JP2006140359A - Interposer bonding method and electronic component manufactured using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an interposer bonding method that enables an interposer, having a semiconductor chip mounted thereon, to be physically and electrically connected to the surface of a base circuit sheet without fail, and to provide a high reliability electronic component manufactured by using the interposer bonding method. <P>SOLUTION: The interposer 10 bonding method implements an adhesive applying step of providing an adhesive disposing layer 25 comprising an insulating adhesive on the surface of a base-side terminal 22 on a base circuit sheet 20; an interposer-disposing step of disposing the interposer 10 such that the base side terminal 22 faces an interposer side terminal 12 via the adhesive disposing layer; and a pressure-pressing step of pressurizing the base circuit sheet 20 and the interposer 10 by using a pair of mutually facing press dies 30. A die 31 is provided with a projection 310, which projects towards another press die on the pressure surface that faces the back of the base side terminal 22. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component in which an interposer mounted with a semiconductor chip is bonded to the surface of a base circuit sheet.

  Conventionally, as a method for joining an interposer mounted with a semiconductor chip, for example, there is a method in which the interposer is adhesively joined with an insulating adhesive applied to the surface of a connection terminal of a base circuit sheet. In this joining method, for example, an insulating adhesive is applied in a pattern on the surface of the connection terminal of the base circuit sheet. That is, a portion where the insulating adhesive is applied and a portion where the insulating adhesive is not applied are formed on the surface of the connection terminal. And the interposer is adhesively bonded to the base circuit sheet by pressing the connection terminal of the interposer against the connection terminal of the base circuit sheet coated with the insulating adhesive in a pattern. In this interposer joining method, the physical connection between the connection terminals in the part abutting through the insulating adhesive, and the electrical connection between the connection terminals in the part abutting without interposing the insulating adhesive (See, for example, Patent Document 1)

  However, the conventional interposer joining method has the following problems. In other words, in the above-described interposer joining method, depending on the coating pattern of the insulating adhesive and the amount of coating, there is a risk that both physical connection and electrical connection between the connection terminals cannot be achieved. In the above-described interposer joining method, if the ratio of the portion covered with the insulating adhesive on the surface of the connection terminal is increased, the electrical connection may be insufficient although the physical connection is sufficient, On the other hand, if the proportion of the portion covered by the insulating adhesive is reduced, the physical connection, that is, the adhesive force becomes insufficient, and as a result, the electrical connection reliability may not be maintained high.

JP 2003-69216 A

  The present invention has been made in view of the above-described conventional problems, and an interposer joining method capable of physically and electrically connecting an interposer mounted with a semiconductor chip to a surface of a base circuit sheet with high reliability, and An object of the present invention is to provide a highly reliable electronic component manufactured using this bonding method.

According to a first aspect of the present invention, an interposer having a semiconductor chip mounted on a sheet-shaped chip holding member and having an interposer-side terminal that is a connection terminal extending from the semiconductor chip is formed on the surface of the sheet-shaped base member. In the joining method of the interposer that joins the base circuit sheet provided with the side terminals,
An adhesive application step of providing an adhesive disposition layer made of an insulating adhesive having electrical insulation on at least the surface of the base-side terminal in the base circuit sheet;
An interposer arrangement step of arranging the interposer on the surface of the base circuit sheet so that the base side terminal and the interposer side terminal face each other with the adhesive material arrangement layer interposed therebetween;
A pressure pressing step of pressing the base circuit sheet and the interposer using a pair of press dies facing each other;
At least one of the base member and the tip holding member is made of a plastic material, and at least one press die of the pair of press dies adjacent to the base member and the tip holding member made of the plastic material is: The interposer joining method is characterized in that a convex surface projecting toward the other press die is provided on the pressing surface facing the back surface of the interposer side terminal or the base side terminal (Claim 1). .

  The interposer joining method according to the first aspect of the present invention includes an adhesive application step of providing the adhesive material disposing layer on at least the surface of the base side terminal, and the base side terminal and the above through the adhesive material disposing layer. The interposer placement step of placing the interposer on the base circuit sheet so as to face the interposer-side terminal, and the base circuit sheet and the interposer are sandwiched using a pair of press dies facing each other. And a pressurizing and pressing step.

