JP2004315805A - Resin composition for laser welding and molded product - Google Patents
Resin composition for laser welding and molded product Download PDFInfo
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- JP2004315805A JP2004315805A JP2004091069A JP2004091069A JP2004315805A JP 2004315805 A JP2004315805 A JP 2004315805A JP 2004091069 A JP2004091069 A JP 2004091069A JP 2004091069 A JP2004091069 A JP 2004091069A JP 2004315805 A JP2004315805 A JP 2004315805A
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- 238000003466 welding Methods 0.000 title claims abstract description 56
- 239000011342 resin composition Substances 0.000 title claims abstract description 46
- 229920005989 resin Polymers 0.000 claims abstract description 133
- 239000011347 resin Substances 0.000 claims abstract description 133
- -1 polybutylene terephthalate Polymers 0.000 claims abstract description 90
- 229920001707 polybutylene terephthalate Polymers 0.000 claims abstract description 78
- 229920001971 elastomer Polymers 0.000 claims abstract description 45
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000000806 elastomer Substances 0.000 claims abstract description 41
- 239000000178 monomer Substances 0.000 claims abstract description 37
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 20
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 20
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 20
- 239000000945 filler Substances 0.000 claims abstract description 17
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 16
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000012744 reinforcing agent Substances 0.000 claims abstract description 11
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 9
- 125000003118 aryl group Chemical group 0.000 claims abstract description 9
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 21
- 239000000835 fiber Substances 0.000 claims description 18
- 229920000728 polyester Polymers 0.000 claims description 16
- 229920001634 Copolyester Polymers 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 14
- 239000004793 Polystyrene Substances 0.000 claims description 13
- 229920002223 polystyrene Polymers 0.000 claims description 13
- 229920005668 polycarbonate resin Polymers 0.000 claims description 9
- 239000004431 polycarbonate resin Substances 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 5
- 230000013011 mating Effects 0.000 claims description 5
- 239000010445 mica Substances 0.000 claims description 5
- 229910052618 mica group Inorganic materials 0.000 claims description 5
- 239000000454 talc Substances 0.000 claims description 5
- 229910052623 talc Inorganic materials 0.000 claims description 5
- 239000010456 wollastonite Substances 0.000 claims description 5
- 229910052882 wollastonite Inorganic materials 0.000 claims description 5
- 239000011324 bead Substances 0.000 claims description 4
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 abstract description 24
- 230000035939 shock Effects 0.000 abstract description 10
- 229920000515 polycarbonate Polymers 0.000 abstract description 6
- 239000004417 polycarbonate Substances 0.000 abstract description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 29
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 22
- 238000000034 method Methods 0.000 description 19
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 18
- 238000012360 testing method Methods 0.000 description 18
- 239000012779 reinforcing material Substances 0.000 description 15
- 239000002253 acid Substances 0.000 description 13
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 13
- 238000000465 moulding Methods 0.000 description 12
- 238000002834 transmittance Methods 0.000 description 11
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 10
- 239000002667 nucleating agent Substances 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 239000008188 pellet Substances 0.000 description 9
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 8
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 8
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 150000001991 dicarboxylic acids Chemical class 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 150000002009 diols Chemical class 0.000 description 6
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- HAYIPGIFANTODX-UHFFFAOYSA-N 4,6-dimethylbenzene-1,3-dicarboxylic acid Chemical compound CC1=CC(C)=C(C(O)=O)C=C1C(O)=O HAYIPGIFANTODX-UHFFFAOYSA-N 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- 239000003086 colorant Substances 0.000 description 5
- 229920000578 graft copolymer Polymers 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 229920000570 polyether Polymers 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical compound O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229920001400 block copolymer Polymers 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 4
- 125000005027 hydroxyaryl group Chemical group 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 150000002596 lactones Chemical class 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 229920006132 styrene block copolymer Polymers 0.000 description 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 229920000800 acrylic rubber Polymers 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920003232 aliphatic polyester Polymers 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 2
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 2
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- IWYDHOAUDWTVEP-UHFFFAOYSA-N mandelic acid Chemical compound OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 239000001053 orange pigment Substances 0.000 description 2
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000001054 red pigment Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 238000005809 transesterification reaction Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- YKPAABNCNAGAAJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)propane Chemical compound C=1C=C(O)C=CC=1C(CC)C1=CC=C(O)C=C1 YKPAABNCNAGAAJ-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- HCUZVMHXDRSBKX-UHFFFAOYSA-N 2-decylpropanedioic acid Chemical compound CCCCCCCCCCC(C(O)=O)C(O)=O HCUZVMHXDRSBKX-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- OVVCSFQRAXVPGT-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclopentyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCC1 OVVCSFQRAXVPGT-UHFFFAOYSA-N 0.000 description 1
- KANXFMWQMYCHHH-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-3-methylbutan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C(C)C)C1=CC=C(O)C=C1 KANXFMWQMYCHHH-UHFFFAOYSA-N 0.000 description 1
- VHLLJTHDWPAQEM-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-4-methylpentan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CC(C)C)C1=CC=C(O)C=C1 VHLLJTHDWPAQEM-UHFFFAOYSA-N 0.000 description 1
- ZQTPHEAGPRFALE-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)hexan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCCC)C1=CC=C(O)C=C1 ZQTPHEAGPRFALE-UHFFFAOYSA-N 0.000 description 1
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- UUAGPGQUHZVJBQ-UHFFFAOYSA-N Bisphenol A bis(2-hydroxyethyl)ether Chemical compound C=1C=C(OCCO)C=CC=1C(C)(C)C1=CC=C(OCCO)C=C1 UUAGPGQUHZVJBQ-UHFFFAOYSA-N 0.000 description 1
- MIUUNYUUEFHIHM-UHFFFAOYSA-N Bisphenol A bis(2-hydroxypropyl) ether Chemical compound C1=CC(OCC(O)C)=CC=C1C(C)(C)C1=CC=C(OCC(C)O)C=C1 MIUUNYUUEFHIHM-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920007962 Styrene Methyl Methacrylate Polymers 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- AUNAPVYQLLNFOI-UHFFFAOYSA-L [Pb++].[Pb++].[Pb++].[O-]S([O-])(=O)=O.[O-][Cr]([O-])(=O)=O.[O-][Mo]([O-])(=O)=O Chemical compound [Pb++].[Pb++].[Pb++].[O-]S([O-])(=O)=O.[O-][Cr]([O-])(=O)=O.[O-][Mo]([O-])(=O)=O AUNAPVYQLLNFOI-UHFFFAOYSA-L 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052586 apatite Inorganic materials 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical group 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- VEZXCJBBBCKRPI-UHFFFAOYSA-N beta-propiolactone Chemical compound O=C1CCO1 VEZXCJBBBCKRPI-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 239000001055 blue pigment Substances 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- OHAFBMGBKBQYSK-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylic acid;methanol Chemical compound OC.OC(=O)C1(C(O)=O)CCCCC1 OHAFBMGBKBQYSK-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- INSRQEMEVAMETL-UHFFFAOYSA-N decane-1,1-diol Chemical compound CCCCCCCCCC(O)O INSRQEMEVAMETL-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000001056 green pigment Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 239000006233 lamp black Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012803 melt mixture Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical class C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- BNJOQKFENDDGSC-UHFFFAOYSA-N octadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCC(O)=O BNJOQKFENDDGSC-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 229960000380 propiolactone Drugs 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000006234 thermal black Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920003212 trans-1,4-polyisoprene Polymers 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 239000001052 yellow pigment Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
- B29C65/1606—Ultraviolet [UV] radiation, e.g. by ultraviolet excimer lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
- B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
- B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本発明は、レーザー溶着性が高く、ヒートショック性に優れるポリブチレンテレフタレート系樹脂組成物、及びそれを用いた成形品に関する。 The present invention relates to a polybutylene terephthalate resin composition having high laser welding property and excellent heat shock property, and a molded article using the same.
ポリブチレンテレフタレート(PBT)系樹脂は、耐熱性、耐薬品性、電気特性、機械的特性、及び成形加工性などの種々の特性に優れるため、多くの用途に利用されている。具体的な用途としては、各種自動車用電装部品(各種コントロールユニット、各種センサー、イグニッションコイルなど)、コネクター類、スイッチ部品、リレー部品、コイル部品などが挙げられる。これらの部品を作製するため、接着剤、ネジ止め、スナップフィット、熱板溶着、超音波溶着などの接合方法を利用して複数の成形部品を接合している。しかし、これらの接合方法について、幾つかの問題点が指摘されている。例えば、接着剤を用いると、接着剤が硬化するまでの工程的な時間のロスや環境への負荷が問題となる。また、ネジ止めでは、締結の手間やコストが増大し、熱板溶着や超音波溶着では、熱や振動などによる製品の損傷が懸念される。これに対して、レーザー溶着による接合方法は、溶着に伴う熱や振動による製品のダメージが無く、溶着工程も非常に簡易である。そのため、最近、レーザー溶着法は、広く利用されるようになってきており、各種樹脂部品の溶着手法として着目されている。さらに、溶着に供される樹脂部品の中には、金属をインサート成形した樹脂部品もある。従って、インサート成形用樹脂として、インサート成形可能であるとともに、レーザー溶着性の高いPBT系樹脂の開発が望まれている。なお、インサート成形品に要求される樹脂の性能として、長時間に亘る高低温度変化(ヒートショック性)に対する耐性、すなわち高低温耐衝撃特性に優れることが要求されている。 Polybutylene terephthalate (PBT) -based resins have been used in many applications because of their excellent properties such as heat resistance, chemical resistance, electrical properties, mechanical properties, and moldability. Specific applications include various automotive electrical components (various control units, various sensors, ignition coils, etc.), connectors, switch components, relay components, coil components, and the like. In order to manufacture these parts, a plurality of molded parts are joined using a joining method such as an adhesive, screwing, snap fitting, hot plate welding, or ultrasonic welding. However, several problems have been pointed out with respect to these joining methods. For example, when an adhesive is used, there is a problem in that a loss of process time until the adhesive is cured and an environmental load are caused. Further, screwing increases the labor and cost of fastening, and hot plate welding or ultrasonic welding may cause damage to the product due to heat or vibration. On the other hand, the joining method by laser welding does not damage the product due to heat and vibrations caused by welding, and the welding process is very simple. For this reason, recently, the laser welding method has been widely used, and has attracted attention as a welding method for various resin parts. Further, among the resin parts to be subjected to welding, there is a resin part obtained by insert-molding a metal. Therefore, development of a PBT-based resin that can be insert-molded and has high laser weldability is desired as an insert-molding resin. In addition, as the performance of the resin required for the insert molded product, it is required that the resin be resistant to a high / low temperature change (heat shock property) over a long period of time, that is, excellent in high / low temperature impact resistance.
一方、PBT系樹脂をレーザー溶着で接合する場合、レーザ光の透過が低いため、炭化などを生じ、実質的に溶着できないことが指摘されている。特開2001−26656号公報(特許文献1)には、特定範囲の融点を有するポリエステル系共重合体で形成された成形品と他の成形品とを溶着加工により一体化させて成形体を製造する方法が開示されている。この文献には、ホモポリアルキレンアリレート樹脂(ポリブチレンテレフタレート、ポリエチレンテレフタレート、ポリエチレンナフタレート)はレーザー溶着強度が小さいことが記載されている。 On the other hand, it has been pointed out that when a PBT-based resin is joined by laser welding, the laser beam has low transmission, so that carbonization or the like occurs, and welding cannot be performed substantially. Japanese Patent Application Laid-Open No. 2001-26656 (Patent Document 1) discloses that a molded article formed of a polyester-based copolymer having a specific range of melting point and another molded article are integrated by welding to produce a molded article. A method for doing so is disclosed. This document describes that homopolyalkylene arylate resins (polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate) have low laser welding strength.
