region.

    In the present invention according to claim 3, the step of depositing an insulator on the inner wall of the contact opening includes depositing a second insulating film on the substrate on which the contact opening is formed, and the second insulating film. 3. A method of manufacturing a semiconductor device according to claim 1, further comprising a step of selectively removing and forming a sidewall on the inner wall of the contact opening.

In the present invention according to claim 4, the first transistor and the second transistor formed on the substrate,
A first film formed on the first transistor and generating stress on the first transistor; a thin insulating film formed on the first film; and formed on the second transistor. And a second film formed on a part of the surface of the thin insulating film and generating stress on the second transistor, and a second film formed on the thin insulating film and the second film. An insulating film; a contact opening formed by selectively removing the first insulating film and the second film; and an inner wall of the contact opening, the first film or the second film And an insulator formed in the vicinity of the film.

    In the present invention according to claim 5, the first transistor is an nFET formed in a first surface region of a semiconductor substrate and has a first channel forming region, and the second transistor includes the first surface region. PFET formed in a second surface region different from that having a second channel forming region, wherein the first film has a tensile stress in the first channel forming region, and the second film has the second channel 5. The semiconductor device according to claim 4, wherein compressive stress is generated in the channel formation region.

    According to a sixth aspect of the present invention, in the semiconductor device according to the fourth or fifth aspect, a sidewall is formed on the inner wall of the contact opening by the insulator.

    According to a seventh aspect of the present invention, in the semiconductor device according to any one of the fourth to sixth aspects, the upper cross-sectional area of the contact opening is larger than the lower cross-sectional area.

    According to the first aspect of the present invention, the first film and the thin insulating film are selectively formed on the first transistor, and the second film is formed on the second transistor and the thin insulating film. When the second film is selectively removed leaving a part on the thin insulating film, the end shape of the second film becomes an overhang and the first insulating film deposited on the second film Even when a void is formed and adjacent contact openings communicate with each other, an insulator is further deposited on the inner wall of the contact opening so that the contact openings can be prevented from communicating via the void. . As a result, even if the contact opening is filled with a conductor to form a plug, adjacent plugs do not short-circuit. Therefore, without changing the design rules, the choice of materials to be applied to the first film and the second film is expanded, and the production of semiconductor devices in which the restrictions on film formation conditions and processing conditions are greatly relaxed A method can be provided.

    According to the second aspect of the present invention, the first film generates a tensile stress in the channel formation region of the first transistor, and the second film generates a compressive stress in the channel formation region of the second transistor. Therefore, the carrier mobility of the transistor can be effectively improved, and the contact opening is not communicated by a void, so that a short circuit between adjacent plugs can be prevented. A method can be provided.

    According to the third aspect of the present invention, since the insulator is deposited on the inner wall of the contact opening to form the sidewall, the end of the second film becomes an overhang and is formed on the first wall. Even when a void is formed in the insulating film and adjacent contact openings communicate with each other, communication between the contact hole openings can be reliably prevented by the side wall formed by the insulator formed thereafter. Therefore, it is possible to provide a method for manufacturing a semiconductor device that can improve the manufacturing yield without causing a short circuit between adjacent plugs.

    According to the fourth aspect of the present invention, the first film formed on the first transistor and generating stress on the first transistor, the thin insulating film formed thereon, and the second transistor Forming a stress on the second transistor, forming a selective second film on the thin insulating film, and forming an insulator on the inner wall of the contact opening and in the vicinity of the second film. Therefore, even when the edge of the second film is overhanged and voids are formed in the first insulating film deposited thereon, and adjacent contact openings communicate with each other, Since the insulator is further deposited on the inner wall, the contact openings are not communicated with each other through the void. As a result, even if the contact opening is filled with a conductor and a plug is formed, adjacent plugs do not short-circuit, and the material applied to the first film and the second film without changing the design rule. It is possible to provide a semiconductor device in which choices are expanded and restrictions on film formation conditions and processing conditions are greatly relaxed.

