JP2003142628A - Wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board where deformation due to heat is hard to occur in an IC loading board after an IC chip is loaded on the surface of the board in the wiring board where electronic parts are stored in the board. SOLUTION: The wiring board 10 is provided with a board surface 102 having a loading region 105 where the IC chip IC 1 is a loaded, and a board backside 103. The board 10 also has a ceramic core board 111 which is formed of ceramic, and has a through hole 115 just below the loading region 105. Electronic parts 121 are stored in the through hole 115, and the hole is filled with a filling material 129. A resin insulating layer 141 is formed on the surface 112 of a core, and an IC connection terminal 107 is formed in the loading region 105.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board on which an IC chip is mounted, and more particularly to a wiring board in which electronic components are housed inside the board.

[0002]

2. Description of the Related Art Conventionally, a wiring board on which an IC chip is mounted is known in which electronic parts are housed inside the board. For example, a wiring board 9 schematically shown in FIG.
01 can be mentioned. This wiring board 901 is
It is a substantially plate shape having a substrate front surface 902 having a mounting area 905 for mounting a C chip IC and a substrate back surface 903 connected to another substrate such as a mother board. Substrate surface 90
In the mounting region 905 of No. 2, solder bumps (IC connection terminals) 907 connected to the terminals of the IC chip IC are formed. On the other hand, on the back surface 903 of the substrate, connection pads (back surface connection) connected to terminals of another board. Terminal) 909 is formed.

Looking inside the wiring board 901, the wiring board 901 is provided with a resin core board 911 at the center thereof. A plurality of resin insulation layers 912, 913, 914, 915 are laminated on both surfaces of the core substrate 911. Of these, a large through hole 921 is formed in the core substrate 911 immediately below the mounting region 905.
A plurality of chip capacitors (electronic components) 923 are accommodated in the through hole 921, and a gap between the through hole 921 and the chip capacitor 923 is filled with a resin filler 925.
Buried by. In this way the chip capacitor 9
By housing 23 inside the substrate, the IC chip IC and the chip capacitor 923 can be connected with low resistance and low inductance. In addition, noise that enters between the IC chip IC and the chip capacitor 923 can be suppressed to an extremely small level.

Wiring layers (not shown) are formed on the core front surface 917 and the core back surface 918 of the core substrate 911, respectively. Furthermore, inside the core substrate 911, through-hole conductors (not shown) that connect the wiring layers formed on the core front surface 917 and the core back surface 918 are formed. Between the resin insulation layers 912, 913, 914, 915 laminated on both surfaces of the core substrate 911,
Wiring layers (not shown) are formed respectively. In addition, the resin insulation layers 912, 913, 914, 915 include
Via conductors (not shown) and the like are also formed.

[0005]

However, an IC mounting board in which an IC chip IC is mounted on such a wiring board 901 is apt to be deformed by warping or the like because of heat.
The chip IC is easily cracked. In particular, the core substrate 9
Mounting area 205 for mounting IC chip IC out of 11
If a large through-hole 921 that accommodates the electronic component 923 is formed in a portion immediately below, the IC mounting board is likely to be deformed and the IC chip IC is easily cracked. In addition, this tendency is due to the through hole 92 that houses the electronic component 923.
The larger 1 is, the more prominent the tendency is. Such a problem occurs because the difference between the coefficient of thermal expansion of the IC chip IC (for example, coefficient of thermal expansion 4) and the coefficient of thermal expansion of the resin core substrate 911 (for example, coefficient of thermal expansion 20) is large. Is considered to be.

The present invention has been made in view of the above circumstances, and in a wiring board in which electronic components are housed inside the board, after mounting an IC chip on the surface of the board,
An object of the present invention is to provide a wiring board in which the mounting board is less likely to be deformed by heat.

