JP2004126054A - Display element and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light weight, high performance and high resolution display element and to provide a method of manufacturing the same. <P>SOLUTION: The display device is provided with a first substrate 10 in which a resin substrate 12 and a first glass substrate 11 are stuck to each other via an adhesive layer and which has a first display region where elements are formed on the first glass substrate, a signal connection part 15 formed at the external part of the display region and wiring 14 connecting the signal connection part to the elements; a second substrate 20 wherein a resin substrate 22 and a second glass substrate 21 are stuck to each other via an adhesive layer, which has a second display region and is held leaving a prescribed interval between the second substrate and the first substrate so that the first display region and the second display region are opposed to and superposed on each other between the inner sides of the first and the second glass substrates and whose end surface is positioned above the wiring; and a material film 18 consisting of a material which cuts off light-shielding a laser beam in the UV region and provided at the position on the wiring of the first substrate corresponding to the end surface 25 of the second substrate. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a display element and a method for manufacturing the same.
[0002]
[Prior art]
Today, liquid crystal displays (hereinafter, also referred to as LCDs) and organic EL displays (hereinafter, also referred to as OLEDs) are used for display of mobile information devices such as notebook computers, televisions, mobile phones, and personal digital assistants (hereinafter, also referred to as PDAs). Widely used as terminals. However, most of currently used LCDs and OLEDs are formed on a glass substrate having a thickness of about 0.7 mm. For this reason, as a demand for display elements including LCDs and OLEDs, further reduction in thickness and weight are required.
In order to satisfy these requirements, materials such as thin glass, thermosetting resin, ultraviolet (hereinafter also referred to as UV) curable resin, thermoplastic resin, and other plastic materials having a lower specific gravity than glass are used for LCDs and OLEDs. Used as a substrate. For example, Non-Patent Document 1 discloses an LCD in which a thin film transistor (hereinafter, also referred to as a TFT) made of amorphous silicon is formed on a plastic substrate.
[0003]
[Non-patent document 1]
SID INTERNATIONAL TOINAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, Vol. XXXIII, Number II, 2002, p802-805.
[0004]
[Problems to be solved by the invention]
However, many thermoplastic resins have a heat-resistant temperature of 200 ° C. or less, and withstand a process of 350 ° C. to 600 ° C. required for manufacturing a thin film transistor (hereinafter also referred to as a TFT) using amorphous silicon or polysilicon. I can't. For this reason, the mobility of the manufactured TFT is low, and a high-performance TFT cannot be obtained. Also, the plastic substrate expands and contracts, so that high definition cannot be achieved. Therefore, it is very difficult to form an active matrix type array substrate including TFTs with high performance and high definition on a substrate made of a thermoplastic resin.
[0005]
The present invention has been made in view of the above circumstances, and has as its object to provide a light-weight, high-performance, high-definition display element and a method of manufacturing the same.
[0006]
[Means for Solving the Problems]
The display element according to the first aspect of the present invention is configured such that a resin substrate and a first glass substrate are bonded to each other via an adhesive layer, and a first display region in which the element is formed on the first glass substrate; A first substrate having a signal connection portion formed outside the region, and a wiring connecting the signal connection portion and the element, and a resin substrate and a second glass substrate bonded to each other via an adhesive layer; A first display area having a second display area, wherein the first display area and the second display area face each other such that the first glass substrate and the second glass substrate are inside; And a second substrate having an end face located on the wiring and provided at a position on the wiring of the first substrate corresponding to the end face of the second substrate. A material film made of a material that blocks laser light in the ultraviolet region. It is characterized in.
[0007]
The material film may include a light-shielding layer formed on the first substrate side with an insulating layer interposed therebetween, for blocking the laser light in the ultraviolet region.
[0008]
Note that the material film may include a light-shielding layer formed on the second substrate side via an insulating layer and shielding the ultraviolet region laser light.
[0009]
Note that the material film may be a spacer formed of a material that blocks laser light in an ultraviolet region formed so as to reach the end face of the second substrate from a position on the wiring of the first substrate. good.
[0010]
Further, the method for manufacturing a display element according to the second aspect of the present invention includes the first display area where the element is formed, the signal connection part formed outside the display area, and the signal connection part and the element. A first substrate having a wiring connecting the first substrate and a second display region, and a predetermined distance from the first substrate so that the first display region and the second display region face each other and overlap each other. A second substrate in which at least a part of the cutting line is located on the wiring, and a position on the wiring of the first substrate corresponding to the cutting line of the second substrate. A light-shielding layer for shielding the laser light in the ultraviolet region formed, wherein a resin substrate and a glass substrate are bonded via an adhesive layer as the first and second substrates, and the glass substrate is And forming the panel on the second substrate of the panel. The laser beam in the ultraviolet region radiated along, characterized by cutting.
[0011]
Further, in the method for manufacturing a display element according to the third aspect of the present invention, the first display area in which the element is formed, the signal connection part formed outside the display area, and the signal connection part and the element A first substrate having a wiring connecting the first substrate and a second display region, and a predetermined distance from the first substrate so that the first display region and the second display region face each other and overlap each other. And a second substrate in which at least a part of the cutting line is located on the wiring, and a laser beam in an ultraviolet region formed near the part of the cutting line on the second substrate. A light-shielding layer for shielding light, wherein a resin substrate and a glass substrate are bonded via an adhesive layer as the first substrate and the second substrate, and panels having the glass substrate inside are formed, respectively, Laser in the ultraviolet region along the cutting line on the second substrate Irradiated with, characterized by cutting.
[0012]
The method for manufacturing a display element according to the fourth aspect of the present invention may further include a first display area in which the element is formed, a signal connection portion formed outside the display area, and the signal connection section and the element. A first substrate having a wiring connecting the first substrate and a second display region, and a predetermined distance from the first substrate so that the first display region and the second display region face each other and overlap each other. A second substrate on which at least a part of a cutting line is located on the wiring, and a position on the wiring of the first substrate corresponding to the cutting line of the second substrate. A spacer made of a material that absorbs laser light in an ultraviolet region formed so as to reach the cutting line, and a resin substrate and a glass substrate are bonded through an adhesive layer as the first substrate and the second substrate. To form panels with the glass substrate inside. And, along said cutting line is irradiated with laser light in the ultraviolet region to the second substrate of the panel, characterized by cutting.
