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JP2004147032A - Small imaging module - Google Patents

Small imaging module Download PDF

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Publication number
JP2004147032A
JP2004147032A JP2002309043A JP2002309043A JP2004147032A JP 2004147032 A JP2004147032 A JP 2004147032A JP 2002309043 A JP2002309043 A JP 2002309043A JP 2002309043 A JP2002309043 A JP 2002309043A JP 2004147032 A JP2004147032 A JP 2004147032A
Authority
JP
Japan
Prior art keywords
case
lens
imaging module
cut filter
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002309043A
Other languages
Japanese (ja)
Inventor
Yasuaki Kayanuma
萱沼 安昭
Kazuomi Tsutsui
筒井 和臣
Megumi Horiuchi
堀内 恵
Kazuhiro Watanabe
渡辺 一博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawaguchiko Seimitsu Co Ltd
Citizen Electronics Co Ltd
Kawaguchiko Seimitsu KK
Original Assignee
Kawaguchiko Seimitsu Co Ltd
Citizen Electronics Co Ltd
Kawaguchiko Seimitsu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawaguchiko Seimitsu Co Ltd, Citizen Electronics Co Ltd, Kawaguchiko Seimitsu KK filed Critical Kawaguchiko Seimitsu Co Ltd
Priority to JP2002309043A priority Critical patent/JP2004147032A/en
Publication of JP2004147032A publication Critical patent/JP2004147032A/en
Pending legal-status Critical Current

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  • Solid State Image Pick-Up Elements (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the number of parts and facilitate assembling by using a method of fixing the parts in which the parts are incorporated into a case of a small imaging module from one direction, while the parts are incorporated from both above and under parts in a conventional technique which takes much troublesomeness, an aperture of a single part is not required, and bonding is not used. <P>SOLUTION: The top end of a case 2 is covered with a ceiling 2b, and an aperture hole 2c is made so as to have an aperture function. Protrusions 2d are provided on the internal surface of the case, and a lens 6 is pushed into the case so that the lens passes through the protrusions, thus the lens is held by the protrusions. An IR cut filter 7 is abutted on the step portions of the case from the lower part and is bonded. In this way, the parts are incorporated only from under. The method of fixing the lens also includes bonding, ring pressure fitting, thermal caulking of the case and others, and these fixing methods are applicable to the IR cut filter. Further, by sandwiching an IR cut filter having the same contour as that of the lens between the lens and the ceiling of the case, the two parts can be simultaneously assembled and assembling man-hours can be reduced. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、ビデオカメラ、監視カメラ、工業用カメラ、パソコン、携帯電話等に組み込んで映像を撮影するのに用いる小型撮像モジュールに関する。
【0002】
【従来の技術】
図13は上記のような小型撮像モジュールの一例で、同図(A)は上面図、(B)は(A)のB−B断面図である。また、図14にその分解斜視図を示す。これらの図面に見るように、セラミックスやガラス入りエポキシ樹脂等の基板1とプラスチックのケース2からなるパッケージに、構成各要素を収容したものである。基板1にはIC(3)をダイボンデイングし、ワイヤ4でワイヤボンディングしてある。IC(3)には、フォトダイオード等の光電変換素子とMOSトランジスタあるいはCCD素子を組み合わせた検出要素を、多数、マトリクス配置した撮像回路が形成されている。