  Here, at least one of the base member and the chip holding member is made of a plastic material. Of the pair of press dies used in the pressure pressing step, the press die adjacent to the base member and the chip holding member made of the plastic material is the interposer side terminal or the base side terminal. On the pressing surface facing the back surface of the slab, there is a convex portion protruding toward the other press die.

  Therefore, in the pressure pressing step, the convex portion provided on the pressing surface of the press mold is used to replace at least one of the base member and the chip holding member with a plastic material from the interposer side terminal or It can press from the back surface of the said base side terminal. And with the said convex part, at least any one of the said interposer side terminal and the said base side terminal can be projectingly deformed toward the other. Therefore, the insulating adhesive is allowed to actively flow out from between the projecting deformed portion of at least one of the interposer-side terminal and the base-side terminal and the other connection terminal, so that the interposer-side terminal and the base The side terminal can be brought into direct contact. And in this state, an interposer side terminal and a base side terminal can be crimped | bonded by pinching and pressurizing a base circuit sheet and an interposer. Thereby, electrical connection between the base side terminal and the interposer side terminal can be realized with high reliability. On the other hand, in the non-projecting portion of the interposer side terminal or the base side terminal, the insulating adhesive remains as it is with the other connection terminal. Therefore, with this remaining insulating adhesive, physical connection between the interposer side terminal and the base side terminal, that is, adhesive bonding can be realized with high reliability.

  As described above, in the interposer joining method according to the first aspect of the present invention, at least one of the interposer-side terminal and the base-side terminal that face each other is pressed from the back surface by the press-shaped convex portion to project and deform. Give rise to Thus, the projecting deformed portion and the other connecting terminal facing each other can be brought into direct contact. Therefore, by interposing the interposer side terminal and the base side terminal facing each other through an insulating adhesive and applying pressure, the physical connection by the insulating adhesive and the electrical connection by the crimping of the connection terminals are performed. Connection can be realized at the same time.

According to a second aspect of the present invention, an interposer having an interposer side terminal which is a connection terminal extending from the semiconductor chip is mounted on a sheet-like chip holding member and electrically connected to the interposer side terminal. An electronic component in which a base side terminal that is a connection terminal is joined to a base circuit sheet provided on the surface of a sheet-like base member,
An electronic component manufactured by using the interposer joining method according to any one of claims 1 to 6 (claim 7).

The electronic component of the second invention is obtained by joining the interposer to the base circuit sheet by using the interposer joining method according to any one of claims 1 to 6. In this electronic component, the interposer-side terminal and the base-side terminal are crimped at the contact portion between the projecting and deformed portion of at least one of the interposer-side terminal and the base-side terminal and the other connection terminal, so that the electric Connection is realized with high certainty. On the other hand, in the part where the non-projecting part of the interposer side terminal or the base side terminal and the other connecting terminal face each other, the physical connection between the interposer side terminal and the base side terminal is made by the insulating adhesive in the gap. That is, adhesive bonding is realized with high reliability. For this reason, the electronic component has excellent quality in which the interposer is electrically and physically bonded to the base circuit sheet with high reliability.

  In the first invention, the chip holding member and the base member are made of synthetic resin such as PET film, PPS resin, PLA resin, general-purpose engineering plastic, metal material such as paper, non-woven fabric, aluminum foil, copper foil, It can be formed from a material such as glass. The material of the chip holding member and the material of the base member may be the same material combination or different material combinations. In particular, as the plastic material, materials such as PS, PC, PA, PP, and PPE (PET) can be used. Furthermore, as the insulating adhesive, hot melt, epoxy adhesive, acrylic adhesive, elastic adhesive, or the like can be used.

The insulating adhesive is thermoplastic, and the press die provided with the convex portion preferably includes a heater for heating the pressure surface. ).
In this case, the thermoplastic insulating adhesive can be transitioned to a high fluidity state by the amount of heat generated by the heater. Therefore, the insulating adhesive can flow out more reliably from the portion of the interposer-side terminal and the base-side terminal that are protruded and deformed by the convex portion.

