JP2004102338A - Case for electronic device, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make an insulation sheet not to come floating by a recess formed on a card face in forming an insulation layer etc. by applying an insulation sheet. <P>SOLUTION: The insulation sheet 107 can be stuck to the surface of a case, even if the recess is formed on the surface of the case for PC cards, since the insulation sheet 107 is applied by carrying out of pressure welding for a first and second pressure welding members 601a, 601b, heated to prescribed temperature to a section of the case 101 for PC cards, on which at least the insulation sheet 107 is applied after applying the insulation sheet 107, on the case surface by wrapping the insulation sheet 107, around a metallic case for the PC cards which exposes from a personal computer body, when the PC card is inserted to a slot for the PC card provided on the personal computer. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a housing for an electronic device and a method for manufacturing the same, and more specifically,
The present invention relates to a housing for an electronic device such as a PC card in which a circuit board is accommodated and an insulating sheet is attached at a desired position, and a method of manufacturing the same.
[0002]
[Prior art]
Electronic devices (hereinafter, referred to as PC cards) such as PCMCIA type cards, CF type cards, and SD cards are used as electronic devices that extend the functions of external devices such as personal computers. This PC card is one in which a circuit board having functions such as a FAX modem, a network adapter, and a hard disk is housed in a card type housing.
[0003]
Recently, a wireless LAN card has been widely used as one of PC cards. This PC card has a wireless communication antenna, and the antenna portion is exposed to the outside when the PC card is inserted into a slot. As described above, a card having a slightly longer shape than a size such as type I, type II, and type III standardized by PCMCIA or the like is called an extended PC card.
[0004]
The PC card uses a conductive metal plate as an exterior in order to secure rigidity of the card body and to remove obstacles due to static electricity and noise. In this method, a metal plate is bonded to the top and bottom of a resin frame to produce a PC card housing having an internal space capable of accommodating a circuit board, and a circuit board for providing each function is accommodated therein. Thus, a PC card is configured.
[0005]
As disclosed in WO97 / 47479 and Japanese Patent Application Laid-Open No. 03-199095, such a PC card is provided with an insulated end on the card slot side of a PC card which may be touched by a charged person. A layer is provided. This is because when a charged person touches a PC card mounted in a slot, the charged person is charged from the metal plate through a conductive spring in the card and a ground line of a circuit board to the personal computer. This is to prevent a situation where a malfunction such as a runaway or stoppage of the computer is caused by flowing into the main body.
[0006]
The extended PC card has an extended portion for housing an antenna formed of a resin member, and the antenna housed therein can transmit and receive radio waves. Therefore, even if the insulating layer is not actively provided at the end of the card, the influence of static electricity is not exerted if the resin extended portion is picked and the card is inserted and removed.
[0007]
[Problems to be solved by the invention]
In the extended PC card, only the extended portion is not necessarily exposed to the outside of the slot. In order to increase the rigidity and strength of the PC card when the PC card is inserted into the slot, the card body portion formed of a metal plate is also provided. Slightly protruding. Thus, even when a strong force is applied to the end of the card, the PC card body or the extended portion can be prevented from being broken or deformed. However, if the PC card body portion is slightly projected, the metal plate of the PC card body can be prevented. Part is also exposed, so a person with an electrostatic charge may come into contact with the slightly exposed part. However, malfunctions such as damage to internal circuits of the PC card and runaway or stoppage of the computer may occur.
[0008]
Therefore, as one of the methods of providing an insulating member in a portion exposed from the slot when the extended PC card is inserted into the PC card slot, there is a method of attaching an insulating sheet. In this method, an insulating sheet is wrapped around a metal PC card main body and adhered to cover the metal part to expose the metal part.
[0009]
However, when attaching an insulating sheet to the periphery of the PC card main body, if irregularities are formed on the housing surface, there is a problem that the insulating seal at that portion rises. When the insulating seal rises in this way, not only may the adhesion state of the entire insulating seal gradually deteriorate due to dust entering the gap, but also there is a problem that appearance and usability are very poor. Further, even if an attempt is made to suppress such a lift by hand, the work is extremely fine, so that the work load is extremely large, and it is extremely difficult in practice to ensure close contact with the housing surface.