[0007]

[Means for Solving the Problems, Actions and Effects] A means for solving the problem is a wiring board having a substrate front surface having a mounting area for mounting an IC chip and a substrate back surface, which is made of ceramic and has a core surface and a core. A ceramic core substrate having a back surface, the ceramic core substrate having a through hole formed directly below the mounting region and penetrating between the core front surface and the core back surface, and an electron housed in the through hole. A component, a filling material that fills a gap between the through hole and the electronic component, a resin insulating layer that is formed on the core surface and forms the surface of the substrate, and a mounting area on the surface of the substrate. A plurality of IC connection terminals connected to the terminals,
It is a wiring board provided with.

As described above, when the core substrate is made of resin, the difference in the coefficient of thermal expansion between the core substrate and the IC chip becomes large, so that the IC mounted substrate on which the IC chip is mounted is warped due to thermal stress. Deformation is likely to occur. In particular, if the core substrate has a large through hole for accommodating an electronic component, this deformation becomes large and the IC chip may be cracked, resulting in poor reliability. On the other hand, in the present invention, since the core substrate is made of ceramic, it is possible to reduce the difference in the coefficient of thermal expansion between the ceramic core substrate and the IC chip, and even if the IC chip is mounted, the IC mounting substrate is affected by heat. Deformation such as warpage is less likely to occur. Further, although the ceramic core substrate has a large through hole in the portion directly below the mounting area, the deformation such as warpage due to heat is small and the reliability is high. The electronic components housed inside the substrate may be passive components or active components, and examples thereof include a chip capacitor and a power supply module.

Another solution is a wiring board having a substrate front surface having a mounting area for mounting an IC chip and a substrate back surface, which is made of ceramic and has a core front surface and a core back surface. The ceramic core substrate having a recess formed directly below the mounting region and opening on the core front surface or the core back surface, an electronic component housed in the recess, and the recess and the electronic component A filler for filling the gap, a resin insulating layer formed on the surface of the core and forming the surface of the substrate, and a plurality of IC connection terminals formed in a mounting region on the surface of the substrate and connected to terminals of the IC chip. And a wiring board including.

When the core substrate is made of resin, the core substrate and the I
Since the difference in the coefficient of thermal expansion from that of the C chip is large, the IC mounting substrate is likely to be deformed such as warped due to thermal stress. In particular, if the core substrate has a large recess for accommodating an electronic component, this deformation becomes large, and the IC chip may be cracked, resulting in poor reliability. On the other hand, in the present invention, since the core substrate is made of ceramic, it is possible to reduce the difference in the coefficient of thermal expansion between the ceramic core substrate and the IC chip, and even if the IC chip is mounted, the IC mounting substrate is affected by heat. Deformation such as warpage is less likely to occur. further,
Although the ceramic core substrate has a large recess immediately below the mounting area, it is highly reliable because of little deformation such as warpage due to heat.

Further, in the wiring board according to any one of the above, the ceramic core substrate is made of low temperature fired ceramic, and a conductor formed on the core front surface, the core back surface or the inside of the ceramic core substrate. Is
A wiring board containing Au, Ag, or Cu as a main component is preferable.

For example, when a conductor is formed on a ceramic core substrate made of alumina, Mo or W is generally used. However, these metals have problems such as high resistance and high transmission loss due to high dielectric constant. On the other hand, as in the present invention, the ceramic core substrate is made of low temperature fired ceramic, more specifically, 110
If it consists of a ceramic that is fired at 0 ° C or below,
The conductor (eg, wiring layer, through-hole conductor, via conductor, etc.) formed on the core substrate can be made of Au, Ag, or Cu as a main component. Therefore, while the core substrate is made of ceramic, the conductivity and the like can be improved to the same extent as in the case of the resin-made core substrate.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION (Embodiment 1) Hereinafter, embodiments of the present invention will be described with reference to the drawings. Embodiment 1
A cross-sectional view of the wiring board 101 is shown in FIG. The wiring board 101 has a substantially plate shape of 30 mm × 30 mm × 1 mm, and has a board front surface 102 having a mounting area 105 on which the IC chip IC1 is mounted, and a board back surface 103 connected to a mother board (another board). . The mounting area 105 of the IC chip IC1 is a rectangular area of 10 mm × 10 mm. In this mounting area 105, a flip chip type I
Solder bumps (IC
A large number of connection terminals) 107 are formed. On the other hand, on the back surface 103 of the substrate, a large number of connection pads (back surface connection terminals) 109 connected to the terminals of the motherboard are formed.

