JP2006237482A - Substrate processing device, substrate processing method, and substrate processing program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten remarkably a tact time for processing operation of supplying processing liquid to a substrate to be processed or applying the same on the substrate to be processed through spinless system. <P>SOLUTION: A zone wherein a first substrate transfer unit 84A and a second substrate transfer unit 84B retain and transfer the substrate G together is not a total transfer zone from a carry-in position to a carry-out position but an intermediate zone from the starting position of application to the finishing position of application. The first substrate transfer unit 84A finishes the role of transfer for the substrate G at a time when the substrate G<SB>i</SB>is transferred to the finishing position of application, and immediately returns to the carry-in position to start the transfer of a succeeding new substrate G<SB>i+1</SB>. On the other hand, the second substrate transfer unit 84B transfers individually the substrate G<SB>i</SB>from the finishing position of application to the carry-out position, subsequently, returns to the starting position of application before the carry-in position, and waits for the first substrate transfer unit 84A which transfers individually the next substrate G<SB>i+1</SB>to that position. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a technique for supplying a processing liquid onto a substrate to be processed, and more particularly to a substrate processing technique for applying a processing liquid on a substrate by a spinless method.

  Recently, in a photolithography process in a flat panel display (FPD) manufacturing process, as a resist coating method that is advantageous for increasing the size of a substrate to be processed (for example, a glass substrate), a resist solution is applied to a substrate from a long resist nozzle. 2. Description of the Related Art A spinless method is widely used in which a resist solution is applied on a substrate with a desired film thickness without requiring a rotational motion by relatively moving, that is, scanning a resist nozzle while discharging it in a strip shape.

A conventional resist coating apparatus using a spinless method, for example, as described in Patent Document 1, is several hundred μm between a substrate that is fixedly mounted horizontally on a stage and a discharge port of a resist nozzle provided above the stage. The following minute gap is set, and the resist solution is ejected onto the substrate while moving the resist nozzle in the scanning direction (generally in the horizontal direction perpendicular to the longitudinal direction of the nozzle). This type of resist nozzle is configured such that a nozzle body is formed in a horizontally long or long shape, and a resist solution is discharged in a strip shape from a discharge port having a very small diameter (for example, about 100 μm). When the coating process by scanning with such a long resist nozzle is completed, the substrate is taken out of the stage by the transfer robot or the transfer arm and carried out of the apparatus. Immediately after that, a subsequent new substrate is carried into the apparatus by the transfer robot and placed on the stage. Then, the same coating process as described above is repeated on the new substrate by scanning the resist nozzle.
JP-A-10-156255

In the spinless type resist coating apparatus as described above, unless a processed substrate is unloaded or unloaded from the stage to completely empty the upper surface of the stage, a subsequent new substrate is loaded or placed on the stage. I can't. For this reason, the time required for scanning the resist nozzle (T _c ), the time required for loading or unloading an unprocessed substrate onto the stage (T _in ), and the unloading of the processed substrate from the stage There is a problem that the required time (T _c + T _in + T _out ) of one cycle of the coating process that is added to the required time (T _out ) of the unloading operation becomes the tact time as it is, and it is difficult to shorten the tact time.

  Furthermore, since the size and weight of the long resist nozzles increase as the substrate size increases, such heavy and long resist nozzles remain constant at a predetermined height (narrow gap) above the stage. There is also a problem that it is difficult to move horizontally stably at a high speed.

  The present invention has been made in view of the above-described problems of the prior art, and a substrate processing apparatus that significantly reduces the tact time of a processing operation for supplying or coating a processing liquid on a substrate to be processed by a spinless method, It is an object to provide a substrate processing method and a substrate processing program.

  Another object of the present invention is to provide a substrate processing apparatus, a substrate processing method, and a substrate processing program that can efficiently cope with an increase in the size of a substrate.

  In order to achieve the above object, the substrate processing apparatus of the present invention has a number of jet holes on the upper surface, and a stage for floating the substrate to be processed to a desired height by the pressure of the gas jetted from the jet holes, A loading section for loading the substrate into a loading position on the stage, a loading section for unloading the substrate from the loading position on the stage, and a coating position between the loading position and the unloading position. A processing liquid supply unit that supplies a processing liquid to the upper surface of the substrate from above the stage, and from the loading position to the first position that is set between the coating position and the unloading position through the coating position. The first substrate transport unit that holds and transports the substrate floating on the stage, and the unloading from the second position set between the loading position and the coating position through the coating position. On the stage to the position And a second board conveying portion for conveying and holding the board that floats.

  Further, the substrate processing method of the present invention sets the carry-in position, the coating start position, the coating end position, and the carry-out position in a line along the substrate transport direction on the stage, from a plurality of jets provided on the upper surface of the stage. The substrate to be processed is floated to a desired height by the pressure of the gas to be ejected, and the first portion of the substrate is held on the stage from the carry-in position to the application start position. In the second section from the coating start position to the coating end position, the first and second parts of the substrate are held, and in the third section from the coating end position to the unloading position, the second portion of the substrate is held. The substrate is conveyed in the substrate conveyance direction, and the processing liquid is applied to the upper surface of the substrate while the substrate moves in the second section.

  In addition, the substrate processing program of the present invention includes a step of loading a substrate to be loaded into a loading position of a stage having a number of jet holes on the upper surface, and a state where the substrate is floated to a desired height on the stage. Holding and transporting the first part of the substrate from the carry-in position to the application start position, and the application start position from the application start position in a state where the substrate is floated at a desired height on the stage. Holding and transporting the first and second parts of the substrate until the substrate is applied to the upper surface of the substrate while the substrate moves from the coating start position to the coating end position on the stage. And holding and transporting the second part of the substrate from the coating end position to the unloading position with the substrate floating at a desired height on the stage; and And a step of unloading the substrate got to carry-out position of the stage.

  In the present invention, the substrate is floated in the air by the pressure of a gas (for example, compressed air) ejected from the ejection port on the upper surface of the stage, and is transported from the loading position to the unloading position on the stage. By supplying the processing liquid from the supply unit, the processing liquid is applied to the entire upper surface or a desired part of the substrate. In order to transport the substrate on the stage, the first and second substrate transport units move in the substrate transport direction while holding the substrate. Here, the first substrate transport unit holds and transports the floating substrate from the loading position through the coating position to the first position before the unloading position. On the other hand, the second substrate transport unit holds and transports the floating substrate from the second position between the carry-in position and the coating position through the coating position to the carry-out position. The section in which the first and second substrate transport sections hold and transport the substrate together is not the entire transport section from the carry-in position to the carry-out position, but an intermediate section from the second position to the first position. . When the first substrate transport unit transports the substrate to the first position, the first substrate transport unit stops transporting the substrate, and immediately returns to the loading position to start transporting a subsequent new substrate. On the other hand, the second substrate transport unit transports the substrate independently from the first position to the carry-out position, and then returns to the second position, and the first substrate transport unit continues from the carry-in position to the second position. Wait for the substrate to be transported alone. Thus, the section in which both the first and second substrate transport sections cooperate to transport the substrate is limited to the vicinity of the coating position, and the rest of the sections are in the sections of interest (carry-in side section, carry-out side section). The conveyance or movement operation is individually performed individually, so that the substrate conveyance efficiency can be greatly improved and the tact time can be greatly improved.

  In the substrate processing apparatus of the present invention, according to a preferred aspect, the application of the processing liquid on the substrate is started at substantially the same timing as the substrate moves from the second position to the unloading position, and the substrate is in the first state. The application of the processing liquid on the substrate is completed at almost the same timing as the arrival at the position.