[0013]
Further, the method for manufacturing a display element according to the fifth aspect of the present invention includes the first display area where the element is formed, the signal connection part formed outside the display area, and the signal connection part and the element. A first substrate having a wiring connecting the first substrate and a second display region, and a predetermined distance from the first substrate so that the first display region and the second display region face each other and overlap each other. A second substrate in which at least a part of the cutting line is located on the wiring, and as the first substrate and the second substrate, a resin substrate and a glass substrate are bonded with an adhesive layer. And forming a panel with the glass substrate inside, immersing the panel in a liquid that absorbs laser light in an ultraviolet region, and irradiating the second substrate of the panel with the ultraviolet light along the cutting line. It is characterized by irradiating the area with laser light and cutting it. .
[0014]
The method of manufacturing a display element according to the sixth aspect of the present invention may further include a first display area in which the element is formed, a signal connection formed outside the display area, and the signal connection and the element. A first substrate having a wiring connecting the first substrate and a second display region, and a predetermined distance from the first substrate so that the first display region and the second display region face each other and overlap each other. A second substrate in which at least a part of the cutting line is located on the wiring, and as the first substrate and the second substrate, a resin substrate and a glass substrate are bonded with an adhesive layer. Forming a panel with the glass substrate inside, and irradiating the second substrate of the panel with a laser beam in an ultraviolet region along the cutting line to cut the cutting line. On at least a part of the region, only the region between the wirings has an ultraviolet region. And irradiating the Heather light.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiments of the present invention will be described below in detail with reference to the drawings, but the present invention is not limited to these embodiments.
[0016]
First, a display element which is a premise of each embodiment of the present invention will be described.
[0017]
In order to reduce the weight of the display element, it is conceivable to use a laminated substrate of thin glass and thin plastic. It is expected that a light and bendable LCD can be obtained by using this laminated substrate without deteriorating the characteristics of the TFT. In this case, the laminated substrate is used not only for the array substrate but also for the opposing substrate. This is because warpage occurs unless a laminated substrate is used.
[0018]
When a laminated substrate made of thin glass and thin plastic is used for the array substrate and the opposing substrate, cracks and the like are likely to extend because the cut surface is not smooth when cut mechanically in order to expose the wiring portion. Therefore, there is a possibility that shavings will come out and mix with the shavings liquid crystal when the liquid crystal is sealed.
[0019]
For this reason, it is conceivable to cut out to a predetermined size using a laser beam in a wavelength region absorbed by the substrate. In the case of glass or plastic, light is absorbed in the ultraviolet region, so that processing can be performed using laser light having a wavelength in the ultraviolet region.
[0020]
Note that the wavelength of the laser light here includes the wavelength after the incident laser light is converted by the optical conversion element in addition to the oscillation wavelength of the laser light. For example, a YAG laser (oscillation wavelength: 1.064 μm ), The third harmonic (wavelength: 355 nm) and the fourth harmonic (wavelength: 266 nm) are also included in the laser light in the ultraviolet region. When a laminated substrate made of glass and plastic is cut using an infrared laser, the infrared laser heats and melts, so the temperature rises, and the glass and plastic have different expansion coefficients, so that thermal stress is applied to the glass. There is a problem that cracks occur. Lasers in the ultraviolet region (hereinafter also referred to as UV lasers) are used because they are molecular breaks that break bonds between molecules.
[0021]
A method of cutting a liquid crystal panel of an active matrix type liquid crystal display element using a substrate obtained by laminating a thin thermoplastic resin substrate and a glass substrate into a predetermined shape using a laser beam having a wavelength in an ultraviolet region. This will be described with reference to FIGS. FIG. 19 is a cross-sectional view of a liquid crystal panel in which the array substrate 10 and the counter substrate 20 are overlapped, and FIG. 20 is a cross-sectional view taken along a cutting line AA shown in FIG. This liquid crystal panel has an array substrate 10 on which a glass substrate 11 and a thermoplastic resin substrate 12 each having a thickness of 0.1 mm are bonded, and a glass substrate 21 and a thermoplastic resin substrate 22 each having a thickness of 0.1 mm. Opposing substrate 20 provided. The array substrate 10 and the opposing substrate 20 have a structure in which the surfaces of the glass substrates 11 and 21 are arranged to face each other, and are formed so as to maintain a predetermined interval by a spacer 31. A plurality of scanning lines (not shown), a plurality of signal lines (not shown) intersecting the plurality of scanning lines, and a plurality of scanning lines are provided on a display area of the glass substrate 11 constituting the array substrate 10. A pixel electrode (not shown) provided at the intersection with the signal line; and a pixel electrode provided corresponding to the pixel electrode, which is opened and closed by a corresponding scanning line, and one end is connected to the corresponding signal line and the other end is a corresponding pixel. A TFT (not shown) connected to the electrode is formed. Further, signal connection portions 15 are formed outside the display area on the array substrate 10, and these signal connection portions 15 are connected to the signal lines and the scanning lines via the wirings 14.
[0022]
On the other hand, a counter electrode made of ITO (Indium-Tin Oxide) is provided in a region of the glass substrate 21 constituting the counter substrate 20 corresponding to the display region. A liquid crystal 35 is sandwiched in the display area between the array substrate 10 and the counter substrate 20. The liquid crystal 35 is sealed by a sealing material 32 applied around the display area.
[0023]
When the array substrate 10 and the counter substrate 20 are irradiated with the laser light 50 in the ultraviolet region having a wavelength of 240 nm to 270 nm from the resin substrates 12 and 22 side, respectively, both the resin substrates 12 and 22 and the glass substrates 11 and 21 have the above-mentioned wavelength region. The substrates 10, 20 can be cut to absorb light. As shown in FIG. 19, the array substrate 10 may cut the outside of the display region and the outside of the region of the signal connection portion 15 along the cutting line 40, and the counter substrate 20 may cut the outside of the display region and the signal connection portion. What is necessary is just to cut along the cutting line 41 so that 15 areas may not be included. When the substrates 10 and 20 are cut along the cutting lines 40 and 41, an active matrix type liquid crystal display device shown in FIGS. 21 and 22 can be obtained.
[0024]
When the substrate is processed by the above-described cutting method, the array substrate 10 and the opposing substrate 20 may be cut at the same position on the side not including the signal connection portion 15. On the other hand, the array substrate 10 is cut outside the counter substrate 20. When the laser beam 50 is not sufficiently absorbed by the thermoplastic resin substrate and the glass substrate of the counter substrate 20 when cutting the counter substrate 20, the laser beam 50 passes through the counter substrate 20 and reaches the array substrate 10. In addition, the wiring portion formed on the array substrate 10 may be damaged, and the wiring 14 may be disconnected, so that a video signal cannot be displayed.
[0025]
Further, when a substrate made of thin glass or resin as described above is used, it is difficult to maintain flatness because the rigidity of the substrate is not sufficient. For example, in an LCD, two substrates need to be overlapped and held at a certain interval, and the interval is very narrow, about 5 μm. Therefore, a spacer 31 is used in the display area and a sealing material is used outside the display area. 32 accurately maintains the interval.
