JP2006094444A - Fixing structure of solid-state imaging device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To fix a CCD to a CCD support plate without making the parallelism of the CCD abutment surface and CCD rear surface of the support plate wrong. <P>SOLUTION: In the CCD support plate 1 having the CCD abutment surface 2a abutting on the rear surface of the CCD 10, a CCD fixing hole 6 extending from the CCD abutment surface 2a through to its opposite surface is provided. The rear surface of the CCD 10 is abutted directly on the CCD abutment surface 2a of the CCD support plate 1, and an adhesive 11 is charged into the CCD fixing hole 6 from the side of the opposite surface of the support plate 1 to adhere a part corresponding to the inside of the fixing hole 6 at the rear surface of the CCD to the support plate 1 in the fixed hole 6. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a structure for fixing a solid-state image sensor to an image sensor support member.

  The digital camera has an imaging lens and a solid-state imaging device disposed therein, and a phase grating type optical system that controls light that is taken in by the imaging lens and incident on the solid-state imaging device in front of the solid-state imaging device. The low-pass filter is arranged.

  In this digital camera, the solid-state image sensor is fixed to an image sensor support member having an image sensor abutting surface that abuts a rear surface, that is, a surface opposite to the image sensing surface (see Patent Document 1), and the image sensor. The support member is mounted by being attached to a support member fixing portion provided at a predetermined position with respect to the imaging lens.

The solid-state image sensor is fixed to the image sensor support member by conventionally bonding the rear surface of the solid-state image sensor to the image sensor contact surface of the image sensor support member with an adhesive.
JP-A-6-58810

  By the way, in a digital camera, since the degree of perpendicularity of the imaging surface of the solid-state imaging device with respect to the optical axis of the imaging lens greatly affects the imaging performance, the solid-state imaging device is made high within a very small tilt error range of ± 30 μm or less. It is necessary to implement with accuracy.

  Therefore, when the support member is attached to the fixing portion, the image pickup device support member has the image pickup surface of the solid-state image pickup device fixed to the image pickup device contact surface perpendicular to the optical axis of the image pickup lens. Thus, it is manufactured with high dimensional accuracy.

  However, conventionally, since the rear surface of the solid-state image sensor is bonded to the image sensor contact surface of the image sensor support member with an adhesive, the image sensor contact surface of the support member due to uneven application of the adhesive or the like And the parallelism of the rear surface of the solid-state image pickup device bonded to the image pickup device contact surface, and for this purpose, the image pickup surface of the solid-state image pickup device mounted with the image pickup device supporting member attached to the fixing portion. In some cases, the tilt error exceeds the allowable range (± 30 μm).

  The present invention provides a solid-state image pickup device capable of fixing a solid-state image pickup device to an image pickup device support member without causing any deviation in the parallelism between the image pickup device contact surface of the support member and the rear surface of the solid-state image pickup device. The purpose is to provide a fixed structure.

  In the solid-state image sensor fixing structure according to the present invention, an image sensor fixing hole that penetrates from the image sensor contact surface to the opposite surface is provided in an image sensor support member having an image sensor contact surface that contacts the rear surface of the solid-state image sensor. The back surface of the solid-state image sensor is directly brought into contact with the image sensor contact surface of the support member, the adhesive is filled into the fixing hole from the opposite surface side of the support member, and the rear surface of the solid-state image sensor is A portion corresponding to the inside of the fixing hole is bonded to the support member in the fixing hole.

  In the solid-state image sensor fixing structure according to the present invention, it is desirable that a concave or convex portion be provided on the peripheral surface of the image sensor fixing hole of the image sensor support member.

  The concave portion or convex portion on the peripheral surface of the imaging element fixing hole is preferably provided along the circumferential direction of the imaging element fixing hole, and in that case, the concave portion or convex portion is more preferably provided in a spiral shape. .

  In the solid-state image sensor fixing structure according to the present invention, the image sensor fixing hole of the image sensor support member has a shape in which the hole width on the opposite surface side is larger than the hole width on the image sensor contact surface side of the support member. It may be formed.

  In that case, it is preferable that the image sensor fixing hole is a stepped hole in which a step is formed between the hole on the image sensor contact surface side and the hole on the opposite surface side.

  In the solid-state image sensor fixing structure according to the present invention, an image sensor fixing hole that penetrates from the image sensor contact surface to the opposite surface is provided in an image sensor support member having an image sensor contact surface that contacts the rear surface of the solid-state image sensor. The back surface of the solid-state image sensor is directly brought into contact with the image sensor contact surface of the support member, the adhesive is filled into the fixing hole from the opposite surface side of the support member, and the rear surface of the solid-state image sensor is Since the portion corresponding to the inside of the fixed hole is bonded to the support member in the fixed hole, the solid-state image sensor is attached to the support member, the image sensor contact surface of the support member, and the rear surface of the solid-state image sensor. It is possible to fix without causing any deviation in the parallelism.