Looking inside the wiring board 101, the wiring board 101 has a thickness 80 made of ceramic in the center thereof.
A 0 μm multilayer ceramic core substrate 111 is provided. Specifically, this ceramic is a low temperature fired ceramic fired at 1100 ° C. or lower, and more specifically, the fired ceramic is composed of wollastonite (crystal) and borate glass. Then, on the core front surface 112 of the ceramic core substrate 111, the front surface side resin insulating layer 141 having an epoxy resin as a main component is laminated, while the core rear surface 11
A backside resin insulating layer 143, which also contains an epoxy resin as a main component, is laminated on the surface 3.

Of these, the ceramic core substrate 111 is
10 mm directly below the mounting area 105 of the IC chip IC1
A large through hole 115 having a rectangular shape in a plan view of 10 mm is formed. A plurality of chip capacitors (electronic components) 121 are housed in the through hole 115.
These chip capacitors 121 have terminals 123 and 125 on their front and back surfaces, respectively. The terminals 123 and 125 are exposed on the core front surface 112 and the core back surface 113, respectively. The gap between the through hole 115 and the chip capacitor 121 is filled with a filler 129 containing epoxy resin as a main component, and the ceramic core substrate 111 and the chip capacitor 121 are fixed to each other.
It is integrated.

Further, on the core front surface 112 and the core back surface 11
3 has wiring layers 131 and 133 having wirings and pads.
Are formed respectively. In addition, a large number of through-hole conductors 135 that connect these wiring layers 131 and 133 to each other are formed inside the ceramic core substrate 111. The wiring layers 131 and 133 and the through-hole conductor 135 utilize the fact that the ceramic core substrate 111 is made of low-temperature fired ceramic, and all have Cu as a main component. Therefore, there is an advantage that the conductivity is higher than that of Mo or W that is often used when forming a conductor on ceramics.

A large number of openings 142 are formed at predetermined positions in the surface side resin insulation layer 141. Then, the above-mentioned solder bumps 107 that are connected to the wiring layer 131 or the terminals 123 on the front surface side of the chip capacitor 121 are formed in these openings 142, respectively. In addition, a large number of openings 14 are also formed at predetermined positions in the back side resin insulation layer 143.
4 are formed. Then, in the openings 144, the above-described connection pads 109 included in the wiring layer 133,
Alternatively, the terminal 12 on the back side of the chip capacitor 121
Part 5 is exposed as the connection pad 109.

In such a wiring board 101, the solder bumps (IC connection terminals) 107 and the connection pads (rear surface connection terminals) 109 are electrically connected to each other, so that a power supply potential and a ground potential are supplied from the mother board to the IC chip IC1. You can Moreover, a signal can be transmitted between the two. Furthermore, since the chip capacitor 121 is housed in the wiring board 101, the IC chip IC1 and the chip capacitor 121 are connected with low resistance and low inductance. Further, noise that enters between the IC chip IC1 and the chip capacitor 121 can be suppressed to an extremely small level.

As described above, this wiring board 10
In No. 1, since the core substrate is the ceramic core substrate 111, the ceramic core substrate 111 (coefficient of thermal expansion 5.3) and I
The difference in the coefficient of thermal expansion of the C chip IC1 (coefficient of thermal expansion 4) can be reduced, and even if the IC chip IC1 is mounted, deformation such as warpage due to heat does not easily occur in the IC mounting substrate. further,
Although the ceramic core substrate 111 has a large through hole 115 for accommodating the chip capacitor 121 in a portion immediately below the mounting region 105, it is highly resistant to deformation due to heat and has high reliability. Furthermore, in the first embodiment, since the ceramic core substrate 111 is made of low-temperature fired ceramic, this is used to make use of the ceramic core substrate 111.
The main component of the conductors (wiring layers 131 and 133 and the through-hole conductor 135) formed in the above is Cu. Therefore, while the core substrate is made of ceramic, the conductivity and the like can be improved to the same extent as in the case of the resin-made core substrate.