[0026]
A substrate having a small rigidity is likely to be warped. In particular, since wirings having a small width and a small interval are densely arranged in the vicinity of the signal connection portion 15, the counter substrate 20 warps as shown in FIG. There is a problem that the rubbing and the opening or shorting of the wiring 14 are likely to occur.
[0027]
Therefore, in each embodiment of the present invention, a display element capable of preventing a wiring from being disconnected or short-circuited and a method for manufacturing the same will be described.
[0028]
(1st Embodiment)
A liquid crystal display device according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view illustrating the configuration of the liquid crystal display device according to the present embodiment, and FIG. 2 is a cross-sectional view taken along a cutting line AA shown in FIG.
[0029]
The liquid crystal display device according to the present embodiment includes an array substrate 10 on which a glass substrate 11 and a thermoplastic resin substrate 12 each having a thickness of 0.1 mm are bonded, a glass substrate 21 having a thickness of 0.1 mm each, and a thermoplastic resin. And a counter substrate 20 to which a substrate 22 is adhered. The array substrate 10 and the opposing substrate 20 have a structure in which the surfaces of the glass substrates 11 and 21 are arranged to face each other, and are formed so as to maintain a predetermined interval by a spacer 31. A plurality of scanning lines (not shown), a plurality of signal lines (not shown) intersecting the plurality of scanning lines, and a plurality of scanning lines are provided on a display area of the glass substrate 11 constituting the array substrate 10. A pixel electrode (not shown) provided at the intersection with the signal line; and a pixel electrode provided corresponding to the pixel electrode, which is opened and closed by a corresponding scanning line, and one end is connected to the corresponding signal line and the other end is a corresponding pixel. A TFT (not shown) connected to the electrode is formed. Further, signal connection portions 15 are formed outside the display area on the glass substrate 11, and these signal connection portions 15 are connected to the signal lines and the scanning lines via the wirings 14. Then, on the region of each wiring 14 corresponding to the cut end face 25 of the counter substrate 20, a laminated film including the insulating layer 17 and the metal light shielding layer 18 is provided.
[0030]
On the other hand, a counter electrode made of ITO (Indium-Tin Oxide) is provided in a region of the glass substrate 21 constituting the counter substrate 20 corresponding to the display region. A liquid crystal 35 is sandwiched in the display area between the array substrate 10 and the counter substrate 20. The liquid crystal 35 is sealed by a sealing material 32 applied around the display area.
[0031]
Next, the method for fabricating the liquid crystal display device according to the present embodiment will be explained with reference to FIGS.
[0032]
The liquid crystal display element is required as a liquid crystal display element by forming a pattern on the array substrate 10 and the opposing substrate 20 having a size larger than the required size and then irradiating a laser beam along the cutting lines 40 and 41. Manufactured by cutting into various external dimensions. FIG. 3 is a cross-sectional view of a liquid crystal panel on which a pattern has been formed but has not yet been cut into external dimensions required for a liquid crystal display element by irradiating a laser beam, and FIG. FIG. 2 shows a cross-sectional view when cut at B.
[0033]
First, a plurality of scanning lines (not shown), which intersect with the plurality of scanning lines, are formed on a display region of a glass substrate 11 having a thickness of 0.1 mm which constitutes the array substrate 10 by using a normal manufacturing process. A plurality of signal lines (not shown), a pixel electrode (not shown) provided at the intersection of the scanning line and the signal line, and a scanning line provided corresponding to the pixel electrode to open and close with one end. A TFT (not shown) made of, for example, polysilicon is connected to the corresponding signal line and the other end is connected to the corresponding pixel electrode. Further, outside the display area on the glass substrate 11, a signal connection portion 15 and a wiring 14 connected to the signal connection portion 15 via the signal line and the scanning line are formed. Then, a laminated film including the insulating layer 17 and the metal light-shielding layer 18 is formed on the region of each wiring 14 corresponding to the end face 25 of the opposite substrate 20 cut by irradiating the laser beam. Further, a spacer 31 is formed in the display area.
[0034]
Thereafter, the glass substrate 11 and the thermoplastic resin substrate 12 each having a thickness of 0.1 mm are bonded with an adhesive to form an array substrate 10 (see FIG. 3).
[0035]
On the other hand, a counter electrode made of ITO (Indium-Tin Oxide) is formed in a region of the glass substrate 21 constituting the counter substrate 20 corresponding to the display region. Thereafter, the glass substrate 21 and the thermoplastic resin substrate 22 each having a thickness of 0.1 mm are bonded with an adhesive to form a counter substrate 20 (see FIG. 3).
[0036]
Then, a sealing material 31 is applied around the display area of the glass substrate 11 constituting the array substrate 10, and the glass substrate 11 and the glass substrate 21 constituting the opposing substrate face each other and are held at a predetermined interval by the spacer 31. In such a manner, the array substrate 10 and the counter substrate 20 are attached to each other.
[0037]
Thereafter, the liquid crystal 35 is injected into the display area from an injection port (not shown), and the injection port is coated with, for example, an ultraviolet curable resin, and the ultraviolet curable resin is cured by irradiating ultraviolet rays to seal the liquid crystal 35. . Thus, the liquid crystal panel shown in FIG. 3 is completed.
[0038]
In the liquid crystal panel thus formed, as shown in FIG. 3, the cutting line 40 of the array substrate 10 and the cutting line 41 of the counter substrate 20 are planar on the side of the array substrate 10 where the signal connection portion 15 is not provided. However, on one side of the signal connection portion 15, the cutting line 41 of the counter substrate 20 is located inside the signal connection portion 15 of the array substrate 10, and a portion intersecting with the wiring 14 on the array substrate 10 is generated. The metal light-shielding layer 18 is laminated via the insulating layer 17 on the region of the wiring 14 where the wiring 14 intersects the cutting line 41 of the counter substrate 20.
[0039]
Next, the fourth harmonic (wavelength: 266 nm) of the YAG laser is irradiated along the cutting line 40 from the resin substrate 12 side of the array substrate 10. Since both the glass substrate 11 and the resin substrate 12 absorb the light 50 of the fourth harmonic of the YAG laser, the array substrate 10 can be cut into a predetermined shape. Similarly, the fourth substrate 50 of the YAG laser is irradiated along the cutting line 41 from the resin substrate 22 side of the opposing substrate 20 to cut out the opposing substrate 20 into a predetermined shape. Thereby, as shown in FIGS. 3 and 4, the signal connection portion 15 formed at the side edge of the array substrate 10 can be exposed.
