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JP2006221196A - Led display device and signal light - Google Patents

Led display device and signal light Download PDF

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Publication number
JP2006221196A
JP2006221196A JP2006128875A JP2006128875A JP2006221196A JP 2006221196 A JP2006221196 A JP 2006221196A JP 2006128875 A JP2006128875 A JP 2006128875A JP 2006128875 A JP2006128875 A JP 2006128875A JP 2006221196 A JP2006221196 A JP 2006221196A
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light emitting
emitting diodes
light
blue
led display
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Takeshi Shinohara
剛 篠原
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting diode (LED) display device of high perceptivity which is good for mass production with low power consumption, by utilizing human visual sense. <P>SOLUTION: A signal light has the LED display device including at least a plurality of blue-green LEDs and a plurality of red LEDs. Packing density of the plurality of blue-green LEDs and/or the plurality of red LEDs are at least higher in a center part of the LED display device than that in an outer circumference part, and pitch width between adjoining the blue-green LEDs near the center of the plurality of blue-green LEDs is wider than the pitch width between adjoining the red LEDs near the center of the plurality of red LEDs. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本願発明は発光ダイオードを用いたＬＥＤ表示器及びそれを用いた信号灯に係わり、特に視認性を向上させたＬＥＤ表示器に関する。   The present invention relates to an LED display using a light emitting diode and a signal lamp using the same, and more particularly to an LED display with improved visibility.

近年、青緑色、黄色、赤色などを高輝度に発光可能な発光ダイオードが開発された。この発光ダイオードを用いて交通信号灯、鉄道信号灯や海上信号灯など種々のＬＥＤ表示器である信号灯に利用され始めている。特に、発光ダイオードは信頼性が高い。個々が点光源として機能する。また、発光ダイオードは半導体発光素子そのものから青緑色、黄色や赤色をそれぞれ発光する。このため従来の信号灯のごとき、光源全体として大きなリフレクターやカラーフィルターを持つ必要がない。電球を用いた信号灯に西日が照射された場合、信号灯に設けられた大きなリフレクターによって太陽光が反射し、反射光がカラーフィルターを透過する。これにより実際に点灯していないにもかかわらず、点灯しているように見える疑似点灯が生ずる。   In recent years, light emitting diodes capable of emitting blue-green, yellow, red and the like with high brightness have been developed. Using this light emitting diode, it has begun to be used for signal lamps which are various LED displays such as traffic signal lights, railway signal lights and maritime signal lights. In particular, the light emitting diode is highly reliable. Individuals function as point light sources. The light emitting diode emits blue green, yellow, and red light from the semiconductor light emitting element itself. For this reason, it is not necessary to have a large reflector or a color filter as a whole light source like a conventional signal light. When a signal light using a light bulb is irradiated with western light, sunlight is reflected by a large reflector provided in the signal light, and the reflected light passes through the color filter. As a result, a pseudo-lighting that appears to be lit even though the light is not actually lit is generated.

しかし、発光ダイオードを用いた信号灯は、リフレクター及びカラーフィルターを用いることなく構成でき、疑似点灯を生じることも実質的にない。そのため、百数十から四百数十個の発光ダイオードを基板上などに配置させ、それぞれが点光源の集合として所望の形状に配置させた交通信号機等の信号灯が設置されつつある。   However, a signal lamp using a light emitting diode can be configured without using a reflector and a color filter, and does not substantially cause pseudo lighting. For this reason, signal lights such as traffic lights are being installed in which hundreds to four hundreds of light emitting diodes are arranged on a substrate or the like, and each is arranged in a desired shape as a set of point light sources.