【0003】
図14に見るように、ケース2は下側が箱形、上側が円筒状で、図13(B)に示したように、基板1上のIC(3)に面して、ケース2の内側下部にIR(赤外線)カットフィルタ7が固定してあり、これにより屋外など赤外線が多い環境で電荷が飽和して、画像が真っ白になるのを防いでいる。ケース2の上側の円筒部の内壁に棚2aがあって、これにレンズ6が取り付けてある。
【0004】
レンズ6はガラスあるいは透明なプラスチック製で、円板状の基部6aの下面に凸レンズ6bを形成するとともに上面は平面、凹または凸の場合があり、基部6aの外周を棚2aに載せ、上面に絞り5を重ねてある。絞り5には光路となる絞り穴5aが開けてある。これらの部品相互の接合にはエポキシ等の接着剤を用いている。このような構成により、外界の映像はレンズ6を通してIC(3)の表面に結像し、電気信号に変換され処理される。
【0005】
これらの図に見るように、基板1の周辺には複数の窪み1aがあり、窪み1aの内壁は導電材料で被覆されていて、この導電材料は基板1の上下両面の導電パターンを接続し、図示してないが、基板1の下面における窪み1aの回りの導電材料のランド部が、組み込み先回路基板への接続用の端子電極になっている。従ってこの小型撮像モジュールは、基板1の下面の端子電極を用いて、電子機器の回路基板に表面実装するのに適している。
【0006】
下記の特許文献1には上記に類する小型撮像モジュールが開示されているが、鏡枠体にIRカットフィルタ、レンズ、絞り等を取り付ける構造の実際については発明の主眼でなく、模式的に描かれているだけで詳細は示されていない。
【0007】
【特許文献1】
特開2001−245217号公報 (図1−図13)
【0008】
【発明が解決しようとする課題】
図15は前記のような小型撮像モジュールの組み立て手順であって、ケース2にIRカットフィルタ7とレンズ6と絞り5を取り付け、これをIC(3)を実装した基板1に固定するのであるが、図に見るようにIRカットフィルタは下側からケース2に組み付け、一方、レンズ6と絞り5は上側からケース2に組み付けるのであって、反対の2方向からであるため製品組み立てに手間が掛かる。また小型撮像モジュールには不要の光を遮断して結像品質を上げるための絞り手段が必須で、そのため絞り5を用いているが、この部品を廃止できるならその分コストが低減する。本発明はこの絞り5を廃止と、組立の容易化を実現する。
【0009】
【課題を解決するための手段】
本発明では上記の課題を解決するため、まず、従来は開放されていたケースの上側の円筒部上端に天井を設け、その中央部に絞り穴を開けることにより天井部を絞りにする。こうしてケースと絞りを一体化し、別部品の絞りを廃止する。ケースの上端が天井で塞がるので、レンズの組み付けも従来のように上方からでなく、下側からケースに入れて天井に突き当てる。IRカットフィルタは従来同様下側からケースに組み付ける。これにより部品の組み付け方向をケースの下側からに統一する。
【0010】
前記の従来例ではレンズ6をケース2の棚2aに載せて接着剤で接合していた。本発明ではケースに天井を設けることに伴って、前記のような棚2aによらずにレンズを組み付ける構造を取る。すなわちレンズ収容部のケース内面に突起を設け、これを乗り越えてレンズを押し込み、突起との係合で保持すること、突起のないケース内面に接着剤で接着すること、レンズの下部のケース内面にリングを圧入してこれにより保持すること、ケース天井の下面に囲いを設けてレンズを収容し、囲いの端面を熱かしめしてレンズの外周を押さえて保持すること、などである。これらの固定方法はケースへのIRカットフィルタの取り付けにも応用できる。さらに本発明では、IRカットフィルタをケースの天井とレンズの間に挟んで保持することにより、IRカットフィルタとレンズを同時にケースに取り付ける構造をも提案する。
【0011】
【発明の実施の形態】
以下、図面に基づいて本発明の実施形態を説明する。なお、各実施形態とも、小型撮像モジュールとしての基本構造は先の従来例と同様であるから、対応する部品や部分については同じ符号をつけ、詳細な説明は省略する。
【0012】
図1に本発明の第1の実施形態の断面図を示す。図13〜15の従来例で用いている絞り5を廃止し、代わりにケース2の上端を天井2bで塞ぎ、その中央に絞り穴2cを設けて絞り作用を行わせている。そして図13のような棚2aに代えて、ケース2の円筒部内面に突起2dを設け、レンズ6の基部6aを支える。
【0013】
部品の組み付けは図2に示すように、レンズ6を下方からケース2の円筒部に入れ、ケース2の内面の突起2dを越えて押し込む。レンズ6は図1のように突起2dに係合して落ち着く。次いでケースの下方からIRカットフィルタ7を入れてケース2の円筒部下端の段差部に当て、従来と同様に接着剤で固定する。このようにして部品を取り付けたケース2を、IC(3)を搭載した基板1の上面に接合して完成する。この構造により、レンズ6とIRカットフィルタ7はいずれも下方からケース2に組み付ければよくなり、従来のように上下別々の方向から行う必要がなくなるとともに、レンズ6の接着が不要で組み立て作業が簡単になる。
【0014】
図1、図2のように突起2dがケース2の円筒部の内周を一周して取り巻く場合は、突起2dの高さの管理が厳しくなったり、レンズ6の押し込みが困難になったりすることがあるが、突起2dを全周連続でなく数カ所に分散して設ければ、その点が緩和される。
【0015】
図3に本発明の第2の実施形態の断面図を示す。この場合もケース2の円筒部の上端を天井2bで塞ぎ、絞り穴2cを設けてある。先の実施形態と異なってケース2の内面に突起は設けず、レンズ6を接着剤11でケース内面に接合してある。
【0016】
部品の組み付けは図4に示すように、レンズ6を下方からケース2の円筒部に入れ、天井に突き当てて接着剤で固定する。次いでケースの下方からIRカットフィルタ7を入れてケース2の円筒部下端の段差部に当て、接着剤で固定する。これによりケース2へのレンズ6とIRカットフィルタ7の組み付けは、いずれも下方から行えばよくなる。
【0017】
図5に本発明の第3の実施形態の断面図を示す。この場合もケース2の円筒部上端に天井2bを設け、絞り穴2cを開けてある。ここでの特徴はケース2の円筒部の内側に、樹脂あるいはゴム等のリング12を固定してレンズ6を保持することである。
【0018】
部品の組み付けは図6に示すように、レンズ6を下方からケース2の円筒部に入れ、その下からリング12を円筒部の内側に軽圧入して、レンズ6を天井に突き当てる。次いでケースの下方からIRカットフィルタ7を入れてケース2に接着する。これにより部品の組み付けを下方からだけ行えばよくなるとともに、レンズ6の接着が不要になる。
