JP2006202650A - Electro-optical device and image printing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optic device, and an image printing device using the same, capable of securing sealing performance and adhesion strength while restraining increase of its area. <P>SOLUTION: The electro-optic device 10 is provided with a substrate 12, a light-emitting element 14 formed on it, and a sealing body 16 partially covering a face of the substrate where the light-emitting 14 is formed. The sealing body 16, jointed to the substrate 12, seals the light-emitting element 14 in cooperation with the substrate 12. The sealing body 16 has a bent wall part 22 formed bent from an edge, and the substrate 12 has a groove 37 formed to accept the bent part 22 of the sealing body 16. The substrate 12 and the bent wall part 22 of the sealing body 16 are bonded by an adhesive 38 fitted inside the groove 37. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to an electro-optical device including a light-emitting element and a sealing body that protects the light-emitting element, and an image printing apparatus including the electro-optical device.

In recent years, organic light-emitting diodes (Organic Lig), called organic electroluminescence (organic EL) elements and light-emitting polymer elements, are the next-generation light-emitting devices that can replace liquid crystal elements.
ht Emitting Diode (hereinafter abbreviated as “OLED” where appropriate) is drawing attention. OL
The ED element is used in a display device as disclosed in Patent Document 1 and Patent Document 2, for example.

In addition, an electrophotographic image printing apparatus has been developed that uses a line head in which a large number of OLED elements are arranged as exposure means, that is, a latent image writer.

Since the OLED element is deteriorated with age due to the influence of moisture or oxygen in an environment exposed to the outside air, it is generally performed to suppress the deterioration by isolating it from the outside air, particularly moisture and oxygen, with a sealing body. Yes. The types of sealing used in the field of OLED include film sealing for bonding the entire surface of the sealing body to the substrate on which the element is provided, and bonding the periphery of the sealing body to the substrate with an adhesive. There is cap sealing that provides a space defined by a sealing body and a substrate around an OLED element.
Usually, in cap sealing, a desiccant is arranged in this space.

In the techniques described in Patent Document 1 and Patent Document 2, cap sealing is used. For example, in the technique described in FIGS. 2 and 8 of Patent Document 1 and Patent Document 2, the bottom surface of the bent wall portion formed on the peripheral edge portion of the sealing body is bonded to the surface of the substrate. Moreover, in the technique described in FIG. 3 to FIG. 6 of Patent Document 1, a peripheral portion of a flat plate-shaped sealing body without a bent wall portion is bonded to the surface of the substrate.

JP 2000-173766 A JP 2001-185349 A

There is a high demand for miniaturization of an electro-optical device including a light emitting element such as an OLED element. For example, in an electrophotographic image printing apparatus that uses this type of electro-optical device as a line head for writing a latent image, the latent image is written on the image carrier in a limited space between the charger and the developer. There is a need. For this reason, when the line head is large, the line head must be arranged at a position away from the image carrier or the size of the image carrier must be increased, and the entire image printing apparatus is also increased in size. By downsizing the electro-optical device, there is a possibility of contributing to downsizing of the entire image printing apparatus.

However, in the conventional electro-optical device, the peripheral area of the sealing body or the bottom surface of the bent wall part formed on the peripheral edge is bonded to the surface of the substrate, so that the bonding area is increased to ensure sealing performance. Then, the area of the electro-optical device increases. That is, when the bonding area is secured, a circuit for driving the light emitting element as well as the light emitting element cannot be provided on the bonding surface. This is because pressure is applied to the adhesive layer in order to enhance the sealing performance, and if a circuit is provided, the three-dimensional intersection of the wiring constituting the circuit is compressed to cause a short circuit. Therefore, the amount of the adhesion area,
This leads to an increase in the area of the substrate provided with the light emitting element.

Further, in the conventional structure in which the peripheral portion of the sealing body or the bottom surface of the bent wall portion formed on the peripheral portion is bonded to the surface of the substrate, a force is applied to peel the sealing body from the substrate. Is
Although resistance due to the tensile strength and peel strength of the adhesive is generated, the durability is weak.

Accordingly, the present invention provides an electro-optical device capable of ensuring sealing performance and adhesive strength while suppressing an increase in the area of the electro-optical device, and an image printing apparatus using the same.

The electro-optical device according to the present invention partially covers a substrate, a light emitting element formed on the substrate, and a surface of the substrate on which the light emitting element is formed, and is bonded to the substrate and cooperates with the substrate. And a sealing body that seals the light emitting element, and the sealing body has a bent wall portion that is bent from at least a part thereof, and the substrate includes the sealing body. A groove for receiving the bent wall portion is formed, and the bent wall portion of the substrate and the sealing body is bonded by an adhesive disposed in the groove.

According to the configuration of the present invention, since the bent wall portion of the sealing body is received in the groove formed in the substrate, it is possible to secure the bonding area between the substrate and the sealing body by the depth of the groove. is there. That is, since the adhesion area can be secured without increasing the bottom surface of the bent wall portion, the sealing performance can be secured while suppressing the increase in the area of the electro-optical device. Further, not only the bottom surface of the groove and the bottom surface of the bent wall portion but also the side surface of the groove and the side surface of the bent wall portion are bonded. In the configuration of the present invention, when a force for peeling the sealing body from the substrate is applied, the tensile strength and peeling strength of the adhesive between the bottom surface of the groove and the bottom surface of the bent wall portion, and the side surface of the groove and the bending Resistance occurs due to the shear strength of the adhesive between the sides of the wall. Therefore, in the present invention, it is easy to ensure the adhesive strength as compared with the prior art in which the strength is obtained only by the resistance due to the tensile strength and peel strength of the adhesive.

Here, the “light-emitting element” is an element that converts applied electric energy into optical energy, and is typically an organic EL element. However, if it is necessary to seal, an inorganic EL element is used.
An element may be sufficient.
The fitting structure of the groove and the bent wall portion according to the present invention may be provided at a large number of locations or around the entire sealing body, but the above effect can be achieved by providing at least a part of the sealing body. . That is, it is sufficient that a bent wall portion is formed at least partially on the sealing body.

Furthermore, in the above configuration, a wiring for driving the light emitting element passes between the inner surface of the groove and the bent wall portion of the sealing body from a region surrounded by the sealing body and the substrate, It is preferable that it extends outside the sealing body. According to this, the wiring for driving the light emitting element can be easily arranged.

