JP2003031912A - Substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate that can suppress the occurrence of fiber dust, even if the substrate is cut by shearing, etc. SOLUTION: This substrate 100 is formed by hardening fibers 110 for reinforcement composed of fibers 113 formed, so that their directions are biased from (becomes oblique to) the peripheral edge section of the substrate 100 and fibers 114 formed, so that their directions intersect the directions of the fibers 113 at right angles, by dipping the fibers 110 in fibers 120. Consequently, when for example, the substrate 100 is cut in parallel with the peripheral edge section of the substrate 100, namely, by biasing the cutting direction from the direction of the fibers 110, the strength of the cutting plane and its vicinity increases, as compared with the conventional examples and the fibers 110 can be cut surely. Therefore, the substrate 100 can be cut without producing fiber dust.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate used for a semiconductor device, for example.

[0002]

2. Description of the Related Art Usually, as a substrate used for a semiconductor device, for example, a substrate formed of a resin containing a glass cloth woven of glass fibers is used.

FIG. 7A is a top view showing an example of the structure of a conventional substrate. Conventionally, the substrate 100 'is shown in FIG.
As shown in, for example, resin 1 made of thermosetting resin
In FIG. 20, a fiber 110 is formed in which a warp yarn 111 formed in the longitudinal direction of a rectangular substrate 100 ′ and a weft yarn 112 formed in the left-right direction are orthogonal to each other.

FIG. 7B is an enlarged view of the cross section taken along the line AA 'in FIG. 7A. For example, as shown in FIG. 7 (b), the warp yarn 111 is composed of a plurality of glass fiber bundles. Similarly, the weft 112 is also composed of a plurality of glass fiber bundles.

The weft thread 112 has a structure woven into the warp thread 111, and the warp thread 111 also has a structure woven into the weft thread 112.

As described above, the warp yarn 111 and the weft yarn 112 are
The glass cloth formed in 1 has a function as a reinforcing material for the substrate 100 '.

FIG. 8 is a top view showing an example of a semiconductor device using the substrate 100 '. The above-mentioned substrate 100 ′ is
For example, copper foil having a wiring pattern is laminated on both sides of the substrate 100 ′, the semiconductor package 10 is mounted on the central portion of the substrate 100 ′ as shown in FIG.
It is used as 00.

For example, when forming the above-mentioned semiconductor device 300, the rectangular substrate 100 'is used after being cut into a desired shape and size.

The cutting method of the substrate 100 'includes methods such as fusing, cutting and shearing, and generally, a shearing method using a die having excellent productivity is performed.

FIG. 9 is a diagram for explaining an example of a shearing method of the semiconductor device 300 of FIG.

For example, as shown in FIG. 9, the shearing device using a die comprises a die 20, a punch guide 21, and a punch 22.

The semiconductor device 300 is constructed by mounting the semiconductor package 10 on a copper clad laminate 101 in which copper foils 130 having a wiring pattern are laminated on both sides of a substrate 100 '.

A shearing method using the above shearing device will be described. First, the above-described semiconductor device 300 is installed on the die 20 of the shearing device, and the punch guide 21 presses the upper surface of the copper-clad laminate 101 of the semiconductor device 300.
The semiconductor device 300 is fixed.

At this time, the side surface of the die 20 and the punch guide 2
The semiconductor device 300 is formed so that the surface formed by the side surface of the semiconductor device 1 and the side surface of the semiconductor device 1 is the cut surface of the copper clad laminate 101 of the semiconductor device 300.
Are set on the die 20.

Then, the punch 22 is pressed downward along the side surface of the punch guide 21 to shear the peripheral portion of the copper-clad laminated substrate 101.

The above is the method of shearing the semiconductor device 30 by the shearing device using a mold.

[0017]

FIG. 10 is an enlarged view of the cut portion of the sheared substrate 100 'of FIG. In the conventional substrate 100 ′, when shearing is performed using the mold as described above, the cut portion of the sheared substrate 100 ′ is, as shown in FIG. 10, a fiber scrap that is a fray of the fiber 110. 30 (hereinafter referred to as scrap) is generated.