このような発光ダイオードを用いた信号灯の模式的断面図を図４に示す。図４には、所望の導電性パターンが形成された硝子エポキシ基板４０２上に２７５個の砲弾型発光ダイオード４０１を半田によって取り付けてある。発光ダイオード４０１は発光観測面側から見て同心円上に配置させ発光ダイオードを点灯させると、発光面が略円形状に見える。個々の発光ダイオード４０１は、リードフレーム上にＬＥＤチップが配置され電気的に接続されると共にレンズ形状をしたモールド樹脂で被覆されている。このような発光ダイオード４０１を複数配置された回路基板４０２と駆動基板４０５は、樹脂製の筐体４０３などにビス４０６等で固定配置される。また、筐体４０３の前方にはカラーフィルターを用いることなく硝子などからなるレンズ４０４が形成されている。さらに、この筐体４０３をアルミ製の灯箱４０７に密閉配置させることで交通信号機灯を構成することができる。駆動回路に電流を流すことによって、低消費電力、長寿命且つ疑似点灯がない交通信号灯を構成させることができる。   FIG. 4 shows a schematic sectional view of a signal lamp using such a light emitting diode. In FIG. 4, 275 bullet-type light emitting diodes 401 are attached by soldering on a glass epoxy substrate 402 on which a desired conductive pattern is formed. When the light emitting diode 401 is arranged on a concentric circle when viewed from the light emission observation surface side and the light emitting diode is turned on, the light emitting surface looks substantially circular. Each light-emitting diode 401 is covered with a lens-shaped molding resin while an LED chip is disposed on a lead frame and electrically connected thereto. The circuit board 402 and the drive board 405 on which a plurality of such light emitting diodes 401 are arranged are fixedly arranged with a screw 406 or the like on a resin casing 403 or the like. In addition, a lens 404 made of glass or the like is formed in front of the housing 403 without using a color filter. Furthermore, a traffic signal light can be configured by sealingly arranging the housing 403 in an aluminum light box 407. By passing a current through the drive circuit, a traffic signal lamp with low power consumption, long life and no simulated lighting can be configured.

しかしながら、量産性やコストを低減させるために発光ダイオードの数を減らすことが考えられる。同様に、発光ダイオードの出力の向上に伴って発光ダイオードの数を減らすことが考えられる。他方、それぞれが点光源としての機能を持った発光ダイオードの数を減らすと、各独立した発光ダイオードの発光が目立ち、視認性が低下する傾向にある。このように信号灯などのＬＥＤ表示器においては発光ダイオードの数低減と視認性の向上とはトレードオフの関係にある。特に、モールドレンズを持った発光ダイオードは、個々の発光ダイオード自体の光が収束されるために顕著に現れる傾向にある。また、信号灯は前方の視野を確保し且つ、移動しながらも把握する必要性がある。この場合、発光ダイオードの点灯／非点灯だけでなく、点灯している形状をも把握することは視認性の向上に大きく寄与する。本発明は上記課題を解決し量産性が高く低消費電力且つ、視認性の高いＬＥＤ表示器や信号灯を提供することを目的とするものである。   However, it is conceivable to reduce the number of light emitting diodes in order to reduce mass productivity and cost. Similarly, it is conceivable to reduce the number of light emitting diodes as the output of the light emitting diodes increases. On the other hand, when the number of light emitting diodes each having a function as a point light source is reduced, the light emission of each independent light emitting diode is conspicuous, and the visibility tends to be lowered. Thus, in an LED display such as a signal lamp, there is a trade-off between reducing the number of light emitting diodes and improving visibility. In particular, a light emitting diode having a molded lens tends to appear prominently because the light of each light emitting diode itself is converged. In addition, the signal lamp needs to secure a visual field in front and grasp it while moving. In this case, not only lighting / non-lighting of the light emitting diode but also grasping the lighting shape greatly contributes to the improvement of visibility. SUMMARY OF THE INVENTION An object of the present invention is to provide an LED display or a signal lamp that solves the above-described problems, has high mass productivity, low power consumption, and high visibility.

ＬＥＤ表示器は、発光観測面側から見て、所望の形状が表示できるよう複数の発光ダイオード（１０１）を配置させたＬＥＤ表示器であって、所望形状の中心部及び／又は形状変化部において隣り合う発光ダイオードのピッチ幅Ａと、所望形状の外周部及び／又は形状変化部以外における隣り合う発光ダイオードのピッチ幅ＢとがＡ＜Ｂの関係である。これによって、低消費電力及び量産性を向上させつつ、視認性の優れたＬＥＤ表示器とすることができる。   The LED indicator is an LED indicator in which a plurality of light emitting diodes (101) are arranged so that a desired shape can be displayed when viewed from the light emission observation surface side, and in the center portion and / or the shape changing portion of the desired shape. The pitch width A of the adjacent light emitting diodes and the pitch width B of the adjacent light emitting diodes other than the outer peripheral portion and / or the shape changing portion of the desired shape have a relationship of A <B. Thereby, it is possible to obtain an LED display with excellent visibility while improving low power consumption and mass productivity.