【0019】
図7に本発明の第4の実施形態の断面図を示す。この場合もケース2の円筒部上端に天井2bを設け、絞り穴2cを開けてある。さらに天井2bの下面に、レンズ6を取り巻く短円筒状の囲い2eを設け、その下端を「熱かしめ」して変形させ、レンズ6の基部6aを押さえて保持している。熱かしめには超音波、ヒーター、レーザー等を用い、囲い2e端面の何カ所かで行えばよい。さらに囲い2e自体を、連続した形状でなく、何本かの支柱状に分散して設けてもよい。
【0020】
部品の組み付けは図8に示すように、レンズ6を下方からケース2の天井2b下面の囲い2eの中に入れ、囲い2eの下端を熱かしめしてレンズ6を押さえる。次いでケースの下方からIRカットフィルタ7を入れてケース2に接着する。これにより部品の組み付けは下方からだけ行えばよくなるとともにレンズ6の接着が不要になる。
【0021】
以上の各実施形態において、ケース2へのレンズ6の取り付けを突起、接着剤、リング、囲い等の手段で行うのに対し、IRカットフィルタ7の固定はもっぱら接着によっていたが、レンズ6の取り付けと同様の手段をIRカットフィルタ7にも用いることができる。その一例を第5の実施形態として図9に示す。レンズ6は第1の実施形態(図1)と同様、ケース2内面の突起2dとの係合により取り付けてある。さらにIRカットフィルタ7もケースと一体で突起のあるフック2fに係合させて取り付ける。
【0022】
図10は部品の組み付け状況の下方からの斜視図で、レンズをすでにケース2に固定済みであり、これからIRカットフィルタ7を取り付けるところである。この場合も部品の組み付けは下方からだけであり、IRカットフィルタ7はフック2fに係合させるだけでよくて、接着工程が不要になる。このほか図示は省くが、レンズ6の固定に用いたリングの圧入やケース部分の熱かしめ等を、IRカットフィルタ7の組み付けにも応用できる。
【0023】
図11に本発明の第6の実施形態の断面図を示す。先の各実施形態と異なり、この実施形態ではIRカットフィルタ7を単独でケース2に取り付けることをせず、IRカットフィルタ7の輪郭をレンズ6とほぼ同形状にして、ケース2の天井2bとレンズ6の間に挟んで保持する。この図ではレンズ6の固定を接着剤11で行っているが、すでに見た他の手段である突起、リング、囲い等によることも可能なのはいうまでもない。
【0024】
部品の組み付けは図12に示すように、IRカットフィルタ7とレンズ6を、順次、下方からケース2の円筒部に入れ、レンズ6を前記のように適宜の方法でケース2に固定する。この場合も部品の組み付けは下方からだけ行えばよく、さらにIRカットフィルタ7はレンズ6と同時に組み付けることができて、組み立て工数が削減される。
【0025】
【発明の効果】
本発明によれば、小型撮像モジュールにおいて絞りとケースを一体化することにより、従来のような単体部品の絞りを廃止できる。これによって部品点数が減り、絞り製作用の金型が不要になる。さらに、ケースに対しレンズやIRカットフィルタを一方向からだけ組み付ければよいので、組立作業が容易になる。もっとも図5、図6の第3の実施形態においては、絞りを廃止する代わりにリング12を導入するから、部品数は変らないが、組み付けを一方向から行う利点は保たれる。また、レンズやIRカットフィルタの固定は、従来同様に接着剤によることもできるが、突起やフックとの係合やケースの一部の熱かしめなどの方法により、接着剤を使う工程を廃止できる。こうして高性能で廉価な小型撮像モジュールが実現する。
【図面の簡単な説明】
【図1】本発明の小型撮像モジュールの第1の実施形態の断面図である。
【図2】図1の実施形態の組み立て手順を示す図である。
【図3】本発明の小型撮像モジュールの第2の実施形態の断面図である。
【図4】図3の実施形態の組み立て手順を示す図である。
【図5】本発明の小型撮像モジュールの第3の実施形態の断面図である。
【図6】図5の実施形態の組み立て手順を示す図である。
【図7】本発明の小型撮像モジュールの第4の実施形態の断面図である。
【図8】図7の実施形態の組み立て手順を示す図である。
【図9】本発明の小型撮像モジュールの第5の実施形態の断面図である。
【図10】図9の実施形態の組み立て手順を示す下方からの斜視図である。
【図11】本発明の小型撮像モジュールの第6の実施形態の断面図である。
【図12】図11の実施形態の組み立て手順を示す図である。
【図13】従来の小型撮像モジュールの図面で、(A)は上面図、(B)は(A)のB−B断面図である。
【図14】図13の従来例の分解斜視図である。
【図15】図13の従来例の組み立て手順を示す図である。
【符号の説明】
1 基板
2 ケース
2a 棚
2b 天井
2c 絞り穴
2d 突起
2e 囲い
2f フック
3 IC
5 絞り
6 レンズ
7 IRカットフィルタ
11 接着剤
12 リング
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a small imaging module that is incorporated into a video camera, a surveillance camera, an industrial camera, a personal computer, a mobile phone, or the like and used to take a picture.
[0002]
[Prior art]
FIGS. 13A and 13B show an example of the small imaging module as described above. FIG. 13A is a top view and FIG. 13B is a cross-sectional view taken along line BB in FIG. FIG. 14 is an exploded perspective view thereof. As seen in these drawings, each component is housed in a package made up of a substrate 1 made of ceramics or epoxy resin containing glass and a plastic case 2. An IC (3) is die bonded to the substrate 1 and wire bonded with a wire 4. The IC (3) is formed with an imaging circuit in which a large number of detection elements, each of which is a combination of a photoelectric conversion element such as a photodiode and a MOS transistor or a CCD element, are arranged in a matrix.