[0010]
Therefore, an object of the present invention is to provide an electric device housing in which an insulating sheet is adhered to a surface of a housing in which a concave portion is formed.
[0011]
Another object of the present invention is to provide a method of manufacturing a housing for an electronic device, which is capable of adhering an insulating sheet attached to a surface of the housing having a recess formed thereon.
[0012]
[Means for Solving the Problems]
An object of the present invention is to provide an electronic device housing for housing a circuit board on which electronic components are mounted, the housing having an internal space capable of housing the circuit board and having a concave portion formed on the surface. And an insulating sheet attached to at least a portion of the surface of the housing where the concave portion is formed, wherein the insulating sheet has a property of shrinking at a predetermined temperature, and the insulating sheet is substantially formed in the concave portion. This is achieved by a housing for an electronic device, which is characterized by being in close contact.
[0013]
ADVANTAGE OF THE INVENTION According to this invention, since the insulating sheet is stuck to the surface of the housing | casing in which the recessed part was formed, the adverse effect of static electricity etc. can be prevented reliably, and the housing | casing for electronic devices with a good appearance and a feeling of use is provided. Can be provided.
[0014]
The object of the present invention is also a method of manufacturing a housing for an electronic device that houses a circuit board on which electronic components are mounted, wherein a surface of the housing having an internal space capable of housing the circuit board is heated. A step of attaching an insulating sheet sometimes shrinkable, wherein a press contact surface is formed in accordance with the shape of the housing, and at least the insulating sheet of the housing surface is attached to a press contact member heated to a predetermined temperature. The present invention is achieved by a method for manufacturing a housing for an electronic device, comprising a step of pressing against a set portion.
[0015]
ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the housing | casing for electronic devices which can adhere | attach the insulating sheet stuck on the surface of the housing | casing in which the recessed part was formed can be provided.
[0016]
The object of the present invention is also a method of manufacturing an electronic device housing for housing a circuit board on which electronic components are mounted, the method having an internal space capable of housing the circuit board, and having a recess on the surface. A step of manufacturing the formed casing, a step of attaching an insulating sheet that is shrinkable at the time of heating to at least a portion of the surface of the casing where the concave portion is formed, and press-fitting according to a shape of the surface of the casing. A housing for an electronic device, comprising a step of pressing a pressing member having a surface formed and heated to a predetermined temperature to at least a portion of the surface of the housing to which the insulating sheet is attached. Is achieved.
[0017]
ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the housing | casing for electronic devices which can adhere | attach the insulating sheet stuck on the surface of the housing | casing in which the recessed part was formed can be provided.
[0018]
In a preferred embodiment of the present invention, the step of manufacturing the housing includes the steps of attaching one surface of a metal plate having an adhesive to upper and lower surfaces of a resin frame, and heating the resin frame and the metal plate. Melting the adhesive and bonding the frame body and the metal plate, and the step of pressing the pressing member against the surface of the housing includes heating the resin frame and the metal plate. The step of dissolving the adhesive and bonding the resin frame and the metal plate is also performed.
[0019]
According to a preferred embodiment of the present invention, it is possible to shorten the manufacturing process of the electronic device housing to which the insulating sheet is attached.
[0020]
In a further preferred embodiment of the present invention, the electronic device is a PC card, and the insulating sheet is attached to a portion of the housing surface that is exposed to the outside when the PC card is inserted into a PC card slot. Attached.
[0021]
ADVANTAGE OF THE INVENTION According to this invention, when attaching an insulating sheet to the surface of the PC card housing | casing in which the recessed part was formed, the manufacturing method of the PC card housing | casing which can make an insulating sheet adhere closely can be provided. .
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0023]
FIG. 1 is a schematic perspective view showing an external configuration of an extended PC card according to a preferred embodiment of the present invention.
[0024]
As shown in FIG. 1, the extended PC card 100 includes a PC card housing 101 in which a circuit board on which electronic components are mounted is housed, and the PC card housing 101 (not shown). The connector 105 provided on the circuit board is exposed from one end in the longitudinal direction. The extended PC card 100 is mounted on an external device by inserting the connector 105 in the direction of the arrow S shown in the drawing with the connector 105 facing the slot side.