[0040]
At this time, since the metal light-shielding layer 18 is formed via the insulating layer 17 on the wiring 14 where the wiring 14 on the array substrate 10 and the cutting line 41 of the opposing substrate 20 intersect, the opposing substrate 20 is cut off. Since the laser light 50 that has passed through the counter substrate 20 during transmission does not pass through the metal light shielding layer 18, the wiring 14 is not damaged, and the electrical connection between the scanning line or the signal line and the signal connection portion 15 is maintained. The counter substrate 20 can be cut into a predetermined shape as it is.
[0041]
As described above, according to the present embodiment, the provision of the light shielding layer can prevent the wiring from being disconnected or short-circuited when the laminated substrate is cut using the UV laser.
[0042]
(2nd Embodiment)
Next, a liquid crystal display device according to a second embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a sectional view showing the configuration of the liquid crystal display device according to the present embodiment, and FIG. 6 is a sectional view taken along the cutting line AA shown in FIG.
[0043]
In the liquid crystal display element of the first embodiment, the laminated film including the insulating layer and the metal light-shielding layer provided at the position where the wiring 14 of the array substrate 10 Although formed above, in the present embodiment, the laminated film is provided on the counter substrate side. That is, as shown in FIG. 5 and FIG. 6, the insulating layer 23 Further, a laminated film including the metal light shielding layer 24 is formed. Except for the above-mentioned laminated film, it has the same configuration as the liquid crystal display element according to the first embodiment.
[0044]
Next, the method for fabricating the liquid crystal display device according to the present embodiment will be explained with reference to FIGS.
[0045]
The liquid crystal display element is required as a liquid crystal display element by forming a pattern on the array substrate 10 and the opposing substrate 20 having a size larger than the required size and then irradiating a laser beam along the cutting lines 40 and 41. It is manufactured by cutting into various external dimensions. FIG. 7 is a cross-sectional view of a liquid crystal panel on which a pattern has been formed, but has not yet been cut into external dimensions required for a liquid crystal display element by irradiating a laser beam, and FIG. FIG. 2 shows a cross-sectional view when cut at B.
[0046]
First, a plurality of scanning lines (not shown) and a plurality of signal lines (not shown) intersecting the plurality of scanning lines are formed on the display area of the glass substrate 11 constituting the array substrate 10 using a normal manufacturing process. Not shown), a pixel electrode (not shown) provided at the intersection of the scanning line and the signal line, an opening / closing operation by a corresponding scanning line provided corresponding to the pixel electrode, and one end connected to the corresponding signal line. A TFT (not shown) made of, for example, polysilicon and having the other end connected to the corresponding pixel electrode is formed. Further, outside the display area on the glass substrate 11, a signal connection portion 15 and a wiring 14 connected to the signal connection portion 15 via the signal line and the scanning line are formed. Further, a spacer 31 is formed in the display area. Thereafter, in the same manner as in the first embodiment, the glass substrate 11 and the thermoplastic resin substrate 12 each having a thickness of 0.1 mm are bonded with an adhesive to form the array substrate 10 (see FIG. 7).
[0047]
On the other hand, a counter electrode made of ITO is formed in a region corresponding to the display region of the glass substrate 21 constituting the counter substrate 20. Then, a laminated film including the insulating layer 23 and the metal light shielding layer 24 is formed on the position of the glass substrate 21 where the cutting line 41 irradiated with the laser beam 50 and the wiring 14 of the array substrate 10 intersect. Subsequently, a glass substrate 21 and a thermoplastic resin substrate 22 each having a thickness of 0.1 mm are bonded with an adhesive to form a counter substrate 20 (see FIG. 7).
[0048]
Thereafter, a sealing material 31 is applied around the display area of the glass substrate 11 constituting the array substrate 10, and the glass substrate 11 and the glass substrate 21 constituting the opposing substrate face each other and are held at a predetermined interval by the spacer 31. In such a manner, the array substrate 10 and the counter substrate 20 are attached to each other.
[0049]
Thereafter, the liquid crystal 35 is injected into the display area from an injection port (not shown), and the injection port is coated with, for example, an ultraviolet curable resin, and the ultraviolet curable resin is cured by irradiating ultraviolet rays to seal the liquid crystal 35. . Thus, the liquid crystal panel shown in FIG. 7 is completed.
[0050]
In the liquid crystal panel thus formed, as shown in FIG. 7, the cutting line 40 of the array substrate 10 and the cutting line 41 of the counter substrate 20 are planar on the side of the array substrate 10 where the signal connection portion 15 is not provided. However, on one side of the signal connection portion 15, the cutting line 41 of the counter substrate 20 is located inside the signal connection portion 15 of the array substrate 10, and a portion intersecting with the wiring 14 on the array substrate 10 is generated. The metal light-shielding layer 18 is laminated via the insulating layer 17 on the position of the counter substrate 20 where the wiring 14 crosses the cutting line 41 of the counter substrate 20.
[0051]
Next, the fourth harmonic (wavelength: 266 nm) of the YAG laser is irradiated along the cutting line 40 from the resin substrate 12 side of the array substrate 10. Since both the glass substrate 11 and the resin substrate 12 absorb the light 50 of the fourth harmonic of the YAG laser, the array substrate 10 can be cut into a predetermined shape. Similarly, the fourth substrate 50 of the YAG laser is irradiated along the cutting line 41 from the resin substrate 22 side of the opposing substrate 20 to cut out the opposing substrate 20 into a predetermined shape. Thereby, as shown in FIGS. 7 and 8, the signal connection portion 15 formed at the side edge of the array substrate 10 can be exposed.
[0052]
At this time, since the metal light shielding layer 24 is formed via the insulating layer 23 on the position of the opposing substrate 20 where the wiring 14 on the array substrate 10 and the cutting line 41 of the opposing substrate 20 intersect, Since the laser light 50 that has passed through the counter substrate 20 when cutting the substrate 20 does not pass through the metal light shielding layer 24, the wiring 14 is not damaged, and the electrical connection between the scanning line or the signal line and the signal connection portion 15 is prevented. The counter substrate 20 can be cut into a predetermined shape while maintaining the connection.
[0053]
At this time, the metal light-shielding layer 24 is formed on the vicinity of the cutting line 41 of the opposing substrate 20 at the side where the signal connection portion 15 of the array substrate 10 is located and in the vicinity thereof, so that the strength is lower than in the case of using only a thin substrate. Being strong, cracks are hardly generated, and the substrate is hardly broken.
[0054]
As described above, according to the present embodiment, the provision of the light shielding layer can prevent the wiring from being disconnected or short-circuited when the laminated substrate is cut using the UV laser.