信号灯は、発光観測面側から見て、略同心円形状に複数の発光ダイオードを配置すると共に、前記複数の発光ダイオードの実装密度は少なくとも略同心円形状の中心部がその外側にある外周部よりも高い信号灯である。これによって、低消費電力及び量産性を向上させつつ、視認性の優れた信号灯とすることができる。特に、中心の実装密度が高いことにより大きさが決められた信号灯においても、移動時の視認性を著しく向上させることができる。   The signal lamp has a plurality of light emitting diodes arranged in a substantially concentric shape when viewed from the light emission observation surface side, and the mounting density of the plurality of light emitting diodes is at least higher than the outer peripheral portion where the center portion of the substantially concentric shape is outside thereof. It is a signal light. Thereby, it can be set as the signal lamp excellent in visibility, improving low power consumption and mass-productivity. In particular, even in a signal lamp whose size is determined by the high mounting density at the center, visibility during movement can be significantly improved.

信号灯は、発光観測面側から見て、矢印形状に複数の発光ダイオードを実装すると共に、前記複数の発光ダイオードの実装密度は矢印先端部がその周辺部よりも高い信号灯である。これによって、低消費電力及び量産性を向上させつつ、視認性の優れた信号灯とすることができる。特に、大きさが決められた信号灯においても、移動時の視認性を著しく向上させることができる。   The signal lamp is a signal lamp in which a plurality of light emitting diodes are mounted in an arrow shape as viewed from the light emission observation surface side, and the mounting density of the plurality of light emitting diodes is higher at the tip of the arrow than at the peripheral portion thereof. Thereby, it can be set as the signal lamp excellent in visibility, improving low power consumption and mass-productivity. In particular, even when the signal light has a predetermined size, the visibility during movement can be remarkably improved.

本発明は、発光ダイオードを用いたＬＥＤ表示器において問題となる視認性を、人間の視覚を利用して向上させることができると共に、消費電力の低下、ＬＥＤ数の削減など種々の利点を挙げることができる。   The present invention can improve visibility, which is a problem in an LED display using light emitting diodes, by using human vision, and also provides various advantages such as reduction in power consumption and reduction in the number of LEDs. Can do.

本発明者は種々実験の結果、ＬＥＤ表示器や信号灯における視認性及び量産性を発光ダイオードの特定の配置とすることにより、著しく改善できることを見出し、本発明を成すに至った。   As a result of various experiments, the inventor has found that the visibility and mass productivity of LED indicators and signal lamps can be remarkably improved by adopting a specific arrangement of light emitting diodes, and the present invention has been achieved.

即ち、視認者は信号等の表示を観測する場合において、識別する形状を見ようとする。そのため、略円形に発光する信号灯においてはその中心付近を、矢印信号灯や歩行者用信号灯などの場合においては、形状の変化部分を見ようとする傾向がある。特に、人間の目は視軸を離れるにしたがって、小さなものを認識しにくい傾向にある。   That is, the viewer tries to see the shape to be identified when observing the display of a signal or the like. For this reason, in the case of a signal light that emits a substantially circular light, there is a tendency to look around the center of the signal light, and in the case of an arrow signal light, a pedestrian signal light, or the like. In particular, human eyes tend to become difficult to recognize small objects as they move away from the visual axis.

そのため、信号灯の発光ダイオードを略同心円上に均一配置させると中心部付近は発光ダイオード間の隙間が目立つと共に、暗く感じる。また、信号灯全体の見かけ上の大きさが小さく観測されると考えられる。また、等間隔に発光ダイオードを配置させた矢印信号灯等では小さく見えると共に視認性が低くなる傾向にある。さらに、同じ形状、同じ大きさであっても、その色彩が変わるだけで大きく見えたり、小さく見えたりすると考えられる。   Therefore, when the light emitting diodes of the signal lamp are arranged uniformly on a substantially concentric circle, the gap between the light emitting diodes is noticeable and dark in the vicinity of the center. In addition, it seems that the apparent size of the entire signal lamp is observed small. Further, an arrow signal lamp or the like in which light emitting diodes are arranged at equal intervals looks small and the visibility tends to be low. Furthermore, even if they have the same shape and the same size, they may appear larger or smaller just by changing their colors.