  According to a preferred aspect, the first and second guide rails are arranged on one side of the stage so that the first and second substrate transport sections extend in parallel with the direction in which the substrate moves, respectively. And first and second transport bodies that are movable along the first and second guide rails, and the first and second transport bodies are moved along the first and second guide rails. The first and second transport driving sections that are driven in this manner, and the first and second transport main bodies extending from the first and second transport main bodies toward the center of the stage so that the first and second side edges of the substrate can be attached and detached. It has the 1st and 2nd holding | maintenance part to hold | maintain.

  According to a preferred aspect, the first substrate transfer unit causes the first holding unit to release the holding of the first side edge of the substrate at the first position, and immediately after that, the first transfer body is moved to the first position. Return from the position 1 to the loading position. Further, the second substrate transfer unit causes the second holding unit to release the holding of the second side edge portion of the substrate immediately after the substrate arrives at the carry-out position, and then the second transfer body is moved from the carry-out position to the above-described position. Return to the second position. Preferably, the first and second holding portions include first and second pads that can be detachably attached to the first and second side edge portions of the substrate, respectively, and the base end portions are the first and first base portions, respectively. The first and second pad support portions are fixed to the two transfer main bodies and the front end portions are coupled to the first and second pads, and the first and second pad suctions to the substrate are controlled. 1 and a second pad suction control unit. Here, the first and second pad suction control units preferably supply first and second negative pressures to the first and second pads in order to couple the first and second pads to the substrate. Negative pressure supply units, and first and second positive pressure supply units for supplying positive pressure to the first and second pads in order to separate the first and second pads from the substrate.

  According to a preferred aspect, the first and second holding portions move the first and second pad support portions forward to connect the first and second pads to the substrate, respectively. First and second pad actuators are provided for moving back the first and second pad supports to separate the first and second pads from the substrate. Further, the first and second holding units couple the first and second pads to the substrate at the loading position, and separate the first pad from the substrate at the first and second positions. It is preferable that the first and second pad support portions displace the height position of the tip portion according to the height position of the substrate.

  According to a preferred aspect, the carry-in unit has a plurality of first lift pins for supporting the substrate at the pin tip at the carry-in position on the stage, and the first lift pins are located at the original position below the stage and above the stage. And a first lift pin lifting / lowering part that moves up and down between the forward and backward movement positions. In addition, the unloading unit has a plurality of second lift pins for supporting the substrate at the unloading position on the stage with the tip of the pin, and the second lift pins are located between the original position below the stage and the forward movement position above the stage. And a second lift pin lifting / lowering section that moves up and down.

  Further, according to a preferred aspect, the processing liquid supply unit has a long nozzle having a fine-diameter discharge port extending in a direction transverse to the substrate transport path on the stage, and is disposed under the nozzle at the application position. The processing liquid is discharged from the discharge port toward the substrate passing through the substrate.

  In the substrate processing method of the present invention, preferably, the first and second portions of the substrate are a pair of left and right side edges as viewed from the substrate transport direction. Further, in the first, second, and third sections, the substrate transport speed may be set independently, and the flying height of the substrate may be set independently. Further, at the application start position, the substrate may be temporarily stopped and the holding of the substrate on the second portion may be started, or the holding of the substrate on the second portion may be started without stopping the movement of the substrate. Good. In addition, at the application end position, the substrate may be temporarily stopped to end the holding of the substrate with respect to the first portion, or the holding of the substrate with respect to the first portion may be ended without stopping the movement of the substrate. . Further, a subsequent new substrate may be loaded into the loading position while the substrate is moving in the second section.

  According to the substrate processing apparatus, the substrate processing method, and the substrate processing program of the present invention, the tact time of the processing operation for supplying or applying the processing liquid onto the substrate to be processed by the spinless method is greatly increased by the configuration and operation as described above. In addition, it is possible to cope with an increase in the size of the substrate by levitation conveyance without difficulty.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows a coating and developing processing system as a configuration example to which the substrate processing apparatus of the present invention can be applied. This coating / development processing system is installed in a clean room and uses, for example, an LCD substrate as a substrate to be processed, and performs cleaning, resist coating, pre-baking, development, and post-baking in the photolithography process in the LCD manufacturing process. is there. The exposure process is performed by an external exposure apparatus (not shown) installed adjacent to this system.

  This coating and developing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, and an interface unit (I / F) 14.

  A cassette station (C / S) 10 installed at one end of the system includes a cassette stage 16 on which a predetermined number, for example, four cassettes C for storing a plurality of substrates G can be placed, and a side on the cassette stage 16. And a transport path 17 provided in parallel with the arrangement direction of the cassette C, and a transport mechanism 20 that is movable on the transport path 17 and that allows the substrate C to be taken in and out of the cassette C on the stage 16. The transport mechanism 20 has a means for holding the substrate G, for example, a transport arm, can be operated with four axes of X, Y, Z, and θ, and is transported on the process station (P / S) 12 side described later. And the substrate G can be transferred.

  The process station (P / S) 12 includes, in order from the cassette station (C / S) 10 side, a cleaning process unit 22, a coating process unit 24, and a development process unit 26, a substrate relay unit 23, a chemical solution supply unit 25, and It is provided in a horizontal row via (spaced) the space 27.

  The cleaning process unit 22 includes two scrubber cleaning units (SCR) 28, an upper and lower ultraviolet irradiation / cooling unit (UV / COL) 30, a heating unit (HP) 32, and a cooling unit (COL) 34. Contains.

  The coating process unit 24 includes a spinless resist coating unit (CT) 40, a vacuum drying unit (VD) 42, an upper and lower two-stage adhesion / cooling unit (AD / COL) 46, and an upper and lower two-stage heating / cooling. A unit (HP / COL) 48 and a heating unit (HP) 50 are included.

  The development process unit 26 includes three development units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 53, and a heating unit (HP) 55.

  Conveying paths 36, 51, 58 are provided in the longitudinal direction at the center of each process unit 22, 24, 26, and the conveying devices 38, 54, 60 move along the conveying paths 36, 51, 58, respectively. Each unit in the process unit is accessed to carry in / out or carry the substrate G. In this system, in each process part 22, 24, 26, a liquid processing system unit (SCR, CT, DEV, etc.) is disposed on one side of the transport paths 36, 51, 58, and heat treatment is performed on the other side. System units (HP, COL, etc.) are arranged.

  The interface unit (I / F) 14 installed at the other end of the system is provided with an extension (substrate transfer unit) 56 and a buffer stage 57 on the side adjacent to the process station 12, and is transported to the side adjacent to the exposure apparatus. A mechanism 59 is provided. The transport mechanism 59 is movable on the transport path 19 extending in the Y direction, and is used to load and unload the substrate G with respect to the buffer stage 57, and to extend from the extension (substrate transfer unit) 56 and the adjacent exposure device. The substrate G is transferred.

  FIG. 2 shows a processing procedure in this coating and developing processing system. First, in the cassette station (C / S) 10, the transport mechanism 20 takes out one substrate G from a predetermined cassette C on the stage 12 and transports it to the cleaning process unit 22 of the process station (P / S) 12. It is passed to the device 38 (step S1).

