JP2003168824A - Led display and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED display in which an accurate position can be defined readily for an object being irradiated. <P>SOLUTION: An LED display comprising a light emitting element 4 emitting light in the direction Y parallel with the mounting face of the LED display is further provided with protruding spacers 8 and 8 for defining the distance between the light emitting element 4 and an object being irradiated in the light emitting direction. The protruding spacers 8 and 8 come into point contact with the object being irradiated thus defining the distance between the light emitting element and the object being irradiated. In an LED display employing an integrated molding of a frame and a resin molded package as a base, the electrode face of the frame projecting to the mounting face side of the resin molded package is bent reversely to the light emitting direction. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED display provided with a light emitting element that emits light in a direction parallel to a mounting surface (emits light in a direction perpendicular to the mounting direction) and a method for manufacturing the same. It is about.

[0002]

2. Description of the Related Art A conventional LED display 101, as shown in FIGS. 17 and 18, has a frame 98, 99 called an insert frame and a resin molded package 103 integrally formed as a base, and is mounted on the frame 98. Light emitting element 1
It is equipped with 04.

A recess 100 is provided in a resin molding package 103 in which a part of each of the frames 98 and 99 is embedded, and one end of a light emitting element 104 (LED) is fixedly connected to the frame 98 exposed in the recess 100. The other end is connected to the frame 99 via the second wire 105. The recess 100 has a shape enlarged toward the front (Y direction), and reflects the light emitted from the light emitting element 104 on its wall surface and emits the light toward the front (Y direction). Here, the frame forming the recess 100 will be referred to as a reflection frame 106. In addition, the emission surface 10 as the LED display 101
3A is the front end face of the reflection frame 106.

Although the frames 98 and 99 are present at the bottom of the recess 100, they are farther from the emitting surface 103A when viewed from the LED display 101 as a whole. Accordingly, the light emitting element 104 is also positioned behind the emission surface 103A. Therefore, the path from the light emitting element 104 to the light emitting surface 103A becomes long, and the loss of light emission intensity is large.

[0005]

When the LED display 101 is in use, a light guide plate as an irradiation object is generally arranged in front of the emission surface 103A. The light guide plate serves to transmit the light emitted from the LED display 101 to a desired position. Since the light transmission efficiency changes depending on the distance from the light source, it is desirable that the distance between the light emitting element 104 and the light guide plate be accurately defined. By the way, in the conventional LED display 101, the light guide plate is provided on the emitting surface 10.
The distance between the light emitting element 104 and the light guide plate is regulated by the surface contact with 3A. Therefore, LE
If the flatness of the emission surface 103A of the D display 101 is not uniform, there is a problem that the distances cannot be adjusted accurately.

In FIG. 17 (c), reference numeral 109 denotes a mounter collet polarity display portion formed on a surface (opposing surface) 103C opposite to the mounting surface 103B of the resin molded package 103. The polarity display portion 109 has a triangular polarity display mark 110 located at a corner of the emission surface 103A as shown in FIG. 17B when viewed from the emission surface 103A side. Therefore, the polarities of the frames 98 and 99 can be confirmed by viewing the polarity display portion 109 from the surface 103C side and viewing the polarity display mark 110 from the emission surface 103A side. However, in the mounting work of the LED display 101 on the substrate or the like, it is easier to see the polarity display portion 109 in the approximate center of the surface 103C, and the polarity display mark 110 also has the surface 103.
The one on the C side looks better after work.

Electrode surface 9 forming the lower part of the frames 98, 99
8B and 99B are the mounting surface 1 of the resin molding package 103.
It is exposed at 03B and has a shape bent along the mounting surface 103B. The direction of the bend is
As shown in FIG. 17D, the direction is the same as the light emission direction Y. Therefore, the electrode surfaces 98B and 99B and the light emitting element 104
The distance between and becomes shorter. Therefore, when mounting by soldering, there is a problem that the heat source and the light emitting element 104 are close to each other, and the light emitting element 104 receives a large thermal load.

