JP2006039390A - Photoelectronic apparatus and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photoelectronic apparatus capable of easily maintaining the degree of freedom in design so that it can cope with a design change, and also, capable of coping with the production of a small quantity, but many kinds, and to provide a method for manufacturing the apparatus. <P>SOLUTION: The apparatus is provided with a light emitting element 20 for emitting light as a clock signal, a semiconductor chip 10 equipped with a light receiving part 11 for receiving the light, and an optical waveguide sheet 30 which has a core 30b whose outer circumference is covered with a crud 30a, and which is formed to a sheet-like shape and which sticks on the conductor chip 10, and regarding the optical waveguide sheet 30, the light emitted from the light emitting element 20 is made incident on the light incident part of the core 30b, and the light is divided into a plurality of beams at one or more Y-shaped branches S arranged on the core 30b, and then, guided, and an opening part P having inside wall surfaces which are inclined in the light guiding direction of the core 30b is arranged in a position where the divided light beams are separately coupled to the light receiving part 11, and the inside wall surfaces functioning as mirror surfaces (MRa and MRb) are constituted so as to reflect the light in a direction outside the surface of the optical waveguide sheet and so as to couple the light to the light receiving part 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optoelectronic device and a method for manufacturing the same, and more particularly, to an optoelectronic device having a configuration in which a light emitting element that emits light serving as a clock signal and a semiconductor chip having an electronic circuit including a light receiving portion are optically connected by an optical waveguide sheet. It relates to the manufacturing method.

The demand for downsizing, thinning, and weight reduction of portable electronic devices such as digital video cameras, digital mobile phones, and notebook personal computers is increasing. A reduction of 70% has been achieved in the year.
On the other hand, as a package form of a semiconductor device, it progresses from a lead insertion type such as DIP (Dual Inline Package) to a surface mounting type or flip chip mounting, and further, a semiconductor chip provided with an active element and a passive element. It has evolved into a complex form called packaged system-in-package (SiP).

As described above, the progress of semiconductor technology in recent years is remarkable, and the clock frequency has already exceeded the GHz order in the LSI world of CPU and high-speed logic.
The wiring of signals exceeding GHz has many problems that have not been a problem in the past, whether inside or outside the LSI. Solving these problems is very important for the further integration and speeding up of semiconductors in the near future. It has become an element.
These issues include signal distortion (Signal Integrity), frequency limits of electrical wiring, wiring loss, wiring delay, radiation from wiring, signal skew (skew), increased power consumption related to wiring driving, etc. It is.

  In particular, the skew (timing difference) of clocks supplied to LSI chips or different LSIs in recent years has been a problem. For example, the 1 GHz clock Idigit time is 500 ps, and the rise and fall times are about several tens ps to about 200 ps or less. On the other hand, in a general wiring on a dielectric of about ε = 4, the propagation speed of an approximate electric signal is 67 ps / cm, and reaches a region that cannot be ignored with respect to the rise time.

Therefore, many attempts have been made to suppress wiring skew by using completely equal length wiring on the mounting substrate or LSI, and distributing the clock to the wiring having the shape of the letter H called H-bar. .
When clock distribution is performed using these conventional electrical wirings, the wiring load is always driven at the clock frequency, and waveform shaping is also performed at each distribution point, resulting in increased power consumption. was there.

Therefore, in order to overcome the above problems, it has been proposed to distribute the clock using light for the wiring instead of the electric wiring using a metal such as aluminum or copper.
For example, Non-Patent Document 1 describes a technique for obtaining a wiring board having an optical clock tree by forming optical waveguides on a silicon substrate and processing them by a semiconductor process for each LSI using a mask. Yes.

However, in the method of sequentially forming a clock wiring layer by a semiconductor process on a substrate such as silicon or ceramic or organic substrate as described above, a design or mask corresponding to a specific LSI is manufactured and processed each time. There is a hassle of doing.
In addition, since all manufacturing processes are performed sequentially, the entire TAT is prolonged and there is a drawback that it is difficult to cope with small changes.
Shiou Lin Sam, Anantha Chandrakasan, and Duane Boning, Variation Issues in On-Chip Optical Clock Distribution, Sixth International Workshop on Statistical Methodologies for IC Processes, Devices, and Circuits, Kyoto, Japan, June, 2001.