特開平10−245481号公報(特許文献2)には、熱可塑性ポリカーボネート樹脂とポリエチレンテレフタレートなどの熱可塑性ポリエステル樹脂とで構成された組成物に、架橋アクリル酸エステル系弾性体の存在下にメタクリル酸エステルを主成分とする単量体をグラフト重合して得られるメタクリル酸エステル系樹脂(グラフト樹脂)を1〜10重量%の割合で配合した熱可塑性樹脂組成物が開示されている。この文献には、前記樹脂組成物において、ビスフェノールA型ポリカーボネート樹脂とポリエチレンテレフタレート樹脂とを1.5/1〜4/1(重量比)の割合で用いた例が記載されている。さらに、前記組成物の熱溶着法として、熱板溶着法、振動溶着法又は超音波溶着も記載されている。しかし、この組成物でをレーザー溶着に供すると、レーザー光の透過率が著しく低下し、レーザー光により溶着できないだけでなく、機械的強度や耐熱性が低下する。さらに、樹脂組成物はインサート成形でのヒートショック性が低下する。 JP-A-10-245481 (Patent Document 2) discloses that a composition composed of a thermoplastic polycarbonate resin and a thermoplastic polyester resin such as polyethylene terephthalate is added to a methacrylic acid in the presence of a crosslinked acrylate-based elastic material. There is disclosed a thermoplastic resin composition in which a methacrylic ester-based resin (graft resin) obtained by graft-polymerizing a monomer having an ester as a main component is blended at a ratio of 1 to 10% by weight. This document describes an example in which a bisphenol A-type polycarbonate resin and a polyethylene terephthalate resin are used in a ratio of 1.5 / 1 to 4/1 (weight ratio) in the resin composition. Further, as a thermal welding method of the composition, a hot plate welding method, a vibration welding method or an ultrasonic welding method is described. However, when this composition is subjected to laser welding, the transmittance of laser light is remarkably reduced, and not only cannot be welded by laser light, but also the mechanical strength and heat resistance decrease. Further, the resin composition has a reduced heat shock property in insert molding.
金属インサート成形に利用できる樹脂として、特開昭63−3055号公報(特許文献3)には、特定のアクリル系ゴムが開示され、特開平6−304963号公報(特許文献4)には特定のオレフィン系共重合体のグラフト共重合体が開示されている。しかし、これらのエラストマー成分は、レーザー光の透過率を著しく低下させ、レーザー溶着に利用できない。
従って、本発明の目的は、PBT系樹脂をベースとしながらもレーザー溶着性および耐ヒートショック性に優れるレーザー溶着用PBT系樹脂組成物、及びその成形品を提供することにある。 Accordingly, an object of the present invention is to provide a PBT-based resin composition for laser welding, which is based on a PBT-based resin and has excellent laser welding properties and heat shock resistance, and a molded article thereof.
本発明の他の目的は、レーザー光の透過率及び溶着強度の高いPBT系樹脂組成物、及びPBT系樹脂成形品を提供することにある。 Another object of the present invention is to provide a PBT-based resin composition having high laser beam transmittance and high welding strength, and a PBT-based resin molded product.
本発明者らは、前記課題を達成するため鋭意検討した結果、PBT系樹脂と特定の屈折率を有するエラストマーと必要により特定の樹脂とを組み合わせると、高いレーザー溶着性及び融着強度を有し、かつ耐ヒートショック性を飛躍的に改善できることを見出し、本発明を完成した。 The present inventors have conducted intensive studies to achieve the above object, and as a result, when a PBT-based resin and an elastomer having a specific refractive index and a specific resin are combined as required, a high laser welding property and a high fusion strength are obtained. And found that the heat shock resistance can be drastically improved, and completed the present invention.
すなわち、本発明のレーザー溶着用ポリブチレンテレフタレート系樹脂組成物は、ポリブチレンテレフタレート系樹脂(PBT系樹脂)(A)と、エラストマー(B)とで構成されている。この樹脂組成物は、さらに、充填剤又は補強剤(C)及び/又はポリカーボネート系樹脂(d1)、スチレン系樹脂(d2)、ポリエチレンテレフタレート系樹脂(d3)から選択された少なくとも一種の樹脂(D)を含んでいてもよい。エラストマー(B)の割合は、樹脂(A)100重量部に対して、1〜50重量部程度であってもよく、充填剤又は補強剤(C)の割合は、樹脂(A)100重量部に対して、0〜100重量部程度であってもよい。樹脂(D)の割合は、樹脂(A)100重量部に対して、0〜80重量部(例えば、10〜60重量部)程度であってもよい。 That is, the polybutylene terephthalate resin composition for laser welding of the present invention is composed of a polybutylene terephthalate resin (PBT resin) (A) and an elastomer (B). The resin composition further comprises a filler or reinforcing agent (C) and / or a polycarbonate resin (d1), a styrene resin (d2), and at least one resin (D3) selected from a polyethylene terephthalate resin (d3). ) May be included. The proportion of the elastomer (B) may be about 1 to 50 parts by weight based on 100 parts by weight of the resin (A), and the proportion of the filler or reinforcing agent (C) may be 100 parts by weight of the resin (A). May be about 0 to 100 parts by weight. The ratio of the resin (D) may be about 0 to 80 parts by weight (for example, 10 to 60 parts by weight) based on 100 parts by weight of the resin (A).
前記ポリブチレンテレフタレート系樹脂(A)は、ホモポリエステル(ポリブチレンテレフタレート樹脂)であってもよく、コポリエステル(ポリブチレンテレフタレート共重合体)であってもよく、コポリエステルは、約45モル%以下(例えば、0.01〜40モル%程度)、特に30モル%以下(例えば、0.01〜30モル%程度)の共重合性モノマーで変性された樹脂であってもよい。前記共重合性モノマーは、例えば、ビスフェノール類又はそのアルキレンオキサイド付加体(ビスフェノールAのアルキレンオキサイド付加体など)、非対称芳香族ジカルボン酸(フタル酸、イソフタル酸など)、及びこれらのエステル形成可能な誘導体などであってもよい。エラストマーの屈折率は、例えば、1.52〜1.59程度であってもよい。前記エラストマーは、ポリスチレン系熱可塑性エラストマー、ポリエステル系熱可塑性エラストマーなどで構成できる。さらに、充填剤又は補強剤(C)は、種々の充填剤又は補強材、例えば、ガラス繊維、ガラスフレーク、ガラスビーズ、タルク、マイカ、ウォラストナイト、チタン酸カリウム繊維などで構成できる。 The polybutylene terephthalate resin (A) may be a homopolyester (polybutylene terephthalate resin) or a copolyester (polybutylene terephthalate copolymer), and the copolyester is about 45 mol% or less. The resin may be a resin modified with a copolymerizable monomer (for example, about 0.01 to 40 mol%), particularly 30 mol% or less (for example, about 0.01 to 30 mol%). Examples of the copolymerizable monomer include bisphenols or an alkylene oxide adduct thereof (such as an alkylene oxide adduct of bisphenol A), an asymmetric aromatic dicarboxylic acid (such as phthalic acid and isophthalic acid), and an ester-forming derivative thereof. And so on. The refractive index of the elastomer may be, for example, about 1.52 to 1.59. The elastomer can be composed of a polystyrene-based thermoplastic elastomer, a polyester-based thermoplastic elastomer, or the like. Further, the filler or reinforcing agent (C) can be composed of various fillers or reinforcing materials, for example, glass fiber, glass flake, glass beads, talc, mica, wollastonite, potassium titanate fiber and the like.
本発明は、前記樹脂組成物で形成された成形品と、相手材の樹脂成形品とがレーザー溶着により接合されている複合成形品も含む。 The present invention also includes a composite molded article in which a molded article formed of the resin composition and a resin molded article of a mating material are joined by laser welding.
本発明では、PBT系樹脂とエラストマーとを組み合わせるので、PBT系樹脂をベースとしながらもレーザー溶着性および耐ヒートショック性を向上できる。また、PBT系樹脂成形品の光線透過率及び溶着強度を高めることができる。そのため、レーザー溶着性の高い成形品(インサート成形品など)や、高い溶着強度で接合した複合成形品を得ることができる。 In the present invention, since the PBT resin and the elastomer are combined, the laser welding property and the heat shock resistance can be improved while using the PBT resin as a base. Further, the light transmittance and welding strength of the PBT-based resin molded product can be increased. Therefore, it is possible to obtain a molded product having high laser weldability (such as an insert molded product) and a composite molded product joined with high welding strength.
[ポリブチレンテレフタレート系樹脂組成物]
(A)PBT系樹脂
ベース樹脂としてのPBT系樹脂としては、ブチレンテレフタレートを主成分(例えば、50〜100重量%、好ましくは60〜100重量%、さらに好ましくは75〜100重量%程度)とするホモポリエステル(ポリブチレンテレフタレート)又はコポリエステル(ブチレンテレフタレート系共重合体又はポリブチレンテレフタレートコポリエステル)などが挙げられる。
[Polybutylene terephthalate resin composition]
(A) PBT resin As a PBT resin as a base resin, butylene terephthalate is a main component (for example, about 50 to 100% by weight, preferably about 60 to 100% by weight, and more preferably about 75 to 100% by weight). Examples include homopolyester (polybutylene terephthalate) or copolyester (butylene terephthalate-based copolymer or polybutylene terephthalate copolyester).
コポリエステル(ブチレンテレフタレート系共重合体又は変性PBT樹脂)における前記共重合可能なモノマー(以下、単に共重合性モノマーと称する場合がある)としては、テレフタル酸を除くジカルボン酸、1,4−ブタンジオールを除くジオール、オキシカルボン酸、ラクトンなどが挙げられる。共重合性モノマーは一種で又は二種以上組み合わせて使用できる。 Examples of the copolymerizable monomer (hereinafter, sometimes simply referred to as a copolymerizable monomer) in the copolyester (butylene terephthalate-based copolymer or modified PBT resin) include dicarboxylic acids other than terephthalic acid and 1,4-butane Examples thereof include diols other than diols, oxycarboxylic acids, and lactones. The copolymerizable monomers can be used alone or in combination of two or more.
ジカルボン酸としては、例えば、脂肪族ジカルボン酸(例えば、コハク酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、ウンデカンジカルボン酸、ドデカンジカルボン酸、ヘキサデカンジカルボン酸、ダイマー酸などのC4−40ジカルボン酸、好ましくはC4−14ジカルボン酸)、脂環式ジカルボン酸(例えば、ヘキサヒドロフタル酸、ヘキサヒドロイソフタル酸、ヘキサヒドロテレフタル酸、ハイミック酸などのC8−12ジカルボン酸)、テレフタル酸を除く芳香族ジカルボン酸(例えば、フタル酸、イソフタル酸;2,6−ナフタレンジカルボン酸などのナフタレンジカルボン酸;4,4′−ジフェニルジカルボン酸、4,4′−ジフェニルエーテルジカルボン酸、4,4′−ジフェニルメタンジカルボン酸、4,4′−ジフェニルケトンジカルボン酸などのC8−16ジフェニルジカルボン酸)、又はこれらの反応性誘導体(例えば、低級アルキルエステル(ジメチルフタル酸、ジメチルイソフタル酸(DMI)などのフタル酸又はイソフタル酸のC1−4アルキルエステルなど)、酸クロライド、酸無水物などのエステル形成可能な誘導体)などが挙げられる。さらに、必要に応じて、トリメリット酸、ピロメリット酸などの多価カルボン酸などを併用してもよい。 Examples of the dicarboxylic acid include aliphatic dicarboxylic acids (for example, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedicarboxylic acid, dodecanedicarboxylic acid, hexadecanedicarboxylic acid, dimer acid, etc. C 4-40 dicarboxylic acids, preferably C 4-14 dicarboxylic acids), alicyclic dicarboxylic acids (e.g., hexahydrophthalic acid, hexahydroisophthalic acid, hexahydroterephthalic acid, C 8-12 dicarboxylic such himic acid Acids), aromatic dicarboxylic acids other than terephthalic acid (eg, phthalic acid, isophthalic acid; naphthalenedicarboxylic acids such as 2,6-naphthalenedicarboxylic acid; 4,4′-diphenyldicarboxylic acid, 4,4′-diphenyletherdicarboxylic acid) , 4,4'-diphenylme Njikarubon acid, 4,4' C 8-16 diphenyl dicarboxylic acid and diphenyl ketone dicarboxylic acid), or phthalic such reactive derivatives thereof (e.g., lower alkyl esters (dimethyl phthalate, dimethyl isophthalate (DMI) An acid or isophthalic acid C1-4 alkyl ester), an acid chloride, a derivative capable of forming an ester such as an acid anhydride) and the like. Further, if necessary, a polycarboxylic acid such as trimellitic acid or pyromellitic acid may be used in combination.
