JP2006167586A - Vibration plate for ultrasonic cleaner and ultrasonic cleaner equipped with the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vibration plate for an ultrasonic cleaner capable of supplying over the whole surface of a large-sized cleaning object a washing liquid to which the ultrasonic vibration with a sufficient intensity is applied. <P>SOLUTION: The vibration plate 20 for the ultrasonic cleaner comprises an ultrasonic vibrator 21 emitting ultrasonic waves and the vibration plate 22 transmitting the ultrasonic vibration excited by the ultrasonic vibrator 21, and the difference of the thermal expansion coefficient of the ultrasonic vibrator 21 and that of the vibration plate 22 is ±1.7×10<SP>-6</SP>/°C or less. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a diaphragm for an ultrasonic cleaning device and an ultrasonic cleaning device including the same.

  In ultrasonic cleaning, the parts to be cleaned are immersed in the cleaning liquid, and the ultrasonic vibration generated from the ultrasonic vibrator is propagated to the cleaning liquid and the parts through the vibration plate. And ultrasonic vibrations to remove dirt efficiently. This ultrasonic cleaning is used particularly for the purpose of increasing the cleanliness in the manufacture of precision parts, automobile parts, electronic parts and other micro parts, complex shaped parts, parts and members that remove surface contamination, and materials.

  For example, since a glass substrate for liquid crystal used for manufacturing a liquid crystal display device also requires high cleanliness, ultrasonic cleaning is used. In ultrasonic cleaning of liquid crystal glass substrates, a vibration method has been put into practical use in which ultrasonic vibration is applied to the cleaning liquid sprayed onto the liquid crystal glass substrate and fine particles adhering to the liquid crystal glass substrate are removed by the vibration action. ing. By applying the ultrasonic vibration, the bonding force of the fine particles adhering to the glass substrate for liquid crystal is reduced, so that the cleaning effect is improved as compared with the case where the ultrasonic vibration is not applied. In recent years, since the glass substrate for liquid crystal tends to be enlarged, it is advantageous in terms of cost. Therefore, a single-wafer type cleaning apparatus that injects a cleaning liquid toward the glass substrate for liquid crystal and cleans one by one is frequently used. ing.

  For ultrasonic transducers used in ultrasonic cleaning devices that use ultrasonic waves, if the frequency of ultrasonic vibrations is too low, the effect of applying ultrasonic vibrations to the cleaning liquid is difficult to develop, and the frequency of ultrasonic vibrations is low. If it is too high, there is a concern about damage to the substrate to be cleaned due to cavitation, so a frequency around 1 MHz is used.

  4 is a cross-sectional view showing a simplified configuration of a conventional ultrasonic cleaning apparatus 1. FIG. 5 is an enlarged view of the diaphragm 6 for the ultrasonic cleaning apparatus provided in the ultrasonic cleaning apparatus 1 shown in FIG.

  In the conventional ultrasonic cleaning apparatus 1, the substrate to be cleaned 3 is conveyed in the direction of the arrow 4, and the cleaning nozzle 5 is provided on the cleaning surface 3 a side of the substrate to be cleaned 3 with a space from the cleaning surface 3 a. The cleaning nozzle 5 is provided with an ultrasonic cleaning device diaphragm 6. The ultrasonic cleaning device vibration plate 6 applies ultrasonic vibrations to the cleaning liquid 7 in the cleaning nozzle 5 and the cleaning liquid 7 a sprayed from the nozzle hole 8 of the cleaning nozzle 5 toward the substrate 3 to be cleaned. Further, the cleaning liquid 7a sprayed toward the substrate 3 to be cleaned contacts the cleaning surface 3a of the substrate 3 to be cleaned, and ultrasonic vibration propagates in the sprayed cleaning liquid 7a. Sonic vibration is applied.

  By applying ultrasonic vibration to the substrate 3 to be cleaned, ultrasonic vibration is also applied to the fine particles adhering to the cleaning surface 3a, and both the substrate 3 to be cleaned and the fine particles are vibrated by the ultrasonic waves. Fine particles are removed from the cleaning surface 3a by acceleration and straight flow of the cleaning liquid 7a to which vibration is applied. In order to prevent the fine particles removed from the cleaning surface 3a of the substrate to be cleaned 3 from reattaching to the cleaning surface 3a, functional water such as alkaline hydrogen water may be used as the cleaning liquid.