  The problem to be solved is that it is difficult to maintain the degree of freedom of design so that it can cope with design changes, and it is difficult to cope with the production of a small variety of products. is there.

  The optoelectronic device according to the present invention includes a light emitting element that emits light serving as a clock signal, a semiconductor chip that includes a light receiving portion that receives the light, and a core that is coated with a clad and formed into a sheet shape. An optical waveguide sheet bonded to a chip, and the optical waveguide sheet is provided with one or more Y-shaped branches provided in the core when the light is incident on the light incident portion of the core from the light emitting element. An opening having an inner wall surface that is inclined with respect to the optical waveguide direction of the core is provided at a position where each of the divided light is guided to the light receiving unit. The inner wall surface is used as a mirror surface to reflect the light in an out-of-plane direction of the optical waveguide sheet and couple the light to the light receiving unit.

The above-described optoelectronic device according to the present invention includes a light emitting element that emits light serving as a clock signal, a semiconductor chip that includes a light receiving portion that receives light, a cladding that covers the outer periphery of the core, and is formed into a sheet shape. And an optical waveguide sheet bonded to the chip.
Here, the light waveguide sheet is divided into light that is incident on the light incident portion of the core from the light emitting element, and is divided into a plurality of light beams in one or more Y-shaped branches provided in the core. An opening having an inner wall surface that is inclined with respect to the optical waveguide direction of the core is provided at a position where each of the lights is coupled to the light receiving unit, and the inner wall surface serves as a mirror surface to reflect light in the out-of-plane direction of the optical waveguide sheet. Thus, it is configured to be coupled to the light receiving unit.

  The method of manufacturing an optoelectronic device according to the present invention includes: a light emitting element that emits light serving as a clock signal; a semiconductor chip that includes a light receiving portion that receives the light; A method of manufacturing an optoelectronic device having an optical waveguide sheet coupled to the light receiving unit at a position coupled to a light receiving unit, wherein a first cladding is formed on a dummy substrate, and one or more Y-shaped branches are provided. A core is formed on the first clad in a pattern in which the core is divided and guided, a second clad is formed so as to cover the core, and the outer periphery of the core is coated with the clad and formed into a sheet shape Forming an optical waveguide sheet, and at a position where the light is coupled to the light receiving portion with respect to the optical waveguide sheet, the optical waveguide sheet is inclined with respect to the optical waveguide direction of the core, and the light is guided to the optical waveguide sheet. Anti-plane direction of wave sheet Forming an opening having an inner wall surface serving as a mirror surface to be coupled to the light receiving portion, peeling the optical waveguide sheet from the dummy substrate, and positioning the optical waveguide sheet with respect to the light receiving portion. And a step of arranging and mounting the light emitting element so that light from the light emitting element is incident on a light incident portion of the core.

The method of manufacturing the optoelectronic device according to the present invention includes a light emitting element that emits light serving as a clock signal, a semiconductor chip that includes a light receiving unit that receives light, a light divided into a plurality of waveguides, and a light receiving unit. A method of manufacturing an optoelectronic device having an optical waveguide sheet coupled to a light receiving portion at a position coupled to a light receiving portion.
First, a first clad is formed on a dummy substrate, and a core is formed on the first clad with a pattern in which one or more Y-shaped branches are provided and light is divided into a plurality of waves, and the core is covered. Thus, the second clad is formed, and the optical waveguide sheet formed into a sheet shape is formed by covering the outer periphery of the core with the clad.
Next, at the position where the light is coupled to the light receiving portion with respect to the optical waveguide sheet, the optical waveguide sheet is inclined with respect to the optical waveguide direction of the core, and the light is reflected in the out-of-plane direction of the optical waveguide sheet and coupled to the light receiving portion An opening having an inner wall surface serving as a mirror surface is formed.
Next, the optical waveguide sheet is peeled from the dummy substrate, and the optical waveguide sheet is aligned with the light receiving portion and bonded to the semiconductor chip.
Next, the light emitting element is arranged and mounted at a predetermined position so that light from the light emitting element enters the light incident portion of the core.

  The optoelectronic device of the present invention is configured by laminating an optical waveguide sheet that distributes a clock and a semiconductor chip, and can easily maintain a degree of design flexibility that can cope with a design change. It can correspond to the production of varieties.

