JP2005306952A - Epoxy resin composition as sealing material for light-emitting element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which can give a cured product very good in heat resistance and light resistance and excellent in colorlessness and transparency and more particularly to provide an epoxy resin composition as a sealing material for an LED which emits short-wavelength light. <P>SOLUTION: The epoxy resin composition essentially consists of the following components (A) and (B): (A) an epoxy resin prepared by formulating 20 to 95 mass% hydrogenated epoxy resin obtained by directly hydrogenating an aromatic epoxy resin and having a degree of hydrogenation of aromatic rings of 90 to 100% with 5 to 80 mass% triazine-ring-containing epoxy resin and (B) an acid anhydride curing agent. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  TECHNICAL FIELD The present invention relates to an epoxy resin composition for a light emitting device sealing material, in which an epoxy resin comprising a hydrogenated epoxy resin and a triazine ring-containing epoxy resin and an acid anhydride curing agent are blended, and the cured product is heat resistant. Epoxy resin for light-emitting device encapsulant that is useful as an encapsulant for LEDs that emit light with a short wavelength, because it has excellent properties, light resistance, and adhesion, and can be used in applications related to optical semiconductors such as LEDs and CCDs. Relates to the composition.

  Epoxy resins are excellent in heat resistance, adhesion, water resistance, mechanical strength, electrical properties, etc., so they are used in various fields such as adhesives, paints, materials for civil engineering and construction, insulating materials for electrical and electronic parts, etc. in use. Normal temperature or heat-curing type epoxy resins used in such fields include fragrance such as diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, phenol or cresol novolac type epoxy resin. Group epoxy resins are common.

  In recent years, most of light emitting devices such as optical semiconductors (LEDs) that have been put to practical use in various display panels, image reading light sources, traffic signals, large display units, and the like are manufactured by resin sealing. The sealing resin used in such an apparatus generally contains the above aromatic epoxy resin and an alicyclic acid anhydride as a curing agent.

  Also, due to the dramatic progress of today's LEDs, high output and short wavelength of LED elements are rapidly becoming a reality, especially LEDs using nitride semiconductors have a short wavelength and high output light emission. Is possible. However, when an LED element using a nitride semiconductor is sealed with the above-described aromatic epoxy resin, the aromatic ring absorbs light of a short wavelength, so that the resin sealed over time deteriorates, and light emission occurs due to yellowing. There arises a problem that the luminance is significantly reduced.

Therefore, an LED sealed with an alicyclic epoxy resin obtained by oxidizing a cyclic olefin, represented by 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, has been proposed. (Patent Document 1, Patent Document 2).
However, the cured resin encapsulated with the above alicyclic epoxy resin is very fragile, easily cracked by the thermal cycle, and extremely poor in moisture resistance, so it is not suitable for applications that require long-term reliability. there were.

  In view of this, an LED has been proposed in which a hydrogenated bisphenol A type epoxy resin is the main component, an alicyclic epoxy resin and a phosphorus antioxidant are blended, and sealed with a methylhexahydrophthalic anhydride curing agent (Patent Literature). 3). Although this epoxy cured product is excellent in colorless and transparent properties, it has a drawback that it tends to yellow due to a decrease in heat resistance, and there is a problem in applications for sealing LED elements that require heat resistance.

  Furthermore, a method using a triazine derivative epoxy resin alone and an acid anhydride curing agent has also been proposed (Patent Document 4). Although the heat resistance of this cured product is improved, it is very brittle, so that it is easy to cause crack fracture by the thermal cycle as in the case of the alicyclic epoxy resin, and the moisture resistance is extremely bad. It was unsuitable for the required use.

  Therefore, a solution for the fundamental problem of the LED encapsulant that can obtain a colorless and transparent cured product, is excellent in heat resistance and adhesion, and improves the brittleness of the epoxy cured product has been awaited.

JP-A-9-213997 JP 2000-196151 A JP 2003-12896 A JP 2003-224305 A

  The present invention does not have the problems of heat resistance and brittleness as described above, can give a cured product having excellent colorless transparency, and is particularly useful as a sealing material for LEDs emitting short-wavelength light. An object of the present invention is to provide an epoxy resin composition for an element sealing material.