[0055]
(Third embodiment)
Next, a liquid crystal display device according to a third embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view showing the configuration of the liquid crystal display device according to the present embodiment, and FIG. 10 is a cross-sectional view taken along a cutting line AA shown in FIG.
[0056]
The liquid crystal display element of this embodiment is different from the liquid crystal display element of the first embodiment in that an insulating layer 17 and a metal light-shielding layer 18 are provided at a portion where the signal connection portion 15 overlaps the cutting line 41 of the counter substrate 20. Instead of providing the laminated film, a configuration is provided in which a spacer 37 made of a light-shielding body reaching the counter substrate 20 is provided.
[0057]
Next, the method for fabricating the liquid crystal display device according to the present embodiment will be explained with reference to FIGS.
[0058]
The liquid crystal display element is required as a liquid crystal display element by forming a pattern on the array substrate 10 and the opposing substrate 20 having a size larger than the required size and then irradiating a laser beam along the cutting lines 40 and 41. It is manufactured by cutting into various external dimensions. FIG. 11 is a cross-sectional view of a liquid crystal panel on which a pattern has been formed, but has not yet been cut into external dimensions necessary for a liquid crystal display element by irradiating a laser beam, and FIG. FIG. 2 shows a cross-sectional view when cut at B.
[0059]
First, a plurality of scanning lines (not shown) and a plurality of signal lines (not shown) intersecting the plurality of scanning lines are formed on the display area of the glass substrate 11 constituting the array substrate 10 by using a normal manufacturing process. Not shown), a pixel electrode (not shown) provided at the intersection of the scanning line and the signal line, an opening / closing operation by a corresponding scanning line provided corresponding to the pixel electrode, and one end connected to the corresponding signal line. A TFT (not shown) made of, for example, polysilicon and having the other end connected to the corresponding pixel electrode is formed. Outside the display area on the glass substrate 11, a signal connection portion 15 and a wiring 14 connected to the signal connection portion 15 via the signal line and the scanning line are formed. Then, a laminated film including the insulating layer 17 and the metal light shielding layer 18 is formed on the region of each wiring 14 corresponding to the end surface of the counter substrate 20 cut by irradiating the laser beam. Further, a spacer 31 is formed in the display area. When the spacer 31 is formed, a spacer 37 made of a light-shielding body is formed at a portion of the array substrate 10 where the signal connection portion 15 is located and overlaps with the cutting line 41 of the counter substrate 20. Thereafter, the glass substrate 11 and the thermoplastic resin substrate 12 each having a thickness of 0.1 mm are bonded with an adhesive to form the array substrate 10 (see FIG. 11).
[0060]
On the other hand, a counter electrode made of ITO is formed in a region corresponding to the display region of the glass substrate 21 constituting the counter substrate 20. Thereafter, the glass substrate 21 and the thermoplastic resin substrate 22 each having a thickness of 0.1 mm are bonded with an adhesive to form a counter substrate 20 (see FIG. 11).
[0061]
Then, a sealing material 31 is applied around the display area of the glass substrate 11 constituting the array substrate 10, and the glass substrate 11 and the glass substrate 21 constituting the opposing substrate face each other and are spaced at predetermined intervals by the spacers 31 and 37. The array substrate 10 and the opposing substrate 20 are bonded so as to be held. The spacer 37 is made of a material that absorbs laser light having a wavelength in the ultraviolet region.
[0062]
Thereafter, the liquid crystal 35 is injected into the display area from an injection port (not shown), and the injection port is coated with, for example, an ultraviolet curable resin, and the ultraviolet curable resin is cured by irradiating ultraviolet rays to seal the liquid crystal 35. . Thus, the liquid crystal panel shown in FIG. 11 is completed.
[0063]
In the liquid crystal panel thus formed, as shown in FIG. 11, the cutting line 40 of the array substrate 10 and the cutting line 41 of the counter substrate 20 are planar on the side of the array substrate 10 where the signal connection portion 15 is not provided. However, on one side of the signal connection portion 15, the cutting line 41 of the counter substrate 20 is located inside the signal connection portion 15 of the array substrate 10, and a portion intersecting with the wiring 14 on the array substrate 10 is generated. The metal light-shielding layer 18 is laminated via the insulating layer 17 on the region of the wiring 14 where the wiring 14 intersects the cutting line 41 of the counter substrate 20.
[0064]
Next, the fourth harmonic (wavelength: 266 nm) of the YAG laser is irradiated along the cutting line 40 from the resin substrate 12 side of the array substrate 10. Since the glass substrate 11 and the resin substrate 12 both absorb the fourth harmonic light 50 of the YAG laser, the array substrate 10 can be cut into a predetermined shape. Similarly, the fourth substrate 50 of the YAG laser is irradiated along the cutting line 41 from the resin substrate 22 side of the opposing substrate 20 to cut out the opposing substrate 20 into a predetermined shape. Thereby, as shown in FIGS. 11 and 12, the signal connection portion 15 formed at the side edge of the array substrate 10 can be exposed. At this time, since the spacers 37 made of a material that absorbs laser light are formed on the wirings 14 at which the wirings 14 on the array substrate 10 and the cutting lines 41 of the counter substrate 20 intersect, the counter substrate 20 is cut. Since the laser beam 50 that has passed through the counter substrate 20 during transmission does not pass through the spacer 37, the wiring 14 is not damaged, and the electrical connection between the scanning line or the signal line and the signal connection unit 15 is maintained. The counter substrate 20 can be cut into a predetermined shape.
[0065]
As described above, according to the present embodiment, disconnection or short circuit of the wiring can be prevented.
[0066]
Further, according to the liquid crystal display element of the present embodiment, when the opposing substrate 20 is cut into a predetermined shape, the opposing substrate 20 is cut on the cutting line 41 of the opposing substrate 20 at the side where the signal connection portion 15 is located on the array substrate 10 and in the vicinity thereof. Since the spacer 37 is formed and the gap is kept constant, the substrate is not warped even if a rigid substrate is used. Open or short circuit can be suppressed.
[0067]
(Fourth embodiment)
Next, a method for fabricating the liquid crystal display device according to the fourth embodiment of the present invention will be described with reference to FIGS.
[0068]
In the method of manufacturing the liquid crystal display element according to this embodiment, first, the liquid crystal panel shown in FIG. 13, that is, the liquid crystal panel shown in FIG. 19 is formed.
[0069]
Next, after this liquid crystal panel is formed, the end of one side of the signal connection portion 15 is immersed in a liquid 65 that does not transmit by absorbing or scattering light in the ultraviolet region. The liquid 65 is held in the container 60. As an example of the liquid 65, a solution in which a dye or pigment such as black carbon, black, or red is dissolved in a solvent is used.
The liquid 65 enters a region sandwiched between the two substrates 10 and 20 by capillary action.