  The manufacturing method of the optoelectronic device of the present invention is formed by bonding an optical waveguide sheet that distributes a clock to a semiconductor chip, and can easily maintain a degree of freedom of design that can cope with a design change, It can be manufactured in response to the production of a small variety of products.

  Hereinafter, an optoelectronic device having a structure in which a light emitting element that emits light serving as a clock signal according to the present invention and a semiconductor chip having an electronic circuit including a light receiving portion are optically connected by an optical waveguide sheet, and a method for manufacturing the same are implemented. Will be described with reference to the drawings.

First Embodiment FIG. 1A is a schematic sectional view of an optoelectronic device according to this embodiment, and FIG. 1B is a plan view.
A light emitting element 20 that emits light serving as a clock signal, such as a semiconductor laser diode, is mounted on the surface of the semiconductor chip 10, and the outer periphery of a core 30 b that extends in a stripe shape in the optical waveguide direction on the surface of the semiconductor chip 10. An optical waveguide sheet 30 that is formed into a sheet by covering with a clad 30 a is bonded to the semiconductor chip 10 by an adhesive layer 31.
The semiconductor chip 10 is formed with an electronic circuit including a light receiving portion 11 such as a photodiode.
The light emitting element 20 is mounted on the semiconductor chip 10 so as to be connected to the pads of the semiconductor chip 10 via the bumps 21.

The optical waveguide sheet 30 has one or more (seven in the drawing) Y-shaped branches S provided on the core, in which light is incident from the light emitting element 20 from the side surface of the optical waveguide sheet 30 to the light incident portion of the core 30b. The light is divided into a plurality of pieces (eight in the drawing) and guided.
The Y-shaped branch S is a branch point where the core is patterned so that one waveguide is branched into two and the angle formed by the two waveguide directions after the branch is 180 ° or less. .
The waveguide directions before and after branching may be bent with a curvature within a range in which bending loss can be suppressed to some extent.
The semiconductor chip 10 is provided with a plurality of light receiving parts 11, and each of the divided lights is coupled to the light receiving part 11 so that the light divided in the optical waveguide sheet 30 is coupled to each light receiving part 11. An opening P having an inner wall surface that is inclined with respect to the optical waveguide direction of the core 30b is provided at the coupling position, and the inner wall surface serves as a mirror surface (MRa, MRb) to transmit light in the out-of-plane direction of the optical waveguide sheet 30. It is configured to be reflected and coupled to the light receiving unit 11.
The inclination of the inner wall surface of the opening P is, for example, about 45 ° with respect to the optical waveguide direction of the core 30b. The direction in which the mirror surfaces (MRa, MRb) are inclined differs depending on the difference in the extending direction of the core.
The optical waveguide sheet is transparent to the wavelength of light to be used, and for example, an organic material such as polyimide resin, polyolefin resin, polynorbornene resin, acrylic resin, epoxy resin, or fluoride thereof can be used. .

  The light receiving unit 11 of the semiconductor chip 10 is composed of a photodiode or the like. Further, for example, an amplifier is provided on the semiconductor chip 10 in the vicinity thereof, and demodulates the clock signal of the incident light into an electrical clock signal.

  Further, a pad opening 30p that penetrates the optical waveguide sheet 30 and the adhesive layer 31 is formed so as to open the pad of the semiconductor chip 10. The pad opening 30p penetrating the optical waveguide sheet 30 is formed only in a region where light is not guided.

In the optical waveguide sheet 30 of the above-described optoelectronic device, the distance for guiding the light from the position of the light incident portion of the core 30b to the position where each of the lights is coupled to the light receiving portion 11 is divided into a plurality of wavelengths. It is preferable that the distances are equal in the route.
As described above, by making the optical wiring for supplying the clock a completely equal length wiring, it is possible to substantially suppress the skew when the clock signal is distributed to the plurality of light receiving units 11.

  According to the optoelectronic device according to the above-described embodiment, the optical waveguide sheet for distributing the clock and the semiconductor chip are bonded to each other, and it is easy to maintain a degree of freedom of design that can cope with a design change. It is possible and can cope with the production of a small variety of products. In particular, by using a completely equal length wiring for the optical wiring for supplying the clock, it is possible to substantially suppress the skew when the clock signal is distributed to the plurality of light receiving portions.