    According to the fifth aspect of the present invention, the first film and the second film are formed on the surfaces of the nFET and the pFET, respectively, and tensile stress is applied to the channel forming region of the nFET, and the channel forming region of the pFET is subjected to tensile stress. Provided is a semiconductor device capable of improving the carrier mobility of a transistor because compressive stress is generated and preventing a short circuit between adjacent plugs because a contact opening is not communicated by a void. can do.

    According to the sixth aspect of the present invention, even if the end portion of the second film becomes an overhang and a void is formed in the first insulating film formed thereon, and adjacent contact openings communicate with each other. A side wall is formed on the inner wall of the contact opening, and the opening of the void is reliably closed. As a result, it is possible to provide a semiconductor device capable of improving the manufacturing yield without causing short-circuit between plugs formed thereafter.

    According to the seventh aspect of the present invention, since the upper cross-sectional area of the contact opening is made larger than the lower cross-sectional area, it is possible to prevent an increase in the resistance of the plug in the contact portion, and a high-density and high-speed operation semiconductor device Can be provided.

    In the semiconductor device and the manufacturing method thereof according to the present invention, first, a first transistor is formed on a first surface region on a substrate, and a second transistor is formed on a second surface region different from the first surface region. A semiconductor single crystal substrate can be used as the substrate. Alternatively, an SOI (Silicon On Insulator) substrate in which a semiconductor layer is formed over an insulator can be used.

    The first transistor and the second transistor can be formed as follows, for example. First, a first gate electrode is formed on the first surface region and a second gate electrode is formed on the second surface region via a gate insulating film on the substrate. Then, a first channel formation region is defined in the vicinity of the surface of the substrate below the first gate electrode, and a first conductive region composed of a source region and a drain region is formed so as to sandwich the first channel formation region. Similarly, a second channel formation region is defined in the vicinity of the surface of the substrate below the second gate electrode, and a second conductive region including a source region and a drain region is formed by separating the second channel formation region. . When the first channel formation region is n-channel conductivity type, the first transistor is nFET, and when the second channel formation region is p-channel conductivity type, the second transistor is pFET.

    Next, a first film and a thin insulating film are formed on the first gate electrode and the first conductive region in the first surface region, and the second gate electrode and the second conductive region in the second surface region. Then, the first film and the thin insulating film in the second surface region are selectively removed using photolithography and etching techniques. Next, a second film is formed on the thin insulating film in the first surface region and the second gate electrode or the second conductive region in the second surface region, and is thin using photolithography and etching techniques. The insulating film is selectively removed from the first surface region while remaining on a part of the surface. The thin insulating film functions as an etching stopper when the second film is etched. As a result, the first film generates stress in the first channel formation region, and the second film generates stress in the second channel formation region. When this second film is selectively etched, the vicinity of the interface of the thin insulating film is under-etched, and an eaves-like or parasol-like overhang is formed.

    A silicon nitride film can be used as the first film and the second film. In addition to the silicon nitride film, a silicon oxide film or a multilayer structure film thereof can be used. Further, it is not limited to a silicon nitride film or a silicon oxide film, and may be any material that can generate necessary stress in the channel formation region of the transistor, and can be insulated from other insulating materials or conductive materials. It is possible to use a film having a composite structure in which an active material is combined. An oxide film such as a silicon oxide film can be used as the thin insulating film.

    The silicon nitride film can change the stress generated in the channel formation region by the film formation conditions and the surface treatment after the film formation. For example, when the first transistor is an nFET, a tensile stress can be generated in the first channel formation region, and when the second transistor is a pFET, a compressive stress can be generated in the second channel formation region. In general, the drain current increases in nFET as the tensile stress in the channel formation region increases, while the drain current increases in pFET as the compressive stress in the channel formation region increases.

    Next, a first insulating film is deposited on the substrate. A silicon oxide film can be used for the first insulating film. This layer functions as an interlayer insulating film. Next, contact openings are formed in order to establish conduction between the first conductive region and the second conductive region of the first transistor and the second transistor and an external circuit. The contact opening is dug down in order of the first insulating film, the second film, the thin insulating film, and the first film by photolithography and anisotropic etching until the first conductive region of the first transistor is exposed.