  The ultrasonic cleaning device vibration plate 6 has a structure in which the ultrasonic vibrator 9 is bonded to the vibration plate 10 and the reinforcing plate 11 with an adhesive 12. The diaphragm 10 is made of a metal such as stainless steel or tantalum (Ta), the reinforcing plate 11 is stainless steel, and the ultrasonic vibrator 9 is a piezo element. The diaphragm 10 is formed in a rectangle having the width direction as a longitudinal direction so that the entire width direction, which is a direction orthogonal to the transport direction 4 of the substrate 3 to be cleaned, can be cleaned. The ultrasonic vibrator 9 is attached.

  In order to improve the production efficiency of the liquid crystal panel, the glass substrate for liquid crystal is increased in size, the substrate transport speed is increased, and the effective application time of ultrasonic waves during ultrasonic cleaning is in the direction of shortening. In order to cope with this, it is required to increase the length in the width direction of the substrate and to increase the width of the cleaning opening in the transport direction 4.

  In order to further increase the ultrasonic vibration application region in the width direction of the substrate, it is easy to devise to increase the number of ultrasonic transducers attached. However, a structure in which a plurality of ultrasonic vibrators are fixed to the same diaphragm and reinforcing plate is generally realized by bonding using a thermosetting resin. Due to the difference in thermal expansion coefficient with the vibrator, after the ultrasonic vibrator is fixed to the vibration plate, the vibration plate may be warped or peeled off, and the ultrasonic vibrator may be broken. In particular, since the substrate size is recently increased to about 2 m, it is difficult to manufacture a long diaphragm including a large number of ultrasonic vibrators corresponding to the large substrate.

For example, the thermal expansion coefficient of the diaphragm formed of lead zirconate titanate (PZT) vibrating element and the stainless steel (SUS304) is 5 × ^{10 -6} /℃,16.4×10 ^-6 / ℃ respectively, 1600 mm When the length of the vibrator and the vibration plate are bonded together with a thermosetting resin adhesive and thermally cured at 200 ° C., the thermal expansion amounts of the ultrasonic vibrator and the vibration plate are expressed by the equations (1) and (1), respectively. It becomes like (2).
Ultrasonic vibrator: 1600 × 5 × 10 ⁻⁶ × (200−25) = 1.4 mm (1)
Diaphragm: 1600 × 16.4 × 10 ⁻⁶ × (200−25) = 4.6 mm (2)

  The resin adhesive that is heat-cured at 200 ° C. is cured in an expanded state. When cooled to room temperature after the thermosetting treatment, the adhesive bears a strain corresponding to the difference in expansion, and the adhesive peels when it exceeds the allowable stress of the adhesive. Although there is a method to prevent adhesion peeling by bonding not only the ultrasonic vibrator and the diaphragm but also the ultrasonic vibrator and the reinforcing material, although the allowable stress value can be slightly increased, This is not a fundamental solution, and there is a problem that the amplitude of the oscillating ultrasonic vibration is reduced.

  Various improvements have been proposed for the ultrasonic cleaning device. For example, by forming a groove in the diaphragm around the ultrasonic vibrator, it can function as a vibration filter and propagate ultrasonic vibration to unnecessary parts. Although there is a prior art such as suppression (see Patent Document 1), there is no disclosure of a technique for solving the above problems.

JP 2002-126667 A

  An object of the present invention is to provide a diaphragm for an ultrasonic cleaning device and an ultrasonic cleaning device capable of cleaning a large object to be cleaned with a cleaning liquid to which ultrasonic vibration is sufficiently applied over the entire surface. .

The present invention relates to a vibration plate for an ultrasonic cleaning device used in an ultrasonic cleaning device for cleaning by spraying a cleaning liquid to which ultrasonic vibration is applied to a substrate.
An ultrasonic vibrator that oscillates ultrasonic vibration;
Including a vibration plate through which ultrasonic vibrations oscillated by an ultrasonic vibrator are propagated,
When the thermal expansion coefficient of the diaphragm is α1, and the thermal expansion coefficient of the ultrasonic vibrator is α2,
The diaphragm for an ultrasonic cleaning device is characterized in that the following formula is established between the thermal expansion coefficient α1 of the diaphragm and the thermal expansion coefficient α2 of the ultrasonic vibrator.
α2−y ≦ α1 ≦ α2 + y
y = 1.7 × 10 ⁻⁶ / ° C.