Next, a method for manufacturing the optoelectronic device according to this embodiment will be described.
About a semiconductor chip and a light emitting element, it can manufacture using a conventionally known process.
As a method for forming the optical waveguide sheet, first, as shown in FIG. 2A, a titanium layer and a copper layer are formed on the surface of a dummy substrate 40 made of silicon or glass by, for example, electron beam evaporation or sputtering. A laminated body of layers is formed as a release layer 41. Alternatively, the peeling layer 41 can be formed by forming a silicon oxide layer by a CVD (Chemical Vapor Deposition) method or a sputtering method. In this case, the dummy substrate 40 uses silicon or the like.

  Next, as shown in FIG. 2B, for example, a resin layer having a first refractive index such as polyimide resin is formed by spin coating or printing, and is cured by curing to form the first cladding 30a. .

Next, as shown in FIG. 2C, a photosensitive resin layer having a second refractive index higher than the first refractive index, such as photosensitive polyimide, is formed, and exposure is performed using a patterning mask. Then, development and curing are further performed to form the core 30b.
In order to simplify the mounting, assuming multimode propagation, the thickness and width of the core 30b are about 5 to 50 μm, and the thickness of the clad 30a is about 1/4 to 1/2 of the core 30b.

Next, as shown in FIG. 3A, in the same manner as described above, a resin layer having a first refractive index such as polyimide resin is formed by, for example, spin coating or printing, and heat reflow is performed as necessary. Curing is performed and cured to form the first cladding 30a.
In this way, the optical waveguide sheet 30 formed into a sheet shape is formed by covering the outer periphery of the core 30b with the clad 30a.
FIG. 3B shows a cross section parallel to the extending direction of the core in the state of FIG. 3A, which is a cross section in a direction orthogonal to FIG. 3A, and the subsequent steps are cross sections in this direction. Follow along.

Next, as shown in FIG. 4A, a resist film R1 having a pattern opening at a position where light is coupled to the light receiving portion is formed on the optical waveguide sheet 30 by a photolithography process, and the resist film R1 is used as a mask. Then, the optical waveguide sheet 30 is inclined obliquely (for example, about 45 °), and anisotropic etching such as RIE (reactive ion etching) is performed. As a result, the mirror surface MRa has an inclination (for example, about 45 °) with respect to the optical waveguide direction of the core 30b and reflects the guided light in the out-of-plane direction of the optical waveguide sheet 30 and couples it to the light receiving portion. An opening P having an inner wall surface is formed.
After this step, the resist film R1 is peeled off.

Next, as shown in FIG. 4B, a pattern that opens the position where the light is coupled to the light receiving portion in a portion where the core extending direction is different from the opening portion P having the inner wall surface serving as the mirror surface MRa. The resist film R2 is patterned by a photolithography process, and the resist film R2 is used as a mask to incline obliquely (for example, about 45 °) with respect to the optical waveguide sheet 30, and anisotropic such as RIE (reactive ion etching). Etching is performed. Thus, the inner wall surface serving as the mirror surface MRb having an inclination (for example, about 45 °) with respect to the optical waveguide direction of the core 30b is provided in a direction different from the opening P having the inner wall surface serving as the mirror surface MRa. Opening P is formed.
After this step, the resist film R2 is peeled off.

Next, as shown in FIG.4 (c), the thermal peeling sheet 50 which has adhesiveness and can peel at a specific temperature is bonded together on the surface of the optical waveguide sheet 30. Next, as shown in FIG.
For example, this thermal release sheet is configured by dispersing foamed capsules in an adhesive on a PET film. For example, River Alpha manufactured by Nitto Denko Corporation can be used. For example, the PET film can be easily removed by heating to 70 ° C. to 150 ° C.

Next, as shown in FIG. 5A, for example, when a laminate of a titanium layer and a copper layer is used as the release layer 41, the optical waveguide supported by the thermal release sheet 50 in an acid such as hydrochloric acid. The sheet 30 is immersed and peeled at the interface between the peeling layer 41 and the clad 30 a of the optical waveguide sheet 30.
Alternatively, when a silicon oxide layer is used as the release layer 41, the optical waveguide sheet 30 supported by the thermal release sheet 50 is immersed in an acid such as hydrofluoric acid or buffered hydrofluoric acid, and the release layer 41. And the optical waveguide sheet 30 is peeled off.