Further, conventionally, when the blue light emitted from the light emitting element 104 is converted into white light to be extracted, it is common to directly apply a phosphor for color conversion to the light emitting element 104. However, in this method, the density and unevenness of the phosphor have a great influence on the accuracy of whitening, and it is difficult to control for maintaining the characteristics. In addition, the extra phosphor is the light emitting element 1.
04 attached to the wall surface of the reflection frame 106,
Had a loss of reflection efficiency.

The present invention has been made in order to solve the above-mentioned conventional problems, and an object thereof is to provide an LED display capable of easily defining an accurate position with respect to an irradiation object. In addition, the present invention is an LE with little loss of emission intensity.
It is intended to provide a D display. It is another object of the present invention to provide an LED display device that allows the polarity of the frame to be easily confirmed from above when the LED display device is mounted. Another object of the present invention is to provide an LED display device in which a light load on the light emitting element is small when the LED display device is mounted. A further object of the present invention is to provide a method for manufacturing an LED display in which a phosphor layer for color conversion can be uniformly formed in front of a light emitting element.

[0010]

In order to solve the above-mentioned problems, according to the present invention, in an LED display provided with a light emitting element that emits light in a direction parallel to a mounting surface, the light emission is performed in the light emission direction. It is characterized in that a protrusion-shaped spacer that defines the distance between the element and the irradiation object is provided. Thereby, the distance between the light emitting element and the irradiation target can be accurately defined by abutting the irradiation target on the tip of the spacer and bringing them into contact with each other at a plurality of points.

Further, in the LED display based on the integrally molded product of the frame and the resin molded package, the electrode surface of the frame projecting to the mounting surface side of the resin molded package is opposite to the light emitting direction. It is characterized by being bent in the direction. Therefore, when the LED display is mounted by soldering on the electrode surface, the distance between the heat source and the light emitting element becomes large, and the thermal load can be suppressed.

In addition, in the LED display, which is provided with a light emitting element which emits light in a direction perpendicular to the mounting direction, and which is based on an integrally molded product of a frame on which the light emitting element is mounted and a resin molded package, The light emitting element is characterized in that the light emitting element is mounted at a position close to the light emitting surface in the depth direction from the light emitting surface of the resin molded package. As a result, the distance from the light emitting element to the light emission surface is shortened, and the loss of light emission intensity can be reduced.

Further, in an LED display based on an integrally molded product of a frame and a resin molded package, a flat portion is provided on a surface facing the mounting surface of the resin molded package,
By breaking the symmetry of the shape of the flat portion, the flat portion can be used for visual recognition of the polarities of the electrodes. Therefore, when the LED display is mounted, the polarities of the pair of electrode surfaces hidden under the mounting surface can be easily confirmed from above.

Further, a reflection frame formed with a predetermined depth from the frame to the light emitting surface side of the resin molded package on the basis of an integrally molded product of the frame and the resin molded package, and the inside of this reflection frame An LED having a light emitting element mounted on the frame, which emits light in a direction perpendicular to the mounting direction of the LED display, and a phosphor layer for color conversion formed in front of the front surface of the light emitting element. The display device is characterized in that a resin containing no phosphor is interposed between the reflection frame and the phosphor layer. According to this, the phosphor layer can be uniformly formed on the front surface side of the light emitting element.

In this case, a transparent resin in an amount larger than the capacity of the reflective frame is injected into the reflective frame, and the resin is lifted into a lens shape by surface tension and cured, and then a phosphor is applied to the surface of the cured transparent resin. By doing so, the phosphor layer can be arranged at a position higher than the depth of the reflection frame and in front of the light emitting element without any unevenness. Further, since the phosphor does not adhere to the wall surface of the reflection frame, it is possible to prevent the reflection efficiency of the reflection frame from being deteriorated. Further, since the phosphors having a constant amount, a constant range, and a constant thickness can be arranged, stable color conversion characteristics can be obtained.