  In the cleaning process section 22, the substrate G is first sequentially carried into an ultraviolet irradiation / cooling unit (UV / COL) 30, subjected to dry cleaning by ultraviolet irradiation in the first ultraviolet irradiation unit (UV), and then subjected to the next cooling unit ( In COL), the temperature is cooled to a predetermined temperature (step S2). This UV cleaning mainly removes organic substances on the substrate surface.

  Next, the substrate G is subjected to a scrubbing cleaning process by one of the scrubber cleaning units (SCR) 28 to remove particulate dirt from the substrate surface (step S3). After the scrubbing cleaning, the substrate G is subjected to dehydration treatment by heating in the heating unit (HP) 32 (step S4), and then cooled to a constant substrate temperature by the cooling unit (COL) 34 (step S5). Thus, the pretreatment in the cleaning process unit 22 is completed, and the substrate G is transferred to the coating process unit 24 by the transfer device 38 via the substrate transfer unit 23.

  In the coating process unit 24, the substrate G is first sequentially carried into an adhesion / cooling unit (AD / COL) 46, and undergoes a hydrophobic treatment (HMDS) in the first adhesion unit (AD) (step S6). The cooling unit (COL) cools to a constant substrate temperature (step S7).

  Thereafter, the substrate G is coated with a resist solution by a spinless method in a resist coating unit (CT) 40, and then subjected to a drying process by reduced pressure in a reduced pressure drying unit (VD) 42 (step S8).

  Next, the substrate G is sequentially carried into the heating / cooling unit (HP / COL) 48, and the first heating unit (HP) performs baking after coating (pre-baking) (step S9), and then the cooling unit ( COL) to cool to a constant substrate temperature (step S10). In addition, the heating unit (HP) 50 can also be used for baking after this application | coating.

  After the coating process, the substrate G is transported to the interface unit (I / F) 14 by the transport device 54 of the coating process unit 24 and the transport device 60 of the development process unit 26, and is passed from there to the exposure apparatus (step). S11). In the exposure apparatus, a predetermined circuit pattern is exposed on the resist on the substrate G. After the pattern exposure, the substrate G is returned from the exposure apparatus to the interface unit (I / F) 14. The transport mechanism 59 of the interface unit (I / F) 14 passes the substrate G received from the exposure apparatus to the development process unit 26 of the process station (P / S) 12 via the extension 56 (step S11).

  In the development process unit 26, the substrate G is subjected to development processing in any one of the development units (DEV) 52 (step S12), and then sequentially carried into one of the heating / cooling units (HP / COL) 53, Post baking is performed in the first heating unit (HP) (step S13), and then the substrate is cooled to a constant substrate temperature in the cooling unit (COL) (step S14). A heating unit (HP) 55 can also be used for this post-baking.

  The substrate G that has undergone a series of processing in the development process section 26 is returned to the cassette station (C / S) 10 by the transfer devices 60, 54, and 38 in the process station (P / S) 24, where the transfer mechanism 20 Is stored in one of the cassettes C (step S1).

  In this coating and developing system, the present invention can be applied to, for example, the resist coating unit (CT) 40 of the coating process unit 24. An embodiment in which the present invention is applied to a resist coating unit (CT) 40 will be described below with reference to FIGS.

  FIG. 3 shows the overall configuration of the resist coating unit (CT) 40 and the vacuum drying unit (VD) 42 in this embodiment.

As shown in FIG. 3, a resist coating unit (CT) 40 and a vacuum drying unit (VD) 42 are arranged in a horizontal row on the support base or support frame 70 in the X direction. A new substrate G to be subjected to the coating process is carried into the resist coating unit (CT) 40 as indicated by an arrow F _A by the transfer device 54 (FIG. 1) on the transfer path 51 side. Substrate G after completion of the coating process in the resist coating unit (CT) 40 is a transfer arm 74 which is movable in the X direction while being guided by the guide rails 72 on the support table 70, a vacuum drying unit as indicated by the arrow F _B (VD) 42. Substrate G having been subjected to the drying treatment in a vacuum drying unit (VD) 42 is drawn off as shown by the arrow F _C by the transfer device 54 of the transport path 51 side (FIG. 1).

  The resist coating unit (CT) 40 includes a stage 76 that extends long in the X direction, and is a long type that is disposed above the stage 76 while the substrate G is transported in the same direction on the stage 76. A resist solution is supplied onto the substrate G from the resist nozzle 78, and a resist coating film having a constant film thickness is formed on the upper surface (surface to be processed) of the substrate by a spinless method. The configuration and operation of each part in the unit (CT) 40 will be described in detail later.

  The vacuum drying unit (VD) 42 includes a tray or shallow container type lower chamber 80 having an open upper surface, and a lid-shaped upper chamber configured to be tightly fitted or fitted to the upper surface of the lower chamber 80. (Not shown). The lower chamber 80 is substantially rectangular, and a stage 82 for placing and supporting the substrate G horizontally is disposed at the center, and exhaust ports 83 are provided at the four corners of the bottom surface. Each exhaust port 83 communicates with a vacuum pump (not shown) through an exhaust pipe (not shown). With the lower chamber 80 covered with the upper chamber, the sealed processing space in both chambers can be depressurized to a predetermined degree of vacuum by the vacuum pump.

  4 and 5 show a more detailed overall configuration in the resist coating unit (CT) 40 in one embodiment of the present invention.

  In the resist coating unit (CT) 40 of this embodiment, the stage 76 does not function as a mounting table for fixing and holding the substrate G as in the prior art, but a substrate for floating the substrate G in the air by the force of air pressure. It functions as a levee. The first and second substrate transfer units 84A and 84B of the linear motion type disposed on both sides of the stage 76 hold both side edges of the substrate G floating on the stage 76 in a detachable manner. Thus, the substrate G is transported in the stage longitudinal direction (X direction). The resist nozzle 78 is a stationary type, not a moving type or a scanning type, and is installed above the center position in the longitudinal direction or the transport direction (X direction) of the stage 76.

Specifically, the stage 76 is divided into _five regions M ₁ , M ₂ , M ₃ , M ₄ , and M ₅ in the longitudinal direction (X direction) (FIG. 5). The leftmost area M ₁ is a carry-in area, and a new substrate G to be subjected to the coating process is carried into a predetermined position in this area M ₁ . In this carry-in area M ₁ , the substrate G is received from the transfer arm of the transfer device 54 (FIG. 1) and loaded onto the stage 76 so as to move up and down between the original position below the stage and the forward movement position above the stage. A plurality of possible lift pins 86 (for example, four) are provided at predetermined intervals. These lift pins 86 are driven up and down by a carry-in lift pin lift unit 85 (FIG. 12) using, for example, an air cylinder (not shown) as a drive source.

The loading area M ₁ is also the area substrate transfer of a floating starts, blows compressed air pressure or positive pressure to float the substrate G on the stage upper surface of this region at a desired height position H _a Many jet outlets 88 are provided at a constant density. Here, the height position or the raised position H _a of the substrate G viewed from the upper surface of the stage 76 in the loading area M ₁ does not require a particularly high accuracy, for example if kept in the range of 100-150 .mu.m. Further, it is preferable that the size of the carry-in area M ₁ exceeds the size of the substrate G in the transport direction (X direction). Further, the carrying-area M _1, the alignment unit 87 (FIG. 12) for aligning the substrate G on the stage 76 is also provided.

A region M ₃ set at the center of the stage 76 is a resist solution supply region or a coating region, and the substrate G is supplied with the resist solution R from the upper resist nozzle 78 at a predetermined position when passing through this region M _3. Receive. _On the upper surface of the stage in the coating region M ₃ , there are fixed a spout 88 for ejecting high-pressure or positive-pressure compressed air and a suction port 90 for sucking air with a negative pressure in order to float the substrate G at a desired floating position H _b . Many are provided in a mixed density.