    Next, an insulator is deposited on the first insulating film and inside the contact opening. The insulator is also deposited on the side wall of the contact opening, and even if the end shape of the second film is overhanged and a void is formed in this part and the void opening is exposed on the inner wall of the contact opening, the void is exposed. The opening can be closed. Further, the sidewall can be formed by an insulator deposited in the contact opening. Further, after that, a conductive material is deposited in the contact opening to form a plug as an electrode. However, in order to prevent the diameter of the plug from being reduced and the resistance from being increased due to the formation of the side wall, The wall can be removed from the other inner walls leaving only the inner wall near the second film at the bottom of the contact opening. By closing the void opening in this way, even if a plug made of a conductive material is formed in the contact opening, the conductive material does not enter the void.

    Hereinafter, embodiments of the present invention will be described in more detail with reference to schematic cross-sectional views of the semiconductor device shown in FIGS.

    FIG. 1 is a schematic cross-sectional view showing a state in which nFETs and pFETs are formed on a surface region of a substrate. As the substrate, a silicon semiconductor substrate (hereinafter referred to as semiconductor substrate 1) is used. First, a silicon nitride film is deposited on the surface of the semiconductor substrate 1 by low pressure CVD (Chemical Vapor Deposition), and the silicon nitride film and the semiconductor substrate in a region to be an element isolation region are selectively removed sequentially by photolithography and etching. A shallow trench. Next, a silicon oxide film is deposited in the trench by low pressure CVD to fill the trench. Thereafter, chemical mechanical polishing (CMP) is performed and planarized, followed by thermal oxidation in an oxygen atmosphere to densify the oxide film, and the element isolation region 4 is formed. Thereafter, the silicon nitride film is removed, and ion implantation is performed on the semiconductor substrate. A p-type region 2 that is a p-well is formed in a region for forming an nFET, and an n-type region 3 that is an n-well is formed in a region for forming a pFET. Form. Any of the above ion implantation steps can be omitted by using p-type or n-type as the semiconductor substrate.

  Next, gate insulating films 14 and 18 and gate electrodes 15 and 20 are formed. The gate insulating films 14 and 18 are formed by thermally oxidizing the surface of the semiconductor substrate 1, polysilicon is deposited thereon by low-pressure CVD, and selectively removed by photolithography and etching to form a gate electrode 15 made of polysilicon. , 20 is formed. Next, LDD (Lightly Doped Drain) regions are formed by ion-implanting arsenic into the nFET region on the left side of the element isolation region 4 using the gate electrode 15 as a mask. Similarly, boron is ion-implanted into the pFET region on the right side of the element isolation region 4 using the gate electrode 20 as a mask to form an LDD region. Next, a silicon nitride film and a silicon oxide film are deposited by plasma CVD, and anisotropic etching is performed to form gate side walls 17 and 21 on the gate electrodes 15 and 20. Next, arsenic or phosphorus is ion-implanted into the nFET region using the gate electrode 15 and its gate sidewall 17 as a mask to form the source region 5 and the drain region 7 constituting the first conductive region near the surface of the semiconductor substrate. Similarly, boron is ion-implanted into the pFET region using the gate electrode 20 and its gate sidewall 21 as a mask to form the source region 10 and the drain region 13 constituting the second conductive region.

  Next, cobalt is deposited on the entire surface of the semiconductor substrate by sputtering, and then an instantaneous heat treatment (RTA: Rapid Thermal Annealing) is performed to form the source regions 5 and 10 and the drain regions 7 and 13, and a gate electrode made of polysilicon. Conductive layers 6, 8, 11, 12, 16 and 19 are formed by siliciding cobalt (CoSi) on 15 and 20. The cobalt on other regions, for example, the element isolation region 4 is removed. Then, a first conductive region composed of cobalt silicide layers 6 and 8 which are conductive layers and a source region 5 and a drain region 7 is formed in the nFET region. Similarly, a second conductive region including the cobalt silicide layers 11 and 12 and the source region 10 and the drain region 13 is formed in the pFET region.