  In the solid-state image sensor fixing structure according to the present invention, it is desirable to provide a concave or convex portion on the peripheral surface of the image sensor fixing hole of the image sensor support member. The fixing strength of the element can be increased.

  It is preferable that the concave portion or the convex portion on the peripheral surface of the imaging element fixing hole is provided along the circumferential direction of the imaging element fixing hole, and in this way, the fixing strength of the solid-state imaging element with respect to the support member is increased. Can be higher.

  In that case, it is more preferable to provide the concave portion or the convex portion in a spiral shape, and by doing so, the fixing strength of the solid-state imaging device with respect to the support member can be further increased.

  In the solid-state image sensor fixing structure according to the present invention, the image sensor fixing hole of the image sensor support member has a shape in which the hole width on the opposite surface side is larger than the hole width on the image sensor contact surface side of the support member. It may be formed, and by doing so, the fixing strength of the solid-state imaging device with respect to the support member can be increased.

  In that case, it is preferable that the image sensor fixing hole is a stepped hole in which a step is formed between the hole on the image sensor contact surface side and the hole on the opposite surface side. Thus, the fixing strength of the solid-state imaging device with respect to the support member can be sufficiently increased.

  1 to 3 show a first embodiment of the present invention. FIG. 1 is a perspective view of an image sensor support member and a solid-state image sensor. FIGS. 2 and 3 show a solid-state image sensor on the image sensor support member. It is the perspective view and sectional drawing of the fixed state.

  In this embodiment, a solid-state image pickup device (hereinafter referred to as CCD) 10 is fixed to a plate-like image pickup device support member 1, and the image pickup device support member 1 is made of a metal plate processed by sheet metal. Hereinafter, the imaging element support member 1 is referred to as a CCD support plate.

  The CCD support plate 1 is attached to both ends of a flat plate portion 2 having one surface (the lower surface in FIGS. 1 to 3) as a CCD abutting surface 2a. 3b is formed, and one of these attachment portions 3a and 3b is provided with a positioning hole 4 that fits into a plate positioning protrusion provided in the support plate fixing portion, and both attachment portions 3a and 3b. A screw insertion hole 5 for screwing the support plate fixing portion is provided.

  A CCD fixing hole 6 penetrating from the CCD contact surface 2a to the opposite surface (the lower surface in FIGS. 1 to 3) is provided at the center of the flat plate portion 2 of the CCD support plate 1. The CCD fixing hole 6 is a straight cylindrical circular hole, and a groove-like recess 7 is provided on the circumferential surface thereof along the circumferential direction.

  In this embodiment, the concave portion 7 is provided in a spiral shape over the entire circumference of the fixed hole 6 by tapping the peripheral surface of the CCD fixed hole 6.

  When the CCD support plate 1 is attached to a support plate fixing portion in the digital camera, the imaging surface of the CCD 10 fixed to the CCD contact surface 2a is the optical of the imaging lens of the digital camera. It is manufactured with high dimensional accuracy so as to be perpendicular to the axis.

  In the CCD fixing structure of this embodiment, as shown in FIGS. 2 and 3, the CCD abutting surface 2a of the flat plate portion 2 of the CCD support plate 1 is placed on the rear surface of the CCD 10 (the surface opposite to the imaging surface). ) Is directly contacted, and the adhesive 11 is filled into the CCD fixing hole 6 from the opposite surface side of the support plate 1 and is cured, whereby the CCD fixing hole 6 on the rear surface of the CCD 10 is cured. The CCD 10 is fixed to the support plate 1 by adhering a portion corresponding to 1 to the support plate 1 in the fixing hole 6.

  According to this CCD fixing structure, the CCD 10 can be fixed to the support plate 1 without causing any deviation in the parallelism between the CCD contact surface 2a of the support plate 1 and the rear surface of the CCD 10.

  That is, when the rear surface of the CCD 10 is bonded to the CCD contact surface 2a of the CCD support plate 1 with an adhesive as in the conventional CCD fixing structure, the CCD contact surface of the support plate 1 due to uneven application of the adhesive or the like. There is an error in the parallelism between 2a and the rear surface of the CCD 10 bonded to the CCD contact surface 2a.

  On the other hand, in the CCD fixing structure of the above embodiment, the CCD contact surface 2a of the CCD support plate 1 and the rear surface of the CCD 10 are directly contacted without interposing an adhesive therebetween, and are provided on the support plate 1. In the CCD fixing hole 6, the rear surface of the CCD 10 is bonded to the support plate 1 by the adhesive 11 filled in the fixing hole 6, so that the CCD contact surface 2 a of the support plate 1 and the rear surface of the CCD 10 are There is no upset in parallelism.