Specifically, the fibers 112 whose fiber direction is substantially parallel to the BB 'cutting line of the substrate 100' cause the scrap 30.

FIG. 11 is a diagram for explaining shearing of the fiber 110 in which the fiber direction is substantially perpendicular to the BB ′ cutting line in FIG.

As shown in FIG. 11, the warp yarn 11 is a fiber 110 whose fiber direction is substantially perpendicular to the BB 'cutting line.
Since 1 is cut in a substantially vertical direction, it is surely sheared. Therefore, the scrap 30 described above does not occur.

FIG. 12 is a view for explaining shearing of the fiber 110 whose fiber direction is substantially parallel to the BB 'cutting line of FIG.

However, as shown in FIG. 12, in the weft yarn 112, which is the fiber 110 whose fiber direction is substantially parallel to the BB ′ cutting line, a part of the fiber 110 is pulled out or frayed at the time of cutting. As a result, fluffing occurs, and thus scraps 30, which are frays of the fiber 110, are generated.

As described above, when the scraps 30 of the fiber 110 are generated, there is a problem that the appearance of the substrate 100 'is deteriorated. There is also a problem that the vicinity of the cut surface becomes brittle.

Also, when the semiconductor package 10 is mounted on the substrate 100 'by soldering, for example, to manufacture a semiconductor device, the scraps 30 of the fiber 110 fall off and the substrate 1
Between 00 'and the semiconductor package 10, a mounting failure occurs, and the yield of the semiconductor device deteriorates.

Further, even when the above-mentioned substrates are laminated to manufacture a multilayer laminated substrate, there is a problem that the product yield of the multilayer laminated substrate is deteriorated due to the scraps 30 of the fiber 110.

The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate capable of suppressing the generation of fiber scraps even when cut by shearing or the like.

Another object is to suppress the generation of fiber scraps even when cut by shearing or the like, improve the yield when a semiconductor is mounted and manufacture a semiconductor device, and manufacture a multilayer laminated substrate. It is to provide a substrate that improves the yield at the time.

[0028]

In order to achieve the above object, the substrate of the present invention is a substrate formed of a resin containing fibers for reinforcement, the fibers being in a bias direction with respect to a peripheral portion. Are arranged so that

Suitably, the fibers are glass fibers.

Further, preferably, the fibers include a plurality of first fiber groups whose fiber directions are formed in a first direction with respect to the peripheral edge portion of the substrate, and the first fiber whose fiber direction is the first fiber group. A second fiber group formed in the second direction so as to intersect the group at a predetermined angle.

According to the above-mentioned substrate of the present invention, it is formed of a resin containing glass fiber for reinforcement. The fibers are formed so as to be in the bias direction (oblique direction) with respect to the peripheral portion of the substrate.

Then, for example, when the substrate of the present invention is sheared substantially parallel to the peripheral edge of the substrate, that is, in the bias direction with respect to the fiber direction, using a shearing device using a die or the like, the fibers are Since the fiber direction is formed in the bias direction with respect to the peripheral portion of the substrate, the fibers are reliably sheared, and the substrate is sheared without generating fiber scraps.

Further, the fiber intersects with the plurality of first fiber groups whose fiber direction is formed in the first direction with respect to the peripheral portion of the substrate, and the fiber direction intersects the first fiber group at a predetermined angle. When it is formed so as to include the second fiber group formed in the second direction, the strength of the substrate becomes stronger.
Then, for example, when the substrate is sheared by a shearing device so as to be substantially parallel to the peripheral portion of the substrate, the fibers are reliably sheared, and the substrate is sheared without generating fiber scraps.

Further, in order to achieve the above object, the substrate of the present invention is formed of a resin containing fibers for reinforcement, and the fibers are arranged so as to be in the bias direction with respect to the peripheral portion. Is sheared in a direction that intersects the fibers at a predetermined angle.