With this configuration, the sealing body is formed with a pair of second bent wall portions that are bent in the same direction as the bent wall portion from the two locations and are longer than the bent wall portion, and the substrate is The second bent wall portion of the substrate and the sealing body is sandwiched between second bent wall portions and is disposed between the end surface of the substrate and the second bent wall portion. May be adhered. According to this, the adhesive is provided between the end surface of the substrate and the side surface of the second bent wall portion, and it is possible to ensure the bonding area between the substrate and the sealing body. That is, since the adhesion area can be secured without increasing the bottom surface of the bent wall portion, the sealing performance can be secured while suppressing the increase in the area of the electro-optical device.

In the embodiment in which the second bent wall portion is provided, a spacer plate is stacked on the substrate on the side opposite to the light emitting element, and the spacer plate is sandwiched between the second bent wall portions. The spacer plate and the second bent wall portion of the sealing body may be bonded by an adhesive disposed between the end face of the spacer plate and the second bent wall portion. When the thickness of the substrate provided with the light emitting element is not large, the spacer plate is bonded to the second bent wall portion, thereby increasing the bonding area and ensuring the sealing performance. .

As another form, an electro-optical device according to the present invention partially covers a substrate, a light emitting element formed on the substrate, and a surface of the substrate on which the light emitting element is formed, and is bonded to the substrate. ,
A sealing body that seals the light-emitting element in cooperation with the substrate, and the sealing body is formed with bent wall portions that bend in the same direction from the two locations; The substrate and the bent wall portion of the sealing body may be bonded by an adhesive sandwiched between the bent wall portions and disposed between an end surface of the substrate and the bent wall portion.
According to this configuration, the adhesive is provided between the end surface of the substrate and the side surface of the bent wall portion, and it is possible to ensure the bonding area between the substrate and the sealing body. That is, since it is possible to ensure the adhesion area without increasing the bottom surface of the bent wall portion, while suppressing an increase in the area of the electro-optical device,
It is possible to ensure sealing performance. Moreover, in this structure, when the force which peels a sealing body from a board | substrate is given, the resistance resulting from the shear strength of the adhesive agent between the end surface of a board | substrate and the side surface of a bending wall part arises. In general, since the shear strength of the adhesive is high, it is easier to secure the adhesive strength in the present invention than in the prior art in which the strength is obtained only by the resistance due to the tensile strength and peel strength of the adhesive.

In this embodiment, a spacer plate is superimposed on the substrate on the side opposite to the light emitting element,
The spacer plate is sandwiched between the bent wall portions, and the spacer plate and the bent wall portion of the sealing body are bonded by an adhesive disposed between the end surface of the spacer plate and the bent wall portion. It is preferable that In the case where the thickness of the substrate provided with the light emitting element is not large, the spacer plate is bonded to the bent wall portion, thereby increasing the bonding area and ensuring the sealing performance.

In the image printing apparatus according to the present invention, an image carrier, a charger for charging the image carrier, and a plurality of the light emitting elements are arranged, and a plurality of the light emitting elements are provided on a charged surface of the image carrier. Any one of the electro-optical devices that forms a latent image by irradiating light, a developing unit that forms a visible image on the image carrier by attaching toner to the latent image, and the image carrier from the image carrier A transfer unit that transfers the visible image to another object. As described above, since the electro-optical device according to the present invention can be reduced in size, the electro-optical device can be arranged at a position close to the image carrier or the size of the image carrier can be reduced. The printing apparatus can also be reduced in size.

Hereinafter, various embodiments according to the present invention will be described with reference to the accompanying drawings. In the drawings, the ratio of dimensions of each part is appropriately changed from the actual one.

<First Embodiment>
FIG. 1 is a schematic plan view showing the electro-optical device according to the first embodiment of the invention.
Is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB in FIG. However, in FIG. 1, illustration of various wirings to be described later is omitted.

The electro-optical device 10 illustrated in the figure is used as a line-type optical head for writing an electrostatic latent image on an image carrier (for example, a photosensitive drum) in an image printing apparatus using an electrophotographic system. The electro-optical device 10 includes a substrate 12 on which a plurality of light emitting elements 14 are arranged on the same plane.
Is provided.

In this embodiment, the light emitting element 14 is an organic EL element, and each light emitting element 14 emits light according to an applied voltage. As shown in FIG. 1, the light emitting elements 14 are arranged in two rows and a staggered pattern. The arrangement pattern of the light emitting elements 14 is not limited to the illustrated form, and may be a single row or three or more rows, or may be arranged in another appropriate pattern. The longitudinal direction of the substrate 12 (
The horizontal direction in FIG. 1 is the main scanning direction of the optical head, and the vertical direction in FIG. 1 is the sub-operation direction.

The substrate 12 provided with the light emitting element 14 is made of glass or transparent plastic, and has a long rectangular shape. In the form shown in the figure, the light emitted from each light emitting element 14 is emitted to the substrate 18 side downward in FIGS. That is, the electro-optical device 10 is a bottom emission type OLED light emitting panel.

As shown in FIGS. 2 and 3, a light emitter assembly 30 is formed on the surface of the substrate 12. As shown in FIG. 2, the light emitter assembly 30 includes a light emitter / drive body layer 34, a low-potential power line 32 disposed on the light emitter / drive body layer 34, and a light emitter / drive body layer 34. And a high-potential power supply line 36 disposed below.

Although detailed illustration of the internal geometric configuration of the light emitter / driving body layer 34 is omitted, the light emitter / driving body layer 34 includes a plurality of pixel circuits each including the light emitting element 14, as described later. A driving circuit for controlling power feeding to the pixel circuit is provided. Each pixel circuit includes a light emitting element 1
4 and a TFT (thin film transistor) element for driving the same.

FIG. 4 is a block diagram showing a drive system of the light emitter assembly 30. As shown in FIG. 4, the above-described light emitter / driver layer 34 includes a plurality of, for example, 128 data lines L0 to L127.
And a drive circuit 280. In addition to the data signals D0 to D127, various control signals CTL, a first power supply potential VIC, and a ground potential GND are supplied to the light emitter / driver layer 34. Data signals D0 to D127 are applied to data lines L0 to L127 from a data control circuit (not shown). The first power supply potential VIC is applied from the high potential power supply line 27A to the drive circuit 280 to the drive circuit 280, and the ground potential GND is applied to the low potential power supply line 27 to the drive circuit 280.
B is applied to the drive circuit 280. The control signal CTL is given from the other control circuit to the drive circuit 280 via the signal line 29.