  According to the present invention, the diaphragm is subjected to an electrolytic composite polishing process in which electrolytic polishing and chemical polishing are combined and polished.

In the present invention, the diaphragm is made of a low thermal expansion alloy having a thermal expansion coefficient of 6.7 × 10 ⁻⁶ / ° C. or less.

  Further, the present invention is characterized in that the low thermal expansion alloy has a composition consisting of Co: 52.5 to 55%, Cr: 9 to 10.5%, the balance Fe and inevitable impurities by weight.

  Further, the present invention is characterized in that the low thermal expansion alloy has a composition consisting of Ni: 34 to 37%, balance Fe and unavoidable impurities in weight%.

  Further, the present invention is characterized in that the low thermal expansion alloy has a composition consisting of Ni: 30 to 32%, Co: 4 to 6%, the balance Fe and inevitable impurities in weight%.

  According to the present invention, the ultrasonic vibrator has an oscillation frequency of 400 kHz to 3 MHz.

  In addition, the present invention is an ultrasonic cleaning apparatus comprising any one of the above-described diaphragms for an ultrasonic cleaning apparatus.

The present invention also includes a holding member for holding the diaphragm of the diaphragm for an ultrasonic cleaning device,
The ultrasonic vibrator is held by a holding member via a diaphragm.

  According to the present invention, a specific relationship is established between the thermal expansion coefficient of the diaphragm and the thermal expansion coefficient of the ultrasonic vibrator, that is, the thermal expansion coefficients of the diaphragm and the ultrasonic vibrator are close to each other. Therefore, there is no peeling between the diaphragm and the ultrasonic vibrator, and a long diaphragm for an ultrasonic cleaning device can be manufactured. Therefore, it is possible to increase the ultrasonic vibration application area by the diaphragm for an ultrasonic cleaning device and to efficiently clean the object to be cleaned.

  Further, according to the present invention, since the diaphragm is subjected to an electrolytic composite polishing process in which electrolytic polishing and chemical polishing are combined, it is easy to remove smut at the time of manufacture and adhesion of fine particles is prevented. The

Moreover, according to the present invention, the diaphragm is preferably made of a low thermal expansion alloy having a thermal expansion coefficient of 6.7 × 10 ⁻⁶ / ° C. or less. Further, as the low expansion alloy, Co: 52.5 to 55 %, Cr: 9 to 10.5%, an alloy having a composition consisting of the balance Fe and unavoidable impurities, Ni: 34 to 37%, an alloy having a composition consisting of the balance Fe and unavoidable impurities, or Ni: 30 to 32 %, Co: 4 to 6%, an alloy having a composition comprising the balance Fe and inevitable impurities is preferable. According to any of these alloys, a diaphragm having a thermal expansion coefficient close to that of an ultrasonic vibrator made of, for example, ceramic or quartz can be easily realized.

  Further, according to the present invention, since the ultrasonic vibrator has an oscillation frequency of 400 kHz to 3 MHz, ultrasonic vibration is applied to the cleaning liquid at a vibration frequency in a high ultrasonic band, and the object to be cleaned can be efficiently cleaned. it can.

  According to the invention, an ultrasonic cleaning device includes any one of the diaphragms for an ultrasonic cleaning device. This realizes an ultrasonic cleaning device that can efficiently clean a cleaning liquid by applying a vibration frequency of a long high ultrasonic band to a cleaning liquid, such as a large liquid crystal glass substrate. .

  Further, according to the present invention, the holding member for holding the diaphragm of the diaphragm for an ultrasonic cleaning device is provided, and the ultrasonic vibrator is held by the holding member through the diaphragm. By applying the vibration frequency to the cleaning liquid, the object to be cleaned can be efficiently cleaned.

  FIG. 1 is a bottom view showing a simplified configuration of a diaphragm 20 for an ultrasonic cleaning device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the section line II-II in FIG. is there.

