JP2002043500A - Wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board capable of surely and stably conducting an electronic component mounted at a proper part and an IC chip mounted on a surface or the like. SOLUTION: The wiring board wherein a plurality of chip-like electronic component 10 are mounted in recess parts 16 provided on core boards 2, 3 and the IC chip 36 is mounted on a first main face 30 is provided with a flip chip bump (IC connection terminal) 32 for connecting the connection terminal 38 of the IC chip 36 formed on the first main face 30, and pieces of wiring 20, 28 for connecting the electrode 12 of the electronic component 10 and the flip chip bump 32. The wiring board has a distance of 1 mm or less between the bump 38 and the nearest electrode 12 out of the connection wiring 20, 28.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board on which electronic components are mounted and on which an IC chip is mounted.

[0002]

2. Description of the Related Art In order to cope with recent miniaturization of wiring boards and higher densities of wiring in the wiring boards, not only electronic parts such as IC chips are mounted on a first main surface of the wiring board, but also such electronic parts are required. There has been proposed a wiring board on which electronic components are mounted inside the wiring board. For example, a wiring board 70 shown in FIG. 4A includes a core substrate 71 including insulating substrates 72, 74, and 75, an electronic component 76 mounted in a gap 73 between the insulating substrates 72 and 75, and an electronic component 76. Wiring layer 77 and via conductor 7 that are conductive and formed in core substrate 71
8 is provided. As shown in FIG. 4A, insulating layers 80 to 82, via conductors 83, 85, 87, and wiring layers 84, 86, 88 formed by a build-up method are provided above the core substrate 71. Is arranged.

Further, a large number of flip chip bumps 92 are formed in the IC chip mounting area 93 on the surface 90 of the uppermost insulating layer 82. By connecting a large number of connection terminals 96 provided on the bottom surface of the IC chip 94 to the bumps 92 individually,
An IC chip 94 is mounted therein. In the wiring board 70 as described above, as shown in FIG.
The electronic component 76 mounted on 1 is a via conductor 78, 83,
85, 87 and the wiring layers 77, 84, 86, 88, and the bumps 92 and the connection terminals 96.
And the IC chip 94 mounted on the front surface 90 is also electrically connected.

As shown in the plan view of FIG. 4B, in the wiring board 70, the position where the electronic component 76 is mounted and the mounting area 93 of the IC chip 94 are slightly shifted in the left-right direction in the figure. I have. For this reason, an electrode (not shown) formed on the upper surface of the electronic component 76 on the left side is shown in FIG.
The distance from the mounting position of the electronic component 76 to the flip chip bump 92 at a position deviated to the left is about several mm. In the connection wiring (77, 84, 86, 88) between the separated bump 92 and the electrode of the electronic component 76, the inductance is increased, and the electrical characteristics are reduced. Further, there has been a problem that conduction between the electronic component 76 and the IC chip 94 becomes unstable, and the two do not function sufficiently.

[0005]

SUMMARY OF THE INVENTION The present invention solves the problems of the prior art described above, and ensures reliable and stable conduction between electronic components mounted in place and IC chips mounted on the surface or inside. It is an object of the present invention to provide a wiring board which can be taken by using the same.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention has been made with the idea that the positions of electrodes of electronic components mounted in place and IC connection terminals are made closer to each other in a plan view. It is a thing. That is, a wiring board of the present invention (claim 1) is a wiring board on which an electronic component is mounted and an IC chip is mounted, wherein an IC connection terminal for connecting to a terminal of the IC chip, Electrodes and the above IC
A connection wiring for connecting the connection terminal, wherein a distance between the electrode and the IC connection terminal is 1 mm or less in the connection wiring.
(However, 0 is not included). According to this, since the distance between the electrode of the mounted electronic component and the IC connection terminal is 1 mm or less, the connection wiring between them is not more than 1 mm.
(Loop) Inductance can be reduced, and electrical characteristics are improved. Therefore, conduction between the electronic component and the IC chip can be reliably and stably achieved. In addition, both functions and the function of the wiring layer interposed therebetween can be sufficiently exhibited.