  The present invention includes the following inventions.

(1) Component (A): 20 to 95% by mass of a hydrogenated epoxy resin having an aromatic ring hydrogenation ratio of 90 to 100% obtained by directly hydrogenating an aromatic epoxy resin, and 5 to 80% by mass of a triazine ring-containing epoxy resin %, And an epoxy resin (B) component containing 0 to 50% by mass of an alicyclic epoxy resin obtained by epoxidizing an alicyclic olefin; an acid anhydride curing agent (C) component; a curing accelerator (A) An epoxy resin composition for a light emitting device sealing material, comprising the components (B) and (C).

  (2) The hydrogenated epoxy resin in component (A) is one or more selected from epoxy resins obtained by directly hydrogenating an epoxy resin selected from bisphenol A type epoxy resin, bisphenol F type epoxy resin and biphenol type epoxy resin The epoxy resin composition for a light-emitting device sealing material according to (1), wherein the epoxy resin composition is a hydrogenated epoxy resin.

  (3) The epoxy resin composition for light-emitting element sealing materials according to (1) or (2), wherein the triazine ring-containing epoxy resin in the component (A) is triglycidyl isocyanurate.

  (4) The acid anhydride curing agent of component (B) is hexahydrophthalic anhydride and / or methyl hexahydrophthalic anhydride, and the curing accelerator of component (C) is a tertiary amine and salts thereof, imidazole Any one of the above (1) to (3), characterized in that it is at least one type of curing accelerator selected from the group consisting of salts and salts thereof, organic phosphine compounds and salts thereof, and organic acid metal salts. The epoxy resin composition for light emitting element sealing materials of description.

  (5) In the epoxy resin of the component (A), an alicyclic epoxy resin obtained by epoxidizing an alicyclic olefin is blended in a proportion of 5 to 50% by mass, The epoxy resin composition for light emitting element sealing materials of any one of 1)-(4).

  (6) The above-mentioned composition comprising 0.01 to 10 parts by mass of at least one antioxidant selected from a phenolic antioxidant, a sulfurous antioxidant and a phosphorus antioxidant, and / or an ultraviolet absorber. The epoxy resin composition for a light-emitting element sealing material according to any one of (1) to (5).

  (7) The light-emitting device according to any one of (1) to (6), wherein the light-emitting device is a light-emitting device whose light-emitting layer has a main light emission peak at 350 to 550 nm. Epoxy resin composition for fastening materials.

  (8) The epoxy resin composition for a light-emitting element sealing material according to any one of (1) to (7), wherein the light-emitting element is a light-emitting diode (LED).

  The cured product of the epoxy resin composition for a light emitting device sealing material of the present invention is excellent in heat resistance and adhesion, and also has excellent light resistance, and therefore encapsulates a group III nitride compound semiconductor that emits light of a short wavelength. It can be used particularly advantageously as an epoxy resin composition for an LED sealing material.

(Hydrogenated epoxy resin)
The hydrogenated epoxy resin in the component (A) of the epoxy resin composition for a light emitting device sealing material of the present invention is an epoxy resin obtained by hydrogenating an aromatic epoxy resin. Examples of this epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, 3,3 ′, 5,5′-tetramethyl-4,4′-biphenol type epoxy resin, or 4,4′-biphenol type. Biphenol type epoxy resin such as epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolac type epoxy resin, naphthalenediol type epoxy resin, trisphenylol methane type epoxy resin, tetrakisphenylol ethane type epoxy resin And an epoxy resin obtained by hydrogenating an aromatic ring of a phenol dicyclopentadiene novolac type epoxy resin. Among these, hydrogenated epoxy resins obtained by directly hydrogenating the aromatic rings of bisphenol A type epoxy resin, bisphenol F type epoxy resin and biphenol type epoxy resin are particularly preferable in that an epoxy resin having a high hydrogenation rate can be obtained.

  The hydrogenation rate of the hydrogenated epoxy resin in the epoxy resin composition of the present invention can be measured by determining the change in absorbance (wavelength; 275 nm) using a spectrophotometer. The hydrogenation rate of the hydrogenated epoxy resin of the present invention is preferably in the range of 90 to 100%, more preferably in the range of 95 to 100%. When the hydrogenation rate is less than 90%, when a nitride semiconductor LED is encapsulated, it absorbs light of a short wavelength and the resin deteriorates with time, and the emission luminance is significantly reduced due to yellowing, which is preferable. Absent.