  Next, as shown in FIG. 5B, an opening is formed on the semiconductor chip 10 having the light receiving portion 11 formed in advance on the surface via an adhesive sheet (adhesive layer) 31 that is transparent to the wavelength of light to be used. The optical waveguide sheet 30 is bonded together while aligning the position of the mirror surface (MRa, MRb) of the part P and the position of the light receiving part 11.

Next, as shown in FIG. 5C, the heat release sheet 50 is peeled off, and the optical waveguide sheet 30 is transferred onto the semiconductor chip 10.
Thereafter, pad openings (not shown) penetrating the optical waveguide sheet 30 and the adhesive layer 31 are formed so as to open the pads of the semiconductor chip 10 as necessary. For this purpose, a pad is formed in advance on the semiconductor chip 10 side, and the opening can be made by irradiating laser light such as CO ₂ laser or excimer laser. At this time, the pad serves as a laser beam stopper.

Next, as shown in FIG. 6A and FIG. 6B, bumps 21 such as gold bumps are formed in advance on the light emitting element 20 such as a laser diode, for example, by wire bonding or the like. The optical waveguide sheet 30 is mounted on the bonding surface. In the drawing, an opening having an inner wall surface serving as a mirror surface is not shown.
Here, solder 22 is precoated on the mounting portion of the semiconductor chip 10 by a printing method or the like, and the light emitting portion of the light emitting element 20 and the light incident portion of the core are mounted while being aligned. At this time, by using a head having a heater, melting the solder while heating, holding the time until cooling after turning off the heater switch, and then opening the heater, the mounting accuracy can be improved. .

The height of the gold bump 21 and the precoat thickness of the solder 22 are determined by the position of the core of the optical waveguide sheet to be aligned.
Since the gold bumps 21 are not melted, the bumps 21 function as spacers, and the height of the light emitting element 20 can be determined by the height of the bumps 21, and a constant high accuracy can be ensured.

  In addition, as a method of mounting the light emitting element 20, a bump in which a copper core is coated with solder is formed on the light emitting element side, a solder precoat is formed on the semiconductor chip side, and mounted by a plip chip. Alternatively, it is possible to use a method in which a spacer is formed on one of the semiconductor chips by nickel plating or the like and mounted with a solder chip or solder precoat with a plip chip.

  According to the manufacturing method of the optoelectronic device according to the above-described embodiment, the optical waveguide sheet that distributes the clock and the semiconductor chip are bonded to each other, and the degree of design flexibility that can cope with the design change is maintained. Is easily possible, and can be manufactured in correspondence with the production of a small variety of products. In particular, by using a completely equal length wiring for the optical wiring for supplying the clock, it is possible to substantially suppress the skew when the clock signal is distributed to the plurality of light receiving portions.

Furthermore, the optical waveguide sheet that distributes the light to be the clock signal formed as described above can always produce a large amount of the base film, and can be mirrored by post-processing at any place. Since an opening having an inner wall surface can be formed, even if the design of the LSI itself is changed, it is possible to deal with various types of LSIs each time.
As a result, it is possible to develop an LSI that suppresses the skew by suppressing the manufacturing cost and shortening the development period and TAT.

  In the above-described method for manufacturing an optoelectronic device according to the present embodiment, an example in which an optical waveguide sheet as a base is manufactured on a dummy substrate such as silicon by a sequential process has been shown. There is also a method of preparing and preparing the core material by batch coating and patterning, for example, using a Roll to Roll process. By doing so, a significant cost reduction can be realized.

Second Embodiment FIG. 7 is a schematic sectional view of an optoelectronic device according to a second embodiment of the present invention.
The semiconductor chip 10 to which the optical waveguide sheet 30 is bonded and the light emitting element 20 are mounted on the intermediate substrate 60, and light from the light emitting element 20 enters the core from the side surface of the optical waveguide sheet 30. Other than this, the second embodiment is substantially the same as the first embodiment.

That is, a light emitting element 20 that emits light serving as a clock signal, such as a semiconductor laser diode, is mounted on the surface of the semiconductor chip 10, and the outer periphery of the core 30b extending in a stripe shape in the optical waveguide direction is clad 30a on this surface. An optical waveguide sheet 30 that is covered and formed into a sheet shape is bonded to the semiconductor chip 10 by an adhesive layer 31.
The semiconductor chip 10 is formed with an electronic circuit including a light receiving portion 11 such as a photodiode.
In addition, a pad opening that penetrates the optical waveguide sheet 30 and the adhesive layer 31 is formed so as to open the pad of the semiconductor chip 10, and a bump 12 is formed so as to be connected to the pad.