The diaphragm 20 for an ultrasonic cleaning device includes an ultrasonic vibrator 21 that oscillates ultrasonic vibrations, and a diaphragm 22 that propagates ultrasonic vibrations oscillated by the ultrasonic vibrator 21. When the thermal expansion coefficient is α1 and the thermal expansion coefficient of the ultrasonic vibrator 21 is α2, the formula (3) is calculated between the thermal expansion coefficient α1 of the diaphragm 22 and the thermal expansion coefficient α2 of the ultrasonic vibrator 21. Is configured to hold.
α2-y ≦ α1 ≦ α2 + y (3)
Here, y = 1.7 × 10 ⁻⁶ / ° C.

The diaphragm 22 is a rectangular parallelepiped shape, more specifically, an elongated flat plate having a rectangular planar shape. In this embodiment, the diaphragm 22 is 54% Co, 9.5% Cr, the remainder Fe, and inevitable impurities in weight percent. An alloy having a composition (hereinafter referred to as a 54Co-9.5Cr-Fe alloy). The thermal expansion coefficient α1 of the 54Co-9.5Cr—Fe alloy constituting the diaphragm 22 is 5 × 10 ⁻⁶ / ° C. The diaphragm 22 is cut into a predetermined shape, and then subjected to an electrolytic composite polishing process in which electrolytic polishing and chemical polishing are combined and polished. In the present specification, the thermal expansion coefficient is used to mean the linear expansion coefficient.

The ultrasonic vibrator 21 is a piezo element, and is composed of, for example, PZT, and has an oscillation frequency of ultrasonic vibration of 400 kHz to 3 MHz. The thermal expansion coefficient α2 of the ultrasonic transducer 21 of the present embodiment is 5 × 10 ⁻⁶ / ° C.

  In the diaphragm 20 for an ultrasonic cleaning device, a plurality (eight in this embodiment) of ultrasonic vibrators 21 are arranged in a row with respect to one surface 22a of the diaphragm 22 with a thermosetting resin adhesive 23 ( Hereinafter, it is simply bonded with an adhesive 23). A spacer 24 made of an insulator such as glass epoxy is provided between the adjacent ultrasonic transducers 21 to prevent the electrodes from short-circuiting between the adjacent ultrasonic transducers 21.

The thermal expansion coefficient α1: 5 × 10 / ° C. of the diaphragm 22 and the thermal expansion coefficient α2 of the ultrasonic vibrator 21: 5 × 10 ⁻⁶ / ° C. in the diaphragm 20 for an ultrasonic cleaning device of the present embodiment are: As shown in the following equation (4), the relationship of the aforementioned equation (3) is satisfied.
(5 × 10 ⁻⁶ ) − (1.7 × 10 ⁻⁶ ) ≦ 5 × 10 ⁻⁶
≦ (5 × 10 ⁻⁶ ) + (1.7 × 10 ⁻⁶ ) (4)

In the ultrasonic cleaning device vibration plate 20 configured as described above, for example, eight ultrasonic vibrators 21 are arranged and bonded to the vibration plate 22 with an adhesive 23, and the length in the longitudinal direction of the bonding region is 1600 mm. Then, taking as an example the case of heating and heating from room temperature (25 ° C.) to 200 ° C., the amount of thermal expansion between the ultrasonic vibrator 21 and the diaphragm 22 is calculated. It is obtained as in (6).
Ultrasonic vibrator 21: 1600 × 5 × 10 ⁻⁶ × (200−25) = 1.4 mm
... (5)
Diaphragm 22: 1600 × 5 × 10 ⁻⁶ × (200−25) = 1.4 mm
(6)

  In this way, in the diaphragm 20 for an ultrasonic cleaning device, the thermal expansion coefficient α2 of the ultrasonic vibrator 21 and the thermal expansion coefficient α1 of the diaphragm 22 are configured to satisfy the relationship of the above formula (3). By doing so, the difference in the amount of thermal expansion when the ultrasonic vibrator 21 is bonded to the vibration plate 22 and the thermosetting treatment is performed can be eliminated or extremely reduced, so that the adhesive peels off due to the difference in thermal expansion. The problem can be eliminated.

In the diaphragm 20 for an ultrasonic cleaning apparatus of the present embodiment, a 54Co-9.5Cr-Fe alloy is used as the diaphragm 22, but the present invention is not limited to this. 34-37%, an alloy having a composition consisting of the balance Fe and inevitable impurities (Fe-36Ni alloy: α1 = 0.5-2 × 10 ⁻⁶ / ° C.), or wt%, Ni: 30-32%, An alloy having a composition comprising Co: 4 to 6%, the balance Fe and inevitable impurities (32Ni-5Co-Fe alloy: α1 = 0 to 1.5 × 10 ⁻⁶ / ° C.) may be used.