[0070]
Thereafter, as shown in FIG. 15, the fourth substrate 50 of the YAG laser is irradiated along the cutting line 41 from the resin substrate 22 side of the counter substrate 20 to cut the counter substrate 20 into a predetermined shape. At this time, the laser light 50 is absorbed or scattered by the liquid 65 on the side where the signal connection portion 15 is located, and the intensity is weakened. Therefore, the wiring 14 on the array substrate 10 is not damaged. The cutting of the array substrate 10 is performed along the cutting line 40.
[0071]
Finally, the liquid 65 is removed by performing clean air cleaning to complete the liquid crystal display element.
[0072]
As described above, according to the present embodiment, disconnection or short circuit of the wiring can be prevented.
[0073]
(Fifth embodiment)
Next, the method for fabricating the liquid crystal display device according to the fifth embodiment of the present invention will be described with reference to FIGS.
[0074]
In the method of manufacturing the liquid crystal display device according to this embodiment, first, the liquid crystal panel shown in FIG. 16, that is, the liquid crystal panel shown in FIG. 19 is formed.
[0075]
In this liquid crystal panel, the cutting line 40 of the array substrate 10 and the cutting line 41 of the counter substrate 20 are planarly overlapped on the side of the array substrate 10 where the signal connection portion 15 is not provided, but on the side where the signal connection portion 15 is provided. The cutting line 41 of the opposing substrate 20 is located inside the signal connection portion 15 of the array substrate 10, and a portion intersecting with the wiring 14 on the array substrate 10 occurs. As shown in FIG. 17, the wiring 14 at a portion that intersects the cutting line 41 includes a portion arranged at regular intervals, the thickness L1 of the wiring 14 is 20 μm to 500 μm, and the interval L2 between the adjacent wirings 14 is It is about 30 μm to 500 μm.
[0076]
In this liquid crystal panel, the signal connection portion 15 is formed on only one side, but the same applies to a case where the signal connection portion 15 is formed on a plurality of sides.
[0077]
Subsequently, the array substrate 10 and the counter substrate 20 are cut into a predetermined shape along the cutting lines 40 and 41 by irradiating light 50 of the fourth harmonic (wavelength: 266 nm) of the YAG laser. Since both glass and plastic films absorb the light 50 of the fourth harmonic of the YAG laser, the substrate can be processed. As shown in FIG. 18, the spot diameter 51 of the irradiated laser beam is about 10 μm to 20 μm, and the irradiation energy is about 100 mW to 1000 mW. First, the array substrate 10 is irradiated with the fourth harmonic light 50 of the YAG laser along the cutting line 40 from the resin substrate 12 side of the array substrate 10 to cut the array substrate 10 into a predetermined shape. In this case, the laser may be continuously irradiated so as not to be interrupted on the cutting line 40, or may be discontinuously irradiated by thinning the cutting line 40.
[0078]
Similarly, the fourth substrate 50 of the YAG laser is irradiated along the cutting line 41 from the resin substrate 22 side of the opposing substrate 20 to cut out the opposing substrate 20 into a predetermined shape. At this time, the cutting of the opposing substrate 20 on the side of the array substrate 10 where the signal connection portion 15 is not provided may be performed by continuously irradiating a laser so as not to be interrupted on the cutting line 41 similarly to the array substrate 10. Alternatively, the irradiation may be discontinuously performed with the cutting line 41 thinned out. However, the cutting of the opposing substrate 20 on the side of the array substrate 10 where the signal connection portion 15 is located is performed as shown in FIG. 18 so as not to damage the wiring 14 on the array substrate 10 due to laser irradiation. It suffices that the laser beam 50 is irradiated only during the period 14.
[0079]
As described above, according to the present embodiment, disconnection or short circuit of the wiring can be prevented.
[0080]
Next, as a method of forming a liquid crystal panel using a substrate in which a thin glass substrate and a resin substrate made of a plastic film are bonded with an adhesive, a method of forming a liquid crystal panel using two thick glass substrates is used. After etching the back surface of each glass substrate to make it thinner and bonding a resin substrate made of a plastic film, or etching each of the two glass substrates from the back surface to make it thinner, the resin substrate made of a plastic film is removed. There is a method of forming a liquid crystal panel by bonding and further combining them. Each will be described.
[0081]
(A) When etching a glass substrate after forming a panel
First, a pattern such as a TFT, a wiring, and a connection pad is formed on a first glass substrate made of non-alkali glass such as borosilicate glass. For these forming methods, a forming method of an array substrate in a conventional active matrix type LCD using polysilicon for TFT can be used. The thickness of the first glass substrate is about 0.7 mm to 1.1 mm, and has sufficient strength to prevent cracking in the process of forming the pattern.
[0082]
In the display area on the first glass substrate, TFTs made of polysilicon are arranged in a matrix. The TFT includes a signal line made of Al having a thickness of 400 nm for inputting a signal to the TFT, a gate line made of a Mo-W alloy having a thickness of 300 nm for driving the TFT, and a transparent conductor such as ITO. A pixel electrode made of a material is connected.
[0083]
A drive circuit including a TFT made of polysilicon is formed around the display region, and a signal connection portion for signal input / output is arranged at an end of the first glass substrate. The wiring between the display region and the driving circuit and between the driving circuit and the signal connection portion are connected by wiring such as Al or Mo-W. These wirings may be formed at the same time as the formation of the gate lines and signal lines.
[0084]
Next, a counter electrode made of a transparent conductor material such as ITO is formed on a portion corresponding to a display region on a second glass substrate made of non-alkali glass such as borosilicate glass. The thickness of the second glass substrate is about 0.7 mm to 1.1 mm, and has sufficient strength to prevent cracking in the process of forming the counter electrode.
[0085]
Subsequently, a spacer made of an organic resin is formed on one of the first glass substrate and the second glass substrate, and a seal made of an adhesive material is formed outside the display region. Then, the first glass substrate and the second glass substrate are overlapped and held so as to have an interval of about 5 μm. Further, liquid crystal is injected into a region sandwiched between the first glass substrate and the second glass substrate and surrounded by the seal. Thus, a liquid crystal panel including the first glass substrate and the second glass substrate is completed.
[0086]
Subsequently, the first glass substrate and the second glass substrate of the liquid crystal panel manufactured by the above method are polished from the back surface, and the thickness of each glass substrate is reduced to about 0.01 mm to 0.2 mm. By setting the thickness to 0.01 mm or more, it is possible to prevent moisture or the like from entering and high reliability can be obtained. As a polishing method, there are mechanical polishing using a grindstone or an abrasive, chemical etching for melting glass using a chemical solution, and a combination thereof. Examples of the chemical solution for dissolving glass include hydrofluoric acid and mixed acids containing hydrofluoric acid. When the glass is polished with a chemical, it is necessary to protect the end face of the cell so that the seal is not exposed to the chemical and damaged.