Generally, the IC connection terminals include an IC power supply connection terminal connected to the power supply terminal of the IC chip, an IC ground connection terminal connected to the ground terminal of the IC chip, and
An IC signal connection terminal connected to a signal terminal of the IC chip is included. Here, the electrode of the electronic component connected to the IC power connection terminal is a power electrode, the electrode of the electronic component connected to the IC ground connection terminal is a ground electrode, and the electrode of the electronic component connected to the IC signal connection terminal. Is a signal electrode. Then, the wiring board of the present invention is a wiring board on which electronic components are mounted and an IC chip is mounted, and an IC power supply connection terminal connected to a power supply terminal of the IC chip;
An IC ground connection terminal connected to the ground terminal of the IC chip, and an IC connected to a signal terminal of the IC chip
A signal connection terminal, a power connection wire for connecting a power electrode of the electronic component to a power terminal of the IC chip, a ground connection wire for connecting a ground electrode of the electronic component to a ground terminal of the IC chip, A signal connection wiring for connecting a signal electrode of an electronic component and a signal terminal of the IC chip; and a distance between the IC power supply connection terminal and the power supply electrode; The distance from the ground electrode and the IC
Both the distance between the signal connection terminal and the signal electrode is 1 m
m or less (however, 0 is not included).

For example, if the electronic component to be mounted is a chip capacitor, its electrodes include a power supply electrode and a ground electrode. In this case, the following aspects are included in the wiring board of the present invention. That is, a wiring board on which a chip capacitor is mounted and an IC chip is mounted, and an IC power supply connection terminal for connecting to a power supply terminal of the IC chip;
An IC ground connection terminal for connecting to a ground terminal of the IC chip; a power connection line for connecting a power electrode of the chip capacitor to the IC power connection terminal; a ground electrode of the chip capacitor and the IC ground connection terminal And a ground connection wiring for connecting the power supply electrode and the IC ground connection terminal, and a distance between the ground electrode and the IC ground connection terminal. Each of them includes a wiring board having a size of 1 mm or less.

Further, for example, when the electronic components to be mounted are an inductor, a resistor, a filter, etc., these electrodes include a signal electrode. In this case, the following aspects are included in the wiring board of the present invention. That is, a wiring board on which electronic components are mounted and on which an IC chip is mounted, and an IC signal connection terminal for connecting to a signal terminal of the IC chip;
A signal connection line for connecting the signal electrode of the electronic component and the IC signal connection terminal, wherein a distance between the signal electrode and the IC signal connection terminal in the signal connection line is 1 mm.
The following wiring boards are also included. Further, the distance between the electrode of the electronic component and the IC connection terminal does not include the distance between the two in the vertical direction of the connection wiring (that is, the thickness direction of the wiring board). This is because such a small distance in the vertical direction has a very small effect on the inductance. In addition, the distance between the electrode and the IC connection terminal is larger than 0 mm.

In the present invention, the mounting position of the terminal of the IC chip is projected in the thickness direction of the wiring board.
The C chip mounting area and the electronic component mounting area which is the mounting position of the electronic component are the same area in plan view, or the IC chip mounting area is located inside the electronic component mounting area. And a wiring board (claim 2). According to this, it is easy to always make the connection wiring connecting the electrode and the IC connection terminal as short as possible, so that the inductance between the electrode and the IC connection terminal can be more reliably reduced. it can.

For example, assuming that an electronic component to be mounted is a chip capacitor, the wiring board of the present invention includes the following mode. That is, a wiring board on which a chip capacitor is mounted and on which an IC chip is mounted, wherein an IC power supply connection terminal for connection to a power supply terminal of the IC chip and an IC ground connection for connection to a ground terminal of the IC chip A power supply connection line connecting the power supply electrode of the chip capacitor to the IC power supply connection terminal; and a ground connection wiring connecting the ground electrode of the chip capacitor to the IC ground connection terminal. Of the connection wiring and the ground connection wiring, the power supply electrode and the IC
The distance from the power supply connection terminal, and the ground electrode and I
The distance to the C ground connection terminal is 1 mm or less, and the power supply area of the IC chip is obtained by projecting the mounting position of the power supply terminal of the IC chip in the thickness direction of the wiring board. The chip capacitor mounting power supply area is the same area in plan view, or the IC chip mounting power supply area is located inside the chip capacitor mounting power supply area, and the ground terminal of the IC chip is mounted. The IC chip mounting ground area obtained by projecting the position in the thickness direction of the wiring board and the chip capacitor mounting ground area which is the mounting position of the chip capacitor are the same area in plan view, or The wiring where the chip mounting ground area is located inside the chip capacitor mounting ground area Plate, is also included.