As a selection criterion for the material of the diaphragm 22, the difference between the thermal expansion coefficient α 2 of the ultrasonic transducer 21 and the thermal expansion coefficient α 1 of the diaphragm 22 is ± 1.7 × 10 ⁻⁶ / ° C. or less. I just need it. By setting the difference in the thermal expansion coefficient between the ultrasonic vibrator 21 and the diaphragm 22 in this way, the adhesive 23 bonding the diaphragm 22 and the ultrasonic vibrator 21 is vibrated. This is because the shearing force due to the difference in thermal expansion between the plate 22 and the ultrasonic vibrator 21 can be absorbed.

  FIG. 3 is a cross-sectional view showing a simplified configuration of an ultrasonic cleaning device 30 according to another embodiment of the present invention. The ultrasonic cleaning device 30 includes an ultrasonic cleaning device diaphragm 20. This ultrasonic cleaning apparatus 30 is exemplified for one used for cleaning a glass substrate for liquid crystal.

  The ultrasonic cleaning apparatus 30 generally includes a first cleaning liquid supply nozzle 32 that supplies a cleaning liquid to a glass substrate 31 that is an object to be cleaned, a transport unit 33 that transports the glass substrate 31, and a first cleaning liquid with respect to the glass substrate 31. An ultrasonic vibration applying means that includes a second cleaning liquid supply nozzle 34 that is disposed on the opposite side of the supply nozzle 32 and supplies a cleaning liquid to which ultrasonic vibration is applied to the glass substrate 31, and an ultrasonic cleaning device vibration plate 20. 35.

  The glass substrate 31 is transported in the direction of the arrow 36 by the transport means 33 in a substantially horizontal state. The conveyance means 33 is a conveyance roller 33 provided so that a rotation axis extends in a width direction that is a direction orthogonal to the conveyance direction of the glass substrate 31 indicated by an arrow 36. A plurality of conveying rollers 33 are arranged at intervals in the conveying direction 36, and are each rotationally driven in the direction of the arrow 37 by a rotation driving means (not shown) to convey the glass substrate 31 that contacts the peripheral surface of the conveying roller 33. To do. The surface on the side where the glass substrate 31 abuts against these conveying rollers 33 is called a back surface 31b for convenience, and the surface facing the upper side opposite to the back surface 31b is called a cleaning surface 31a for convenience.

  The first cleaning liquid supply nozzle 32 is provided with the first nozzle hole 32a facing the cleaning surface 31a of the glass substrate 31 and extending in the width direction. The first cleaning liquid supply nozzle 32 is connected to a cleaning liquid supply unit (not shown) and injects a cleaning liquid supplied from the cleaning liquid supply unit, such as pure water or alkaline hydrogen water, onto the cleaning surface 31 a of the glass substrate 31.

  The second cleaning liquid supply nozzle 34 is provided facing the back surface 31 b of the glass substrate 31. The second cleaning liquid supply nozzle 34 has a substantially rectangular tube shape extending in the width direction of the glass substrate 31, and an opening is formed on the side facing the back surface 31 b of the glass substrate 31 and the side opposite thereto, and the side facing the back surface 31 b. The opening formed in the second portion constitutes the second nozzle hole 37. The opening on the opposite side is attached to the ultrasonic vibration applying means 35 so as to face the ultrasonic cleaning device vibration plate 20 provided in the ultrasonic vibration applying means 35 and is sealed by the ultrasonic vibration applying means 35. The second nozzle hole 37 has a rectangular shape, the short side is parallel to the transport direction 36 of the glass substrate 31, and the long side is parallel to the width direction of the glass substrate 31.

  A cleaning liquid supply port 38 is formed on the upstream side wall of the second cleaning liquid supply nozzle 34 in the conveying direction 36. A cleaning liquid pipe 39 is connected to the cleaning liquid supply port 38, and the cleaning liquid pipe 39 is connected to the cleaning liquid supply means. Thus, a cleaning liquid such as pure water is supplied to the second cleaning liquid supply nozzle 34.