  Therefore, by attaching the CCD support plate 1 to which the CCD 10 is fixed by this CCD fixing structure to the support plate fixing portion in the digital camera, the CCD 10 can be mounted with almost no inclination error of its imaging surface.

  Further, in this CCD fixing structure, since the concave portion 7 is provided on the peripheral surface of the CCD fixing hole 6 of the CCD support plate 1, the fixing strength of the CCD 10 with respect to the support plate 1 can be increased.

  That is, the CCD fixing structure is obtained by bonding the rear surface of the CCD 10 and the support plate 1 with the adhesive 11 in the CCD fixing hole 6 of the CCD support plate 1. Therefore, the fixing strength of the CCD 10 with respect to the support plate 1 is as follows. The strength according to the hole width, that is, the diameter of the CCD fixing hole 6 and the peripheral surface height of the CCD fixing hole 6.

  Among them, since the CCD fixing hole 6 can be drilled to an arbitrary size, by increasing the CCD fixing hole 6 to some extent, the bonding area between the rear surface of the CCD 10 and the adhesive 11 is increased. Adhesive strength can be sufficiently secured. The diameter of the CCD fixing hole 6 is about 2 to 3 mm.

  On the other hand, the peripheral surface height of the CCD fixing hole 6 is determined by the thickness of the CCD support plate 1. If the thickness of the support plate 1 is about 0.5 mm or more, it adheres to the peripheral surface of the CCD fixing hole 6. The adhesion area with the agent 11 can be increased and sufficient adhesion strength can be ensured. However, if the thickness of the CCD support plate 1 is reduced in order to reduce the thickness of the digital camera, the CCD fixing hole is accordingly increased. The adhesion area between the peripheral surface 6 and the adhesive 11 is reduced.

  However, in the CCD fixing structure of this embodiment, since the concave portion 7 is provided on the peripheral surface of the CCD fixing hole 6, the periphery of the CCD fixing hole 6 is compared with the case where the peripheral surface of the fixing hole 6 is a straight cylindrical surface. Therefore, even if the thickness of the CCD support plate 1 is reduced to, for example, about 0.1 to 0.3 mm, it can be bonded to the peripheral surface of the CCD fixing hole 6. Adhesive strength with the agent 11 can be sufficiently ensured, and the peripheral surface of the CCD fixing hole 6 and the adhesive 11 are further bonded by entering the adhesive 11 into the recess 7 on the peripheral surface of the CCD fixing hole 6. Thus, the CCD 10 can be strongly fixed to the CCD support plate 1.

  In addition, in this embodiment, since the groove-shaped recess 7 is provided along the circumferential direction of the fixing hole 6 on the peripheral surface of the CCD fixing hole 6, the peripheral surface of the fixing hole 6 and the adhesive 11 are provided. And the fixing strength of the CCD 10 with respect to the CCD support plate 1 can be further increased.

  Further, in this embodiment, since the concave portion 7 is provided in a spiral shape, the shrinkage force at the time of curing of the adhesive 11 filled in the CCD fixing hole 6 acts like a screwing force, and the CCD support plate The fixing strength of the CCD 10 with respect to 1 can be further increased.

  In the above embodiment, the concave portion 7 is provided on the peripheral surface of the CCD fixing hole 6 of the CCD support plate 1, but a convex portion may be provided on the peripheral surface of the CCD fixing hole 6 instead. In addition, sufficient adhesion strength between the peripheral surface of the CCD fixing hole 6 and the adhesive 11 is ensured, and the convex portion of the peripheral surface of the CCD fixing hole 6 enters the adhesive 11 so as to surround the CCD fixing hole 6. By fixing the surface and the adhesive 11 more strongly, the fixing strength of the CCD 10 to the CCD support plate 1 can be increased.

  4 and 5 show a second embodiment of the present invention. FIG. 4 is a perspective view of a CCD support plate, and FIG. 5 is a cross-sectional view of a state where the CCD is fixed to the CCD support plate. 4 and 5, the same components as those in the first embodiment described above are denoted by the same reference numerals, and the description thereof is omitted.