Each of the pixel blocks B1 to B40 shown in FIG. 4 is a set of a plurality of, for example, 128 pixel circuits P that are driven in one unit time. The driving circuit 280 is supplied with a clock signal as the control signal CTL, and the driving circuit 280 selects the selection signal SEL1 according to the clock signal.
... SEL40 is sequentially output. The selection signals SEL1 to SEL40 are input to the pixel blocks B1 to B40, respectively, and are supplied to 128 pixel circuits P in the corresponding pixel block. Each of the selection signals SEL1 to SEL40 becomes active for a period (selection period) of 1/40 of the main scanning period for latent image writing.

The first to forty pixel blocks B1 to B40 are exclusively and sequentially selected by the selection signals SEL1 to SEL40. In this way, the main scanning period is divided into a plurality of selection periods (writing periods),
Since the pixel blocks B1 to B40 are time-division driven, it is not necessary to provide dedicated data lines for each of the 5120 (128 × 40) pixel circuits P, and the number of data lines can be reduced. That is, 5120 pixel circuits P can be controlled by 128 data lines L0 to L127. Each of the first to fourth pixel blocks B1 to B40 includes data lines L0 to L127.
128 pixel circuits P respectively corresponding to. These pixel circuits P are supplied with the second power supply potential VEL and the ground potential GND. The second power supply potential VEL is a plurality of light emitting elements 14.
The ground potential GND is applied from the common low potential power line 32 to the plurality of light emitting elements 14. In each selection period, the data lines L0 to L1
27, data signals D0 to D127 supplied through the pixel circuit P are taken in. In addition,
The data signals D0 to D127 in this example are binary signals for instructing to turn on / off the light emitting elements.

FIG. 5 is a circuit diagram of each pixel circuit P. Each pixel circuit P includes a holding transistor 281, a driving transistor 282, and the OLED element 14. One of the selection signals SEL1 to SEL40 is supplied from the drive circuit 280 to the gate of the holding transistor 281 and the source thereof is connected to one of the data lines L0 to L127, whereby the data signals D0 to D12 are connected.
Any one of 7 is supplied to the source. The drain of the holding transistor 281 and the gate of the driving transistor 282 are connected by a connection line. A stray capacitance is attached to the connection line, and this capacitance acts as a holding capacitance. In the storage capacitor, a binary voltage is written in the selection period, and the written voltage is held until the next selection period. Therefore, the data signals D0 to D127 are selected in the period when the holding transistors are selected by the selection signals SEL1 to SEL40.
The light emitting element 14 emits light only during a period in which is a signal instructing lighting of the light emitting element 14.

The second power supply potential VEL is supplied from the high potential power supply line 36 to the drain of the driving transistor 282. The source of the driving transistor 282 is connected to the anode of the light emitting element 14. The drive transistor 282 supplies a drive current corresponding to the voltage (binary value) written in the storage capacitor to the light emitting element 14. The cathode of the light emitting element 14 is connected to the ground potential GN from the low potential power supply line 32.
D is supplied. The light emitting element 14 emits an amount of light corresponding to the magnitude of the drive current.

The low potential power supply line 32 shown in FIG. 2 is connected to a common cathode for the plurality of light emitting elements 14 and is formed from the same material as the cathode in the same process. Light emitting element 1 in light emitter assembly 30
In order to emit light emitted from 4 downward, the cathode of the light emitting element 14 and thus the low-potential power supply line 32 are formed of a conductive material that reflects light, such as aluminum.

Further, the high potential power supply line 36 shown in FIG. 2 is also common to the plurality of light emitting elements 14. That is, the anode of each of the plurality of light emitting elements 14 is connected to the source of the driving transistor 282 corresponding to the light emitting element 14, and the drain of these driving transistors 282 is connected to the high potential power supply line 36. The high potential power line 36 is formed from the same material as the anode of the light emitting element 14 in the same process. In order to emit light emitted from the light emitting element 14 in the light emitter assembly 30 downward, the high potential power supply line 36 is formed of, for example, transparent ITO (Indium Tin Oxide).

In order to isolate the light emitting element 14 from the outside air, a cap sealing body 16 for sealing the light emitting element 14 in cooperation with the substrate 12 is joined to the substrate 12. The sealing body 16 partially covers the surface of the substrate 12 on which the light emitting / driving body layer 34 provided with the light emitting element 14 is formed, and the sealing body 16 and the substrate are disposed around the light emitting body / driving body layer 34. 12 is provided. A desiccant (not shown) is disposed in this space, but it is not essential to provide a desiccant.

The sealing body 16 generally has a long rectangular shape, and bent wall portions 20 and 22 that are bent from the peripheral portion are formed at the peripheral portion. The bent wall portion 20 is formed on the two short sides of the sealing body 16, and the bent wall portion 22 is formed on the two long sides of the sealing body 16. 2 and 3, the bent wall portions 20, 22 extend in the same direction, but the bent wall portion 22 extends longer than the bent wall portion 20, and the width thereof is the bent wall portion. It is smaller than 20 width Le3.

As shown in FIG. 2, a groove 37 that receives the bent wall portion 22 of the sealing body 16 is formed in the substrate 12. The groove 37 has a depth Le1 and a width Le2. A low potential power line 32 for driving the light emitting element 14 is formed on the inner wall surface of one groove 37. Accordingly, the low potential power line 32 passes between the inner wall surface of the groove 37 and the bent wall portion 22 of the sealing body 16 from the region surrounded by the sealing body 16 and the substrate 12, and the outside of the sealing body 16. It extends to. The other groove 37
A high potential power line 36 for driving the light emitting element 14 is formed on the inner wall surface. Accordingly, the high potential power supply line 36 is also formed in the groove 37 of the substrate 12 from the region surrounded by the sealing body 16 and the substrate 12.
It passes between the inner wall surface and the bent wall portion 22 of the sealing body 16 and extends to the outside of the sealing body 16. In the region outside the sealing body 16, the power lines 32 and 36 are connected to a power supply device (not shown).

As shown in FIG. 3, the wiring 40 that is a part of the light emitter assembly 30 is connected to the sealing body 16.
From the region surrounded by the substrate 12, it passes between the bottom surface of the short side of the sealing body 16 and the substrate 12 and extends to the outside of the sealing body 16. The wiring 40 is composed of the high potential power line 27A and the low potential power line 2 described above.
7B, the signal line 29, and the data lines L0 to L127 (FIG. 4). A connection terminal 42 is formed at the end of the wiring 40 in a region outside the sealing body 16, and the connection terminal 42 is connected to a power supply device or a control device (not shown).