そのため、本願発明は人間の視覚感覚を有効に利用して、量産性及び視認性を向上させたものである。より具体的には信号灯機の発光色に応じ、発光ダイオードのピッチ幅を変える。青緑色、黄色、赤色をそれぞれ使用する交通信号機灯の場合、青緑色は赤色よりも発光ダイオード間のピッチ幅を大きくとる。黄色は同時に使用される他の色の発光ダイオードの出力及び青緑色及び赤色との色の関係により、発光ダイオードの配置をそれぞれの間の間隔に配置させることが好ましい。   Therefore, the present invention improves mass productivity and visibility by effectively using human visual sense. More specifically, the pitch width of the light emitting diodes is changed in accordance with the emission color of the signal lamp. In the case of a traffic light that uses blue green, yellow, and red, blue green has a larger pitch width between the light emitting diodes than red. It is preferable to arrange the light emitting diodes at intervals between each other, depending on the output of the light emitting diodes of other colors used at the same time and the relationship between the colors of blue green and red.

また、内側の円の明度が上がるにつれて見かけ上の大きさも増大し、逆に外側の明度が上がるにつれて見掛け上の大きさが減少する。そのため、発光ダイオードの数を減らしつつ、見かけ上の大きさを大きくさせるためには、内側の円の明度を上げる及び／又は、内側の実装密度（ピッチ幅）を上げる（狭くする）ことが好ましい。以下、本発明の具体的実施例について説明するがこれのみに限定されないのは言うまでもない。   Further, the apparent size increases as the brightness of the inner circle increases, and conversely, the apparent size decreases as the brightness of the outer circle increases. Therefore, in order to increase the apparent size while reducing the number of light emitting diodes, it is preferable to increase the brightness of the inner circle and / or increase (narrow) the inner mounting density (pitch width). . Hereinafter, specific examples of the present invention will be described, but it is needless to say that the present invention is not limited thereto.

（実施例１）
発光ダイオードを用いたＬＥＤ表示器として交通信号灯を制作する。図３にＬＥＤ表示器に利用される発光ダイオードの模式的断面図を示す。発光ダイオードは青緑色及び黄色を発光させるために窒化ガリウム系化合物半導体（ＩｎxＧａyＡｌ1-x-yＮ、０≦ｘ≦１、０≦ｙ≦１、０≦ｘ＋ｙ≦１）を用いたＬＥＤチップ３０１をリードフレーム３０３の先端にエポキシ樹脂からなるダイボンド樹脂でダイボンドしてある。一対のリードフレーム３０３、３０４と、ＬＥＤチップ３０１の各電極とを金線３０２などによって電気的に接続させてある。発光素子であるＬＥＤチップ３０１や金線３０２等を保護するために、透光性樹脂３０５としてエポキシ樹脂で被覆してある。透光性樹脂３０５はＬＥＤチップ３０１からの光を集光するために、凸レンズ形状など好適な形状に形成させてある。なお、赤色が発光可能な発光ダイオードはＡｌＩｎＧａＰからなるＬＥＤチップを用いて同様に利用することができる。 Example 1
A traffic light is produced as an LED display using light emitting diodes. FIG. 3 shows a schematic cross-sectional view of a light emitting diode used in an LED display. The light emitting diode is an LED using a gallium nitride compound semiconductor (In x Ga y Al 1-xy N, 0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1) to emit blue-green and yellow light. The chip 301 is die-bonded to the end of the lead frame 303 with a die-bond resin made of epoxy resin. A pair of lead frames 303 and 304 and each electrode of the LED chip 301 are electrically connected by a gold wire 302 or the like. In order to protect the LED chip 301, the gold wire 302, and the like which are light emitting elements, the transparent resin 305 is covered with an epoxy resin. The translucent resin 305 is formed in a suitable shape such as a convex lens shape in order to collect the light from the LED chip 301. A light emitting diode capable of emitting red light can be similarly used by using an LED chip made of AlInGaP.