  In this CCD fixing structure, the CCD fixing hole 6 of the CCD support plate 1 is shaped so that the hole width (diameter) on the opposite surface side is larger than the hole width (diameter) on the CCD contact surface 2a side of the CCD support plate 1. In this embodiment, the CCD fixing hole 6 is formed on the opposite side of the support plate 1 and the circular hole 6a having a diameter of about 2 to 3 mm formed on the CCD contact surface 2a side. A circular hole 6b having a diameter of, for example, about 4 to 5 mm larger than the formed circular hole 6a on the CCD contact surface 2a side, and an annular step 8 formed between the circular holes 6a and 6b, and It is a stepped hole consisting of

  Similarly to the CCD fixing structure of the first embodiment, the CCD fixing structure of this embodiment also has a CCD abutting surface 2a of the flat plate portion 2 of the CCD support plate 1 on the rear surface of the CCD 10 (on the side opposite to the imaging surface). The CCD fixing hole on the rear surface of the CCD 10 is cured by directly abutting the surface of the support plate 1 and filling the CCD fixing hole 6 with the adhesive 11 from the opposite side of the support plate 1 and curing the adhesive 11. 6, a portion corresponding to the inside of the fixing plate 6 is bonded to the supporting plate 1 in the fixing hole 6, and the CCD 10 is fixed to the supporting plate 1. The parallelism between the CCD contact surface 2a and the rear surface of the CCD 10 can be fixed without causing any deviation.

  In the CCD fixing structure of this embodiment, the CCD fixing hole 6 of the CCD support plate 1 is divided into a small circular hole 6a on the CCD contact surface 2a side and a large circular hole 6b on the opposite surface side. Since the stepped hole is formed with a stepped portion 8 therebetween, even if the thickness of the CCD support plate 1 is reduced to, for example, about 0.1 to 0.3 mm, the peripheral surface of the CCD fixing hole 6 The adhesion area between the adhesive 11 and the adhesive 11 is increased to ensure a sufficient adhesion strength between the peripheral surface of the CCD fixing hole 6 and the adhesive 11 and filled into the CCD fixing hole 6 composed of the stepped holes. With the adhesive 11, the rear surface of the CCD 10 can be fixed to the CCD support plate 1 with the same fixing force as riveting, so that the fixing strength of the CCD 10 with respect to the CCD support plate 1 is sufficiently increased. Can.

  In this embodiment, the CCD fixing hole 6 of the CCD support plate 1 is a stepped hole. The CCD fixing hole 6 is, for example, from the CCD contact surface 2a side of the support plate 1 toward the opposite surface side. The CCD fixing hole 6 may be a tapered hole having a large diameter. If the hole width (diameter) on the opposite surface side is larger than the hole width (diameter) on the CCD contact surface 2a side, the CCD is fixed. The fixing strength of the CCD 10 with respect to the support plate 1 can be increased.

  In the first and second embodiments described above, the CCD fixing hole 6 of the CCD support plate 1 is a circular hole. However, the CCD fixing hole 6 may be a square hole.

  Furthermore, in the above embodiment, the CCD 10 is fixed to the CCD support plate 1 made of a metal plate. However, if the CCD support member has a CCD contact surface that contacts the rear surface of the CCD 10, for example, synthetic resin molding Goods may be used.

1 is a perspective view of an image sensor support member and a solid-state image sensor showing a first embodiment of the present invention. FIG. Similarly, the perspective view of the state which fixed the solid-state image sensor to the image sensor support member. Sectional drawing of the state which similarly fixed the solid-state image sensor to the image sensor support member. The perspective view of the image pick-up element support member which shows the 2nd Example of this invention. Sectional drawing of the state which similarly fixed the solid-state image sensor to the image sensor support member.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... CCD support plate (imaging element support member), 2 ... Flat plate part, 2a ... CCD contact surface, 3a, 3b ... Mounting part, 6 ... CCD fixing hole, 7 ... Recessed part, 8 ... Step part, 10 ... CCD ( Solid-state imaging device), 11 ... adhesive.

Claims (6)

In the fixing structure of the solid-state image sensor to the image sensor support member,
An image sensor support member having an image sensor contact surface that contacts the rear surface of the solid-state image sensor is provided with an image sensor fixing hole penetrating from the image sensor contact surface to the opposite surface thereof. A rear surface of the solid-state imaging device is directly brought into contact with a surface, an adhesive is filled into the fixing hole from the opposite surface side of the support member, and a portion corresponding to the fixing hole on the rear surface of the solid-state imaging device is A solid-state imaging element fixing structure, wherein the fixing member is adhered to the support member in a fixing hole.   The solid-state image sensor fixing structure according to claim 1, wherein a concave portion or a convex portion is provided on a peripheral surface of the image sensor fixing hole of the image sensor support member.   The solid-state image sensor fixing structure according to claim 2, wherein the concave portion or the convex portion is provided along a circumferential direction of the image sensor fixing hole.   The solid image pickup device fixing structure according to claim 3, wherein the concave portion or the convex portion is provided in a spiral shape.   The solid-state image sensor fixing device according to claim 1, wherein the image sensor fixing hole of the image sensor support member is formed in a shape having a hole width on the opposite surface side larger than the hole width on the image sensor contact surface side. Construction.   6. The solid-state image pickup device according to claim 5, wherein the image pickup device fixing hole is a stepped hole in which a step portion is formed between the hole portion on the image pickup element contact surface side and the hole portion on the opposite surface side. Fixed structure.

Images