[0003]
As shown in FIG. 14, the case 2 has a box shape on the lower side and a cylindrical shape on the upper side, and faces the IC (3) on the substrate 1 as shown in FIG. Further, an IR (infrared) cut filter 7 is fixed to prevent the image from becoming saturated due to the saturation of electric charge in an environment with a lot of infrared rays such as outdoors. A shelf 2a is provided on the inner wall of the upper cylindrical portion of the case 2, and a lens 6 is attached thereto.
[0004]
The lens 6 is made of glass or transparent plastic, and a convex lens 6b is formed on the lower surface of the disc-shaped base portion 6a, and the upper surface may be flat, concave or convex, and the outer periphery of the base portion 6a is placed on the shelf 2a, The aperture 5 is overlaid. The aperture 5 has an aperture 5a serving as an optical path. An adhesive such as epoxy is used for joining these components. With such a configuration, an image of the outside world is imaged on the surface of the IC (3) through the lens 6, and is converted into an electric signal and processed.
[0005]
As seen in these figures, there are a plurality of depressions 1a around the substrate 1, and the inner walls of the depressions 1a are covered with a conductive material, which connects the conductive patterns on both the upper and lower surfaces of the substrate 1, Although not shown, the land portion of the conductive material around the recess 1a on the lower surface of the substrate 1 serves as a terminal electrode for connection to the circuit board to be incorporated. Therefore, this small imaging module is suitable for surface mounting on a circuit board of an electronic device using the terminal electrode on the lower surface of the substrate 1.
[0006]
Patent Document 1 below discloses a small-sized imaging module similar to the above, but the actual structure of attaching an IR cut filter, a lens, a diaphragm, etc. to the lens frame is schematically illustrated rather than the main point of the invention. The details are not shown.
[0007]
[Patent Document 1]
JP 2001-245217 A (FIG. 1 to FIG. 13)
[0008]
[Problems to be solved by the invention]
FIG. 15 shows the procedure for assembling the small imaging module as described above. The IR cut filter 7, the lens 6 and the diaphragm 5 are attached to the case 2, and this is fixed to the substrate 1 on which the IC (3) is mounted. As shown in the figure, the IR cut filter is assembled to the case 2 from the lower side, while the lens 6 and the diaphragm 5 are assembled to the case 2 from the upper side. . In addition, a diaphragm means for blocking unnecessary light and improving imaging quality is essential for a small imaging module, and therefore the diaphragm 5 is used. However, if this part can be eliminated, the cost is reduced accordingly. The present invention eliminates the diaphragm 5 and facilitates assembly.