Next, a method of manufacturing the wiring board 101 will be described. First, the ceramic core substrate 111 is formed. That is, a plurality of ceramic green sheets corresponding to the ceramic core substrate 111 are prepared, and holes corresponding to the through holes 115 and holes for forming the through-hole conductor 135 are punched in each ceramic green sheet by punching. . Then, the respective ceramic green sheets are aligned and laminated. Then, a Cu paste is applied to this laminated body to fill and form unfired through-hole conductors 135 in the holes for through-hole conductors, and unfired wiring layers 131 and 133 are formed on the front and back surfaces of the laminated body.
To print. Next, this laminated body is fired at a low temperature to obtain a ceramic core substrate 111.

Next, the chip capacitors 121 are aligned and arranged in the through holes 115 of the ceramic core substrate 111. Then, an insulating resin paste containing an epoxy resin as a main component is filled in the gap between the through hole 115 and the chip capacitor 121 and cured. As a result, the ceramic core substrate 111 and the chip capacitor 121 are fixed and integrated with each other via the filler 129. next,
A front surface side resin insulation layer 141 having an opening 142 and a back surface side resin insulation layer 143 having an opening 144 are formed on the core front surface 112 and the core back surface 113 by a known method. Next, solder paste is printed in each opening 142 of the front-side resin insulation layer 141, and then the solder paste is melted to form solder bumps 107. With the above, the wiring board 101 is completed.

(Second Embodiment) Next, a second embodiment will be described with reference to FIG. The description of the same parts as those in the first embodiment will be omitted or simplified.
A cross-sectional view of the wiring board 201 according to the second exemplary embodiment is shown in FIG.
This wiring board 201 is 30 mm × 30 mm × 0.9 m
It has a substantially plate shape of m, and has a substrate front surface 202 having a mounting region 205 on which the IC chip IC2 is mounted, and a substrate rear surface 203 connected to a mother board. Mounting area 205
Is a rectangular area of 10 mm × 10 mm. In this mounting area 205, a flip chip type IC chip IC2
Solder bump (IC connection terminal) 20 connected to the terminal of
Many 7 are formed. On the other hand, on the back surface 203 of the substrate,
A large number of connection pads (back surface connection terminals) 209 connected to the terminals of the motherboard are formed.

Looking inside the wiring board 201, the wiring board 201 is made of the same ceramic as in the first embodiment, and has a multilayer ceramic core substrate 21 of 800 μm in thickness.
1 is provided. Then, on the core surface 212 of the ceramic core substrate 211, two surface-side resin insulating layers 241 and 2 are formed.
42 are stacked. On the other hand, on the core back surface 213,
The resin insulation layer is not formed. Therefore, the core back surface 21
3 is also the back surface 203 of the substrate.

Of these, the ceramic core substrate 211 is
Immediately below the mounting area 205 of the IC chip IC2, a large recess 215 of 10 mm × 10 mm × 0.6 mm that opens to the core surface 212 is formed. And this recess 2
A plurality of chip capacitors (electronic parts) 221
Is housed. These chip capacitors 221
Has terminals 223 and 225 on its front and back surfaces, respectively. Of the terminals 223 and 225, the surface-side terminal 223 is exposed on the core surface 212.
On the other hand, the terminal 225 on the back surface side is connected to the capacitor pad 217 formed on the bottom surface of the recess 215. The gap between the recess 215 and the chip capacitor 221 is filled with the same filling material 229 as in the first embodiment.