If the electronic components to be mounted are inductors, resistors, filters, etc., for example, the wiring board of the present invention includes the following aspects. That is, a wiring board on which electronic components are mounted and on which an IC chip is mounted, and an IC signal connection terminal for connecting to a signal terminal of the IC chip;
Signal connection wiring for connecting the signal electrode of the electronic component and the IC signal connection terminal, wherein the distance between the signal electrode and the IC signal connection terminal is 1 m in the signal connection wiring.
m or less, and an IC chip mounting signal area formed by projecting the mounting position of the signal terminal of the IC chip in the thickness direction of the wiring board and an electronic component mounting signal area which is a mounting position of the electronic component are flat. It also includes a wiring board that is the same area in view, or where the IC chip mounting signal area is located inside the electronic component mounting signal area.

In the present specification, the above-mentioned IC chip mounting area refers to an area surrounded by a plurality of terminals of an IC chip or a plurality of IC connection terminals which are individually connected to the IC chip and outer terminals. The electronic component mounting area refers to an area surrounded by each electrode on the outer side among a large number of electrodes in the electronic component. In addition, an IC chip mounting power supply area, an IC chip mounting ground area, and an IC chip mounting area.
The chip mounted signal area means a number of power supply, ground, and signal terminals of an IC chip, or a number of IC power supply connection terminals, ICs respectively connected to these.
It refers to the area surrounded by each terminal on the outer side of the ground connection terminal and the IC signal connection terminal. Of course, the shape of these areas includes a polygon such as a rectangle, a pentagon, a hexagon, a circle, an ellipse, or a concave or convex shape in a plan view. Further, the electronic component mounting power supply area, the electronic component mounting ground area, and the electronic component mounting signal area are:
Each refers to the area surrounded by each electrode on the outer side of the power supply, ground, and signal electrodes of the electronic component,
The shape of such an area includes the same shape as above.

The electronic component may be a wiring board on which the electronic component is mounted such that the electronic component has a plurality of electrodes and is located over substantially the entire area of the electronic component mounting area. In this case, each electrode and the nearest I
The connection with the C connection terminal can be minimized, and stable conduction can be obtained with each connection wiring. Further, the electronic component may be a wiring board, which is a plurality of chip-shaped electronic components. In this case, a desired number of chip-shaped electronic components and various chip-shaped electronic components are mounted, inductance between these electrodes and the nearest IC connection terminal is reduced, and conduction between the two is ensured. Becomes possible. Further, by connecting a plurality of chip-shaped electronic components, for example, chip capacitors in parallel, the overall capacity of these can be increased. In addition, it is also possible to use a plurality of chip-shaped electronic components as an electronic component unit that is previously bonded between the side surfaces.

[0015] Further, in any one of the wiring boards, the IC chip is mounted on a first main surface of the wiring board, and the electronic component is formed to be open on a side opposite to the first main surface. It can also be a wiring board mounted inside. In this case, the distance between the electrode of the electronic component and the IC connection terminal can be easily set to a predetermined range. Further, the wiring board includes a core substrate and a build-up layer formed on at least one of a front surface and a back surface of the core substrate, and the electronic component is mounted on a concave portion formed on the core substrate, or Alternatively, a wiring board mounted in the build-up layer may be used.
In this case, when the electronic component is mounted in the core board, the warpage in the thickness direction of the wiring board can be suppressed. When electronic components are mounted in the build-up layer,
Since the distance between the electrode and the IC connection terminal can be further reduced, the inductance can be further reduced and reliable conduction can be achieved. Furthermore, since the electrical connection between the wiring layer formed in the build-up layer and the electronic component and the IC chip can be easily made, it is possible to easily cope with the high performance of the wiring board.

[0016]

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1A shows one embodiment of the present invention.
3 shows a cross section of a main part in a wiring board 1 of one embodiment. The wiring board 1 includes, as shown in FIG.
A plurality of electronic components 10 mounted thereon and a first main surface 30
And an IC chip 36 mounted on the device. Each of the core substrates 2 and 3 is an insulating plate having a substantially square shape in a plan view and an overall thickness of about 0.8 mm. For example, relatively thick and thin insulating plates made of a glass-epoxy resin composite material are used. It is a laminate. Also, by punching substantially the center of the relatively thick core substrate 2 in advance, the core substrates 2 and 3 are punched.
And a concave portion 16 which is substantially square in plan view and has a side of about 12 mm.