  Furthermore, according to the said heater, the contact location with the part which carried out the projection deformation | transformation as mentioned above and the other connection terminal can be heated, and both can be thermocompression-bonded. According to thermocompression bonding, it is possible to further improve the bonding state where the interposer side terminal and the base side terminal are in direct contact. Therefore, the electrical connection state between the interposer side terminal and the base side terminal can be further ensured, and the good connection state can be maintained with high reliability over a long period of use.

The insulating adhesive is preferably a moisture-curing type (Claim 3).
The moisture-curable insulating adhesive is a reactive type that cures in the atmosphere. Therefore, when using a moisture curable adhesive as the insulating adhesive, the base circuit sheet subjected to the pressure pressing step and the interposer are stored, for example, in an indoor environment in a factory or a warehouse. In the meantime, the curing of the insulating adhesive can be promoted to further strengthen the bonding of the interposer.

Moreover, it is preferable that an ultrasonic vibration acts between the interposer side terminal and the base side terminal in the pressure pressing step.
In this case, the interposer side terminal and the base side terminal can be fused by ultrasonic vibration at a location where the interposer side terminal and the base side terminal directly contact each other. And according to this ultrasonic bonding, the electrical connection reliability between an interposer side terminal and a base side terminal can be further improved, and the durability can be further enhanced.

Moreover, it is preferable that the adhesive arrangement | positioning area | region which forms the said adhesive arrangement | positioning layer in the said adhesive application process includes the interposer arrangement | positioning area | region which arrange | positions the said interposer in the said interposer arrangement | positioning process.
In this case, the bonding strength of the interposer can be further improved by attaching the insulating adhesive over the entire surface of the interposer that faces the base circuit sheet. Furthermore, if the adhesive disposition area is formed so as to include the interposer disposition area, when the interposer and the base circuit sheet are clamped in the pressure pressing step, the excess insulating adhesive is removed from the outer periphery of the interposer. It sticks around the side. Thereby, the slope which consists of an insulating adhesive agent can be formed between the outer peripheral side surface of an interposer, and the surface of a base circuit sheet. Therefore, not only the surface of the interposer but also the interposer can be joined more firmly by the insulating adhesive attached to the outer peripheral side surface thereof.

Further, the base circuit sheet is formed by forming an antenna pattern for wireless communication made of a conductive pattern on the surface of the base member, and the interposer mounts an IC chip for RF-ID as the semiconductor chip. (Claim 6).
Here, RF-ID is an abbreviation for Radio-Frequency IDentification. When the RF-ID medium for non-contact ID in which the interposer is bonded to the surface of the base circuit sheet by the interposer bonding method according to the first aspect of the invention, the interposer and the base circuit sheet are physically separated. It is possible to manufacture a highly reliable and excellent quality product that is connected with high reliability and reliability electrically and efficiently. In particular, since the RF-ID media is required to reduce costs, the effect of the first invention excellent in production efficiency is particularly effective. It is also possible to produce an ID medium for contact ID.

Example 1
This example is an example relating to a joining method of an interposer 10 using an insulating adhesive and an electronic component 1 manufactured by using the joining method of the interposer 10. This will be described with reference to FIGS.
As shown in FIG. 1, the joining method of the interposer 10 of this example is that a semiconductor chip 11 is mounted on a sheet-like chip holding member 13 and an interposer-side terminal 12 that is a connection terminal extending from the semiconductor chip 11. The interposer 10 having the above is joined to a base circuit sheet 20 in which a base-side terminal 22 is provided on the surface of a sheet-like base member 21.
In this interposer 10 joining method, an adhesive coating step of providing an adhesive disposing layer 25 made of an insulating adhesive material having electrical insulation on at least the surface of the base side terminal 22 in the base circuit sheet 20, and a base side An interposer placement step of placing the interposer 10 on the surface of the base circuit sheet 20 so that the terminals 22 and the interposer side terminals 12 face each other with the adhesive material placement layer 25 interposed therebetween, and a pair of press dies facing each other 30 is used to perform a pressurizing press process for pressurizing the base circuit sheet 20 and the interposer 10.
Here, at least one of the base member 21 and the chip holding member 13 is made of a plastic material. One of the pair of press dies 30 adjacent to the one made of a plastic material among the base member 21 and the chip holding member 13 (in this example, the die 31) is the interposer side terminal 12 or the base side terminal 22. On the pressure surface facing the back surface of the plate, a convex portion 310 is provided that protrudes toward the other press die (in this example, the press anvil 32; see FIG. 6).
Hereinafter, this content will be described in detail.