ジオールには、例えば、1,4−ブタンジオールを除く脂肪族アルキレングリコール(例えば、エチレングリコール、トリメチレングリコール、プロピレングリコール、ネオペンチルグリコール、ヘキサンジオール、オクタンジオール、デカンジオールなどの直鎖状又は分岐鎖状C2−12脂肪族グリコール、好ましくは直鎖状又は分岐鎖状C2−10脂肪族グリコール)、(ポリ)オキシアルキレングリコール[複数のオキシC2−4アルキレン単位を有するグリコール、例えば、ジエチレングリコール、ジプロピレングリコール、ジテトラメチレングリコール、トリエチレングリコール、トリプロピレングリコール、ポリテトラメチレングリコールなど]、脂環族ジオール(例えば、1,4−シクロヘキサンジオール、1,4−シクロヘキサンジメタノール、水素化ビスフェノールAなど)、芳香族ジオール[例えば、ハイドロキノン、レゾルシノール、ナフタレンジオールなどのC6−14芳香族ジオール;ビフェノール;ビスフェノール類;キシリレングリコールなど]などが挙げられる。さらに、必要に応じて、グリセリン、トリメチロールプロパン、トリメチロールエタン、ペンタエリスリトールなどのポリオールを併用してもよい。 Diols include, for example, aliphatic alkylene glycols other than 1,4-butanediol (for example, linear or branched such as ethylene glycol, trimethylene glycol, propylene glycol, neopentyl glycol, hexanediol, octanediol, decanediol, etc.). Linear C 2-12 aliphatic glycols, preferably linear or branched C 2-10 aliphatic glycols), (poly) oxyalkylene glycols [glycols having a plurality of oxy C 2-4 alkylene units, for example, Diethylene glycol, dipropylene glycol, ditetramethylene glycol, triethylene glycol, tripropylene glycol, polytetramethylene glycol, etc.], alicyclic diols (eg, 1,4-cyclohexanediol, 1,4-cyclo Cyclohexanedicarboxylic methanol, and hydrogenated bisphenol A), aromatic diol [for example, hydroquinone, resorcinol, C 6-14 aromatic diols such as naphthalene diol; biphenol; bisphenols; xylylene glycol], and others. Further, if necessary, a polyol such as glycerin, trimethylolpropane, trimethylolethane or pentaerythritol may be used in combination.
前記ビスフェノール類としては、ビス(4−ヒドロキシフェニル)メタン(ビスフェノールF)、1,1−ビス(4−ヒドロキシフェニル)エタン(ビスフェノールAD)、1,1−ビス(4−ヒドロキシフェニル)プロパン、2,2−ビス(4−ヒドロキシフェニル)プロパン(ビスフェノールA)、2,2−ビス(4−ヒドロキシ−3−メチルフェニル)プロパン、2,2−ビス(4−ヒドロキシフェニル)ブタン、2,2−ビス(4−ヒドロキシフェニル)−3−メチルブタン、2,2−ビス(4−ヒドロキシフェニル)ヘキサン、2,2−ビス(4−ヒドロキシフェニル)−4−メチルペンタンなどのビス(ヒドロキシアリール)C1−6アルカン;1,1−ビス(4−ヒドロキシフェニル)シクロペンタン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサンなどのビス(ヒドロキシアリール)C4−10シクロアルカン;4,4’−ジヒドロキシジフェニルエーテル;4,4’−ジヒドロキシジフェニルスルホン;4,4’−ジヒドロキシジフェニルスルフィド;4,4’−ジヒドロキシジフェニルケトン、及びこれらのアルキレンオキサイド付加体が例示できる。アルキレンオキサイド付加体としては、ビスフェノール類(例えば、ビスフェノールA、ビスフェノールAD、ビスフェノールFなど)のC2−3アルキレンオキサイド付加体、例えば、2,2−ビス−[4−(2−ヒドロキシエトキシ)フェニル]プロパン、ジエトキシ化ビスフェノールA(EBPA)、2,2−ビス−[4−(2−ヒドロキシプロポキシ)フェニル]プロパン、ジプロポキシ化ビスフェノールAなどが挙げられる。アルキレンオキサイド付加体において、アルキレンオキサイド(エチレンオキサイド、プロピレンオキサイドなどのC2−3アルキレンオキサイド)の付加モル数は、各ヒドロキシル基に対して1〜10モル、好ましくは1〜5モル程度である。 Examples of the bisphenols include bis (4-hydroxyphenyl) methane (bisphenol F), 1,1-bis (4-hydroxyphenyl) ethane (bisphenol AD), 1,1-bis (4-hydroxyphenyl) propane, 2,2-bis (4-hydroxyphenyl) propane (bisphenol A), 2,2-bis (4-hydroxy-3-methylphenyl) propane, 2,2-bis (4-hydroxyphenyl) butane, 2,2- Bis (hydroxyaryl) C 1 such as bis (4-hydroxyphenyl) -3-methylbutane, 2,2-bis (4-hydroxyphenyl) hexane, 2,2-bis (4-hydroxyphenyl) -4-methylpentane -6 alkane; 1,1-bis (4-hydroxyphenyl) cyclopentane, 1,1-bis (4-h Bis (hydroxyaryl) C 4-10 cycloalkane such as droxyphenyl) cyclohexane; 4,4′-dihydroxydiphenyl ether; 4,4′-dihydroxydiphenyl sulfone; 4,4′-dihydroxydiphenyl sulfide; 4,4′- Examples thereof include dihydroxydiphenyl ketone and their alkylene oxide adducts. The alkylene oxide adduct, bisphenol (e.g., bisphenol A, bisphenol AD, bisphenol F, etc.) C 2-3 alkylene oxide adducts of, for example, 2,2-bis - [4- (2-hydroxyethoxy) phenyl ] Propane, diethoxylated bisphenol A (EBPA), 2,2-bis- [4- (2-hydroxypropoxy) phenyl] propane, dipropoxylated bisphenol A, and the like. In the alkylene oxide adduct, the addition mole number of the alkylene oxide ( C2-3 alkylene oxide such as ethylene oxide and propylene oxide) is 1 to 10 mol, preferably about 1 to 5 mol, for each hydroxyl group.
オキシカルボン酸には、例えば、オキシ安息香酸、オキシナフトエ酸、ヒドロキシフェニル酢酸、グリコール酸、オキシカプロン酸などのオキシカルボン酸又はこれらの誘導体などが含まれる。ラクトンには、プロピオラクトン、ブチロラクトン、バレロラクトン、カプロラクトン(例えば、ε−カプロラクトンなど)などのC3−12ラクトンなどが含まれる。 Examples of the oxycarboxylic acid include oxycarboxylic acids such as oxybenzoic acid, oxynaphthoic acid, hydroxyphenylacetic acid, glycolic acid, and oxycaproic acid, and derivatives thereof. Lactones include C3-12 lactones such as propiolactone, butyrolactone, valerolactone, and caprolactone (eg, ε-caprolactone).
好ましい共重合性モノマーとしては、ジオール類[C2−6アルキレングリコール(エチレングリコール、トリメチレングリコール、プロピレングリコール、ヘキサンジオールなどの直鎖状又は分岐鎖状アルキレングリコールなど)、繰返し数が2〜4程度のオキシアルキレン単位を有するポリオキシC2−4アルキレングリコール(ジエチレングリコールなど)、ビスフェノール類(ビスフェノール類又はそのアルキレンオキサイド付加体など)など]、ジカルボン酸類[C6−12脂肪族ジカルボン酸(アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸など)、カルボキシル基がアレーン環の非対称位置に置換した非対称芳香族ジカルボン酸、1,4−シクロヘキサンジメタノールなど]などが挙げられる。これらの化合物のうち、芳香族化合物、例えば、ビスフェノール類(特にビスフェノールA)のアルキレンオキサイド付加体、及び非対称芳香族ジカルボン酸[フタル酸、イソフタル酸、及びその反応性誘導体(ジメチルイソフタル酸(DMI)などの低級アルキルエステル)など]などが好ましい。 Preferred copolymerizable monomers include diols [C 2-6 alkylene glycols (such as linear or branched alkylene glycols such as ethylene glycol, trimethylene glycol, propylene glycol, and hexane diol); Polyoxy C2-4 alkylene glycol having a certain degree of oxyalkylene units (such as diethylene glycol), bisphenols (such as bisphenols or alkylene oxide adducts thereof), dicarboxylic acids [C 6-12 aliphatic dicarboxylic acid (adipic acid, Pimelic acid, suberic acid, azelaic acid, sebacic acid, etc.), an asymmetric aromatic dicarboxylic acid in which a carboxyl group is substituted at an asymmetric position of an arene ring, 1,4-cyclohexanedimethanol, etc.]. Among these compounds, aromatic compounds, for example, alkylene oxide adducts of bisphenols (particularly bisphenol A), and asymmetric aromatic dicarboxylic acids [phthalic acid, isophthalic acid, and reactive derivatives thereof (dimethylisophthalic acid (DMI)) And the like).
ポリブチレンテレフタレート系樹脂としては、ホモポリエステル(ポリブチレンテレフタレート)及び/又は共重合体(ポリブチレンテレフタレートコポリエステル)が好ましく、共重合性モノマーの割合(変性量)は、通常、45モル%以下(例えば、0〜40モル%程度)、好ましくは35モル%以下(例えば、0〜35モル%程度)であってもよく、30モル%以下(0〜30モル%程度)であってもよい。単独で使用する場合、共重合体において、共重合性モノマーの割合は、例えば、0.01〜30モル%程度の範囲から選択でき、通常、1〜30モル%、好ましくは3〜25モル%、さらに好ましくは5〜20モル%(例えば、5〜15モル%)程度である。ホモポリエステルと併用する場合、共重合体において、共重合性モノマーの割合は、例えば、0.1〜45モル%程度の範囲から選択でき、通常、1〜40モル%(例えば、5〜40モル%)、好ましくは10〜35モル%程度であってもよい。 As the polybutylene terephthalate-based resin, a homopolyester (polybutylene terephthalate) and / or a copolymer (polybutylene terephthalate copolyester) is preferable, and the proportion (modification amount) of the copolymerizable monomer is usually 45 mol% or less ( For example, it may be about 0 to 40 mol%), preferably 35 mol% or less (for example, about 0 to 35 mol%), or 30 mol% or less (about 0 to 30 mol%). When used alone, the proportion of the copolymerizable monomer in the copolymer can be selected, for example, from the range of about 0.01 to 30 mol%, and is usually 1 to 30 mol%, preferably 3 to 25 mol%. And more preferably about 5 to 20 mol% (for example, 5 to 15 mol%). When used in combination with a homopolyester, the proportion of the copolymerizable monomer in the copolymer can be selected, for example, from the range of about 0.1 to 45 mol%, and is usually 1 to 40 mol% (for example, 5 to 40 mol%). %), Preferably about 10 to 35 mol%.