The optical waveguide sheet 30 is affixed to the intermediate substrate 60 in which the first resin layer 61, the second resin layer 62, and the third resin layer 63 are laminated and the interface pattern and the wiring pattern 64 are formed so as to penetrate these. The combined semiconductor chip 10 is mounted via bumps 12.
In addition, the light emitting element 20 is mounted on the same surface as the semiconductor chip 10 mounting surface of the intermediate substrate 60.
Bumps 65 are formed on the surface of the intermediate substrate 60 opposite to the surface on which the semiconductor chip 10 is mounted, and are used by being mounted on a further mounting substrate.

  As the intermediate substrate 60, any type of organic wiring substrate such as a so-called FR-4 substrate, FR-5 substrate, BT-resin substrate, or polyimide substrate, or a ceramic wiring substrate such as alumina or glass ceramic can be used.

  On the other hand, a laser diode that serves as a light source for an optical clock, for example, is mounted close to the end of an optical waveguide sheet so that light can be efficiently incident on the core of the optical waveguide. It is mounted on the intermediate board 60 in the vicinity.

  According to the optoelectronic device according to the above-described embodiment, the optical waveguide sheet for distributing the clock and the semiconductor chip are bonded to each other, and it is easy to maintain a degree of freedom of design that can cope with a design change. It is possible and can cope with the production of a small variety of products. In particular, by using a completely equal length wiring for the optical wiring for supplying the clock, it is possible to substantially suppress the skew when the clock signal is distributed to the plurality of light receiving portions.

Third Embodiment FIG. 8 is a schematic sectional view of an optoelectronic device according to a second embodiment of the present invention.
A plurality of semiconductor chips (10a, 10b) are bonded to the optical waveguide sheet 30 and mounted on the intermediate substrate 60. In addition, the light emitting element 20 is also mounted on the intermediate substrate 60, and the light from the light emitting element 20 is incident on the core from the side surface of the optical waveguide sheet 30, and the rest is substantially the same as in the first embodiment. It is the same.

In the optoelectronic device of this embodiment, each of the plurality of semiconductor chips is provided with a light receiving portion, and the light divided in the optical waveguide sheet can be coupled to each light receiving portion.
Further, a plurality of light receiving portions may be provided in part or all of the plurality of semiconductor chips, and the light divided in the optical waveguide sheet may be coupled to each light receiving portion.
For example, a plurality of light receiving portions 11a are formed on the first semiconductor chip 10a, and are optically coupled by mirror surfaces (MRa, MRb) provided on the optical waveguide sheet.
On the other hand, a plurality of light receiving portions 11b are formed on the second semiconductor chip 10b, and are optically coupled by mirror surfaces (MRc, MRd) provided on the optical waveguide sheet.

  Further, for example, the reliability of the optoelectronic device can be improved by providing the light emitting element 20 with the radiator 23 and the structure having the thermal via TV penetrating the intermediate substrate.

  The optical waveguide sheet is held with the light emitting side as the upper surface, and the semiconductor chips are sequentially mounted through the adhesive sheet while aligning the positions of the emitting part and the light receiving part on the semiconductor chip, and further to the pads of the semiconductor chip It can manufacture by providing the opening part for mounting and mounting in an intermediate board via a bump.

  According to the optoelectronic device according to the above-described embodiment, the optical waveguide sheet for distributing the clock and the semiconductor chip are bonded to each other, and it is easy to maintain a degree of freedom of design that can cope with a design change. It is possible and can cope with the production of a small variety of products. In particular, by using a completely equal length wiring for the optical wiring for supplying the clock, it is possible to substantially suppress the skew when the clock signal is distributed to the plurality of light receiving portions.