Here, the reason why the positive pressure jet port 88 and the negative pressure suction port 90 are mixed is to maintain the flying position _Hb at a set value (for example, 50 μm) with high accuracy. That is, floating position H _b in the coating area M ₃ are, defines a gap S (e.g. 100 [mu] m) between the nozzle lower end (discharge port) and the substrate upper surface (surface to be processed). The gap S is an important parameter that influences the resist coating film and the resist consumption, and needs to be kept constant with high accuracy. In this embodiment, a vertical upward force by compressed air is applied from the jet outlet 88 to the portion of the substrate G passing through the coating region M ₃ , and at the same time, a vertical downward force by the negative pressure suction force is applied from the suction port 90. By applying this force, the balance of the combined pressure in both directions is controlled to maintain the flying position _Hb at a set value (50 μm). For this floating position control, a feedback control mechanism including a height detection sensor (not shown) for detecting the height position of the substrate G may be provided. Note that the size of the coating region M ₃ in the transport direction (X direction) only needs to be large enough to stably form the narrow gap S as described above immediately below the resist nozzle 78, and is usually larger than the size of the substrate G. Can be small.

Middle area M ₂ that is set between the loading area M ₁ and the application area M ₃ are, coating area the height position of the substrate G during transport from the floating position H _a in the carrying region M ₁ (100-150 .mu.m) This is a transition region for changing or transitioning to the flying position H _b (50 μm) in M ₃ . Even in the transition region M ₂ , the jet port 88 and the suction port 90 are mixedly arranged on the upper surface of the stage 76. However, the density of the suction port 90 along the conveying direction is gradually larger, floating position of the substrate G is adapted to transition from gradual or linearly H _a in H _b during transport thereby.

In the region M ₄ adjacent to the downstream side of the coating region M ₃ , the height position of the substrate G is changed from the floating position H _b (50 μm) for coating to the floating position H _c (for example, 100 to 150 μm) for unloading. It is a transition area for. _On the upper surface of the stage of the transition region M ₄ , the jet outlet 88 and the suction port 90 are mixedly arranged in a symmetrical arrangement pattern with the transition region M ₂ on the upstream side in the transport direction.

A region M ₅ at the downstream end (right end) of the stage 76 is a carry-out region. The resist coating unit (CT) substrate G having received a coating process with 40, the transport arm 74 from a predetermined position or unloading position of the unloading area M ₅ vacuum drying unit on the downstream side next (FIG. 3) (VD) 42 ( 3). The carry-out area M ₅ is spatially contrasted with the carry-in area M ₁ described above, and is below the stage for unloading the substrate G from the stage 76 and delivering it to the transfer arm 74 (FIG. 3). along with the lift pins 92 that can move up and down between the home position and the stage upper forward position are provided a plurality of at predetermined intervals (e.g., present 4), for floating the substrate G in the floating position H _c A number of jet outlets 88 are provided at a constant density on the upper surface of the stage. The lift pin 92 is driven up and down by, for example, a lift pin lift unit 91 (FIG. 12) for carrying out using an air cylinder (not shown) as a drive source.

  The resist nozzle 78 is included in the resist solution supply section 93 (FIG. 12), and has a long nozzle body 79 that extends in the Y direction with a length that can cover the substrate G on the stage 76 from one end to the other end. It is connected to a resist solution supply pipe 94 from a resist solution supply source (not shown). The nozzle body 79 is supported by a portal or inverted U-shaped nozzle support (not shown), and has a slit-like or porous fine-diameter discharge port (in the Y-direction) at the lower end thereof. (Not shown) is formed. Although this resist nozzle 78 is a stationary type, in order to adjust the gap S with the substrate G passing underneath, a height position is set in the vertical direction by a nozzle lifting / lowering portion 95 (FIG. 12) constituted by, for example, a ball screw mechanism or the like. It is preferable that can be arbitrarily changed.

  As shown in FIGS. 4, 6, and 7, the first and second substrate transfer portions 84 </ b> A and 84 </ b> B are arranged in parallel on the left and right sides of the stage 76. The first and second sliders (conveying bodies) 98A and 98B attached to both guide rails 96A and 96B so as to be movable in the axial direction (X direction), and both sliders 98A on both guide rails 96A and 96B. , 98B can be moved simultaneously or individually, and the left and right edges of the substrate G can be attached and detached while extending from both sliders 98A, 98B toward the center of the stage 76. 1st and 2nd holding | maintenance part 102A, 102B each hold | maintained.

  Here, each of the transport driving units 100A and 100B is configured by a linear drive mechanism such as a linear motor. The holding portions 102A and 102B support the suction pads 104A and 104B that are bonded to the lower surfaces of the left and right side edges of the substrate G by vacuum suction force, and the suction pads 104A and 104B at the tip portions, and on the sliders 98A and 98B side. Plate spring type pad support portions 106A and 106B that can be elastically deformed so that the height position of the distal end portion can be changed with the base end portion as a fulcrum are provided. The suction pads 104A and 104B are arranged in a line at a constant pitch, and the pad support portions 106A and 106B support the suction pads 104A and 104B independently. As a result, the individual suction pads 104 and the pad support portions 106 can stably hold the substrate G at independent height positions (even at different height positions).

  As shown in FIGS. 6 and 7, the pad support portions 106A and 106B in this embodiment are attached to plate-like pad elevating members 108A and 108B attached to the inner side surfaces of the sliders 98A and 98B so as to be elevable. . For example, first and second pad actuators 109A and 109B (FIG. 12), which are air cylinders (not shown) mounted on the sliders 98A and 98B, lift the pad lifting members 108A and 108B to the flying height of the substrate G, for example. It is configured to move up and down between an original position (retracted position) lower than the position and a forward movement position (coupling position) corresponding to the flying height position of the substrate G.

  As shown in FIG. 8, each suction pad 104A, 104B is provided with a plurality of suction ports 112A, 112B, for example, on the upper surface of a rectangular parallelepiped pad body 110A, 110B made of synthetic rubber. These suction ports 112A and 112B are slit-like long holes, but may be round or rectangular small holes. Band-shaped vacuum tubes 114A and 114B made of, for example, synthetic rubber are connected to the suction pads 104A and 104B. Pipe lines 116A and 116B of these vacuum pipes 114A and 114B communicate with the vacuum sources of the first and second pad suction controllers 115A and 115 (FIG. 12), respectively.

  The first and second pad suction control units 115A and 115 (FIG. 12) connect the pipes 116A and 116 (FIG. 8) of the vacuum pipes 114A and 114B to the compressed air source (not shown) via a switching valve (not shown). When the vacuum suction pads 104A and 104B are separated from the side edges of the substrate G, the switching valve is switched to the compressed air source side, and positive pressure is applied to the suction pads 104A and 104B. Alternatively, high-pressure compressed air is supplied.

  As shown in FIG. 4, the holding parts 102A and 102B preferably have a separation type or completely independent type in which the vacuum suction pads 104A and 104B and the pad support parts 106A and 106B on one side are separated for each set. . However, as shown in FIG. 9, one plate spring is provided with notches 118A and 118B to form one row of pad support portions 120A and 120B, and one side of the vacuum suction pads 104A and 104B is formed thereon. A one-piece configuration in which is arranged is also possible.