なお、ホモポリエステル(ポリブチレンテレフタレート)と共重合体とを組み合わせて使用する場合、ホモポリエステルとコポリエステルとの割合は、共重合性モノマーの割合が、全単量体に対して0.1〜30モル%(好ましくは1〜25モル%、さらに好ましくは5〜25モル%)程度となる範囲であり、通常、前者/後者=99/1〜1/99(重量比)、好ましくは95/5〜5/95(重量比)、さらに好ましくは90/10〜10/90(重量比)程度の範囲から選択できる。 When a homopolyester (polybutylene terephthalate) and a copolymer are used in combination, the ratio of the homopolyester to the copolyester is such that the ratio of the copolymerizable monomer is 0.1 to The range is about 30 mol% (preferably 1 to 25 mol%, more preferably 5 to 25 mol%), and usually the former / latter = 99/1 to 1/99 (weight ratio), preferably 95 / It can be selected from the range of about 5 to 5/95 (weight ratio), more preferably about 90/10 to 10/90 (weight ratio).
PBT系樹脂は、テレフタル酸又はその反応性誘導体と1,4−ブタンジオールと必要により共重合可能なモノマーとを、慣用の方法、例えば、エステル交換、直接エステル化法などにより共重合することにより製造できる。 The PBT-based resin is obtained by copolymerizing terephthalic acid or a reactive derivative thereof, 1,4-butanediol, and a copolymerizable monomer as necessary with a conventional method such as transesterification or direct esterification. Can be manufactured.
(B)エラストマー
エラストマーには、種々の熱可塑性エラストマーが使用できる。エラストマーの屈折率は、例えば、1.52〜1.59、好ましくは1.53〜1.58程度であってもよい。エラストマーの屈折率が小さすぎたり大きすぎると、透過光の散乱が著しくなり、溶着エネルギーの低下をもたらす。
(B) Elastomer Various thermoplastic elastomers can be used as the elastomer. The refractive index of the elastomer may be, for example, about 1.52 to 1.59, preferably about 1.53 to 1.58. If the refractive index of the elastomer is too small or too large, scattering of transmitted light becomes remarkable, resulting in a decrease in welding energy.
エラストマーは、通常、ハードセグメント(又は硬質性分)とソフトセグメント(又は軟質性分)とで構成されている。エラストマー(熱可塑性エラストマー)としては、例えば、ポリスチレン系エラストマー[スチレン、α−メチルスチレン、ビニルトルエンなどの芳香族ビニル単量体の単独又は共重合体で構成されたハードセグメントと、α−C2−12オレフィン(エチレン、プロピレン、ブテンなど)、ジエン(ブタジエン、イソプレンなど)などから選択された単量体の単独又は共重合体で構成されたソフトセグメントとのブロック共重合体又はその水素添加ブロック共重合体]、ポリエステル系エラストマー[ポリアルキレンアリレート(ポリエチレンテレフタレート、ポリブチレンテレフタレートなどのポリC2−4アルキレンアリレート)、1〜30モル%(例えば、3〜25モル%程度)の共重合成分(イソフタル酸など)で変性又は共重合された変性ポリC2−4アルキレンアリレートで構成されたハードセグメントと、ポリカプロラクトン、オキシC2−6アルキレン単位を有する脂肪族ポリエーテル(ポリC2−6アルキレングリコールなど)や脂肪族ポリエステルで構成されたソフトセグメントとの共重合体]、ポリアミド系エラストマー[ポリアミドで構成されたハードセグメントと、ポリC2−6アルキレングリコールなどの脂肪族ポリエーテルで構成されたソフトセグメントとの共重合体]、ポリウレタン系エラストマー[短鎖グリコールのポリウレタンで構成されたハードセグメントと、脂肪族ポリエーテルや脂肪族ポリエステルで構成されたソフトセグメントとの共重合体、例えば、ポリエステルウレタンエラストマーなど]、ポリオレフィン系エラストマー[ポリスチレン又はポリプロピレンで構成されたハードセグメントと、エチレン・プロピレンゴムやエチレン・プロピレン・ジエンゴムで構成されたソフトセグメントとのエラストマー、結晶性シンジオタクチック1,2−ポリブタジエンをハードセグメント、無定形1,2−ポリブタジエンをソフトセグメントとするシンジオタクチック1,2−ポリブタジエン系エラストマー、結晶性トランス1,4−ポリイソプレンをハードセグメント、非結晶性1,4−ポリイソプレンをソフトセグメントとするトランス1,4−ポリイソプレン系エラストマーなど]などが含まれる。熱可塑性エラストマーのブロック構造は特に制限されず、トリブロック構造、マルチブロック構造、星形ブロック構造などであってもよい。これらの熱可塑性エラストマーは単独で又は二種以上組み合わせて使用できる。 The elastomer is usually composed of a hard segment (or a hard component) and a soft segment (or a soft component). The elastomer (thermoplastic elastomer), for example, a hard segment composed of a polystyrene-based elastomer [styrene, alpha-methyl styrene, homo- or copolymer of an aromatic vinyl monomer such as vinyl toluene, alpha-C 2 -12 Block copolymer with a soft segment composed of a homo- or copolymer of a monomer selected from olefins (ethylene, propylene, butene, etc.), dienes (butadiene, isoprene, etc.) or hydrogenated blocks thereof Copolymer), a polyester-based elastomer [polyalkylene arylate (poly C2-4 alkylene allylate such as polyethylene terephthalate and polybutylene terephthalate), a copolymer component of 1 to 30 mol% (for example, about 3 to 25 mol%) ( Modified or copolymerized with isophthalic acid A hard segment composed of a modified poly C 2-4 alkylene arylate which, polycaprolactone, composed oxy C 2-6 aliphatic polyether having an alkylene unit (poly C 2-6 alkylene glycol) and an aliphatic polyester With a soft segment formed by a soft segment], a polyamide elastomer [a copolymer with a hard segment formed of a polyamide and a soft segment formed of an aliphatic polyether such as poly C2-6 alkylene glycol], Polyurethane elastomers [Copolymers of hard segments composed of short-chain glycol polyurethane and soft segments composed of aliphatic polyether or aliphatic polyester, such as polyester urethane elastomers], polyolefin elastomers An elastomer of a hard segment composed of polystyrene or polypropylene and a soft segment composed of ethylene-propylene rubber or ethylene-propylene-diene rubber, a crystalline syndiotactic 1,2-polybutadiene as a hard segment, amorphous 1,2 -A syndiotactic 1,2-polybutadiene-based elastomer having polybutadiene as a soft segment, a trans 1,4- having a crystalline trans 1,4-polyisoprene as a hard segment and an amorphous 1,4-polyisoprene as a soft segment. Polyisoprene elastomer etc.]. The block structure of the thermoplastic elastomer is not particularly limited, and may be a triblock structure, a multiblock structure, a star block structure, or the like. These thermoplastic elastomers can be used alone or in combination of two or more.
好ましい熱可塑性エラストマーには、ポリエステル系エラストマー、ポリスチレン系エラストマーが含まれる。代表的なポリエステル系エラストマーには、ポリエステル・ポリエステル型熱可塑性エラストマー(例えば、ポリC2−4アルキレンアリレート(特にポリブチレンテレフタレート単位を有する単独重合体、又はエチレングリコール、イソフタル酸などを5〜20モル%程度の割合で共重合させた共重合体)などの芳香族系結晶性ポリエステルで構成されたハードセグメントと、ポリエチレンアジペート、ポリブチレンアジペートなどのC2−6アルキレングリコールとC6−12アルキレンジカルボン酸とのポリエステルなどの脂肪族ポリエステルで構成されたソフトセグメントとのブロック共重合体)、ポリエステル・ポリエーテル型熱可塑性エラストマー(例えば、前記芳香族系結晶性ポリエステルで構成されたハードセグメントと、ポリテトラメチレンエーテルグリコールなどのポリオキシC2−4アルキレングリコールなどのポリエーテルで構成されたソフトセグメントとのブロック共重合体)、液晶性熱可塑性エラストマーなどが含まれる。代表的なポリスチレン系エラストマーとしては、スチレン−ジエン−スチレンブロック共重合体[スチレン−ブタジエン−スチレンブロック共重合体(SBS)、スチレン−イソプレン−スチレンブロック共重合体(SIS)など]、水素添加重合体[スチレン−エチレン・ブチレン−スチレンブロック共重合体(SEBS)、スチレン−エチレン・プロピレン−スチレンブロック共重合体(SEPS)、ランダムスチレン−ブタジエンゴム(SBR)の水素添加重合体、ジエンの不飽和結合がエポキシ化されたエポキシ化スチレン−ジエン共重合体(エポキシ化スチレン−ジエン−スチレンブロック共重合体など)など]が例示でき、これらのエラストマーは、必要により、カルボキシル基、エポキシ基などの官能基を有していてもよい。 Preferred thermoplastic elastomers include polyester-based elastomers and polystyrene-based elastomers. Representative polyester-based elastomers include polyester-polyester type thermoplastic elastomers (for example, poly C 2-4 alkylene arylate (particularly, a homopolymer having a polybutylene terephthalate unit, or 5 to 20 mol of ethylene glycol, isophthalic acid, or the like). %), A hard segment composed of an aromatic crystalline polyester such as a copolymer copolymerized at a ratio of about 2%, C 2-6 alkylene glycol such as polyethylene adipate and polybutylene adipate, and C 6-12 alkylene dicarboxylic acid. A block copolymer with a soft segment composed of an aliphatic polyester such as a polyester with an acid), a polyester / polyether thermoplastic elastomer (for example, a hard segment composed of the aromatic crystalline polyester and Block copolymers of polyoxy C 2-4 soft segment composed of a polyether and alkylene glycols such as polytetramethylene ether glycol), and the like liquid thermoplastic elastomer. Typical polystyrene elastomers include styrene-diene-styrene block copolymers [styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), etc.], hydrogenated weight [Styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (SEPS), hydrogenated polymer of random styrene-butadiene rubber (SBR), unsaturated diene Epoxidized styrene-diene copolymer in which the bond is epoxidized (epoxidized styrene-diene-styrene block copolymer, etc.). These elastomers may be optionally provided with a functional group such as a carboxyl group or an epoxy group. It may have a group.
熱可塑性エラストマーにおいて、ハードセグメント(又は硬質成分)とソフトセグメント(又は軟質成分)との重量割合は、通常、前者/後者=10/90〜90/10程度であり、好ましくは20/80〜80/20、さらに好ましくは30/70〜70/30(例えば、40/60〜60/40)程度である。 In the thermoplastic elastomer, the weight ratio of the hard segment (or the hard component) to the soft segment (or the soft component) is usually about the former / the latter = about 10/90 to 90/10, and preferably about 20/80 to 80/80. / 20, more preferably about 30/70 to 70/30 (for example, 40/60 to 60/40).
エラストマーの使用量は、PBT系樹脂(A)100重量部に対して1〜50重量部(例えば、2〜50重量部)、好ましくは3〜40重量部(例えば、5〜35重量部)、さらに好ましくは5〜30重量部程度である。 The amount of the elastomer used is 1 to 50 parts by weight (for example, 2 to 50 parts by weight), preferably 3 to 40 parts by weight (for example, 5 to 35 parts by weight) with respect to 100 parts by weight of the PBT resin (A). More preferably, it is about 5 to 30 parts by weight.