A wiring layer 231 having wirings and pads is formed on the core surface 212. On the other hand, the aforementioned connection pads 209 are formed on the core back surface 212 (substrate back surface 203). Further, inside the ceramic core substrate 211, a through-hole conductor 235 that connects the wiring layer 231 on the core surface 212 and the connection pad 209, or connects the capacitor pad 217 and the connection pad 209 on the bottom surface of the recess 215. Are formed in large numbers. These wiring layer 231, capacitor pad 217,
Since both the connection pad 209 and the through-hole conductor 235 have Cu as a main component, they have advantages such as high conductivity.

A wiring layer 243 having wirings and pads is formed between the two front surface side resin insulating layers 241 and 242. Further, it penetrates through the front surface side resin insulation layer 241 on the substrate back surface 203 side, while the front surface side resin insulation layer 2 is formed.
The via conductor 24 connected to the wiring layer 243 between the layers 41 and 242 and connected to the wiring layer 231 on the core surface 212 or the terminal 223 on the surface side of the chip capacitor 221 on the other hand.
A large number of 5 are formed at predetermined positions. Further, a large number of openings 247 are formed at predetermined positions in the surface side resin insulating layer 242 on the substrate surface 202 side. Then, in the openings 247, the solder bumps 207 described above that are connected to the wiring layer 243 between the surface-side resin insulating layers 241 and 242 are connected.
Are formed.

In such a wiring board 201, since the core board is the ceramic core board 211, the difference in the coefficient of thermal expansion between the ceramic core board 211 (coefficient of thermal expansion 5.3) and the IC chip IC2 (coefficient of thermal expansion 4). Can be reduced to I
Even if the C chip IC2 is mounted, the IC mounting substrate is less likely to be deformed by heat. Further, despite the large recess 215 for accommodating the chip capacitor 221, which is formed immediately below the mounting region 205 in the ceramic core substrate 211, the deformation due to heat is small and the reliability is high. Furthermore, in the second embodiment, since the ceramic core substrate 211 is made of low temperature fired ceramic, conductors (wiring layer 231, capacitor pads 217, connection pads 209, through hole conductors 23 formed on the ceramic core substrate 211 are formed.
The main component of 5) is Cu. Therefore, while the core substrate is made of ceramic, the conductivity and the like can be improved to the same extent as in the case of the resin-made core substrate.

Next, a method of manufacturing the wiring board 201 will be described. First, the ceramic core substrate 211 is formed. That is, a plurality of ceramic green sheets corresponding to the ceramic core substrate 211 are prepared, and holes corresponding to the recesses 215 and holes for forming the through-hole conductor 235 are punched. Then, the respective ceramic green sheets are aligned and laminated. afterwards,
Cu paste is applied to this laminated body to fill the holes for the through-hole conductors 235 with the unfired through-hole conductors 235, and the unfired wiring layers 231 and the connection pads 209 are formed on the front and back surfaces of the laminated body. Print and form. Further, an unfired capacitor pad 217 is formed by printing on the bottom surface of the recess of the laminated body. Next, this laminated body is fired at a low temperature to obtain a ceramic core substrate 211.

Next, the concave portion 2 of the ceramic core substrate 211
The chip capacitor 221 is housed in the connector 15, and the terminal 225 on the back surface side of the chip capacitor and the capacitor pad 217 on the bottom surface of the recess 215 are fixed by soldering. After that, a resin paste is filled in the gap between the recess 215 and the chip capacitor 221, and is cured. Next, the core surface 21
The surface-side resin insulation layer 241 is formed on the surface 2 by a known method. After that, the via conductor 245 and the wiring layer 243 are formed on the front surface side insulating layer 241 by a known method. Next, on the surface-side resin insulation layer 241, further,
A surface side resin insulating layer 242 having an opening 247 is formed. Then, a solder paste is printed in each opening 247 of the front-side resin insulation layer 242 to form solder bumps 207, whereby the wiring board 201 is completed.