この発光ダイオードを各色毎に直並列に接続させる。図４に示された信号灯と同様に発光ダイオード４０１は所望の導電性パターンが形成された硝子エポキシ基板４０２上に配置させる。各発光ダイオードは発光観測面側から見て、略同心円上に配置させてある。この時、本発明の信号灯は図１の如く発光観測面側から見て中心付近の青緑色発光ダイオードの実装密度（ピッチ幅Ａ）を、その外側の青緑色発光ダイオードの実装密度（ピッチ幅Ｂ）より高く（狭く）配置させてある。   The light emitting diodes are connected in series and parallel for each color. Similar to the signal lamp shown in FIG. 4, the light emitting diode 401 is disposed on a glass epoxy substrate 402 on which a desired conductive pattern is formed. Each light emitting diode is arranged on a substantially concentric circle as seen from the light emission observation surface side. At this time, the signal lamp of the present invention has a mounting density (pitch width A) of blue-green light emitting diodes near the center when viewed from the light emission observation surface side as shown in FIG. ) Higher (narrower).

硝子エポキシ基板４０２上の導電性パターンと発光ダイオード４０１のリードフレームとを半田で固定すると共に電気的導通を取ってある。次に、車両用交通信号機の灯箱４０７の大きさに合わせてクリアレンズ４０４及びパッケージの裏面であるバックケース４０３を構成させる。パッケージ内には、発光ダイオード４０１を配置させた基板４０２と駆動基板４０５とを電気的に接続させ配置してある。こうして形成されたＬＥＤ表示器とパッキンを通して電力コードを電気的に接続させた後、ＬＥＤ表示ユニットのバックケースとＬＥＤ表示器とをネジ４０６によって固定させた。また、パッケージとクリアレンズとをゴムパッキンによって固定させる。   The conductive pattern on the glass epoxy substrate 402 and the lead frame of the light emitting diode 401 are fixed by soldering and are electrically connected. Next, the clear lens 404 and the back case 403 which is the back surface of the package are configured in accordance with the size of the light box 407 of the traffic signal vehicle. In the package, the substrate 402 on which the light emitting diode 401 is disposed and the drive substrate 405 are electrically connected to each other. After the power cord was electrically connected through the LED display thus formed and the packing, the back case of the LED display unit and the LED display were fixed with screws 406. Further, the package and the clear lens are fixed by rubber packing.

次に、青緑色発光ダイオードに用いたものと同じ大きさの基板を用い、黄色発光ダイオードを実装させる。黄色発光ダイオードは発光観測面側から見て略同心円上の中心付近における実装密度（ピッチ幅）を、その外側の黄色発光ダイオードの実装密度（ピッチ幅）より高く（狭く）配置させてある。また、青緑色発光ダイオードに用いたものと同じ大きさの基板を用い、赤色発光ダイオードを実装させる。赤色発光ダイオードは発光観測面側から見て略同心円上の中心付近における実装密度（ピッチ幅）を、その外側の赤色発光ダイオードの実装密度（ピッチ幅）より高く（狭く）配置させてある。また、青緑色発光ダイオードの実装密度（ピッチ幅）は赤色発光ダイオードの実装密度（ピッチ幅）よりも低く（広く）取ってある。黄色発光ダイオードの実装密度（ピッチ幅）は青緑色発光ダイオードと赤色発光ダイオードの略中間で形成させてある。それ以外は青緑色発光ダイオードと同様に各色のＬＥＤ表示器を構成し、それぞれ形成されたＬＥＤ表示ユニット自体をネジによってそれぞれ同じ灯箱に固定させ交通信号機等を構成できる。   Next, a yellow light-emitting diode is mounted using a substrate having the same size as that used for the blue-green light-emitting diode. The yellow light emitting diodes are arranged such that the mounting density (pitch width) near the center of the substantially concentric circle as viewed from the light emission observation surface side is higher (narrower) than the mounting density (pitch width) of the outer yellow light emitting diodes. Also, a red light emitting diode is mounted using a substrate having the same size as that used for the blue green light emitting diode. The red light emitting diodes are arranged such that the mounting density (pitch width) near the center of the substantially concentric circle as viewed from the light emission observation surface side is higher (narrower) than the mounting density (pitch width) of the red light emitting diodes outside the red light emitting diodes. Further, the mounting density (pitch width) of the blue-green light emitting diodes is lower (wider) than the mounting density (pitch width) of the red light emitting diodes. The mounting density (pitch width) of the yellow light emitting diodes is formed approximately halfway between the blue green light emitting diode and the red light emitting diode. Other than that, the LED display of each color is comprised like a blue-green light emitting diode, and each formed LED display unit itself can be fixed to the same light box with a screw, respectively, and a traffic signal etc. can be comprised.