(C)充填剤又は補強剤
樹脂組成物は充填剤又は補強材(C)を含んでいてもよい。このような補強材(C)には、繊維状補強材[例えば、無機質繊維(例えば、ガラス繊維、アスベスト繊維、カーボン繊維、シリカ繊維、アルミナ繊維、シリカ・アルミナ繊維、アルミニウムシリケート繊維、ジルコニア繊維、チタン酸カリウム繊維、炭化ケイ素繊維、ウィスカー(炭化ケイ素、アルミナ、窒化珪素などのウイスカー)など)、有機質繊維(例えば、脂肪族又は芳香族ポリアミド、芳香族ポリエステル、フッ素樹脂、ポリアクリロニトリルなどのアクリル樹脂、レーヨンなどで形成された繊維)など]、板状補強材[例えば、タルク、マイカ、ガラスフレーク、グラファイトなど]、粉粒状補強材[例えば、ガラスビーズ、ガラス粉、ミルドファイバー(例えば、ミルドガラスファイバーなど)など]、ウォラストナイト(珪灰石)などが含まれ、ウォラストナイトは、板状、柱状、繊維状などの形態であってもよい。繊維状補強材の平均径は、例えば、1〜50μm(好ましくは3〜30μm)程度、平均長は、例えば、100μm〜3mm(好ましくは300μm〜1mm、さらに好ましくは500μm〜1mm)程度であってもよい。また、板状又は粉粒状補強材の平均粒径は、例えば、0.1〜100μm、好ましくは0.1〜50μm(例えば、0.1〜10μm)程度であってもよい。これらの充填剤又は補強材は単独で又は二種以上組み合わせて使用できる。
(C) Filler or reinforcing agent The resin composition may contain a filler or a reinforcing material (C). Such reinforcing materials (C) include fibrous reinforcing materials [for example, inorganic fibers (for example, glass fibers, asbestos fibers, carbon fibers, silica fibers, alumina fibers, silica / alumina fibers, aluminum silicate fibers, zirconia fibers, Potassium titanate fiber, silicon carbide fiber, whisker (whisker of silicon carbide, alumina, silicon nitride, etc.), organic fiber (eg, aliphatic or aromatic polyamide, aromatic polyester, fluororesin, acrylic resin such as polyacrylonitrile) , A fiber formed of rayon, etc.), a plate-like reinforcing material [eg, talc, mica, glass flake, graphite, etc.], a granular reinforcing material [eg, glass beads, glass powder, milled fiber (eg, milled glass)] Fiber, etc.), wollastonite ( Apatite) and the like, wollastonite, plate-like, columnar, may be in the form of such fibers. The average diameter of the fibrous reinforcing material is, for example, about 1 to 50 μm (preferably 3 to 30 μm), and the average length is, for example, about 100 μm to 3 mm (preferably 300 μm to 1 mm, more preferably 500 μm to 1 mm). Is also good. Further, the average particle size of the plate-like or powder-granular reinforcing material may be, for example, about 0.1 to 100 μm, preferably about 0.1 to 50 μm (for example, about 0.1 to 10 μm). These fillers or reinforcing materials can be used alone or in combination of two or more.
これらの補強材のうち、ガラス系又はガラス質充填剤又は補強材(ガラス繊維、ガラスフレーク、ガラスビーズなど)、タルク、マイカ、ウォラストナイト、チタン酸カリウム繊維が好ましい。 Among these reinforcing materials, glass-based or vitreous fillers or reinforcing materials (glass fibers, glass flakes, glass beads, etc.), talc, mica, wollastonite, and potassium titanate fiber are preferable.
充填剤又は補強材(C)の割合は、例えば、PBT系樹脂(A)100重量部に対して0〜100重量部(例えば、0〜80重量部)程度の範囲から選択でき、通常、10〜100重量部(例えば、10〜80重量部)、好ましくは20〜80重量部、さらに好ましくは30〜80重量部(例えば、40〜70重量部)程度であってもよい。 The ratio of the filler or the reinforcing material (C) can be selected, for example, from a range of about 0 to 100 parts by weight (for example, 0 to 80 parts by weight) with respect to 100 parts by weight of the PBT-based resin (A). It may be about 100 to 100 parts by weight (for example, 10 to 80 parts by weight), preferably about 20 to 80 parts by weight, more preferably about 30 to 80 parts by weight (for example, 40 to 70 parts by weight).
(D)樹脂(第2の樹脂)
光透過性を改善するため、PBT系樹脂組成物は、さらに、熱可塑性樹脂(第2の樹脂)を含んでいてもよい。この第2の樹脂としては、例えば、ポリカーボネート(PC)系樹脂(d1)、スチレン系樹脂(d2)、ポリエチレンテレフタレート(PET)系樹脂(d3)などが挙げられる。これらの第2の樹脂(D)は単独で又は二種以上組み合わせて使用できる。なお、樹脂組成物において、ポリブチレンテレフタレート系樹脂(A)と樹脂(D)とのモルホロジーは特に制限されず、均一樹脂系を形成してもよく分散系を形成してもよい。
(D) Resin (second resin)
In order to improve light transmittance, the PBT-based resin composition may further contain a thermoplastic resin (second resin). Examples of the second resin include a polycarbonate (PC) resin (d1), a styrene resin (d2), and a polyethylene terephthalate (PET) resin (d3). These second resins (D) can be used alone or in combination of two or more. In the resin composition, the morphology of the polybutylene terephthalate-based resin (A) and the resin (D) is not particularly limited, and a uniform resin-based or dispersion-based resin may be formed.
(d1)ポリカーボネート(PC)系樹脂
ポリカーボネート系樹脂は、ジヒドロキシ化合物と、ホスゲン又はジフェニルカーボネートなどの炭酸エステルとの反応により得られる。ジヒドロキシ化合物は、脂環族化合物などであってもよいが、好ましくは芳香族化合物(特にビスフェノール化合物)である。
(D1) Polycarbonate (PC) Resin A polycarbonate resin is obtained by reacting a dihydroxy compound with a carbonate such as phosgene or diphenyl carbonate. The dihydroxy compound may be an alicyclic compound or the like, but is preferably an aromatic compound (particularly a bisphenol compound).
ビスフェノール化合物としては、前記PBT系樹脂の項で例示のビスフェノール類[例えば、ビス(ヒドロキシアリール)C1−6アルカン;ビス(ヒドロキシアリール)C4−10シクロアルカン;4,4’−ジヒドロキシジフェニルエーテル;4,4’−ジヒドロキシジフェニルスルホン;4,4’−ジヒドロキシジフェニルスルフィド;4,4’−ジヒドロキシジフェニルケトンなど]が挙げられる。好ましいポリカーボネート系樹脂には、ビスフェノールA型ポリカーボネートが含まれる。 Examples of the bisphenol compound include bisphenols exemplified in the above-mentioned PBT-based resin [for example, bis (hydroxyaryl) C 1-6 alkane; bis (hydroxyaryl) C 4-10cycloalkane ; 4,4′-dihydroxydiphenyl ether; 4,4'-dihydroxydiphenyl sulfone; 4,4'-dihydroxydiphenyl sulfide; 4,4'-dihydroxydiphenyl ketone, etc.]. Preferred polycarbonate resins include bisphenol A type polycarbonate.
(d2)スチレン系樹脂
スチレン系樹脂としては、例えば、スチレン系単量体(例えば、スチレン、ビニルトルエン、α−メチルスチレンなど)の単独又は共重合体;スチレン系単量体とビニル単量体(例えば、(メタ)アクリロニトリルなどの不飽和ニトリル、(メタ)アクリル酸エステル、(メタ)アクリル酸、無水マレイン酸などのα,β−モノオレフィン性不飽和カルボン酸又は酸無水物あるいはそのエステル、マレイミド、N−アルキルマレイミド、N−フェニルマレイミドなどのマレイミド系単量体など)との共重合体;スチレン系グラフト共重合体、スチレン系ブロック共重合体などが挙げられる。ポリスチレン系グラフト共重合体としては、例えば、ゴム成分に、少なくともスチレン系単量体、例えば、スチレン系単量体単独、又はスチレン系単量体とビニル単量体(例えば、(メタ)アクリロニトリル及び(メタ)アクリル酸エステルから選択された少なくとも一種の単量体と、必要によりカルボキシル基又は酸無水物基を有する単量体やマレイミド系単量体など)とをグラフト重合した樹脂が例示できる。ゴム成分としては、ポリブタジエン、アクリルゴム、塩素化ポリエチレン、エチレン−酢酸ビニル共重合体、エチレン−プロピレンゴム、エチレン−プロピレン−ジエンゴム、スチレン−ブタジエン共重合体ゴムなどが例示できる。ポリスチレン系グラフト共重合体としては、例えば、ゴム成分に、少なくともスチレン系単量体(例えば、スチレンと、アクリロニトリル及び/又はメタクリル酸メチル)をグラフト重合した樹脂(例えば、ABS樹脂、MBS樹脂など)などが例示できる。これらのスチレン系樹脂は、単独で又は2種以上組み合わせて使用できる。
(D2) Styrene-based resin As the styrene-based resin, for example, a styrene-based monomer (for example, styrene, vinyltoluene, α-methylstyrene, etc.) alone or a copolymer; (For example, unsaturated nitriles such as (meth) acrylonitrile, (meth) acrylic acid esters, (meth) acrylic acid, α, β-monoolefinic unsaturated carboxylic acids such as maleic anhydride or acid anhydrides or esters thereof, Copolymers with maleimide-based monomers such as maleimide, N-alkylmaleimide and N-phenylmaleimide); styrene-based graft copolymers, styrene-based block copolymers, and the like. Examples of the polystyrene-based graft copolymer include, for example, at least a styrene-based monomer, for example, a styrene-based monomer alone, or a styrene-based monomer and a vinyl monomer (for example, (meth) acrylonitrile and A resin obtained by graft polymerization of at least one monomer selected from (meth) acrylic esters and, if necessary, a monomer having a carboxyl group or an acid anhydride group or a maleimide-based monomer) can be exemplified. Examples of the rubber component include polybutadiene, acrylic rubber, chlorinated polyethylene, ethylene-vinyl acetate copolymer, ethylene-propylene rubber, ethylene-propylene-diene rubber, and styrene-butadiene copolymer rubber. As the polystyrene-based graft copolymer, for example, a resin obtained by graft-polymerizing at least a styrene-based monomer (for example, styrene and acrylonitrile and / or methyl methacrylate) to a rubber component (for example, an ABS resin, an MBS resin, etc.) And the like. These styrene resins can be used alone or in combination of two or more.
好ましいスチレン系樹脂としては、ポリスチレン(GPPS)、スチレン−メタクリル酸メチル共重合体などのスチレン−(メタ)アクリル酸エステル共重合体、スチレン−(メタ)アクリル酸共重合体、スチレン−無水マレイン酸共重合体、スチレン−アクリロニトリル共重合体(AS樹脂)、ゴム成分に少なくともスチレン系単量体がグラフト重合したグラフト共重合体[例えば、耐衝撃性ポリスチレン(HIPS)、ABS樹脂、MBS樹脂など]などが含まれる。 Preferred styrene resins include polystyrene (GPPS), styrene- (meth) acrylate copolymers such as styrene-methyl methacrylate copolymer, styrene- (meth) acrylic acid copolymer, and styrene-maleic anhydride. Copolymer, styrene-acrylonitrile copolymer (AS resin), graft copolymer obtained by graft-polymerizing at least a styrene-based monomer to a rubber component [for example, impact-resistant polystyrene (HIPS), ABS resin, MBS resin, etc.] And so on.