Alternatively, a transparent resin containing a precipitating phosphor in an amount larger than the capacity of the reflecting frame is injected into the reflecting frame,
After being raised into a lens shape by surface tension, the base may be turned upside down to settle the precipitating phosphor in the transparent resin and cure the transparent resin.

Alternatively, a transparent resin containing a precipitating phosphor is injected onto the entire light emitting surface of the resin molded package, and the base is turned upside down while the transparent resin is being cured, so that the precipitating phosphor is removed. While settling in the transparent resin,
This transparent resin may be cured.

Alternatively, after injecting a transparent resin in an amount larger than the capacity of the reflecting frame into the reflecting frame and raising it into a lens shape by surface tension and curing it, a transparent resin further containing a precipitating phosphor is formed thereon. May be injected to settle the sedimentary phosphor in the transparent resin, and the transparent resin may be cured.

By making the depth of the reflecting frame substantially equal to the height of the light emitting element, the light emitting element and the phosphor can be brought as close as possible.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will be described. FIG. 1 is an LE according to a first embodiment of the present invention.
It is the figure which looked at the external appearance of D display from each direction, Drawing 2 is a stairs sectional view along the AA line of Drawing 1 (a), and Drawing 13 is a perspective view of the LED display. It is a figure.

The LED display 1 comprises an anode frame 2
1. The integrally formed product of the cathode frame 22 and the resin molded package 3 is used as a base. The resin molding package 3 is
It is formed into a substantially rectangular parallelepiped shape. This LED display 1
Emits light in a direction (Y direction) perpendicular to the mounting direction indicated by arrow X. The mounting surface of the bottom of the LED display 1 is mounted on a mounting surface such as a substrate and emits light in a direction (Y direction) parallel to the mounting surface.

A recess 100 is provided in a resin molding package 3 in which a part of each of the anode frame 21 and the cathode frame 22 is buried. The anode frame 21 exposed in the recess 100 has a light emitting element 4 (LED).
One end (anode) is fixedly connected, and the other end (cathode) is connected to the cathode frame 22 via the second wire 5. The recess 100 has a shape enlarged toward the front (the Y direction), and emits the light emitted from the light emitting element 4 to the front (the Y direction) while reflecting the light emitted from the wall surface. Here, the frame forming the recess 100 will be referred to as the reflection frame 6. In addition, the emission surface 3A as the LED display 1
Is the front end face of the reflection frame 6.

FIG. 14 is a perspective view of the anode frame 21 and the cathode frame 22. The anode frame 21 is a light emitting element mounting surface 21A on which the light emitting element 4 is mounted.
The electrode surface 21B formed by bending the light emitting element mounting surface 21A along the mounting surface 3B of the resin molded package 3 at a right angle, and the width defining surface 21C formed by bending the electrode surface 21B at a right angle (see FIG. 1). (See (b)). On the other hand, the cathode frame 22 has a symmetrical shape (axisymmetric) with the anode frame 21,
The surface corresponding to the light emitting element mounting surface 21A is a wire bonding surface 22A to which the second wire 5 is wire bonded.

The resin molded package 3 includes a light emitting element mounting surface 21 A of the anode frame 21 and the cathode frame 2.
The reflection frame 6 is formed at a predetermined depth d (see FIG. 2) from the surface of the second wire bond surface 22A to the light emission surface 3A side. The depth of this reflection frame 6 (hence the recess 100
Depth d) is selected to be approximately equal to the height h of the light emitting element 4.

When the thickness limitation is loose, the depth d of the reflecting frame 6 is selected to be larger than the height h of the light emitting element 4. When the thickness limitation is severe, the depth d of the reflection frame 6 is selected to be smaller than the height h of the light emitting element 4.