A plurality of chip-shaped electronic components 10 such as chip capacitors are mounted in the recesses 16 by being connected to electronic component pads 14 described below via solder (not shown). Electronic component 10
Is a ceramic capacitor in which a plurality of electrodes 12 made of Cu are protruded along each long side of the upper surface, for example, a dielectric layer mainly composed of barium titanate and a Ni layer are alternately laminated, The dimensions are about 3.2mm x 1.6mm x
0.7 mm. As shown in FIG. 1A, each electrode 12 on the upper side of each electronic component 10 is individually connected to an electronic component pad 14 formed on the ceiling surface (bottom surface) of the recess 16, and the core substrate 3 is connected to each other. It is connected to a flat wiring layer 20 made of Cu formed on the surface 4 of the core substrates 2 and 3 through the penetrated filled via conductor 18. The wiring layer 20 is used as a power supply layer or a ground layer, and is conductive through each electronic component 10. Also, pad 1 for electronic parts
The connection between the electrode 4 and the electrode 12 is made of, for example, Sn-Sb based solder.
(Not shown).

When the electronic component 10 is a chip capacitor, the electrode 12 serves as a power electrode and a ground electrode.
Among them, the one with the power supply potential is connected to the power supply layer of the wiring layer, and the one with the ground (ground) potential is connected to the ground layer. Further, the power supply layer and the ground layer are
They may be formed in the same wiring layer, or may be formed in multiple layers. On the other hand, when the electronic component 10 is a resistor, a filter, or the like, the electrode 12 becomes a signal electrode. Further, when the electronic component 10 is an inductor, the electrode 12
Is a power electrode and a ground electrode, or a power electrode, a ground electrode, or a signal electrode.

A plurality of through-hole conductors 7 made of Cu and a filling resin 8 located at the center of the plurality of through-holes 6 drilled in advance around the concave portions 16 of the core substrates 2 and 3 are provided. And are filled. Wirings in wiring layers 20 and 21 formed on the front surface 4 and the back surface 5 of the core substrates 2 and 3 are individually formed at the upper end and the lower end of each through-hole conductor 7, and the wiring layers 20 and 21 are formed by the through-hole conductors. 7
Through each other. As shown in FIG.
The insulating layers 22, 23, 26, 2 made of epoxy resin are provided above the front surface 4 and below the rear surface 5 of the core substrates 2, 3.
7 and a buildup layer 39 in which wiring layers 28 and 29 made of Cu are alternately stacked. Via conductors are provided between the wiring layers 20 and 28 on the surface 4 of the core substrates 2 and 3.
(Filled via) 24, and a via conductor (filled via) 25 between the wiring layers 21 and 29 under the back surface 5.
Each is connected to each other. Note that the insulating layers 23 and 27 and the wiring layers 21 and 29 are not located below the concave portion 16 and open to the second main surface side.

As shown in FIG. 1A, the uppermost wiring layer 2
8 at a predetermined position, a number of flip-chip bumps (IC connection terminals, ie, IC power connection terminals and IC ground connection terminals, or IC signal connection terminals) 32 made of solder are placed on an insulating layer (solder layer) immediately above. (Resist layer) 26 and protrudes higher than the first main surface 30. As shown in FIG. 1B, for example, six flip chip bumps 32 are vertically and horizontally arranged in a grid pattern, and an IC chip mounting formed along each of the bumps 32 on the vertical and horizontal outer sides. It is arranged in the area 34. As shown in FIG. 1A, on the mounting area 34 of the first main surface 30,
An IC chip 36 is disposed, and each of the bumps 3
2, a connection terminal 38 is provided to protrude. As shown, the connection terminals 38 at the corresponding positions are individually placed on the bumps 32 and the bumps 32 are connected to the connection terminals 38 by reflowing the bumps 32. As a result, the IC chip 36 can be mounted in the mounting area 34 as shown. At the same time, IC
The wiring layers 20, 2 are also provided between the chip 36 and each electronic component 10.
8 and via conductors 24 and the like.