Preferably, the fibers are glass fibers.

Preferably, the fibers include a plurality of first fiber groups whose fiber direction is formed in a first direction with respect to the peripheral portion of the substrate, and the first fiber whose fiber direction is the first fiber group. A second fiber group formed in the second direction so as to intersect the group at a predetermined angle.

The above-mentioned substrate of the present invention is prepared in advance by a resin containing glass fibers for reinforcement, and a main substrate is prepared in which the fibers are arranged in the bias direction with respect to the peripheral portion. It is formed by shearing a part of the main substrate in such a direction as to intersect the fibers at a predetermined angle.

Then, for example, by using a shearing device using a die or the like, the substrate of the present invention is made substantially parallel to the peripheral portion of the substrate, that is, at a predetermined angle with respect to the fiber direction, for example, surely. By cutting at a shearable angle, the substrate is sheared without generating fiber scraps.

Further, the fiber intersects with the plurality of first fiber groups whose fiber direction is formed in the first direction with respect to the peripheral portion of the substrate, and the fiber direction intersects the first fiber group at a predetermined angle. When it is formed so as to include the second fiber group formed in the second direction, the strength of the substrate becomes stronger.
Then, for example, when the substrate is sheared by a shearing device substantially parallel to the peripheral portion of the substrate, that is, the fibers are sheared at an angle at which the fibers can be sheared, the fibers are surely sheared, and the substrate is generated without generating fiber scraps. Sheared.

[0040]

BEST MODE FOR CARRYING OUT THE INVENTION A substrate according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a top view of the substrate according to this embodiment.

In the substrate 100 of this embodiment, as shown in FIG. 1, the fibers 110 made of, for example, glass fibers are arranged in the bias direction (oblique direction) with respect to the peripheral portion of the substrate 100, and the fibers 113. The fibers 114 are arranged so as to be orthogonal to the fibers 113.

Here, the structure in which the fibers 110 are formed in the bias direction with respect to the peripheral portion of the substrate 100 as described above is referred to as a bias structure.

The fibers 113 and 114 are composed of, for example, a plurality of glass fiber bundles.

The above-mentioned fiber bundle is specifically, for example,
Glass that is generally called E glass is melted,
It is formed with a desired thickness of 9, 11 μm or the like through a nozzle corresponding to the number of fiber bundles.

The fibers 110 are woven by, for example, an air-spinning loom. At this time, the tension and twist of the intersecting yarns are adjusted so that, for example, the subsequent expansion and contraction of the substrate dimensions are the same.

Then, for example, the woven fiber 110 is dipped in a resin 120 made of a thermosetting resin and cured to form the substrate 100.

The thermosetting resin is brittle and does not form a plate by itself. Therefore, the fiber 110 is used as a reinforcing material.

The resin 120 is, for example, generally FR-4.
It is formed of an epoxy resin called, a tetrafunctional epoxy resin, a polyimide, or the like.

It is desirable that the resin 120 has, for example, the same coefficient of thermal expansion as the coefficient of thermal expansion of the fiber 110. This is because, for example, when there is a large difference between the expansion and contraction of the fiber and the expansion and contraction of the resin when the temperature changes, microcracks and peeling easily occur in the substrate 100.

FIG. 2 is an enlarged view of the fiber 110 when sheared along the line CC ′ in FIG. In the figure, the surface indicated by the broken line is a cut surface.

For example, the substrate 100 is processed by a shearing device using a mold or the like as shown in FIG. 9 described above.
When sheared along a line CC ′ parallel to the peripheral edge of the fiber 110, as shown in FIG. 2, the fiber of the fiber 110 with respect to the line CC ′ parallel to the peripheral edge of the substrate 100. Since the direction is the bias direction, the fiber 110 is reliably cut.

At this time, the fibers 113 and 114 which are the fibers 110 are arranged so that the fibers 110 are surely sheared by the shearing device in the bias direction. Specifically, for example, it is preferable that the fiber direction of the fiber 110 is 45 ° ± several tens% with respect to the peripheral portion of the substrate 100.