  On the inner surface side of the side wall of the second cleaning liquid supply nozzle 34, there is a flat projection piece 42 extending in the width direction, and one end 40 is located above the cleaning liquid supply port 38, that is, near the glass substrate 31 to be conveyed. A protrusion piece 42 is provided, which is fixed and extends so that the other end portion 41 has a downward slope toward the ultrasonic vibration applying means 35 side to form the free end portion 41.

  The protruding piece 42 has an inclination angle with respect to the cleaning liquid supply port 38 and is provided at a position so as to cover the cleaning liquid supply port 38. Therefore, the cleaning liquid supplied from the cleaning liquid pipe 39 through the cleaning liquid supply port 38 into the internal space 43 of the second cleaning liquid supply nozzle 34 collides with the protruding piece 42 and flows in the direction of the diaphragm 20 for the ultrasonic cleaning device. Then, the ultrasonic vibration is sufficiently applied by the ultrasonic cleaning device diaphragm 20, and then flows toward the second nozzle hole 37. That is, the protrusions 42 convect the cleaning liquid in the direction of the arrow 44 so that the cleaning liquid supplied into the internal space 43 of the second cleaning liquid supply nozzle 34 is easily applied with ultrasonic vibration.

  The ultrasonic vibration applying means 35 includes a base 45, a holding member 46, an ultrasonic cleaning device diaphragm 20, a fixing member 47, and a power feeding member 48. The base 45 is, for example, a bottomed rectangular tube-shaped container member made of metal and has an internal space 49.

  A holding member 46 is provided on the peripheral portion of the base 45 on the opening side. The holding member 46 is made of, for example, stainless steel, and is a member having a substantially rectangular parallelepiped shape in which a transducer mounting hole 51 in which the ultrasonic transducer 21 is disposed is formed in a rectangular through hole at a central portion. The holding member 46 has a flat surface on the side attached to the base 45, and a step portion 50 is formed on the inner surface facing the vibrator mounting hole 51 on the surface near the second cleaning liquid supply nozzle 34. . The vibration plate 22 is fitted to the stepped portion 50, and the ultrasonic vibrator 21 fixed to the vibration plate 22 is disposed in the vibrator mounting hole 51 so as to face the internal space 49. The plate 20 is held.

  The holding member 46 and the ultrasonic cleaning device vibration plate 20 held by the holding member 46 are in contact with the holding member 46 and the ultrasonic cleaning device vibration plate 20 further closer to the second cleaning liquid supply nozzle 34, and the fixing member 47. Provided. The fixing member 47 is made of, for example, stainless steel, and is a member having a substantially rectangular parallelepiped outer shape in which a communication hole 52 communicating with the internal space 43 of the second cleaning liquid supply nozzle 34 is formed at a central portion. . A taper that is inclined toward the diaphragm 22 is formed at the inner peripheral edge facing the communication hole 52 of the fixing member 47.

  A through hole for attaching the holding member 46 and the fixing member 47 to the base 45 is formed in a portion of the holding member 46 and the fixing member 47 stacked on the base 45. An internal thread portion is cut in a portion corresponding to the through hole of 46 and the fixing member 47. The fixing member 47 and the holding member 46 are attached to the base 45 by a bolt member 53 that is inserted through the through hole and screwed into the female screw portion of the base 45.

  At this time, the diaphragm 20 for an ultrasonic cleaning device is held stably because the diaphragm 22 is sandwiched and pressed between the holding member 46 and the fixing member 47. The ultrasonic vibrator 21 is only bonded and fixed to the diaphragm 22 with an adhesive, and is held by the holding member 46 via the diaphragm 22, and the holding member 46 and / or the fixing member. 47 so as not to be directly held and fixed by 47.

  The second cleaning liquid supply nozzle 34 has a female screw portion that is engraved in the fixing member 47 through a through-hole formed in the flange portion 54 in the flange portion 54 formed on the peripheral portion near the ultrasonic vibration applying means 35. It is attached to the fixing member 47, that is, the ultrasonic vibration applying means 35 by another bolt member 55 that is screwed onto the fixing member 47.