On the other hand, as shown in FIG. 1A, a part of the wiring 33 of the lowermost wiring layer 29 is exposed in the opening 31 provided in the insulating layer (solder resist layer) 27 immediately below. ,
The surface is coated with a plating film of Ni and Au plating, and is used as a connection terminal 33 for connecting to a motherboard (not shown) on which the wiring board 1 itself is mounted.
Incidentally, a pin (not shown) made of a copper-based or iron-based alloy may be connected to the connection terminal 33 by soldering. By the way, in the wiring board 1, as shown in FIG. 1B, the IC chip mounting area 34 follows the outer side of each electrode 12 on the upper side of each electronic component 10 in FIG.
It is located slightly inside the electronic component mounting area 11 indicated by the broken line in (B). In addition, each electrode 12 and the corresponding flip chip bump (IC connection terminal) 32
Are all set to 1 mm or less.

Therefore, each electronic component 10 and IC chip 3
6 can keep the inductance of each connection wiring low even if it is conducted by any of the electrodes 12 and the connection wiring (such as the wiring layer 20) between the bumps 32 closest to this. Therefore, it is possible to improve the electrical characteristics of the connection wiring. Therefore, according to the wiring board 1, the electronic components 10 mounted on the recesses 16 of the core substrates 2 and 3 and the IC chip 36 mounted on the first main surface 30 always conduct in a reliable and stable state. Can be. In addition, since the IC chip 36 is also electrically connected to the connection terminals 33 via the electronic components 10 and the wiring layers 21 and 29 on the back surface 5 side, it is easy to stably conduct the electrical connection to the motherboard through these. Become. still,
If the distance between the flip chip bump 32 and the nearest electrode 12 is 1 mm or less, the IC chip mounting area 34 and the electronic component mounting area 11 shown in FIG. Alternatively, the IC chip mounting area 34 may be located outside the electronic component mounting area 11.

[0023]

EXAMPLES Specific examples of the present invention will now be described together with comparative examples. FIG. 2A is a plan view of six electronic components 10 mounted on the wiring board 1 according to the embodiment, and an IC chip mounting area 34 located above and overlapped therewith. On each long side on the upper surface of each electronic component 10,
A plurality of electrodes 12 are located. For this reason, the electronic component mounting area 11 indicated by a broken line in FIG. Each electronic component 10 is mounted in advance so that the plurality of electrodes 12 are located over substantially the entire surface of the electronic component mounting area 11. Also,
The electrode 12 is a power electrode and a ground electrode, or
It is a signal electrode. Further, I shown by a dashed line in FIG.
The C chip mounting area 34 is the electronic component mounting area 1
It is set so that each side is located about 0.2 mm inward on each side. 2A are the flip-chip bumps to be measured in the mounting area 34.
(IC power connection terminal and IC ground connection terminal or IC signal connection terminal) 32 are shown.

On the other hand, FIG. 2B shows a wiring board 1 'of the comparative example.
5 shows a plan view of six mounted electronic components 10 and an IC chip mounting area 34 located above and overlapped therewith. In the same manner as described above, a plurality of electrodes 12 are located on each long side on the upper surface of each electronic component 10, and the electrodes 12 located on the outer side of each electronic component 10 and along the gap between these electrodes 12 in FIG. An electronic component mounting area 11 indicated by a broken line is located. Note that the plurality of electrodes 12 are also located over substantially the entire surface of the electronic component mounting area 11.
Each electronic component 10 is mounted in advance. In addition, FIG.
The IC chip mounting area 34 indicated by the one-dot chain line is set so as to be located outside the electronic component mounting area 11 by about 0.7 mm on each side. 2 (B) indicate the positions of the flip chip bumps (IC power connection terminal and IC ground connection terminal or IC signal connection terminal) 32 to be measured in the mounting area 34. .

A in plan view of the wiring boards 1 and 1 '
D) The distance between the flip chip bumps 32 located at the points (a) to (c) and the electrode 12 of the nearest electronic component 10 was measured in advance. In addition, each of the bumps 3 located at a to d and
2 (for power supply and ground, or for signal), a high frequency (1 GHz) measuring probe (not shown) is brought into contact with the probe, and the inductance (L) value of the connection wiring formed via the nearest electrode 12 is individually determined. It was measured. These results are shown in the graph of FIG. In the graph of FIG. 2C, the distance between the bump 32 and the electrode 12 indicated by the vertical axis on the right side is at each of positions A to D on the wiring board 1 of the embodiment.
The inductance (L) of the connection wiring between the bump 32 and the electrode 12 indicated by the vertical axis on the left was several tens μm to several hundreds μm, and all were at the level of 0.4 pH.