Further, the reflection frame 6 is formed by the resin molding package 3
The recess 100 is divided into two parts by a partition wall 7 integrally formed with. Here, the partition wall 7 is not parallel to the side surface of the light emitting element 4 and is divided into two recesses 100.
Has an inclination so that it expands forward. Therefore, the light emitted from the light emitting element 4 is also reflected by the partition wall 7. Moreover, since the reflecting surface by the partition wall 7 is formed at a position relatively close to the light emitting element 4, the reflection efficiency is improved as compared with the case where the partition wall 7 is not provided.

The bending directions of the electrode surfaces 21B and 22B of the anode frame 21 and the cathode frame 22 are opposite to the light emission direction Y. Therefore, when mounting the LED display 1, the electrode surfaces 21B, 2
Even when soldering to 2B, since the distance between the heat source and the light emitting element 4 is long, the thermal load applied to the light emitting element 4 can be suppressed.

Although the anode frame 21 and the cathode frame 22 are present at the bottom of the recess 100, the LED display 1
Seen from the whole, it is in a position close to the emission surface 3A. Along with this, the light emitting element 104 is also positioned in front of the emission surface 103A. As a result, the path from the light emitting element 4 to the light emission surface 3A is shortened. Therefore, the loss of light emission intensity can be reduced.

A pair of semicircular spacers 8 that define the distance between the light emitting element 4 and the light guide plate (not shown) are provided at both ends of the light emitting surface 3A of the resin molded package 3. Each spacer 8 comes into point contact with the light guide plate provided in front of it, and is less affected by dimensional errors and variations during resin molding as compared with the case where surface contact between the light guide plate and the emission surface 3A is used. can do. Therefore, the distance from the light emitting element 4 to the light guide plate can be accurately defined, and the light transmission efficiency of the light guide plate can be increased. In addition, the exit surface 3
Although a lens-shaped transparent resin layer may be formed on the A side, the spacer 8 also serves to protect this transparent resin layer.

The mounting surface 3B of the resin molding package 3
A rectangular flat portion 9 for a collet (element suction nozzle portion of the assembling device) is provided in the substantially center of the surface 3C facing the. The shape of the flat portion 9 is asymmetric, and the side on the anode frame 21 side is the oblique side 10. Therefore,
When the LED display 1 is mounted, the polarity of the electrode surface 21B of the anode frame 21 or the electrode surface 22B of the cathode frame 22 hidden under the mounting surface 3B can be easily visually confirmed from above or by an image recognition device.

Next, a second embodiment of the present invention will be described. FIG. 3 shows an LED according to the second embodiment of the present invention.
It is the figure which looked at the external appearance of a display from the front (b) and the side (a). FIG. 4 is a stepwise sectional view taken along the line BB of FIG. 3A, and FIG. 15 shows a method of forming a phosphor layer for color conversion on the LED display according to the present embodiment. It is a schematic diagram for explaining. In these drawings, the same members as those of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 15 (a), a transparent resin (a resin not containing a phosphor) 12 which is larger than the capacity of the reflecting frame 6 is injected into the reflecting frame 6 (hence, in the recess 100), The surface tension builds up into a lens shape and cures. After that, as shown in FIG. 15B, by applying the phosphor 11 to the surface of the cured transparent resin 12, unevenness is provided at a position higher than the depth d of the reflection frame 6 and in front of the light emitting element 4. Instead, a layer of phosphor 11 can be arranged. That is, the resin containing no phosphor is interposed between the layer of the phosphor 11 and the reflection frame 6.

Therefore, the phosphor 11 is directly connected to the light emitting element 4
As compared with the conventional method of applying the same to the above, the influence of the density and unevenness of the phosphor 11 on the accuracy of the color conversion characteristic can be reduced, and the control for maintaining the characteristic becomes easier. In addition, the extra phosphor 11
Does not adhere to the wall surface of the reflection frame 6 near the light emitting element 4, so that the reflection efficiency of the reflection frame 6 can be improved. Further, since the depth d of the reflection frame is set to be substantially equal to the height h of the light emitting element 4, the light emitting element 4 and the phosphor 11 are brought close to each other, and the LED display 1 having good color conversion efficiency can be realized.