[0009]
[Means for Solving the Problems]
In the present invention, in order to solve the above-described problem, first, a ceiling is provided at the upper end of the upper cylindrical portion of the case that has been open in the past, and a throttle hole is formed in the central portion thereof to make the ceiling portion an aperture. In this way, the case and the diaphragm are integrated, and the diaphragm of another part is abolished. Since the upper end of the case is closed by the ceiling, the lens is assembled from the lower side rather than the upper side as in the prior art, and is put into the case from the lower side and abuts against the ceiling. The IR cut filter is assembled to the case from below as in the prior art. This unifies the assembly direction of the parts from the lower side of the case.
[0010]
In the conventional example described above, the lens 6 is mounted on the shelf 2a of the case 2 and bonded with an adhesive. The present invention adopts a structure in which a lens is assembled regardless of the shelf 2a as described above in connection with providing a ceiling on the case. That is, a protrusion is provided on the inner surface of the case of the lens housing portion, and the lens is pushed over and held in engagement with the protrusion, adhered to the inner surface of the case without the protrusion, and adhered to the inner surface of the case below the lens. For example, a ring is press-fitted and held thereby, and an enclosure is provided on the lower surface of the case ceiling to accommodate the lens, and an end surface of the enclosure is heat caulked to press and hold the outer periphery of the lens. These fixing methods can also be applied to attachment of an IR cut filter to the case. Furthermore, the present invention proposes a structure in which the IR cut filter and the lens are attached to the case at the same time by holding the IR cut filter between the ceiling of the case and the lens.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each of the embodiments, the basic structure as a small imaging module is the same as that of the prior art, so corresponding parts and portions are denoted by the same reference numerals and detailed description thereof is omitted.
[0012]
FIG. 1 shows a cross-sectional view of a first embodiment of the present invention. The diaphragm 5 used in the conventional examples of FIGS. 13 to 15 is abolished. Instead, the upper end of the case 2 is closed by the ceiling 2b, and a diaphragm hole 2c is provided at the center to perform the diaphragm action. Then, instead of the shelf 2 a as shown in FIG. 13, a protrusion 2 d is provided on the inner surface of the cylindrical portion of the case 2 to support the base portion 6 a of the lens 6.
[0013]
As shown in FIG. 2, the lens 6 is inserted into the cylindrical portion of the case 2 from below and pushed in over the protrusion 2 d on the inner surface of the case 2. As shown in FIG. 1, the lens 6 engages with the protrusion 2d and settles. Next, the IR cut filter 7 is inserted from below the case, applied to the stepped portion at the lower end of the cylindrical portion of the case 2, and fixed with an adhesive as in the conventional case. The case 2 to which the components are attached in this way is completed by joining to the upper surface of the substrate 1 on which the IC (3) is mounted. With this structure, both the lens 6 and the IR cut filter 7 have only to be assembled to the case 2 from below, and it is not necessary to perform from the top and bottom separate directions as in the prior art. It will be easy.
[0014]
When the protrusion 2d surrounds the inner periphery of the cylindrical portion of the case 2 as shown in FIGS. 1 and 2, the height of the protrusion 2d is difficult to be managed, and it is difficult to push the lens 6 in. However, if the protrusions 2d are provided not in a continuous manner on the entire circumference but in several places, this point is alleviated.
[0015]
FIG. 3 shows a cross-sectional view of the second embodiment of the present invention. Also in this case, the upper end of the cylindrical portion of the case 2 is closed by the ceiling 2b, and a throttle hole 2c is provided. Unlike the previous embodiment, no protrusion is provided on the inner surface of the case 2, and the lens 6 is bonded to the inner surface of the case with an adhesive 11.
[0016]
As shown in FIG. 4, the parts are assembled by putting the lens 6 into the cylindrical portion of the case 2 from below, abutting against the ceiling, and fixing with an adhesive. Next, the IR cut filter 7 is inserted from below the case, applied to the stepped portion at the lower end of the cylindrical portion of the case 2, and fixed with an adhesive. As a result, the lens 6 and the IR cut filter 7 can be assembled to the case 2 from below.
[0017]
FIG. 5 shows a cross-sectional view of a third embodiment of the present invention. Also in this case, a ceiling 2b is provided at the upper end of the cylindrical portion of the case 2, and a throttle hole 2c is formed. The feature here is that the lens 6 is held by fixing a ring 12 made of resin or rubber inside the cylindrical portion of the case 2.
