JP2004319924A - Wiring structure of electronic substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring structure being miniaturized to selectively mount a package having the same performance and a different shape. <P>SOLUTION: Lines 12, 13 showing an external shape for packaging first and second IC packages are formed side by side on an electronic substrate 11. Lands 14<SB>-1</SB>, ... ..., 14<SB>-14</SB>, 15<SB>-1</SB>, ... ..., and 15<SB>-14</SB>for each terminal connection are formed outside both the long sides of respective external shape lines 12, 13. The lands are correspondingly connected one another in common by lines 16<SB>-1</SB>, 16<SB>-2</SB>, ... ..., and 16<SB>-14</SB>. Then, lands 14<SB>-9</SB>, ... ..., and 14<SB>-13</SB>in the lands 14<SB>-1</SB>, ... ..., and 14<SB>-14</SB>for the first IC package are formed at a position overlapping with the outer shape line 13 of the second IC package. Additionally, the lands 15<SB>-1</SB>, ... ..., and 15<SB>-7</SB>in the lands 15<SB>-1</SB>, ... ..., 15<SB>-14</SB>for the second IC package are formed at a position overlapping with the outer shape line 12 of the first IC package. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a wiring structure of an electronic board used for various electronic devices.
[0002]
[Prior art]
Many IC packages are mounted on various electronic substrates. With the passage of the times, the size of IC packages has been reduced. In the transition period from the old type (large) to the new type (small) with the same function, that is, during the period in which the old type and the new type are used in a mixed manner, the substrate is designed so that either type of IC package may be used. In some cases, a wiring (pattern) that can cope with any type of mounting is formed (for example, see Patent Document 1).
[0003]
FIG. 4 shows an example of the wiring pattern. In FIG. 4, lands _3-1 , _3-2 ,..., _3-14 for connecting the lead terminals of the old (large) IC package 2 are formed on the electronic substrate 1, and the old IC package 2 The lands _5-1 , 5 _-2 ,..., _5-14 for connecting the lead terminals of the new (small) IC package 4 are formed side by side in the longitudinal direction of the package to be mounted and wired. The lands _3-1 , _3-2 , ..., _3-14 and the lands _5-1 , _5-2 , ..., _5-14 are formed by the wiring patterns _6-1 , _6-2 , ..., _6-14. They are commonly connected to each other. A part of the wiring patterns _6-1 , _6-2 , ..., _6-14 is lower than a part of the lands _3-1 , _3-2 , ..., _3-14 , Via the land group 3 and the land group 5, they are connected to the outer _ends of some of the lands _5-1 , _5-2 ,..., _5-14 . The other part of the wiring patterns _6-1 , _6-2 , ..., _6-14 is the outer tip of the other part of the lands _3-1 , _3-2 , ..., _3-14. The outer lands are connected to outer ends or inner ends of other portions of the lands _5-1 , _5-2 ,..., _5-14 .
[0004]
[Patent Document 1]
JP-A-5-315759
[Problems to be solved by the invention]
In the wiring structure of the conventional electronic substrate described above, the land for the old (large) IC package and the land for the new (small) IC package are arranged side by side, so that the wiring pattern becomes large. There is.
[0006]
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a wiring structure that is reduced in size for selectively mounting packages having the same performance and different shapes.
[0007]
[Means for Solving the Problems]
The wiring structure of an electronic substrate according to the present invention is a wiring structure of an electronic substrate that allows two IC packages having the same performance and different shapes (sizes) to be selectively mounted, and connects terminals of one of the IC packages. Are formed at positions overlapping the main body mounting position of the other IC package.
[0008]
In the present invention, a land for connecting a terminal of the other IC package may be formed at a position overlapping a main body mounting position of the one IC package.
[0009]
Further, in the present invention, the two IC packages may have a rectangular shape, and their mounting positions may be formed by arranging the long sides in parallel in the short side direction.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in more detail with reference to embodiments. FIG. 1 is a diagram showing a wiring pattern of an electronic substrate according to an embodiment of the present invention. In FIG. 1, a line 12 indicating the outer shape of the first IC package and a line 13 indicating the outer shape of the second IC package are formed on the electronic substrate 11 by silk printing. Both the outline 12 of the first IC package and the outline 13 of the second IC package are rectangular in plan view. The outlines 12 and 13 of these IC packages indicate the mounting position of each IC package.
[0011]
First on the outside of the long sides of the outline 12 of the IC package, the first land ₁₄ -1 for terminal connection of the IC _package, 14 -2, ..., and _{14 -7, 14} -8, 14 _{- 9, ..., 14-14} are patterned. Also, lands _15-1 , _15-2 ,..., _15-7 , _15-7 , _15-8 , and _15-2 for terminal connection of the second IC package are provided outside both long sides of the outer shape line 13 of the second IC package. The patterns _15-9 ,..., And _15-14 are patterned. First land ₁₄ -1 for IC _package, 14 -2, ..., and _{14 -7,} 14 _-8, 14 -9, _{..., 14 -14,} the second IC package of land 15 _{- 1, 15} -2, ..., and _{15 -7,} 15 _-8, 15 -9, _..., and _{15 14,} together those of the corresponding position, the line ₁₆ -1, _{16 -2,} ..., _16-7 , _16-8 , _16-9 ,..., _16-14 .
[0012]
First land ₁₄ -1 for IC _package, 14 -2, ..., and _{14 -7,} 14 _-8, 14 -9, _..., among the _{14 -14} land _{14 -9, 14 -10,} .., _14-13 are formed at positions overlapping with the outer shape line 13 of the second IC package, that is, at positions overlapping with the mounting position of the second IC package. The second land ₁₅ -1 for IC _package, 15 -2, ..., and _{15 -7,} 15 _-8, 15 -9, _..., among the _{15 -14} lands ₁₅ -1, 15 _{- 2,} ..., _{15 -7} is formed on the first profile 12 overlaps the position of the IC package, i.e. overlap the mounting position of the first IC package position. As described above, in this embodiment, the lands for connecting the terminals of each IC package are positioned so as to overlap the package body when the other IC package is mounted. It is possible to realize a compact wiring structure that can cope with the above.