The hydrogenated epoxy resin used in the epoxy resin composition for a light emitting device sealing material of the present invention can be obtained by selectively hydrogenating the aromatic ring of an aromatic epoxy resin by a known method in the presence of a catalyst. An example of a more preferable reaction method is a method in which an aromatic epoxy resin is dissolved in an organic solvent, and an aromatic ring is selectively hydrogenated in the presence of a catalyst in which rhodium or ruthenium is supported on graphite. Graphite used as the surface area is supported on a carrier in the range of 10m ² / g~400m ² / g. The reaction is carried out within a range of pressure 1-30 MPa, temperature 30-150 ° C., and time 0.5-20 hours. After completion of the reaction, the catalyst is removed by filtration, and the organic solvent is distilled off under reduced pressure until it substantially disappears to obtain a hydrogenated epoxy resin.

(Triazine ring-containing epoxy resin)
Examples of the triazine ring-containing epoxy resin in the component (A) of the epoxy resin composition for a light emitting device sealing material of the present invention include triglycidyl isocyanurate, tris (α-methylglycidyl) isosinurate, tris (β-methylglycidyl) Examples thereof include isocyanurate and the like. Among these, triglycidyl isosinurate is preferable.

  The ratio of the hydrogenated epoxy resin and the triazine ring-containing epoxy resin is 5 to 80% by mass of the triazine ring-containing epoxy resin with respect to 20 to 95% by mass of the hydrogenated epoxy resin. If the triazine ring-containing epoxy resin is less than 5% by mass, the effect of improving the heat resistance is insufficient, and if it exceeds 80% by mass, the brittleness becomes brittle.

  Furthermore, an alicyclic epoxy resin obtained by epoxidizing an alicyclic olefin can be used together in a hydrogenated epoxy resin and a triazine ring-containing epoxy resin at 5 to 50% by mass. A particularly preferred alicyclic epoxy resin is 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate. When this alicyclic epoxy resin is blended, the blending viscosity of the epoxy resin composition can be lowered. Can be improved.

(Acid anhydride curing agent)
The acid anhydride curing agent in the epoxy resin composition for a light emitting device sealing material of the present invention is preferably an acid anhydride curing agent having no carbon-carbon double bond in the molecule. Specifically, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, hydrogenated nadic anhydride, hydrogenated methyl nadic anhydride, hydrogenated trialkylhexahydrophthalic anhydride, 2,4-diethylglutaric anhydride, etc. Is mentioned. Among these, hexahydrophthalic anhydride and / or methyl hexahydrophthalic anhydride are particularly preferable in that they are excellent in heat resistance and a colorless cured product can be obtained.

  Although the usage-amount of an acid anhydride hardening | curing agent changes with the epoxy equivalent of an epoxy resin, Preferably it mix | blends in 40-200 mass parts with respect to 100 mass parts of epoxy resins.

(Curing accelerator)
A curing accelerator can be used in the epoxy resin composition for a light emitting device sealing material of the present invention for the purpose of accelerating the curing reaction between the epoxy resin and the acid anhydride. Examples of curing accelerators include tertiary amines and salts thereof, imidazoles and salts thereof, organic phosphine compounds, zinc octylates, tin octylates and other organic acid metal salts, and particularly preferred curing accelerators are Organic phosphine compounds. The mixing ratio of the curing accelerator to be added is in the range of 0.01 to 10 parts by mass with respect to 100 parts by mass of the hydrogenated anhydride curing agent. Outside this range, the balance of heat resistance and moisture resistance of the cured epoxy resin is deteriorated, which is not preferable.

(Antioxidant)
By blending an antioxidant in the epoxy resin composition for an LED sealing material of the present invention, it is preferable to prevent oxidative deterioration during heating and to obtain a cured product with little coloring. The antioxidant which can be used can use a phenol type, sulfur type, and phosphorus type antioxidant, and 0.01-10 mass parts is mix | blended in 100 mass parts of epoxy resin compositions. Specific examples of the antioxidant that can be used include the following antioxidants.

