JP2004031187A - Surface mounting method for high frequency connector, printed circuit board mounted with high frequency connector, and printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting method for a high frequency connector mountable in low reflection by suppressing capacitive coupling of the connector caused by a board dielectric, and a printed circuit board mounted with the high frequency connector. <P>SOLUTION: By forming a through hole 21 in a connector fixing position of a printed circuit board 20, the board dielectric 9 just under a connector 1 is eliminated, and the capacitive coupling of the connector 1 is suppressed. As a result, the connector 1 through which a high frequency signal flows can be mounted in low reflection on the printed circuit board 20. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for mounting a high-frequency connector, a high-frequency connector-mounted printed board, and a printed board.
[0002]
[Prior art]
FIG. 3 is a perspective perspective view of a high-frequency connector, and FIG. 4 is an external perspective view of a conventional printed circuit board. FIG. 5 is a partial cross-sectional view of a high-frequency connector mounted printed board in which the high-frequency connector shown in FIG. 3 is mounted on a printed board by applying a conventional mounting method.
[0003]
The high-frequency connector 1 shown in FIG. 3 includes a cylindrical connector signal line 2 connected to an external connector (not shown), and a cylindrical external conductor 3 arranged around the connector signal line 2 and connected to the external connector. One of the pieces is connected to the external conductor 3, and the other piece is connected to the connector external conductor soldering portions 4, 5 having an L-shaped cross section and extending outward so as to be orthogonal to the center of the external conductor 3. A strip-shaped connector signal wire soldering portion 6 connected to the extension portion and extending outward so as to be orthogonal to the connector signal line 2 and the external conductor 3, and a block-shaped resin mold covering a base portion of each of the soldering portions 4 to 6. This is a surface-mounted coaxial connector composed of the first and the second components.
[0004]
The printed circuit board 8 shown in FIG. 4 is connected to the exposed portions of the soldered portions 4 to 6 (see FIG. 3) of the high-frequency connector 1 (see FIG. 3) on one surface (the upper surface in the drawing) of the substrate dielectric 9. This is a double-sided printed circuit board provided with soldering portions 10 to 12 and a ground plate 13 formed on the other surface (in this case, the lower surface). The connector outer conductor soldering portions 10 and 11 and the ground plate 13 are electrically connected by through-hole plating 14 and 15, respectively, and the soldering portion 12 is a signal line formed on one surface of the substrate dielectric 9. (Microstrip line) 16.
[0005]
At the connector fixing position (portion surrounded by the soldering portions 10 (11) and 12) on the printed circuit board 8 shown in FIG. 5, the exposed portion of the connector signal line soldering portion 6 of the connector 1 (see FIG. 3) is printed. The connector signal soldering portion 12 of the signal line of the board 8 is connected by soldering, and the exposed portion of the connector outer conductor soldering portion 4 (5) of the connector 1 and the connector outer conductor soldering portion 10 (11) of the printed board 8 are connected. And are connected by solder.
[0006]
[Problems to be solved by the invention]
However, as shown in FIG. 6, when the high-frequency connector (hereinafter referred to as “connector”) 1 is surface-mounted as it is on a printed circuit board 8, the connector signal line 2 and the outside are connected by a board dielectric (eg, glass epoxy resin) 9 of the printed circuit board 8. Capacitive coupling occurs with the conductor 3, which causes impedance mismatch. Since the impedance mismatch causes signal reflection, it must be minimized.
[0007]
FIG. 6 is an explanatory diagram showing the capacitive coupling of the connector by the substrate dielectric of the printed circuit board shown in FIG.
[0008]
Therefore, there is a method of considering the effect of the substrate dielectric 9 when designing the connector 1. However, since the magnitude of the capacitive coupling changes depending on the relative dielectric constant of the printed circuit board 8 on which the connector 1 is mounted, each printed circuit board 8 used The shape of the connector must be changed, resulting in an increase in working time and an increase in cost.