The sealing body 16 is bonded to the substrate 12 with an adhesive 38. As shown in FIG. 2, an adhesive 38 is disposed in the groove 37 of the substrate 12 in the vicinity of the long side of the substrate 12.
Thus, the inner wall surface of the groove 37 (the power supply lines 32 and 36 in the portion where the power supply lines 32 and 36 are provided) and the bent wall portion 22 are joined. On the other hand, as shown in FIG.
6 between the bottom surface of the bent wall portion 20 and the substrate 12 (the wiring 40 in the portion where the wiring 40 is present).
8 is disposed, and the bottom surface of the bent wall portion 20 and the substrate 12 are joined by the adhesive 38.
Preferably, a thermosetting or ultraviolet curable adhesive is used as the adhesive 38. In this way, the sealing body 16 and the substrate 12 are sealed with the adhesive 38 without any gap.

According to this embodiment, the bent wall portion 22 of the sealing body 16 is placed in the groove 37 formed in the substrate 12.
Therefore, the bonding area between the substrate 12 and the sealing body 16 can be secured by the depth Le1 of the groove 37. That is, since it is possible to ensure the bonding area without increasing the width of the bottom surface of the bent wall portion 22, it is possible to ensure the sealing performance while suppressing the increase in the area of the electro-optical device 10. It is.

Further, not only the bottom surface of the groove 37 and the bottom surface of the bent wall portion 22 but also the side surface of the groove 37 and the side surface of the bent wall portion 22 are bonded. In this configuration, the tensile strength of the adhesive 38 between the bottom surface of the groove 37 and the bottom surface of the bent wall portion 22 when a force for peeling the sealing body 16 from the substrate 12 is applied in the vicinity of the long side of the substrate 12. Resistance due to the peel strength and the shear strength of the adhesive 38 between the side surface of the groove 37 and the side surface of the bent wall portion 22 occurs. Therefore, in the present invention, it is easy to ensure the adhesive strength as compared with the prior art in which the strength is obtained only by the resistance due to the tensile strength and peel strength of the adhesive.

For example, regarding the bonding structure between the bent wall portion 20 and the substrate 12 that does not use the groove shown in FIG. 3, the bonding width is the width Le3 of the bottom surface of the bent wall portion 20 and a currently available general adhesive is sufficient. In order to ensure the sealing performance, it is preferably at least about 1 mm. Further, in order to secure sufficient adhesive strength with a currently available general adhesive, it is preferable that the adhesion width, that is, the width Le3 of the bottom surface of the bent wall portion 20 is at least about 2 mm.
The width Le3 of the bottom surface is preferably at least about 2 mm.

On the other hand, the bonding width of the bent wall portion 22 using the groove 37 shown in FIG. 2 and the substrate 12 is 2Le1 + Le2. In order to ensure sufficient sealing performance with a currently available general adhesive, it is sufficient that 2Le1 + Le2 ≧ 1 mm. For example, when the depth Le1 of the groove 37 is 0.75 mm and the width Le2 of the groove 37 is 0.5 mm, the bonding width is 2 mm.
And this condition is satisfied. Further, the depth Le1 of the groove 37 is 0.5 mm, and the width Le2 of the groove 37.
Even when the thickness is 0.5 mm, the bonding width is 1.5 mm, which satisfies this condition.

The strength of adhesion between the bent wall portion 22 using the groove 37 and the substrate 12 varies greatly depending on the depth Le1 of the groove 37. However, if the depth Le1 is at least 0.5 mm, a large shear strength can be secured, and If the width Le2 is 0.5 mm, the adhesive strength is considered to be sufficient.

Since the conventional bonding structure between the sealing body 16 and the substrate 12 is basically a type that does not use a groove similar to the structure shown in FIG. 3, the bonding width is preferably at least about 2 mm. In this embodiment, the groove 37 shown in FIG.
The width Le2 of the bottom surface of the bent wall portion 22 may be 0.5 mm with respect to the bonding structure between the bent wall portion 22 and the substrate 12 using the above-described structure. Therefore, the area of the electro-optical device 10 can be reduced correspondingly.

Further, the power lines 32 and 36 for driving the light emitting element 14 pass between the inner surface of the groove 37 and the bent wall portion 22 of the sealing body 16 from the region surrounded by the sealing body 16 and the substrate 12. , Sealing body 16
Therefore, the power supply lines 32 and 36 can be easily arranged.

6 and 7 are cross-sectional views of the electro-optical device 10 according to a modification of the first embodiment. More specifically, FIG. 6 and FIG. 7 are cross-sectional views taken along line BB in FIG. FIG. In these modified examples, the bonding structure between the sealing body 16 and the substrate 12 in the vicinity of the short side of the substrate 12 is different from that in the first embodiment (FIG. 3), but the sealing in the vicinity of the long side of the substrate 12 is performed. The joining structure of the stationary body 16 and the substrate 12 is the same as that of the first embodiment (FIG. 2), and a groove 37 is used.

6 and 7, the bent wall portion 20 is not formed on the two short sides of the sealing body 16. In the structure of FIG. 6, near the short side of the substrate 12, the lower surface of the edge of the sealing body 16 and the substrate 1.
2 (the wiring 40 in a portion where the wiring 40 is present) is disposed between the lower surface of the sealing body 16 and the substrate 12 by the adhesive 38. Adhesive 38 near the short side of the substrate 12
The width Le3 ′ is preferably at least about 2 mm in order to ensure sufficient adhesive strength with a currently available general adhesive.

In the structure of FIG. 7, a spacer piece 44 is interposed between the lower surface of the edge of the sealing body 16 and the substrate 12 in the vicinity of the short side of the substrate 12. The spacer piece 44 can be formed of, for example, glass, plastic, ceramic, or metal. The adhesive 38 is disposed between the lower surface of the sealing body 16 and the spacer piece 44 and between the spacer piece 44 and the substrate 12 (the wiring 40 where the wiring 40 is present). In this way, the sealing body 16 and the substrate 12 are joined. The width Le3 ″ of the adhesive 38 in the vicinity of the short side of the substrate 12 is preferably at least about 2 mm in order to ensure sufficient adhesive strength with a currently available general adhesive.

Also in these modified examples, a fitting structure of the groove 37 and the bent wall portion 22 is fitted to the bonding structure of the sealing body 16 and the substrate 12 in the vicinity of the long side of the substrate 12 as in the first embodiment (FIG. 2). The same effect as described above can be achieved by using.