[0018]
As shown in FIG. 6, the lens 6 is put into the cylindrical portion of the case 2 from below, the ring 12 is lightly press-fitted into the inside of the cylindrical portion from below, and the lens 6 is abutted against the ceiling. Next, an IR cut filter 7 is inserted from below the case and adhered to the case 2. As a result, the parts need only be assembled from below, and the lens 6 need not be adhered.
[0019]
FIG. 7 shows a cross-sectional view of a fourth embodiment of the present invention. Also in this case, a ceiling 2b is provided at the upper end of the cylindrical portion of the case 2, and a throttle hole 2c is formed. Further, a short cylindrical enclosure 2e surrounding the lens 6 is provided on the lower surface of the ceiling 2b, and the lower end thereof is deformed by “heat caulking”, and the base 6a of the lens 6 is pressed and held. For heat caulking, an ultrasonic wave, a heater, a laser, or the like may be used, and the heat caulking may be performed at several places on the end face of the enclosure 2e. Further, the enclosure 2e itself may be provided in a dispersed form in a number of support columns instead of a continuous shape.
[0020]
As shown in FIG. 8, the lens 6 is inserted into the enclosure 2 e on the lower surface of the ceiling 2 b of the case 2 from below, and the lower end of the enclosure 2 e is heat caulked to hold the lens 6. Next, an IR cut filter 7 is inserted from below the case and adhered to the case 2. As a result, the parts need only be assembled from below, and the lens 6 need not be adhered.
[0021]
In each of the embodiments described above, the lens 6 is attached to the case 2 by means such as a protrusion, an adhesive, a ring, and an enclosure, whereas the IR cut filter 7 is fixed solely by adhesion, but the lens 6 is attached. The same means can be used for the IR cut filter 7 as well. An example thereof is shown in FIG. 9 as a fifth embodiment. Similarly to the first embodiment (FIG. 1), the lens 6 is attached by engagement with the protrusion 2d on the inner surface of the case 2. Further, the IR cut filter 7 is attached by being engaged with the hook 2f having a protrusion integral with the case.
[0022]
FIG. 10 is a perspective view of the part assembly state from below. The lens has already been fixed to the case 2, and the IR cut filter 7 is to be attached. Also in this case, the parts are assembled only from below, and the IR cut filter 7 only needs to be engaged with the hook 2f, and the bonding step is unnecessary. In addition, although not shown in the figure, the press-fitting of the ring used for fixing the lens 6 and the heat caulking of the case portion can also be applied to the assembly of the IR cut filter 7.
[0023]
FIG. 11 shows a cross-sectional view of a sixth embodiment of the present invention. Unlike the previous embodiments, in this embodiment, the IR cut filter 7 is not attached to the case 2 alone, and the outline of the IR cut filter 7 is substantially the same shape as the lens 6, and the ceiling 2 b of the case 2 Hold between the lenses 6. Although the lens 6 is fixed with the adhesive 11 in this figure, it is needless to say that it is possible to use other means that have already been seen, such as protrusions, rings, and enclosures.
[0024]
As shown in FIG. 12, the parts are assembled by sequentially inserting the IR cut filter 7 and the lens 6 into the cylindrical portion of the case 2 from below and fixing the lens 6 to the case 2 by an appropriate method as described above. Also in this case, the parts need only be assembled from below, and the IR cut filter 7 can be assembled at the same time as the lens 6, thereby reducing the number of assembly steps.
[0025]
【The invention's effect】
According to the present invention, the diaphragm of a single component as in the past can be eliminated by integrating the diaphragm and the case in the small imaging module. This reduces the number of parts and eliminates the need for a drawing mold. Furthermore, since the lens and the IR cut filter need only be assembled to the case from only one direction, the assembling work is facilitated. However, in the third embodiment shown in FIGS. 5 and 6, since the ring 12 is introduced instead of eliminating the aperture, the number of parts does not change, but the advantage of assembling from one direction is maintained. In addition, the lens and IR cut filter can be fixed with an adhesive as in the conventional case, but the process of using the adhesive can be abolished by engaging with the protrusions and hooks, or by heat caulking part of the case. . Thus, a high-performance and inexpensive small-sized imaging module is realized.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a first embodiment of a small imaging module of the present invention.
FIG. 2 is a diagram showing an assembly procedure of the embodiment of FIG. 1;
FIG. 3 is a cross-sectional view of a second embodiment of a small imaging module of the present invention.
FIG. 4 is a diagram showing an assembly procedure of the embodiment of FIG. 3;
FIG. 5 is a cross-sectional view of a third embodiment of a small imaging module of the present invention.