[0009]
For this reason, there is a problem that a board mounting method that can suppress impedance mismatch on any printed board without changing the structure of the connector is required.
[0010]
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to provide a method of mounting a high-frequency connector and a printed circuit board on which a high-frequency connector can be mounted with low reflection by suppressing capacitive coupling of the connector by a substrate dielectric.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, a first aspect of the present invention is a method of surface mounting a high-frequency connector on a printed circuit board, wherein the high-frequency connector is surface-mounted after a through hole is formed at a fixed position of the high-frequency connector on the printed circuit board. is there.
[0012]
According to a second aspect of the present invention, in addition to the configuration described in the first aspect, it is preferable that a high-frequency connector for surface mounting is used as the high-frequency connector, and a double-sided printed board is used as the printed board.
[0013]
According to a third aspect of the present invention, in addition to the configuration according to the first or second aspect, as the high-frequency connector, a connector signal line connected to an external connector, and a connector signal line arranged around the connector signal line and connected to the external connector. A cylindrical external conductor, an L-shaped connector external conductor soldering portion having one piece connected to the external conductor and the other piece extending outward so as to be orthogonal to the center of the external conductor, A surface mount coaxial connector, which is composed of a connector signal line soldering portion connected to the extension portion and extending outward so as to be orthogonal to the connector signal line and the external conductor, and a resin mold portion covering a base portion of each soldering portion. As a printed circuit board, a signal line connected to each soldering part is provided on one surface, a ground plate is provided on the other surface, and a through hole is provided at the fixed position of the high-frequency connector. Preferably used made the double-sided printed circuit board.
[0014]
According to a fourth aspect of the present invention, in addition to the configuration of the third aspect, the through-hole formed in the connector connection portion of the ground plate may be covered with a metal plate after the surface mounting of the connector.
[0015]
According to a fifth aspect of the present invention, in a high-frequency connector-mounted printed circuit board having a high-frequency connector surface-mounted on the printed circuit board, a through hole is formed at a position on the printed circuit board where the high-frequency connector is fixed.
[0016]
According to a sixth aspect of the present invention, in a printed circuit board on which a high-frequency connector is surface-mounted, a through hole is formed at a fixing position of the high-frequency connector.
[0017]
According to the present invention, by forming a through hole at the connector fixing position of the printed circuit board, there is no substrate dielectric just below the connector, and the capacitive coupling of the connector can be suppressed. As a result, the connector through which the high-frequency signal flows can be mounted on the printed circuit board with low reflection.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same members as those in the conventional example shown in FIGS. 3 and 4 are denoted by the same reference numerals.
[0019]
FIG. 1 is a cross-sectional view showing one embodiment of a printed circuit board on which a high-frequency connector according to the present invention is applied. FIG. 2 is an external perspective view of a printed circuit board used for the high-frequency connector mounted printed circuit board shown in FIG.
[0020]
As shown in FIG. 2, a printed circuit board 20 used for the high-frequency connector mounting printed circuit board shown in FIG. 1 has one surface (upper surface in FIG. 2) of the substrate dielectric 9 on each of the soldered portions 4 of the high-frequency connector (see FIG. 3). 6 to 6 (see FIG. 3) are provided, and a ground plate 13 is formed on the other surface (the lower surface in this case) of the substrate dielectric 9 to fix the high-frequency connector 1. This is a double-sided printed circuit board having through holes 21 formed at positions. For the formation of the through holes 21, for example, means such as drilling or punching is used. The shape of the through-hole 21 is rectangular in the figure, but is not limited thereto, and may be triangular, circular or polygonal.
[0021]
The connector outer conductor soldering portions 10 and 11 and the ground plate 13 are electrically connected by through-hole platings 14 and 15, respectively, and the soldering portion 12 is connected to the signal line 16 formed on one surface of the substrate dielectric 9. Connected to one end.