Here, the light-emitting element 4 uses a light source that emits blue light, and the phosphor 11 uses a light-emitting element 4 that converts the light of the light-emitting element 4 into a yellowish light. However, the emission color of the light emitting element 4 and the light emitted by the phosphor 11 may be other combinations. This also applies to the following embodiments.

Next, a third embodiment of the present invention will be described. FIG. 5 shows an LED according to the third embodiment of the present invention.
It is the figure which looked at the external appearance of a display from the front (b) and the side (a). FIG. 6 is a staircase cross-sectional view taken along the line D-D of FIG. 5A, and FIG. 16 illustrates a method of forming a phosphor layer for color conversion on the LED display according to the present embodiment. It is a schematic diagram for explaining. In these drawings, the same members as those of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 16A, the transparent resin 12 containing the precipitating phosphor 11 in an amount larger than the capacity of the reflecting frame 6 is injected into the reflecting frame 6 and is raised into a lens shape by surface tension. The phosphor 11 has a specific gravity of the transparent resin 1 before curing.
By setting the specific gravity to be larger than 2, a precipitating resin that sinks downward due to its own weight in the resin 12 before curing is used.

Thereafter, as shown in FIG. 16 (b), the base is turned upside down, and the settling phosphor 11 is settled in the transparent resin 12 by its own weight, and the transparent resin 12 is cured. The phosphor 11 is partially formed on the surface side of 12. By doing so, the layer of the phosphor 11 can be positioned at a position higher than the depth d of the reflection frame 6 and in front of the light emitting element 4 without unevenness.

FIG. 7 and FIG. 8 are modified examples of this embodiment and show an example in which a layer of the phosphor 11 is formed in a narrow area in front of the light emitting element 4. In order to form the layer of the phosphor 11 in such a narrow range, the settling phosphor 11 is included only in the portion where the light emitting element 4 is housed in the two recesses 100 partitioned by the partition wall 7. The transparent resin 12 may be injected. According to this, the usage amount of the phosphor 11 and the transparent resin 12 is reduced, so that the cost can be reduced.

Next, a fourth embodiment of the present invention will be described. FIG. 9 shows an LED according to the fourth embodiment of the present invention.
It is the figure which looked at the external appearance of a display from the front (b) and the side (a). FIG. 10 is a step sectional view taken along the line EE of FIG. In these drawings, the same members as those of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

The transparent resin 12 containing the precipitating phosphor 11 is injected into the entire light emitting surface 3A including the reflecting frame 6, and the base is turned upside down while the transparent resin 12 is being cured, so that the precipitating phosphor 1 is formed.
1 is settled in the transparent resin 12 and the transparent resin 12 is further hardened, so that the layer of the phosphor 11 is evenly arranged at a position higher than the depth d of the reflection frame 6 and in front of the light emitting element 4. Can be placed. In this case, a wide range of layers of the phosphor 11 can be formed inside the surface of the transparent resin 12.

In the third embodiment, after the transparent resin 12 is applied, the base is immediately turned upside down and cured.
In the fourth embodiment, after the transparent resin 12 is applied, the base is turned upside down after a while (after being cured to some extent), so that as shown in FIG. A layer is formed.

Next, a fifth embodiment of the present invention will be described. FIG. 11 is an LE according to the fifth embodiment of the present invention.
It is the figure which looked at the external appearance of a D indicator from the front (b) and side (a). FIG. 12 is a staircase cross-sectional view taken along the line FF of FIG. In these drawings, the same members as those of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

A transparent resin 12 in an amount larger than the capacity of the reflective frame 6 is injected into the reflective frame 6, and the surface is tension-set into a lens shape by surface tension to be cured. Then, the light emitting surface 3 including the reflective frame 6 is included.
By injecting the transparent resin 12 containing the sinking phosphor 11 into the entire A, allowing the sinking phosphor 11 to settle in the transparent resin 12, and hardening the transparent resin 12, the depth d of the reflection frame 6 is set. It is possible to arrange the layer of the phosphor 11 at a higher position and evenly in front of the light emitting element 4. In this fifth embodiment, the base is not turned upside down.