As described above, a number of jet outlets 88 are provided on the upper surface of the stage 76. In this embodiment, an ejection controller that individually and automatically switches the air ejection flow rate for each ejection port 88 belonging to the carry-in area M ₁ and the carry-out area M ₅ of the stage 76 based on the relative positional relationship with the substrate G. 122 is provided in the stage 76 in the form of a flow rate switching valve.

  In FIG. 10, the structure of the ejection control part 122 by one Example is shown. The ejection control unit 122 includes a valve chamber 124 having a spherical wall surface formed inside the stage 76, and a spherical valve body 126 movably provided in the valve chamber 124. Yes. At the top and bottom of the valve chamber 124, an outlet 124a and an inlet 124b that are opposed to each other in the vertical direction are formed. The outlet 124 a communicates with the jet outlet 88 corresponding to the jet control unit 122. The inlet 124 b communicates with a compressed air supply path 128 running under the stage 76.

  FIG. 11 shows an example of a piping pattern of the compressed air supply path 128 in the stage 76. For example, compressed air from a compressed air source (not shown) such as a compressor flows through the external pipe 130 and is introduced into the compressed air introduction section 132 in the stage 76. The compressed air introduced into the compressed air introduction section 132 is distributed to a number of compressed air supply paths 128 extending from there to the stage 76.

In FIG. 10, a valve seat is formed around the outlet 124 a of the valve chamber 124. A plurality of (four) grooves 124c extending radially from the outlet 124a are formed in the valve seat at predetermined intervals (for example, 90 ° intervals) in the circumferential direction. As a result, even if the valve body 126 is in close contact with or seated on the valve seat and closes the outlet 124a, the compressed air leaks from the valve chamber 124 to the jet outlet 88 side through the groove 124c. The valve body 126 is, for example, a resin sphere having a diameter one or two times smaller than the inner diameter of the valve chamber 124, and a vertical upward force P _U corresponding to the air pressure on the inlet 124b side is applied to the lower half of the spherical surface. receiving with a vertical downward force in accordance with the air pressure in the outlet 124a side in the upper half of the sphere (reaction) subjected to P _D. Further, the gravity P _G (constant value) corresponding to the mass of the valve body 126 always acts vertically downward. The valve body 126 changes the vertical position (height position) in the valve chamber 124 according to the difference between the vertical upward force P _U and the vertical downward force (P _D + P _G ) as described above.

  In this embodiment, as shown in FIG. 10, depending on whether or not the substrate G is present above each ejection port 88, the ejection control unit 122 immediately below the ejection port 88 has a valve body in the valve chamber 124. The height position of 126 is switched to either the first position that is in close contact with the valve seat on the outlet 124a side, or the second position that is separated from the valve seat and floats in the valve chamber 124. It has become.

In other words, upward (in the strict sense approach distance of less than the set floating position H _a is) of the spout 88 when the substrate G is present, the spout 88 near or valve chamber immediately below the counteraction from the substrate G 124 As the air pressure in the vicinity of the outlet 124a increases, the vertical downward force (especially P _D ) acting on the valve body 126 increases so as to be equal to or slightly above the vertical upward force P _U, and the valve body 126 It is separated from the valve seat on the 124a side. As a result, the outlet 124a is opened, and the compressed air introduced into the valve chamber 124 from the inlet 124b passes through the outlet 124a at a large flow rate and is ejected from the outlet 88.

As described above, the numerous outlets 88 formed on the upper surface of the stage 76, the compression supply source for supplying the compressed air for generating the levitation force to them, the external pipe 130, the compressed air supply path 128, and the ejection control unit 122. Further, the substrate is formed on the stage 76 by a suction port 90 formed in the regions M ₂ , M ₃ , and M ₄ of the stage 76 in a mixed manner with the ejection port 88 and a vacuum mechanism for giving a negative pressure suction force thereto. A stage substrate floating portion 134 (FIG. 12) for efficiently floating G at a desired height is formed.

  FIG. 12 shows the configuration of the control system in the resist coating unit (CT) 40 of this embodiment. The controller 136 is composed of a microcomputer, and each part in the unit, in particular, the stage substrate floating part 134, the resist solution supply part 93, the nozzle lifting part 95, the loading lift pin lifting part 85, the unloading lift pin lifting part 91, the first and first parts. 2 Controls individual operations and overall operations (sequence) of the transport driving units 100A and 100B, the first and second pad suction control units 115A and 115B, the first and second pad actuators 109A and 109B, and the like.

  Next, the coating processing operation in the resist coating unit (CT) 40 of this embodiment will be described with reference to FIGS. FIG. 13 is a timing chart showing the position or state of each part in the unit (CT) 40 in one cycle of the coating treatment operation. 14 to 22 are schematic plan views showing positions or states of main movable parts at each time point in one cycle. FIG. 23 is a perspective view showing the state of FIG.

  The controller 136 fetches and executes a resist coating processing program stored in a storage medium such as an optical disk in the main memory, and controls a series of programmed coating processing operations.

Figure 14 corresponds to the time point t ₀ of FIG. 13 shows a state immediately after the new substrate G _i unprocessed than loading machine, that the transport device 54 (FIG. 1) is carried into the carry-area M ₁ stage 76 . At this time, the lift pins 86 of the carry-area M ₁ is supported horizontally substrate G _i just received in forward position. The first board conveying portion 84A has just returned to the conveyance start position P _a corresponding slider 98A to the carrying position in the loading area M _1. The pad suction control unit 115A starts supplying vacuum to the suction pad 104A at this time. However, the pad actuator 109A lowers the suction pad 104A to the original position (retracted position). On the other hand, the second board conveying portion 84B has just delivered the substrate G _i-1 immediately preceding the completion of the coating process on the stage 76 to the unloading area M _5. The slider 98B has reached the conveying end position P _b corresponding to the unloading position in the unloading area M _5, the pad suction portion 115B is released the vacuum suction force from the suction pad 104B. Instead, in order to unload the substrate G _i-1 , the lift pins 92 are raised from the original position below the stage to the forward movement position (substrate delivery position) above the stage.

Immediately after this, down in carrying area M ₁ to the height position for transporting the substrate G _i lift pins 86 are lowered ie floating position H _a (FIG. 5). Next, the alignment unit 87 is actuated, and a pressing member (not shown) is pressed against the floating substrate G _i from four directions as indicated by an arrow J to align the substrate G _i on the stage 76 (FIG. 15, Time t _{1 in} FIG. 13). The second board conveying portion 84B causes turning back at high speed V ₁ of the slider 98B from the conveying end position P _b to the conveyance stop position P _c corresponding to an application start position. Access is unloaded machine clogging the transfer arm 74 to the unloading area M _5, are carried out from the lift pins 92 receiving the substrate G _i-1 out of the stage 76 (FIG. 15, the point of FIG. 13 t _1). The coating start position is set between the loading position and the resist nozzle 78 just below the position that is the resist solution supply position P _s in the loading area M _1.

The alignment of the substrate G _i in carrying region M ₁ is completed, the pad activator eta 109A is operating in the first board conveying portion 84A immediately thereafter, forward position (coupling position the suction pad 104A from the original position (retracted position) ) To (UP). Suction pad 104A is then vacuum is turned on from its previous, one substrate G _i of floating state binds with and whether or vacuum suction force into contact with the side edges of the (left) (FIG. 16, the point of FIG. 13 t ₂ ). Immediately after the suction pad 104A is bonded to the left side edge of the substrate G _i, alignment unit 87 retracts the pressing member to a predetermined position. On the other hand, the second substrate transfer unit 84B starts supplying vacuum to the suction pad 104B while waiting the slider 98B at the transfer stop position _Pc . In the carry-out section M ₅ , the carry-out lift pin 92 is retracted below the stage (time t _{2 in} FIGS. 16 and 13).