[0025]
An end portion opposite to the one end provided with the connector 105 is provided with an extended portion 106 made of resin. The extended portion 106 is exposed outside the device even when the PC card is inserted into the PC card slot of the external device. The extended section 106 accommodates a wireless LAN antenna element. Note that the PC card housing may be simply referred to as a housing, and the PC card housing 101 to which the extended portion 106 is attached may be referred to as a PC card housing in a broad sense.
[0026]
Furthermore, an insulating sheet 107 is attached near the boundary between the extended portion 106 and the PC card housing 101 so that the metal housing portion is not exposed when the slot is mounted in the slot. This insulating sheet can prevent the influence of static electricity and the like.
[0027]
FIG. 2 is a schematic sectional view of the PC card housing 101 shown in FIG. 1 along the line AA.
[0028]
As shown in FIG. 2, a PC card housing 101 includes a frame-shaped plastic frame 102, a first metal plate 103 provided so as to close one surface of the frame 102, and a frame 102. A second metal plate 104 is provided so as to close the other surface. By combining these, an internal space that can accommodate the circuit board is configured.
[0029]
Further, based on the provisions of the PC card types II and III, the first metal plate 103 and the second metal plate 104 have raised portions 103x and 104x in which the top plate portion is raised while leaving a certain area around. Each is formed. As a result, the internal space is wider than that of the type I PC card, and a circuit board on which components having relatively high heights are mounted can be accommodated.
[0030]
The metal plates 103 and 104 are formed by punching a metal plate into a predetermined shape so that a top plate and four side walls are formed, and then forming raised portions 103x and 104x on the top plate by press working. At the same time, the portion serving as the side wall is bent, and the end of the side wall is further bent inward to form L-shaped portions 103y and 104y.
[0031]
The metal plates 103 and 104 are attached to the frame 102 by locking the L-shaped portions 103y and 104y of the side wall ends in the concave portions 102a of the frame 102. An adhesive is provided on the inner surfaces of the metal plates 103 and 104, and the metal plates 103 and 104 and the frame 102 are bonded by the adhesive.
[0032]
The PC card housing 102 thus configured has steps and irregularities on its surface. Specifically, the raised portion 103x is formed on the metal plate 103, and the space between the corner 201 of the first metal plate 103 and the corner 202 of the raised portion 103x is recessed from these corners. The recess 203 is formed therein. Such a concave portion is similarly formed on the second metal plate 104. Further, a gap between the L-shaped portion 103y of the side wall end of the first metal piece 103 and the L-shaped portion 104y of the side wall end of the second metal piece 104 locked in the concave portion 102a of the frame 102. The concave portion 204 is also formed by the portion. The L-shaped portions 103y and 104y are to advance along a guide inside the PC card slot when inserted into the PC card slot and to be mounted.
[0033]
The insulating sheet 107 is wound around the housing along the boundary between the extended portion 106 and the first and second metal plates 103 and 104, and the above-described concave portion 203 and concave portion 204 are formed as illustrated. Also adheres to the part where Therefore, since the insulating sheet does not rise from the concave portion formed on the surface of the housing, there is no problem that dust or the like easily enters and peels off.
[0034]
A method for manufacturing the above-described PC card housing will be described below.
[0035]
FIG. 3 is an exploded perspective view of the PC card housing 101.
[0036]
As shown in FIG. 3, in the PC card housing 101, the frame-shaped plastic frame 102 has a space provided on one end side capable of accommodating the connector 105 and a space accommodating the circuit board 301. It has. A circuit board 301 is fitted in the frame 102, a first metal plate 103 is attached so as to close one surface of the circuit board 301, and a second metal plate 103 is closed so as to close the other surface of the circuit board 301. 104 is attached.
[0037]
Further, a plastic extended portion 106 is attached to an end opposite to the one end where the connector 105 is provided. It is preferable that the same material as that of the frame 102 is used for the extended portion 106. Further, the frame 102 and the extended portion 106 may of course be formed integrally.