In the above-mentioned embodiment, it is desirable that the front end of the resin 12 is located behind the front end of the spacer 8. However, depending on the shape of the object such as the light guide plate, the front end of the resin 12 is equal to the front end of the spacer 8. It may be located at a position or in front of the front end of the spacer 8.

The above LED display 1 is arranged so that the mounting surface 3B of the resin molded package 3 faces the circuit board (mounting surface), and the electrode surfaces 21B and 22B correspond to each other via a conductive material such as solder. Is fixed to the terminal portion of the circuit board to be electrically connected. Then, the LED display can be used as a light source of a backlight device by bringing the spacers 8 into contact with an object, for example, a light incident surface such as a light guide plate.

The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the invention.

[0047]

As described above, according to the LED display of the present invention, the irradiation object is abutted against the tip of the protrusion-shaped spacer, and both are brought into contact with each other at a plurality of points, so that the light emitting element and the irradiation object are irradiated. The distance to and can be specified accurately.

According to the LED display of the present invention, since the electrode surface of the frame is bent in the direction opposite to the light emission direction, when mounting the LED display by soldering to the electrode surface, a heat source is used. The distance between the light emitting element and the light emitting element is increased, and the thermal load can be suppressed.

Further, according to the LED display of the present invention, since the light emitting element is mounted at a position relatively close to the light emitting surface,
The distance from the light emitting element to the light emission surface is shortened, and the loss of light emission intensity can be reduced.

Further, in the LED display of the present invention, a flat portion is provided on the surface facing the mounting surface of the resin molded package, and the flat portion is broken to avoid the symmetry of the shape of the flat portion. I am trying to use it for visual recognition. Therefore, when the LED display is mounted, the polarities of the pair of electrode surfaces hidden under the mounting surface can be easily confirmed from above.

Further, in the LED display of the present invention, a transparent material containing no phosphor is provided between the reflection frame and the phosphor layer for color conversion, or between the front surface of the light emitting element and the phosphor layer for color conversion. Since the structure in which the resin is interposed is adopted, the phosphor layer can be uniformly formed on the front surface side of the light emitting element.

In this case, a transparent resin in an amount larger than the capacity of the reflection frame is injected into the reflection frame provided as a recess in the resin package, and the resin is raised to a lens shape by surface tension and cured, and then the cured. By applying a phosphor on the surface of the transparent resin, at a position higher than the depth of the reflection frame,
In addition, the phosphor layer can be arranged evenly in front of the light emitting element. Further, since the phosphor does not adhere to the wall surface of the reflection frame, it is possible to prevent the reflection efficiency of the reflection frame from being deteriorated. Further, since the phosphors having a constant amount, a constant range, and a constant thickness can be arranged, stable color conversion characteristics can be obtained.

Alternatively, a transparent resin containing a precipitating phosphor in an amount larger than the capacity of the reflecting frame is injected into the reflecting frame,
After swelling into a lens shape by surface tension, the base is turned upside down, and the precipitating phosphor is allowed to settle in the transparent resin, and by curing the transparent resin,
The phosphor layer can be arranged at a position higher than the depth of the reflection frame and in front of the light emitting element without any unevenness.

Alternatively, a transparent resin containing a settling phosphor is injected over the entire light emitting surface of the resin molded package,
The base is turned upside down while the transparent resin is being cured, and the precipitating phosphor is allowed to settle in the transparent resin, and by curing the transparent resin, at a position higher than the depth of the reflection frame, and The phosphor layer can be arranged evenly in front of the light emitting element.