(d3)ポリエチレンテレフタレート(PET)系樹脂
ポリエチレンテレフタレート系樹脂としては、エチレンテレフタレートを主成分(例えば、50〜100重量%、好ましくは60〜100重量%、さらに好ましくは75〜100重量%程度)とするホモポリエステル又はコポリエステル(ポリエチレンテレフタレート、ポリエチレンテレフタレートコポリエステル)などが挙げられる。
(D3) Polyethylene terephthalate (PET) -based resin The polyethylene terephthalate-based resin contains ethylene terephthalate as a main component (for example, about 50 to 100% by weight, preferably about 60 to 100% by weight, more preferably about 75 to 100% by weight). (Polyethylene terephthalate, polyethylene terephthalate copolyester) and the like.
コポリエステル(エチレンテレフタレート系共重合体又は変性PET樹脂)における前記共重合性モノマーとしては、テレフタル酸を除くジカルボン酸、エチレングリコールを除くジオール、オキシカルボン酸、ラクトンなどが挙げられる。これらの共重合性モノマーとしては、ブタンジオールに加えて、前記PBT系樹脂の項で例示の共重合性モノマーがそれぞれ使用できる。共重合性モノマーは一種で又は二種以上組み合わせて使用できる。 Examples of the copolymerizable monomer in the copolyester (ethylene terephthalate copolymer or modified PET resin) include dicarboxylic acids other than terephthalic acid, diols other than ethylene glycol, oxycarboxylic acids, and lactones. As these copolymerizable monomers, in addition to butanediol, the copolymerizable monomers exemplified in the section of the PBT resin can be used. The copolymerizable monomers can be used alone or in combination of two or more.
好ましい共重合性モノマーとしては、前記PBT系樹脂の項で例示のモノマー、例えば、ジオール類[C3−6アルキレングリコール(トリメチレングリコール、プロピレングリコール、ブタンジオールなどの直鎖状又は分岐鎖状アルキレングリコールなど)、(ポリ)オキシアルキレングリコール、ビスフェノール類又はそのアルキレンオキサイド付加体、ジカルボン酸類[C6−12脂肪族ジカルボン酸、非対称芳香族ジカルボン酸、1,4−シクロヘキサンジメタノールなど]などが挙げられる。 Preferable copolymerizable monomers include the monomers exemplified in the section of the PBT resin, for example, diols [C 3-6 alkylene glycol (linear or branched alkylene such as trimethylene glycol, propylene glycol and butanediol). Glycol, etc.), (poly) oxyalkylene glycol, bisphenols or alkylene oxide adducts thereof, dicarboxylic acids [C 6-12 aliphatic dicarboxylic acid, asymmetric aromatic dicarboxylic acid, 1,4-cyclohexanedimethanol, etc.] and the like. Can be
共重合体において、共重合性モノマーの割合(変性量)は、1〜30モル%、好ましくは3〜25モル%、さらに好ましくは5〜20モル%程度である。 In the copolymer, the proportion (modification amount) of the copolymerizable monomer is about 1 to 30 mol%, preferably about 3 to 25 mol%, and more preferably about 5 to 20 mol%.
PET系樹脂は、テレフタル酸とエチレングリコールと必要により共重合性モノマーとを、慣用の方法、例えば、エステル交換、直接エステル化法などにより共重合することにより得られる。 The PET resin is obtained by copolymerizing terephthalic acid, ethylene glycol and, if necessary, a copolymerizable monomer by a conventional method, for example, transesterification or direct esterification.
前記樹脂(D)の使用量は、例えば、PBT系樹脂(A)100重量部に対して、0〜80重量部(例えば、0〜50重量部)程度の範囲から選択でき、通常、5〜80重量部(例えば、5〜60重量部)、好ましくは10〜60重量部(例えば、20〜40重量部)、さらに好ましくは10〜50重量部(例えば、10〜30重量部)程度であってもよい。樹脂(D)の使用量が少ないと、前記エラストマーによる耐衝撃性及び耐冷熱サイクル特性がさほど改善せず、多すぎると機械的強度が低下しやすい。 The amount of the resin (D) can be selected, for example, from a range of about 0 to 80 parts by weight (for example, 0 to 50 parts by weight) with respect to 100 parts by weight of the PBT resin (A). It is about 80 parts by weight (for example, 5 to 60 parts by weight), preferably about 10 to 60 parts by weight (for example, 20 to 40 parts by weight), and more preferably about 10 to 50 parts by weight (for example, 10 to 30 parts by weight). You may. If the amount of the resin (D) is small, the impact resistance and the thermal cycling resistance of the elastomer do not improve so much. If the amount is too large, the mechanical strength tends to decrease.
樹脂組成物には、種々の添加剤、例えば、安定剤(酸化防止剤、紫外線吸収剤、熱安定剤など)、難燃剤、滑剤、離型剤、帯電防止剤、染顔料などの着色剤、分散剤、可塑剤、核剤などを添加してもよい。また、必要であれば、他の樹脂(熱可塑性樹脂、熱硬化性樹脂など)と組合せて用いてもよい。なお、核剤とエラストマー(B)とを組み合わせると、熱溶着強度のバラツキを改善でき、確実かつ容易に溶着できる。そのため、本発明の樹脂組成物は、PBT系樹脂とエラストマーと核剤との組合せ、PBT系樹脂とエラストマーと第2の樹脂と核剤との組合せで構成してもよい。核剤としては、有機核剤を使用してもよいが、無機核剤(例えば、シリカ、アルミナ、ジルコニア、酸化チタンなどの金属酸化物;炭酸カルシウム、炭酸バリウムなどの金属炭酸塩;タルクなどの板状無機物又は珪酸塩;炭化ケイ素などの金属炭化物;窒化ケイ素、窒化ホウ素、窒化タンタルなどの金属窒化物など)を使用する場合が多い。無機核剤の平均粒子径は、例えば、0.01〜10μm、好ましくは0.01〜5μm(例えば、0.01〜2μm)、さらに好ましくは0.01〜1μm程度であってもよい。PBT系樹脂(A)100重量部に対する核剤の割合は、0.001〜5重量部(例えば、0.01〜5重量部)、好ましくは0.01〜3重量部(例えば、0.01〜2重量部)、さらに好ましくは0.01〜1重量部(例えば、0.01〜0.5重量部)程度であってもよい。エラストマー(B)100重量部に対する核剤の割合は、0.01〜10重量部、好ましくは0.05〜5重量部(例えば、0.05〜2.5重量部)、さらに好ましくは0.1〜1重量部(例えば、0.1〜0.5重量部)程度であってもよい。 Various additives such as stabilizers (antioxidants, ultraviolet absorbers, heat stabilizers, etc.), flame retardants, lubricants, mold release agents, antistatic agents, coloring agents such as dyes and pigments, You may add a dispersing agent, a plasticizer, a nucleating agent, etc. If necessary, it may be used in combination with another resin (such as a thermoplastic resin or a thermosetting resin). When the nucleating agent and the elastomer (B) are combined, the variation in the heat welding strength can be improved, and the welding can be performed reliably and easily. Therefore, the resin composition of the present invention may be composed of a combination of a PBT-based resin, an elastomer, and a nucleating agent, or a combination of a PBT-based resin, an elastomer, a second resin, and a nucleating agent. As the nucleating agent, an organic nucleating agent may be used, but inorganic nucleating agents (for example, metal oxides such as silica, alumina, zirconia, and titanium oxide; metal carbonates such as calcium carbonate and barium carbonate; talc and the like) Plate-like inorganic substances or silicates; metal carbides such as silicon carbide; metal nitrides such as silicon nitride, boron nitride, and tantalum nitride). The average particle diameter of the inorganic nucleating agent may be, for example, about 0.01 to 10 μm, preferably about 0.01 to 5 μm (eg, about 0.01 to 2 μm), and more preferably about 0.01 to 1 μm. The ratio of the nucleating agent to 100 parts by weight of the PBT resin (A) is 0.001 to 5 parts by weight (for example, 0.01 to 5 parts by weight), preferably 0.01 to 3 parts by weight (for example, 0.01 to 0.01 parts by weight). To 2 parts by weight), more preferably about 0.01 to 1 part by weight (e.g., 0.01 to 0.5 part by weight). The ratio of the nucleating agent to 100 parts by weight of the elastomer (B) is 0.01 to 10 parts by weight, preferably 0.05 to 5 parts by weight (for example, 0.05 to 2.5 parts by weight), and more preferably 0.1 to 2.5 parts by weight. It may be about 1 to 1 part by weight (for example, 0.1 to 0.5 part by weight).
本発明のPBT系樹脂組成物は、粉粒体混合物や溶融混合物(ペレットなど)であってもよい。本発明の樹脂組成物は、成形性が高く、機械的強度や耐熱性の高い成形体又は成形品を製造できる。特に、本発明の樹脂組成物で形成した成形品は、PBT系樹脂組成物で形成されているにも拘わらず、光線透過性(特に、レーザ光に対する光線透過性)が高く、レーザー溶着に適している。例えば、射出成形により形成された厚さ2mmの成形品において、800〜1000nmの波長の光線透過率は20%以上(例えば、20〜70%程度)、好ましくは25%以上(例えば、25〜60%程度)、さらに好ましくは30%以上(例えば、30〜50%程度)である。しかも、本発明の樹脂組成物は、レーザ光による溶着性が高いので、レーザ光を利用して溶着するための成形体を製造するのに有用である。 The PBT-based resin composition of the present invention may be a powder mixture or a melt mixture (such as pellets). The resin composition of the present invention has high moldability and can produce a molded article or molded article having high mechanical strength and heat resistance. In particular, the molded article formed of the resin composition of the present invention has high light transmittance (particularly, light transmittance to laser light) despite being formed of the PBT-based resin composition, and is suitable for laser welding. ing. For example, in a molded product having a thickness of 2 mm formed by injection molding, the light transmittance at a wavelength of 800 to 1000 nm is 20% or more (for example, about 20 to 70%), preferably 25% or more (for example, 25 to 60). %), More preferably 30% or more (for example, about 30 to 50%). In addition, the resin composition of the present invention has high weldability with laser light, and thus is useful for producing a molded article to be welded using laser light.
[成形体]
成形体は、PBT系樹脂(A)と、エラストマー(B)と、必要により補強材(C)及び/又は樹脂(D)などで構成された樹脂組成物を慣用の方法、例えば、(1)各成分を混合して、一軸又は二軸の押出機により混練し押出してペレットを調製した後、成形する方法、(2)一旦、組成の異なるペレット(マスターバッチ)を調製し、そのペレットを所定量混合(希釈)して成形に供し、所定の組成の成形品を得る方法、(3)成形機に各成分の1又は2以上を直接仕込む方法などで製造できる。なお、ペレットは、例えば、脆性成分(ガラス系補強材など)を除く成分を溶融混合した後に、脆性成分(ガラス系補強材など)を混合することにより調製してもよい。
[Molded body]
The molded body is prepared by using a resin composition composed of a PBT-based resin (A), an elastomer (B) and, if necessary, a reinforcing material (C) and / or a resin (D) in a conventional manner, for example, (1) A method in which each component is mixed, kneaded and extruded with a single-screw or twin-screw extruder to prepare pellets, and then molded. (2) A pellet (master batch) having a different composition is once prepared, and the pellet is placed in a desired place. It can be produced by a method of mixing (diluting) quantitatively and subjecting it to molding to obtain a molded article of a predetermined composition, or (3) a method of directly charging one or more of each component to a molding machine. The pellets may be prepared by, for example, melting and mixing components other than a brittle component (such as a glass-based reinforcing material) and then mixing a brittle component (such as a glass-based reinforcing material).
成形体は、前記PBT系樹脂組成物を溶融混練し、押出成形、射出成形、圧縮成形、ブロー成形、真空成形、回転成形、ガスインジェクションモールディングなどの慣用の方法で成形してもよいが、通常、射出成形により成形される。特に、本発明の樹脂組成物は耐ヒートショック性が高いため、インサート成形に適している。 The molded body may be melt-kneaded with the PBT resin composition and molded by a conventional method such as extrusion molding, injection molding, compression molding, blow molding, vacuum molding, rotational molding, gas injection molding, etc. , Formed by injection molding. In particular, the resin composition of the present invention has high heat shock resistance and is therefore suitable for insert molding.