  As shown in FIG. 1, the electronic component 1 manufactured using the joining method of the interposer 10 of this example is an RF-ID (Radio-Frequency IDentification) medium for non-contact ID (hereinafter, appropriately referred to as RF-ID medium 1). .) This RF-ID medium 1 is provided with an interposer 10 on which an IC chip for RF-ID (hereinafter referred to as an IC chip 11 as appropriate) is mounted as a semiconductor chip 11 and an antenna pattern 24 as the base circuit sheet 20. And an antenna sheet (hereinafter appropriately referred to as an antenna sheet 20). In addition, based on the joining method of the interposer of this example, ID media for contact ID can also be produced.

  As shown in FIGS. 1 and 2, the interposer 10 is obtained by mounting an IC chip 11 on the surface of a sheet-like chip holding member 13 having a thickness of 177 μm. In this example, the chip holding member 13 made of a material PSF film is formed in a predetermined size including the formation region of the pair of base side terminals 22 of the antenna sheet 20. On the surface of the chip holding member 13, a conductive pad (not shown) electrically connected to an electrode pad (not shown) of the IC chip 11, and an interposer-side terminal 12 extending from the conductive pad, A pair of conductive patterns including are provided. The conductive pattern on the surface of the chip holding member 13 is made of conductive ink.

  In addition to the PSF of this example, PC, processed paper, or the like can be used as the material of the chip holding member 13. Further, an underfill material, a potting material, or the like may be used to protect the electrical connection portion between the conductive pad and the electrode pad. Further, as a method of forming the conductive pattern of the chip holding member 13, instead of the method of printing the conductive ink of this example, copper etching, dispensing, metal foil pasting, direct metal vapor deposition, metal vapor deposition film transfer, conductive A method such as polymer layer formation is also good.

  As shown in FIGS. 1 and 2, the antenna sheet 20 is provided with an antenna pattern 24 in which conductive ink is printed in a predetermined pattern on the surface of a thermoplastic base member 21 made of material PET and having a thickness of 50 μm. . At both ends of the antenna pattern 24, base side terminals 22 that are electrically connected to the interposer side terminals 12 are provided. Similar to the conductive pattern formed on the chip holding member 13, instead of the antenna pattern 24 made of conductive ink, copper etching foil, dispense, metal foil pasting, direct metal deposition, metal deposition film transfer, conductive height The antenna pattern 24 can also be formed by a method such as molecular layer formation.

  As the material of the base member 21, PET-G, PC, PP, nylon, paper, etc. can be used in addition to the PET of this example. As the ink material for the conductive ink, silver, graphite, silver chloride, copper, nickel, or the like can be used.

  Next, a method for joining the interposer 10 mounted with the IC chip 11 to the surface of the antenna sheet 20 will be described. In the joining method of the interposer 10 of this example, as described above, an adhesive is applied to provide the adhesive disposing layer 25 of an insulating adhesive material having electrical insulation on at least the surface of the base side terminal 22 in the antenna sheet 20. A step (FIG. 4), an interposer placement step (FIG. 5) for placing the interposer 10 on the surface of the antenna sheet 20, and a process of applying pressure to the antenna sheet 30 and the interposer 10 using a pair of press dies 30 facing each other. A pressure pressing step (FIG. 6) is performed.