Alternatively, a transparent resin in an amount larger than the capacity of the reflecting frame is injected into the reflecting frame, and the lens is formed into a lens shape by surface tension and cured, and then a transparent resin containing a precipitating phosphor is further formed thereon. Is injected, and the sedimentable phosphor is allowed to settle in the transparent resin, and by curing the transparent resin, fluorescence is evenly provided at a position higher than the depth of the reflection frame and ahead of the light emitting element. Body layers can be placed.

By making the depth of the reflection frame substantially equal to the height of the light emitting element, the light emitting element and the phosphor are brought as close as possible, so that the color conversion efficiency of the emission color is improved.

[Brief description of drawings]

FIG. 1 is a diagram showing an appearance of an LED display device according to a first embodiment of the present invention as seen from a front surface (b), a side surface (a), an upper surface (c), a lower surface (d) and a rear surface (e). .

FIG. 2 is a step sectional view taken along the line AA of FIG.

FIG. 3 is a diagram showing an appearance of an LED display device according to a second embodiment of the present invention as viewed from the front (b) and side (a).

FIG. 4 is a staircase cross-sectional view taken along the line BB of FIG.

FIG. 5 is a diagram showing the appearance of an LED display device according to a third embodiment of the present invention as seen from the front (b) and side (a).

FIG. 6 is a step sectional view taken along the line D-D of FIG.

FIG. 7 is an LED of another example of the third embodiment of the present invention.
It is the figure which looked at the external appearance of a display from the front (b) and the side (a).

FIG. 8 is a step sectional view taken along the line CC of FIG. 7 (a).

FIG. 9 is a diagram showing the appearance of an LED display device according to a fourth embodiment of the present invention as seen from the front (b) and side (a).

FIG. 10 is a step sectional view taken along line EE of FIG. 9 (a).

FIG. 11 is a diagram showing the appearance of an LED display device according to a fifth embodiment of the present invention as seen from the front (b) and side (a).

FIG. 12 is a staircase cross-sectional view taken along the line FF of FIG.

FIG. 13 is a perspective view of an LED display according to the present invention.

FIG. 14 is a perspective view of a frame of the LED display.

FIG. 15 is a schematic diagram for explaining an example of a method of forming a phosphor layer for white conversion on the LED display according to the present invention.

FIG. 16 is a schematic view for explaining another example of the method of forming a phosphor layer for white conversion on the LED display according to the present invention.

FIG. 17 is a diagram showing the appearance of a conventional general LED display from the front (b), side (a), top (c) and bottom (d).

FIG. 18 is a staircase cross-sectional view taken along the line ZZ of FIG.

[Explanation of symbols]

1 LED display 3 resin molding package 4 light emitting elements 5 second wire 6 reflection frame 7 partition walls 8 spacers 9 Flat part 10 hypotenuse 11 phosphor 12 Transparent resin 21 Anode frame 22 Cathode frame

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takafumi Watanabe             3-201 Minamiyoshikata, Tottori City, Tottori Prefecture Tottori             Sanyo Electric Co., Ltd. F-term (reference) 5F041 DA12 DA17 DA26 DA46 DA57                       DA58 DA81

Claims (11)