[0038]
Simply combining these components results in a temporarily fixed state, so that they are finally firmly bonded using an adhesive. Although not shown, an adhesive is attached to the back surfaces of the first metal plate 103 and the second metal plate 104 that are in contact with the frame and to the inside of the extended portion 106. This adhesive is non-tacky or very weak at room temperature, melts when heated to a predetermined temperature to increase the adhesive strength, and further solidifies by cooling to bond parts together. The heating temperature at this time is preferably substantially equal to the temperature at which the insulating sheet described later is heated. Such a bonding process is performed by a pressing device described later.
[0039]
FIG. 4 is a perspective view showing an external configuration of the extended PC card housing, showing a state in which the components of FIG. 3 are assembled and an insulating sheet is being attached.
[0040]
As shown in FIG. 4, in the PC card housing 101, a recess 203 is formed by the protruding portions 103x and 104x of the metal plate, and a recess 204 is also formed by the gap 205 between the metal plates as described above. It is. The concave portions 203 and 204 extend to a boundary 401 between the extended portion 106 and the first metal plate 103 and the second metal plate 104.
[0041]
On the other hand, in order to prevent adverse effects due to static electricity or the like, the insulating sheet 107 is wound around the housing and is attached. This insulating sheet is a portion exposed to the outside when the PC card is inserted into the slot. Pasted near. The boundary 401 may form a recess depending on the shape of the metal plate and the extended portion 106 and the state of close contact. Therefore, in the region where the insulating sheet 107 is attached, in addition to the concave portions 203 and 204 on the housing, there is also a concave portion at the boundary 401.
[0042]
The insulating sheet 107 is a resin sheet having electrical insulating properties, and has a property of contracting at a predetermined temperature. Specifically, it is preferably a material such as polyethylene terephthalate (PET) or polypropylene (PP), and the heating temperature is about 150 degrees.
[0043]
An adhesive material is adhered to the back surface 402 of the insulating sheet 107. This adhesive material is of a so-called room temperature adhesive type having an adhesive force at room temperature, and the insulating sheet 107 to which such an adhesive material is adhered is pressurized to some extent to be firmly attached to the housing surface. Glued.
[0044]
FIG. 5 is a schematic cross-sectional view of the extended PC card housing shown in FIG. 4 along the line BB, and shows a state immediately after an insulating sheet is pasted around the housing.
[0045]
As shown in FIG. 5, since the recesses 203 and 204 on the surface of the PC card housing 101 extend to the boundary with the extended portion 106 as described above, the PC card is mounted in the slot. At this time, even if the insulating sheet 107 is simply stuck to the portion exposed to the outside, the insulating sheet 107 is stretched above the concave portion 103 or the concave portion 104 and floats from the inner surface of the concave portion. Therefore, in order to eliminate such a state and bring the insulating sheet into close contact with the housing surface, the insulating sheet is heated and pressed.
[0046]
FIG. 6 is a schematic perspective view showing an external configuration of a pressure welding device for bringing an insulating sheet into close contact with a housing surface.
[0047]
As shown in FIG. 6, the apparatus 600 includes a first pressing member 601a on which a PC card housing is mounted, and a second pressing member for pressing the PC card housing together with the first pressing member 601a. 601b, a pressing auxiliary member 602 provided on both sides of the first pressing member 601a, a stopper 603 provided at a rear end of the first pressing member 601 and a base supporting the first pressing member 601. 604 and a guide rail 605 for guiding the vertical movement of the second pressure contact member 602b.
[0048]
The first and second pressure-contact members 601a and 601b are members for heating and pressing the insulating sheet attached to the surface of the PC card housing, particularly the top plate side of the metal plate. Each of the press contact members 601a and 601b has a heat supply source (heater) therein, and the heater generates heat when electric power is supplied from the outside, so that the press contact members themselves are also heated. These press-contact members also serve as jigs for bonding the metal plates 103 and 104 to the frame 102 constituting the PC card housing.
[0049]
The second pressing member 601b is disposed above the first pressing member 601a, and is attached to the guide rail 605 so as to be able to move up and down by a lifting mechanism such as a motor or an air cylinder. The second pressing member 601b is pressed together with the first pressing member 601a by sandwiching the PC card housing.