これにより、視認性を確保しつつＬＥＤ数の削減を行い低消費電力のユニットを作製することができる。なお、本願発明の発光ダイオードを砲弾型発光ダイオードとして利用したが、レンズを持たないＳＭＤ型の発光ダイオードを利用できることは言うまでもない。
（実施例２）
次に、矢印信号に用いられる本発明のＬＥＤ表示器について説明する。本発明の矢印信号は、発光ダイオード１０１を同心円上に形成させたものから図２に示す如く、発光観測面側から見て矢印形にそれぞれ配置させた以外は実施例１で用いたＬＥＤ表示ユニットと同様に形成させてある。本発明の矢印信号は特に、人間が注意して視認させるポイントにおいて発光ダイオードの実装密度（ピッチ幅）を高く（狭く）するために、矢印形状に配置させた複数の発光ダイオードの実装密度（ピッチ幅）が矢印先端部でその周辺部よりも高く（狭く）配置させてある。 Thereby, the number of LEDs can be reduced while ensuring visibility, and a low power consumption unit can be manufactured. Although the light emitting diode of the present invention is used as a bullet type light emitting diode, it goes without saying that an SMD type light emitting diode having no lens can be used.
(Example 2)
Next, the LED display of the present invention used for the arrow signal will be described. The arrow signal of the present invention is the LED display unit used in Example 1 except that the light emitting diodes 101 are concentrically formed and arranged in an arrow shape when viewed from the light emission observation surface side as shown in FIG. It is formed in the same way. In particular, the arrow signal of the present invention has a mounting density (pitch) of a plurality of light emitting diodes arranged in the shape of an arrow in order to increase (narrow) the mounting density (pitch width) of the light emitting diodes at a point that is visually recognized by humans. (Width) is arranged higher (narrower) than the peripheral portion at the tip of the arrow.

具体的には、図２に示すように各発光ダイオード２０１の実装密度（ピッチ幅）として発光ダイオード間のピッチ幅をＡ、Ｂ、Ｃ、Ｄで規定してある。ピッチ幅はそれぞれＡ＜Ｂ、Ａ＜Ｃ、Ａ＜Ｄ、Ｃ＜Ｄの関係を満たす。具体的には、ピッチ幅Ａを１５．５５ｃｍ、同Ｂを１６．４５ｃｍ、同Ｃを１７．６５ｃｍ、同Ｄを１８．６ｃｍとしてある。なお、ピッチ幅Ａとピッチ幅Ｂとの間のピッチ幅は表示面の中心部であるＡから表示面の外周部であるＢに向かうにつれ徐々に広くしてある。また、ピッチ幅Ｃとピッチ幅Ｄとの間のピッチ幅は形状変化部であるＣからそれ以外のＤに向かうにつれ徐々に広くしてある。この関係は例えば、定数ａ、ｂ、ｃ…ｘで表され、ＡとＢとの間は、順番に、Ａ、Ａ＋ａ、Ａ＋ａ＋ｂ、Ａ＋ａ＋ｂ＋ｃ…Ｂの順に実装密度（ピッチ幅）を高く（広く）させてある。さらに、表示面のより中心部に近いピッチ幅Ａは外周部であるピッチ幅Ｃ及びＤに比べて狭く形成させてある。これにより、矢印信号の外形を大きく見せることができる。また、視認性を向上させると共にＬＥＤ数の削減を行い低消費電力のユニットを作製することができる。   Specifically, as shown in FIG. 2, the pitch width between the light emitting diodes is defined as A, B, C, and D as the mounting density (pitch width) of each light emitting diode 201. The pitch widths satisfy the relationships A <B, A <C, A <D, and C <D, respectively. Specifically, the pitch width A is 15.55 cm, the B is 16.45 cm, the C is 17.65 cm, and the D is 18.6 cm. Note that the pitch width between the pitch width A and the pitch width B is gradually increased from A which is the central portion of the display surface toward B which is the outer peripheral portion of the display surface. Further, the pitch width between the pitch width C and the pitch width D is gradually increased from C as the shape changing portion toward the other D. This relationship is expressed by, for example, constants a, b, c... X, and between A and B, the mounting density (pitch width) is increased (wider) in order of A, A + a, A + a + b, A + a + b + c. I'm allowed. Further, the pitch width A closer to the center of the display surface is formed narrower than the pitch widths C and D which are the outer peripheral portions. Thereby, the outline of the arrow signal can be shown larger. In addition, the unit with low power consumption can be manufactured by improving the visibility and reducing the number of LEDs.