[Claims] 1. An LED display equipped with a light emitting element that emits light in a direction parallel to a mounting surface of the LED display, wherein a distance between the light emitting element and an irradiation object is defined in a light emitting direction. An LED display comprising a protrusion-shaped spacer. 2. The projection-shaped spacer makes point contact with the irradiation target object to define a distance between the light emitting element and the irradiation target object. LED display. 3. In an LED display based on an integrally molded product of a frame and a resin molded package, an electrode surface of the frame protruding toward a mounting surface side of the resin molded package is opposite to a light emitting direction. An LED display characterized by being bent in any direction. 4. An LED display comprising a light emitting element that emits light in a direction parallel to a mounting surface of an LED display, and a frame on which the light emitting element is mounted and an integrally molded product of a resin molded package as a base. In the container, the LED display is characterized in that the light emitting element is mounted at a position close to the light emitting surface in the depth direction from the light emitting surface of the resin molded package. 5. An LED display using an integrally molded product of a frame and a resin molded package as a base, wherein a flat portion is provided on a surface facing the mounting surface of the resin molded package, and the shape of the flat portion is symmetrical. An LED display characterized in that the flat portion can be utilized for visual recognition of the polarities of the electrodes by breaking the flat portion. 6. A reflection frame formed at a predetermined depth from above the frame to the light emission surface side of the resin molded package, which is based on an integrally molded product of the frame and the resin molded package, and inside the reflection frame. L mounted on the frame of
In the LED display having a light emitting element that emits light in a direction parallel to the mounting surface of the ED display and a phosphor layer formed in front of the front surface of the light emitting element, the reflection frame and the phosphor are provided. An LED display in which a resin not containing a phosphor is interposed between the layer and the layer. 7. A resin not containing the phosphor is interposed between the front surface of the light emitting element and the phosphor layer, and the depth of the reflection frame is substantially equal to the height of the light emitting element. The LED display device according to claim 6, wherein the light emitting device has a height equal to or less than the height of the light emitting device. 8. A reflection frame formed at a predetermined depth from above the frame to the light emission surface side of the resin molding package, which is based on an integrally molded product of the frame and the resin molding package, and inside the reflection frame. L mounted on the frame of
In the method for manufacturing an LED display having a light emitting element that emits light in a direction parallel to the mounting surface of the ED display and a phosphor layer formed in front of the front surface of the light emitting element, A transparent resin in an amount larger than the capacity of the reflection frame is injected into the lens, and the resin is piled up and cured by a surface tension into a lens shape, and then a phosphor is applied to the surface of the cured transparent resin. Production method. 9. A reflecting frame formed at a predetermined depth from above the frame to the light emitting surface side of the resin molded package based on an integrally molded product of the frame and the resin molded package, and the inside of this reflecting frame. L mounted on the frame of
In the method for manufacturing an LED display having a light emitting element that emits light in a direction parallel to the mounting surface of the ED display and a phosphor layer formed in front of the front surface of the light emitting element, Injecting a transparent resin containing a settling phosphor in an amount larger than the capacity of the reflecting frame into the lens shape by surface tension and then inverting the base upside down to set the settling phosphor in the transparent resin. A method for manufacturing an LED display device, which comprises allowing the transparent resin to settle and curing the transparent resin. 10. A reflection frame formed with a predetermined depth from the frame to the light emission surface side of the resin molded package, which is based on an integrally molded product of the frame and the resin molded package, and the inside of the reflection frame. Of an LED display mounted on the frame and emitting light in a direction parallel to a mounting surface of the LED display, and a phosphor layer formed in front of the front surface of the light emitting element. In the method, a transparent resin containing a precipitating phosphor is injected onto the entire light emitting surface of the resin molded package, the base is turned upside down while the transparent resin is being cured, and the precipitating phosphor is transparent. A method for manufacturing an LED display, which comprises setting the resin in a resin and curing the transparent resin. 11. A reflection frame formed at a predetermined depth from above the frame to the light emission surface side of the resin molded package, which is based on an integrally molded product of the frame and the resin molded package, and inside the reflection frame. Of an LED display mounted on the frame and emitting light in a direction parallel to a mounting surface of the LED display, and a phosphor layer formed in front of the front surface of the light emitting element. In the method, a transparent resin in an amount larger than the capacity of the reflective frame is injected into the reflective frame, and the resin is piled up into a lens shape by surface tension and cured, and then a transparent resin containing a precipitating phosphor is injected onto the transparent resin. Then, the method of manufacturing an LED display device, characterized in that the transparent phosphor is set in the transparent resin and the transparent resin is cured.