成形品の形状は特に制限されないが、成形品をレーザー溶着により相手材(他の樹脂成形品)と接合して用いるため、通常、少なくとも接触面(平面など)を有する形状(例えば、板状)である。また、本発明の成形体はレーザ光に対する透過性が高いので、レーザ光が透過する部位の成形品の厚み(レーザ光が透過する方向の厚み)は、広い範囲から選択でき、例えば、0.1〜5mm、好ましくは0.1〜3mm(例えば、0.5〜3mm)程度であってもよい。 Although the shape of the molded product is not particularly limited, since the molded product is used by being joined to a counterpart material (other resin molded product) by laser welding, the shape usually has at least a contact surface (such as a flat surface) (for example, a plate shape). It is. Further, since the molded article of the present invention has high transparency to laser light, the thickness (thickness in the direction in which laser light is transmitted) of the molded article at a portion where laser light is transmitted can be selected from a wide range. It may be about 1 to 5 mm, preferably about 0.1 to 3 mm (for example, 0.5 to 3 mm).
レーザ光源としては、特に制限されず、例えば、色素レーザ、気体レーザ(エキシマレーザ、アルゴンレーザ、クリプトンレーザ、ヘリウム−ネオンレーザなど)、固体レーザ(YAGレーザなど)、半導体レーザなどが利用できる。レーザ光としては、通常、パルスレーザが利用される。 The laser light source is not particularly limited, and examples thereof include a dye laser, a gas laser (such as an excimer laser, an argon laser, a krypton laser, and a helium-neon laser), a solid-state laser (such as a YAG laser), and a semiconductor laser. Generally, a pulse laser is used as the laser light.
前記成形品は、レーザー溶着性に優れているため、通常、レーザー溶着により相手材の樹脂成形品と溶着させるのが好ましいが、必要であれば、他の熱溶着法、例えば、振動溶着法、超音波溶着法、熱板溶着法などにより他の樹脂成形品と溶着させることもできる。 Since the molded product is excellent in laser welding property, it is usually preferable to weld with a resin molded product of a mating material by laser welding, but if necessary, another heat welding method, for example, a vibration welding method, It can be welded to another resin molded product by an ultrasonic welding method, a hot plate welding method, or the like.
本発明はレーザー溶着した複合成形品も開示する。この複合成形品は、前記PBT系樹脂組成物で形成された成形品(第1の成形品)と、相手材の樹脂成形品(第2の成形品、被着体)とがレーザー溶着により接合され、一体化されている。例えば、第1の成形品と第2の成形品とを接触(特に少なくとも接合部を面接触)させ、レーザ光を照射することにより、第1の成形品と第2の成形品との界面を少なくとも部分的に溶融させて接合面を密着させ、冷却することにより二種の成形品を接合、一体化して1つの成形体とすることができる。このような複合成形体において、本発明の成形体を用いると、融着により高い接合強度が得られ、レーザ光の照射により融着していない非融着部材と同等の高い融着強度を保持できる。 The present invention also discloses a laser-molded composite molded article. In this composite molded article, a molded article (first molded article) formed of the PBT-based resin composition and a resin molded article (second molded article, adherend) of a mating material are joined by laser welding. It is integrated. For example, the interface between the first molded article and the second molded article is formed by bringing the first molded article and the second molded article into contact with each other (particularly at least at the joint portion in plane contact) and irradiating the laser beam. The two types of molded articles can be joined and integrated into one molded article by at least partially melting and bringing the joining surfaces into close contact and cooling. In such a composite molded article, when the molded article of the present invention is used, a high bonding strength is obtained by fusion, and a high fusion strength equivalent to that of a non-fused member not fused by laser light irradiation is maintained. it can.
前記相手材の樹脂成形品を構成する樹脂としては、特に制限されず、種々の熱可塑性樹脂、例えば、オレフィン系樹脂、ビニル系樹脂、スチレン系樹脂、アクリル系樹脂、ポリエステル系樹脂、ポリアミド系樹脂、ポリカーボネート系樹脂などが挙げられる。これらの樹脂のうち、前記PBT系樹脂組成物を構成する樹脂と同種類又は同系統の樹脂(PBT系樹脂、PET系樹脂などのポリエステル系樹脂(芳香族ポリエステル系樹脂)、ポリカーボネート系樹脂、スチレン系樹脂、アクリル系樹脂など)又はその組成物で相手材を構成してもよい。例えば、第1の成形体と第2の成形体とを、それぞれ、本発明のPBT系樹脂組成物で形成してもよい。 The resin constituting the resin molded product of the counterpart material is not particularly limited, and various thermoplastic resins, for example, olefin resin, vinyl resin, styrene resin, acrylic resin, polyester resin, polyamide resin And polycarbonate-based resins. Among these resins, polyester resins (aromatic polyester resins) such as resins of the same type or the same type as the resins constituting the PBT resin composition (PBT resins, PET resins, etc.), polycarbonate resins, styrene Base resin, acrylic resin, etc.) or its composition. For example, each of the first molded body and the second molded body may be formed of the PBT-based resin composition of the present invention.
被着体は、レーザ光に対する吸収剤又は着色剤を含んでいてもよい。前記着色剤は、レーザ光の波長に応じて選択でき、無機顔料[カーボンブラック(例えば、アセチレンブラック、ランプブラック、サーマルブラック、ファーネスブラック、チャンネルブラック、ケッチェンブラックなど)などの黒色顔料、酸化鉄赤などの赤色顔料、モリブデートオレンジなどの橙色顔料、酸化チタンなどの白色顔料など]、有機顔料(黄色顔料、橙色顔料、赤色顔料、青色顔料、緑色顔料など)などが挙げられる。これらの吸収剤は単独で又は二種以上組み合わせて使用できる。吸収剤としては、通常、黒色顔料又は染料、特にカーボンブラックが使用できる。カーボンブラックの平均粒子径は、通常、10〜1000nm、好ましくは10〜100nm程度であってもよい。着色剤の割合は、被着体全体に対して0.1〜10重量%、好ましくは0.5〜5重量%(例えば、0.5〜3重量%)程度である。 The adherend may include an absorber or a colorant for laser light. The colorant can be selected according to the wavelength of the laser beam, and can be selected from inorganic pigments such as black pigments such as carbon black (eg, acetylene black, lamp black, thermal black, furnace black, channel black, Ketjen black), and iron oxide. Red pigments such as red, orange pigments such as molybdate orange, white pigments such as titanium oxide, etc.), and organic pigments (such as yellow pigments, orange pigments, red pigments, blue pigments, and green pigments). These absorbents can be used alone or in combination of two or more. Usually, black pigments or dyes, especially carbon black, can be used as the absorbent. The average particle size of the carbon black may be generally from 10 to 1000 nm, preferably from about 10 to 100 nm. The ratio of the colorant is about 0.1 to 10% by weight, preferably about 0.5 to 5% by weight (for example, 0.5 to 3% by weight) based on the whole adherend.
レーザ光の照射は、通常、第1の成形体から第2の成形体の方向に向けて行われ、吸収剤又は着色剤を含む第2の成形体の界面で発熱させることにより、第1の成形体と第2の成形体とを融着させる。なお、必要によりレンズ系を利用して、第1の成形品と第2の成形品との界面にレーザ光を集光させ接触界面を融着してもよい。 Irradiation of laser light is usually performed from the first molded body toward the second molded body, and is caused to generate heat at the interface of the second molded body containing the absorbing agent or the coloring agent, so that the first molded body is heated. The compact and the second compact are fused. If necessary, a laser beam may be focused on the interface between the first molded product and the second molded product by using a lens system to fuse the contact interface.
本発明の好ましい態様は、次の通りである。 Preferred embodiments of the present invention are as follows.
(1)ブチレンテレフタレート単位を有するホモポリエステル(ポリブチレンテレフタレート)及びコポリエステル(変性ポリブチレンテレフタレート、又はポリブチレンテレフタレート系コポリエステル)から選択された少なくとも一種のポリブチレンテレフタレート系樹脂(A)100重量部に対して、ポリスチレン系熱可塑性エラストマーおよびポリエステル系熱可塑性エラストマーから選択された少なくとも一種の熱可塑性エラストマー(B)2〜50重量部と、充填剤又は補強剤(C)0〜100重量部と、ポリカーボネート系樹脂(d1)、スチレン系樹脂(d2)およびポリエチレンテレフタレート系樹脂(d3)から選択された少なくとも一種の樹脂(D)0〜80重量とで構成され、レーザー溶着可能なポリブチレンテレフタレート系樹脂組成物。 (1) 100 parts by weight of at least one kind of polybutylene terephthalate-based resin (A) selected from homopolyester (polybutylene terephthalate) and copolyester (modified polybutylene terephthalate or polybutylene terephthalate-based copolyester) having butylene terephthalate unit And at least one thermoplastic elastomer (B) selected from a polystyrene thermoplastic elastomer and a polyester thermoplastic elastomer (B) in an amount of 2 to 50 parts by weight, and a filler or reinforcing agent (C) in an amount of 0 to 100 parts by weight. At least one resin (D) selected from the group consisting of a polycarbonate resin (d1), a styrene resin (d2) and a polyethylene terephthalate resin (d3); Tallates resin composition.
(2)充填剤又は補強剤(C)及び樹脂(D)のうち少なくとも一方の成分を含む上記樹脂組成物。 (2) The resin composition containing at least one of a filler or reinforcing agent (C) and a resin (D).
(3)コポリエステルが、フタル酸、イソフタル酸、ビスフェノールAのアルキレンオキサイド付加体、及びこれらの反応性誘導体から選択された少なくとも一種の共重合性モノマー3〜25モル%が共重合したポリブチレンテレフタレート系コポリエステルである上記樹脂組成物。 (3) Polybutylene terephthalate in which the copolyester is copolymerized with 3 to 25 mol% of at least one copolymerizable monomer selected from phthalic acid, isophthalic acid, an alkylene oxide adduct of bisphenol A, and a reactive derivative thereof. The above resin composition which is a system copolyester.
(4)ポリブチレンテレフタレート系樹脂(A)100重量部に対して、熱可塑性エラストマー(B)5〜30重量部、充填剤又は補強剤(C)0〜80重量部、樹脂(D)0〜50重量部を含む上記樹脂組成物。 (4) With respect to 100 parts by weight of polybutylene terephthalate resin (A), 5 to 30 parts by weight of thermoplastic elastomer (B), 0 to 80 parts by weight of filler or reinforcing agent (C), 0 to 0 parts of resin (D) The above resin composition containing 50 parts by weight.
(5)インサート成形可能であるとともに、レーザー光により相手材としての樹脂成形体と溶着可能である上記樹脂組成物。 (5) The above resin composition which can be insert-molded and can be welded to a resin molding as a mating material by laser light.
(6)前記樹脂組成物で形成された射出成形品。 (6) An injection molded article formed from the resin composition.
(7)金属部材を含むインサート成形品である上記成形品。 (7) The above-mentioned molded product which is an insert molded product including a metal member.
本発明で得られた複合成形品は、高い溶着強度を有し、レーザ光照射によるPBT系樹脂の損傷も少ないため、種々の用途、例えば、電気・電子部品、オフィスオートメート(OA)機器部品、家電機器部品、機械機構部品、自動車機構部品などに適用できる。特に、自動車電装部品(各種コントロールユニット、イグニッションコイル部品など)、モーター部品、各種センサー部品、コネクター部品、スイッチ部品、リレー部品、コイル部品、トランス部品、ランプ部品などに好適に用いることができる。 The composite molded product obtained by the present invention has a high welding strength and has little damage to the PBT resin due to laser beam irradiation, so that it can be used in various applications, for example, electric / electronic parts, office automation (OA) equipment parts. It can be applied to home electric appliance parts, mechanical mechanism parts, automobile mechanism parts, etc. In particular, it can be suitably used for automotive electrical components (various control units, ignition coil components, etc.), motor components, various sensor components, connector components, switch components, relay components, coil components, transformer components, lamp components, and the like.