<Monophenols>
2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-t-butyl-p-ethylphenol, stearyl-β- (3,5-di-t-butyl-4 -Hydroxyphenyl) propionate and the like.
<Bisphenols>
2,2′-methylenebis (4-methyl-6-tert-butylphenol), 2,2′-methylenebis (4-ethyl-6-tert-butylphenol), 4,4′-thiobis (3-methyl-6-t) -Butylphenol), 4,4′-butylidenebis (3-methyl-6-tert-butylphenol), 3,9-bis [1,1-dimethyl-2- {β- (3-tert-butyl-4-hydroxy-) 5-methylphenyl) propionyloxy} ethyl] 2,4,8,10-tetraoxaspiro [5,5] undecane and the like.

<Polymer type phenols>
1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5-trimethyl-2,4,6-tris (3,5-di-tert-butyl) -4-hydroxybenzyl) benzene, tetrakis- [methylene-3- (3 ', 5'-di-t-butyl-4'-hydroxyphenyl) propionate] methane, bis [3,3'-bis- (4'-Hydroxy-3'-t-butylphenyl) butyric acid] glycol ester, 1,3,5-tris (3 ', 5'-di-t-butyl-4'-hydroxybenzyl) -S-triazine-2 4,6- (1H, 3H, 5H) trione, tocophenol and the like.

<Sulfur-based antioxidant>
Dilauryl-3,3′-thiodipropionate, dimyristyl-3,3′-thiodipropionate, distearyl-3,3′-thiodipropionate, and the like.

<Phosphorus antioxidant>
Phosphites; triphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, tris (nonylphenyl) phosphite, diisodecylpentaerythritol phosphite, tris (2,4-di-t-butylphenyl) phosphite, Cyclic neopentanetetraylbis (octadecyl) phosphite, cyclic neopentanetetraylbi (2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbi (2,4-di-t-butyl) -4-methylphenyl) phosphite, bis [2-tert-butyl-6-methyl-4- {2- (octadecyloxycarbonyl) ethyl} phenyl] hydrogen phosphite, and the like.

<Oxaphosphaphenanthrene oxides>
9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10- (3,5-di-tert-butyl-4-hydroxybenzyl) -9,10-dihydro-9-oxa-10 -Phosphaphenanthrene-10-oxide, 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, etc. are mentioned.
These antioxidants can be used alone, but it is particularly preferable to use them in combination with phenol / sulfur or phenol / phosphorus.

(UV absorber)
Into 100 parts by mass of the epoxy resin composition for a sealing material of the present invention, 0.01 to 10 parts by mass of an ultraviolet absorber can be blended to further improve the light resistance. The ultraviolet absorber which can be mix | blended can use the general ultraviolet absorber for plastics, The following are mentioned as an example.

Salicylic acids such as phenyl salicylate, pt-butylphenyl salicylate, p-octylphenyl salicylate, 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2-hydroxy Benzophenones such as -4-dodecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-5′-tert-butylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5 ′ -Di-tert-butylphenyl) Nzotriazole, 2- (2′-hydroxy-3′-tert-butyl-5′-methylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-3 ′, 5′-ditert-butyl Phenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-3 ′, 5′-ditert-amylphenyl) benzotriazole, 2-{(2′-hydroxy-3 ′, 3 ″, 4 ′) Benzotriazoles such as' 5 ″, 6 ″ -tetrahydrophthalimidomethyl) -5′-methylphenyl} benzotriazole, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis ( 1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) [{3,5-bis (1,1-dimethylethyl ) Hindered amines such as 4-hydrido hydroxyphenyl} methyl] butyl malonate.

(Light emitting element)
The epoxy resin composition for a light emitting device sealing material of the present invention is excellent in light resistance, and the light emitting device to be sealed is preferably a device that emits light with a relatively short wavelength having a peak wavelength of 350 to 550 nm. .