[0050]
The press-contact assisting member 602 is a member for heating and press-contacting the insulating sheet attached to the side surface of the PC card housing, which cannot be handled by the first and second press-contact members 601a and 601b. The press-contact assisting member 602 is provided corresponding to the position of the insulating sheet when the PC card housing is set on the first press-contact member 601a, but is provided on the entire side surface of the first press-contact member 601a. No problem.
[0051]
The stopper 603 is provided so that when the PC card housing is mounted on the first pressure contact member 601a, the PC card housing is correctly set. That is, when the rear end portion of the PC card housing is set in contact with the end surface of the stopper 603, the surface of the PC card housing comes into close contact with the upper surface of the first pressure contact member 601.
[0052]
The base 604 supports the first pressing member 601 from below and supports the guide rail 605.
[0053]
FIG. 7 is a schematic perspective view showing the external configuration of the pressure welding device, and shows a state in which a PC card housing is mounted.
[0054]
First, the first and second pressure contact members 601a and 601b are previously heated to a predetermined temperature, specifically, about 150 degrees. Next, as shown in FIG. 7, the PC card housing 101 is mounted at a predetermined position of the pressure welding device 600. After that, the second press-contact member 601b is lowered, and a PC card is sandwiched between the first press-contact member 601a and the second press-contact member 601b to perform a heating and press-contact process.
[0055]
At this time, the insulating sheet attached around the PC card housing 101 contracts due to the heating. Due to this contraction, the insulating sheet 107 comes into close contact with the surface of the housing. At the same time, the adhesive adhering to the rear surface of the metal plate in the PC card housing 101 is melted, and the adhesive is solidified by further cooling the PC card housing, thereby forming a frame 102 constituting the PC card housing. And the metal plate 103 and the metal plate 104 are bonded.
[0056]
Thus, the frame 102 of the PC card housing and the first and second metal plates 103 and 104 are firmly adhered to each other, and the insulating sheet is securely adhered to the entire periphery of the housing.
[0057]
Therefore, even when the above-described concave portion is formed on the surface of the housing, the insulating sheet is in close contact with the inner surface of the concave portion, so that dust enters the gap in the raised portion and the insulating sheet is easily peeled. There is no.
[0058]
The present invention is not limited to the above embodiments, and various changes can be made within the scope of the invention described in the claims, and these are also included in the scope of the present invention. Needless to say.
[0059]
For example, in the above-described embodiment, the step of bonding the frame 102 of the PC card housing 101 to the metal plates 103 and 104 using the pressure welding device 600 and the step of bonding the insulation to the surface of the PC card housing 101 are performed. The case where the step of shrinking the sheet 107 and bringing it into close contact with the surface has been described as an example, but is not limited to this, and the step of bonding the frame 102 to the metal plates 103 and 104 has already been completed. After the insulating sheet 107 is attached to the PC card housing 101 thus formed, the insulating sheet may be brought into close contact with the pressure contact device 600.
[0060]
Further, in the above-described embodiment, the case where the insulating sheet is attached to a portion of the surface of the PC card housing that is exposed to the outside from the PC card slot is described as an example, but the present invention is not limited to this. Any surface may be used as long as the surface has a recess formed thereon.
[0061]
Further, the housing to which the insulating sheet is attached may be made of not only metal but also resin as long as it functions as a shield for a built-in circuit board.
[0062]
Furthermore, in the above embodiment, the insulating sheet is attached to the PC card housing, but the present invention is not limited to this, and any electronic device housing may be used.
[0063]
Further, in the above-described embodiment, the case where the adhesive material adhered to the back surface 402 of the insulating sheet 107 is a so-called room-temperature adhesive type is described as an example. Is also good. That is, it has such a weak adhesive strength that the insulating sheet 107 can be stuck or peeled at room temperature so that a mistake in sticking can be corrected, and can be firmly bonded when heated at a predetermined temperature. It does not matter. Note that the heating temperature for firmly bonding is preferably a temperature close to the temperature (around 150 degrees) applied when the insulating sheet is brought into close contact with the housing surface.
[0064]
Furthermore, in the said embodiment, although the case where an insulating sheet was stuck for the purpose of insulating a housing from static electricity etc. was demonstrated as an example, it is not necessarily required to be an insulating purpose, for example, in order to improve appearance and usability. You can paste it. That is, the above-mentioned insulating sheet does not mean a sheet used exclusively for the purpose of insulation, but may be a resin sheet having a property of contracting when heated and having an electrical insulating property.