As described above, the substrate 10 of this embodiment
0 is formed so that the fiber direction of the fiber 110 is in the bias direction with respect to the peripheral portion of the substrate 100. Therefore, when cutting is performed in parallel with the peripheral portion of the substrate 100, that is, in the bias direction with respect to the direction of the fiber 110, the strength in the vicinity of the cut surface is increased as compared with the conventional technique, and the fiber 110 is reliably cut. It can be cut, and the substrate 100 can be cut without generating fiber scraps.

Further, in the above-described substrate 100, the generation of fiber scraps during the cutting process is suppressed, so the appearance of the cut surface of the substrate 100 becomes better than in the prior art.

In addition, for example, when the semiconductor package is mounted on the substrate 100 by soldering, the dropped fiber scraps are not mixed between the mounting substrate and the semiconductor package, and soldering failure is prevented. be able to.

FIG. 3 shows a base material 20 having a conventional fiber structure.
It is a figure for explaining forming substrate 100 from 0.

The substrate 100 is, for example, as shown in FIG. 3, a base material 200 which is a main board having fibers 110 whose fiber directions are perpendicular and parallel to the peripheral portion of the base material 200.
The rectangular substrate 100 is formed by shearing the fibers 110 in a bias direction and at a predetermined interval.

If the substrate 100 is formed as described above,
Fibers 1 that are arranged so as to be parallel and perpendicular to the peripheral portion of the base material 200 that is generally used in the past
The substrate 100 can be easily formed from the base material 200 having 10.

FIG. 4 shows a base material 200 having a bias structure.
FIG. 6 is a diagram for explaining that the substrate 100 is formed from FIG.

In addition to the method of forming the substrate 100 described above, for example, as shown in FIG. 4, the fibers 110 are laminated in advance so that the fiber directions of the fibers 110 are in the bias direction with respect to the peripheral portion of the base material 200. Then, the base material 200 is formed.

Then, using the shearing device as shown in FIG. 9, the rectangular substrate 100 is sheared by shearing at a predetermined interval with the fiber 110 in the bias direction.
To form.

If the substrate 100 is formed as described above,
Since the base material 200 has the bias structure, the substrate 100 can be easily formed, for example, by cutting the base material 200 in parallel and perpendicularly to the peripheral edge portion at a predetermined interval.

FIG. 5 is a diagram for explaining the formation of a multilayer copper clad laminate by laminating the substrates 100 according to one embodiment of the present invention.

For example, the substrate 100 described above is used for a multilayer copper clad laminate forming a semiconductor device. For example, as shown in FIG. 5, a multilayer copper-clad laminate is formed by laminating the above-mentioned substrates 100 in a number corresponding to a desired thickness, and placing a copper foil 130 on both surfaces of a knitted product between end plates (not shown). Place, stack a predetermined number, and heat and pressurize with a vacuum press (not shown) while suppressing the generation of voids to perform molding. Then, a multilayer copper clad laminate is obtained.

Using the above-mentioned multilayer copper-clad laminate, for example, in the step of cutting the multilayer copper-clad laminate in the process of manufacturing a desired semiconductor device, the cut surface of the substrate 100 is biased in the fiber direction. Since the fiber 110 is reliably cut, the generation of fiber scraps can be suppressed. Further, when manufacturing the above-mentioned multilayer copper clad laminate, the substrate 10
It is possible to suppress the mixing of fiber scraps between the laminated layers of 0, and the product yield of the multilayer copper-clad laminated board is improved.

FIG. 6 is a diagram showing an example of a lead frame using the substrate 100 described above. The above-mentioned substrate 100 is
For example, as shown in FIG. 6, a slit 4 is formed near the center.
0 may be formed and used as the lead frame 300.