本発明の発光装置は、発光ダイオードを用いたＬＥＤ表示器や信号灯等に利用することができる。   The light emitting device of the present invention can be used for an LED display or a signal lamp using a light emitting diode.

本発明のＬＥＤ表示器に用いられる発光ダイオードの配置を示す模式的平面図である。It is a typical top view which shows arrangement | positioning of the light emitting diode used for the LED display of this invention. 本発明の他のＬＥＤ表示器に用いられる発光ダイオードの配置を示す模式的平面図である。It is a typical top view which shows arrangement | positioning of the light emitting diode used for the other LED display of this invention. 発光ダイオードの模式的断面図である。It is typical sectional drawing of a light emitting diode. 交通信号機灯の模式的断面図である。It is a typical sectional view of a traffic signal light.

符号の説明Explanation of symbols

１０１、２０１、４０１…発光ダイオード
３０１…ＬＥＤチップ
３０２…導電性ワイヤー
３０３、３０４…リードフレーム
３０５…透光性樹脂
４０２…硝子エポキシ基板
４０３…筐体
４０４…レンズ
４０５…駆動基板
４０６…ビス
４０７…灯箱
101, 201, 401 ... light emitting diode 301 ... LED chip 302 ... conductive wire 303, 304 ... lead frame 305 ... translucent resin 402 ... glass epoxy substrate 403 ... housing 404 ... lens 405 ... drive substrate 406 ... screw 407 ... Light box

Claims (1)

複数の青緑色発光ダイオードと複数の赤色発光ダイオードとを少なくとも有するＬＥＤ表示器を持つ信号灯において、前記複数の青緑色発光ダイオード及び／または前記複数の赤色発光ダイオードの実装密度は少なくとも前記ＬＥＤ表示器の中心部がその外側にある外周部よりも高く、前記複数の青緑色発光ダイオードの中心付近における隣り合う青緑色発光ダイオード同士間のピッチ幅は前記複数の赤色発光ダイオードの中心付近における隣り合う赤色発光ダイオード同士間のピッチ幅よりも広いことを特徴とする信号灯。
In a signal lamp having an LED display having at least a plurality of blue-green light-emitting diodes and a plurality of red light-emitting diodes, the mounting density of the plurality of blue-green light-emitting diodes and / or the plurality of red light-emitting diodes is at least that of the LED display. The central portion is higher than the outer peripheral portion on the outside thereof, and the pitch width between adjacent blue-green light emitting diodes in the vicinity of the centers of the plurality of blue-green light emitting diodes is adjacent red light emission in the vicinity of the centers of the plurality of red light-emitting diodes. A signal lamp characterized by being wider than the pitch width between diodes.
JP2006128875A 2006-05-08 2006-05-08 Led display device and signal light Pending JP2006221196A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019105672A (en) * 2017-12-08 2019-06-27 株式会社ブイ・テクノロジー Light irradiation apparatus, light irradiation method, exposure apparatus, and exposure method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019105672A (en) * 2017-12-08 2019-06-27 株式会社ブイ・テクノロジー Light irradiation apparatus, light irradiation method, exposure apparatus, and exposure method

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