Note that, in the first embodiment and the above-described modification example, the fitting structure of the groove and the bent wall portion is not provided in the vicinity of the two short sides of the substrate 12. However, a groove and bent wall fitting structure similar to the fitting structure of the groove 37 and the bent wall portion 22 may be provided not only near the long side of the substrate 12 but also near the short side. That is, a continuous loop-shaped groove may be formed on the substrate, a continuous loop-shaped bent wall portion may be formed on the entire sealing body, and the bent wall portion may be fitted into the groove.

<Second Embodiment>
FIG. 8 is a schematic plan view showing an electro-optical device according to the second embodiment of the invention.
FIG. 9 is a cross-sectional view taken along line BB in FIG. 8. In FIG. 8 and FIG. 9, the same reference numerals are used to indicate the same components as those in the first embodiment, and these components will not be described in detail. Further, in FIG. 8, similarly to FIG. 1, illustration of various wirings for driving the light emitting element 14 is omitted.

The electro-optical device 60 illustrated in the drawing is similar to the electro-optical device 10 of the first embodiment in that an electrostatic latent image is formed on an image carrier (for example, a photosensitive drum) in an image printing apparatus using an electrophotographic system. Used as a line-type optical head for writing. 8 is the same as FIG. 2. Therefore, in the bonding structure of the sealing body 16 and the substrate 12 in the vicinity of the long side of the substrate 12,
As in the first embodiment, a fitting structure of the groove 37 and the bent wall portion 22 is used.

On the other hand, as shown in FIG. 9, a long bent wall portion (second bent wall portion) 50 is formed on two short sides of the sealing body 16. As is clear from FIG. 2 and FIG. 9, the long bent wall portion 50 is used.
The bent wall portion 22 extends in the same direction, but the long bent wall portion 50 extends longer than the bent wall portion 22. The end surfaces of the two short sides of the substrate 12 are opposed to the side surface of the long bent wall portion 50.
That is, the substrate 12 is sandwiched between the long bent wall portions 50 of the sealing body 16. Then, the substrate 12 is bonded by the adhesive 38 disposed between the end surfaces of the two short sides of the substrate 12 and the long bent wall portion 50.
And the elongate bending wall part 50 of the sealing body 16 is adhere | attached. In this way, the sealing body 16 and the substrate 12 are sealed with the adhesive 38 without any gap.

Since the two short sides of the substrate 12 are thus covered with the long bent wall portion 50 of the sealing body 16, in this embodiment, the wiring 40, that is, the high potential power line 27A and the low potential power line 27B. ,
The signal line 29 and the data lines L0 to L127 (FIG. 4) do not extend outward from the short side of the substrate 12. Instead, although not shown, the wiring 40 is formed in a groove 37 near the long side of the substrate 12 from the region surrounded by the sealing body 16 and the substrate 12, similarly to the power supply lines 32 and 36 shown in FIG. 2. It passes between the inner wall surface and the bent wall portion 22 of the sealing body 16 and extends to the outside of the sealing body 16.

In this embodiment, the bonding width at the short side of the substrate 12 is equal to the thickness Le4 of the substrate 12.
In this configuration, when a force for peeling the sealing body 16 from the substrate 12 is applied in the vicinity of the short side of the substrate 12, the adhesive 38 between the end surface of the substrate 12 and the side surface of the long bent wall portion 50 is provided. Resistance due to shear strength occurs. In order to secure sufficient sealing performance and adhesive strength with a general adhesive currently available, it is preferable that the adhesive width, that is, the thickness Le4 of the substrate 12, is at least about 1 mm.

Also, in order to ensure sufficient structural strength, the thickness of the long bent wall 50 is at least about 0.
It is preferably 5 mm. On the other hand, the adhesion widths Le3, Le3 ′, Le3 ″ in the vicinity of the short side of the substrate 12 in the first embodiment and its modifications (FIGS. 3, 6, and 7).
Is preferably about 2 mm or more as described above. Therefore, in this embodiment, the substrate 1
Since it is possible to ensure a bonding area between the end face of 2 and the side surface of the long bent wall portion 50,
The bottom surface of the long bent wall portion 50 may not be enlarged. That is, it is possible to ensure sealing performance while suppressing an increase in the area of the electro-optical device 60.

When the thickness Le4 of the substrate 12 is not large, a spacer plate 54 may be stacked on the side of the substrate 12 opposite to the light emitting element 14 as shown in FIG. The spacer plate 54 is made of glass or transparent plastic. The spacer plate 54 is a long bent wall portion 50 together with the substrate 12.
The spacer plate 50 and the long bent wall portion 50 may be bonded together by an adhesive 38 disposed between the end face of the spacer plate 54 and the long bent wall portion 50. .
In addition to the substrate 12, the spacer plate 54 is bonded to the long bent wall portion 50, so that the substrate 12
Even if it is thin, the adhesion area is increased and the sealing performance can be ensured. The total of the adhesion width, that is, the thickness Le4 of the substrate 12 and the thickness Le5 of the spacer plate 54 is preferably at least about 1 mm.

As described above, in the second embodiment and the modified example of FIG. 10, the groove 37 and the bent wall portion 22 are fitted to the joint structure of the sealing body 16 and the substrate 12 in the vicinity of the long side of the substrate 12 ( FIG. 2) is used. However, the bonding structure between the sealing body 16 and the substrate 12 in the vicinity of the long side of the substrate 12 is
Joint without fitting similar to the structure shown in FIG. 3, FIG. 6 or FIG. 7 (joint structure of sealing body 16 and substrate 12 near the short side of substrate 12 in the first embodiment) It may be a structure.
Although illustration of this modification is omitted, in this modification, the wiring 40 passes between the bottom surface of the short side of the sealing body 16 and the substrate 12 from the region surrounded by the sealing body 16 and the substrate 12. , And extends outside the sealing body 16.

<Third Embodiment>
FIG. 11 is a schematic plan view showing an electro-optical device according to a third embodiment of the invention, and FIG. 12 is a cross-sectional view taken along line AA in FIG. In FIG. 11 and FIG. 12, the same reference numerals are used to indicate the same components as those in the first embodiment, and these components will not be described in detail. In FIG. 11, similarly to FIG. 1, illustration of various wirings for driving the light emitting element 14 is omitted.

The electro-optical device 70 illustrated in the drawing is similar to the electro-optical device 10 of the first embodiment in that an electrostatic latent image is formed on an image carrier (for example, a photosensitive drum) in an image printing apparatus using an electrophotographic system. Used as a line-type optical head for writing. 11 is the same as that of any of FIGS. 3, 6 and 7. Therefore, the wiring 40 passes between the bottom surface of the short side of the sealing body 16 and the substrate 12 from the region surrounded by the sealing body 16 and the substrate 12, and the sealing body 16.
Extends outside.