  FIG. 2 schematically shows the semiconductor substrate 1 in which the first film 22 and the thin insulating film 40 are deposited on the conductive layers 6, 8, 11, 12, 16, 19 and the element isolation region 4 in the nFET region and the pFET region. It is sectional drawing. More specifically, a silicon nitride film is deposited as a first film 22 by 50 to 100 nm by plasma CVD. As another deposition method of the silicon nitride film, the silicon nitride film may be formed by a thermal CVD method, or a two-layer structure or a composite structure of the silicon nitride film and another film may be used. As the thin insulating film 40, an insulating film such as a silicon oxide film can be used.

  FIG. 3 is a schematic cross-sectional view of the semiconductor substrate 1 in which the first film 22 and the thin insulating film 40 are removed from the element isolation region and the pFET region. More specifically, the first film 22 and the thin insulating film 40 are left in the nFET region and removed from the pFET region by photolithography and etching. The first film 22 generates a tensile stress in the first channel formation region 9 of the nFET. Although an example in which tensile stress is generated in the nFET is shown in the present embodiment, a pFET is formed in this region, and a compressive stress is generated in the channel formation region of the pFET by the first film 22. Also good.

  FIG. 4 is a schematic cross-sectional view of the semiconductor substrate 1 in which the second film 23 is deposited on the semiconductor substrate of FIG. More specifically, a silicon nitride film is deposited from 50 nm to 100 nm by plasma CVD. As another deposition method of the silicon nitride film, a silicon nitride film may be formed by a thermal CVD method, or a two-layer structure of a silicon nitride film and a silicon oxide film or other composite structures may be used.

  FIG. 5 is a schematic cross-sectional view of the semiconductor substrate 1 from which the second film 23 has been selectively removed. More specifically, by photolithography and etching, the nFET region is formed by leaving the second film 23 on the pFET and on the first conductive regions 7 and 8 of the nFET and leaving a portion to be laminated with the thin insulating film 40. Remove from other parts. At this time, the silicon nitride film, which is the second film 23 in contact with the thin insulating film 40, is undercut at the end thereof, and an eaves-like or parasol-like overhang 24 is formed. A silicon nitride film formed by plasma CVD is used as the second film 23 to generate a compressive stress in the second channel formation region 9 '. The silicon nitride film deposited by the plasma CVD method generates compressive stress or tensile stress in the area under the silicon nitride film depending on the film formation conditions and surface treatment after film formation, etc. It can be selected appropriately. Similarly to the first film 22, the second film 23 may form an nFET in this region, and the second film 23 may generate a tensile stress in the channel formation region of the nFET.

  FIG. 6 is a schematic cross-sectional view of the semiconductor substrate 1 in which the first insulating film 25 is formed on the surface of the semiconductor substrate of FIG. The first insulating film 25 functions as an interlayer insulating film. More specifically, silicon dioxide is deposited as a first insulating film on the first film 22 and the second film 23 by plasma CVD to 500 nm to 1500 nm. However, the silicon dioxide material cannot enter under the overhang 24 formed at the end of the silicon nitride film which is the second film 23, and a void 26 having a hollow inside is formed.

  FIG. 7 is a schematic cross-sectional view of the semiconductor substrate 1 in which the contact opening 27 is formed in the first insulating film 25. In order to establish electrical continuity between the first conductive regions 7 and 8 constituting the nFET electrode and the second conductive regions 10 and 11 constituting the pFET electrode and the external circuit, a contact opening is formed in the first insulating film 25. 27 is formed. More specifically, anisotropic etching of the first insulating film 25, which is a silicon oxide film, is performed using photolithography and reactive ion etching (RIE) technology, so that the first conductive regions 7, 8 and The second conductive regions 10 and 11 are exposed. When the end portion of the second film 23 formed on the thin insulating film 40 intersects with the contact opening portion 27, the void 26 formed at the end portion of the second film 23 forms the contact opening portion 27. Opened as a void opening 26 ′ in the inner wall.