[0087]
Further, a plastic film is attached to the first glass substrate and the second glass substrate thinned by the above method using an adhesive. As the adhesive, an ultraviolet curable adhesive, an acrylic adhesive, an epoxy resin, a thermosetting adhesive, or the like may be used. A plastic film having a thickness of about 0.025 mm to 0.4 mm is desirable. , Polyether ether ketone (PEEK), polyimide (PI), polyethylene naphthalate (PEN), polyolefin and the like. Further, when used as a liquid crystal display as in the above-described embodiment, it is more desirable that the material be transparent in the visible region and have small anisotropy in refractive index.
[0088]
By such a process, a panel including a thin glass substrate and a substrate to which a resin substrate is attached can be obtained.
[0089]
(B) When forming a panel after etching a glass substrate
First, a pattern such as a TFT, a wiring, and a connection pad is formed on a first glass substrate made of non-alkali glass such as borosilicate glass. For these forming methods, a conventional method for forming an active matrix substrate using polysilicon for a TFT can be used. The thickness of the first glass substrate is about 0.7 mm to 1.1 mm, and has sufficient strength to prevent cracking in the process of forming the pattern.
[0090]
In the display area on the first glass substrate, TFTs made of polysilicon are arranged in a matrix. The TFT includes a signal line made of Al having a thickness of 400 nm for inputting a signal to the TFT, a gate line made of a Mo-W alloy having a thickness of 300 nm for driving the TFT, and a transparent conductor material such as ITO. Pixel electrodes, etc. are connected.
[0091]
A drive circuit including a polysilicon TFT is formed around the display area, and a signal connection portion for signal input / output is arranged at an end of the first glass substrate. The wiring between the display region and the driving circuit and between the driving circuit and the signal connection portion are connected by wiring such as Al or Mo-W. These wirings may be formed at the same time as the formation of the gate lines and signal lines.
[0092]
Next, a counter electrode made of a transparent conductor material such as ITO is formed on a portion corresponding to a display region on a second glass substrate made of non-alkali glass such as borosilicate glass. The thickness of the second glass substrate is about 0.7 mm to 1.1 mm, and has a sufficient strength to prevent cracking in the process of forming the pattern.
[0093]
Subsequently, each of the upper first glass substrate and the second glass substrate is polished from the back surface, and the thickness of each glass is reduced to about 0.01 mm to 0.2 mm. As a polishing method, there are mechanical polishing using a grindstone or an abrasive, chemical etching for melting glass using a chemical solution, and a combination thereof. Examples of the chemical solution for dissolving glass include hydrofluoric acid and mixed acids containing hydrofluoric acid. In the case of polishing glass using a chemical, it is necessary to protect the surfaces and end faces of the first glass substrate and the second glass substrate from being exposed to the chemical and being damaged.
[0094]
Further, a plastic film is attached to the back surfaces of the first and second glass substrates thinned by the above method using an adhesive. As the adhesive, an ultraviolet curable adhesive, an acrylic adhesive, an epoxy resin, a thermosetting adhesive, or the like may be used. A plastic film having a thickness of about 0.025 mm to 0.4 mm is desirable. , Polyether ether ketone (PEEK), polyimide (PI), polyethylene naphthalate (PEN), polyolefin and the like. Further, when used as a liquid crystal display as in the above-described embodiment, it is more desirable that the material be transparent in the visible region and have small anisotropy in refractive index.
[0095]
By such a process, a first substrate and a second substrate to which thin glass and a plastic film are adhered can be obtained.
[0096]
Subsequently, a spacer made of an organic resin is formed on one of the first substrate and the second substrate, and a seal made of an adhesive material is formed outside the display region. The first substrate and the second substrate are overlapped and held so as to have an interval of about 5 μm. Further, liquid crystal is injected into a region sandwiched between the first substrate and the second substrate and surrounded by the seal.
[0097]
By such a process, a liquid crystal panel including a substrate on which thin glass and a plastic substrate are adhered can be obtained.
[0098]
Note that the UV laser has a wavelength of about 1 nm to 400 nm, and in each of the above embodiments, it is preferable to use a UV laser having a wavelength of 150 nm to 400 nm. By setting the wavelength to this range, it is possible to use a laser in an ultraviolet region that has sufficient power for cutting and is not absorbed by glass.
[0099]
In each of the above embodiments, Al, Mo, Cr, Cu, Ta, Ti, W, or an alloy thereof is used as the metal light shielding layer. Further, when the metal light-shielding layer made of Cr is formed on the counter substrate side, it can be formed together with BM (Black Matrix), so that the number of steps is reduced.
[0100]
In the present invention, it is only necessary to prevent disconnection or short circuit of the wiring, and it is not necessary that the light-shielding layer can completely shield the laser. For example, the light shielding layer itself may be damaged.
[0101]
The spacer includes a spacer column and a spacer sphere. Acrylic resin, epoxy resin, polyimide, or the like is used to form the spacer pillar. In terms of process, photosensitive acrylic resin, photosensitive polyimide, or the like is used because the number of steps is reduced when the photosensitive material is used. In particular, when the spacer is used for light shielding, the spacer can be formed together with the spacer in the display surface, so that the number of steps can be reduced. As the spacer sphere, divinylbenzene copolymer (trade name: Micropearl), silica (SiO 2) ₂ ) Or silica coated with divinylbenzene.
[0102]
【The invention's effect】
As described above, according to the present invention, disconnection or short-circuit of a wiring can be prevented.
[Brief description of the drawings]
FIG. 1 is a sectional view showing a configuration of a liquid crystal display device according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of the liquid crystal display device according to the first embodiment when cut along a cutting line AA shown in FIG.
FIG. 3 is a sectional view showing a liquid crystal panel of the liquid crystal display device according to the first embodiment.
FIG. 4 is a cross-sectional view of the liquid crystal display device according to the first embodiment when cut along a cutting line BB shown in FIG. 3;
FIG. 5 is a sectional view showing a configuration of a liquid crystal display device according to a second embodiment of the present invention.
FIG. 6 is a cross-sectional view of the liquid crystal display device according to the second embodiment when cut along a cutting line AA shown in FIG.
FIG. 7 is a sectional view showing a liquid crystal panel of a liquid crystal display device according to a second embodiment.
8 is a cross-sectional view of the liquid crystal display device according to the second embodiment, taken along a cutting line BB shown in FIG.
FIG. 9 is a sectional view showing a configuration of a liquid crystal display device according to a third embodiment of the present invention.