Next, the first board conveying portion 84A is relatively fast constant speed slider 98A while holding the left side edge portion of the substrate G _i at the holding portion 102A from the conveyance start position P _a to the substrate transporting direction (X direction) When it moves straight at V ₂ and reaches the upstream conveyance stop position _Pc corresponding to the application start position on the stage 76, it is temporarily stopped there (time point t _{3 in} FIGS. 17 and 13). The coating start position, the front end of the resist coating area on the substrate G _i (coating start line) is located directly below the resist nozzle 78. Incidentally, in the substrate transfer from the transport start position P _a to the upstream side conveyance stop position P _c, but the right edge of the substrate G _i is a free end, the height position at floating force by the stage substrate floating unit 134 It is restrained and moves at substantially the same height as the right edge that is coupled to the holding portion 102A of the first substrate transport portion 84A.

When the slider 98A of the first substrate transport unit 84A arrives at the upstream transport stop position _Pc as described above, the pad actuator 109B is activated in the second substrate transport unit 84B that has been waiting there, and the suction pad 104B is raised (UP) from the original position (retracted position) to the forward movement position (joined position). Suction pads 104B, since the vacuum is turned on to couple with contact with the side edges or not and the vacuum suction force of the other substrate G _i (right). The height position of the substrate G _i at the coating start position on the stage 76 is different de board rear end side (H _a) the substrate front end side (H _b), but the difference (H _a -H _b) is at most It is 100 μm, and is negligible compared to the rising distance (for example, several mm) from the original position of the suction pad 104B to the forward movement position. Thus, the transport stop position P _c corresponding to the coating start position on the stage 76, the first and second board conveying portion 84A, 84B are facing each other across the substrate G _i of floating state, both side edges of the substrate G _i Are held at the same height position (time t _{4 in} FIGS. 18 and 13). Meanwhile, although not shown, down to the resist nozzle 78 nozzle vertical movement unit 95 is actuated, adjust the gap S between the outlets and the substrate G _i of the resist nozzle 78 to the set value (e.g. 50 [mu] m).

Next, the first and second substrate transport sections 84A and 84B simultaneously move the sliders 98A and 98B straight from the transport stop position _{Pc in the} substrate transport direction (X direction) at a relatively low constant speed V ₃ ( Time t _{5 in} FIG. 13). On the other hand, the resist solution supply unit 93 starts to discharge the resist solution R from the resist nozzle 78. Thus, towards the resist solution supply position P _s immediately below the resist nozzle 78 on the upper surface of the substrate G _i to pass at a constant speed V ₂ in the X direction, the strip of the resist solution R from long resist nozzle 78 extending in the Y-direction by ejected at a constant flow rate, it will be coated film RM of toward the rear end resist solution formed from the front end of the substrate G _i (Figure 19, point t ₆ in Figure 13).

When the rear end portion of the substrate G _i (coating end line) arrives at the resist solution supply position P _s immediately below the resist nozzle 78, the timing in the coating process is completed, the resist solution in the resist solution supply unit 93 from the resist nozzle 78 at the same time to end the discharge of the R, first and second board conveying portion 84A, 84B each of the slider 98A, a position before the transport the 98B end position P _b (downstream transport stop position) stopped at the same time P _d Let On the other hand, the loading area M _1, the subsequent new substrate G _i is carried by a conveying device 54 in the coating operation, is delivered to the lift pins 86 (FIG. 20, the time t ₇ in Figure 13).

In the first board conveying portion 84A, as soon as the slider 98A arrives at the feeding-stop position P _d, the pad suction control unit 115A is stopped the supply of vacuum for the suction pad 104A, and at the same time pad activator eta 109A is suction pad 104A the forward movement down position from the (binding position) to the original position (retracted position), to separate the suction pad 104A from the left edge of the substrate G _i (Figure 20, point t ₈ in FIG. 13). At this time, the pad suction control unit 115A supplies a positive pressure (compressed air) to the suction pad 104A, accelerate separation from the substrate G _i. Then, the slider 98A is moved at a high velocity V ₅ in the direction opposite to the direction of substrate conveyance, thereby turning back to the conveyance start position P _a (FIG. 21, the time t ₉ in FIG. 13).

On the other hand, in the second board conveying portion 84B, a relatively fast constant speed slider 98B while holding the right end from the downstream side substrate stop position P _d to the transfer end position P _b of the substrate G _i at the holding portion 102B The substrate is moved in the substrate transport direction (X direction) by V ₄ (time point t _{9 in} FIGS. 21 and 13). In this case, the left edge of the substrate G _i has become free ends, are also constrain the height position at floating force by the stage substrate floating unit 134, moves at approximately the same height as the right edge. Then, as soon as the slider 98B arrives at the conveying end position P _b, stopping the supply of vacuum for the pad suction control unit 115B is suction pad 104B, and at the same time the forward movement position of the pad activator eta 109B suction pads 104B (bonding position) down from the original position (retracted position), to separate the suction pad 104B from the right edge of the substrate G _i. At this time, the pad suction control unit 115B supplies a positive pressure (compressed air) to the suction pad 104B, accelerate separation from the substrate G _i. Alternatively, the lift pins 92 is raised from the original position of the stage below to unloading the substrate G _i of the stage top to forward position (FIGS. 22 and 23, the time t ₁₀ in FIG. 13).

As described above, in this embodiment, the carry-in area M ₁ , the coating area M ₃ , and the carry-out area M ₅ are separately provided on the stage 76, and the substrate is sequentially transferred to each of these areas to carry out the substrate carry-in operation, resist The liquid supply operation and the substrate carry-out operation are performed independently or in parallel in each region. By such a pipeline system, a time (T _IN ) required for the operation of loading one substrate G onto the stage 76 and a time required for transferring from the loading area M ₁ to the unloading area M ₅ on the stage 76. The tact time is significantly shorter than the time required for one cycle of coating treatment (T _C + T _IN + T _OUT ), which is the sum of (T _C ) and the time (T _OUT ) required to carry out from the carry-out area M ₅ can do. Moreover, the substrate G is floated in the air using the pressure of the gas ejected from the ejection port 88 provided on the upper surface of the stage 76, and the stationary long resist nozzle 78 is conveyed while the floating substrate G is conveyed on the stage 76. Further, since the resist solution is supplied and applied onto the substrate G, it is possible to efficiently cope with an increase in the size of the substrate without difficulty.

Then, in order to transfer the substrate G _i on the stage 76, the substrate transfer while the first and second board conveying portion 84A, 84B holds the side edge portions of the substrate G _i which are arranged on both sides of the stage 76 Move in the direction. Here, the first board conveying portion 84A is set between the feed location in the carrying region M ₁ and carry-out position in the unloading area M ₅ and coating position through a coating position directly below the long resist nozzle The substrate G _i floating on the stage 76 is held and transported to the coating end position. On the other hand, the second substrate transport unit 84B holds and transports the substrate floating on the stage from the coating start position set between the carry-in position and the coating position, through the coating position to the carry-out position.