[0022]
As shown in FIG. 1, the connector signal line soldering portion 6 of the high-frequency connector 1 and the printed circuit board 20 are soldered at the connector fixing position on the printed circuit board 20 (the portion surrounded by the soldering portions 10 (11) and 12). The part 12 is connected by solder, and the exposed part of the connector outer conductor soldering part 4 (5) of the high-frequency connector 1 and the connector outer conductor soldering part 10 (11) of the printed circuit board 20 are connected by solder.
[0023]
By forming the through hole 21 at the connector fixing position of the printed circuit board 20 in this way, the board dielectric 9 immediately below the connector 1 is eliminated, and the capacitive coupling of the connector 1 can be suppressed. As a result, the connector 1 through which a high-frequency signal flows can be mounted with low reflection.
[0024]
In the present embodiment, the case where the through-hole 21 is formed in the printed circuit board 20 has been described. However, the present invention is not limited to this, and the through-hole 21 is covered with the metal plate 30 indicated by a broken line. You may. In this case, it is possible to prevent dust and moisture in the air from entering into the through-hole 21 and to improve the shielding effect.
[0025]
【The invention's effect】
In summary, according to the present invention, it is possible to realize a mounting method of a high-frequency connector and a printed circuit board on which a high-frequency connector is mounted, which can be mounted with low reflection by suppressing capacitive coupling of the connector by the substrate dielectric.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing one embodiment of a high-frequency connector mounting printed circuit board to which a high-frequency connector mounting method of the present invention is applied.
FIG. 2 is an external perspective view of a printed circuit board used for the high-frequency connector mounted printed circuit board shown in FIG.
FIG. 3 is a perspective perspective view of a high-frequency connector.
FIG. 4 is an external perspective view of a conventional printed circuit board.
FIG. 5 is a partial cross-sectional view of a high-frequency connector mounted printed circuit board in which the high-frequency connector shown in FIG. 3 is mounted on a printed circuit board by applying a conventional mounting method.
6 is an explanatory diagram showing capacitive coupling of a connector by a substrate dielectric of the printed circuit board shown in FIG. 5;
[Explanation of symbols]
1 high frequency connector (connector)
2 Connector signal wire 3 External conductor 4-5 Soldering part 6 Connector signal wire soldering part (Soldering part)
7 Resin molded part 9 Substrate dielectrics 10, 11 Connector external conductor soldering part (Soldering part)
12 Connector signal wire soldering part (Soldering part)
13 Ground plate 14, 15 Through hole plating 16 Signal line 20 Printed circuit board 21 Through hole

Claims (6)

A method for surface-mounting a high-frequency connector on a printed circuit board, the method comprising: mounting a high-frequency connector on a surface of the printed circuit board after forming a through hole at a fixed position of the high-frequency connector. The method for mounting a high-frequency connector according to claim 1, wherein a high-frequency connector for surface mounting is used as the high-frequency connector, and a double-sided printed board is used as the printed board. As the high-frequency connector, a connector signal line connected to an external connector, a cylindrical external conductor arranged around the connector signal line and connected to the external connector, and one piece is connected to the external conductor. A connector external conductor soldering portion having an L-shaped cross section extending outwardly so that the other piece is orthogonal to the center of the external conductor, and an extension of the connector signal line, wherein the connector signal line and the external conductor are connected. A coaxial connector for surface mounting composed of a connector signal wire soldering portion extending outward to be orthogonal to and a resin mold portion covering the base of each soldering portion. A signal wire connected to each soldering part is provided, a ground plate is provided on the other surface, and a through hole is formed at a fixing position of the high-frequency connector. Implementation of high-frequency connector according to claim 1 or 2 using preparative substrate. The method for mounting a high-frequency connector according to claim 3, wherein after the surface mounting of the connector, a through-hole formed in the connector connection portion of the ground plate is covered with a metal plate. A high-frequency connector mounting printed circuit board, wherein the high-frequency connector is surface-mounted on a printed circuit board, wherein a through-hole is formed in the printed board at a position where the high-frequency connector is fixed. A printed circuit board on which a high-frequency connector is surface-mounted, wherein a through hole is formed at a fixing position of the high-frequency connector.

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