On the other hand, in the wiring board 1 'of the comparative example,
At the position of (g), the distance and the inductance (L) were almost the same as those in the above (a) to (d). However, the distances indicated by arrows in FIG. 2 (B) at the positions of ク and に お け る on the wiring board 1 ′ of the comparative example are as long as 0.72 mm and 1.68 mm, and the inductance (L) is also 0.58 pH, It became considerably high at 0.77 pH. In particular, the inductance at the position (L)
Exceeded 0.6 pH, which is one measure of low inductance indicated by the dashed line in FIG. 2 (C). From the above results, the operation and effect of the wiring board 1 of the present invention that the distance between the flip chip bump (IC connection terminal) 32 and the electrode 12 is set to 1 mm or less and the inductance of the connection wiring between them is reduced are supported. Was.

FIG. 3A shows a cross section of a main part of a wiring board 40 having a different form. As shown in FIG. 3A, the wiring board 40 includes a core substrate (insulating substrate) 42, a concave portion 55 opened on the back surface 44 side of the core substrate 42,
5, a plurality of electronic components (chip capacitors) 50 mounted by connecting to electronic component pads 54 via solder (not shown). Core substrate 42
Also, the recesses 55 are made of the same size and material as those of the core substrates 2 and 3, and a central portion thereof is processed by a router to form a recess 55 having a substantially square shape in plan view and a side of 12 mm. Further, as shown in FIG. 3A, a plurality of through holes 45 penetrate on both sides (periphery) of the concave portion 55, and a through hole conductor 46 and a filling resin 47 are individually formed therein. ing.

The electronic component 50 mounted in the recess 55 by being connected to the electronic component pad 54 via solder has a Cu electrode 52 protruding only at the upper end thereof. It is similar. As shown in FIG. 3A, the core substrate 42 which is the ceiling surface (bottom surface) of the concave portion 55
A plurality of via conductors 48 and a filling resin 49 penetrating the thin portion are formed in the thin portion. The electrode 52 of each electronic component 50 is electrically connected to the flat wiring layer 56 formed on the surface 43 of the core substrate 42 via each via conductor 48. Such a wiring layer 56 is used as a ground layer or a power supply layer. The wiring layer 56 is also connected to the upper end of each through-hole conductor 46. When the electronic component 50 is a chip capacitor, the electrode 52 serves as a power supply electrode and a ground electrode. Of these, a power supply potential is connected to the power supply layer of the wiring layer, and a ground potential is connected to the ground layer. Is done. On the other hand, when the electronic component 50 is a resistor, a filter, or the like, the electrode 52 becomes a signal electrode. Further, when the electronic component 50 is an inductor, the electrode 52 is a power electrode and a ground electrode, or a power electrode, a ground electrode, or a signal electrode.

As shown in FIG. 3A, insulating layers 58 and 62 made of epoxy resin and a wiring layer 64 made of Cu are alternately laminated above the surface 43 of the core substrate 42. Via conductors (filled vias) 60 for connecting the wiring layers 56 and 64 are formed in the insulating layer 58. At a predetermined position in the uppermost wiring layer 64, a plurality of flip chip bumps (IC connection terminals, ie, IC connection terminals, that penetrate through the insulating layer (solder resist layer) 62 immediately above and protrude higher than the first main surface 66. An IC power connection terminal and an IC ground connection terminal, or an IC signal connection terminal) 65 are formed. These bumps 65 are located in an IC chip mounting area 69 on the first main surface 66 and are individually connected to connection terminals 67 of an IC chip 68 mounted in this area 69. Note that the wiring layers 56 and 64, the insulating layers 58 and 62, and the via conductor 60 form a build-up layer.

Further, below the back surface 44 of the core substrate 42, as shown in FIG. 3A, an insulating layer 59 and a wiring layer 57 made of the same resin as described above are laminated. However, the insulating layer 59 and the wiring layer 57 are not formed below the concave portion 55. In the opening 61 provided in the insulating layer (solder resist layer) 59, a part of the wiring layer 57 is exposed, and the connection terminal 63 whose surface is coated with a Ni and Au plating film is provided.
Are formed. These connection terminals 63 are also used for connection to a printed board such as a motherboard (not shown) on which the wiring board 40 itself is mounted. The wiring layers 56 and 57 sandwiching the core substrate 42 are connected to the through-hole conductors 46 and 4.
6 are connected to each other. Also, connection terminal 6
A pin made of a copper-based or iron-based alloy may be connected to 3 by soldering (not shown).