  In the adhesive application step, as shown in FIG. 3, an insulating adhesive is applied to the adhesive arrangement region 250 (see FIG. 3B) including the pair of base-side terminals 22 of the antenna sheet 20. To do. In this example, an adhesive having a thickness of 40 to 80 μm is disposed in an adhesive disposing area 250 including an interposer disposing area 150 (see FIG. 4C) in which the interposer 10 is disposed in a subsequent process, as shown in FIG. A layer 25 was provided. In this example, a thermoplastic and moisture-curing hot melt (model number TE-031 manufactured by 3M) was used as the insulating adhesive. In addition to the above, as the insulating adhesive, an epoxy adhesive, an acrylic adhesive, an elastic adhesive, a urethane adhesive, or the like can be used. Furthermore, instead of the moisture curable insulating adhesive, a reactive insulating adhesive such as thermosetting, ultraviolet curable, or electron beam curable can be used.

  Next, in the interposer arrangement step, as shown in FIGS. 3 and 5, a predetermined interposer arrangement in the antenna sheet 20 so that each base side terminal 22 of the antenna sheet 20 and each interposer side terminal 12 of the interposer 10 face each other. The interposer 10 is arranged in the area 150. Here, as described above, the adhesive placement region 250 of this example is formed so as to include the interposer placement region 150 as shown in FIG. Therefore, the interposer 10 faces the antenna sheet 20 through the insulating adhesive layer 25 over the entire surface.

Next, as shown in FIG. 6, a press pressing process is performed in which the antenna sheet 20 and the interposer 10 are sandwiched and pressed using a pair of press dies 30 facing each other. Of the pair of press dies 30 used in this step, the pressing surface of the die 31 that comes into contact with the base member 21 made of a thermoplastic material has a bowl-like shape at a position facing the back surface of each base-side terminal 22. It has three convex portions 310 formed in parallel. In this example, the protruding height hd of the convex portion 310 is set to 300 μm so that the protruding deformation portion 220 having the protruding height hs = about 50 μm can be formed on the base-side terminal 22. In addition, as protrusion height hs, it is preferable to form in 20-80 micrometers, and it is preferable to set the protrusion height hd in the range of 100-400 micrometers for that purpose. Furthermore, the protrusion height hd may be set to 260 to 300 μm so as to form a protrusion height hs of 30 to 40 μm.
On the other hand, the pressing surface of the press die 32 on the interposer 10 side (hereinafter referred to as a press anvil 32) is a substantially flat surface. In addition, the die 31 of this example is provided with a pressure surface so that the base member 21 made of a thermoplastic material can be easily deformed and the fluidity of the insulating adhesive of the adhesive disposing layer 25 is increased. A heater (not shown) for heating is equipped.

  As the shape of the convex portion 310 provided on the pressing surface of the die 31, convex portions having various shapes such as a dotted shape, a cross shape, and a comb shape can be formed instead of the saddle shape of this example. In this example, the convex portion 310 is provided on the die 31. Alternatively, the chip holding member 13 may be formed of a plastic material, and the convex portion may be provided on the pressure surface of the press anvil 32. Furthermore, the base member 21 and the chip holding member 13 can be formed of a plastic material, and convex portions can be provided on both the die 31 and the press anvil 32.

  And in this example, using the die 31 heated to a surface temperature of the pressure surface of 200 ° C., a state in which a pressing force of about 13.5 MPa is applied to the press anvil 32 is maintained for about 0.1 second. Thus, the antenna sheet 20 and the interposer 10 were pressurized. In this example, by applying the above-mentioned pressure between the die 31 and the press anvil 32, both the portions other than the convex portion 310 in the die 31 and the press anvil 32 are approximately 150 μm. Approached.

  According to the pressure pressing process described above, a part of each base side terminal 22 in the antenna sheet 20 can be protruded and deformed by the convex portion 310 of the die 31. That is, the hook-shaped projecting deformable portions 220 can be formed on the base-side terminals 22 corresponding to the convex portions 310 provided in parallel with the die 31 on the pressing surface. The antenna sheet 20 and the interposer 10 are in direct contact with each other via the hook-shaped projecting deformed portion 220, and a gap is formed between the antenna sheet 20 and the projecting deformed portion 220.