According to the optoelectronic device of each of the above embodiments, the problem of clock skew when a semiconductor chip is increased in speed is solved, and malfunction can be prevented. In addition, the conventional design method requires a considerable amount of time. This eliminates the need for hard-working clock timing analysis and significantly shortens the design and development period.
Further, as in the manufacturing method of the optoelectronic device of each embodiment, by separately producing an optical waveguide sheet, it is significantly faster and cheaper than the case where the optical waveguide is formed on the semiconductor chip each time as in the conventional case. A clock supply mechanism can be realized.
It is possible to respond flexibly to changes in the design of semiconductor chips, etc., and the convenience and reusability in the development and prototyping stage of a small quantity and a wide variety are very high.

  The optoelectronic device of this embodiment is a computer device, particularly a game computer, a network server, a home server, a brain of a robot, etc., which requires a large capacity and high-speed signal processing, such as an MPU or an image processing processor, a high-speed cache memory, etc. It can be used for a signal processing LSI.

The present invention is not limited to the above description.
For example, as a semiconductor chip bonded to the optical waveguide sheet, SiP (system gin package type semiconductor device) can be used. For example, a semiconductor chip having an active element such as a transistor, an inductance, a capacitor, or an electric resistance element A package in combination with a passive element such as can be used.
As the optical device incorporated in the SiP, a light emitting diode or the like can be used in addition to a laser diode.
In addition, various modifications can be made without departing from the scope of the present invention.

  The optoelectronic device of the present invention can be applied to an optoelectronic device having a configuration in which a light emitting element that emits light serving as a clock signal and a semiconductor chip having an electronic circuit including a light receiving portion are optically connected by an optical waveguide sheet.

  The method of manufacturing an optoelectronic device according to the present invention manufactures an optoelectronic device having a configuration in which a light emitting element that emits light serving as a clock signal and a semiconductor chip having an electronic circuit including a light receiving portion are optically connected by an optical waveguide sheet. Applicable to.

FIG. 1A is a schematic cross-sectional view of the optoelectronic device according to the first embodiment of the present invention, and FIG. 1B is a plan view. 2A to 2C are cross-sectional views illustrating manufacturing steps of the method of manufacturing the optoelectronic device according to the first embodiment of the present invention. FIG. 3A and FIG. 3B are cross-sectional views showing the manufacturing process of the optoelectronic device manufacturing method according to the first embodiment of the present invention. 4A to 4C are cross-sectional views illustrating manufacturing steps of the method for manufacturing the optoelectronic device according to the first embodiment of the present invention. 5A to 5C are cross-sectional views showing manufacturing steps of the method for manufacturing the optoelectronic device according to the first embodiment of the present invention. 6 (a) and 6 (b) are cross-sectional views showing the manufacturing process of the optoelectronic device manufacturing method according to the first embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of an optoelectronic device according to a second embodiment of the present invention. FIG. 8 is a schematic cross-sectional view of an optoelectronic device according to a third embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Semiconductor chip 11, 11a, 11b ... Light-receiving part, 12 ... Bump, 20 ... Light emitting element, 21 ... Bump, 22 ... Solder, 23 ... Radiator, 30 ... Optical waveguide sheet, 30a ... Cladding, 30b ... Core, 30 ... Pad opening, 31 ... Adhesive layer, 40 ... Dummy substrate, 41 ... Release layer, 50 ... Heat release sheet, 60 ... Intermediate substrate, 61 ... First resin layer, 62 ... Second resin layer, 63 ... First 3 resin layers, 64 ... wiring 64, 65 ... bump, R1, R2 ... resist film, L ... light, P ... opening, MRa, MRb, MRc, MRd ... mirror surface, S ... Y-shaped branch, TV ... thermal Beer

Claims (16)