  FIG. 8 is a schematic cross-sectional view of the semiconductor substrate 1 in which an insulator 28 is deposited on the semiconductor substrate of FIG. Specifically, a silicon oxide film is deposited as an insulator by plasma CVD. Since the insulator 28 is also deposited on the inner wall of the contact opening 27, the void opening 26 'can be closed. The insulator 28 is not limited to a silicon oxide film, and silicon nitride and other insulating materials can be used.

  FIG. 9 is a schematic cross-sectional view of the semiconductor substrate 1 from which the insulator 28 is selectively removed by an anisotropic etching technique. The bottom insulator of the contact opening 27 is selectively removed to expose the conductive layer 8 in the first conductive region and the conductive layer 11 in the second conductive region, and at least the conductive layer on the inner wall of the contact opening 27 Sidewalls 29 are formed by leaving insulators in the vicinity of 8 and 11. It is desirable that the thickness of the sidewall 29 formed on the inner wall of the contact opening does not exceed 10% of the inner diameter of the contact opening 27. Furthermore, it is desirable that the area of the exposed portion where the conductive layer 8 or the conductive layer 11 is exposed at the bottom of the contact opening 27 does not fall below 80% of the upper area of the contact opening 27. When a plug is formed by depositing a conductive material for contact later on the contact opening 27, the external dimension of the plug is reduced, or the contact area between the conductive layer 8 or the conductive layer 11 and the plug is reduced. This is to prevent the resistance of the plug from increasing.

  As described above, by forming the sidewall 29 made of an insulating material in the contact opening 27, even when the void opening 26 ′ appears in the contact opening 27, it can be blocked.

  FIG. 10 is a schematic cross-sectional view of the semiconductor substrate 1 in which the barrier layer 30 is formed on the semiconductor substrate of FIG. As the barrier layer 30, a titanium or titanium nitride film was deposited by a CVD method. The barrier layer improves the adhesion between the conductive material deposited later and the first insulating film 25 and the sidewall 29, and prevents an unnecessary substance from entering the conductive material from the inner wall of the barrier opening. Provide.

  FIG. 11 is a schematic cross-sectional view of the semiconductor substrate 1 on which a conductive material 31 is deposited following the barrier layer 30. Tungsten is deposited as the conductive material 31 to form a plug metal. In this way, electrical contact was made with the conductive layer 8 in the first conductive region of the nFET and the conductive layer 11 in the second conductive region of the pFET. Next, the conductive material 31 and the barrier layer 30 were planarized by performing a CMP process.

  FIG. 12 is a schematic cross-sectional view of the semiconductor substrate 1 in which the wiring layer 32 is formed on the flattened surface. As the wiring layer 32, aluminum or the like was formed by sputtering or the like, and selectively formed by photolithography and etching to form the wiring layer 32.

  In the above embodiment, an nFET or a pFET is configured on a semiconductor substrate. However, an nFET or a pFET can be configured using a semiconductor layer made of amorphous silicon or polysilicon deposited on an insulating substrate. . Further, in the above description, the laminated portion of the first film and the second film is formed on the first conductive region of the nFET that is the first transistor. A laminated portion of the first film and the thin insulating film and the second film can be formed on the two conductive regions. Further, a thin insulating film may be formed on the second film by reversing the stacking order of the first film and the second film.

  In order to facilitate understanding in the description of the above embodiment, an example in which the end portion of the second film laminated on the first film and the thin insulating film intersects the contact opening will be described. did. However, the above embodiment can be applied even when the contact opening portion does not intersect with the short portion of the second film by design. In other words, even if the design does not intersect, a void opening may appear on the inner wall of the contact opening due to an alignment error during manufacturing, etc., and adjacent contacts may be electrically shorted. This is because it is only necessary to prevent this.