Examples of such a light emitting device include a group III nitride compound semiconductor formed by metal organic chemical vapor deposition (MOCVD), molecular beam crystal growth (MBE), or halide vapor deposition (HVPE). Al _x Ga _y In _1-XY N (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, 0 ≦ X + Y ≦ 1) as a general formula, and a so-called binary system of Al _x , GaN and InN, Al including so-called ternary _{X Ga 1-X N, Al} X in 1-X N and Ga _X in _1-X N (or at 0 ≦ X ≦ 1). Examples of the semiconductor structure include a homostructure having a MIS junction, a PIN junction, and a pn junction, a heterostructure, and a double heterostructure. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal. In addition, a single quantum well structure or a multiple quantum well structure in which the semiconductor active layer is formed in a thin film in which a quantum effect is generated can be used.

(Optional component)
The following components can be added and blended with the epoxy resin composition for a light emitting device sealing material of the present invention as required.

(1) Powdery reinforcing agents and fillers such as metal oxides such as aluminum oxide and magnesium oxide, silicon compounds such as fine powder silica, fused silica and crystalline silica, transparent fillers such as glass beads, and aluminum hydroxide Metal hydroxide, others, kaolin, mica, quartz powder, graphite, molybdenum disulfide, etc.
These compounding is mix | blended in the range which does not impair the transparency of the epoxy composition of this invention, and 10-100 mass parts is suitable with respect to 100 mass parts of compositions of this invention.

(2) Colorants or pigments such as titanium dioxide, molybdenum red, bitumen, ultramarine blue, cadmium yellow, cadmium red and organic dyes.
(3) Flame retardants such as antimony trioxide, bromine compounds and phosphorus compounds.
(4) Ion adsorbent.
(5) Coupling agent 0.01-30 mass parts of these are mix | blended with respect to 100 mass parts of epoxy resin compositions of this invention.

  (6) Furthermore, various curable monomers, oligomers and synthetic resins can be blended for the purpose of improving the properties of the epoxy cured product. For example, one or a combination of two or more of a diluent for epoxy resin such as aliphatic epoxy, diol or triol, vinyl ether, oxetane compound, fluororesin, acrylic resin, and silicone resin can be used. The compounding ratio of these compounds and resins is preferably 50 parts by mass or less with respect to an amount within a range not impairing the original properties of the epoxy resin composition of the present invention, that is, 100 parts by mass of the composition of the present invention.

  Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. In addition, the part in an example means a mass part.

Example 1
As a hydrogenated epoxy resin, 80 parts of Epicoat YX8000 (trade name of Japan Epoxy Resin Co., Ltd .; epoxy resin directly hydrogenated bisphenol A type epoxy resin, hydrogenation rate of about 100%, epoxy equivalent; 205 g / equivalent), triazine-containing epoxy resin 20 parts TEPIC-S (Nissan Chemical Industries trade name; triglycidyl isocyanurate, epoxy equivalent; 99 g / equivalent), Ricacid MH-700 (New Nippon Rika Co., Ltd. trade name; methyl hexahydrophthalic anhydride as an acid anhydride curing agent) ) After mixing 100 parts at a temperature of 80 ° C. until uniform, Hishicolin PX-4ET (trade name of Nippon Chemical Industry; tetra-n-butylphosphonium o, o-diethyl phosphorodithioate) as a curing accelerator 0. 5 parts were added, stirred and dissolved to obtain an epoxy resin composition . The composition was degassed under reduced pressure, poured into a mold, and cured in an oven at 100 ° C. for 3 hours and then at 140 ° C. for 3 hours to obtain a cured product. The physical property values of this epoxy cured product are shown in Table 1.

Examples 2-5 and Comparative Examples 1-2
Except changing the epoxy resin, acid anhydride curing agent, curing accelerator and additives as shown in Table 1, the same operation as in Example 1 was performed to obtain an epoxy resin composition, and a cured product was obtained. The physical properties of the epoxy cured product are shown in Table 1.