On the other hand, as shown in FIG. 12, the long bent wall portion 50 is formed on the two long sides of the sealing body 16. As is clear from FIG. 12 and FIG. 3, the long bent wall portion 50, the bent wall portion 20.
Extend in the same direction, but the long bent wall portion 50 extends longer than the bent wall portion 20. The end surfaces of the two short sides of the substrate 12 are opposed to the side surface of the long bent wall portion 50. That is, the substrate 12 is sandwiched between the long bent wall portions 50 of the sealing body 16. And the board | substrate 12 and the sealing body 1 with the adhesive agent 38 arrange | positioned between the end surface of the two short sides of the board | substrate 12, and the elongate bending wall part 50 are used.
Six long bent wall portions 50 are bonded. In this way, the sealing body 16 and the substrate 12 are sealed with the adhesive 38 without any gap.

As described above, since the two long sides of the substrate 12 are covered with the long bent wall portion 50 of the sealing body 16, in this embodiment, the power supply lines 32 and 36 are disposed outward from the long sides of the substrate 12. It does not extend.
Instead, although not shown, the power supply lines 32 and 36 are connected to the sealing body 16 from the region surrounded by the sealing body 16 and the substrate 12, similarly to the wiring 40 shown in FIGS. 3, 6, and 7. It passes between the bottom surface of the short side and the substrate 12 and extends to the outside of the sealing body 16.

In this embodiment, the bonding width on the long side of the substrate 12 is equal to the thickness Le4 ′ of the substrate 12. In this configuration, when a force is applied to peel off the sealing body 16 from the substrate 12 in the vicinity of the long side of the substrate 12, the adhesive 38 between the end surface of the substrate 12 and the side surface of the long bent wall portion 50. Resistance due to shear strength occurs. In general, since the shear strength of the adhesive is high, it is easier to secure the adhesive strength in this embodiment than in the prior art in which the strength is obtained only by the resistance due to the tensile strength and peel strength of the adhesive. In order to secure sufficient sealing performance and adhesive strength with the currently available general adhesives, the adhesive width, ie, the thickness Le4 ′ of the substrate 12, is preferably at least about 1 mm.

Also, in order to ensure sufficient structural strength, the thickness of the long bent wall 50 is at least about 0.
It is preferably 5 mm. On the other hand, in the conventional structure, the bonding surface is in a direction parallel to the surface of the substrate 12, and the width is preferably about 2 mm or more. Therefore, in this embodiment, since it is possible to secure an adhesion area between the end surface of the substrate 12 and the side surface of the long bent wall portion 50, the bottom surface of the long bent wall portion 50 need not be enlarged. Also good. That is, it is possible to ensure sealing performance while suppressing an increase in the area of the electro-optical device 60.

When the thickness Le4 ′ of the substrate 12 is not large, a spacer plate 54 may be stacked on the opposite side of the substrate 12 from the light emitting element 14, as shown in FIG. The spacer plate 54 is made of glass or transparent plastic. The spacer plate 54 together with the substrate 12 has a long bent wall portion 5.
The spacer plate 54 and the long bent wall portion 50 are bonded by an adhesive 38 disposed between the end face of the spacer plate 54 and the long bent wall portion 50. Good. In addition to the substrate 12, the spacer plate 54 is bonded to the long bent wall portion 50, so that the substrate 1
Even if 2 is thin, an adhesion area increases and it is possible to ensure sealing performance. The total of the adhesion width, that is, the thickness Le4 ′ of the substrate 12 and the thickness Le5 ′ of the spacer plate 54 is preferably at least about 1 mm.

As described above, in the third embodiment and the modification of FIG. 12, the bonding structure of FIG. 3, FIG. 6, or FIG. 7 is included in the bonding structure of the sealing body 16 and the substrate 12 near the short side of the substrate 12. It is used. However, the bonding structure of the sealing body 16 and the substrate 12 in the vicinity of the short side of the substrate 12 is the fitting structure of the groove and the bent wall portion shown in FIG. 2 (the length of the substrate 12 in the first embodiment). Sealed body 1 near the side
6 and the joint structure of the substrate 12). Although illustration of this modified example is omitted, in this modified example, the wiring 40 extends from the region surrounded by the sealing body 16 and the substrate 12 to the inner wall surface of the groove near the short side of the substrate 12 and the sealing body 16. It passes between the bent walls of the short side and extends to the outside of the sealing body 16.

<Image printing device>
As described above, the electro-optical devices 10, 60, and 70 can be used as a line-type optical head for writing a latent image on an image carrier in an image printing apparatus using an electrophotographic system. Examples of the image printing apparatus include a printer, a printing part of a copying machine, and a printing part of a facsimile.

FIG. 14 is a longitudinal sectional view showing an example of an image printing apparatus using any one of the electro-optical devices 10, 60, and 70 as a line type optical head. This image printing apparatus is a tandem type full-color image printing apparatus using a belt intermediate transfer body system.

In this image printing apparatus, four organic EL array exposure heads 10K, 10C having the same configuration are used.
, 10M, 10Y are four photosensitive drums (image carriers) 110K, 11 having the same configuration.
Arranged at the exposure positions of 0C, 110M, and 110Y, respectively. The organic EL array exposure heads 10K, 10C, 10M, and 10Y are any of the electro-optical devices 10, 60, and 70 described above.

As shown in FIG. 14, this image printing apparatus is provided with a driving roller 121 and a driven roller 122, and an endless intermediate transfer belt 120 is wound around these rollers 121 and 122, as indicated by arrows. Thus, the periphery of the rollers 121 and 122 is rotated. Although not shown, tension applying means such as a tension roller that applies tension to the intermediate transfer belt 120 may be provided.

Around the intermediate transfer belt 120, photosensitive drums 110K, 110C, 110M, and 110Y having photosensitive layers on four outer peripheral surfaces are arranged at predetermined intervals. Subscript K
, C, M, and Y mean that they are used to form visible images of black, cyan, magenta, and yellow, respectively. The same applies to other members. Photosensitive drums 110K and 11
0C, 110M, and 110Y are rotationally driven in synchronization with the driving of the intermediate transfer belt 120.