By the way, also in the wiring board 40, FIG.
As shown in FIG. 3B, the IC chip mounting area 69 follows the outer side of each electrode 52 of each electronic component 50 in FIG.
It is located slightly inside the electronic component mounting area 51 indicated by the broken line inside. In addition, the distance between each electrode 52 and the corresponding flip-chip bump (IC connection terminal) 65 is all set to 1 mm or less. Therefore, each of the electronic components 50 and the IC chip 68 is connected to any one of the electrodes 52 and the bump 67 closest thereto.
The inductance of each connection wiring can be kept low even when the connection is made by the wiring layer 64 or the like.

Therefore, according to the wiring board 40, the electronic components 50 mounted in the recesses 55 of the core substrate 42 and the IC chip 68 mounted on the first main surface 66 are conducted in a reliable and stable state. be able to. Moreover, since the IC chip 68 is also electrically connected to the connection terminals 63 via the wiring layers 64 and 56 on the front surface 43 and the wiring layer 57 on the rear surface 44, the conduction with the motherboard described above is easy and stable. I can take it. If the distance between the flip chip bump (IC connection terminal) 65 and the nearest electrode 52 is 1 mm or less, the IC chip mounting area 69 and the electronic component mounting area 51 shown in FIG. Or the former may be located outside the latter.

The present invention is not limited to the embodiments described above. For example, only one electronic component may be mounted in the recesses 16, 55 or the like. Conversely, a plurality of recesses 16, 5 are provided in one wiring board 1, 40 per product unit in a panel including a large number of core boards 2, 3, 42.
5 may be formed. Alternatively, a plurality of chip-shaped electronic components may be a unit in which the side surfaces thereof are bonded in advance, and these may be inserted into the recesses 16 and 55 and mounted. Further, the chip-type electronic component includes the chip capacitor 10.
In addition to passive components such as chip-shaped inductors, resistors, and filters, active components such as transistors, memories, and low-noise amplifiers (LNAs),
It is also possible to mount W filters, LC filters, antenna switch modules, couplers, diplexers, and other electronic components of different types together in the same recess.

Further, the IC chip is not limited to the above-described embodiments mounted on the first main surface, but may be mounted in a gap provided in a build-up layer 39 formed on the front and back surfaces of the core substrates 2 and 3. In this case, the IC connection terminal is formed on the bottom surface of the gap. Further, the material of the core substrate 2 or the like may be a glass woven fabric having the same heat resistance, mechanical strength, flexibility, and ease of processing, or the like, in addition to the glass-epoxy resin composite material. A glass fiber-resin composite material that is a composite material of glass fiber and a resin such as an epoxy resin, a polyimide resin, or a BT resin may be used. Alternatively, a composite material of an organic fiber and a resin such as a polyimide fiber, or a resin-resin composite material in which a resin such as an epoxy resin is impregnated with a fluororesin having a three-dimensional network structure such as PTFE having continuous pores is used. It is also possible. Further, it is also possible to use alumina, glass ceramic, low-temperature fired ceramic, silicon nitride, zirconium, or a ceramic of a mixture thereof. The material of the wiring layers 28 and 56 is the same as that of the C layer.
u, Ni, Ni-Au, Au, Ag, Ag-Pd,
It may be made of Ag-Pt, Mo, W, or the like, or may be formed by a method of applying a conductive resin without using the above-mentioned metal plating film. Further, the via conductor 24 and the like are not limited to the form of the filled via filling up the inside of the via hole, and may have a conical form following the via hole.

The materials of the insulating layers 22 and 58 are, for example, polyimide resin having similar heat resistance and pattern moldability, BT, in addition to the aforementioned epoxy resin as a main component.
Resin, PPE resin, or PTF having continuous pores
A resin-resin-based composite material in which a resin such as an epoxy resin is impregnated with a fluorine-based resin having a three-dimensional network structure such as E can also be used. In addition, in order to form the insulating layer, in addition to a method of applying a liquid resin by a roll coater, an insulating film is thermocompression-bonded, or alumina, glass ceramic, low-temperature fired ceramic, silicon nitride, zirconium, or Can be used. Further, an IC chip 3 mounted on the first main surfaces 30, 66 of the wiring boards 1, 40, etc.
For the IC connection terminals 6 and 68, in addition to the flip chip bumps 32 and 65, a flip chip pad, a wire bonding pad, a terminal formed with a TAB connection pad, or the like may be used. Although the capacitors 10 and 50 of the electronic components are made of a high dielectric ceramic containing BaTiO ₃ as a main component, PbTiO ₃ and Pb
ZrO ₃ , TiO ₂ , SrTiO ₃ , CaTiO ₃ , M
gTiO ₃ , KNbO ₃ , NaTiO ₃ , KTaO ₃ ,
PbTaO ₃ , (Na _1/2 Bi _1/2 ) TiO ₃ , Pb
_{(Mg 1/2 W 1/2)} O 3, (K 1/2 Bi 1/2) Ti
A material containing O ₃ or the like as a main component may be used.