First and second board conveying portion 84A, 84B is the section which holds and conveys a substrate G _i together, rather than the entire transport section from the loading position to the unloading position, the intermediate from the coating start position to the coating end position It is a section. When the first substrate transport unit 84A transports the substrate G _i to the coating end position, the first substrate transport unit 84A finishes the role of transport to the substrate G _i and immediately returns to the loading position to transport the subsequent new substrate G _{i + 1.} It takes. On the other hand, the second board conveying portion 84B is the substrate G _i from the coating end position to the unloading position and the transport alone, then turned back from the load position to the application start position of the front, the first board conveying portion 84A to its position It waits for the next substrate G _{i + 1} to be carried alone.

  As described above, the simultaneous substrate transfer operation between the first and second substrate transfer units 84A and 84B is limited to a necessary minimum (section during application where a strict substrate height is required), and the others. In the respective sections (carrying-side section, unloading-side section), the transportation or moving operation is individually performed individually, and the substrate transportation efficiency is greatly improved and the tact time is greatly improved. The guide rails 96A and 96B laid on both sides of the stage 76 do not need to be laid from end to end of the stage 76, and the first substrate transport unit 84A lays the guide rail 96A from the loading position to the coating end position. The second substrate transport unit 84B only needs to lay the guide rail 96B from the coating start position to the unloading position, and the cost of the transport system such as the guide rails 96A and 96B and the transport driving units 100A and 100B can be reduced. I can plan. However, the guide rail 96B on the second substrate transport section 84B side is extended to the coating start position, and both the substrate transport sections 84A and 84B start transporting the substrates together from the coating start position for the first substrate in the lot. Good.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the technical idea.

  For example, the holding portions 102A and 102B of the substrate transport portions 84A and 84B in the above-described embodiment have the vacuum suction pads 104A and 104B, but the side edges of the substrate G are mechanically (for example, tightly attached). E) a holding pad or the like is also possible. Various systems are also available for the mechanism (pad support portions 104A, 104B, pad lifting portions 106A, 106B, pad actuators 109A, 109B, etc.) for detachably coupling the pads 104A, 104B to the side edges of the substrate G. The configuration can be adopted. In the above-described embodiment, the resist nozzle 78 is a stationary type, but it may be horizontally movable as necessary.

In the embodiment described above, the substrate conveyance by the first substrate conveyance unit 84A is temporarily stopped at the position (P _c ) corresponding to the exact application start position, and the substrate conveyance by the first and second substrate conveyance units 84A and 84B is performed. It is temporarily stopped at a position (P _d ) corresponding to the exact application end position. As a modification, the second substrate transport unit 84B is coupled to the moving substrate G at the position (P _c ) corresponding to the application start position without performing such a temporary stop, and corresponds to the application end position. At the position (P _d ), the first substrate transfer unit 84A may be separated from the moving substrate G. As another modification, the substrate transfer is temporarily stopped at the first substrate transfer unit 84A or the substrate transfer is entered at the second substrate transfer unit 84B at a position shifted from the position (P _c ) corresponding to the application start position. The first and second substrate transport units 84A and 84B are temporarily stopped from transporting the substrate and the first substrate transport unit 84A is transported from the substrate at a position shifted from the position corresponding to the application end position (P _d ). It is also possible to perform the lowering.

  The above-described embodiment relates to a resist coating apparatus in a coating / development processing system for LCD manufacturing. However, the present invention is applicable to any processing apparatus or application that supplies a processing liquid onto a substrate to be processed. Therefore, as the processing liquid in the present invention, in addition to the resist liquid, for example, a coating liquid such as an interlayer insulating material, a dielectric material, and a wiring material can be used, and a developing liquid or a rinsing liquid can also be used. The substrate to be processed in the present invention is not limited to an LCD substrate, and other flat panel display substrates, semiconductor wafers, CD substrates, glass substrates, photomasks, printed substrates, and the like are also possible.

It is a top view which shows the structure of the application | coating development processing system which can apply this invention. It is a flowchart which shows the procedure of the process in the application | coating development processing system of embodiment. It is a schematic plan view showing the entire configuration of a resist coating unit and a vacuum drying unit in the coating and developing treatment system of the embodiment. It is a perspective view which shows the whole structure of the resist coating unit in embodiment. It is a schematic front view which shows the whole structure of the resist coating unit in embodiment. It is a partial cross section schematic side view which shows the structure of the board | substrate conveyance part in the resist coating unit of embodiment. It is an expanded sectional view showing composition of a holding part of a substrate conveyance part in a resist application unit of an embodiment. It is a perspective view which shows the structure of the pad part of the board | substrate conveyance part in the resist coating unit of embodiment. It is a perspective view which shows one modification of the holding | maintenance part of the board | substrate conveyance part in the resist coating unit of embodiment. It is sectional drawing which shows the structure of the ejection control part in the resist application unit of embodiment. It is a fragmentary sectional view showing composition of a channel inside a stage in a resist application unit of an embodiment. It is a block diagram which shows the structure of the control system in the resist coating unit of embodiment. It is a timing chart for demonstrating the application | coating process operation | movement in the resist application | coating unit of embodiment. It is a schematic plan view showing one stage of the coating treatment operation in the resist coating unit of the embodiment. It is a schematic plan view showing one stage of the coating treatment operation in the resist coating unit of the embodiment. It is a schematic plan view showing one stage of the coating treatment operation in the resist coating unit of the embodiment. It is a schematic plan view showing one stage of the coating treatment operation in the resist coating unit of the embodiment. It is a schematic plan view showing one stage of the coating treatment operation in the resist coating unit of the embodiment. It is a schematic plan view showing one stage of the coating treatment operation in the resist coating unit of the embodiment. It is a schematic plan view showing one stage of the coating treatment operation in the resist coating unit of the embodiment. It is a schematic plan view showing one stage of the coating treatment operation in the resist coating unit of the embodiment. It is a schematic plan view showing one stage of the coating treatment operation in the resist coating unit of the embodiment. It is a perspective view which shows one step of the coating processing operation in the resist coating unit of the embodiment.

Explanation of symbols

40 resist coating unit (CT)
54 Conveying Device 74 Conveying Arm 76 Stage 78 Resist Nozzle 84A, 84B First and Second Substrate Conveying Unit 85 Loading Lift Pin Lifting Unit 86 Loading Lift Pin 87 Alignment Unit 88 Jetting Port 90 Suction Port 91 Unloading Lift Pin Lifting Unit 92 Unloading Lift pins 96A, 96B First and second guide rails 98A, 98B First and second sliders 100A, 100B First and second transport drive units 102A, 102B First and second holding units 104A, 104B First 1st and 2nd suction pad 106A, 106B 1st and 2nd pad support part 108A, 108B 1st and 2nd pad raising / lowering member 109A, 109B 1st and 2nd pad actuator 115A, 115B 1st and 2nd 2 pad adsorption control unit Tage board floating part 136 Controller M ₁ carry-in area M ₃ application area M ₅ carry-out area

Claims (32)