Around each photosensitive drum 110 (K, C, M, Y), a corona charger 111 (K, C,
M, Y), organic EL array exposure head 10 (K, C, M, Y), and developing device 114 (K, Y).
C, M, Y) are arranged. The corona charger 111 (K, C, M, Y) uniformly charges the outer peripheral surface of the corresponding photosensitive drum 110 (K, C, M, Y). The organic EL array exposure head 10 (K, C, M, Y) writes an electrostatic latent image on the charged outer peripheral surface of the photosensitive drum. Each organic EL array exposure head 10 (K, C, M, Y) includes a plurality of OLED elements 1.
4 are arranged so that the arrangement direction of 4 is along the bus (main scanning direction) of the photosensitive drum 110 (K, C, M, Y). The electrostatic latent image is written by irradiating the photosensitive drum with light from the plurality of OLED elements 14. The developing device 114 (K, C, M, Y) forms a visible image, that is, a visible image on the photosensitive drum by attaching toner as a developer to the electrostatic latent image.

Black, cyan, magenta, and black formed by such a four-color single color image forming station
The yellow visible images are sequentially primary-transferred onto the intermediate transfer belt 120 to be superimposed on the intermediate transfer belt 120, and as a result, a full-color visible image is obtained. Inside the intermediate transfer belt 120, four primary transfer corotrons (transfer units) 112 (K, C, M, Y) are provided.
Is arranged. The primary transfer corotron 112 (K, C, M, Y) is connected to the photosensitive drum 11.
0 (K, C, M, Y) are arranged in the vicinity of the photosensitive drum 110 (K, C,
The visible image is electrostatically attracted from (M, Y) to transfer the visible image to the intermediate transfer belt 120 passing between the photosensitive drum and the primary transfer corotron.

A sheet 102 as an object on which an image is to be finally formed is fed one by one from the sheet feeding cassette 101 by the pickup roller 103, and between the intermediate transfer belt 120 and the secondary transfer roller 126 in contact with the driving roller 121. Sent to the nip. The full-color visible image on the intermediate transfer belt 120 is secondarily transferred to one side of the sheet 102 by the secondary transfer roller 126 and fixed on the sheet 102 through the fixing roller pair 127 as a fixing unit. . Thereafter, the sheet 102 is discharged onto a paper discharge cassette formed in the upper part of the apparatus by a paper discharge roller pair 128.

The image printing apparatus of FIG. 14 includes an electro-optical device 1 having an organic EL array as writing means.
Since any one of 0, 60, and 70 is used, the apparatus can be reduced in size as compared with the case where the laser scanning optical system is used. In addition, as described above, any one of the electro-optical devices 10, 60, and 70 can be made smaller than the conventional one, so that the photosensitive drums 110K, 110C, and 1
10M and 110Y can be arranged at positions close to each other, and the image printing apparatus can be further downsized.

Next, another embodiment of the image printing apparatus according to the present invention will be described.
FIG. 15 is a longitudinal sectional view of another image printing apparatus using any one of the electro-optical devices 10, 60, and 70 as a line type optical head. This image printing apparatus is a rotary development type full-color image printing apparatus using a belt intermediate transfer body system. In the image printing apparatus shown in FIG. 15, a corona charger 168, a rotary developing unit 161, an organic EL array exposure head 167, and an intermediate transfer belt 169 are provided around a photosensitive drum (image carrier) 165. Yes.

The corona charger 168 uniformly charges the outer peripheral surface of the photosensitive drum 165. The organic EL array exposure head 167 writes an electrostatic latent image on the charged outer peripheral surface of the photosensitive drum 165. The organic EL array exposure head 167 is one of the electro-optical devices 10, 60, and 70 described above, and is installed such that the arrangement direction of the plurality of OLED elements 14 is along the bus line (main scanning direction) of the photosensitive drum 165. The The electrostatic latent image is written in the plurality of OLED elements 14 described above.
By irradiating the photosensitive drum with light.

The developing unit 161 includes four developing units 163Y, 163C, 163M, and 163K.
The drums are arranged at an angular interval of ° and can be rotated counterclockwise about the shaft 161a. The developing units 163Y, 163C, 163M, and 163K supply yellow, cyan, magenta, and black toners to the photosensitive drum 165, respectively, and attach the toner as a developer to the electrostatic latent image, thereby the photosensitive drum 165. A visible image, that is, a visible image is formed.

The endless intermediate transfer belt 169 is wound around a driving roller 170a, a driven roller 170b, a primary transfer roller 166, and a tension roller, and is rotated around these rollers in a direction indicated by an arrow. The primary transfer roller 166 transfers the visible image to the intermediate transfer belt 169 that passes between the photosensitive drum and the primary transfer roller 166 by electrostatically attracting the visible image from the photosensitive drum 165.

Specifically, in the first rotation of the photosensitive drum 165, an electrostatic latent image for a yellow (Y) image is written by the exposure head 167, and a developed image of the same color is formed by the developing unit 163Y.
Further, the image is transferred to the intermediate transfer belt 169. Further, in the next rotation, an electrostatic latent image for a cyan (C) image is written by the exposure head 167, and a developed image of the same color is formed by the developing device 163C. The intermediate transfer is performed so as to overlap the yellow developed image. Transferred to the belt 169. Then, during the four rotations of the photosensitive drum 9, the yellow, cyan, magenta, and black visible images are sequentially superimposed on the intermediate transfer belt 169. As a result, a full-color visible image is formed on the transfer belt 169. It is formed. When images are finally formed on both sides of a sheet as an object on which an image is to be formed, the same color images of the front and back surfaces are transferred to the intermediate transfer belt 169, and then the front and back surfaces are transferred to the intermediate transfer belt 169. A full-color visible image is obtained on the intermediate transfer belt 169 by transferring the visible image of the next color.

The image printing apparatus is provided with a sheet conveyance path 174 through which a sheet is passed. The sheets are picked up one by one from the paper feed cassette 178 by the pick-up roller 179, advanced through the sheet transport path 174 by the transport roller, and between the intermediate transfer belt 169 and the secondary transfer roller 171 in contact with the drive roller 170a. Pass through the nip. The secondary transfer roller 171 transfers the developed image to one side of the sheet by electrostatically attracting a full-color developed image from the intermediate transfer belt 169 collectively. The secondary transfer roller 171 can be moved closer to and away from the intermediate transfer belt 169 by a clutch (not shown). And
The secondary transfer roller 171 moves the intermediate transfer belt 169 when transferring a full-color visible image onto the sheet.
And is separated from the secondary transfer roller 171 while the visible image is superimposed on the intermediate transfer belt 169.