以下に、実施例に基づいて本発明をより詳細に説明するが、本発明はこれらの実施例により限定されるものではない。 Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.
実施例1〜12及び比較例1〜5
実施例及び比較例では、以下のPBT系樹脂(A)、エラストマー(B)、充填剤(C)、樹脂(D)及び添加剤を用いた。
Examples 1 to 12 and Comparative Examples 1 to 5
In Examples and Comparative Examples, the following PBT-based resin (A), elastomer (B), filler (C), resin (D) and additives were used.
PBT系樹脂(A)
(A−1)PBT樹脂:ポリブチレンテレフタレート(ウィンテックポリマー(株)製)
(A−2)変性PBT樹脂:ジメチルイソフタル酸(DMI)変性PBT樹脂
テレフタル酸と1,4−ブタンジオールとの反応において、テレフタル酸の一部(12.5モル%)に代えて、共重合成分としてのジメチルイソフタル酸(DMI)12.5モル%を用い、変性ポリブチレンテレフタレートを調製した。
PBT resin (A)
(A-1) PBT resin: polybutylene terephthalate (manufactured by Wintech Polymer Co., Ltd.)
(A-2) Modified PBT resin: dimethyl isophthalic acid (DMI) modified PBT resin In the reaction between terephthalic acid and 1,4-butanediol, copolymerization is performed in place of part (12.5 mol%) of terephthalic acid. Using 12.5 mol% of dimethyl isophthalic acid (DMI) as a component, modified polybutylene terephthalate was prepared.
(A−3)変性PBT樹脂:ジメチルイソフタル酸(DMI)変性PBT樹脂
テレフタル酸と1,4−ブタンジオールとの反応において、テレフタル酸の一部(30モル%)に代えて、共重合成分としてのジメチルイソフタル酸(DMI)30モル%を用い、変性ポリブチレンテレフタレートを調製した。
(A-3) Modified PBT resin: dimethyl isophthalic acid (DMI) modified PBT resin In the reaction between terephthalic acid and 1,4-butanediol, a copolymer component is used instead of part (30 mol%) of terephthalic acid. Of dimethyl isophthalic acid (DMI) was used to prepare a modified polybutylene terephthalate.
エラストマー(B)
(B−1)ポリエステル系熱可塑性エラストマー[東洋紡(株)製「ペルプレンP−90BD」]
(B−2)ポリエステル系熱可塑性エラストマー[東洋紡(株)製「ペルプレンS2002」]
(B−3)ESBS:エポキシ基含有ポリスチレン系熱可塑性エラストマー[ダイセル化学工業(株)製「エポフレンドAT504」]
(B−4)ESBS:エポキシ基含有ポリスチレン系熱可塑性エラストマー[ダイセル化学工業(株)製「エポフレンドAT510」]
(B−5)アクリル系熱可塑性エラストマー[日本油脂(株)製「モディパーA5300」]
(B−6)EMAGMA:エチルメタクリレート−グリシジルメタクリレート
共重合体[アトフィナジャパン(株)製「ロタダーA8930」]
(B−7)EEA:エチレン−エチルアクリレート共重合体[日本ユニカー(株)製「NUC−6570」]
無機充填材(C)
(C−1)ガラス繊維(日東紡績(株)製「CS3J−948S」平均繊維径φ11μm、平均繊維長400μm)
(C−2)ガラスフレーク(日本硝子繊維(株)製「REFG−101」)
(C−3)マイカ(山口雲母(株)製「21PU」)
熱可塑性樹脂(D)
(D−1)PC:ポリカーボネート樹脂(帝人化成(株)製,「パンライトL−1225」)
(D−2)AS:アクロリニトリル−スチレン樹脂(ダイセル化学工業(株)製,「セビアンN AP−20」)
(D−3)PET:ポリエチレンテレフタレート系樹脂[鐘紡(株)製「EFG−10」]
添加剤(E)
窒化ホウ素(水島合金鉄(株)製、「ボロンナイトライドFS−1」,平均粒子径0.1〜0.5μm)
表1及び表2に示す割合で、2軸押出機(日本製鋼所(株)製,30mmφ)により250℃にて混錬し、ペレットを作製した。得られたペレットを用いて射出成形機((株)東芝製)により、シリンダー温度260℃及び金型温度80℃の条件で試験片A(縦8cm×横1cm×厚さ2mm)を成形した。
Elastomer (B)
(B-1) Polyester-based thermoplastic elastomer [“Perprene P-90BD” manufactured by Toyobo Co., Ltd.]
(B-2) Polyester-based thermoplastic elastomer [“Perprene S2002” manufactured by Toyobo Co., Ltd.]
(B-3) ESBS: Epoxy group-containing polystyrene-based thermoplastic elastomer [“Epofriend AT504” manufactured by Daicel Chemical Industries, Ltd.]
(B-4) ESBS: Epoxy group-containing polystyrene-based thermoplastic elastomer [“Epofriend AT510” manufactured by Daicel Chemical Industries, Ltd.]
(B-5) Acrylic thermoplastic elastomer [“MODIPA A5300” manufactured by NOF Corporation]
(B-6) EMAGMMA: Ethyl methacrylate-glycidyl methacrylate copolymer [“Rotada A8930” manufactured by Atofina Japan Co., Ltd.]
(B-7) EEA: ethylene-ethyl acrylate copolymer [NUC-6570 manufactured by Nippon Unicar Co., Ltd.]
Inorganic filler (C)
(C-1) Glass fiber (“Nitto Boseki Co., Ltd.“ CS3J-948S ”average fiber diameter φ11 μm, average fiber length 400 μm)
(C-2) Glass flakes (“REFG-101” manufactured by Nippon Glass Fiber Co., Ltd.)
(C-3) Mica (“21PU” manufactured by Mika Yamaguchi Co., Ltd.)
Thermoplastic resin (D)
(D-1) PC: polycarbonate resin (manufactured by Teijin Chemicals Limited, "Panlite L-1225")
(D-2) AS: Acrolinitrile-styrene resin ("Sebian NAP-20", manufactured by Daicel Chemical Industries, Ltd.)
(D-3) PET: polyethylene terephthalate-based resin [“EFG-10” manufactured by Kanebo Co., Ltd.]
Additive (E)
Boron nitride (manufactured by Mizushima Alloy Irons Co., Ltd., "Boron nitride FS-1", average particle size 0.1 to 0.5 [mu] m)
Pellets were produced by kneading at a rate shown in Tables 1 and 2 at 250 ° C. using a twin-screw extruder (30 mmφ, manufactured by Nippon Steel Works, Ltd.). A test piece A (8 cm long × 1 cm wide × 2 mm thick) was formed from the obtained pellets by an injection molding machine (manufactured by Toshiba Corporation) under the conditions of a cylinder temperature of 260 ° C. and a mold temperature of 80 ° C.
また、前記試験片Aに対する被溶着試験片Bとして、前記ペレット100重量部と黒色着色用カーボンブラック(ウィンテックポリマー(株)製,商品名「2020C」)3重量部とを用いる以外、試験片Aと同様にして、着色した試験片Bを作製した。なお、試験片Bはレーザ光による発熱体として作用する。 In addition, as a test piece B to be welded to the test piece A, a test piece was used except that 100 parts by weight of the pellet and 3 parts by weight of carbon black for black coloring (trade name “2020C”, manufactured by Wintech Polymer Co., Ltd.) were used. A colored test piece B was produced in the same manner as in A. In addition, the test piece B functions as a heating element by the laser beam.
図1に示すように、試験片B(4)に対して試験片A(3)の一部を重ねて接触させ、レーザー溶着機(ライスター社製)を用いて、光源又はレーザー発振器(1)からのレーザー光(2)の焦点を調整し、試験片Aと試験片Bとの接触面に線幅w(2mm)で集光させた。そして、波長940nmのレーザー光(2)を試験片A(3)側から、出力0〜60W及び走査速度3〜15mm/秒の条件で照射して溶着を行った。 As shown in FIG. 1, a part of the test piece A (3) is brought into contact with the test piece B (4) by overlapping, and a light source or a laser oscillator (1) is used using a laser welding machine (manufactured by Leister). The focus of the laser beam (2) was adjusted, and focused on the contact surface between the test piece A and the test piece B with a line width w (2 mm). Then, welding was performed by irradiating a laser beam (2) having a wavelength of 940 nm from the test piece A (3) side under the conditions of an output of 0 to 60 W and a scanning speed of 3 to 15 mm / sec.
(1)溶着強度の測定
引張試験機(オリエンテック製,RTC−1325)を用いてレーザ溶着した試験片Aと試験片Bとを10mm/分で引張せん断し、溶着強度を測定した。
(1) Measurement of welding strength A laser-welded test piece A and a test piece B were tensile-sheared at 10 mm / min using a tensile tester (manufactured by Orientec, RTC-1325), and the welding strength was measured.
(2)光線透過率
分光光度計(日本分光(株)製,V570)を用いて、波長940nmでの試験片Aの光線透過率を測定した。
(2) Light transmittance The light transmittance of the test piece A at a wavelength of 940 nm was measured using a spectrophotometer (V570, manufactured by JASCO Corporation).
(3)エラストマーの屈折率
上記エラストマー(B)の屈折率を試験片C(縦40mm×横10mm×厚さ1mm)またはフィルムについて測定した。
(3) Refractive Index of Elastomer The refractive index of the elastomer (B) was measured for a test piece C (40 mm long × 10 mm wide × 1 mm thick) or a film.
(4)高低温衝撃特性(冷熱サイクル性)
ペレットを用い、樹脂温度270℃、金型温度65℃、射出時間25秒、冷却時間10秒で、試験片成形用金型(縦22mm×横22mm×高さ51mmの角柱内部に、縦18mm×横18mm×高さ30mmの鉄芯をインサートする金型)に、一部の樹脂成形部の最小肉厚が1mmとなるようにインサート射出成形し、インサート成形品を製造した。得られたインサート成形品について、冷熱衝撃試験機を用いて140℃にて1時間30分加熱後、−40℃に降温して1時間30分冷却後、さらに140℃に昇温する過程を1サイクルとする高低温衝撃試験を行い、成形品にクラックが入るまでのサイクル数を測定し、高低温衝撃性を評価した。
(4) High / low temperature impact characteristics (cooling / heating cycle properties)
Using pellets, a resin temperature of 270 ° C., a mold temperature of 65 ° C., an injection time of 25 seconds, and a cooling time of 10 seconds were used to form a test piece molding die (in a prism of 22 mm long × 22 mm wide × 51 mm high, 18 mm long × Insert molding was performed on a metal mold (inserting an iron core having a width of 18 mm and a height of 30 mm) so that the minimum thickness of some of the resin moldings was 1 mm to produce insert molded products. The obtained insert molded product was heated at 140 ° C. for 1 hour and 30 minutes using a thermal shock tester, cooled to −40 ° C., cooled for 1 hour and 30 minutes, and further heated to 140 ° C. A high and low temperature impact test was performed as a cycle, and the number of cycles until a crack was formed in the molded product was measured to evaluate the high and low temperature impact resistance.
実施例及び比較例の結果を表1及び表2に示す。 Tables 1 and 2 show the results of Examples and Comparative Examples.
1…光源
2…レーザー光
3…試験片A
4…試験片B
1. Light source 2. Laser light 3. Test piece A
4: Test piece B
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