6 is a diagram showing an assembly procedure of the embodiment of FIG. 5;
FIG. 7 is a cross-sectional view of a fourth embodiment of a small imaging module of the present invention.
FIG. 8 is a diagram showing an assembly procedure of the embodiment of FIG.
FIG. 9 is a cross-sectional view of a fifth embodiment of a small imaging module of the present invention.
FIG. 10 is a perspective view from below showing the assembly procedure of the embodiment of FIG. 9;
FIG. 11 is a cross-sectional view of a sixth embodiment of a small imaging module of the present invention.
FIG. 12 is a diagram showing an assembly procedure of the embodiment of FIG.
13A and 13B are drawings of a conventional small imaging module, in which FIG. 13A is a top view and FIG. 13B is a cross-sectional view taken along line BB of FIG.
14 is an exploded perspective view of the conventional example of FIG.
15 is a diagram showing an assembly procedure of the conventional example of FIG.
[Explanation of symbols]
1 Substrate 2 Case 2a Shelf 2b Ceiling 2c Restriction hole 2d Protrusion 2e Enclosure 2f Hook 3 IC
5 Aperture 6 Lens 7 IR Cut Filter 11 Adhesive 12 Ring

Claims (7)

基板とケースでパッケージを構成し、絞り手段、レンズ、IRカットフィルタ、IC等を収容してなる小型撮像モジュールにおいて、
ケースと一体に天井を形成し、その中央部に穴を開けてこれを絞り手段とし、
レンズおよびIRカットフィルタを下方よりケースに組み付けることを特徴とする小型撮像モジュール。
In a small imaging module comprising a package with a substrate and a case, and containing an aperture means, a lens, an IR cut filter, an IC, etc.
A ceiling is formed integrally with the case, and a hole is made in the center thereof, which is used as a squeezing means.
A compact imaging module, wherein a lens and an IR cut filter are assembled to a case from below.
請求項1に記載の小型撮像モジュールにおいて、
ケースの内周に突起を設け、これを乗り越えて組み付けたレンズをこの突起により保持することを特徴とする小型撮像モジュール。
The small imaging module according to claim 1,
A small imaging module characterized in that a projection is provided on the inner periphery of the case, and the lens assembled over the projection is held by the projection.
請求項1に記載の小型撮像モジュールにおいて、
レンズを接着剤によりケースの内周に固定することを特徴とする小型撮像モジュール。
The small imaging module according to claim 1,
A compact imaging module, wherein a lens is fixed to an inner periphery of a case with an adhesive.
請求項1に記載の小型撮像モジュールにおいて、
レンズ下側のケース内周にリングを圧入してレンズを保持することを特徴とする小型撮像モジュール。
The small imaging module according to claim 1,
A compact imaging module characterized by holding a lens by press-fitting a ring into the inner periphery of the case on the lower side of the lens.
請求項1に記載の小型撮像モジュールにおいて、
ケースの一部を熱かしめしてレンズを固定することを特徴とする小型撮像モジュール。
The small imaging module according to claim 1,
A compact imaging module characterized in that a lens is fixed by caulking part of a case.
請求項1に記載の小型撮像モジュールにおいて、
IRカットフィルタを接着剤、突起、リング、またはケースの熱かしめのいずれかの方法によりケースに取り付けることを特徴とする小型撮像モジュール。
The small imaging module according to claim 1,
A small imaging module, wherein an IR cut filter is attached to a case by any one of adhesive, protrusion, ring, or heat caulking of the case.
請求項1ないし5に記載の小型撮像モジュールにおいて、
IRカットフィルタをケース天井とレンズの間に挟んで保持することを特徴とする小型撮像モジュール。
The small imaging module according to claim 1,
A compact imaging module characterized in that an IR cut filter is held between a case ceiling and a lens.