  The internal space 49 of the base 45 is sealed by the holding member 46 and the ultrasonic cleaning device diaphragm 20 held by the holding member 46, thereby forming a sealed space 49. A power supply member 48 for supplying power to the ultrasonic transducer 21 is provided in the sealed space 49. A pair of power supply members 48 are provided and each include an electrode portion 56 and a wire portion 57. The electrode part 56 is made of an elastic conductive material such as a copper alloy for springs, and the wire part 57 is made of a stretched material of oxygen-free copper, for example. The electrode portion 56 of one power supply member 48 elastically contacts the power supply portion of the ultrasonic transducer 21, and the electrode 56 of the other power supply member 48 elastically contacts the holding member 46, and the holding member 46 and the diaphragm 22 and the counter electrode of the ultrasonic transducer 21 through the adhesive. Note that an electrode portion is formed of a conductive metal such as gold (Au) or silver (Ag) on the power feeding portion of the ultrasonic vibrator 21. The power supply member 48 is supplied with high-frequency power for causing the ultrasonic transducer 21 to generate ultrasonic vibrations from an oscillation circuit (not shown) through the wire portion 57.

  In addition, by providing a seal member (not shown) at the contact portion between the base 45 and the holding member 46, the airtightness and liquid tightness of the sealed space 49 are improved. In the sealed space 49, an inert gas or dry air is supplied from a gas supply unit (not shown). By supplying inert gas or dry air to the sealed space 49, electrical contact between the power supply member 48 and the electrode surface of the ultrasonic transducer 21, and electrical contact between the power supply member 48 and the holding member 46 are ensured. The deterioration of these parts due to oxidation can be prevented. Furthermore, by keeping the pressure in the sealed space 49 higher than the pressure of the cleaning liquid 61 supplied to the second cleaning liquid supply nozzle 34 and sprayed outside the nozzle from the second nozzle hole 37, It is possible to prevent gas and liquid from entering from the outside.

Hereinafter, the operation of the ultrasonic cleaning device 30 will be briefly described.
The cleaning liquid is supplied from the cleaning liquid pipe 39 through the cleaning liquid supply port 38 to the internal space 43 of the second cleaning liquid supply nozzle 34. The cleaning liquid collides with the protruding piece 42 and flows in the direction of the diaphragm 20 for the ultrasonic cleaning device. At this time, power is supplied to the ultrasonic vibrator 21 of the diaphragm 20 for an ultrasonic cleaning device via the power supply member 48, and the ultrasonic vibrator 21 oscillates ultrasonic vibration. Accordingly, ultrasonic vibration is applied to the cleaning liquid that flows in the direction of the vibration plate 20 for the ultrasonic cleaning device.

  The cleaning liquid to which the ultrasonic vibration is applied is ejected from the second nozzle hole 37 of the second cleaning liquid supply nozzle 34 toward the back surface 31 b of the glass substrate 31 and is transported by the transport roller 33. The ultrasonic vibration is propagated to the glass substrate 31. At this time, the cleaning liquid 62 is also sprayed onto the cleaning surface 31a from the first cleaning liquid supply nozzle 32 disposed on the cleaning surface 31a side of the glass substrate 31. The cleaning liquid 61 ejected from the second cleaning liquid supply nozzle 34 propagates ultrasonic vibrations to the glass substrate 31, and further ultrasonically acts on the cleaning liquid 62 ejected from the first cleaning liquid supply nozzle 32 via the glass substrate 31. Propagate vibration.

  Accordingly, the glass substrate 31 is ultrasonically vibrated, and the cleaning liquid 62 sprayed from the first cleaning liquid supply nozzle 32 and flowing on the cleaning surface 31a of the glass substrate 31 is also ultrasonically vibrated. Dirt such as fine particles on the surface 31a can be easily removed, and the glass substrate 31 can be cleaned so as to significantly increase the cleanliness.

  As described above, in the present embodiment, the ultrasonic cleaning device 30 injects the cleaning liquid 61 to which the ultrasonic vibration oscillated from the ultrasonic vibrator 21 is applied on the back surface 31 b side of the liquid crystal glass substrate 31. Although the cleaning liquid 62 is separately sprayed from the first cleaning liquid supply nozzle 32 onto the cleaning surface 31a of the glass substrate 31, the present invention is not limited to this, and the reverse structure, that is, the ultrasonic vibration applying means is mounted. The second cleaning liquid supply nozzle may be disposed on the cleaning surface side of the glass substrate, and a cleaning liquid to which ultrasonic vibration is applied to the cleaning surface may be ejected. Also, a plurality of ultrasonic cleaning devices 20 can be prepared, and both surfaces of the glass substrate 31 can be cleaned simultaneously.