  Therefore, the insulating adhesive flows out between the protruding deformed portion 220 and the interposer side terminal 12, and the protruding deformed portion 220 is thermocompression bonded to the interposer side terminal 12. As a result, the electrical connection between the interposer side terminal 12 and the base side terminal 22 can be realized with high reliability. On the other hand, in the gap between the non-deformed portion 221 excluding the projecting deformed portion 220 in each base terminal 22 and the interposer-side terminal 12 facing each other, the insulating adhesive does not completely flow out, and an appropriate amount of the insulating adhesive remains as it is. Remains. Therefore, adhesive bonding between the interposer-side terminal 12 and the base-side terminal 22, that is, physical connection is realized with high reliability through the insulating adhesive remaining in the gap. Further, the interposer 10 faces the antenna sheet 20 through an insulating adhesive over the entire surface facing the antenna sheet 20. Therefore, the interposer 10 is firmly bonded to the antenna sheet 20 over the entire surface.

  In particular, in this example, as described above, the adhesive placement region 250 in the adhesive application step is formed so as to include the interposer placement region 150. Therefore, when the interposer 10 and the antenna sheet 20 are brought into contact with each other and pressed, excess insulating adhesive wraps around and adheres to the outer peripheral side surface of the interposer 10. As a result, not only the surface of the interposer 10 but also the outer peripheral side surface of the interposer 10 becomes an adhesive surface, and the interposer 10 is bonded to the antenna sheet 20 very firmly.

  Furthermore, in this example, the base member 21 is formed of a material having thermoplasticity, and a heater 31 is provided on the die 31 that is in contact with the base member 21. Therefore, by performing the pressure pressing step while heating the antenna sheet 20 using the die 31, the protruding deformed portion 220 can be efficiently formed by the convex portion 310 of the die 31. In addition, in this example, an insulating adhesive having thermoplasticity is used. Therefore, the fluidity of the insulating adhesive between the antenna sheet 20 and the interposer 10 can be increased by transmitting the heat generated by the heater to the insulating adhesive via the die 31. And an insulating adhesive agent can be made to flow out from between the protrusion deformation | transformation part 220 in the base side terminal 22, and the interposer side terminal 12 with high certainty, and electrical contact between both can be implement | achieved with high certainty.

  Furthermore, the insulating adhesive used in this example is a moisture-curing reaction type. Therefore, after performing the pressure pressing step, the joined state of the interposer 10 can be brought close to perfection during storage of the produced RF-ID media 1.

  In addition, while forming the chip | tip holding member 13 with a thermoplastic material, it is also good to form the convex part similar to the above also on the pressurization surface of the press anvil 32 by the side of the interposer 10. FIG. At this time, the formation shape of the convex portion of the press anvil 32 can be substantially matched with the formation shape of the convex portion of the die 31. In this case, the projecting deformed part 220 of the base side terminal 22 projecting and deformed by the projecting part on the die 31 side, and the projecting deforming part of the interposer side terminal 12 projecting and deformed by the projecting part on the press anvil 32 side, Each protruding vertex can be contacted. Furthermore, the formation shape of the convex part on the die 31 side and the convex part on the press anvil 32 side may be different. In this case, the projecting deformed portion of the interposer side terminal 12 and the projecting deformed portion of the base side terminal at a location where the forming position of the projecting portion on the die 31 side substantially coincides with the forming position of the projecting portion on the press anvil 32 side. Can be brought into contact with each other.

  In addition, the joining method of the interposer 10 of this example is not limited to manufacture of the RF-ID media 1, but is effective in production of various electronic components using the interposer 10. For example, it can be utilized in the manufacturing process of various electronic components such as FPC (flexible printed circuit board), paper computer, and disposable electrical products.

Furthermore, the pressurizing step may be performed using a press device equipped with an ultrasonic vibration unit. Where the interposer-side terminal 12 and the base-side terminal 22 are in direct contact, both can be fused by ultrasonic bonding, and the electrical connection reliability can be further improved. If the interposer-side terminal 12 and the base-side terminal 22 are joined by a combination of thermocompression bonding and fusion by ultrasonic bonding, an excellent electrical property between them can be obtained over a long period of use of the RF-ID media 1. Can maintain a stable connection state with high stability.