JP2002309043A 2002-10-23 2002-10-23 Small imaging module Pending JP2004147032A (en)

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006246461A (en) * 2005-03-02 2006-09-14 Premier Image Technology Corp Camera module and its manufacturing method
KR100691157B1 (en) * 2005-04-07 2007-03-09 삼성전기주식회사 A camera module for focusing unadjustable type
US7196857B2 (en) 2004-12-14 2007-03-27 Shinko Electric Industries Co., Ltd. Image pickup module, method of manufacturing the same, and spacer with infrared ray cut film
JP2007184801A (en) * 2006-01-10 2007-07-19 Alps Electric Co Ltd Camera module
KR100757067B1 (en) 2006-07-04 2007-09-11 (주)디바이스 온 Holder of low profile for compact carmera module
KR100818514B1 (en) 2006-10-23 2008-03-31 삼성전기주식회사 A camera module package
US7414799B2 (en) 2004-12-20 2008-08-19 Shinko Electric Industries Co., Ltd. Manufacturing method of camera module
US7515817B2 (en) 2005-04-26 2009-04-07 Shinko Electric Industries Co., Ltd. Camera module
US7626773B2 (en) 2004-11-08 2009-12-01 Panasonic Corporation Lens unit
US7903170B2 (en) * 2006-10-18 2011-03-08 Shinten Sangyo Co., Ltd. Imaging apparatus
US8027101B2 (en) 2007-11-12 2011-09-27 Olympus Corporation Optical element fixing component and imaging unit
US8522856B2 (en) 2009-03-09 2013-09-03 Olympus Corporation Method of manufacturing optical component
KR101474128B1 (en) 2013-03-26 2014-12-17 삼성전기주식회사 Camera module
CN104659045A (en) * 2013-11-19 2015-05-27 索尼公司 Solid state image capturing apparatus, camera module and electronic device
JP2016001756A (en) * 2009-09-17 2016-01-07 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. Led module with high index lens
WO2016147556A1 (en) * 2015-03-17 2016-09-22 ソニー株式会社 Optical connector, optical connector set, image pickup unit, image pickup system, and optical transmission module
JP2018045212A (en) * 2016-09-16 2018-03-22 株式会社フジクラ Image capturing module and manufacturing method therefor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09130683A (en) * 1995-11-06 1997-05-16 Konica Corp Optical element-integrated image pickup element and image pickup device
JPH09130654A (en) * 1995-11-06 1997-05-16 Konica Corp Image pickup device
JPH10321827A (en) * 1997-05-16 1998-12-04 Sony Corp Image-pickup device and camera
JP2000125212A (en) * 1998-08-10 2000-04-28 Olympus Optical Co Ltd Image pickup module
JP2000147346A (en) * 1998-11-09 2000-05-26 Toshiba Corp Fitting mechanism for mold lens
JP2002098878A (en) * 2000-07-17 2002-04-05 Toshiba Corp Optical lens unit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09130683A (en) * 1995-11-06 1997-05-16 Konica Corp Optical element-integrated image pickup element and image pickup device
JPH09130654A (en) * 1995-11-06 1997-05-16 Konica Corp Image pickup device
JPH10321827A (en) * 1997-05-16 1998-12-04 Sony Corp Image-pickup device and camera
JP2000125212A (en) * 1998-08-10 2000-04-28 Olympus Optical Co Ltd Image pickup module
JP2000147346A (en) * 1998-11-09 2000-05-26 Toshiba Corp Fitting mechanism for mold lens
JP2002098878A (en) * 2000-07-17 2002-04-05 Toshiba Corp Optical lens unit

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US7414799B2 (en) 2004-12-20 2008-08-19 Shinko Electric Industries Co., Ltd. Manufacturing method of camera module
JP2006246461A (en) * 2005-03-02 2006-09-14 Premier Image Technology Corp Camera module and its manufacturing method
KR100691157B1 (en) * 2005-04-07 2007-03-09 삼성전기주식회사 A camera module for focusing unadjustable type
US7515817B2 (en) 2005-04-26 2009-04-07 Shinko Electric Industries Co., Ltd. Camera module
JP2007184801A (en) * 2006-01-10 2007-07-19 Alps Electric Co Ltd Camera module
KR100757067B1 (en) 2006-07-04 2007-09-11 (주)디바이스 온 Holder of low profile for compact carmera module
US7903170B2 (en) * 2006-10-18 2011-03-08 Shinten Sangyo Co., Ltd. Imaging apparatus
KR100818514B1 (en) 2006-10-23 2008-03-31 삼성전기주식회사 A camera module package
US8027101B2 (en) 2007-11-12 2011-09-27 Olympus Corporation Optical element fixing component and imaging unit
US8522856B2 (en) 2009-03-09 2013-09-03 Olympus Corporation Method of manufacturing optical component
JP2016001756A (en) * 2009-09-17 2016-01-07 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. Led module with high index lens
KR101474128B1 (en) 2013-03-26 2014-12-17 삼성전기주식회사 Camera module
CN104659045A (en) * 2013-11-19 2015-05-27 索尼公司 Solid state image capturing apparatus, camera module and electronic device
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US10578854B2 (en) 2015-03-17 2020-03-03 Sony Corporation Optical connector, optical connector set, image pickup unit, image pickup system, and optical transmission module
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US10698172B2 (en) 2016-09-16 2020-06-30 Fujikura Ltd. Imaging module and method of manufacturing the same

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