It is typical sectional drawing which shows the manufacturing process of the semiconductor device in this Embodiment. It is typical sectional drawing which shows the manufacturing process of the semiconductor device in this Embodiment. It is typical sectional drawing which shows the manufacturing process of the semiconductor device in this Embodiment. It is typical sectional drawing which shows the manufacturing process of the semiconductor device in this Embodiment. It is typical sectional drawing which shows the manufacturing process of the semiconductor device in this Embodiment. It is typical sectional drawing which shows the manufacturing process of the semiconductor device in this Embodiment. It is typical sectional drawing which shows the manufacturing process of the semiconductor device in this Embodiment. It is typical sectional drawing for demonstrating the semiconductor device and its manufacturing method in this Embodiment. It is typical sectional drawing for demonstrating the semiconductor device and its manufacturing method in this Embodiment. It is typical sectional drawing which shows the manufacturing process of the semiconductor device in this Embodiment. It is typical sectional drawing which shows the manufacturing process of the semiconductor device in this Embodiment. It is typical sectional drawing which shows the manufacturing process of the semiconductor device in this Embodiment. It is typical sectional drawing of the semiconductor substrate in the middle of the process known conventionally. It is typical sectional drawing of the semiconductor substrate for demonstrating the subject in a conventionally well-known technique. It is a schematic plan view of the semiconductor substrate for demonstrating the subject in a conventionally well-known technique. It is a typical perspective view of the semiconductor substrate for demonstrating the subject in a conventionally well-known technique.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor substrate 2 p-type area | region 3 n-type area | region 4 Element isolation region 5, 10 Source region 7, 13 Drain region 9 1st channel formation region 9 '2nd channel formation region 6, 8, 11, 12, 16, 19 Conductivity Layers 14, 18 Gate insulating films 15, 20 Gate electrodes 17, 21 Gate sidewall 22 First film 23 Second film 24 Overhang 25 First insulating film 26 Void 26 'Void opening 27 Contact opening 28 Insulator 29 Side wall 30 Barrier layer 31 Conductive material 32 Wiring layer 40 Thin insulating film

Claims (7)

Forming a first transistor and a second transistor on a substrate;
Forming a first film on the first transistor for generating stress in the first transistor;
Forming a thin insulating film on the first film;
Selectively forming a second film for generating stress on the second transistor on the second transistor and on the thin insulating film;
Forming a first insulating film on the thin insulating film and the second film;
Selectively removing the first insulating film and the second film to form a contact opening;
Depositing an insulator on the inner wall of the contact opening. The step of forming the first transistor and the second transistor on the substrate includes forming a first conductive region and a first channel forming region in the first surface region of the semiconductor substrate, and a second different from the first surface region. Forming a second conductive region and a second channel forming region in the surface region;
The semiconductor device according to claim 1, wherein the first film generates a tensile stress in the first channel formation region, and the second film generates a compressive stress in the second channel formation region. Method.     The step of depositing an insulator on the inner wall of the contact opening includes the step of depositing a second insulating film on the substrate on which the contact opening is formed, and the contact opening by selectively removing the second insulating film. And a step of forming a sidewall on the inner wall of the portion. The method of manufacturing a semiconductor device according to claim 1, wherein: A first transistor and a second transistor formed on a substrate;
A first film formed on the first transistor and generating stress on the first transistor;
A thin insulating film formed on the first film;
A second film formed on the second transistor and extending on a part of the surface of the thin insulating film to generate stress in the second transistor;
A first insulating film formed on the thin insulating film and the second film;
A contact opening formed by selectively removing the first insulating film and the second film;
A semiconductor device including an insulator formed on an inner wall of the contact opening and in the vicinity of the first film or the second film. The first transistor is an nFET formed in a first surface region of a semiconductor substrate and has a first channel forming region, and the second transistor is formed in a second surface region different from the first surface region. A pFET having a second channel forming region,
The semiconductor device according to claim 4, wherein the first film generates a tensile stress in the first channel formation region, and the second film generates a compressive stress in the second channel formation region.     6. The semiconductor device according to claim 4, wherein a sidewall is formed on the inner wall of the contact opening by the insulator.     The semiconductor device according to claim 4, wherein an upper cross-sectional area of the contact opening is larger than a lower cross-sectional area.

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