In Table 1, ^* 1 to ^* 16 are as follows.
^* 1 Measured at 120 ° C, Yasuda Seiki Gel Time Tester
^* 2; TMA method (heated at 5 ° C / min)
^* 3: YI value (Yellowness Index) after irradiation for 72 hours using a metallizing vertical weather meter (manufactured by Suga Test Instruments Co., Ltd.) under irradiation conditions of 0.4 kw / m ² black panel temperature of 63 ° C.
^* 4: YI value (Yellowness Index) after heating at 150 ° C for 72 hours
^* 5; JIS-K-6911
^* 6; Tensile bond shear strength of iron-iron (JIS-K-6850)
^* 7: Moisture absorption after 24 hours at 121 ° C., 0.21 MPa of a disk-shaped cured product having a thickness of 3 mm and a diameter of 50 mm
^* 8: Hydrogenated bisphenol A type epoxy resin-WPE 205 (made by Japan Epoxy Resin Co., Ltd.)
^* 9: Hydrogenated bisphenol A type epoxy resin-WPE 290 (made by Japan Epoxy Resin Co., Ltd.)
^* 10: Hydrogenated bisphenol A type epoxy resin-WPE 1,200 (made by Japan Epoxy Resin Co., Ltd.)
^* 11: Triglycidyl isocyanurate (Nissan Chemical Industries)
^* 12; 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate (manufactured by Japan Epoxy Resin Co., Ltd.)
^* 13: Methylhexahydrophthalic anhydride (manufactured by Shin Nippon Rika Co., Ltd.)
^* 14; Tetra-n-butylphosphonium o, o-diethyl phosphorodithioate (manufactured by Nippon Chemical Industry Co., Ltd.)
^* 15; 2-hydroxy-4-methoxybenzophenone
^* 16; 2,6-di-t-butyl-p-cresol (BHT) / triphenyl phosphite (TPP)

  As is clear from Table 1, the epoxy resin composition for a light emitting device sealing material of the present invention has a cured product with excellent heat resistance and adhesion, and excellent moisture resistance and light resistance. It is particularly useful as an epoxy resin composition for an LED encapsulant that encapsulates a group III nitride compound semiconductor that emits.

Claims (8)

(A) component; 20-95 mass% of hydrogenated epoxy resins whose hydrogenation rate of the aromatic ring obtained by directly hydrogenating an aromatic epoxy resin is 90-100%, 5-80 mass% of triazine ring containing epoxy resins, and Epoxy resin (B) component containing 0-50% by mass of alicyclic epoxy resin obtained by epoxidizing alicyclic olefin; acid anhydride curing agent (C) component; curing accelerator (A) component ( B) The epoxy resin composition for light emitting element sealing materials containing a component and (C) component.   The hydrogenated epoxy resin in component (A) is one or more hydrogenated epoxy resins selected from epoxy resins obtained by directly hydrogenating bisphenol A type epoxy resins, bisphenol F type epoxy resins or biphenol type epoxy resins. The epoxy resin composition for light emitting element sealing materials of Claim 1 characterized by these.   The epoxy resin composition for a light-emitting device sealing material according to claim 1 or 2, wherein the triazine ring-containing epoxy resin in component (A) is triglycidyl isocyanurate.   The acid anhydride curing agent as component (B) is hexahydrophthalic anhydride and / or methyl hexahydrophthalic anhydride, and the curing accelerator as component (C) is tertiary amines and salts thereof, imidazoles and their The light emitting device according to any one of claims 1 to 3, wherein the light emitting device is at least one curing accelerator selected from salts, organic phosphine compounds and salts thereof, and organic acid metal salts. Epoxy resin composition for sealing material.   The content ratio of the alicyclic epoxy resin obtained by epoxidizing the alicyclic olefin in the epoxy resin of the component (A) is 5 to 50% by mass, any one of claims 1 to 4 The epoxy resin composition for light emitting element sealing materials of Claim 1.   The at least 1 sort (s) antioxidant or / and ultraviolet absorber which are chosen from a phenolic antioxidant, a sulfur type antioxidant, and a phosphorus type antioxidant are 0.01-10 mass parts mix | blended. The epoxy resin composition for light emitting element sealing materials of any one of Claim 5.   7. The epoxy resin for a light-emitting element sealing material according to claim 1, wherein the light-emitting element is a light-emitting element whose light-emitting layer has a main emission peak at 350 to 550 nm. Composition.   The epoxy resin composition for a light emitting device sealing material according to any one of claims 1 to 7, wherein the light emitting device is a light emitting diode (LED).