[0065]
【The invention's effect】
As described above, according to the present invention, at least the insulating sheet of the electronic device housing is attached by winding the insulating sheet around the electronic device housing, and then attaching the insulating sheet to the housing surface. Since the insulating sheet is shrunk by pressing a press-contact member heated to a predetermined temperature on the set portion, the insulating sheet can be in close contact even if a concave portion is formed on the surface of the electronic device housing, Accordingly, an adverse effect such as static electricity can be reliably prevented, and furthermore, the insulating sheet is less likely to peel off, and it is possible to provide a housing for an electronic device that has a good appearance and a feeling of use.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an external configuration of a PC card housing according to a preferred embodiment of the present invention.
FIG. 2 is a sectional view taken along line AA of FIG. 1;
FIG. 3 is an exploded perspective view of a PC card housing.
FIG. 4 is a view showing a state where the PC card housing of FIG. 3 is assembled, and is a view showing a state where an insulating tape is being applied to the PC card housing;
FIG. 5 is a sectional view taken along line BB of FIG. 5;
FIG. 6 is a perspective view showing an external configuration of a pressure welding device used for heating and pressure welding the insulating tape, and shows a state in which a PC card housing is not mounted.
FIG. 7 is a perspective view showing an external configuration of the pressure welding device, and shows a state where a PC card housing is mounted.
[Explanation of symbols]
REFERENCE SIGNS LIST 100 Extended PC card 101 PC card casing 105 Connector 106 Extended portion 107 Insulating sheet 102 Plastic frame 103 First metal plate 104 Second metal plate 103x, 104x Raised portion 103y, 104y L-shaped portion 201 at side wall end Corner portion 202 of first metal plate 103 corner portion 203 of raised portion 103x recessed portion 204 recessed portion 401 boundary 402 between casing 101 and extended portion 106 back surface 600 of insulating sheet 107 pressure-contact device 601a first pressure-contact member 601b second Pressing member 602 Pressing auxiliary member 603 Stopper 604 Base 605 Guide rail

Claims (5)

An electronic device housing for housing a circuit board on which electronic components are mounted,
A housing having an internal space capable of accommodating the circuit board, and having a recess formed on a surface thereof;
An insulating sheet attached to at least a portion where the concave portion is formed on the surface of the housing,
The insulating sheet has a property of shrinking at a predetermined temperature,
The housing for an electronic device, wherein the insulating sheet is substantially in close contact with the recess. A method for manufacturing an electronic device housing that houses a circuit board on which electronic components are mounted,
A step of attaching an insulating sheet having shrinkage when heated to a surface of a housing having an internal space capable of housing the circuit board,
The method includes a step of pressing a pressing member having a pressing surface formed according to the shape of the housing and heated to a predetermined temperature to at least a portion of the housing surface to which the insulating sheet is attached. A method for manufacturing an electronic device housing. A method for manufacturing an electronic device housing that houses a circuit board on which electronic components are mounted,
A step of producing a housing having an internal space capable of accommodating the circuit board, and having a concave portion formed on a surface thereof;
At least a portion of the surface of the housing where the concave portion is formed, a step of attaching an insulating sheet having shrinkage when heated,
A step of forming a press-contact surface according to the shape of the surface of the housing and pressing a press-contact member heated to a predetermined temperature to at least a portion of the front surface of the housing to which the insulating sheet is attached. A method for manufacturing a housing for an electronic device, comprising: The step of manufacturing the housing,
A step of attaching one surface of a metal plate having an adhesive to the upper and lower surfaces of the resin frame,
Heating the resin frame and the metal plate to melt the adhesive, and bonding the frame and the metal plate;
The step of pressing the pressing member against the surface of the housing,
4. The electronic device housing according to claim 3, wherein the resin frame and the metal plate are heated to melt the adhesive, and the resin frame and the metal plate are bonded together. 5. Production method. The electronic device is a PC card,
The insulating sheet,
The electronic device housing according to any one of claims 2 to 4, wherein the housing surface is attached to a portion exposed to the outside when the PC card is inserted into a PC card slot. Production method.

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