A stage that has a number of jet holes on the upper surface and floats the substrate to be processed to a desired height by the pressure of the gas jetted from the jet holes;
A loading section for loading the substrate into a loading position on the stage;
An unloading unit for unloading the substrate from the unloading position on the stage;
A processing liquid supply unit for supplying a processing liquid to the upper surface of the substrate from above the stage at a coating position between the carry-in position and the carry-out position;
A first substrate transport unit that holds and transports the substrate floating on the stage from the carry-in position to the first position set between the application position and the carry-out position through the application position. When,
A second substrate transport unit that holds and transports the substrate floating on the stage from a second position set between the carry-in position and the application position to the carry-out position through the application position. And a substrate processing apparatus.   The substrate processing apparatus according to claim 1, wherein the application of the processing liquid on the substrate is completed at substantially the same timing as when the substrate arrives at the first position. The first substrate transport unit is
A first guide rail disposed on one side of the stage so as to extend in parallel with a direction in which the substrate moves;
A first transfer body movable along the first guide rail;
A first transport driving unit that drives the first transport body to move along the first guide rail;
The first holding part that extends from the first transfer body toward the center of the stage and holds the first side edge of the substrate in a detachable manner. The substrate processing apparatus as described.   The first substrate transfer unit causes the first holding unit to release the holding on the first side edge of the substrate at the first position, and immediately after that, the first transfer body is moved to the first position. The substrate processing apparatus according to claim 3, wherein the substrate processing apparatus is turned back from a position to the carry-in position. The first holding part is
A first pad removably attachable to the first side edge of the substrate;
A first pad support portion having a proximal end portion fixed to the first transport body and a distal end portion coupled to the first pad;
The substrate processing apparatus according to claim 3, further comprising: a first pad suction control unit that controls suction of the first pad to the substrate.   The substrate according to claim 5, wherein the first pad suction control unit includes a first negative pressure supply unit that supplies a negative pressure to the first pad in order to couple the first pad to the substrate. Processing equipment.   The substrate according to claim 6, wherein the first pad suction control unit includes a first positive pressure supply unit that supplies a positive pressure to the first pad in order to separate the first pad from the substrate. Processing equipment.   The first holding unit moves the first pad support unit to couple the first pad to the substrate and separates the first pad from the substrate. The substrate processing apparatus according to claim 5, further comprising a first pad actuator that moves the pad support portion backward.   The said 1st holding | maintenance part couple | bonds the said 1st pad with the said board | substrate in the said carrying-in position, and isolate | separates the said 1st pad from the said board | substrate in the said 1st position. The substrate processing apparatus according to item.   The substrate processing apparatus according to claim 4, wherein the first pad support portion displaces a height position of a tip portion thereof according to a height position of the substrate.   The substrate processing apparatus according to claim 1, wherein the application of the processing liquid on the substrate is started at substantially the same timing as the substrate moves from the second position to the carry-out position side. The second substrate transport section is
A second guide rail disposed on the other side of the stage so as to extend in parallel with the moving direction of the substrate;
A second transport body movable along the second guide rail;
A second transport driving unit that drives the second transport body to move along the second guide rail;
A second holding part that extends from the second transfer body toward the center of the stage and holds the second side edge of the substrate in a detachable manner. The substrate processing apparatus according to one item.   The second substrate transfer unit causes the second holding unit to release the holding of the second side edge of the substrate immediately after the substrate has arrived at the carry-out position, and then the second transfer body is moved to the second holding unit. The substrate processing apparatus according to claim 12, wherein the substrate processing apparatus is returned from the unloading position to the second position. The second holding part is
A second pad removably connectable to a second side edge of the substrate;
A base end portion fixed to the second transport body, and a tip end portion coupled to the second pad; a second pad support portion;
The substrate processing apparatus according to claim 12, further comprising: a second pad suction control unit that controls suction of the second pad to the substrate.   The said 2nd pad adsorption | suction control part has a 2nd negative pressure supply part which supplies a negative pressure to the said 2nd pad in order to couple | bond the said 2nd pad with the said board | substrate. 2. The substrate processing apparatus according to 1.   The said 2nd pad adsorption | suction control part has a 2nd positive pressure supply part which supplies a positive pressure to the said 2nd pad in order to isolate | separate the said 2nd pad from the said board | substrate. 2. The substrate processing apparatus according to 1.   The second pad suction control unit moves the second pad support unit forward to couple the second pad to the substrate and separates the second pad from the substrate. The substrate processing apparatus according to claim 13, further comprising a second pad actuator that moves the two pad support portions backward.   The said 2nd pad adsorption | suction control part couple | bonds the said 2nd pad with the said board | substrate in the said 2nd position, and isolate | separates the said 2nd pad from the said board | substrate in the said carrying-out position. The substrate processing apparatus according to claim 1.   The substrate processing apparatus according to claim 13, wherein the second pad support portion displaces a height position of a tip portion thereof according to a height position of the substrate. The carrying-in part is
A plurality of first lift pins for supporting the substrate by a pin tip at a loading position on the stage;
20. The substrate according to claim 1, further comprising: a first lift pin elevating unit that moves the first lift pin up and down between an original position below the stage and a forward movement position above the stage. Processing equipment. The unloading part is
A plurality of second lift pins for supporting the substrate by a pin tip at an unloading position on the stage;
21. The substrate according to any one of claims 1 to 20, further comprising: a second lift pin lifting / lowering unit that moves the second lift pin up and down between an original position below the stage and a forward movement position above the stage. Processing equipment.   The treatment liquid supply unit has a long nozzle having a fine-diameter discharge port extending in a direction crossing the substrate conveyance path on the stage, and the substrate passes through the nozzle at the application position. The substrate processing apparatus according to claim 1, wherein the processing liquid is discharged from the discharge port. Set the loading position, coating start position, coating end position and unloading position in a line along the substrate transport direction on the stage,
The substrate to be processed is floated to a desired height by the pressure of gas ejected from a large number of ejection ports provided on the upper surface of the stage,
On the stage, the first portion of the substrate is held in a first section from the carry-in position to the application start position, and the substrate is used in a second section from the application start position to the application end position. And holding the second part of the substrate in the third section from the coating end position to the unloading position, and transporting the substrate in the substrate transport direction. ,
A substrate processing method for applying a processing liquid to an upper surface of the substrate while the substrate moves in the second section.   The substrate processing method according to claim 23, wherein the first and second portions of the substrate are a pair of left and right side edges as viewed from the substrate transport direction.   25. The substrate processing method according to claim 23 or 24, wherein a transfer speed of the substrate in the first, second, and third sections is set independently.   26. The substrate processing method according to any one of claims 23, 24, and 25, wherein a flying height of the substrate in the first, second, and third sections is set independently.   27. The substrate processing method according to any one of claims 23 to 26, wherein the substrate is temporarily stopped at the application start position to start holding the second portion of the substrate.   The substrate processing method according to any one of claims 23 to 27, wherein the holding of the substrate with respect to the second part is started without stopping the movement of the substrate at the application start position.   29. The substrate processing method according to any one of claims 23 to 28, wherein the substrate is temporarily stopped at the application end position to end the holding of the substrate with respect to the first portion.   The substrate processing method according to any one of claims 23 to 28, wherein the holding of the first portion of the substrate is terminated without stopping the movement of the substrate at the coating end position.   The substrate processing method according to any one of claims 23 to 30, wherein a subsequent new substrate is loaded into the loading position while the substrate is moving in the second section. Loading a substrate to be processed into a loading position of a stage having a large number of jet holes on the upper surface;
On the stage, with the substrate floating at a desired height, holding and transporting the first part of the substrate from the loading position to the application start position;
Holding and transporting the first and second parts of the substrate from the application start position to the application end position, with the substrate floating at a desired height on the stage;
Applying a treatment liquid on the upper surface of the substrate while the substrate moves from the application start position to the application end position on the stage; and
Holding and transporting the second part of the substrate from the coating end position to the unloading position with the substrate floating at a desired height on the stage;
A substrate processing program for executing the step of unloading the substrate that has arrived at the unloading position of the stage.

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