(Third Embodiment) Next, a third embodiment will be described with reference to FIG. The description of the same parts as those in the first and second embodiments will be omitted or simplified. A cross-sectional view of the wiring board 301 of the third exemplary embodiment is shown in FIG. This wiring board 301 is 30 mm x 30 mm x 1
It has a substantially plate shape of mm, and has a substrate front surface 302 having a mounting region 305 on which the IC chip IC3 is mounted, and a substrate back surface 303 connected to a mother board. Mounting area 30
5 is a rectangular area of 10 mm × 10 mm. In this mounting area 305, a flip chip type IC chip IC
Solder bump (IC connection terminal) 3 connected to the terminal 3
Many 07 are formed. On the other hand, on the back surface 303 of the substrate, a large number of connection pads (back surface connection terminals) 309 connected to the terminals of the motherboard are formed.

Looking inside the wiring board 301, the wiring board 301 is provided with a multilayer ceramic core board 311 made of the same ceramic as that of the first embodiment and having a thickness of 800 μm in the center thereof. And the ceramic core substrate 3
On the core surface 312 of No. 11, the surface side resin insulation layer 341
Are stacked. On the other hand, on the core back surface 213, two back surface side resin insulating layers 343 and 344 are laminated.

Of these, the ceramic core substrate 311 includes
Immediately below the mounting area 305 of the IC chip IC3, a large recess 315 of 10 mm × 10 mm × 0.6 mm that opens to the core back surface 313 is formed. And this recess 3
A plurality of chip capacitors (electronic parts) 32
1 is housed. These chip capacitors 321
Has a terminal 323 only on its surface. The terminal 223 is connected to the capacitor pad 317 formed on the bottom surface of the recess 315. Recess 3
The gap between 15 and the chip capacitor 321 is filled with the same filling material 329 as in the first embodiment.

Further, on the core front surface 312 and the core back surface 31.
3 has wiring layers 331 and 333 having wirings and pads.
Are formed respectively. Further, inside the ceramic core substrate 311, the wiring layer 331 on the core front surface 312 and the wiring layer 333 on the core back surface 313 are connected, or
A large number of through-hole conductors 335 that connect the wiring layer 331 on the core surface 312 and the capacitor connection pads 317 are formed. Since each of the wiring layers 331 and 333, the capacitor pad 317, and the through-hole conductor 335 contains Cu as a main component, it has advantages such as high conductivity.

A large number of openings 342 are formed at predetermined positions in the surface side resin insulation layer 341. Then, the above-mentioned solder bumps 307 connected to the wiring layer 331 on the core surface 312 are formed in these openings 342. On the other hand, a wiring layer 345 including wiring and the above-described connection pad 309 is provided between the two back surface side resin insulating layers 343 and 344.
Are formed. In addition, the back surface side resin insulating layer 343 on the substrate front surface 302 side penetrates through this, while the core back surface 3
A large number of via conductors 347 that are connected to the wiring layer 333 on 13 and the other side are connected to the wiring layer 345 between the back surface side resin insulating layers 343 and 344 are formed at predetermined positions. Also,
A large number of openings 348 are formed at predetermined positions in the backside resin insulation layer 344 on the side of the backside 303 of the substrate. And
The connection pads 309 are exposed in these openings 348.

Since the core substrate of such a wiring substrate 301 is the ceramic core substrate 311, the difference in the coefficient of thermal expansion between the ceramic core substrate 311 (coefficient of thermal expansion 5.3) and the IC chip IC3 (coefficient of thermal expansion 4). Can be reduced to I
Even if the C chip IC3 is mounted, the IC mounting substrate is less likely to be deformed by heat. Furthermore, despite the large recess 315 for the chip capacitor 321 formed in the ceramic core substrate 311, the deformation due to heat is small and the reliability is high. Furthermore, in the third embodiment, since the ceramic core substrate 311 is made of low-temperature fired ceramic, conductors (wiring layers 331, 3) formed on the ceramic core substrate 311.
33, capacitor pad 317, through-hole conductor 3
The main component of 35) is Cu. Therefore, while the core substrate is made of ceramic, the conductivity and the like can be improved to the same extent as in the case of the resin-made core substrate.