When the lead frame 300 is formed by using the above-described substrate 100 of the present embodiment, a semiconductor chip (not shown) is mounted on the lead frame 300, and the lead frame 300 is sealed with a sealing resin. When cutting into semiconductor devices, the cut surface of the substrate 100 is in the bias direction with respect to the fiber direction, and the fibers 110 are reliably cut, so that generation of fiber scraps can be suppressed.

The present invention is not limited to this embodiment, and various suitable modifications can be made. For example, in the present embodiment, the substrate 100 is formed in a form in which the fibers 110 are woven, but the present invention is not limited to this form. For example, the fibers 110 may not be woven, may have only one fiber direction, or may have multiple fiber directions.

Further, in this embodiment, the fiber 110 is
The fibers were formed using E glass, but the form is not limited to this. For example, Q glass, D glass, S glass or the like may be used, or polyester, other organic fiber or inorganic fiber may be used.

In this embodiment, the substrate 100 is
Although it is used for the mounting substrate and the multilayer copper foil laminated plate, the present invention is not limited to this form. For example, it may be used as a prepreg for multilayer adhesion, or may be used for other purposes.

[0072]

As described above, according to the present invention,
It is possible to realize a substrate that can suppress the generation of fiber scraps even when cut by shearing or the like.

[Brief description of drawings]

FIG. 1 is a sectional view of a substrate according to an embodiment of the present invention.

FIG. 2 is an enlarged view of a fiber when sheared along the line CC ′ of FIG.

FIG. 3 is a diagram for explaining forming a substrate according to an embodiment of the present invention from a base material having a conventional fiber structure.

FIG. 4 is a diagram for explaining forming a substrate according to an embodiment of the present invention from a base material having a bias structure.

FIG. 5 is a diagram for explaining formation of a multilayer copper-clad laminate by laminating substrates according to an embodiment of the present invention.

FIG. 6 is a diagram showing an example of a lead frame using the substrate according to the embodiment of the present invention.

7 (a) is a top view showing an example of a structure of a conventional substrate, and FIG. 7 (b) is an enlarged view of a cross section taken along the line AA ′ of FIG. 7 (a).

FIG. 8 is a top view of a semiconductor device in which a semiconductor package is mounted on the substrate of the present embodiment.

9A and 9B are views for explaining a shearing method of the semiconductor device in FIG.

FIG. 10 is an enlarged view of a cut portion of the sheared substrate of FIG.

11 is a diagram for explaining shearing of fibers substantially perpendicular to the cut surface of FIG.

12 is a diagram for explaining shearing of fibers substantially parallel to the cut surface of FIG.

[Explanation of symbols]

10 ... Semiconductor package, 20 ... Die, 21 ... Punch guide, 22 ... Punch, 30 ... Textile waste, 40 ... Slit,
100, 100 '... Substrate, 101 ... Copper clad laminate, 110
... fiber, 111 ... warp thread, 112 ... weft thread, 120 ... resin,
130 ... Copper foil, 200 ... Base material, 300 ... Semiconductor device.

Claims (6)

[Claims] 1. A substrate formed of a resin containing fibers for reinforcement, wherein the fibers are arranged in a bias direction with respect to a peripheral portion. 2. The substrate according to claim 1, wherein the fibers are glass fibers. 3. The plurality of first fiber groups, each of which has a fiber direction formed in a first direction with respect to a peripheral portion of the substrate, and a predetermined fiber direction with respect to the first fiber group. The substrate according to claim 1, further comprising a second fiber group formed in a second direction so as to intersect at an angle. 4. A part of a main substrate, which is formed of a resin containing fibers for reinforcement and arranged so that the fibers are in a bias direction with respect to a peripheral portion, intersects the fibers at a predetermined angle. A substrate formed by shearing in various directions. 5. The substrate according to claim 4, wherein the fibers are glass fibers. 6. The fiber includes a plurality of first fiber groups whose fiber direction is formed in a first direction with respect to a peripheral portion of the substrate, and a predetermined fiber direction with the first fiber group. The substrate according to claim 4, further comprising a second fiber group formed in a second direction so as to intersect at an angle.