The sheet on which the image has been transferred as described above is conveyed to the fixing device 172 and is passed between the heating roller 172a and the pressure roller 172b of the fixing device 172, whereby the visible image on the sheet is fixed. The sheet after the fixing process is drawn into the discharge roller pair 176 and proceeds in the direction of arrow F. In the case of double-sided printing, after most of the sheet passes through the paper discharge roller pair 176, the paper discharge roller pair 176 is rotated in the reverse direction.
75. Then, the visible image is transferred to the other surface of the sheet by the secondary transfer roller 171, the fixing process is performed again by the fixing device 172, and then the sheet is discharged by the discharge roller pair 176.

The image printing apparatus of FIG. 15 includes an exposure head 16 having an organic EL array as writing means.
7 (any of electro-optical devices 10, 60, and 70) is used, the device can be made smaller than when a laser scanning optical system is used. In addition, as described above, any one of the electro-optical devices 10, 60, and 70 can be made smaller than the conventional one.
It is possible to arrange at a position close to 65, and the image printing apparatus can be further downsized.

The image printing apparatus to which any of the electro-optical devices 10, 60, and 70 can be applied has been described above, but any one of the electro-optical devices 10, 60, and 70 is applied to other electrophotographic image printing apparatuses. And such image printing devices are within the scope of the present invention. For example, any of the electro-optical devices 10, 60, and 70 may be used for an image printing apparatus that directly transfers a visible image from a photosensitive drum to a sheet without using an intermediate transfer belt, and an image printing apparatus that forms a monochrome image. Can be applied.

<Other applications>
The electro-optical device according to the present invention can be further applied to various exposure devices, illumination devices, and image display devices.

<Modification>
The light emitting element 14 described above is an organic EL element. However, if sealing is necessary, a substrate provided with an inorganic EL element may be sealed in the same manner as in the above embodiment mode.
The electro-optical device 10 described above is a bottom emission type, but a sealing structure similar to that of the above-described embodiment is used for a top emission type electro-optical device that emits light to the side opposite to the substrate on which the light emitting element is provided. May be.

In the embodiment described above, the substrate 12 and the sealing body 16 are rectangular, but other shapes may be used. In the above-described embodiment, the bent wall portions 20, 22, and 50 are formed on the periphery of the sealing body 16, but the positions where the bent wall portions are formed may be other portions of the sealing body. .

1 is a schematic plan view showing an electro-optical device according to a first embodiment of the invention. It is AA arrow sectional drawing of FIG. It is a BB arrow directional cross-sectional view of FIG. FIG. 2 is a block diagram illustrating a drive system of the electro-optical device. FIG. 5 is a circuit diagram of each pixel circuit in the drive system of FIG. 4. 6 is a cross-sectional view of an electro-optical device according to a modification of the first embodiment. FIG. FIG. 10 is a cross-sectional view of an electro-optical device according to another modification of the first embodiment. FIG. 5 is a schematic plan view showing an electro-optical device according to a second embodiment of the invention. FIG. 9 is a cross-sectional view taken along line B-B in FIG. 8. FIG. 10 is a cross-sectional view of an electro-optical device according to a modification of the second embodiment. FIG. 6 is a schematic plan view showing an electro-optical device according to a third embodiment of the invention. It is AA arrow sectional drawing of FIG. FIG. 10 is a cross-sectional view of an electro-optical device according to a modification of the third embodiment. FIG. 11 is a longitudinal sectional view illustrating an example of an image printing apparatus using the electro-optical device illustrated in FIG. 1 or 10. FIG. 11 is a longitudinal sectional view illustrating another example of an image printing apparatus using the electro-optical device illustrated in FIG. 1 or 10.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,60,70 ... Electro-optical apparatus, 12 ... Board | substrate, 14 ... Light emitting element, 16 ... Sealing body, 20
, 22 ... bent wall part, 32 ... low potential power line, 36 ... high potential power line, 37 ... groove, 38 ... adhesive, 40 ... wiring, 50 ... long bent wall part, 54 ... spacer plate, L0 to L127 ... data line, 2
7A: High potential power line, 27B: Low potential power line, 29 ... Signal line

Claims (7)

A substrate,
A light emitting device formed on the substrate;
A sealing body that partially covers a surface of the substrate on which the light emitting element is formed, is bonded to the substrate, and seals the light emitting element in cooperation with the substrate;
The sealing body is formed with a bent wall portion that bends from at least a part thereof,
A groove for receiving the bent wall portion of the sealing body is formed in the substrate,
The electro-optical device, wherein the substrate and the bent wall portion of the sealing body are bonded by an adhesive disposed in the groove. Wiring for driving the light emitting element passes between the inner surface of the groove and the bent wall portion of the sealing body from a region surrounded by the sealing body and the substrate, and is outside the sealing body. The electro-optical device according to claim 1, wherein the electro-optical device extends. The sealing body is formed with a pair of second bent wall portions that are bent in the same direction as the bent wall portion from two places and longer than the bent wall portion,
The substrate is sandwiched between the second bent wall portion, and the second of the substrate and the sealing body is formed by an adhesive disposed between the end surface of the substrate and the second bent wall portion. The electro-optical device according to claim 1, wherein the bent wall portion is bonded. A spacer plate is stacked on the substrate on the side opposite to the light emitting element,
The spacer plate is sandwiched between the second bent wall portions, and the spacer plate and the sealing body are bonded by an adhesive disposed between the end surface of the spacer plate and the second bent wall portion. The electro-optical device according to claim 4, wherein the second bent wall portion is bonded. A substrate,
A light emitting device formed on the substrate;
A sealing body that partially covers a surface of the substrate on which the light emitting element is formed, is bonded to the substrate, and seals the light emitting element in cooperation with the substrate;
The sealing body is formed with a bent wall portion that bends in the same direction from the two locations,
The substrate is sandwiched between the bent wall portions, and the bent wall portion of the substrate and the sealing body are bonded by an adhesive disposed between the end surface of the substrate and the bent wall portion. An electro-optical device. A spacer plate is stacked on the substrate on the side opposite to the light emitting element,
The spacer plate is sandwiched between the bent wall portions, and the spacer plate and the bent wall portion of the sealing body are bonded by an adhesive disposed between the end surface of the spacer plate and the bent wall portion. The electro-optical device according to claim 5, wherein the electro-optical device is provided. An image carrier;
A charger for charging the image carrier;
The plurality of light-emitting elements are arranged, and a latent image is formed by irradiating light on the charged surface of the image carrier with the plurality of light-emitting elements. An electro-optic device;
A developer that forms a visible image on the image carrier by attaching toner to the latent image;
An image printing apparatus comprising: a transfer unit that transfers the visible image from the image carrier to another object.

Images