FIG. 10 is a cross-sectional view of the liquid crystal display device according to the third embodiment, taken along a cutting line AA shown in FIG.
FIG. 11 is a sectional view showing a liquid crystal panel of a liquid crystal display device according to a third embodiment.
FIG. 12 is a cross-sectional view of the liquid crystal display device according to the third embodiment when cut along a cutting line BB shown in FIG. 11;
FIG. 13 is a sectional view showing a structure of a liquid crystal cell used in a method for manufacturing a liquid crystal display device according to a fourth embodiment of the present invention.
FIG. 14 is a view for explaining the manufacturing method according to the fourth embodiment;
FIG. 15 is a view for explaining the manufacturing method according to the fourth embodiment;
FIG. 16 is a sectional view showing the configuration of a liquid crystal panel used in the method for manufacturing a liquid crystal display device according to the fifth embodiment.
FIG. 17 is a view for explaining a relationship between wirings connected to a signal connection portion of a liquid crystal panel used in the manufacturing method according to the fifth embodiment.
FIG. 18 is a view for explaining the manufacturing method according to the fifth embodiment;
FIG. 19 is a cross-sectional view illustrating a configuration of a liquid crystal display element.
20 is a cross-sectional view of the liquid crystal display element taken along a cutting line AA shown in FIG.
FIG. 21 is a cross-sectional view illustrating a liquid crystal panel of a liquid crystal display element.
FIG. 22 is a cross-sectional view of the liquid crystal display element when cut along a cutting line BB shown in FIG. 21;
FIG. 23 is a diagram illustrating a problem when a counter substrate having low rigidity is used.
[Explanation of symbols]
10 Array substrate
11 Glass substrate
12 Resin substrate
14 Wiring
15 signal connection
17 Insulating layer
18 Metal shading layer
20 Counter substrate
21 Glass substrate
22 Resin substrate
23 insulating layer
24 Metal shading layer
25 End face
31 Spacer
32 Sealing material
35 LCD

Claims (9)

A first display region in which a resin substrate and a first glass substrate are bonded via an adhesive layer, and an element is formed on the first glass substrate; a signal connection portion formed outside the display region; A first substrate having a wiring connecting the signal connection portion and the element,
A resin substrate and a second glass substrate are adhered via an adhesive layer, and have a second display region, wherein the first glass substrate and the second glass substrate are inside and the first display region is A second substrate, which is held at a predetermined interval with the first substrate so that the second display region faces and overlaps with each other, and an end surface of which is located on the wiring;
And a material film made of a material that shields laser light in an ultraviolet region provided at a position on the wiring of the first substrate corresponding to the end face of the second substrate. element. 2. The display element according to claim 1, wherein the material film includes a light-shielding layer formed on the first substrate side via an insulating layer to shield the laser light in the ultraviolet region. The display element according to claim 1, wherein the material film includes a light-shielding layer formed on the second substrate side via an insulating layer to shield the laser light in the ultraviolet region. The material film is a spacer formed of a material that blocks laser light in an ultraviolet region formed so as to reach the end face of the second substrate from a position on the wiring of the first substrate. The display element according to claim 1, wherein A first substrate having a first display region in which elements are formed, a signal connection portion formed outside the display region, and a wiring connecting the signal connection portion and the element; and a second display region And the first display area and the second display area are held at a predetermined distance from the first substrate so as to face and overlap with each other, and at least a part of a cutting line is formed on the wiring. A second substrate located at
A light-shielding layer that shields laser light in an ultraviolet region formed at a position on the wiring of the first substrate corresponding to a cutting line of the second substrate,
As the first substrate and the second substrate, a resin substrate and a glass substrate are bonded via an adhesive layer, and panels with the glass substrate inside are formed, respectively.
A method for manufacturing a display element, comprising irradiating the second substrate of the panel with laser light in an ultraviolet region along the cutting line to cut the panel. A first substrate having a first display region in which elements are formed, a signal connection portion formed outside the display region, and a wiring connecting the signal connection portion and the element; and a second display region And the first display area and the second display area are held at a predetermined distance from the first substrate so as to face and overlap with each other, and at least a part of a cutting line is formed on the wiring. And a light-shielding layer that shields laser light in an ultraviolet region formed near a part of the cutting line of the second substrate,
As the first substrate and the second substrate, a resin substrate and a glass substrate are bonded via an adhesive layer, and panels having the glass substrate inside are formed, respectively, and the second substrate of the panel is formed on the second substrate. A method for manufacturing a display element, comprising irradiating a laser beam in an ultraviolet region along a cutting line and cutting the same. A first substrate having a first display region in which elements are formed, a signal connection portion formed outside the display region, and a wiring connecting the signal connection portion and the element; and a second display region And the first display area and the second display area are held at a predetermined distance from the first substrate so as to face and overlap with each other, and at least a part of a cutting line is formed on the wiring. And a laser beam in an ultraviolet region formed so as to reach the cutting line at a position on the wiring of the first substrate corresponding to the cutting line of the second substrate. And a spacer made of an absorbing material,
As the first substrate and the second substrate, a resin substrate and a glass substrate are bonded via an adhesive layer, and panels having the glass substrate inside are formed, respectively, and the second substrate of the panel is formed on the second substrate. A method for manufacturing a display element, comprising irradiating a laser beam in an ultraviolet region along a cutting line and cutting the same. A first substrate having a first display region in which elements are formed, a signal connection portion formed outside the display region, and a wiring connecting the signal connection portion and the element; and a second display region And the first display area and the second display area are held at a predetermined distance from the first substrate so as to face and overlap with each other, and at least a part of a cutting line is formed on the wiring. And a second substrate located at
As the first substrate and the second substrate, a resin substrate and a glass substrate are bonded via an adhesive layer, and panels with the glass substrate inside are formed, and the panel is irradiated with laser light in an ultraviolet region. A method of manufacturing a display element, comprising immersing the substrate in an absorbing liquid, irradiating the second substrate of the panel with laser light in an ultraviolet region along the cutting line, and cutting the panel. A first substrate having a first display region in which elements are formed, a signal connection portion formed outside the display region, and a wiring connecting the signal connection portion and the element; and a second display region And the first display area and the second display area are held at a predetermined distance from the first substrate so as to face and overlap with each other, and at least a part of a cutting line is formed on the wiring. And a second substrate located at
As the first substrate and the second substrate, a resin substrate and a glass substrate are adhered through an adhesive layer to form panels with the glass substrate inside, respectively. A display element characterized in that when cutting by irradiating laser light in a region along the cutting line, at least a part of the cutting line is irradiated with laser light in an ultraviolet region only between the wirings. Manufacturing method.

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