A light emitting element that emits light as a clock signal;
A semiconductor chip including a light receiving portion for receiving the light;
The outer periphery of the core is coated with a clad, formed into a sheet shape, and an optical waveguide sheet bonded to the semiconductor chip,
The optical waveguide sheet is
The light is incident from the light emitting element on the light incident portion of the core,
In one or more Y-shaped branches provided in the core, the light is divided into a plurality of waveguides,
An opening having an inner wall surface that is inclined with respect to the optical waveguide direction of the core is provided at a position where each of the divided lights is coupled to the light receiving unit, and the inner wall surface serves as a mirror surface to transmit the light. An optoelectronic device that reflects in the out-of-plane direction of the optical waveguide sheet and is coupled to the light receiving unit. In the optical waveguide sheet, the distance for guiding the light from the position of the light incident portion of the core to the position where each of the lights is coupled to the light receiving portion is divided into a plurality of paths to be guided. The optoelectronic device according to claim 1, wherein the distances are equal. The optoelectronic device according to claim 1, wherein the inner wall surface of the opening is inclined by about 45 ° with respect to the optical waveguide direction of the core. A plurality of the light receiving portions are provided in the semiconductor chip;
The optoelectronic device according to claim 1, wherein the light divided in the optical waveguide sheet is coupled to each light receiving unit. A plurality of semiconductor chips as the semiconductor chip;
The optoelectronic device according to claim 1, wherein the light divided in the optical waveguide sheet is coupled to each light receiving portion provided in each of the plurality of semiconductor chips. A plurality of light receiving portions are provided in part or all of the plurality of semiconductor chips,
The optoelectronic device according to claim 5, wherein the light divided in the optical waveguide sheet is coupled to each light receiving unit. The light emitting element is mounted on the surface of the semiconductor chip on the side where the optical waveguide sheet is bonded,
The optoelectronic device according to claim 1, wherein light from the light emitting element is incident on the core from a side surface of the optical waveguide sheet. The semiconductor chip to which the optical waveguide sheet is bonded, and the light emitting element are mounted on an intermediate substrate,
The optoelectronic device according to claim 1, wherein light from the light emitting element is incident on the core from a side surface of the optical waveguide sheet. The optoelectronic device according to claim 8, wherein a plurality of the semiconductor chips are bonded to the optical waveguide sheet and mounted on the intermediate substrate. A light emitting element that emits light serving as a clock signal, a semiconductor chip that includes a light receiving unit that receives the light, and a waveguide that divides the light into a plurality of parts and is coupled to the light receiving unit. A method of manufacturing an optoelectronic device having an optical waveguide sheet to be coupled,
A first clad is formed on a dummy substrate, a core is formed on the first clad in a pattern in which one or more Y-shaped branches are provided and light is divided into a plurality of waveguides, and the core is covered Forming a second clad so that the outer periphery of the core is covered with the clad and forming a sheet-shaped optical waveguide sheet;
The optical waveguide sheet has an inclination with respect to the optical waveguide direction of the core at a position where the light is coupled to the light receiving unit, and reflects the light in an out-of-plane direction of the optical waveguide sheet. Forming an opening having an inner wall surface serving as a mirror surface to be coupled to the light receiving portion;
Peeling the optical waveguide sheet from the dummy substrate;
Aligning the optical waveguide sheet with the light receiving portion and bonding the semiconductor waveguide to the semiconductor chip;
Arranging and mounting the light emitting element so that light from the light emitting element is incident on a light incident portion of the core. In the step of forming the optical waveguide sheet, a distance for guiding the light from a position of the light incident portion of the core to a position where each of the lights is coupled to the light receiving portion is divided into a plurality of waveguides. The method of manufacturing an optoelectronic device according to claim 10, wherein the distances are equal to each other. Before the step of forming the optical waveguide sheet on the dummy substrate, further comprising the step of forming a release layer on the surface of the dummy substrate,
In the step of forming the optical waveguide sheet, it is formed on the release layer,
The method of manufacturing an optoelectronic device according to claim 10, wherein in the step of peeling the optical waveguide sheet from the dummy substrate, peeling is performed at an interface between the optical waveguide sheet and the peeling layer. The method for manufacturing an optoelectronic device according to claim 12, wherein the release layer is a laminate of a titanium layer and a copper layer or a silicon oxide layer. The method of manufacturing an optoelectronic device according to claim 10, wherein in the step of forming the opening, the inner wall surface of the opening is formed to be inclined by about 45 ° with respect to the optical waveguide direction of the core. In the step of mounting the light emitting element, on the surface of the semiconductor chip on the side where the optical waveguide sheet is bonded, so that light from the light emitting element is incident on the core from the side surface of the optical waveguide sheet, The method for manufacturing an optoelectronic device according to claim 10, wherein the light emitting element is mounted. Further comprising the step of mounting the semiconductor chip on which the optical waveguide sheet is bonded to an intermediate substrate;
The photoelectron according to claim 10, wherein in the step of mounting the light emitting element, the light emitting element is mounted on the intermediate substrate so that light from the light emitting element is incident on the core from a side surface of the optical waveguide sheet. Device manufacturing method.

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