  Further, although the object to be cleaned is the glass substrate 31 for liquid crystal, it is not limited to this and may be a semiconductor wafer or the like. Furthermore, although the glass substrate 31 that is the object to be cleaned is configured to be conveyed in a horizontal state, the configuration is not limited thereto, and the glass substrate 31 may be configured to be conveyed in a vertical or inclined state with respect to a horizontal plane. . Further, the cleaning may be performed by spraying the cleaning liquid to which ultrasonic vibration is applied and the cleaning liquid to which ultrasonic vibration is not applied onto the same cleaning surface.

It is a bottom view which simplifies and shows the structure of the diaphragm 20 for ultrasonic cleaning apparatuses which is one Embodiment of this invention. It is sectional drawing seen from the cut surface line II-II of FIG. It is sectional drawing which simplifies and shows the structure of the ultrasonic cleaning apparatus 30 which is another embodiment of this invention. It is sectional drawing which simplifies and shows the structure of the conventional ultrasonic cleaning apparatus 1. It is an enlarged view of the diaphragm 6 for ultrasonic devices with which the ultrasonic cleaning apparatus 1 shown in FIG. 4 is equipped.

Explanation of symbols

20 Ultrasonic Cleaning Device Diaphragm 21 Ultrasonic Vibrator 22 Vibrating Plate 23 Thermosetting Adhesive 30 Ultrasonic Cleaning Device 31 Glass Substrate 32 First Cleaning Liquid Supply Nozzle 33 Conveying Means 34 Second Cleaning Liquid Supply Nozzle 35 Application of Ultrasonic Vibration means

Claims (9)

In the vibration plate for an ultrasonic cleaning device used in an ultrasonic cleaning device for cleaning by spraying a cleaning liquid to which ultrasonic vibration is applied to the substrate,
An ultrasonic vibrator that oscillates ultrasonic vibration;
Including a vibration plate through which ultrasonic vibrations oscillated by an ultrasonic vibrator are propagated,
When the thermal expansion coefficient of the diaphragm is α1, and the thermal expansion coefficient of the ultrasonic vibrator is α2,
A diaphragm for an ultrasonic cleaning device, wherein the following formula is established between a thermal expansion coefficient α1 of the diaphragm and a thermal expansion coefficient α2 of the ultrasonic vibrator.
α2−y ≦ α1 ≦ α2 + y
y = 1.7 × 10 ⁻⁶ / ° C. The diaphragm
2. The diaphragm for an ultrasonic cleaning device according to claim 1, wherein an electrolytic composite polishing treatment is performed in which electrolytic polishing and chemical polishing are combined and polished. The diaphragm
The diaphragm for an ultrasonic cleaning device according to claim 1 or 2, comprising a low thermal expansion alloy having a thermal expansion coefficient of 6.7 x ^10-6 / ° C or less. Low thermal expansion alloy
4. The diaphragm for an ultrasonic cleaning device according to claim 3, wherein the vibration plate has a composition consisting of Co: 52.5 to 55%, Cr: 9 to 10.5%, balance Fe and inevitable impurities. . Low thermal expansion alloy
4. The diaphragm for an ultrasonic cleaning device according to claim 3, wherein the vibration plate has a composition consisting of Ni: 34 to 37%, balance Fe and inevitable impurities. Low thermal expansion alloy
4. The diaphragm for an ultrasonic cleaning device according to claim 3, wherein the diaphragm is composed of Ni: 30 to 32%, Co: 4 to 6%, balance Fe and inevitable impurities. The ultrasonic transducer
The vibration plate for an ultrasonic cleaning device according to any one of claims 1 to 6, wherein the oscillation frequency is 400 kHz to 3 MHz.   An ultrasonic cleaning apparatus comprising the diaphragm for an ultrasonic cleaning apparatus according to any one of claims 1 to 7. A holding member for holding the diaphragm of the ultrasonic cleaning apparatus;
The ultrasonic cleaning apparatus according to claim 8, wherein the ultrasonic vibrator is held by a holding member via a vibration plate.

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