Next, a method of manufacturing the wiring board 301 will be described. First, the ceramic core substrate 311
It is formed similarly to the second embodiment. Next, in the recess 315 of the ceramic core substrate 311, the chip capacitor 321 is housed, soldered, filled with a resin paste, and hardened as in the second embodiment. Next, the surface-side resin insulation layer 341 having the opening 342 is formed on the core surface 312 by a known method. On the other hand, the back surface side resin insulating layer 343 is also formed on the core back surface 313. After that, the via conductor 347 and the wiring layer 345 are formed on the back surface side resin insulating layer 343 by a known method. Next, the opening 3 is further formed on the back surface side resin insulating layer 343.
A backside resin insulation layer 344 having 48 is formed. Then, the solder bumps 307 are formed in the openings 342 of the front surface side resin insulating layer 341, whereby the wiring board 301 is completed.

Although the present invention has been described with reference to the embodiments, the present invention is not limited to the above-described first to third embodiments, and is appropriately modified and applied without departing from the scope of the invention. It goes without saying that you can do it. For example, in the above-described first to third embodiments, the ceramic core substrates 111 and 211 are used.
Although the chip capacitors 121, 221, and 321 are housed in the through holes 115 of the 11, 311 and the recesses 215 and 315, electronic components other than the chip capacitors, such as a power supply module, may be housed.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a wiring board according to a first embodiment.

FIG. 2 is a cross-sectional view of a wiring board according to a second embodiment.

FIG. 3 is a sectional view of a wiring board according to a third embodiment.

FIG. 4 is an explanatory diagram showing an outline of a wiring board according to a conventional technique.

[Explanation of symbols]

101, 201, 301 Wiring boards 102, 202, 302 Board surfaces 103, 203, 303 Board back surfaces 105, 205, 305 Mounting areas 107, 207, 307 Solder bumps (IC connection terminals) 111, 211, 311 Ceramic core boards 112, 212 , 312 Core surface 113, 213, 313 Core back surface 115 Through holes 121, 221, 321 Chip capacitors (electronic parts) 129, 229, 329 Fillers 141, 241, 242, 341 Surface side resin insulation layer (resin insulation layer) 215 , 315 Recessed IC1, IC2, IC3 IC chip

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5E336 AA04 AA07 AA08 AA13 BB02                       BB03 BB15 BB18 BC02 BC26                       BC34 CC32 CC43 CC51 CC58                       GG01 GG16                 5E346 AA06 AA12 AA15 AA26 AA35                       AA43 AA60 BB01 BB16 CC08                       CC32 CC38 CC39 CC40 DD03                       DD34 EE31 FF01 FF45 GG03                       GG09 GG19 GG28 GG40 HH11

Claims (3)

[Claims] 1. A wiring board comprising a substrate front surface having a mounting area for mounting an IC chip and a substrate back surface, the ceramic core substrate being made of ceramic and having a core front surface and a core back surface. A ceramic core substrate formed immediately below the region and having a through hole penetrating between the core front surface and the core back surface, an electronic component housed in the through hole, and a gap between the through hole and the electronic component. A filling material to be filled, a resin insulating layer formed on the surface of the core and forming the surface of the substrate, and a plurality of IC connection terminals formed in a mounting region on the surface of the substrate and connected to terminals of the IC chip. A wiring board provided. 2. A wiring board comprising a substrate front surface having a mounting area for mounting an IC chip and a substrate back surface, the ceramic core substrate being made of ceramic and having a core front surface and a core back surface. A ceramic core substrate formed immediately below the region and having a recess opening on the core front surface or the core back surface, an electronic component housed in the recess, and a filler filling a gap between the recess and the electronic component. A wiring board comprising: a resin insulating layer formed on the surface of the core and forming the surface of the substrate; and a plurality of IC connection terminals formed in a mounting region on the surface of the substrate and connected to terminals of the IC chip. 3. The wiring board according to claim 1, wherein the ceramic core substrate is made of low temperature fired ceramic, and is formed on the core front surface, the core back surface, or inside the core of the ceramic core substrate. The conductor is a wiring board whose main component is Au, Ag or Cu.