[0013]
FIG. 2 is a diagram showing a wiring pattern of an electronic substrate according to another embodiment of the present invention. In FIG. 2, a line 22 indicating the outer shape of the first IC package and a line 23 indicating the outer shape of the second IC package are also formed on the electronic substrate 21 by silk printing. Here, the outline 22 of the first IC package is larger than the outline 23 of the second IC package. Both the outlines 22 and 23 of the first and second IC packages are rectangular.
[0014]
First land ₂₄ -1 for terminal connection of both long sides of the first IC package outside the IC package outline _22, ..., _{24 -4,} 24 -5, ..., _{24 -8} formation Have been. Also, terminals _25-1 ,..., _25-4 , _25-5 ,..., _25-8 for terminal connection of the second IC package are provided outside both long sides of the outline 23 of the second IC package. Are patterned. First land ₂₄ -1 for IC _package, 24 -2, ..., and _{24 -8,} the second land ₂₅ -1 for IC _package, 25 -2, ..., and a _{25 -8,} respectively between that of the corresponding position, the line ₂₆ -1, ... are commonly connected by a _{26 -8.}
[0015]
In this embodiment, the positions where the lands _25-1 , _25-2 ,..., _25-8 for the second IC package overlap the outline 23 of the first IC package, that is, the mounting position of the first package Is formed at a position overlapping with.
[0016]
In this embodiment, when the first package is mounted, the land for the second package is formed in the portion where the package body overlaps, so that the area when the previous large package is mounted Without increasing the size of the wiring, it is possible to realize a wiring structure that can support both packages having the same performance and different shapes.
[0017]
FIG. 3 is a view showing a wiring pattern of an electronic substrate according to still another embodiment of the present invention. On the electronic substrate 31 of this embodiment, wiring patterns are formed on both front and back surfaces. A line 32 indicating the outer shape of the first IC package is formed on the front surface of the electronic substrate 31, and a line 33 indicating the outer shape of the second IC package is formed on the back surface of the electronic substrate 31. Here, the outline 32 of the first IC package is larger than the outline 33 of the second IC package. The outlines 32 and 33 of the first and second IC packages are also rectangular, and are disposed so that the longitudinal directions are orthogonal to each other on the front and back sides.
[0018]
The outer surfaces of the long sides of the first IC package outline 32 of the surface, the first land ₃₄ -1 for terminal connection of the IC package, ..., _{34 -4} and ₃₄ -5, ..., 34 _{- 8} are formed. Also, terminal lands _35-1 ,..., _35-4 and _35-5 ,..., _35-8 are formed outside both long sides of the outer shape line 33 of the second IC package on the back surface. I have. First land ₃₄ -1 for IC packages, ..., _{34 -4} and ₃₄ -5, ..., _{34 -8,} the second land ₃₅ -1 for IC packages, ..., and _{35 -4} 35 _-5, ..., _{35 -8,} between which the corresponding _through-36 -1 to connect the front and back, ... are commonly connected by a _{36 -8.}
[0019]
In this embodiment, the positions where the lands _35-1 ,..., _35-4 and _35-5 ,..., _35-8 for the second IC package overlap with the outline 33 of the first IC package, that is, A back surface is formed at a position overlapping the mounting position of the first package.
[0020]
In this embodiment, when the first package is mounted, the land for the second package is formed on the back surface of the portion where the package body overlaps. The wiring structure can be realized that can cope with both packages having the same performance and different shapes without enlarging the area.
[0021]
【The invention's effect】
According to the present invention, the lands for connecting the terminals of one IC package are formed at positions overlapping the main body mounting position of the other IC package, so that packages of different shapes with the same performance are selectively mounted. The wiring structure of the electronic substrate can be realized without increasing the substrate area.
[Brief description of the drawings]
FIG. 1 is a diagram showing a wiring pattern of an electronic substrate according to an embodiment of the present invention.
FIG. 2 is a diagram showing a wiring pattern of an electronic substrate according to another embodiment of the present invention.
FIG. 3 is a diagram showing a wiring pattern of an electronic substrate according to still another embodiment of the present invention.
FIG. 4 is a diagram illustrating an example of a wiring pattern of a conventional electronic substrate.
[Explanation of symbols]
11, 21 and 31 the electronic board 12, 22, 32 first IC package outline 13, 23, 33 the second IC package outline ₁₄ -1, _..., 14 14, _{24 -1,} ... , _24-8 , _34-1 , ..., _34-8
The first of the IC package of land _{15 -1, ...,} 15 14, 25 _-1, ..., _{25 -8,} 35 -1, ..., _{35 -8}
Second land ₁₆ -1 for IC _{packages, ...,} 16 14, 26 _-1, ..., _{26 -8,} 36 -1, ..., _{36 -8}
Connection pattern wire

Claims (3)

A wiring structure of an electronic board that allows two IC packages having the same performance but different shapes to be selectively mounted,
A wiring structure for an electronic board, wherein a land for connecting terminals of one IC package is formed at a position overlapping a main body mounting position of the other IC package. 2. The wiring structure of an electronic board according to claim 1, wherein lands for connecting terminals of the other IC package are formed at positions overlapping with main body mounting positions of the one IC package. 3. The wiring of the electronic substrate according to claim 1, wherein the two IC packages are rectangular, and the mounting positions thereof are formed in such a manner that long sides are arranged in parallel in a short side direction. Construction.

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