Further, the material of the electrodes 12 and the like in the capacitors 10 and 50 of the electronic component is mainly composed of Cu.
Pt, Ag, Ag-Pt, compatible with electronic components
Ag-Pd, Pd, Au, Ni and the like can be used. In addition, the capacitor 10 or the like of the electronic component may include a dielectric layer mainly composed of a high dielectric ceramic or Ag-Pd.
And the like, and a via conductor and a wiring layer made of resin, Cu plating, Ni plating or the like may be combined to form a capacitor. The first main surface 3 of the wiring boards 1 and 40
A plurality of IC chip mounting areas 3 on 0, 66, etc.
4, 68, and a plurality of IC chips 36, 68 can be individually mounted in the mounting areas 34, 69.

[0037]

According to the wiring board of the present invention described above, the distance between the electrode of the mounted electronic component and the IC connection terminal formed on the surface or the like is 1 mm or less. (Loop) inductance in the connection wiring can be reduced. Therefore, the electrical characteristics of the connection wiring can be improved. Therefore, conduction between the electronic component and the IC chip can be reliably and stably achieved, and the functions of both and the function of the wiring layer interposed therebetween can be sufficiently exhibited. Claim 2
According to this wiring board, it is easy to always minimize the connection wiring for connecting the electrode and the IC connection terminal. Therefore, the inductance in the connection wiring between the electrode and the IC connection terminal can be reduced more reliably.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view showing a main part of a wiring board of the present invention, and FIG. 1B is a schematic plan view showing a positional relationship between two areas in the wiring board of FIG.

FIGS. 2A and 2B are schematic plan views showing a positional relationship between electrodes of an electronic component and an IC chip mounting area on a wiring board of an example or a comparative example, and FIGS. Graphs showing the inductance and the like at each position in parentheses.

3A is a cross-sectional view illustrating a main part of a wiring board of a different form, and FIG. 3B is a schematic plan view illustrating a positional relationship between two areas in the wiring board of FIG.

4A is a cross-sectional view illustrating a main part of a conventional wiring board, and FIG. 4B is a schematic plan view illustrating a positional relationship between two areas in the wiring board of FIG.

[Explanation of symbols]

1,40 Wiring board 10,50 ... Electronic component 11,51 ... Electronic component mounting area 12,52 ... Electrode 32,65 ...... Flip chip bumps (IC connection terminals) 20, 28, 56, 64 Wiring layers (connection wiring) 34, 69 ... IC chip mounting area 36, 68 ... IC Chips 38, 67 ... IC chip terminals

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H05K 3/46 H01L 23/12 B (72) Inventor Yuki Ogawa 14-18 Takatsuji-cho, Mizuho-ku, Nagoya-shi, Aichi Japan Special Ceramics Co., Ltd. (72) Inventor Eiji Kodera 14-18 Takatsuji-cho, Mizuho-ku, Nagoya City, Aichi Prefecture Japan Special Ceramics Co., Ltd. (72) Inventor Yasuhiro Sugimoto 14-18, Takatsuji-cho, Mizuho-ku, Nagoya City, Aichi Prefecture F-term (Reference) in Japan Special Ceramics Co., Ltd.

Claims (2)

[Claims] 1. A wiring board on which an electronic component is mounted and on which an IC chip is mounted, wherein an IC connection terminal for connecting to a terminal of the IC chip is connected to an electrode of the electronic component and the IC connection terminal. A connection wiring, wherein a distance between the electrode and the IC connection terminal in the connection wiring is 1 mm or less. 2. An IC chip mounting area formed by projecting a mounting position of a terminal of the IC chip in a thickness direction of the wiring board, and an electronic component mounting area, which is a mounting position of the electronic component, in plan view. In the same area, or
The wiring board according to claim 1, wherein the IC chip mounting area is located inside the electronic component mounting area.