Furthermore, in this example, the adhesive arrangement area 250 is formed so as to include the interposer arrangement area 150. By reversing this inclusion relationship, the adhesive placement area 250 can be made smaller than the interposer placement area 150. Moreover, it is also possible to form the adhesive arrangement | positioning layer 25 independently with respect to each base side terminal 22, respectively.

Explanatory drawing which shows the mode of the pressurization process which joins an interposer and an antenna sheet | seat in Example 1. FIG. Sectional drawing which shows the cross-section of RF-ID media in Example 1 ((A) is sectional drawing which follows the longitudinal direction of an interposer. (B) is the sectional view on the AA line in (A).) . The perspective view which shows the relationship between the adhesive agent arrangement | positioning area | region and interposer arrangement | positioning area | region in the surface of an antenna sheet in Example 1. FIG. Sectional drawing ((A) is sectional drawing in alignment with the longitudinal direction of an interposer. (B) is the BB line in (A). A cross-sectional view taken along the arrow.). Sectional drawing which shows the cross-section of the antenna sheet which has arrange | positioned the interposer in Example 1 ((A) is sectional drawing which follows the longitudinal direction of an interposer. (B) is CC sectional view taken on line CC in (A). .) Sectional drawing ((A) is sectional drawing which follows the longitudinal direction of an interposer. (B) is DD in (A). FIG.

Explanation of symbols

1 Electronic components (RF-ID media)
10 Interposer 11 Semiconductor chip (IC chip)
12 Interposer side terminal 13 Chip holding member 20 Base circuit sheet (antenna sheet)
21 Base member 22 Base side terminal 24 Antenna pattern 220 Protruding deformation part 25 Adhesive arrangement layer 30 Press die 31 Die 310 Convex part 32 Press anvil

Claims (7)

A base in which a semiconductor chip is mounted on a sheet-like chip holding member and an interposer having an interposer-side terminal that is a connection terminal extending from the semiconductor chip is provided on the surface of the sheet-like base member. In the joining method of the interposer that joins to the circuit sheet,
An adhesive application step of providing an adhesive disposition layer made of an insulating adhesive having electrical insulation on at least the surface of the base-side terminal in the base circuit sheet;
An interposer arrangement step of arranging the interposer on the surface of the base circuit sheet so that the base side terminal and the interposer side terminal face each other with the adhesive material arrangement layer interposed therebetween;
A pressure pressing step of pressing the base circuit sheet and the interposer using a pair of press dies facing each other;
At least one of the base member and the tip holding member is made of a plastic material, and at least one press die of the pair of press dies adjacent to the base member and the tip holding member made of the plastic material is: A method of joining an interposer, characterized in that a convex surface protruding toward the other press die is provided on a pressing surface facing the back surface of the interposer side terminal or the base side terminal.   2. The insulating adhesive according to claim 1, wherein the insulating adhesive is thermoplastic, and the press die provided with the convex portion includes a heater for heating the pressure surface. Interposer joining method.   3. The interposer joining method according to claim 2, wherein the insulating adhesive is of a moisture curing type.   4. The interposer joining method according to claim 1, wherein in the pressure pressing step, ultrasonic vibration is applied between the interposer-side terminal and the base-side terminal.   5. The adhesive disposing region for forming the adhesive disposing layer in the adhesive applying step in any one of claims 1 to 4 includes an interposer disposing region for disposing the interposer in the interposer disposing step. An interposer joining method characterized in that:   The base circuit sheet according to any one of claims 1 to 5, wherein an antenna pattern for wireless communication made of a conductive pattern is formed on a surface of the base member, and the interposer is used as the semiconductor chip. An interposer joining method comprising mounting an IC chip for RF-ID. A base, which is a connection terminal for electrically connecting an interposer having an interposer side terminal which is a connection terminal extending from the semiconductor chip and is mounted on a sheet-like chip holding member. An electronic component in which side terminals are joined to a base circuit sheet provided on the surface of a sheet-like base member,
An electronic component manufactured using the interposer joining method according to claim 1.

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